JP2020072179A

JP2020072179A - Substrate transfer device and method of operating the same

Info

Publication number: JP2020072179A
Application number: JP2018205260A
Authority: JP
Inventors: 崇行福島; Takayuki Fukushima
Original assignee: Kawasaki Heavy Industries Ltd
Current assignee: Kawasaki Heavy Industries Ltd
Priority date: 2018-10-31
Filing date: 2018-10-31
Publication date: 2020-05-07

Abstract

To provide a substrate transfer device capable of performing accurate positioning as compared with a conventional substrate transfer device.SOLUTION: A substrate transfer device 1 includes: a substrate holding hand 3; a first holding member 4A having a plurality of first claw portions; a second holding member 4B having a plurality of second claw portions; a drive mechanism; and a controller 200 configured to drive the drive mechanism so that a first portion of the first claw portion and a first portion of the second claw portion, and an outer periphery of a substrate 9 are in contact with each other.SELECTED DRAWING: Figure 1

Description

本発明は、基板搬送装置及び基板搬送装置の運転方法に関する。 The present invention relates to a substrate transfer device and a method of operating a substrate transfer device.

半導体ウエハ（半導体基板；以下、単にウエハ又は基板ということもある）は、クリーンルーム内で複数の処理がなされて、製造される。また、半導体ウエハは、各処理間をクリーンルーム内に配置されているロボットにより搬送される。 A semiconductor wafer (semiconductor substrate; hereinafter sometimes simply referred to as a wafer or a substrate) is manufactured by performing a plurality of processes in a clean room. Further, the semiconductor wafer is transferred between the processes by a robot arranged in a clean room.

クリーンルーム内に配置されているロボットとして、半導体ウエハの収容ピッチを変更してウエハからボートへ移載する、半導体ウエハの移載装置が知られている（例えば、特許文献１参照）。特許文献１に開示されている半導体ウエハの移載装置では、アーム上に敷設されたレール上に一対のポストが立設されていて、ポストの間隔をモータにより調整することができる。 As a robot arranged in a clean room, there is known a semiconductor wafer transfer device that transfers semiconductor wafers to a boat by changing the accommodation pitch of the semiconductor wafers (see, for example, Patent Document 1). In the semiconductor wafer transfer device disclosed in Patent Document 1, a pair of posts are erected on a rail laid on the arm, and the distance between the posts can be adjusted by a motor.

特開２００３−３０９１６６号公報JP, 2003-309166, A

しかしながら、上記特許文献１に開示されている半導体ウエハの移載装置では、半導体ウエハをウエハ保持部材で保持するときに、半導体ウエハの外周と垂直部との間に隙間を有するように保持する。このため、半導体ウエハを搬送するときに、モータの振動等により、半導体ウエハが水平方向に移動するおそれがあった。そして、半導体ウエハが移動すると、当該半導体ウエハを載置するときに、正確な位置決めができないおそれがあった。 However, in the semiconductor wafer transfer device disclosed in Patent Document 1, when the semiconductor wafer is held by the wafer holding member, the semiconductor wafer is held so that there is a gap between the outer periphery of the semiconductor wafer and the vertical portion. Therefore, when the semiconductor wafer is transferred, the semiconductor wafer may move in the horizontal direction due to vibration of the motor or the like. When the semiconductor wafer is moved, there is a possibility that accurate positioning may not be possible when mounting the semiconductor wafer.

本発明は、上記従来の課題を解決するもので、従来の基板搬送装置に比して、正確な位置決めをすることができ得る、基板搬送装置及びその運転方法を提供することを目的とする。 The present invention solves the above-described conventional problems, and an object of the present invention is to provide a substrate transfer apparatus and an operating method thereof that enable more accurate positioning than the conventional substrate transfer apparatus.

上記従来の課題を解決するために、本発明に係る基板搬送装置は、基板保持ハンドと、前記基板保持ハンドの先端部に設けられ、基板を保持する第１保持部材と、前記基板保持ハンドの基端部に設けられ、前記基板を保持する第２保持部材と、前記基板保持ハンドを移動させるマニピュレータと、前記第１保持部材又は前記第２保持部材を駆動する駆動機構と、制御装置と、を備え、前記基板の厚み方向を第１方向と定義した場合に、前記第１保持部材は、前記第１方向に沿って、互いに所定の間隔をおいて配置される、複数の第１爪部を有し、前記第２保持部材は、前記第１方向に沿って、互いに所定の間隔をおいて配置される、複数の第２爪部を有し、前記基板搬送装置は、複数の前記第１爪部と複数の前記第２爪部が、それぞれ、複数の前記基板の一方の主面である第１主面と当接して保持するように構成されていて、前記第１爪部及び前記第２爪部は、それぞれ、前記第１方向に延びる第１部分と前記基板の第１主面と平行な方向に延びる第２部分とを有し、前記制御装置は、前記第１爪部における前記第２部分の先端部と、前記第２爪部における前記第２部分の先端部と、が、前記基板の外周よりも外方に位置するように、前記駆動機構を駆動させる（Ａ）と、前記（Ａ）後に、前記マニピュレータを制御して、隣接する前記基板の間に、前記第１保持部材及び前記第２保持部材が位置するように、前記基板保持ハンドを移動させる（Ｂ）と、前記（Ｂ）の後に、前記第１方向から見て、前記第１爪部の前記第２部分及び前記第２爪部の前記第２部分と、前記基板の第１主面と、が重なるように、前記駆動機構を駆動させる（Ｃ）と、前記（Ｃ）の後に、前記マニピュレータを制御して、前記第１爪部の前記第２部分及び前記第２爪部の前記第２部分と、前記基板の第１主面と、が当接するように、前記基板保持ハンドを移動させる（Ｄ）と、前記（Ｄ）の後に、前記第１爪部の前記第１部分及び前記第２爪部の前記第１部分と、前記基板の外周と、が当接するように、前記駆動機構を駆動させる（Ｅ）と、前記（Ｅ）の後に、前記マニピュレータを制御して、前記基板保持ハンドを移動させて、前記基板を搬送する（Ｆ）と、を実行するように構成されている。 In order to solve the above-mentioned conventional problems, a substrate transfer device according to the present invention includes a substrate holding hand, a first holding member which is provided at a tip portion of the substrate holding hand and holds a substrate, and the substrate holding hand. A second holding member provided at a base end portion for holding the substrate, a manipulator for moving the substrate holding hand, a drive mechanism for driving the first holding member or the second holding member, and a control device, A plurality of first claw portions, wherein the first holding member is arranged at predetermined intervals along the first direction when the thickness direction of the substrate is defined as a first direction. The second holding member has a plurality of second claw portions arranged at a predetermined interval from each other along the first direction, and the substrate transfer device has a plurality of the plurality of first claw portions. A plurality of one claw portion and a plurality of the second claw portions, respectively. A first main surface, which is one main surface of the substrate, is configured to abut and hold the first main surface, and the first claw portion and the second claw portion each extend in the first direction. And a second portion extending in a direction parallel to the first main surface of the substrate, wherein the control device includes a tip portion of the second portion of the first claw portion and the second portion of the second claw portion. (A) driving the drive mechanism so that the tip portions of the two portions are located outside the outer periphery of the substrate; and (A) after controlling the manipulator, adjoining the manipulator. When the substrate holding hand is moved so that the first holding member and the second holding member are located between the substrates (B), after the (B), when viewed from the first direction, the The second portion of the first claw portion, the second portion of the second claw portion, and the first portion of the substrate. When the driving mechanism is driven so that the surface overlaps with (C), the manipulator is controlled after (C) to control the second portion of the first pawl portion and the second pawl portion. When the substrate holding hand is moved so that the second portion and the first main surface of the substrate are in contact with each other (D), the first portion of the first claw portion is provided after (D). And (E) driving the drive mechanism so that the first portion of the second claw portion and the outer periphery of the substrate come into contact with each other, and after the (E), controlling the manipulator, The substrate holding hand is moved to convey the substrate (F).

これにより、従来の基板搬送装置に比して、正確な位置決めをすることができ得る。 As a result, accurate positioning can be performed as compared with the conventional substrate transfer device.

また、本発明に係る基板搬送装置の運転方法は、前記基板搬送装置が、基板保持ハンドと、前記基板保持ハンドの先端部に設けられ、前記基板を保持する第１保持部材と、前記基板保持ハンドの基端部に設けられ、前記基板を保持する第２保持部材と、前記基板保持ハンドを移動させるマニピュレータと、前記第１保持部材又は前記第２保持部材を駆動する駆動機構と、を備え、基板の厚み方向を第１方向と定義した場合に、前記第１保持部材は、前記第１方向に沿って、互いに所定の間隔をおいて配置される、複数の第１爪部を有し、前記第２保持部材は、前記第１方向に沿って、互いに所定の間隔をおいて配置される、複数の第２爪部を有し、前記基板搬送装置は、複数の前記第１爪部と複数の前記第２爪部が、それぞれ、複数の前記基板の一方の主面である第１主面と当接して保持するように構成されていて、前記第１爪部及び前記第２爪部は、それぞれ、前記第１方向に延びる第１部分と前記基板の第１主面と平行な方向に延びる第２部分とを有し、前記第１爪部の前記第２部分の先端部と、前記第２爪部の前記第２部分の先端部と、が、前記基板の外周よりも外方に位置するように、前記駆動機構が駆動する（Ａ）と、前記（Ａ）後に、前記マニピュレータが動作して、隣接する前記基板の間に、前記第１保持部材及び前記第２保持部材が位置するように、前記基板保持ハンドを移動させる（Ｂ）と、前記（Ｂ）の後に、前記第１方向から見て、前記第１爪部における前記第２部分及び前記第２爪部における前記第２部分と、前記基板の第１主面と、が重なるように、前記駆動機構が駆動させる（Ｃ）と、前記（Ｃ）の後に、前記マニピュレータが動作して、前記第１爪部の前記第２部分及び前記第２爪部の前記第２部分と、前記基板の第１主面と、が当接するように、前記基板保持ハンドを移動させる（Ｄ）と、前記（Ｄ）の後に、前記第１爪部の前記第１部分及び前記第２爪部の前記第１部分と、前記基板の外周と、が当接するように、前記駆動機構が駆動する（Ｅ）と、前記（Ｅ）の後に、前記マニピュレータを制御して、前記基板保持ハンドを移動させて、前記基板を搬送する（Ｆ）と、を備える。 Further, in the method of operating a substrate transfer device according to the present invention, the substrate transfer device is provided with a substrate holding hand, a first holding member for holding the substrate, the first holding member being provided at a tip end portion of the substrate holding hand, A second holding member that is provided at a base end of the hand and holds the substrate; a manipulator that moves the substrate holding hand; and a drive mechanism that drives the first holding member or the second holding member. When the thickness direction of the substrate is defined as the first direction, the first holding member has a plurality of first claw portions that are arranged at predetermined intervals along the first direction. The second holding member has a plurality of second claw portions which are arranged at a predetermined interval from each other along the first direction, and the substrate transfer device has a plurality of the first claw portions. And a plurality of the second claw portions, respectively, a plurality of the base The first claw portion and the second claw portion are configured to abut and hold a first main surface that is one of the main surfaces, and the first claw portion and the second claw portion respectively extend in the first direction and the first portion. A second portion extending in a direction parallel to the first main surface of the substrate, a tip portion of the second portion of the first claw portion, and a tip portion of the second portion of the second claw portion; However, when the drive mechanism is driven (A) so as to be located outside the outer periphery of the substrate, the manipulator operates after (A), and the manipulator operates between the adjacent substrates. When the substrate holding hand is moved so that the 1st holding member and the 2nd holding member are positioned (B), after the (B), when viewed from the first direction, the first holding member in the first claw portion is moved. The second part of the second part and the second claw part and the first main surface of the substrate are overlapped with each other. When the driving mechanism drives (C), the manipulator operates after the (C) to operate the second portion of the first claw portion and the second portion of the second claw portion, and the substrate. When the substrate holding hand is moved so that the first main surface abuts (D), the first portion of the first claw portion and the second portion of the second claw portion are moved after (D). When the drive mechanism is driven so that the first portion and the outer periphery of the substrate come into contact with each other (E), after the (E), the manipulator is controlled to move the substrate holding hand, Transporting the substrate (F).

本発明の基板搬送装置及び基板搬送装置の運転方法によれば、従来の基板搬送装置に比して、正確な位置決めをすることができ得る。 According to the substrate transfer device and the method of operating the substrate transfer device of the present invention, it is possible to perform accurate positioning as compared with the conventional substrate transfer device.

図１は、本実施の形態１に係る基板搬送装置の概略構成を示す斜視図である。FIG. 1 is a perspective view showing a schematic configuration of a substrate transfer device according to the first embodiment. 図２は、図１に示す基板搬送装置の制御装置の構成を概略的に示す機能ブロック図である。FIG. 2 is a functional block diagram schematically showing the configuration of the control device of the substrate transfer apparatus shown in FIG. 図３は、図１に示す基板搬送装置における基板保持ハンドの左側面図である。FIG. 3 is a left side view of the substrate holding hand in the substrate transfer device shown in FIG. 図４は、図１に示す基板搬送装置における第１保持部材の概略構成を示す斜視図である。FIG. 4 is a perspective view showing a schematic configuration of the first holding member in the substrate transfer device shown in FIG. 図５は、本実施の形態１に係る基板搬送装置の動作の一例を示すフローチャートである。FIG. 5 is a flowchart showing an example of the operation of the substrate transfer apparatus according to the first embodiment. 図６は、図５に示すフローチャートに沿って、基板搬送装置が動作しているときの基板搬送装置の状態を示す模式図である。FIG. 6 is a schematic diagram showing a state of the substrate transfer device when the substrate transfer device is operating, following the flowchart shown in FIG. 図７は、図５に示すフローチャートに沿って、基板搬送装置が動作しているときの基板搬送装置の状態を示す模式図である。FIG. 7 is a schematic diagram showing a state of the substrate transfer device when the substrate transfer device is operating, following the flowchart shown in FIG. 図８は、図５に示すフローチャートに沿って、基板搬送装置が動作しているときの基板搬送装置の状態を示す模式図である。FIG. 8 is a schematic diagram showing a state of the substrate transfer device when the substrate transfer device is operating, according to the flowchart shown in FIG. 図９は、図５に示すフローチャートに沿って、基板搬送装置が動作しているときの基板搬送装置の状態を示す模式図である。FIG. 9 is a schematic diagram showing a state of the substrate transfer device when the substrate transfer device is operating, following the flowchart shown in FIG. 図１０は、図５に示すフローチャートに沿って、基板搬送装置が動作しているときの基板搬送装置の状態を示す模式図である。FIG. 10 is a schematic diagram showing the state of the substrate transfer device when the substrate transfer device is operating, following the flowchart shown in FIG. 図１１は、本実施の形態１における変形例１の基板搬送装置の概略構成を示す斜視図である。FIG. 11 is a perspective view showing a schematic configuration of the substrate transfer apparatus of the first modification of the first embodiment.

以下、本発明の実施の形態を、図面を参照しながら説明する。なお、全ての図面において、同一又は相当部分には同一符号を付し、重複する説明は省略する。また、全ての図面において、本発明を説明するための構成要素を抜粋して図示しており、その他の構成要素については図示を省略している場合がある。さらに、本発明は以下の実施の形態に限定されない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same or corresponding parts will be denoted by the same reference symbols, without redundant description. In addition, in all the drawings, constituent elements for explaining the present invention are extracted and shown, and other constituent elements may be omitted. Furthermore, the present invention is not limited to the embodiments below.

（実施の形態１）
本実施の形態１に係る基板搬送装置は、基板保持ハンドと、基板保持ハンドの先端部に設けられ、基板を保持する第１保持部材と、基板保持ハンドの基端部に設けられ、基板を保持する第２保持部材と、基板保持ハンドを移動させるマニピュレータと、第１保持部材又は第２保持部材を駆動する駆動機構と、制御装置と、を備え、基板の厚み方向を第１方向とし、基板保持ハンドの基端部から先端部に向かう方向を第２方向と定義した場合に、第１保持部材は、第１方向に沿って、互いに所定の間隔をおいて配置される、複数の第１爪部を有し、第２保持部材は、第１方向に沿って、互いに所定の間隔をおいて配置される、複数の第２爪部を有し、基板搬送装置は、複数の第１爪部と複数の第２爪部が、それぞれ、複数の基板の一方の主面である第１主面と当接して保持するように構成されていて、第１爪部及び第２爪部は、それぞれ、第１方向に延びる第１部分と基板の第１主面と平行な方向に延びる第２部分とを有し、制御装置は、第１爪部の第２部分の先端部と、第２爪部の第２部分の先端部と、が、基板の外周よりも外方に位置するように、駆動機構を駆動させる（Ａ）と、（Ａ）後に、マニピュレータを制御して、隣接する基板の間に、第１保持部材及び第２保持部材が位置するように、基板保持ハンドを移動させる（Ｂ）と、（Ｂ）の後に、第１方向から見て、第１爪部の第２部分及び第２爪部の第２部分と、基板の第１主面と、が重なるように、駆動機構を駆動させる（Ｃ）と、（Ｃ）の後に、マニピュレータを制御して、第１爪部の第２部分及び第２爪部の第２部分と、基板の第１主面と、が当接するように、基板保持ハンドを移動させる（Ｄ）と、（Ｄ）の後に、第１爪部の第１部分及び第２爪部の第１部分と、基板の外周と、が当接するように、駆動機構を駆動させる（Ｅ）と、（Ｅ）の後に、マニピュレータを制御して、基板保持ハンドを移動させて、基板を搬送する（Ｆ）と、を実行するように構成されている。 (Embodiment 1)
The substrate transfer device according to the first embodiment is provided with a substrate holding hand, a first holding member that is provided at the tip of the substrate holding hand and holds a substrate, and a substrate holding hand that is provided at the base end of the substrate holding hand. A second holding member for holding, a manipulator for moving the substrate holding hand, a drive mechanism for driving the first holding member or the second holding member, and a control device, the thickness direction of the substrate is the first direction, When the direction from the base end portion of the substrate holding hand toward the tip end portion is defined as the second direction, the first holding member has a plurality of first holding members arranged at predetermined intervals along the first direction. The second holding member has a plurality of second claw portions that are arranged at predetermined intervals in the first direction, and the substrate transfer device has a plurality of first claw portions. The claw portion and the plurality of second claw portions are respectively provided on one main surface of the plurality of substrates. The first claw portion and the second claw portion are configured to contact and hold the first main surface of the substrate, and the first claw portion and the second claw portion respectively extend in the first direction and a direction parallel to the first main surface of the substrate. And a second portion extending to the outer side of the substrate, and the control device is configured such that the tip portion of the second portion of the first claw portion and the tip portion of the second portion of the second claw portion are located outside the outer periphery of the substrate. The driving mechanism is driven so as to be positioned (A), and after (A), the manipulator is controlled so that the first holding member and the second holding member are positioned between the adjacent substrates. When the hand is moved (B), after (B), the second portion of the first claw portion and the second portion of the second claw portion and the first main surface of the substrate are seen from the first direction. When the driving mechanism is driven so as to be overlapped with each other, the manipulator is controlled after (C) to control the second portion of the first claw portion and the second portion of the second claw portion. And (D) the substrate holding hand is moved so that the first main surface of the substrate and the first main surface of the substrate come into contact with each other, and after (D), the first portion of the first claw portion and the first portion of the second claw portion. And (E) drive the drive mechanism so that the substrate and the outer periphery of the substrate come into contact with each other. After (E), the manipulator is controlled to move the substrate holding hand to convey the substrate (F). And are configured to perform.

また、本実施の形態１に係る基板搬送装置では、第１方向から見て、複数の第１爪部と複数の第２爪部は、それぞれ、基板の外周に沿うように配置されていてもよい。 In addition, in the substrate transfer apparatus according to the first embodiment, the plurality of first claw portions and the plurality of second claw portions may be arranged along the outer periphery of the substrate when viewed from the first direction. Good.

以下、本実施の形態１に係る基板搬送装置の一例について、図１〜図１０を参照しながら説明する。 Hereinafter, an example of the substrate transfer apparatus according to the first embodiment will be described with reference to FIGS. 1 to 10.

［基板搬送装置の構成］
図１は、本実施の形態１に係る基板搬送装置の概略構成を示す斜視図である。なお、図１においては、基板搬送装置における上下方向、前後方向、及び左右方向を図における上下方向、前後方向、及び左右方向として表している。 [Structure of substrate transfer device]
FIG. 1 is a perspective view showing a schematic configuration of a substrate transfer device according to the first embodiment. Note that, in FIG. 1, the vertical direction, the front-back direction, and the left-right direction in the substrate transfer device are represented as the vertical direction, the front-back direction, and the left-right direction in the drawing.

図１に示すように、本実施の形態１に係る基板搬送装置１は、マニピュレータ２と、基板保持ハンド３と、第１駆動器（駆動機構）１１と、駆動器１３と、制御装置２００と、を備えていて、フープ９０内に収納されている基板９を第１保持部材４Ａ及び第２保持部材４Ｂにより、把持（保持）して、搬送するように構成されている。なお、基板９は、フープ９０以外に、例えば、石英ボート等の容器に収納されていてもよい。また、基板９は、扉等により、開閉される、箱状の容器（例えば、ロードロック室）内に収納されていてもよい。 As shown in FIG. 1, the substrate transfer apparatus 1 according to the first embodiment includes a manipulator 2, a substrate holding hand 3, a first driver (driving mechanism) 11, a driver 13, and a controller 200. , And is configured to be grasped (held) by the first holding member 4A and the second holding member 4B to be transported by the first holding member 4A and the second holding member 4B. The substrate 9 may be housed in a container such as a quartz boat other than the hoop 90. Further, the substrate 9 may be housed in a box-shaped container (for example, a load lock chamber) that is opened and closed by a door or the like.

基板９は、例えば、半導体基板及びガラス基板等の半導体デバイスの基板の材料となる円形の薄板であってもよい。半導体基板としては、例えば、シリコン基板、サファイヤ（単結晶アルミナ）基板、その他の各種の基板等であってもよい。ガラス基板としては、例えば、ＦＰＤ（ＦｌａｔＰａｎｅｌＤｉｓｐｌａｙ）用ガラス基板、ＭＥＭＳ（ＭｉｃｒｏＥｌｅｃｔｒｏＭｅｃｈａｎｉｃａｌＳｙｓｔｅｍｓ）用ガラス基板等であってもよい。 The substrate 9 may be, for example, a circular thin plate that is a material for a substrate of a semiconductor device such as a semiconductor substrate and a glass substrate. The semiconductor substrate may be, for example, a silicon substrate, a sapphire (single crystal alumina) substrate, various other substrates, or the like. The glass substrate may be, for example, a glass substrate for FPD (Flat Panel Display), a glass substrate for MEMS (Micro Electro Mechanical Systems), or the like.

なお、以下においては、マニピュレータ２として、水平多関節ロボットの構成について説明するが、マニピュレータ２は、水平多関節ロボットに限定されず、垂直多関節ロボットをベースにしたものであってもよい。 It should be noted that the configuration of a horizontal articulated robot will be described below as the manipulator 2, but the manipulator 2 is not limited to the horizontal articulated robot, and may be based on a vertical articulated robot.

マニピュレータ２は、アーム２０、基台２１、支持台２２、支持軸２３、及び軸体２４を備えている。支持台２２の内部には、制御装置２００が配置されている。なお、制御装置２００は、支持台２２の内部以外の場所に設けられていてもよい。 The manipulator 2 includes an arm 20, a base 21, a support base 22, a support shaft 23, and a shaft body 24. A control device 200 is arranged inside the support base 22. The control device 200 may be provided in a place other than the inside of the support base 22.

また、支持台２２には、支持軸２３が設けられている。支持軸２３は、例えば、ボールネジ機構、駆動モータ、駆動モータの回転位置を検出する回転センサ、及び駆動モータの回転を制御する電流を検出する電流センサ等（いずれも図示せず）を有していて、上下方向に伸縮し、かつ、回動するように構成されている。なお、駆動モータは、例えば、制御装置２００によってサーボ制御されるサーボモータであってもよい。また、回転センサは、例えば、エンコーダであってもよい。 A support shaft 23 is provided on the support base 22. The support shaft 23 has, for example, a ball screw mechanism, a drive motor, a rotation sensor that detects the rotational position of the drive motor, and a current sensor that detects a current that controls the rotation of the drive motor (none of which are shown). Thus, it is configured to expand and contract in the vertical direction and rotate. The drive motor may be, for example, a servo motor servo-controlled by the control device 200. Further, the rotation sensor may be, for example, an encoder.

支持軸２３の上端部には、当該支持軸２３の軸心を通る回転軸の軸回りに回動可能にアーム２０の下端部が接続されている。アーム２０の後端部には、軸体２４を介して、回動可能に基台２１の後端部が接続されている。また、基台２１の上面には、基板保持ハンド３が配設されている。 A lower end portion of the arm 20 is connected to an upper end portion of the support shaft 23 so as to be rotatable about an axis of a rotation shaft passing through the axis of the support shaft 23. The rear end of the base 21 is rotatably connected to the rear end of the arm 20 via a shaft 24. Further, the substrate holding hand 3 is arranged on the upper surface of the base 21.

また、マニピュレータ２は、軸体２４の軸心回りに基台２１を回転移動させるための駆動モータ、動力伝達機構、回転センサ、及び電流センサ（いずれも図示せず）を有している。なお、駆動モータは、例えば、制御装置２００によってサーボ制御されるサーボモータであってもよい。また、回転センサは、例えば、エンコーダであってもよい。 Further, the manipulator 2 has a drive motor, a power transmission mechanism, a rotation sensor, and a current sensor (all not shown) for rotating the base 21 around the axis of the shaft body 24. The drive motor may be, for example, a servo motor servo-controlled by the control device 200. Further, the rotation sensor may be, for example, an encoder.

次に、制御装置２００の構成について、図２を参照しながら説明する。 Next, the configuration of the control device 200 will be described with reference to FIG.

図２は、図１に示す基板搬送装置の制御装置の構成を概略的に示す機能ブロック図である。 FIG. 2 is a functional block diagram schematically showing the configuration of the control device of the substrate transfer apparatus shown in FIG.

図２に示すように、制御装置２００は、ＣＰＵ等の演算処理器２００ａと、ＲＯＭ、ＲＡＭ等の記憶器２００ｂと、サーボ制御器２００ｃと、を備えている。記憶器２００ｂには、ロボットコントローラとしての基本プログラム、各種固定データ等の情報が記憶されている。演算処理器２００ａは、記憶器２００ｂに記憶された基本プログラム等のソフトウェアを読み出して実行することにより、マニピュレータ２の各種動作を制御する。 As shown in FIG. 2, the control device 200 includes an arithmetic processing unit 200a such as a CPU, a storage unit 200b such as a ROM and a RAM, and a servo controller 200c. Information such as a basic program as a robot controller and various fixed data is stored in the storage device 200b. The arithmetic processing unit 200a controls various operations of the manipulator 2 by reading and executing software such as a basic program stored in the storage unit 200b.

すなわち、演算処理器２００ａは、マニピュレータ２の制御指令を生成し、これをサーボ制御器２００ｃに出力する。サーボ制御器２００ｃは、演算処理器２００ａにより生成された制御指令に基づいて、マニピュレータ２の支持軸２３及び軸体２４のそれぞれに対応する回転軸を回転させるサーボモータの駆動を制御するように構成されている。 That is, the arithmetic processor 200a generates a control command for the manipulator 2 and outputs this to the servo controller 200c. The servo controller 200c is configured to control the drive of the servo motor that rotates the rotary shafts corresponding to the support shaft 23 and the shaft body 24 of the manipulator 2 based on the control command generated by the arithmetic processor 200a. Has been done.

なお、制御装置２００は、集中制御する単独の制御装置２００によって構成されていてもよいし、互いに協働して分散制御する複数の制御装置２００によって構成されていてもよい。また、本実施の形態１においては、記憶器２００ｂが、制御装置２００内に配置されている形態を採用したが、これに限定されず、記憶器２００ｂが、制御装置２００と別体に設けられている形態を採用してもよい。 The control device 200 may be configured by a single control device 200 that performs centralized control, or may be configured by a plurality of control devices 200 that perform distributed control in cooperation with each other. In the first embodiment, the storage device 200b is arranged in the control device 200, but the present invention is not limited to this, and the storage device 200b is provided separately from the control device 200. The form may be adopted.

次に、基板保持ハンド３の構成について、図１及び図３を参照しながら、詳細に説明する。 Next, the configuration of the substrate holding hand 3 will be described in detail with reference to FIGS. 1 and 3.

図３は、図１に示す基板搬送装置における基板保持ハンドの左側面図である。なお、図３においては、基板保持ハンドの後端側の一部を省略している。また、図３においては、基板搬送装置における上下及び前後方向を図における上下及び前後方向を示している。 FIG. 3 is a left side view of the substrate holding hand in the substrate transfer device shown in FIG. Note that, in FIG. 3, a part of the rear end side of the substrate holding hand is omitted. Further, in FIG. 3, the vertical and front-back directions in the substrate transfer device are shown in the vertical and front-back directions in the drawing.

図１及び図３に示すように、基板保持ハンド３は、基台２１の前端側に配置されている第１筐体３１と、基台２１の後端側に配置されている第２筐体３０と、を有している。第１筐体３１と第２筐体３０は、それぞれの内部空間が連通するように接続されている。 As shown in FIGS. 1 and 3, the substrate holding hand 3 includes a first housing 31 arranged on the front end side of the base 21 and a second housing 31 arranged on the rear end side of the base 21. 30 and. The first housing 31 and the second housing 30 are connected so that their internal spaces communicate with each other.

第２筐体３０の内部には、第１駆動器１１及び駆動器１３が配置されている。第１駆動器１１及び駆動器１３は、直動アクチュエータで構成されていて、例えば、サーボモータと、ラック、及びピニオンギヤ等の適宜な動力伝達機構と、で構成されていてもよく、エアシリンダ等で構成されていてもよい。なお、第１駆動器１１及び駆動器１３の詳細については、後述する。 The first driver 11 and the driver 13 are arranged inside the second housing 30. The first driver 11 and the driver 13 may be configured by linear actuators, and may be configured by, for example, a servo motor, a rack, and an appropriate power transmission mechanism such as a pinion gear, or an air cylinder or the like. It may be composed of. The details of the first driver 11 and the driver 13 will be described later.

また、第１筐体３１の上面には、後端（基端）側に第１保持部材４Ａ、４Ａが設けられていて、前端（先端）側に第２保持部材４Ｂ、４Ｂが設けられている。具体的には、一方の第１保持部材４Ａは、第１筐体３１の左側後端部に設けられていて、他方の第１保持部材４Ａは、第１筐体３１の右側後端部に設けられている。また、一方の第２保持部材４Ｂは、第１筐体３１の左側前端部に設けられていて、他方の第２保持部材４Ｂは、第１筐体３１の右側前端部に設けられている。 Further, on the upper surface of the first housing 31, the first holding members 4A and 4A are provided on the rear end (base end) side and the second holding members 4B and 4B are provided on the front end (tip end) side. There is. Specifically, one first holding member 4A is provided on the left rear end portion of the first housing 31, and the other first holding member 4A is provided on the right rear end portion of the first housing 31. It is provided. The one second holding member 4B is provided at the left front end of the first housing 31, and the other second holding member 4B is provided at the right front end of the first housing 31.

そして、図３に示すように、第１保持部材４Ａは、複数（ここでは、５つ）の第１爪部４０Ａ〜４０Ｅを有していて、第２保持部材４Ｂは、複数（ここでは、５つ）の第２爪部５０Ａ〜５０Ｅを有している。 Then, as shown in FIG. 3, the first holding member 4A has a plurality of (here, five) first claw portions 40A to 40E, and the second holding member 4B has a plurality (here, It has five) second claw portions 50A to 50E.

第１爪部４０Ａ〜４０Ｅは、それぞれ、基板９の厚み方向である第１方向（ここでは、上下方向）から見て、基板９の外周に沿って並ぶように配置されている。同様に、第２爪部５０Ａ〜５０Ｅは、それぞれ、第１方向から見て、基板９の外周に沿って並ぶように配置されている。 The first claw portions 40 </ b> A to 40 </ b> E are arranged so as to be lined up along the outer circumference of the substrate 9 when viewed from the first direction (here, the vertical direction) which is the thickness direction of the substrate 9. Similarly, the second claw portions 50A to 50E are arranged so as to be lined up along the outer periphery of the substrate 9 when viewed from the first direction.

ここで、第１保持部材４Ａの第１爪部４０Ａ〜４０Ｅについて、図３及び図４を参照しながら、詳細に説明する。なお、第２保持部材４Ｂの第２爪部５０Ａ〜５０Ｅは、第１保持部材４Ａの第１爪部４０Ａ〜４０Ｅと同様に構成されているので、その詳細な説明は省略する。また、以下においては、右側に配置されている第１保持部材４Ａの第１爪部４０Ａ〜４０Ｅについて、説明する。 Here, the first claw portions 40A to 40E of the first holding member 4A will be described in detail with reference to FIGS. 3 and 4. Since the second claw portions 50A to 50E of the second holding member 4B have the same configuration as the first claw portions 40A to 40E of the first holding member 4A, detailed description thereof will be omitted. Moreover, below, the 1st nail | claw part 40A-40E of the 1st holding member 4A arrange | positioned at the right side is demonstrated.

図４は、図１に示す基板搬送装置における第１保持部材の概略構成を示す斜視図である。 FIG. 4 is a perspective view showing a schematic configuration of the first holding member in the substrate transfer device shown in FIG.

図４に示すように、第１爪部４０Ａは、柱部分４１Ａと、柱部分４１Ａの先端部（ここでは、上端部）に設けられている当接部分４２Ａと、を有している。同様に、第１爪部４０Ｂ〜４０Ｅは、それぞれ、柱部分４１Ｂ〜４１Ｅと、当接部分４２Ｂ〜４２Ｅと、を有している。なお、第１爪部４０Ｂ〜４０Ｅは、第１爪部４０Ａと同様に構成されているため、その詳細な説明は省略する。 As shown in FIG. 4, the first claw portion 40A has a pillar portion 41A and an abutting portion 42A provided at the tip portion (here, the upper end portion) of the pillar portion 41A. Similarly, the first claw portions 40B to 40E have pillar portions 41B to 41E and abutting portions 42B to 42E, respectively. Since the first claw portions 40B to 40E have the same configuration as the first claw portion 40A, detailed description thereof will be omitted.

柱部分４１Ａは、第１方向に沿って延びるように形成されている。また、当接部分４２Ａは、Ｌ字状に形成されていて、基板９の周面と当接する第１部分（内壁面）４４Ａと、基板９の下面（第１主面９Ａ；図６参照）の周縁部が載置される第２部分（底面）４３Ａと、を有する。なお、当接部分４２Ａの第１部分４４Ａは、第１方向と平行となるように形成されていてもよく、第１方向に対して傾斜するように形成されていてもよい。 The column portion 41A is formed to extend along the first direction. The contact portion 42A is formed in an L-shape, and has a first portion (inner wall surface) 44A that contacts the peripheral surface of the substrate 9 and a lower surface of the substrate 9 (first main surface 9A; see FIG. 6). A second portion (bottom surface) 43A on which the peripheral edge portion of the second portion is placed. The first portion 44A of the contact portion 42A may be formed to be parallel to the first direction, or may be formed to be inclined with respect to the first direction.

第１爪部４０Ａ〜４０Ｅは、駆動器１３により、基板９の厚み方向である第１方向（ここでは、上下方向）に沿って、互いに所定の間隔をおいて位置する（配置される）ように、昇降する。同様に、第２爪部５０Ａ〜５０Ｅは、駆動器１３により、上下方向に沿って、互いに所定の間隔をおいて位置するように、昇降する。 The first claw portions 40A to 40E are positioned (arranged) at predetermined intervals by the driver 13 along the first direction (here, the vertical direction) that is the thickness direction of the substrate 9. Then go up and down. Similarly, the second claw portions 50A to 50E are moved up and down by the driver 13 so as to be positioned at a predetermined distance from each other in the vertical direction.

より詳細には、第１爪部４０Ａ〜４０Ｅは、水平方向から見て、駆動器１３により、当接部分４２Ａ〜４２Ｅが、上下方向に沿って、互いに所定の間隔を有するように、昇降する。同様に、第２爪部５０Ａ〜５０Ｅは、水平方向から見て、駆動器１３により、当接部分が、上下方向に沿って、互いに所定の間隔を有するように、昇降する。 More specifically, when viewed from the horizontal direction, the first claw portions 40A to 40E are moved up and down by the driver 13 so that the contact portions 42A to 42E have a predetermined distance from each other along the vertical direction. .. Similarly, when viewed in the horizontal direction, the second claw portions 50A to 50E are moved up and down by the driver 13 so that the contact portions have a predetermined distance from each other along the vertical direction.

また、第１爪部４０Ａ〜４０Ｅ及び第２爪部５０Ａ〜５０Ｅは、駆動器１３により、第１筐体３１内に収納されるように、降下する。 Further, the first claw portions 40A to 40E and the second claw portions 50A to 50E descend by the driver 13 so as to be housed in the first housing 31.

なお、本実施の形態１においては、第１保持部材４Ａは、第１爪部４０Ａ〜４０Ｅの順で、その高さが小さくなるように配置される。同様に、第２保持部材４Ｂは、第２爪部５０Ａ〜５０Ｅの順で、その高さが小さくなるように、配置される。すなわち、第１爪部４０Ａ及び第２爪部５０Ａが最も上方に位置し、第１爪部４０Ｅ及び第２爪部５０Ｅが最も下方に位置するように、駆動器１３により、駆動される。 In addition, in this Embodiment 1, the 1st holding member 4A is arrange | positioned so that the height may become small in order of the 1st nail | claw part 40A-40E. Similarly, the second holding member 4B is arranged in the order of the second claw portions 50A to 50E such that the height thereof becomes smaller. That is, the driving device 13 drives the first claw portion 40A and the second claw portion 50A to be located at the highest position, and the first claw portion 40E and the second claw portion 50E to be located at the lowest position.

また、図１に示すように、第１駆動器１１は、第１保持部材４Ａを前後方向に移動させるように構成されている。具体的には、第１駆動器１１は、第１保持部材４Ａにおける第２部分の先端部と第２保持部材４Ｂにおける第２部分の先端部との間の距離が、基板９の直径（最大径）よりも大きくなる第１距離と、第１保持部材４Ａの第１部分と第２保持部材４Ｂの第１部分が基板９の周面（側面）と当接する第２距離と、第１距離よりも小さく、第２距離よりも大きい第３距離と、なるように、第１保持部材４Ａを移動させる。 Further, as shown in FIG. 1, the first driver 11 is configured to move the first holding member 4A in the front-rear direction. Specifically, in the first driver 11, the distance between the tip of the second portion of the first holding member 4A and the tip of the second portion of the second holding member 4B is the diameter of the substrate 9 (maximum). Diameter), a second distance at which the first portion of the first holding member 4A and the first portion of the second holding member 4B contact the peripheral surface (side surface) of the substrate 9, and the first distance. The first holding member 4A is moved so that the third distance is smaller than the second distance and is larger than the second distance.

第１距離としては、例えば、第１保持部材４Ａと第２保持部材４Ｂが、基板９との接触を抑制する観点から、基板９の直径よりも１ｍｍ以上長くてもよく、基板保持ハンド３をコンパクトにする観点から、基板９の直径よりも４ｍｍ長くてもよく、３ｍｍ長くてもよい。 As the first distance, for example, the first holding member 4A and the second holding member 4B may be longer than the diameter of the substrate 9 by 1 mm or more from the viewpoint of suppressing contact between the first holding member 4A and the second holding member 4B. From the viewpoint of compactness, the diameter may be 4 mm longer or 3 mm longer than the diameter of the substrate 9.

なお、本実施の形態１においては、第１駆動器１１が第２筐体３０の内部空間に配置されている形態を採用したが、これに限定されず、第１駆動器１１が、第１筐体３１の内部空間に配置されている形態を採用してもよい。 Although the first driver 11 is arranged in the inner space of the second housing 30 in the first embodiment, the present invention is not limited to this. You may employ | adopt the form arrange | positioned in the internal space of the housing | casing 31.

また、本実施の形態１においては、その主面が水平方向に位置する基板９を基板搬送装置１により、保持する形態を採用したが、これに限定されない。例えば、その主面が鉛直方向に位置する基板９を基板搬送装置１により、保持する形態を採用してもよい。 In the first embodiment, the substrate 9 whose main surface is located in the horizontal direction is held by the substrate transfer device 1, but the present invention is not limited to this. For example, a mode may be adopted in which the substrate 9 whose main surface is located in the vertical direction is held by the substrate transfer device 1.

［基板搬送装置の動作及び作用効果］
次に、本実施の形態１に係る基板搬送装置１の動作及び作用効果について、図１〜図１０を参照しながら説明する。なお、基板搬送装置１のマニピュレータ２が、複数の工程からなる一連の作業を行う動作については、公知のマニピュレータと同様に実行されるため、その詳細な説明は省略する。また、以下の動作は、制御装置２００の演算処理器２００ａが、記憶器２００ｂに格納されているプログラムを読み出すことにより実行される。 [Operation and effect of substrate transfer device]
Next, operations and effects of the substrate transfer device 1 according to the first embodiment will be described with reference to FIGS. The operation of the manipulator 2 of the substrate transfer apparatus 1 for performing a series of work including a plurality of steps is performed in the same manner as a known manipulator, and thus detailed description thereof will be omitted. Further, the following operation is executed by the arithmetic processing unit 200a of the control device 200 reading the program stored in the storage unit 200b.

図５は、本実施の形態１に係る基板搬送装置の動作の一例を示すフローチャートである。図６〜図１０は、図５に示すフローチャートに沿って、基板搬送装置が動作しているときの基板搬送装置の状態を示す模式図である。 FIG. 5 is a flowchart showing an example of the operation of the substrate transfer apparatus according to the first embodiment. 6 to 10 are schematic diagrams showing the state of the substrate transfer device when the substrate transfer device is operating, following the flowchart shown in FIG.

まず、制御装置２００に、オペレータから図示されない入力装置を介して、一連の作業を実行することを示す指示情報が入力されたとする。すると、図５に示すように、制御装置２００は、マニピュレータ２を動作させて、基板保持ハンド３がフープ９０の前方に位置するまで移動させる（ステップＳ１０１）。このとき、制御装置２００は、基板保持ハンド３が、保持する基板９が載置されている部分よりも下方に位置するように、マニピュレータ２を動作させる。 First, it is assumed that the operator inputs instruction information indicating execution of a series of operations to the control device 200 via an input device (not shown). Then, as shown in FIG. 5, the control device 200 operates the manipulator 2 to move the substrate holding hand 3 until it is located in front of the hoop 90 (step S101). At this time, the control device 200 operates the manipulator 2 so that the substrate holding hand 3 is located below the portion on which the substrate 9 to be held is placed.

次に、制御装置２００は、基板保持ハンド３がフープ９０内の基板９の下方に位置するまで、マニピュレータ２を動作させる（ステップＳ１０２）。このとき、制御装置２００は、第１爪部４０Ａ〜４０Ｅ及び第２爪部５０Ａ〜５０Ｅを第１筐体３１内に収納した状態で、基板保持ハンド３をフープ９０内に進入させる。そして、制御装置２００は、基板保持ハンド３の第２部分で基板９を載置できる位置にまで、基板保持ハンド３を移動させる。 Next, the control device 200 operates the manipulator 2 until the substrate holding hand 3 is located below the substrate 9 in the hoop 90 (step S102). At this time, the control device 200 causes the substrate holding hand 3 to enter the hoop 90 with the first claw portions 40A to 40E and the second claw portions 50A to 50E housed in the first housing 31. Then, the control device 200 moves the substrate holding hand 3 to a position where the substrate 9 can be placed on the second portion of the substrate holding hand 3.

次に、制御装置２００は、第１方向から見て、第１爪部４０Ａ〜４０Ｅにおける第２部分の先端部と、第２爪部５０Ａ〜５０Ｅにおける第２部分の先端部と、が基板９の外周の外方に位置するように、第１駆動器１１を駆動させる（ステップＳ１０３；図６参照）。換言すると、制御装置２００は、第１爪部４０Ａ〜４０Ｅにおける第２部分の先端部と、第２爪部５０Ａ〜５０Ｅにおける第２部分の先端部と、の間の距離が、第１距離となるように、第１駆動器１１を駆動させる。 Next, in the control device 200, when viewed from the first direction, the tip portion of the second portion of the first claw portions 40A to 40E and the tip portion of the second portion of the second claw portions 50A to 50E are arranged on the substrate 9 The first driver 11 is driven so as to be positioned outside the outer periphery of the (step S103; see FIG. 6). In other words, in the control device 200, the distance between the tip of the second portion of the first claw portions 40A to 40E and the tip of the second portion of the second claw portions 50A to 50E is the first distance. The first driver 11 is driven so that

これにより、基板保持ハンド３を上方に移動させても、第１保持部材４Ａ及び第２保持部材４Ｂが、基板９との接触を抑制することができる。 Thereby, even if the substrate holding hand 3 is moved upward, the first holding member 4A and the second holding member 4B can suppress the contact with the substrate 9.

次に、制御装置２００は、マニピュレータ２を動作させて、隣接する基板９間に、第１保持部材４Ａ及び第２保持部材４Ｂが位置するように、基板保持ハンド３を移動させる（ステップＳ１０４；図７参照）。 Next, the control device 200 operates the manipulator 2 to move the substrate holding hand 3 so that the first holding member 4A and the second holding member 4B are located between the adjacent substrates 9 (step S104; (See FIG. 7).

具体的には、制御装置２００は、基板９の第１主面９Ａと平行な方向（ここでは、水平方向）から見て、第１爪部４０Ａ〜４０Ｄにおける第２部分の先端部と第２爪部５０Ａ〜５０Ｄにおける第２部分の先端部が、隣接する基板９間に位置するように、マニピュレータ２を動作させる。このとき、第１爪部４０Ｅにおける第２部分及び第２爪部５０Ｅにおける第２部分は、保持する基板９の下方に位置している。 Specifically, the control device 200 sees from the direction parallel to the first main surface 9A of the substrate 9 (here, the horizontal direction), and the second end of the first claw portions 40A to 40D and the second portion. The manipulator 2 is operated so that the tip portions of the second portions of the claw portions 50A to 50D are located between the adjacent substrates 9. At this time, the second portion of the first claw portion 40E and the second portion of the second claw portion 50E are located below the substrate 9 to be held.

なお、制御装置２００は、マニピュレータ２及び／又は駆動器１３を動作させることにより、第１爪部４０Ａ〜４０Ｄにおける第２部分の先端部と第２爪部５０Ａ〜５０Ｄにおける第２部分の先端部が、隣接する基板９間に位置するようにしてもよい。 In addition, the control device 200 operates the manipulator 2 and / or the driver 13 to thereby cause the tip portions of the second portions of the first claw portions 40A to 40D and the tip portions of the second portion of the second claw portions 50A to 50D. However, it may be located between the adjacent substrates 9.

次に、制御装置２００は、第１方向から見て、第１爪部４０Ａ〜４０Ｅにおける第２部分の先端部及び第２爪部５０Ａ〜５０Ｅにおける第２部分の先端部と、基板９の第１主面９Ａと、が重なるように、第１駆動器１１を駆動させる（ステップＳ１０５；図８参照）。より詳細には、制御装置２００は、第１方向から見て、第１爪部４０Ａ〜４０Ｅにおける第２部分の先端部及び第２爪部５０Ａ〜５０Ｅにおける第２部分の先端部と、第１主面９Ａの周縁部と、が重なるように、第１駆動器１１を駆動させる。換言すると、制御装置２００は、第１爪部４０Ａ〜４０Ｅにおける第２部分の先端部と、第２爪部５０Ａ〜５０Ｅにおける第２部分の先端部と、の間の距離が、第３距離となるように、第１駆動器１１を駆動させる。 Next, when viewed from the first direction, the control device 200 causes the tip portions of the second portions of the first claw portions 40A to 40E and the tip portions of the second portion of the second claw portions 50A to 50E, and the first portion of the substrate 9. The first driver 11 is driven such that the first main surface 9A and the first main surface 9A overlap each other (step S105; see FIG. 8). More specifically, the control device 200, when viewed from the first direction, the tip of the second portion of the first claw portions 40A to 40E and the tip of the second portion of the second claw portions 50A to 50E, and the first portion. The first driver 11 is driven so that the peripheral portion of the main surface 9A overlaps. In other words, in the control device 200, the distance between the tip of the second part of the first claws 40A to 40E and the tip of the second part of the second claws 50A to 50E is the third distance. The first driver 11 is driven so that

次に、制御装置２００は、マニピュレータ２を動作させて、第１爪部４０Ａ〜４０Ｅにおける第２部分及び第２爪部５０Ａ〜５０Ｅにおける第２部分と、基板９の第１主面９Ａと、が、それぞれ、当接するように、基板保持ハンド３が上方に移動させる（ステップＳ１０６；図９参照）。これにより、基板９を基板保持ハンド３の第１保持部材４Ａ及び第２保持部材４Ｂで保持させることができる。 Next, the control device 200 operates the manipulator 2, and the second portion of the first claw portions 40A to 40E and the second portion of the second claw portions 50A to 50E, the first main surface 9A of the substrate 9, However, the substrate holding hand 3 is moved upward so as to contact each other (step S106; see FIG. 9). As a result, the substrate 9 can be held by the first holding member 4A and the second holding member 4B of the substrate holding hand 3.

次に、制御装置２００は、第１爪部４０Ａ〜４０Ｅにおける第１部分及び第２爪部５０Ａ〜５０Ｅにおける第１部分と、基板９の周面と、が、それぞれ、当接するように、第１駆動器１１を駆動させる（ステップＳ１０７；図１０参照）。換言すれば、制御装置２００は、第１爪部４０Ａ〜４０Ｅにおける第１部分と、第２爪部５０Ａ〜５０Ｅにおける第１部分と、の間の距離が、第２距離となるように、第１駆動器１１を駆動させる。 Next, the control device 200 causes the first portion of the first claw portions 40A to 40E and the first portion of the second claw portions 50A to 50E and the peripheral surface of the substrate 9 to come into contact with each other. 1 The driver 11 is driven (step S107; see FIG. 10). In other words, the control device 200 is configured such that the distance between the first portion of the first claw portions 40A to 40E and the first portion of the second claw portions 50A to 50E becomes the second distance. 1 Drive the driver 11.

これにより、基板保持ハンド３における基板９の位置決めをすることができる。 Thereby, the substrate 9 can be positioned in the substrate holding hand 3.

次に、制御装置２００は、マニピュレータ２を動作させ、基板９を次の処理を実行する装置等に搬送させ（ステップＳ１０８）、本プログラムを終了する。 Next, the control device 200 operates the manipulator 2 to convey the substrate 9 to a device or the like that executes the next process (step S108), and ends this program.

このように構成された、本実施の形態１に係る基板搬送装置１では、制御装置２００が、第１方向から見て、第１爪部４０Ａ〜４０Ｅにおける第２部分の先端部と、第２爪部５０Ａ〜５０Ｅにおける第２部分の先端部と、が基板９の外周の外方に位置するように、第１駆動器１１を駆動させるように構成されている。 In the substrate transfer device 1 according to the first embodiment configured as described above, the control device 200, when viewed from the first direction, has a tip portion of the second portion of the first claw portions 40A to 40E and a second portion. The first driver 11 is configured to be driven so that the tip portions of the second portions of the claw portions 50A to 50E are located outside the outer circumference of the substrate 9.

これにより、基板保持ハンド３を上方に移動させるときに、第１保持部材４Ａ及び／又は第２保持部材４Ｂが、基板９との接触を抑制することができる。特に、フープ９０内に、基板９がばらついて、配置されていても、第１保持部材４Ａ及び／又は第２保持部材４Ｂが、基板９との接触を抑制することができる。 Thereby, when the substrate holding hand 3 is moved upward, the first holding member 4A and / or the second holding member 4B can suppress contact with the substrate 9. In particular, even if the substrate 9 varies and is arranged in the hoop 90, the first holding member 4A and / or the second holding member 4B can suppress the contact with the substrate 9.

また、本実施の形態１に係る基板搬送装置１では、制御装置２００が、第１爪部４０Ａ〜４０Ｅにおける第１部分及び第２爪部５０Ａ〜５０Ｅにおける第１部分と、基板９の周面と、が、それぞれ、当接するように、第１駆動器１１を駆動させるように構成されている。 Further, in the substrate transfer device 1 according to the first embodiment, the control device 200 controls the first portion of the first claw portions 40A to 40E and the first portion of the second claw portions 50A to 50E, and the peripheral surface of the substrate 9. And are configured to drive the first driver 11 so as to contact each other.

これにより、基板保持ハンド３における基板９の位置決めをすることができる。また、第１部分が、基板９の周面と当接しているため、基板９を搬送するときに、モータの振動等により、基板９の水平方向の移動を抑制することができる。 Thereby, the substrate 9 can be positioned in the substrate holding hand 3. Further, since the first portion is in contact with the peripheral surface of the substrate 9, it is possible to suppress the horizontal movement of the substrate 9 due to vibration of the motor or the like when the substrate 9 is transported.

このため、上記特許文献１に開示されている半導体ウエハの移載装置に比して、基板９を他の容器等に載置するときに、正確に位置決めをすることができる。 Therefore, as compared with the semiconductor wafer transfer device disclosed in Patent Document 1, positioning can be performed more accurately when the substrate 9 is placed in another container or the like.

［変形例１］
次に、本実施の形態１に係る基板搬送装置１の変形例について、図１１を参照しながら説明する。 [Modification 1]
Next, a modified example of the substrate transfer apparatus 1 according to the first embodiment will be described with reference to FIG.

図１１は、本実施の形態１における変形例１の基板搬送装置の概略構成を示す斜視図である。なお、図１１においては、基板搬送装置における上下方向、前後方向、及び左右方向を図における上下方向、前後方向、及び左右方向として表している。 FIG. 11 is a perspective view showing a schematic configuration of the substrate transfer apparatus of the first modification of the first embodiment. Note that, in FIG. 11, the vertical direction, the front-back direction, and the left-right direction in the substrate transfer device are represented as the vertical direction, the front-back direction, and the left-right direction in the drawing.

図１１に示すように、本変形例１の基板搬送装置１は、実施の形態１に係る基板搬送装置１と基本的構成は同じであるが、第１駆動器１１に代えて、第２保持部材４Ｂを前後方向、又は基板９の径方向に移動させるように構成されている、第２駆動器（駆動機構）１２を備える点が異なる。 As shown in FIG. 11, the substrate transfer apparatus 1 according to the first modification has the same basic configuration as the substrate transfer apparatus 1 according to the first embodiment, but instead of the first driver 11, a second holding device is used. The difference is that a second driver (driving mechanism) 12 is provided that is configured to move the member 4B in the front-back direction or in the radial direction of the substrate 9.

第２駆動器１２は、第１保持部材４Ａにおける第２部分の先端部と第２保持部材４Ｂにおける第２部分の先端部との間の距離が、基板９の直径（最大径）よりも大きくなる第１距離と、第１保持部材４Ａの第１部分と第２保持部材４Ｂの第１部分が基板９の周面（側面）と当接する第２距離と、第１距離よりも小さく、第２距離よりも大きい第３距離と、なるように、第２保持部材４Ｂを移動させるように構成されている。 In the second driver 12, the distance between the tip of the second portion of the first holding member 4A and the tip of the second portion of the second holding member 4B is larger than the diameter (maximum diameter) of the substrate 9. And a second distance at which the first portion of the first holding member 4A and the first portion of the second holding member 4B contact the peripheral surface (side surface) of the substrate 9, and the first distance is smaller than the first distance. The second holding member 4B is moved so that the third distance is larger than the second distance.

このように構成された、本変形例１の基板搬送装置１であっても、実施の形態１に係る基板搬送装置１と同様の作用効果を奏する。 Even the substrate transfer apparatus 1 of the first modified example thus configured has the same operation and effect as the substrate transfer apparatus 1 according to the first embodiment.

上記説明から、当業者にとっては、本発明の多くの改良又は他の実施形態が明らかである。従って、上記説明は、例示としてのみ解釈されるべきであり、本発明を実行する最良の態様を当業者に教示する目的で提供されたものである。本発明を逸脱することなく、その構造及び／又は機能の詳細を実質的に変更できる。 Many modifications or other embodiments of the invention will be apparent to those skilled in the art from the above description. Therefore, the above description should be construed as illustrative only and is provided for the purpose of teaching those skilled in the art the best mode for carrying out the present invention. The details of structure and / or function may be changed substantially without departing from the invention.

本発明の基板搬送装置及び基板搬送装置の運転方法は、従来の基板搬送装置に比して、正確な位置決めをすることができるため、産業ロボットの分野において有用である。 INDUSTRIAL APPLICABILITY The substrate transfer apparatus and the method for operating the substrate transfer apparatus of the present invention are more useful in the field of industrial robots because they can perform more accurate positioning than conventional substrate transfer apparatuses.

１基板搬送装置
２マニピュレータ
３基板保持ハンド
４Ａ第１保持部材
４Ｂ第２保持部材
９基板
９Ａ第１主面
１１第１駆動器
１２第２駆動器
１３駆動器
２０アーム
２１基台
２２支持台
２３支持軸
２４軸体
３０第２筐体
３１第１筐体
４０Ａ第１爪部
４０Ｂ第１爪部
４０Ｃ第１爪部
４０Ｄ第１爪部
４０Ｅ第１爪部
４１Ａ柱部分
４１Ｂ柱部分
４１Ｃ柱部分
４１Ｄ柱部分
４１Ｅ柱部分
４２Ａ当接部分
４２Ｂ当接部分
４２Ｃ当接部分
４２Ｄ当接部分
４２Ｅ当接部分
４３Ａ第２部分
４４Ａ第１部分
５０Ａ第２爪部
５０Ｂ第２爪部
５０Ｃ第２爪部
５０Ｄ第２爪部
５０Ｅ第２爪部
９０フープ
２００制御装置
２００ａ演算処理器
２００ｂ記憶器
２００ｃサーボ制御器

1 Substrate Transfer Device 2 Manipulator 3 Substrate Holding Hand 4A First Holding Member 4B Second Holding Member 9 Substrate 9A First Main Surface 11 First Driver 12 Second Driver 13 Driver 20 Arm 21 Base 22 Support 23 Shaft 24 Shaft body 30 Second housing 31 First housing 40A First claw portion 40B First claw portion 40C First claw portion 40D First claw portion 40E First claw portion 41A Pillar portion 41B Pillar portion 41C Pillar portion 41D Pillar Part 41E Column part 42A Contact part 42B Contact part 42C Contact part 42D Contact part 42E Contact part 43A 2nd part 44A 1st part 50A 2nd claw part 50B 2nd claw part 50C 2nd claw part 50D 2nd Claw part 50E Second claw part 90 Hoop 200 Control device 200a Arithmetic processor 200b Storage device 200c Servo controller

Claims

A board holding hand,
A first holding member which is provided at the base end of the substrate holding hand and holds the substrate;
A second holding member which is provided at the tip of the substrate holding hand and holds the substrate;
A manipulator for moving the substrate holding hand,
A drive mechanism for driving the first holding member or the second holding member;
And a control device,
When the thickness direction of the substrate is defined as the first direction,
The first holding member has a plurality of first claw portions arranged at a predetermined interval from each other along the first direction,
The second holding member has a plurality of second claw portions arranged at a predetermined interval from each other along the first direction,
The substrate transfer device is configured such that the plurality of first claw portions and the plurality of second claw portions respectively contact and hold a first main surface that is one main surface of the plurality of substrates. And
Each of the first claw portion and the second claw portion has a first portion extending in the first direction and a second portion extending in a direction parallel to the first main surface of the substrate,
The control device may be configured such that a tip end portion of the second portion of the first claw portion and a tip end portion of the second portion of the second claw portion are located outside the outer periphery of the substrate. , Driving the drive mechanism (A),
After the (A), the manipulator is operated to move the substrate holding hand so that the first holding member and the second holding member are located between the adjacent substrates (B).
After (B), the second portion of the first claw portion and the second portion of the second claw portion and the first main surface of the substrate are overlapped with each other when viewed from the first direction. And (C) driving the drive mechanism,
After (C), the manipulator is operated so that the second portion of the first claw portion and the second portion of the second claw portion come into contact with the first main surface of the substrate. Then, when the substrate holding hand is moved (D),
After (D), the drive mechanism is driven so that the first portion of the first claw portion and the first portion of the second claw portion and the outer periphery of the substrate come into contact with each other (E )When,
After (E), the manipulator is operated, the substrate holding hand is moved, and (F) of transporting the substrate is configured to be executed.

The substrate transfer device according to claim 1, wherein the plurality of first claw portions and the plurality of second claw portions are respectively arranged along the outer periphery of the substrate when viewed from the first direction.

A method of operating a board transfer device for transferring a board, comprising:
The substrate transfer device,
A board holding hand,
A first holding member which is provided at the tip of the substrate holding hand and holds the substrate;
A second holding member which is provided at the base end of the substrate holding hand and holds the substrate;
A manipulator for moving the substrate holding hand,
A drive mechanism for driving the first holding member or the second holding member,
When the thickness direction of the substrate is defined as the first direction,
The first holding member has a plurality of first claw portions arranged at a predetermined interval from each other along the first direction,
The second holding member has a plurality of second claw portions arranged at a predetermined interval from each other along the first direction,
The substrate transfer device is configured such that the plurality of first claw portions and the plurality of second claw portions respectively contact and hold a first main surface that is one main surface of the plurality of substrates. And
The first claw portion and the second claw portion have a first portion extending in the first direction and a second portion extending in a direction parallel to the first main surface of the substrate,
The drive mechanism is configured such that the tip of the second portion of the first claw portion and the tip of the second portion of the second claw portion are located outside the outer periphery of the substrate. When driving (A),
After the (A), the manipulator is operated to move the substrate holding hand so that the first holding member and the second holding member are located between the adjacent substrates (B).
After (B), the second portion of the first claw portion and the second portion of the second claw portion and the first main surface of the substrate are overlapped with each other when viewed from the first direction. And (C) driven by the drive mechanism,
After the step (C), the manipulator operates so that the second portion of the first claw portion and the second portion of the second claw portion come into contact with the first main surface of the substrate. Then, when the substrate holding hand is moved (D),
After (D), the drive mechanism is driven such that the first portion of the first claw portion and the first portion of the second claw portion and the outer periphery of the substrate come into contact with each other (E )When,
After the step (E), the manipulator is controlled to move the substrate holding hand to transfer the substrate (F).

The substrate transfer device according to claim 3, wherein the plurality of first claw portions and the plurality of second claw portions are respectively arranged along the outer periphery of the substrate when viewed from the first direction. how to drive.