JP2020068243A - Substrate holding apparatus, exposure apparatus, and article manufacturing method - Google Patents

Substrate holding apparatus, exposure apparatus, and article manufacturing method Download PDF

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JP2020068243A
JP2020068243A JP2018198756A JP2018198756A JP2020068243A JP 2020068243 A JP2020068243 A JP 2020068243A JP 2018198756 A JP2018198756 A JP 2018198756A JP 2018198756 A JP2018198756 A JP 2018198756A JP 2020068243 A JP2020068243 A JP 2020068243A
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Prior art keywords
substrate
substrate holding
holding member
exposure apparatus
holding device
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JP2020068243A5 (en
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雅人 鴫原
Masahito Shigihara
雅人 鴫原
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Canon Inc
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Canon Inc
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Priority to JP2018198756A priority Critical patent/JP2020068243A/en
Priority to TW108130166A priority patent/TWI770414B/en
Priority to KR1020190126649A priority patent/KR20200045405A/en
Priority to CN201910985753.5A priority patent/CN111077740A/en
Publication of JP2020068243A publication Critical patent/JP2020068243A/en
Publication of JP2020068243A5 publication Critical patent/JP2020068243A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Abstract

To provide a substrate holding device capable of suppressing a decrease in holding flatness of a substrate.SOLUTION: A substrate holding device includes a substrate holding member 9 that holds a substrate G, a base member 30 that supports the substrate holding member 9, and an actuator 32 that rotates the substrate holding member 9 within a holding surface where the substrate holding member 9 holds the substrate G, and a rotating member 39 that rotates integrally with the substrate holding member 9, and a guide member that guides the rotation of the rotating member 39 are provided between the substrate holding member 9 and the base member 30.SELECTED DRAWING: Figure 2

Description

本発明は、基板保持装置、露光装置及び物品の製造方法に関する。   The present invention relates to a substrate holding device, an exposure device, and an article manufacturing method.

フォトリソグラフィ技術を用いて半導体素子や液晶表示素子等のデバイスを製造する際に、マスクのパターンを投影光学系によって基板に投影してパターンを転写する露光装置が使用されている。   When manufacturing a device such as a semiconductor device or a liquid crystal display device by using a photolithography technique, an exposure apparatus that projects a mask pattern onto a substrate by a projection optical system and transfers the pattern is used.

露光装置において、基板を搭載した基板ステージを駆動することによって基板を移動させながら、基板上の複数のショット領域を順次露光する。デバイスの生産性を高めるために、基板ステージの駆動速度は非常に高速となっており、基板ステージの高速化に伴い、基板や基板を保持する基板保持部材に振動が伝わりやすくなっている。   In an exposure apparatus, a plurality of shot areas on a substrate are sequentially exposed while the substrate is moved by driving a substrate stage on which the substrate is mounted. In order to improve the productivity of the device, the driving speed of the substrate stage is extremely high, and with the increase in the speed of the substrate stage, vibration is easily transmitted to the substrate and the substrate holding member that holds the substrate.

また、基板保持部材に基板を載置する際に、基板保持部材が所定の位置からずれることがある。このような位置ずれを補正するために、露光装置には、一般的に、基板保持部材を回転させる回転機構が設けられている。   Further, when the substrate is placed on the substrate holding member, the substrate holding member may shift from a predetermined position. In order to correct such positional deviation, the exposure apparatus is generally provided with a rotation mechanism that rotates the substrate holding member.

特開２００１−２３０１７３号公報JP, 2001-230173, A

基板や基板保持部材への振動を低減させるための手法として、特許文献１は、基板保持部材と基板ステージのベース部材の間にＬ字型の板ばねを配置し、基板保持部材や基板に対する振動の伝達を低減する構成を開示している。   As a method for reducing the vibration to the substrate and the substrate holding member, Patent Document 1 discloses that an L-shaped leaf spring is arranged between the substrate holding member and the base member of the substrate stage to vibrate the substrate holding member and the substrate. Disclosed is a configuration that reduces the transmission of

特許文献１の基板ステージでは、基板保持部材と基板ステージの天板を上記Ｌ字型の板ばねで連結している。基板ステージの移動に伴い、上記Ｌ字型の板ばねが変形することで、基板保持部材や基板に対して鉛直方向に力が加わることがある。このような力は、基板の平坦度を部分的に変化させる要因となる。基板の平坦度が低下すると、マスクのパターンを基板上に焼き付ける際の合焦精度の低下を招き、パターンの形成精度の低下につながるおそれがある。   In the substrate stage of Patent Document 1, the substrate holding member and the top plate of the substrate stage are connected by the L-shaped leaf spring. As the substrate stage moves, the L-shaped leaf spring is deformed, so that a force may be applied to the substrate holding member and the substrate in the vertical direction. Such force becomes a factor that partially changes the flatness of the substrate. When the flatness of the substrate is lowered, the focusing accuracy when the mask pattern is printed on the substrate is lowered, which may lead to the lowering of the pattern forming accuracy.

本発明は、基板保持部材を適切に回転させる機構を備えつつ、基板ステージの移動に伴う基板の保持平坦度の低下を抑えることが可能な基板保持装置を実現することを例示的な目的とする。   An exemplary object of the present invention is to realize a substrate holding device capable of suppressing a decrease in holding flatness of a substrate due to movement of a substrate stage while having a mechanism for appropriately rotating a substrate holding member. .

本発明の基板保持装置は、基板を保持する基板保持部材と、前記基板保持部材を支持するベース部材と、前記基板保持部材が前記基板を保持する保持面内において前記基板保持部材を回転させるアクチュエータを含む基板保持装置であって、前記基板保持部材と前記ベース部材との間に、前記基板保持部材と一体的に回転する回転部材と、該回転部材の回転をガイドするガイド部材が設けられていることを特徴とする。   A substrate holding device of the present invention includes a substrate holding member that holds a substrate, a base member that supports the substrate holding member, and an actuator that rotates the substrate holding member within a holding surface where the substrate holding member holds the substrate. A substrate holding device including: a rotating member that rotates integrally with the substrate holding member; and a guide member that guides the rotation of the rotating member, between the substrate holding member and the base member. It is characterized by being

本発明によれば、基板の保持平坦度の低下を抑えることが可能な基板保持装置及び露光装置が得られる。   According to the present invention, it is possible to obtain a substrate holding device and an exposure device capable of suppressing a decrease in holding flatness of a substrate.

露光装置の概略図である。It is a schematic diagram of an exposure device. 基板保持装置の概略図である。It is a schematic diagram of a substrate holding device. 回転部材とガイド機構が連結される構成を示す図である。It is a figure showing composition which a rotation member and a guide mechanism are connected. 円形ばねの形状を示す図である。It is a figure which shows the shape of a circular spring. 基板の姿勢を検出するための構成を示す図である。It is a figure which shows the structure for detecting the attitude | position of a board | substrate.

以下、添付図面を参照して、本発明の好適な実施の形態について説明する。本発明の基板保持装置は、露光装置によって基板上にパターンの焼き付けを行う際に、基板を保持するために好適なものである。   Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. The substrate holding device of the present invention is suitable for holding a substrate when a pattern is printed on the substrate by the exposure device.

図１は、本実施形態の一側面としての露光装置の構成を示す概略図である。本実施形態における露光装置は、マスクＭと基板Ｇとを走査方向に互いに同期走査しながら、マスクＭのパターンを基板Ｇに転写する走査型露光装置（スキャナー）である。以下では、鉛直方向をＺ軸方向、Ｚ軸方向に垂直な平面内における基板Ｇの走査方向をＹ軸方向、Ｚ軸方向及びＹ軸方向に垂直な方向である非走査方向をＸ軸方向とする。   FIG. 1 is a schematic view showing the arrangement of an exposure apparatus according to one aspect of this embodiment. The exposure apparatus in the present embodiment is a scanning type exposure apparatus (scanner) that transfers the pattern of the mask M onto the substrate G while scanning the mask M and the substrate G in synchronization with each other in the scanning direction. In the following, the vertical direction is the Z-axis direction, the scanning direction of the substrate G in the plane perpendicular to the Z-axis direction is the Y-axis direction, and the non-scanning direction that is the direction perpendicular to the Z-axis direction and the Y-axis direction is the X-axis direction. To do.

露光装置は、光源１を含む光源装置２、マスクＭを照明する照明光学系３、マスクＭを保持するマスクステージ４を含む。マスクステージ４は、マスクステージ基盤６とＸＹθステージ５を備える。ＸＹθステージは、Ｘ方向、Ｙ方向、及びＸＹ面内の回転方向に移動可能である。さらに、露光装置は、マスクＭのパターンの像を基板ステージ８（基板保持装置）上に保持された基板Ｇに投影する投影光学系７を含む。   The exposure apparatus includes a light source device 2 including a light source 1, an illumination optical system 3 that illuminates the mask M, and a mask stage 4 that holds the mask M. The mask stage 4 includes a mask stage base 6 and an XYθ stage 5. The XYθ stage is movable in the X direction, the Y direction, and the rotation direction in the XY plane. Further, the exposure apparatus includes a projection optical system 7 that projects an image of the pattern of the mask M onto the substrate G held on the substrate stage 8 (substrate holding device).

光源１として高圧水銀ランプやエキシマレーザ等が用いられる。なお、一般的な露光光として、ｇ線（波長約４３６ｎｍ）や、波長領域が１００ｎｍから４００ｎｍの近紫外光が用いられる。例えば、超高圧水銀ランプのｇ線やｉ線（波長約３６５ｎｍ）、ＫｒＦエキシマレーザ光（波長約２４８ｎｍ）、ＡｒＦエキシマレーザ光（波長約１９３ｎｍ）、Ｆ２レーザ光（波長約１５７ｎｍ）などが用いられる。 As the light source 1, a high pressure mercury lamp, an excimer laser or the like is used. Note that g-line (wavelength of about 436 nm) or near-ultraviolet light having a wavelength range of 100 nm to 400 nm is used as general exposure light. For example, g-line or i-line (wavelength: about 365 nm) of an ultra-high pressure mercury lamp, KrF excimer laser light (wavelength: about 248 nm), ArF excimer laser light (wavelength: about 193 nm), F 2 laser light (wavelength: about 157 nm), etc. are used. To be

光源１から照射された光は、照明光学系３を介してマスクＭに導かれる。投影光学系７は、マスクＭのパターンを所定の投影倍率で基板Ｇに投影する。基板Ｇには特定の波長の光に対して感度を有する感光材（レジスト）が塗布されており、マスクＭのパターンの像がレジストに投影されると、レジストに潜像パターンが形成される。   The light emitted from the light source 1 is guided to the mask M via the illumination optical system 3. The projection optical system 7 projects the pattern of the mask M on the substrate G at a predetermined projection magnification. The substrate G is coated with a photosensitive material (resist) having sensitivity to light of a specific wavelength, and when a pattern image of the mask M is projected on the resist, a latent image pattern is formed on the resist.

基板Ｇは、基板ステージ８を構成する基板保持部材９によって保持される。基板保持部材９は、不図示の吸着パッドを用いた真空吸着や静電吸着等により基板Ｇを保持する。基板ステージ８は、基板Ｇ及び基板保持部材９をＸ軸方向及びＸＹ面内の回転方向に駆動させるＸステージ１１、基板ＧをＹ軸方向に駆動させるＹステージ１２を含む。また、基板ステージ８は、露光装置に含まれる本体ベース１３上に設けられる。   The substrate G is held by the substrate holding member 9 that constitutes the substrate stage 8. The substrate holding member 9 holds the substrate G by vacuum suction or electrostatic suction using a suction pad (not shown). The substrate stage 8 includes an X stage 11 that drives the substrate G and the substrate holding member 9 in the X-axis direction and the rotational direction in the XY plane, and a Y stage 12 that drives the substrate G in the Y-axis direction. The substrate stage 8 is provided on the main body base 13 included in the exposure apparatus.

マスクステージ４及び基板ステージ８の位置及び姿勢は、レーザ干渉計２０によって計測される。レーザ干渉計２０は、レーザ装置２１、マスクステージ基盤６に設けられた反射ミラー２２、ベース部材１０に設けられた反射ミラー２３、干渉ミラー２４、干渉ミラー２５を含む。マスクステージ４の位置及び姿勢は、レーザ装置２１からのレーザを干渉ミラー２５、２４を介して反射ミラー２２まで導き、反射ミラー２２において反射されたレーザを観測することで測定される。同様に、ベース部材１０の位置及び姿勢は、レーザ装置２１からのレーザを干渉ミラー２５を介して反射ミラー２３まで導き、反射ミラー２３において反射されたレーザを観測することで測定される。   The positions and orientations of the mask stage 4 and the substrate stage 8 are measured by the laser interferometer 20. The laser interferometer 20 includes a laser device 21, a reflection mirror 22 provided on the mask stage substrate 6, a reflection mirror 23 provided on the base member 10, an interference mirror 24, and an interference mirror 25. The position and orientation of the mask stage 4 is measured by guiding the laser from the laser device 21 to the reflection mirror 22 via the interference mirrors 25 and 24 and observing the laser reflected by the reflection mirror 22. Similarly, the position and orientation of the base member 10 are measured by guiding the laser from the laser device 21 to the reflection mirror 23 via the interference mirror 25 and observing the laser reflected by the reflection mirror 23.

続いて、図２を用いて、本発明における基板ステージ８の詳細な構成について説明する。基板Ｇは、基板保持部材９によって保持される。基板保持部材９は、エアパッド（支持部材）３１を介してベース部材１０に支持される。アクチュエータとしての回転モータ３２は、基板保持部材９に固定された連結アーム３３を介して基板保持部材９をＸＹ面内において回転駆動させる。   Subsequently, a detailed configuration of the substrate stage 8 in the present invention will be described with reference to FIG. The substrate G is held by the substrate holding member 9. The substrate holding member 9 is supported by the base member 10 via an air pad (supporting member) 31. The rotary motor 32 as an actuator rotationally drives the substrate holding member 9 in the XY plane via the connecting arm 33 fixed to the substrate holding member 9.

回転モータ３２を用いた基板保持部材９の回転駆動は、基板保持部材９に基板Ｇを載置する際における位置ずれを補正するために行われる。一方、上述したＸステージ１１を用いた基板保持部材９の回転駆動は、露光動作を行う前における基板Ｇの位置の微調整等のために行われる。例えば、回転モータ３２としてパルスモータを用いることで、基板保持部材９の回転量を容易に制御することができる。また、回転モータを用いて基板保持部材９の回転駆動を行うことで、基板保持部材９の位置を検出するための干渉計等が不要となる。これにより、干渉計を配置するスペースを確保する必要がなくなる等のメリットが得られる。   The rotation driving of the substrate holding member 9 using the rotation motor 32 is performed in order to correct the positional deviation when the substrate G is placed on the substrate holding member 9. On the other hand, the rotational driving of the substrate holding member 9 using the X stage 11 described above is performed for fine adjustment of the position of the substrate G before performing the exposure operation. For example, by using a pulse motor as the rotation motor 32, the rotation amount of the substrate holding member 9 can be easily controlled. Further, by rotationally driving the substrate holding member 9 using the rotary motor, an interferometer or the like for detecting the position of the substrate holding member 9 becomes unnecessary. As a result, there is an advantage that it is not necessary to secure a space for disposing the interferometer.

また、干渉計を用いると、干渉計によって基板保持部材９の位置を検出可能な範囲においてのみ基板保持部材９を回転させることが可能である。一方で、回転モータ３２及び連結アーム３３を用いることで、このような回転範囲の制限を受けることなく、基板保持部材９を回転させることができる。   Moreover, when an interferometer is used, it is possible to rotate the substrate holding member 9 only within a range in which the position of the substrate holding member 9 can be detected by the interferometer. On the other hand, by using the rotation motor 32 and the connecting arm 33, the substrate holding member 9 can be rotated without being limited by such a rotation range.

エアパッド３１は、基板Ｇを保持する基板保持部材９をＺ軸方向に浮上することができるように構成されている。また、基板保持部材９をできる限り水平に保持するために、複数のエアパッド３１がベース部材１０の周辺に設けられている。   The air pad 31 is configured so that the substrate holding member 9 holding the substrate G can be levitated in the Z-axis direction. Further, a plurality of air pads 31 are provided around the base member 10 in order to hold the substrate holding member 9 as horizontally as possible.

本発明においては、基板保持部材９とベース部材１０の間であって、エアパッド３１の内側の領域に、基板保持部材９の回転駆動をガイドするガイド機構が設けられている。ガイド機構として、ガイド部材としての転がり軸受を用いている。転がり軸受は、内輪３５と外輪３６を含む。内輪３５は、中継部材３７に固定され、中継部材３７は、弾性部材としての円形ばね３８を介して回転部材３９に固定されている。回転部材３９は、基板保持部材９に取り付けられており、基板保持部材９の回転と一体的に回転駆動される。   In the present invention, a guide mechanism for guiding the rotational drive of the substrate holding member 9 is provided in the region inside the air pad 31 between the substrate holding member 9 and the base member 10. A rolling bearing is used as a guide member as the guide mechanism. The rolling bearing includes an inner ring 35 and an outer ring 36. The inner ring 35 is fixed to a relay member 37, and the relay member 37 is fixed to a rotating member 39 via a circular spring 38 as an elastic member. The rotating member 39 is attached to the substrate holding member 9 and is rotationally driven integrally with the rotation of the substrate holding member 9.

回転モータ３２によって基板保持部材９が回転されると、回転部材３９が基板保持部材９と一体的に回転する。回転部材３９の回転軸とともに内輪３５が回転し、これに伴い、内輪３５と外輪３６との間に設けられた不図示の転動体が回転駆動することで、基板保持部材９の回転駆動がガイドされる。外輪３６は、ガイド固定部３４によってベース部材１０に固定される。   When the substrate holding member 9 is rotated by the rotation motor 32, the rotating member 39 rotates integrally with the substrate holding member 9. The inner ring 35 rotates together with the rotating shaft of the rotating member 39, and accordingly, the rolling element (not shown) provided between the inner ring 35 and the outer ring 36 is rotationally driven to guide the rotational driving of the substrate holding member 9. To be done. The outer ring 36 is fixed to the base member 10 by the guide fixing portion 34.

基板保持部材９に取り付けられた回転部材３９を介して、基板保持部材９の保持面内における回転駆動をガイドするガイド機構が設けることで、基板ステージ８の駆動に伴うＸＹ平面内における振動を基板保持部材９に伝わりにくくすることができる。これにより基板Ｇの保持平坦度を向上させることができ、結果として露光装置を用いた高精度なパターン形成を行うことができる。   By providing a guide mechanism for guiding the rotational drive in the holding surface of the substrate holding member 9 via the rotating member 39 attached to the substrate holding member 9, the vibration in the XY plane due to the driving of the substrate stage 8 is generated. It can be made hard to be transmitted to the holding member 9. As a result, the flatness of holding the substrate G can be improved, and as a result, highly accurate pattern formation using the exposure apparatus can be performed.

次に、図３を用いて、円形ばね３８によって回転部材３９とガイド機構が連結される構成について説明する。円形ばね３８の数に合わせて、複数のスペーサ３９ａをＺ軸方向に重ねて配置している。複数のスペーサ３９ａのそれぞれは回転部材３９の回転軸に挟み込むように固定されている。スペーサ３９ａの形状は円筒状とすることが好ましい。   Next, a configuration in which the rotating member 39 and the guide mechanism are connected by the circular spring 38 will be described with reference to FIG. According to the number of circular springs 38, a plurality of spacers 39a are arranged so as to overlap in the Z-axis direction. Each of the plurality of spacers 39 a is fixed so as to be sandwiched by the rotating shaft of the rotating member 39. The shape of the spacer 39a is preferably cylindrical.

また、円形ばね３８の数に合わせて、複数のスペーサ３７ａをＺ軸方向に重ねて配置している。複数のスペーサ３７ａのそれぞれは円形ばね３８の外周部に挟み込むように固定されており、これにより、スペーサ３７ａと円形ばね３８が固定されている。スペーサ３７ａの形状は円筒状とすることが好ましい。   Further, a plurality of spacers 37a are arranged so as to overlap in the Z-axis direction according to the number of circular springs 38. Each of the plurality of spacers 37a is fixed so as to be sandwiched by the outer peripheral portion of the circular spring 38, whereby the spacer 37a and the circular spring 38 are fixed. The shape of the spacer 37a is preferably cylindrical.

図４は、円形ばね３８の形状を示す図である。円形ばね３８の中心領域には、スペーサ３９ａと円形ばね３８を固定するためのボルトを通す穴３８ａが設けられている。穴３８ａの位置や数は、スペーサ３９ａの形状等に合わせて適宜変更することができる。また、円形ばね３８の周辺領域には、スペーサ３７ａと円形ばね３８を固定するためのボルトを通す穴３８ｂが設けられている。穴３８ｂの位置や数は、スペーサ３７ａの形状等に合わせて適宜変更することができる。   FIG. 4 is a diagram showing the shape of the circular spring 38. A hole 38a through which a bolt for fixing the spacer 39a and the circular spring 38 is inserted is provided in the central region of the circular spring 38. The position and number of the holes 38a can be appropriately changed according to the shape of the spacer 39a and the like. Further, in the peripheral area of the circular spring 38, a hole 38b through which a bolt for fixing the spacer 37a and the circular spring 38 is inserted is provided. The position and number of the holes 38b can be appropriately changed according to the shape of the spacer 37a and the like.

続いて、図５を用いて、基板Ｇの姿勢を検出するための構成について説明する。不図示の基板供給部から基板保持部材９に対して基板Ｇを供給するタイミング等で、基板Ｇの配置位置が理想的な位置からずれることがある。この状態で、露光装置を用いて基板上にパターン形成を行うと、パターンに位置ずれが生じてしまう。図５は、ＸＹ平面内において回転ずれが生じている例を示している。   Subsequently, a configuration for detecting the attitude of the substrate G will be described with reference to FIG. The arrangement position of the substrate G may deviate from the ideal position due to the timing of supplying the substrate G to the substrate holding member 9 from the substrate supply unit (not shown). In this state, if a pattern is formed on the substrate using the exposure apparatus, the pattern will be displaced. FIG. 5 shows an example in which a rotation deviation occurs in the XY plane.

そこで、位置検出センサ（検出部）５０を用いて基板Ｇの姿勢を検出し、基板Ｇの位置ずれを検出する。その検出結果に基づいて、位置ずれをキャンセルするように、図２における回転モータ３２を用いて基板保持部材９を回転させることで、上述した基板Ｇの位置ずれを低減することができる。位置検出センサ５０を複数設けることで、基板Ｇの回転方向の位置ずれだけでなく、Ｘ軸方向やＹ軸方向の位置ずれを分離して検出することができる。Ｘ軸方向やＹ軸方向の位置ずれは、Ｘステージ１１またはＹステージ１２を適宜駆動させることでキャンセルすることができる。   Therefore, the position detection sensor (detection unit) 50 is used to detect the posture of the substrate G, and the positional deviation of the substrate G is detected. Based on the detection result, by rotating the substrate holding member 9 using the rotary motor 32 in FIG. 2 so as to cancel the positional deviation, it is possible to reduce the above-described positional deviation of the substrate G. By providing the plurality of position detection sensors 50, not only the positional deviation in the rotation direction of the substrate G but also the positional deviation in the X-axis direction and the Y-axis direction can be separately detected. The positional deviation in the X-axis direction or the Y-axis direction can be canceled by appropriately driving the X stage 11 or the Y stage 12.

（その他の変形例）
上述した実施例においては、本発明に係る基板保持装置を露光装置としてのスキャナーに適用した例について説明をした。その他、例えば、マスクＭを固定してマスクＭのパターンを基板Ｇに投影するステッパーに対しても本発明の基板保持装置を適用することができる。 (Other modifications)
In the above-described embodiments, the example in which the substrate holding device according to the present invention is applied to the scanner as the exposure device has been described. Besides, for example, the substrate holding device of the present invention can be applied to a stepper that fixes the mask M and projects the pattern of the mask M onto the substrate G.

（物品の製造方法）
次に、前述の露光装置を用いた物品（半導体集積回路素子、液晶表示素子等）の製造方法を説明する。物品の製造方法としては、本発明に係る基板保持装置を用いて保持された基板に対して露光光を照射してパターンを形成する工程と、パターンが形成された基板を加工（現像、エッチングなど）する工程が行われる。本発明に係る基板保持装置を用いることで、基板の保持平坦度を向上させることが可能となり、結果として基板上のパターン形成精度を向上させることができる。 (Method of manufacturing articles)
Next, a method of manufacturing an article (semiconductor integrated circuit element, liquid crystal display element, etc.) using the above-described exposure apparatus will be described. As a method of manufacturing an article, a step of irradiating a substrate held by using the substrate holding device according to the present invention with exposure light to form a pattern, and a step of processing the substrate on which the pattern is formed (development, etching, etc.) ) Is performed. By using the substrate holding device according to the present invention, the holding flatness of the substrate can be improved, and as a result, the pattern forming accuracy on the substrate can be improved.

本物品の製造方法は、従来に比べて、物品の性能、品質、生産性及び生産コストの少なくとも１つにおいて有利である。または、前述の露光装置は、高品位なデバイス（半導体集積回路素子、液晶表示素子等）などの物品を提供することができる。   The method for manufacturing the present article is advantageous in at least one of the performance, quality, productivity and production cost of the article as compared with the conventional method. Alternatively, the exposure apparatus described above can provide articles such as high-quality devices (semiconductor integrated circuit elements, liquid crystal display elements, etc.).

以上、本発明の好ましい実施形態について説明したが、本発明はこれらの実施形態に限定されないことはいうまでもなく、その要旨の範囲内で種々の変形及び変更が可能である。   The preferred embodiments of the present invention have been described above, but it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

９ 基板保持部材
１０ ベース部材
３２ 回転モータ（アクチュエータ）
３９ 回転部材 9 substrate holding member 10 base member 32 rotary motor (actuator)
39 Rotating member

Claims (8)

基板を保持する基板保持部材と、
前記基板保持部材を支持するベース部材と、
前記基板保持部材が前記基板を保持する保持面内において前記基板保持部材を回転させるアクチュエータを含む基板保持装置であって、
前記基板保持部材と前記ベース部材との間に、前記基板保持部材と一体的に回転する回転部材と、該回転部材の回転をガイドするガイド部材が設けられていることを特徴とする基板保持装置。 A substrate holding member for holding the substrate;
A base member supporting the substrate holding member,
A substrate holding device including an actuator for rotating the substrate holding member in a holding surface, wherein the substrate holding member holds the substrate,
Between the substrate holding member and the base member, a rotating member that rotates integrally with the substrate holding member and a guide member that guides the rotation of the rotating member are provided. . 前記ガイド部材は、転がり軸受であり、内輪と外輪を含むことを特徴とする請求項１に記載の基板保持装置。   The substrate holding device according to claim 1, wherein the guide member is a rolling bearing and includes an inner ring and an outer ring. 前記ガイド部材を前記ベース部材に対して固定するガイド固定部をさらに含むことを特徴とする請求項１または２に記載の基板保持装置。   The substrate holding device according to claim 1, further comprising a guide fixing portion that fixes the guide member to the base member. 前記基板保持部材に保持された基板の姿勢を検出する検出部をさらに含み、
前記アクチュエータは、前記検出部による検出結果に基づいて前記基板保持部材を回転させることを特徴とする請求項１乃至３のいずれか１項に記載の基板保持装置。 Further comprising a detection unit for detecting a posture of the substrate held by the substrate holding member,
The substrate holding device according to any one of claims 1 to 3, wherein the actuator rotates the substrate holding member based on a detection result of the detection unit. 前記ベース部材と連結され、前記基板保持部材を支持する支持部材さらに有し、前記ガイド部材は前記支持部材の内側の領域に配置されていることを特徴とする請求項１乃至４のいずれか１項に記載の基板保持装置。   5. The support member, which is connected to the base member and supports the substrate holding member, is further included, and the guide member is arranged in an area inside the support member. Substrate holding device according to item. 前記回転部材と前記ガイド部材を連結する弾性部材をさらに含むことを特徴とする請求項１乃至５のいずれか１項に記載の基板保持装置。   The substrate holding device according to claim 1, further comprising an elastic member that connects the rotating member and the guide member. 露光光を用いてマスクのパターンを基板に転写する露光装置であって、
基板を請求項１乃至６のいずれか１項に記載の基板保持装置によって保持した状態で、前記基板に対して前記マスクのパターンを転写することを特徴とする露光装置。 An exposure apparatus that transfers a pattern of a mask onto a substrate using exposure light,
An exposure apparatus, wherein the pattern of the mask is transferred onto the substrate while the substrate is held by the substrate holding apparatus according to any one of claims 1 to 6. 請求項７に記載の露光装置を用いて基板を露光する工程と、
前記工程で露光された前記基板を現像する工程と、
を含むことを特徴とする物品の製造方法。 Exposing a substrate using the exposure apparatus according to claim 7;
Developing the substrate exposed in the step,
A method for manufacturing an article, comprising:
JP2018198756A 2018-10-22 2018-10-22 Substrate holding apparatus, exposure apparatus, and article manufacturing method Pending JP2020068243A (en)

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JP2006297545A (en) * 2005-04-21 2006-11-02 Nsk Ltd Positioning table device
JP2007019429A (en) * 2005-07-11 2007-01-25 Sumitomo Heavy Ind Ltd Stage equipment

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