JP2020067572A - Curved display device - Google Patents

Abstract

To prevent damage of an IC chip mounted on a substrate in a curved display device.SOLUTION: A curved display device comprises a substrate and an IC chip. The IC chip is mounted on the substrate and has a circuit surface facing the substrate. The substrate is curved by an external force. The IC chip is curved along the substrate due to the external force. The circuit surface is a neutral surface of bending stress, or a compressive stress is applied to the circuit surface.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a curved display device.

  The curved display device includes a curved display element panel and has a curved display surface. The curved display device is incorporated in a computer monitor, a mobile device, or the like.

  On the other hand, in order to display a high-definition image on the display device, it is necessary to increase the number of wirings arranged at the edge of the display element panel. However, it is difficult to increase the number of wirings. Therefore, it has been proposed that an integrated circuit (IC) chip on which a drive circuit is mounted be mounted on a frame portion of a display element panel to reduce the number of wirings. In many cases, the IC chip is chip-on-glass (COG) mounted on a glass substrate provided in a display element panel. In order to narrow the frame portion of the display element panel, the IC chip often has an elongated planar shape and is mounted so that the longitudinal direction of the planar shape is parallel to the edge of the display element panel.

  In the technique described in Patent Document 1, the liquid crystal panel is curved (paragraph 0013). The liquid crystal panel is connected to the control circuit board via a flexible COF (paragraph 0013). An IC chip is provided on the COF (paragraph 0022).

  In the technique described in Patent Document 2, it is possible to easily bend the display panel (paragraph 0035). The IC is provided inside the support portion that is configured to be more difficult to bend than the display panel (paragraphs 0029 and 0034).

  In the technique described in Patent Document 3, the liquid crystal panel substrate can be curved (paragraph 0020). The IC chip is mounted in the chip mounting area on the glass substrate (paragraphs 0018 and 0019). Areas other than the area corresponding to the chip mounting area and its peripheral area are thinned (paragraph 0020). The chip mounting area has the same thickness as that before thinning (paragraph 0020).

Patent No. 6316189 JP, 2016-173587, A JP, 2016-126111, A

  In the curved display device, the IC chip mounted on the substrate may be damaged by bending stress acting on the IC chip mounted on the substrate. This problem becomes particularly noticeable when the IC chip is mounted such that the IC chip has an elongated planar shape and the longitudinal direction of the planar shape is parallel to the edge of the display element panel.

  On the other hand, in the technique described in Patent Document 1, it is difficult to miniaturize the wiring provided on the COF, and thus it is difficult to display a high-definition image on the liquid crystal panel. Further, in the technique described in Patent Document 2, since the liquid crystal panel cannot be curved by the support portion provided with the IC, there is a large restriction on the curvature of the liquid crystal panel. Further, in the technique described in Patent Document 3, since the chip mounting region has high rigidity, the glass substrate is easily broken when the liquid crystal panel substrate is bent, and the constraint on the bending of the liquid crystal panel substrate is large. Due to these circumstances, in many cases, the techniques described in Patent Documents 1, 2, or 3 cannot be adopted to solve the above problems.

  The present invention has been made in view of these problems. An object to be solved by the present invention is to make it difficult for an IC chip mounted on a substrate to be damaged in a curved display device.

  The curved display device includes a substrate and an integrated circuit chip.

  The integrated circuit chip is mounted on the substrate and has a circuit side facing the substrate.

  The substrate is curved by an external force. The integrated circuit chip is curved along the substrate due to an external force. The circuit surface is a neutral surface of bending stress, or the circuit surface is under compressive stress.

  According to the present invention, the tensile stress acting on the integrated circuit chip, which is weak against the tensile stress, becomes smaller than that when the tensile stress acts on the circuit surface. Therefore, the integrated circuit chip mounted on the substrate is reduced. Is less likely to be damaged.

  Objects, features, aspects, and advantages of the present invention will become more apparent by the following detailed description and the accompanying drawings.

FIG. 3 is a cross-sectional view schematically showing the curved display device according to the first embodiment. FIG. 3 is a perspective view schematically illustrating an assembling method of the curved display device according to the first embodiment. 7 is a perspective view schematically illustrating a curved display device according to a modified example of the first embodiment. FIG. FIG. 7 is a cross-sectional view schematically showing the curved display device according to the second embodiment. FIG. 7 is a perspective view schematically illustrating the curved display device according to the second embodiment. FIG. 11 is a perspective view schematically illustrating the curved display device according to the third embodiment. FIG. 11 is a cross-sectional view schematically showing the curved display device according to the fourth embodiment. FIG. 16 is a perspective view schematically illustrating the curved display device according to the fifth embodiment. It is sectional drawing which illustrates the bending type display apparatus of Embodiment 6 typically. FIG. 16 is a perspective view schematically illustrating the curved display device according to the seventh embodiment. It is a perspective view which illustrates typically the bending type display apparatus of Embodiment 8, and the jig used for manufacture of the said bending type display apparatus. It is sectional drawing which illustrates typically the bending type display apparatus of Embodiment 8, and the jig used for manufacture of the said bending type display apparatus.

Embodiment 1
1.1 Curved Display Device FIG. 1 is a sectional view schematically showing the curved display device according to the first embodiment. FIG. 2 is a perspective view schematically illustrating an assembling method of the curved display device according to the first embodiment.

  The curved display device 100 according to the first embodiment illustrated in FIGS. 1 and 2 includes a protective plate 110 and a display element 111. The display element 111 includes a display element panel 120 and a flexible printed circuit board (FPC) 121. The curved display device 100 may include elements other than these elements.

  The display element 111 is a liquid crystal display element. However, the technique for making the integrated circuit (IC) chip 134 less likely to be damaged as described below may be adopted in a curved display device including a display element that is not a liquid crystal display element. For example, the technique may be adopted in a curved display device including an organic electroluminescence (EL) display element, an electrochemical display element, and the like.

  The protection plate 110 is curved when no external force acts. The display element panel 120 is flat when no external force is applied, but is curved by the external force. The display element panel 120 is attached to the curved surface 110a of the protective plate 110 and is attached to the curved surface 110a.

  The display surface of the curved display device 100 is on the front side of the curved display device 100. The protection plate 110 is arranged on the front side of the curved display device 100. The display element panel 120 is arranged on the back side of the curved display device 100. Therefore, the protective plate 110 protects the display element panel 120 from an impact applied from the front side of the curved display device 100. Further, from the front side of the curved display device 100, the image displayed on the display element panel 120 can be viewed through the protective plate 110.

  The FPC 121 is connected to the display element panel 120.

1.2 Display Element The display element panel 120 includes a glass substrate 130, a glass substrate 131, a polarizing plate 132, a polarizing plate 133, and an IC chip 134, as shown in FIGS. 1 and 2. The display element panel 120 may include elements other than these elements. The glass substrates 130 and 131 made of glass may be replaced with a substrate made of a transparent material other than glass. For example, the glass substrates 130 and 131 may be replaced with a transparent resin substrate made of a transparent resin.

  The glass substrate 130 is arranged on the front side of the curved display device 100. The glass substrate 131 is arranged on the back side of the curved display device 100. One main surface 131A of the glass substrate 131 faces the one main surface 130A of the glass substrate 130. The non-frame portion 140 of the glass substrate 131 overlaps the glass substrate 130 when viewed in the thickness direction D1 of the glass substrate 131. The frame portion 141 of the glass substrate 131 is continuous from the non-frame portion 140 of the glass substrate 131 and does not overlap the glass substrate 130 when viewed in the thickness direction D1 of the glass substrate 131. The polarizing plate 132 is attached to the other main surface 130B of the glass substrate 130. The polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131.

  The display element panel 120 includes wiring and an anisotropic conductive film. The wiring is formed on one main surface 131A of the glass substrate 131. The FPC 121 and the IC chip 134 are attached to the one main surface 131A via an anisotropic conductive film. The FPC 121 and the IC chip 134 are attached to the frame portion 141. The anisotropic conductive film is composed of an adhesive layer in which conductive particles are mixed. As a result, the FPC 121 and the IC chip 134 are electrically connected to the wiring formed on the one main surface 131A. Therefore, the IC chip 134 is electrically connected to the FPC 121 via the wiring.

  When the display element 111 displays an image, a video signal and power are supplied to the FPC 121 and are supplied to the display element panel 120 via the FPC 121. The video signal and the power source supplied to the display element panel 120 are supplied to the IC chip 134 via the wiring formed on the one main surface 131A of the glass substrate 131. The IC chip 134 is a driving IC chip in which a driving circuit is mounted, operates by using the supplied power, and generates a driving signal according to the supplied video signal. The display element panel 120 controls the light transmittance of each pixel according to the generated drive signal. As a result, the display element panel 120 displays an image according to the supplied image signal in the image display area 170. A signal other than a video signal may be supplied to the FPC 121 and may be supplied to the display element panel 120 via the FPC 121. For example, a touch panel signal may be supplied to the FPC 121 and may be supplied to the display element panel 120 via the FPC 121.

1.3 Mounting of IC Chip The IC chip 134 is mounted on the glass substrate 131 as a chip-on-glass (COG), as shown in FIGS. The COG implementation may be replaced with a non-COG implementation. The IC chip 134 is mounted face down on the glass substrate 131 with the circuit surface 134A of the IC chip 134 facing the glass substrate 131. The IC chip 134 is mounted on the frame portion 141.

  The IC chip 134 has bumps. The bump is arranged on the circuit surface 134A of the IC chip 134. The bump is connected to a wiring formed on one main surface 131A of the glass substrate 131. Thereby, the IC chip 134 is electrically connected to the wiring.

1.4 Manufacturing of Curved Display Device When the curved display device 100 is manufactured, an intermediate product of the display element panel 120 on which the IC chip 134 is not mounted is assembled.

  Then, the IC chip 134 is mounted on the frame portion 141 provided in the intermediate product of the assembled display element panel 120, and the FPC 121 is mounted on the frame portion 141. As a result, the display element 111 including the display element panel 120 is assembled.

  Then, the entire display element panel 120 included in the assembled display element 111 is curved.

  Subsequently, as shown in FIG. 2, the curved display element panel 120 is attached to the protective plate 110 which is curved in advance. As a result, the curved display device 100 is completed.

1.5 Bending Stress The display element panel 120 is bent by an external force as shown in FIGS. 1 and 2. Therefore, each element of the glass substrate 130, the glass substrate 131, the polarizing plate 132, and the polarizing plate 133 provided in the display element panel 120 is curved by an external force acting on each element. The IC chip 134 included in the display element panel 120 is also curved along the glass substrate 131 due to the external force acting on the IC chip 134. As a result, bending stress is generated inside the glass substrate 131 and the IC chip 134.

  One main surface 131A of the glass substrate 131 has a mounting area 160 on which the IC chip 134 is mounted. The other main surface 131B of the glass substrate 131 is on the side opposite to the side where the one main surface 131A of the glass substrate 131 is located, and overlaps with the mounting region 160 when viewed from the thickness direction D1 of the glass substrate 131. It has a mounting area back surface 162.

  The back surface 134B of the IC chip 134 is on the side opposite to the side where the circuit surface 134A of the IC chip 134 is located.

  One main surface 131A of the glass substrate 131 is a concave surface. Therefore, the mounting area 160 on the one main surface 131A is also a concave surface. Therefore, within a certain range of the mounting region 160, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the other main surface 131B of the glass substrate 131. The compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting tensile stress TS increases as it approaches the other principal surface 131B. Moreover, the acting compressive stress CS becomes larger as it approaches the back surface 134B.

  The thicknesses of the glass substrate 131 and the IC chip 134 are determined such that the neutral surface of the bending stress is formed on the circuit surface 134A of the IC chip 134 or in the glass substrate 131. Therefore, the thickness of at least one of the glass substrate 131 and the IC chip 134 is adjusted by polishing or the like. As a result, in the curved display device 100, the section modulus of the glass substrate 131 and the IC chip 134 is adjusted so that the circuit surface 134A is a neutral surface or the compressive stress CS in a direction parallel to the circuit surface 134A. Acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller than that when the tensile stress TS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A, and the compression acting on the IC chip 134 is reduced. The stress CS increases. Polishing of the IC chip 134 is performed in a wafer state, for example.

  The IC chip 134 is mainly composed of a silicon substrate which is a brittle material. Therefore, the IC chip 134 is strong against the compressive stress CS but weak against the tensile stress TS. In the curved display device 100, since the tensile stress TS acting on the IC chip 134, which is weak with respect to the tensile stress TS, becomes small, the IC chip 134 mounted on the glass substrate 131 is less likely to be damaged.

  The edge 131L on the long side of the glass substrate 131 is curved in parallel with the direction D2 in which the display element panel 120 is curved. The edge 131S on the short side of the glass substrate 131 is perpendicular to the direction D2 and is not curved. The long side edge 131L may be perpendicular to the direction D2, and the short side edge 131S may be parallel to the direction D2. The IC chip 134 has a rectangular planar shape. The IC chip 134L is mounted on the mounting region 160L provided along the long side edge 131L. The longitudinal direction of the IC chip 134L is parallel to the long side edge 131L. The IC chip 134S is mounted on the mounting area 160S provided along the short side edge 131S. The longitudinal direction of the IC chip 134S is parallel to the short side edge 131S. The effect of making the IC chip 134 mounted on the glass substrate 131 less likely to be damaged is particularly remarkable in the IC chip 134L which is easily damaged by bending.

The thicknesses of the glass substrate 131 and the IC chip 134 are the thickness t _{IC of} the IC chip 134, the sectional area S _{IC of} the IC chip 134 perpendicular to the direction D2 in which the glass substrate 131 is curved, and the elasticity of the IC chip 134. Rate E _IC , thickness t _{glass of} glass substrate 131, area S _glass of the cross section of glass substrate 131 that is perpendicular to direction D2 and forms the same plane as the cross section of IC chip 134, elastic modulus E _glass of glass substrate 131, and correction The coefficient a is determined so as to satisfy Expression 1. The correction coefficient a is obtained by experiment or theoretical calculation.

  It should be noted that by checking in advance the range of the magnitude of bending stress acting on the circuit surface 134A of the IC chip 134, which allows the IC chip 134 to operate normally, the bending radius of the display element panel 120 can be designed. You can estimate the limits.

  The thickness of at least one of the glass substrate 131 and the IC chip 134 is desirably adjusted so that the neutral surface of the bending stress is formed on the circuit surface 134A of the IC chip 134. Thus, an electronic circuit provided in the IC chip 134, an electronic circuit provided in the glass substrate 131, and a circuit in which an electrical connection structure for electrically connecting the former electronic circuit and the latter electronic circuit to each other are concentrated. The tensile stress TS and the compressive stress CS acting on the surface 134A are eliminated, so that the defective electrical functions of the IC chip 134 and glass substrate 131 can be suppressed. Further, peeling of the IC chip 134 can be made difficult to occur.

  Below, an element corresponding to an element of the curved display device 100, whether it is not hidden by another element or hidden by another element, is a curved display device. The same reference numerals are assigned to the 100 elements.

1.6 Mounting of IC Chip on Convex Surface FIG. 3 is a perspective view schematically showing a curved display device of a modification of the first embodiment.

  The display element panel 120 included in the curved display device 180 of the modification of the first embodiment shown in FIG. 3 is curved in an S shape. Therefore, one main surface 131A of the glass substrate 131 included in the display element panel 120 has a mounting area 160 that is a convex surface.

  Within a certain range of the mounting area 160, which is a convex surface, the compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the other main surface 131B of the glass substrate 131. Further, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting compressive stress CS increases as it approaches the other principal surface 131B. Further, the acting tensile stress TS increases as it approaches the back surface 134B.

  The thicknesses of the glass substrate 131 and the IC chip 134 are determined such that the neutral surface of bending stress is formed on the circuit surface 134A of the IC chip 134 or in the IC chip 134. Therefore, the thickness of at least one of the glass substrate 131 and the IC chip 134 is adjusted by polishing or the like. As a result, in the curved display device 180, the section modulus of the glass substrate 131 and the IC chip 134 is adjusted so that the circuit surface 134A is a neutral surface or the compressive stress CS in the direction parallel to the circuit surface 134A. Acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller than that when the tensile stress TS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A. In some cases, the tensile stress TS acts on the IC chip 134. The acting compressive stress CS becomes large.

The thicknesses of the glass substrate 131 and the IC chip 134 are adjusted by adjusting the sectional area S _{ic of} the IC chip 134 perpendicular to the direction D2 in which the glass substrate 131 is curved, the elastic modulus E _ic of the IC chip 134, and the direction D2. The area S _glass of the cross section of the glass substrate 131 which is vertical and forms the same plane as the cross section of the IC chip 134, the elastic modulus E _glass of the glass substrate 131, and the correction coefficient a are satisfied so as to satisfy the expression 2.

Second Embodiment
FIG. 4 is a cross-sectional view schematically showing the curved display device according to the second embodiment. FIG. 5 is a perspective view schematically illustrating the curved display device according to the second embodiment.

  The curved display device 200 of the second embodiment shown in FIGS. 4 and 5 differs from the curved display device 100 of the first embodiment shown in FIGS. 1 and 2 mainly in the following points. .

  In the curved display device 100 shown in FIGS. 1 and 2, a polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131.

  On the other hand, in the curved display device 200 illustrated in FIGS. 4 and 5, the polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131, and the other main surface of the polarizing plate 133 is attached. A reinforcing plate 135 for reinforcing the glass substrate 131 is attached to 133B.

  In the following, the configuration adopted in the curved display device 200 will be described in relation to the above differences. Regarding the configuration not described, the configuration adopted in the curved display device 100 is used as it is or after being modified in the curved display device 200.

  One main surface 133A of the polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131. The other main surface 133B of the polarizing plate 133 is on the side opposite to the one main surface 133A of the polarizing plate 133. The first main surface 135A of the reinforcing plate 135 is attached to the other main surface 133B of the polarizing plate 133 via an adhesive layer. The second main surface 135B of the reinforcing plate 135 is on the side opposite to the side of the first main surface 135A of the reinforcing plate 135. The polarizing plate 133 and the reinforcing plate 135 overlap with the image display area 170, the mounting area 160, and the peripheral area thereof when viewed from the thickness direction D1 of the glass substrate 131, and the other main surface 131B of the glass substrate 131 is substantially omitted. It overlaps the whole.

  The material forming the reinforcing plate 135 is selected from materials such as glass, metal, and resin in consideration of elastic modulus. When it is necessary to irradiate the other main surface 133B of the polarizing plate 133 with light through the reinforcing plate 135, the material forming the reinforcing plate 135 is selected from transparent materials such as glass and transparent resin.

  When the curved display device 200 is manufactured, an intermediate product of the display element panel 120 in which the IC chip 134 is not mounted and the reinforcing plate 135 is not bonded is assembled.

  Subsequently, the IC chip 134 is mounted on the frame part 141 provided in the intermediate product of the assembled display element panel 120, the FPC 121 is mounted on the frame part 141, and the polarizing plate provided in the intermediate product of the display element panel 120 is installed. The reinforcing plate 135 is attached to the other main surface 133B of the 133. As a result, the display element 111 including the display element panel 120 is assembled.

  Then, the entire display element panel 120 included in the assembled display element 111 is curved.

  Subsequently, the curved display element panel 120 is attached to the protective plate 110 which is curved in advance. As a result, the curved display device 200 is completed.

  Also in the curved display device 200, one main surface 131A of the glass substrate 131 is a concave surface. Therefore, the mounting area 160 on the one main surface 131A is also a concave surface. Therefore, within a certain range of the mounting region 160, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the second main surface 135B of the reinforcing plate 135. The compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting tensile stress TS increases as it approaches the second principal surface 135B. Moreover, the acting compressive stress CS becomes larger as it approaches the back surface 134B.

  The reinforcing plate 135 is on the other main surface 131B of the glass substrate 131, and is curved by the external force together with the glass substrate 131. The reinforcing plate 135 is a member that moves the neutral surface of bending stress onto the circuit surface 134A of the IC chip 134 or into the glass substrate 131. Therefore, in the curved display device 200, the circuit surface 134A is a neutral surface or the compressive stress CS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller than that when the tensile stress TS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A, and the compression acting on the IC chip 134 is reduced. The stress CS increases.

  In the curved display device 200 as well, similarly to the curved display device 100, the tensile stress TS acting on the IC chip 134 which is weak with respect to the tensile stress TS becomes small, so that the IC chip 134 mounted on the glass substrate 131 can be made smaller. Damage is less likely to occur.

  In the curved display device 200 as well, similar to the curved display device 100, the range of the magnitude of the bending stress acting on the circuit surface 134A of the IC chip 134 that allows the IC chip 134 to operate normally is preliminarily set. By conducting the above investigation, the limit of the bending radius of the display element panel 120 can be estimated at the time of designing.

  Also in the curved display device 200, as in the curved display device 100, by forming the neutral surface of the bending stress on the circuit surface 134A of the IC chip 134, the electrical characteristics of the IC chip 134 and the glass substrate 131 are improved. It is possible to suppress defects in various functions. Further, peeling of the IC chip 134 can be made difficult to occur.

Third Embodiment
FIG. 6 is a perspective view schematically showing the curved display device according to the third embodiment.

  The curved display device 300 of the third embodiment shown in FIG. 6 mainly differs from the curved display device 100 of the first embodiment shown in FIGS. 1 and 2 in the following points.

  In the curved display device 100 shown in FIGS. 1 and 2, a polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131.

  On the other hand, in the curved display device 300 shown in FIG. 6, the polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131, and the glass is attached to the other main surface 131B of the glass substrate 131. A reinforcing plate 135 that reinforces the substrate 131 is attached.

  In the following, the configuration adopted in the curved display device 300 will be described in relation to the above differences. Regarding the configuration not described, the configuration adopted in the curved display device 100 is adopted as it is or after being modified in the curved display device 300.

  The polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131. The reinforcing plate 135 is attached to the other main surface 131B of the glass substrate 131. The polarizing plate 133 overlaps the image display area 170 when viewed in the thickness direction D1 of the glass substrate 131, but does not overlap the mounting area 160 and its peripheral area. The reinforcing plate 135 overlaps the mounting region 160 and its peripheral region when viewed in the thickness direction D1 of the glass substrate 131, but does not overlap the image display region 170.

  The material forming the reinforcing plate 135 is selected from materials such as glass, metal, and resin in consideration of elastic modulus.

  When the curved display device 300 is manufactured, an intermediate product of the display element panel 120 in which the IC chip 134 is not mounted and the reinforcing plate 135 is not bonded is assembled.

  Subsequently, the IC chip 134 is mounted on the frame portion 141 provided in the intermediate product of the assembled display element panel 120, the FPC 121 is mounted on the frame portion 141, and the glass substrate provided in the intermediate product of the display element panel 120. The reinforcing plate 135 is attached to the other main surface 131B of the 131. As a result, the display element 111 including the display element panel 120 is assembled.

  Then, the entire display element panel 120 included in the assembled display element 111 is curved.

  Subsequently, the curved display element panel 120 is attached to the protective plate 110 which is curved in advance. As a result, the curved display device 300 is completed.

  Also in the curved display device 300, one main surface 131A of the glass substrate 131 is a concave surface. Therefore, the mounting area 160 on the one main surface 131A is also a concave surface. Therefore, within a certain range of the mounting region 160, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the second main surface 135B of the reinforcing plate 135. The compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting tensile stress TS increases as it approaches the second principal surface 135B. Moreover, the acting compressive stress CS becomes larger as it approaches the back surface 134B.

  The reinforcing plate 135 is on the other main surface 131B of the glass substrate 131, and is curved by the external force together with the glass substrate 131. The reinforcing plate 135 is a member that moves the neutral surface of bending stress onto the circuit surface 134A of the IC chip 134 or into the glass substrate 131. Therefore, in the curved display device 300, the circuit surface 134A is a neutral surface or the compressive stress CS parallel to the circuit surface 134A acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller and the compressive stress CS acting on the IC chip 134 becomes smaller than in the case where the tensile stress TS parallel to the circuit surface 134A acts on the circuit surface 134A. Grows larger.

  In the curved display device 300 as well, similar to the curved display device 100, the tensile stress TS acting on the IC chip 134, which is weak with respect to the tensile stress TS, becomes small. Therefore, the IC chip 134 mounted on the glass substrate 131 is Damage is less likely to occur.

  In the curved display device 300 as well, similarly to the curved display device 100, the range of the magnitude of the bending stress acting on the circuit surface 134A of the IC chip 134 that allows the IC chip 134 to operate normally is preliminarily set. By conducting the above investigation, the limit of the bending radius of the display element panel 120 can be estimated at the time of designing.

  Also in the curved display device 300, as in the curved display device 100, by forming the neutral plane of the bending stress on the circuit surface 134A of the IC chip 134, the electrical characteristics of the IC chip 134 and the glass substrate 131 are improved. It is possible to suppress defects in various functions. Further, peeling of the IC chip 134 can be made difficult to occur.

Fourth Embodiment
FIG. 7 is a cross-sectional view schematically illustrating the curved display device according to the fourth embodiment.

  The curved display device 400 of the fourth embodiment shown in FIG. 7 mainly differs from the curved display device 100 of the first embodiment shown in FIGS. 1 and 2 in the following points.

  In the curved display device 100 shown in FIGS. 1 and 2, a polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131.

  On the other hand, in the curved display device 400 shown in FIG. 7, the reinforcing plate 135 for reinforcing the glass substrate 131 is attached to the other main surface 131B of the glass substrate 131, and the second reinforcing plate 135 A polarizing plate 133 is attached to the main surface 135B of the.

  In the following, the configuration adopted in the curved display device 400 will be described in relation to the above differences. Regarding the configuration not described, the configuration adopted in the curved display device 100 is adopted as it is or after being modified in the curved display device 400.

  The first main surface 135A of the reinforcing plate 135 is attached to the other main surface 131B of the glass substrate 131. The second main surface 135B of the reinforcing plate 135 is on the side opposite to the side of the first main surface 135A of the reinforcing plate 135. The polarizing plate 133 is attached to the second main surface 135B of the reinforcing plate 135. The polarizing plate 133 and the reinforcing plate 135 overlap with the image display area 170, the mounting area 160, and the peripheral area thereof when viewed from the thickness direction D1 of the glass substrate 131, and the other main surface 131B of the glass substrate 131 is substantially omitted. It overlaps the whole.

  The material forming the reinforcing plate 135 is selected from transparent materials such as glass and transparent resin.

  When the curved display device 400 is manufactured, an intermediate product of the display element panel 120 in which the IC chip 134 is not mounted and the polarizing plate 133 and the reinforcing plate 135 are not attached is assembled.

  Subsequently, the IC chip 134 is mounted on the frame portion 141 provided in the intermediate product of the assembled display element panel 120, the FPC 121 is mounted on the frame portion 141, and the glass substrate provided in the intermediate product of the display element panel 120. The reinforcing plate 135 and the polarizing plate 133 are attached to the other main surface 131B of the 131. As a result, the display element 111 including the display element panel 120 is assembled.

  Subsequently, the entire display element panel 120 provided in the intermediate product of the assembled display element 111 is curved.

  Subsequently, the curved display element panel 120 is attached to the protective plate 110 which is curved in advance. As a result, the curved display device 400 is completed.

  Also in the curved display device 400, one main surface 131A of the glass substrate 131 is a concave surface. Therefore, the mounting area 160 on the one main surface 131A is also a concave surface. Therefore, within a certain range of the mounting region 160, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the second main surface 135B of the reinforcing plate 135. The compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting tensile stress TS increases as it approaches the second principal surface 135B. Moreover, the acting compressive stress CS becomes larger as it approaches the back surface 134B.

  The reinforcing plate 135 is on the other main surface 131B of the glass substrate 131, and is curved by the external force together with the glass substrate 131. The reinforcing plate 135 is a member that moves the neutral surface of bending stress onto the circuit surface 134A of the IC chip 134 or into the glass substrate 131. Therefore, in the curved display device 400, the circuit surface 134A is a neutral surface or the compressive stress CS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller than that when the tensile stress TS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A, and the compression acting on the IC chip 134 is reduced. The stress CS increases.

  In the curved display device 400 as well, similar to the curved display device 100, the tensile stress TS acting on the IC chip 134, which is weak with respect to the tensile stress TS, becomes small, and thus the IC chip 134 mounted on the glass substrate 131 is Damage is less likely to occur.

  Also, in the curved display device 400, similarly to the curved display device 100, the range of the magnitude of the bending stress acting on the circuit surface 134A of the IC chip 134 that allows the IC chip 134 to operate normally is preliminarily set. By conducting the above investigation, the limit of the bending radius of the display element panel 120 can be estimated at the time of designing.

  Also in the curved display device 400, as in the curved display device 100, the neutral surface of the bending stress is formed on the circuit surface 134A of the IC chip 134, so that the IC chip 134 and the glass substrate 131 are electrically connected. It is possible to suppress defects in various functions. Further, peeling of the IC chip 134 can be made difficult to occur.

  In addition, in the curved display device 400, the bending stress acting on the polarizing plate 133 can be reduced. The polarizing plate 133 generally includes a resin material layer and an adhesive layer, and when curved, a deviation occurs between the resin material layer and the adhesive layer. Therefore, reducing the bending stress acting on the polarizing plate 133 contributes to suppressing the displacement between the resin material layer and the adhesive layer that occurs on the polarizing plate 133.

Fifth Embodiment
FIG. 8 is a perspective view schematically showing the curved display device according to the fifth embodiment.

  The curved display device 500 of the fifth embodiment shown in FIG. 8 mainly differs from the curved display device 100 of the first embodiment shown in FIGS. 1 and 2 in the following points.

  In the curved display device 100 shown in FIGS. 1 and 2, a polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131.

  On the other hand, in the curved display device 500 shown in FIG. 8, the polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131, and the glass is attached to the other main surface 133B of the polarizing plate 133. A reinforcing plate 135 that reinforces the substrate 131 is attached.

  In the following, the configuration adopted in the curved display device 500 will be described in relation to the above differences. Regarding the configuration that is not described, the configuration adopted in the curved display device 100 is adopted as it is or after being modified in the curved display device 500.

  One main surface 133A of the polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131. The other main surface 133B of the polarizing plate 133 is on the side opposite to the one main surface 133A of the polarizing plate 133. The reinforcing plate 135 is attached to the other main surface 133B of the polarizing plate 133 via an adhesive layer. The reinforcing plate 135 overlaps the image display area 170 when viewed from the thickness direction D1 of the glass substrate 131, but does not overlap the mounting area 160 and the peripheral area thereof.

  The material forming the reinforcing plate 135 is selected from transparent materials such as glass and transparent resin.

  When the curved display device 500 is manufactured, an intermediate product of the display element panel 120 in which the IC chip 134 is not mounted and the reinforcing plate 135 is not bonded is assembled.

  Subsequently, the IC chip 134 is mounted on the frame part 141 provided in the intermediate product of the assembled display element panel 120, the FPC 121 is mounted on the frame part 141, and the polarizing plate provided in the intermediate product of the display element panel 120 is installed. The reinforcing plate 135 is attached to the other main surface 133B of the 133. As a result, the display element 111 including the display element panel 120 is assembled.

  Then, the entire display element panel 120 included in the assembled display element 111 is curved.

  Subsequently, the curved display element panel 120 is attached to the protective plate 110 which is curved in advance. As a result, the curved display device 500 is completed.

  Also in the curved display device 500, one main surface 131A of the glass substrate 131 is a concave surface. Therefore, the mounting area 160 on the one main surface 131A is also a concave surface. Therefore, within a certain range of the mounting region 160, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the second main surface 135B of the reinforcing plate 135. The compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting tensile stress TS increases as it approaches the second principal surface 135B. Moreover, the acting compressive stress CS becomes larger as it approaches the back surface 134B.

  The reinforcing plate 135 is on the other main surface 131B of the glass substrate 131, and is curved by the external force together with the glass substrate 131. The reinforcing plate 135 does not overlap with the mounting region 160 on the one main surface 131A of the glass substrate 131, and the positional relationship between the position of the reinforcing plate 135 and the position of the mounting region 160 has a twisted positional relationship. However, the influence of the reinforcing plate 135 on the stress extends to the vicinity of the mounting region 160. Therefore, the reinforcing plate 135 is a member that moves the neutral surface of the bending stress onto the circuit surface 134A of the IC chip 134 or into the glass substrate 131. Therefore, in the curved display device 500, the circuit surface 134A is a neutral surface or the compressive stress CS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller than that when the tensile stress TS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A, and the compression acting on the IC chip 134 is reduced. The stress CS increases.

  In the curved display device 500 as well, similar to the curved display device 100, the tensile stress TS acting on the IC chip 134 weak against the tensile stress TS becomes small, so that the IC chip 134 mounted on the glass substrate 131 can be made smaller. Damage is less likely to occur.

  Also in the curved display device 500, similarly to the curved display device 100, the range of the magnitude of the bending stress acting on the circuit surface 134A of the IC chip 134 that allows the IC chip 134 to operate normally is preliminarily set. By conducting the above investigation, the limit of the bending radius of the display element panel 120 can be estimated at the time of designing.

  Also in the curved display device 500, similarly to the curved display device 100, by forming the neutral surface of the bending stress on the circuit surface 134A of the IC chip 134, the electrical conductivity of the IC chip 134 and the glass substrate 131 is improved. It is possible to suppress defects in various functions. Further, peeling of the IC chip 134 can be made difficult to occur.

Sixth Embodiment
FIG. 9 is a cross-sectional view schematically illustrating the curved display device according to the sixth embodiment.

  The curved display device 600 of the sixth embodiment shown in FIG. 9 is different from the curved display device 100 of the first embodiment shown in FIGS. 1 and 2 mainly in the following points.

  In the curved display device 100 shown in FIGS. 1 and 2, a polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131.

  On the other hand, in the curved display device 600 illustrated in FIG. 9, the optical film 136 including the polarizing plate 150 and the stress adjusting layer 151 is attached to the other main surface 131B of the glass substrate 131.

  In the following, the configuration adopted in the curved display device 600 will be described in relation to the above differences. Regarding the configuration not described, the configuration adopted in the curved display device 100 is used as it is or after being modified in the curved display device 600.

  The optical film 136 is attached to the other main surface 131B of the glass substrate 131.

  The optical film 136 has a multilayer structure and includes a polarizing plate 150 and a stress adjusting layer 151. The polarizing plate 150 and the stress adjustment layer 151 are laminated. One principal surface 151A of the stress adjustment layer 151 contacts the polarizing plate 150. The other main surface 151B of the stress adjustment layer 151 is on the side opposite to the side where the one main surface 151A of the stress adjustment layer 151 is located.

  The material forming the stress adjustment layer 151 is selected from transparent resins.

  When the curved display device 600 is manufactured, an intermediate product of the display element panel 120 in which the IC chip 134 is not mounted and the optical film 136 is not bonded is assembled.

  Subsequently, the IC chip 134 is mounted on the frame portion 141 provided in the intermediate product of the assembled display element panel 120, the FPC 121 is mounted on the frame portion 141, and the glass substrate provided in the intermediate product of the display element panel 120. The optical film 136 is attached to the other main surface 131B of the 131. As a result, the display element 111 including the display element panel 120 is assembled.

  Then, the entire display element panel 120 included in the assembled display element 111 is curved.

  Subsequently, the curved display element panel 120 is attached to the protective plate 110 which is curved in advance. As a result, the curved display device 600 is completed.

  Also in the curved display device 600, one main surface 131A of the glass substrate 131 is a concave surface. Therefore, the mounting area 160 on the one main surface 131A is also a concave surface. Therefore, within a certain range of the mounting region 160, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the other main surface 151B of the stress adjusting layer 151. The compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting tensile stress TS increases as it approaches the other principal surface 151B. Moreover, the acting compressive stress CS becomes larger as it approaches the back surface 134B.

  The stress adjustment layer 151 is on the other main surface 131B of the glass substrate 131 and is curved by the external force together with the glass substrate 131. The stress adjusting layer 151 is a member that moves the neutral surface of the bending stress onto the circuit surface 134A of the IC chip 134 or into the glass substrate 131. Therefore, in the curved display device 600, the circuit surface 134A is a neutral surface or the compressive stress CS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller than that in the case where the tensile stress TS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A, and the compression acting on the IC chip 134 is reduced. The stress CS increases.

  In the curved display device 600 as well, similar to the curved display device 100, the tensile stress TS acting on the IC chip 134 which is weak with respect to the tensile stress TS becomes small, so that the IC chip 134 mounted on the glass substrate 131 can be made smaller. Damage is less likely to occur.

  Also in the curved display device 600, similarly to the curved display device 100, the range of the magnitude of the bending stress acting on the circuit surface 134A of the IC chip 134, which allows the IC chip 134 to operate normally, is preset. By conducting the above investigation, the limit of the bending radius of the display element panel 120 can be estimated at the time of designing.

  Also in the curved display device 600, as in the curved display device 100, by forming the neutral surface of the bending stress on the circuit surface 134A of the IC chip 134, the electrical characteristics of the IC chip 134 and the glass substrate 131 are improved. It is possible to suppress defects in various functions. Further, peeling of the IC chip 134 can be made difficult to occur.

  In addition, in the curved display device 600, since the stress adjustment layer 151 has the same function as that of the reinforcing plate 135 included in the curved display device 200 according to the second embodiment, the reinforcing plate 135 is eliminated and the stress adjusting layer 151 is curved. It is possible to reduce the number of parts constituting the die display device 600.

Seventh Embodiment
FIG. 10 is a perspective view schematically illustrating the curved display device according to the seventh embodiment.

  The curved display device 700 of the seventh embodiment shown in FIG. 10 mainly differs from the curved display device 100 of the first embodiment shown in FIGS. 1 and 2 in the following points.

  In the curved display device 100 shown in FIGS. 1 and 2, a polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131.

  On the other hand, in the curved display device 700 shown in FIG. 10, the polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131, and the back surface is attached to the other main surface 133B of the polarizing plate 133. A light guide plate 137 that guides the light from the light to the other main surface 133B is attached.

  In the following, the configuration adopted in the curved display device 700 will be described in relation to the above differences. Regarding the configuration that is not described, the configuration adopted in the curved display device 100 is adopted as it is or after being modified in the curved display device 700.

  One main surface 133A of the polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131. The other main surface 133B of the polarizing plate 133 is on the side opposite to the one main surface 133A of the polarizing plate 133. The light guide plate 137 is attached to the other main surface 133B of the polarizing plate 133 via an adhesive layer. The light guide plate 137 preferably overlaps the image display area 170, the mounting area 160, and the peripheral area thereof when viewed in the thickness direction D1 of the glass substrate 131, and substantially the entire other main surface 131B of the glass substrate 131. Overlaps. However, the light guide plate 137 overlaps with the image display region 170 when viewed from the thickness direction D1 of the glass substrate 131, as in the reinforcing plate 135 included in the curved display device 500 according to the fifth embodiment, but the mounting region 160 and It does not have to overlap the surrounding area.

  The material forming the light guide plate 137 is selected from transparent materials such as glass and transparent resin. The light guide plate 137 can be manufactured by processing a transparent material.

  When the curved display device 700 is manufactured, an intermediate product of the display element panel 120 in which the IC chip 134 is not mounted and the light guide plate 137 is not bonded is assembled.

  Subsequently, the IC chip 134 is mounted on the frame part 141 provided in the intermediate product of the assembled display element panel 120, the FPC 121 is mounted on the frame part 141, and the polarizing plate provided in the intermediate product of the display element panel 120 is installed. The light guide plate 137 is attached to the other main surface 133B of the 133. As a result, the display element 111 including the display element panel 120 is assembled.

  Subsequently, the entire display element panel 120 provided in the intermediate product of the assembled display element 111 is curved.

  Subsequently, the curved display element panel 120 is attached to the protective plate 110 which is curved in advance. As a result, the curved display device 700 is completed.

  Also in the curved display device 700, one main surface 131A of the glass substrate 131 is a concave surface. Therefore, the mounting area 160 on the one main surface 131A is also a concave surface. Therefore, within a certain range of the mounting region 160, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the outer peripheral side main surface of the light guide plate 137. The compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting tensile stress TS increases as it approaches the outer peripheral main surface of the light guide plate 137. Moreover, the acting compressive stress CS becomes larger as it approaches the back surface 134B.

  The light guide plate 137 is on one main surface 131A of the glass substrate 131, and is curved by the external force together with the glass substrate 131. The light guide plate 137 is a member that moves the neutral surface of the bending stress onto the circuit surface 134A of the IC chip 134 or into the glass substrate 131. Therefore, in the curved display device 700, the circuit surface 134A is a neutral surface or the compressive stress CS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller than that when the tensile stress TS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A, and the compression acting on the IC chip 134 is reduced. The stress CS increases.

  In the curved display device 700 as well, similar to the curved display device 100, the tensile stress TS acting on the IC chip 134 which is weak with respect to the tensile stress TS becomes small, so that the IC chip 134 mounted on the glass substrate 131 can be made smaller. Damage is less likely to occur.

  Also in the curved display device 700, similarly to the curved display device 100, the range of the magnitude of the bending stress acting on the circuit surface 134A of the IC chip 134 that allows the IC chip 134 to operate normally is preliminarily set. By conducting the above investigation, the limit of the bending radius of the display element panel 120 can be estimated at the time of designing.

  In the curved display device 700 as well, similar to the curved display device 100, the neutral surface of the bending stress is formed on the circuit surface 134A of the IC chip 134, so that the IC chip 134 and the glass substrate 131 are electrically connected. It is possible to suppress defects in various functions. Further, peeling of the IC chip 134 can be made difficult to occur.

  In addition, in the curved display device 700, since the light guide plate 137 has the same function as that of the reinforcing plate 135 included in the curved display device 200 according to the second embodiment, the curved plate is eliminated without the reinforcing plate 135. The number of parts that configure the display device 700 can be reduced.

Eighth Embodiment
FIG. 11 is a perspective view schematically showing the curved display device of Embodiment 8 and a jig used for manufacturing the curved display device. FIG. 12 is a cross-sectional view schematically showing the curved display device of Embodiment 8 and a jig used for manufacturing the curved display device.

  The curved display device 800 of the eighth embodiment shown in FIGS. 11 and 12 is different from the curved display device 100 of the first embodiment shown in FIGS. 1 and 2 mainly in the following points. .

  In the curved display device 100 shown in FIGS. 1 and 2, the glass substrate 130 is arranged on the front side of the curved display device 100, and the glass substrate 131 is arranged on the rear surface 134B side of the curved display device 100. . A polarizing plate 132 is attached to the other main surface 130B of the glass substrate 130, and a protective plate 110 that protects the glass substrate 130 is attached to the inner main surface 132B of the polarizing plate 132. A polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131.

  On the other hand, in the curved display device 800 illustrated in FIGS. 11 and 12, the glass substrate 130 is arranged on the back side of the curved display device 800, and the glass substrate 131 is on the front side of the curved display device 800. Is located in. A polarizing plate 132 is attached to the other main surface 130B of the glass substrate 130. A polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131, and a protective plate 110 that protects the glass substrate 131 is attached to the other main surface 133B of the polarizing plate 133.

  In the following, the configuration adopted in the curved display device 800 will be described in relation to the above differences. Regarding the configuration that is not described, the configuration adopted in the curved display device 100 is used as it is or after being modified in the curved display device 800.

  One main surface 133A of the polarizing plate 133 is attached to the other main surface 131B of the glass substrate 131. The other main surface 133B of the polarizing plate 133 is on the side opposite to the one main surface 133A of the polarizing plate 133. The protective plate 110 is attached to the other main surface 133B of the polarizing plate 133.

  The protection plate 110 may be a touch panel.

  When the curved display device 800 is manufactured, an intermediate product of the display element panel 120 on which the IC chip 134 is not mounted is assembled.

  Subsequently, the IC chip 134 is mounted on the frame part 141 provided in the intermediate product of the assembled display element panel 120, the FPC 121 is mounted on the frame part 141, and the polarizing plate provided in the intermediate product of the display element panel 120 is installed. The protection plate 110 is attached to the other main surface 133B of the 133. As a result, the display element 111 including the display element panel 120 is assembled.

  Subsequently, the entire display element panel 120 included in the assembled display element 111 is bent along the curved surface 138A of the jig 138. The jig 138 may be used as a light guide component that is made of a transparent material and emits light.

  Also in the curved display device 800, one main surface 131A of the glass substrate 131 is a concave surface. Therefore, the mounting area 160 on the one main surface 131A is also a concave surface. Therefore, within a certain range of the mounting region 160, the tensile stress TS acts on the outer peripheral side between the neutral surface of the bending stress and the main surface 110B on the outer peripheral side of the protective plate 110. The compressive stress CS acts on the inner peripheral side between the neutral surface of the bending stress and the back surface 134B of the IC chip 134. The acting tensile stress TS increases as it approaches the outer peripheral main surface 110B. Moreover, the acting compressive stress CS becomes larger as it approaches the back surface 134B.

  The protection plate 110 is on the other main surface 131B of the glass substrate 131 and is curved together with the glass substrate 131 by an external force. The protection plate 110 is a member that moves the neutral surface of the bending stress onto the circuit surface 134A of the IC chip 134 or into the glass substrate 131. Therefore, in the curved display device 800, the circuit surface 134A is a neutral surface or the compressive stress CS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A. As a result, the tensile stress TS acting on the IC chip 134 becomes smaller than that when the tensile stress TS in the direction parallel to the circuit surface 134A acts on the circuit surface 134A, and the compression acting on the IC chip 134 is reduced. The stress CS increases.

  In the curved display device 800 as well, similarly to the curved display device 100, the tensile stress TS acting on the IC chip 134, which is weak with respect to the tensile stress TS, becomes small, so that the IC chip 134 mounted on the glass substrate 131 has a smaller tensile stress. Damage is less likely to occur.

  Also in the curved display device 800, similarly to the curved display device 100, the range of the magnitude of the bending stress acting on the circuit surface 134A of the IC chip 134 that allows the IC chip 134 to operate normally is preliminarily set. By conducting the above investigation, the limit of the bending radius of the display element panel 120 can be estimated at the time of designing.

  Also in the curved display device 800, similarly to the curved display device 100, by forming the neutral surface of the bending stress on the circuit surface 134A of the IC chip 134, the electrical characteristics of the IC chip 134 and the glass substrate 131 are improved. It is possible to suppress defects in various functions. Further, peeling of the IC chip 134 can be made difficult to occur.

  In the present invention, the embodiments can be appropriately modified or omitted within the scope of the invention.

  Although the present invention has been described in detail, the above description is illustrative in all aspects, and the present invention is not limited thereto. It is understood that innumerable variants not illustrated can be envisaged without departing from the scope of the invention.

  100, 200, 300, 400, 500, 600, 700, 800 Curved display device, 110 protective plate, 111 display element, 120 display element panel, 130, 131 glass substrate, 132, 133 polarizing plate, 134 IC chip, 135 Reinforcement plate, 136 optical film, 137 light guide plate, 150 polarizing plate, 151 stress adjusting layer, TS tensile stress, CS compressive stress.

Claims (12)

A substrate that is curved by an external force,
Mounted on the substrate, having a circuit surface directed toward the substrate, curved along the substrate by an external force, the circuit surface being a neutral plane of bending stress, or An integrated circuit chip in which a compressive stress is applied to the circuit surface,
And a curved display device. The substrate has a mounting area in which the integrated circuit chip is concave and is mounted,
The curved display device according to claim 1, wherein the substrate and the integrated circuit chip have a thickness that forms the neutral surface on the circuit surface or in the substrate. The substrate has a mounting area in which the integrated circuit chip is a convex surface,
The curved display device according to claim 1, wherein the substrate and the integrated circuit chip have a thickness that forms the neutral surface on the circuit surface or in the integrated circuit chip. The substrate has one main surface on which the integrated circuit chip is mounted, and the other main surface on the side opposite to the side having the one main surface,
A member that is on the other main surface, is curved by an external force together with the substrate, and moves the neutral surface onto the circuit surface or into the substrate,
The curved display device according to claim 1, further comprising: The curved display device according to claim 4, wherein the member is a reinforcing plate that reinforces the substrate. The one main surface has a mounting area in which the integrated circuit chip is mounted,
The curved display device according to claim 5, wherein the reinforcing plate overlaps with an image display region for displaying an image and the mounting region when viewed from the thickness direction of the substrate. The one main surface has a mounting area in which the integrated circuit chip is mounted,
The curved display device according to claim 5, wherein the reinforcing plate overlaps with the mounting region when viewed from the thickness direction of the substrate, but does not overlap with an image display region for displaying an image. The one main surface has a mounting area in which the integrated circuit chip is mounted,
The curved display device according to claim 5, wherein the reinforcing plate overlaps with a video display region for displaying a video, but does not overlap with the mounting region when viewed from the thickness direction of the substrate. The member has a first main surface attached to the other main surface and a second main surface on the side opposite to the side on which the first main surface is present, and reinforces the substrate. Is a reinforcing plate that
The curved display device according to claim 4, further comprising a polarizing plate attached to the second main surface. The curved display device according to claim 4, further comprising an optical film that is attached to the other main surface, includes a polarizing plate and the member, and further includes the optical film on which the polarizing plate and the member are laminated. The curved display device according to claim 4, wherein the member is a light guide plate that guides light to the other main surface. The curved display device according to claim 4, wherein the member is a protective plate that protects the substrate.

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