JP2020057852A - Imaging device - Google Patents

Abstract

To provide an imaging device which achieves improvement of cooling efficiency while inhibiting appearing of an image of a housing.SOLUTION: An imaging device includes: a housing having an intake port and an exhaust port; a first imaging element disposed within the housing; a second imaging element disposed within the housing; an image processing part which is disposed between the first imaging element and the second imaging element within the housing, performs image processing based on an electric signal from the first imaging element and the second imaging element, and has heating power larger than the first imaging element and the second imaging element; and a cooling fan which is disposed between one of the first imaging element and the second imaging element and the image processing part, suctions air from the intake port, and exhausts air from the exhaust port.SELECTED DRAWING: Figure 4A

Description

  The present invention relates to an imaging device.

  The omnidirectional imaging device has a plurality of imaging optical systems each including a wide-angle lens and an imaging sensor that captures an image using the wide-angle lens. The omnidirectional imaging device obtains an image within a solid angle of 4π steradian by combining images captured by the imaging optical systems (for example, see Patent Document 1 below).

  However, in the celestial sphere imaging device of Patent Document 1, a configuration for radiating a heat source such as an imaging sensor is not considered.

JP 2013-25255 A

  An imaging device disclosed in the present application includes a housing having an intake port and an exhaust port, a first imaging device disposed in the housing, a second imaging device disposed in the housing, Disposed between the first image sensor and the second image sensor to perform image processing based on electrical signals from the first image sensor and the second image sensor, and the first image sensor and the second image sensor. An image processing unit that generates a larger amount of heat than the second imaging device, and is disposed between one of the first imaging device and the second imaging device and the image processing unit, and inhales from the intake port and exhausts the air. And a cooling fan that exhausts air from the mouth.

  The imaging device disclosed in the present application is an imaging device in which a flow path through which air flows from an intake port to an exhaust port is formed, and includes a first image sensor, a second image sensor, the first image sensor, An image processing unit that performs signal processing on an output signal of the second image sensor, a first heat transfer member that conducts heat generated by the first image sensor, and a second heat transfer member that conducts heat generated by the second image sensor A heat transfer member, and a third heat transfer member that conducts heat generated in the image processing unit, wherein at least a part of the first heat transfer member and the second heat transfer member is connected to the third heat transfer member. The heat member comes into contact with the air in the flow path at a location different from a section from the location in contact with the air in the flow path to the exhaust port.

  The imaging device disclosed in the present application is an imaging device in which a flow path through which air flows from an intake port to an exhaust port is formed, and includes a first image sensor, a second image sensor, the first image sensor, An image processing unit that performs signal processing on an output signal of the second image sensor, a first heat transfer member that conducts heat generated by the first image sensor, and a second heat transfer member that conducts heat generated by the second image sensor A heat transfer member, and a third heat transfer member that conducts heat generated in the image processing unit, wherein the flow path includes at least a first flow path and the first flow path from the intake port to the exhaust port. A second flow path different from the flow path, wherein at least one of the first heat transfer member and the second heat transfer member includes the exhaust port including the first flow path from a point where the flow path branches. The third heat transfer member contacts the air in the flow path up to the second flow path from the point where the flow path branches. Contact with the air flow path to the exhaust port, including the road.

  The imaging device disclosed in the present application is an imaging device in which a flow path through which air flows from an intake port to an exhaust port is formed, and includes a first image sensor, a second image sensor, the first image sensor, An image processing unit that performs signal processing on an output signal of the second image sensor, a first heat transfer member that conducts heat generated by the first image sensor, and a second heat transfer member that conducts heat generated by the second image sensor A heat transfer member, and a third heat transfer member that conducts heat generated in the image processing unit, wherein at least one of the first heat transfer member and the second heat transfer member is a first air inlet. And the third heat transfer member is in contact with air in a flow path from the second intake path to the exhaust port including the first flow path. Contact the air in the flow path.

  An imaging device disclosed in the present application includes a housing having an intake port and an exhaust port, a first imaging device disposed in the housing, a second imaging device disposed in the housing, And an image processing unit that performs signal processing on output signals of the first image sensor and the second image sensor, wherein each of the first image sensor, the second image sensor, and the image processor includes The generated heat is transmitted to the air flowing through the flow path from the intake port to the exhaust port and is dissipated, and the heat generated by the first image sensor and the second image sensor generates the image of the image in the flow channel. The heat generated in the processing unit is transmitted to air in a section different from the section in which the transmitted air flows.

FIG. 1 is a perspective view of the imaging apparatus according to the first embodiment. FIG. 2 is a bottom view of the imaging device according to the first embodiment. FIG. 3 is a side sectional view of the imaging apparatus according to the first embodiment. FIG. 4A is a side cross-sectional view illustrating an example of the flow of air in the imaging device according to the first embodiment. FIG. 4B is a side cross-sectional view illustrating another example of the flow of the air in the imaging device according to the first embodiment. FIG. 5 is a side sectional view of the imaging apparatus according to the second embodiment. FIG. 6 is an explanatory diagram illustrating the flow of air in the imaging device according to the second embodiment.

<Appearance of imaging device>
FIG. 1 is a perspective view of the imaging apparatus according to the first embodiment, and FIG. 2 is a bottom view of the imaging apparatus according to the first embodiment. 1A is a front perspective view, and FIG. 1B is a rear perspective view. The imaging device 100 has a housing 101. A wide-angle lens 102A and an air inlet 103 are provided on a front plate portion 101A of the housing 101.

  A wide-angle lens 102B is provided on a rear plate portion 101B of the housing 101. An exhaust port 200 is provided in the bottom plate portion 101C of the housing 101. A slit is formed in the intake port 103 and the exhaust port 200, and air passes between the slits. Note that reference numeral 101D is an upper surface plate portion.

  The wide-angle lens 102 </ b> A is provided on the housing 101 so as to be exposed from the housing 101. The wide-angle lens 102A receives light from outside the housing 101 and emits the light to the image sensor. The wide-angle lens 102B is provided on the housing 101 so as to be exposed from the housing 101 in a direction opposite to the direction in which the wide-angle lens 102A is exposed. The wide-angle lens 102B receives light from outside the housing 101 and emits the light to the image sensor.

  At least one of the wide-angle lenses 102A and 102B has an angle of view of 180 degrees or more. The imaging apparatus 100 arranges two imaging elements so as to be opposite to each other, and arranges a wide-angle lens 102A and a wide-angle lens 102B in front of each imaging element to image a subject at a solid angle of 4π steradian.

  When the image data obtained by the two image pickup devices is combined, image data of a celestial sphere image (an image within a solid angle of 4π steradians) is generated. Note that if the wide-angle lenses 102A and 102B do not require a solid-state angle of 4π steradians to capture an image of a subject, both of them may have an angle of view of less than 180.

<Side cross section of imaging device 100>
FIG. 3 is a side sectional view of the imaging apparatus 100 according to the first embodiment. The imaging apparatus 100 includes a cooling fan 300, imaging elements 301A and 301B, heat transfer pads 302A and 302B, heat radiation sheets 303A and 303B, heat sinks 304A and 304B, a circuit board 305, The group includes a group 306, a heat transfer pad 307, a heat sink 308, a rechargeable battery 309, and a battery case 310. The imaging elements 301A and 301B and the circuit group 306 are heat sources. X is an optical axis common to the wide-angle lenses 102A and 102B. The direction from the back plate portion 101B to the front plate portion 101A is + X, and the direction from the front plate portion 101A to the back plate portion 101B is -X.

  The cooling fan 300 is, for example, a blower fan and cools the inside of the housing 101. The blower fan has a structure in which air is taken in from both sides perpendicular to the rotation axis 300c and exhausted from one side in the rotation direction. The cooling fan 300 has a fan 300a and a storage case 300b.

  Fan 300a is stored in storage case 300b. The rotation axis 300c of the fan 300a stored in the storage case 300b is parallel to the optical axis X. The storage case 300b stores the fan 300a. The storage case 300b has openings 300cA and 300cB on a plane perpendicular to the optical axis X, and has an opening 300cC on a side surface facing the exhaust port 200.

  The opening 300cC is connected to the exhaust port 200, and allows the air inside the cooling fan 300 to pass through the exhaust port 200. The cooling fan 300 is connected to the circuit group 306 via a circuit board 305 by a flexible wiring board (not shown). The cooling fan 300 rotates the fan 300a by drive control of the circuit group 306, draws air in the housing 101 from the openings 300cA and 300cB, and discharges air from the opening 300cC to the outside of the housing 101 through the exhaust port 200. .

  The image sensor 301A is arranged near the air inlet 103. The image sensor 301A is arranged at a position closer to the air inlet 103 than the image sensor 301B and the circuit group 306. The image sensor 301A is disposed inside the image capturing apparatus 100 more than the wide-angle lens 102A, receives light condensed by the wide-angle lens 102A, and converts the light into an electric signal. The imaging element 301A is connected to a circuit group 306 via a circuit board 305 by a flexible wiring board (not shown).

  The image sensor 301A is fixed to the heat dissipation sheet 303A via the heat transfer pad 302A. A heat sink 304A is provided around the heat radiation sheet 303A. Therefore, the heat generated from the image sensor 301A is transmitted to the air in the internal space of the housing 101 via the heat transfer pad 302A, the heat radiation sheet 303A, and the heat sink 304A. The heat transfer pad 302A, heat dissipation sheet 303A, and heat sink 304A that conduct heat generated from the image sensor 301A are referred to as a first heat transfer member.

  The image sensor 301B is arranged at a position in the housing 101 farther from the air inlet 103 than the image sensor 301A and at a predetermined distance from the image sensor 301A. The image sensor 301B is disposed inside the image capturing apparatus 100 more than the wide-angle lens 102B, receives light condensed by the wide-angle lens 102B, and converts the light into an electric signal. The imaging element 301B is connected to a circuit group 306 via a circuit board 305 by a flexible wiring board (not shown).

  The image sensor 301B is fixed to the heat dissipation sheet 303B via the heat transfer pad 302B. A heat sink 304B is provided around the heat radiation sheet 303B. Therefore, the heat generated from the image sensor 301B is transmitted to the air in the internal space of the housing 101 via the heat transfer pad 302B, the heat radiation sheet 303B, and the heat sink 304B. The heat transfer pad 302B, heat dissipation sheet 303B, and heat sink 304B that conduct heat generated from the image sensor 301B are referred to as a second heat transfer member.

  Note that the image pickup devices 301A and 301B may be, for example, XY address type solid state image pickup devices (for example, CMOS (Complementary Metal-Oxide Semiconductor) sensors), and progressive scan type solid state image pickup devices (for example, CCD (Charge)). Coupled Device)).

  A plurality of light receiving elements (pixels) are arranged in a matrix on the light receiving surfaces of the imaging elements 301A and 301B. A plurality of types of color filters that transmit light of different color components are arranged in the pixels of the imaging elements 301A and 301B according to a predetermined color arrangement (for example, a Bayer arrangement). Therefore, each pixel of the imaging elements 301A and 301B outputs an analog electric signal corresponding to each color component to the circuit group 306 by color separation using a color filter. In the present embodiment, the imaging elements 301A and 301B having a heat value smaller than the heat value of the circuit group 306 are employed. Further, the amounts of heat generated by the imaging elements 301A and 301B may be different.

  Each of the imaging devices 301A and 301B has an AFE (Analog Front End). The AFE is an analog front-end circuit that performs signal processing on analog electric signals from the imaging elements 301A and 301B. The AFE generates RAW image data by sequentially performing gain adjustment of an electric signal, analog signal processing (correlated double sampling, black level correction, etc.), A / D conversion processing, digital signal processing (defective pixel correction, etc.). , To the circuit group 306.

  The circuit board 305 is provided between the rechargeable battery 309 and the cooling fan 300 such that the board surface is orthogonal to the optical axis X. A circuit group 306 is mounted on the circuit board 305. The circuit group 306 includes, for example, a processor, a memory, and an LSI such as an ASIC (Application Specific Integrated Circuit) and an FPGA (Field-Programmable Gate Array).

  The processor integrally controls the imaging device 100. The processor executes the program. The memory stores a program to be executed by the processor, data prepared in advance, and data obtained by execution processing of the processor and the LSI.

  The LSI executes specific processing such as image processing and compression / expansion processing using electric signals from the imaging elements 301A and 301B. This specific processing may be realized by the processor executing a program stored in the memory. An LSI that executes image processing with an LSI or software or a processor that executes an image processing program is referred to as an image processing unit. The image processing unit generates image data of a celestial sphere image (an image within a solid angle of 4π steradian) by combining image data obtained by each of the two imaging elements 301A and 301B. As described above, since the circuit group 306 performs various processes, the heat generation amount of the circuit group 306 is larger than that of the imaging elements 301A and 301B.

  The circuit group 306 is fixed to the heat sink 308 via the heat transfer pad 307. The heat sink 308 has a substantially C shape, one end of which is connected to the heat transfer pad 307, and the other end of which is fixed to the battery case 310. Therefore, heat generated from the circuit group 306 is transmitted to the air in the internal space of the housing 101 via the heat transfer pad 307 and the heat sink 308. The heat transfer pad 307 and the heat radiating plate 308 that conduct heat generated from the circuit group 306 are referred to as a third heat transfer member.

  The rechargeable battery 309 is provided between the image sensor 301A and the circuit group 306. The rechargeable battery 309 supplies power to the imaging elements 301A and 301B, the circuit group 306, and the cooling fan 300 via a circuit board 305 by a flexible wiring board (not shown).

The battery case 310 has a box 310a and a lid 310b. The box 310a houses the rechargeable battery 309. The cover 310b seals the opening of the box 310a in which the rechargeable battery 309 is stored. A wall plate 320 is provided on one edge of the lid 310b. The wall plate 320 extends in the X direction. One end of the wall plate 320 contacts one end of the lid 310b. The other end of the wall plate 320 does not come into contact with the cooling fan 300 and forms a gap with the cooling fan 300. The wall plate 320 may be a substantially L-shaped plate member integrally formed with the lid 310b.

  In the imaging device 100, these are arranged on the X axis in the order of the wide-angle lens 102A, the image sensor 301A, the rechargeable battery 309, the circuit group 306, the cooling fan 300, the image sensor 301B, and the wide-angle lens 102B in the −X direction. ing. The imaging apparatus 100 in which the combination of the wide-angle lens 102A and the imaging element 301A and the combination of the wide-angle lens 102B and the imaging element 301B are arranged back to back in opposite directions captures an image of a subject at a solid angle of 4π steradians.

  Therefore, when a new mechanism such as the cooling fan 300 is added to the inside of the imaging device 100, it is necessary to expand the housing 101 to accommodate the new mechanism. For example, when the housing 101 is elongated in a direction perpendicular to the optical axis X (for example, on the bottom plate portion 101C side) without changing the thickness of the housing 101 in the optical axis X direction, the housing 101 is expanded. Part of the image is reflected.

  Therefore, it is preferable that the cooling fan 300, the circuit group 306, the circuit board 305, and the rechargeable battery 309 be disposed on the optical axis X and between the imaging devices 301A and 301B. With this arrangement, reflection of an image of the housing 101 can be suppressed.

  In order to increase the cooling efficiency, the cooling fan 300 needs to be arranged near the heat source. However, in the housing 101, three heat sources of the image pickup devices 301A and 301B and the circuit group 306 are provided as heat sources to be cooled. There is. Since the cooling fan 300 is of a double-sided suction type that draws air from the openings 300cA and 300cB, where two heat sources are disposed near each of the openings 300cA and 300cB, where should the remaining one heat source be disposed in the housing 101? Is a problem.

  Air flowing through the casing 101 is drawn into the cooling fan 300 from the intake port 103 and is exhausted from the exhaust port 200. Therefore, for example, it is assumed that the imaging elements 301A and 301B are respectively arranged near the openings 300cA and 300cB of the cooling fan 300, and the circuit group 306 having the largest heat generation is arranged on the upstream side near the intake port 103.

  In this case, when the cooling fan 300 draws air, the air heated in the circuit group 306 comes into contact with the image pickup devices 301A and 301B, so that it cannot be cooled. For this reason, it is necessary to arrange the imaging devices 301A and 301B and the circuit group 306 such that air heated with a heat generation amount larger than the heat generation amount does not come into contact with the air.

  For this reason, the image sensor 301A is arranged at a position closer to the intake port 103 than the circuit group 306. Then, the circuit group 306 is arranged at a position closer to the opening 300cA of the cooling fan 300 than at least one of the imaging devices 301A and 301B. Thereby, an array structure in which the imaging element 301B is arranged near the opening 300cB is obtained.

  As described above, the circuit group 306 is arranged at a position closer to the cooling fan 300 than one of the two image sensors 301A and 301B. Thus, the imaging element 301A can be cooled by the air sucked from the air inlet 103, and the cooling efficiency of the imaging element 301A can be improved.

  The air taken in by the cooling fan 300 is heated by the image sensor 301A, and the air heated by the image sensor 301A hits the image sensor 301B and the circuit group 306. However, the image sensor 301B generates the same amount of heat as the image sensor 301A, and the circuit group 306 generates a larger amount of heat than the image sensor 301A.

  Therefore, even if the air heated by the image sensor 301A is applied to the circuit group 306 and the image sensor 301B, the circuit group 306 and the image sensor 301B are not heated and can be sufficiently cooled. By arranging such an arrangement on the X-axis, the thickness of the housing 101 in the Y-axis direction and the Z-axis direction where the wide-angle lenses 102A and 102B are not arranged can be suppressed. Can be suppressed.

  Note that the arrangement of the imaging devices 301A and 301B, the cooling fan 300, and the circuit group 306 is not limited to the above arrangement. The circuit group 306 may be arranged at a position closer to the cooling fan 300 than at least one of the two image sensors 301A and 301B.

  FIG. 4A is a side cross-sectional view illustrating an example of the flow of air in the imaging device 100 according to the first embodiment. In FIG. 4A, thick black arrows indicate the flow of air and the flow path formed in the housing 101. When the cooling fan 300 is driven to rotate the fan 300 a, air outside the housing 101 is drawn into the housing 101 from the air inlet 103.

  The air sucked from the air inlet 103 passes through a gap between the housing 101 and the heat sink 304A and a gap between the heat radiation sheet 303A and the battery case 310. Since heat from the image sensor 301A is transmitted to the heat radiation sheet 303A and the heat sink 304A, the image sensor 301A is thereby cooled.

  The air sucked from the air inlet 103 branches (1) and passes through a gap (flow path) formed by the housing 101 and the heat sink 304A. The air sucked from the air inlet 103 passes through a gap (flow path) formed by the (2) wide-angle lens 102A and the heat sink 304A, and passes through a gap (flow path) between the heat radiation sheet 303A and the battery case 310. pass. Heat from the image sensor 301A is transmitted to the heat radiation sheet 303A and the heat sink 304A. When the air sucked from the air inlet 103 flows through these gaps (flow paths), the imaging element 301A is cooled by contacting the heat radiation sheet 303A and the heat sink 304A.

  The air that has passed through the gap between the housing 101 and the heat sink 304A branches and passes (3) through the gap (flow path) between the circuit board 305 and the heat sink 308. The air that has passed through the gap (flow path) between the circuit board 305 and the heat sink 308 is guided to the cooling fan side 300 by the wall plate 320. (4) The air passing through the gap between the casing 101 and the heat sink 304A passes through the gap formed between the heat sink 308 and the casing 101, and (5) the gap between the heat sink 308 and the cooling fan 300 ( Flow path). Heat from the circuit group 306 is transmitted to the circuit board 305 and the heat sink 308, and the air cools the circuit group 306.

  The air that has passed between the heat dissipation sheet 303A and the battery case 310 flows through the flow path formed by the inner wall surface of the upper surface plate portion 101D and the battery case 310 and the wall plate 320 (6). Then, this air is branched, and one of them passes through the gap between the wall plate 320 and the storage case 300b, and passes through the gap (flow path) between the heat sink 308 and the cooling fan 300.

  The circuit group 306 is also cooled by this air. Further, the other branched air also passes through the gap between the cooling fan 300, the heat sink 304B, and the heat dissipation sheet 303B. Since heat from the image sensor 301B is transmitted to the heat radiation sheet 303B and the heat sink 304B, the image sensor 301B is thereby cooled.

  The air heated near the openings 300aC and 300bC of the cooling fan 300 is sucked into the storage case 300b from the openings 300bC and 300cC, and is exhausted from the opening 300cC to the outside of the housing 101 via the exhaust port 200. Thereby, the cooling efficiency of the circuit group 306 and the image sensor 301B is improved. By improving the cooling efficiency in this way, the influence of noise on image data due to heat generation can be reduced.

  FIG. 4B is a side cross-sectional view illustrating another example of the flow of the air in the imaging device 100 according to the first embodiment. The imaging device 100 in FIG. 4B has a configuration in which a wall plate 330 and an air inlet 340 are added to the imaging device 100 in FIG. 4A. The same components as those in FIG. 4A are denoted by the same reference numerals, and description thereof will be omitted.

  The wall plate 330 is provided so as to seal the space between the inner wall surface of the upper surface plate portion 101D and the storage case 300b of the cooling fan 300. Specifically, for example, the wall plate 330, together with the storage case 300b of the cooling fan 300, divides the internal space of the housing 101 into a space on the + X direction side from the wall plate 330 and a space on the −X direction side from the wall plate 330. And is divided into Thereby, the air from the space on the + X direction side of the wall plate 330 does not flow into the space on the −X direction side of the wall plate 330.

  For example, the air that has passed through the heat radiating sheet 303A and the heat sink 304A and has passed through the space between the inner wall surface of the upper surface plate portion 101D and the battery case 310 and the wall plate 320 is transmitted by the wall plate 330 to the wall plate 320 and the cooling fan 300. From the storage case 300b. The inflowing air is drawn into the cooling fan 300 from the opening 300aC of the cooling fan 300. Thereby, the image sensor 301A can be cooled.

  Further, the intake port 340 is provided on the upper surface plate portion 101 </ b> D of the imaging device 100, and connects the outside of the imaging device 100 and the space on the −X direction side from the wall plate 330 inside the imaging device 100. Air is passed through the imaging device 100. The air that has flowed in from the air inlet 340 passes through the heat radiation sheet 303B and the heat sink 304B. Since heat from the image sensor 301B is transmitted to the heat radiation sheet 303B and the heat sink 304B, the image sensor 301B is thereby cooled.

  As described above, in FIGS. 4A and 4B, at least a part of the first heat transfer member and the second heat transfer member is configured such that the third heat transfer member is connected to the air in the flow path where the air flows from the intake port to the exhaust port. It comes into contact with the air in the flow path at a location different from the section from the contact location to the exhaust port.

  4A and 4B, the air flow path from the intake port 103 to the exhaust port 200 is such that if the air flows to be cooled in the order of the image sensor 301A → the image sensor 301B and the circuit group 306, the air inlet 103 The arrangement and number of the exhaust ports 200 are not limited to FIGS. For example, the circuit group 306 only needs to be closest to the cooling fan 300 when viewed from the flow path through which air flows.

  4A and 4B, the rechargeable battery 309, the circuit board 305 and the circuit group 306, and the cooling fan 300 are arranged between the image sensors 301A and 301B. The battery 309, the circuit board 305, the circuit group 306, and the cooling fan 300 may be arranged so that their longitudinal directions extend along the optical axis X.

  Example 2 will be described. In the first embodiment, the example in which the blower fan is used as the cooling fan has been described. In a second embodiment, an example in which a sirocco fan is used as a cooling fan will be described. In the second embodiment, since the description focuses on the characteristic portions of the second embodiment, the same reference numerals are given to the same contents as in the first embodiment, and the description thereof will be omitted.

<Side cross section of imaging device 100>
FIG. 5 is a side sectional view of the imaging apparatus 100 according to the second embodiment. The imaging device 100 includes a cooling fan 500 and a support member 501 in the housing 101 instead of the cooling fan 300 of the first embodiment. In the housing 101, the image sensor 301A, the cooling fan 300, the circuit group 306, the circuit board 305, the rechargeable battery 309, and the image sensor 301B are arranged in this order in the −X direction.

  The cooling fan 500 is, for example, a sirocco fan and cools the inside of the housing 101. The sirocco fan has a structure in which air is taken in from one surface orthogonal to the rotation axis 500c and exhausted from one side surface in the rotation direction. The cooling fan 500 has a fan 500a and a storage case 500b.

  Fan 500a is stored in storage case 500b. Fan 500a is arranged in storage case 500b such that its rotation axis 500c is parallel to optical axis X. The storage case 500b stores the fan 500a. The storage case 500b has an opening 500cB on one plane substantially orthogonal to the optical axis X, and has an opening 500cC on the side surface on the exhaust port 200 side. The opening 500cB faces the heat sink 308, and the opening 500cC allows the air inside the cooling fan 500 to pass through the exhaust port 200. The other plane substantially orthogonal to the optical axis X faces the support member 501.

  The cooling fan 500 is connected to the circuit group 306 via a circuit board 305 by a flexible wiring board (not shown). The cooling fan 500 rotates the fan 500a by the drive control of the circuit group 306, sucks the air in the housing 101 from the opening 500cB, and discharges the air from the opening 500cC to the outside of the housing 101 through the exhaust port 200.

  The support member 501 is substantially L-shaped and fixedly supports the heat sink 308. The support member 501 is fixed to the bottom plate 101C of the housing 101 in the vicinity of the exhaust port 200 and shields the air from leaking from the intake port 103 to the exhaust port 200. Accordingly, the support member 501 forms a part of the flow path of the air sucked from the air inlet 103 together with the heat radiation sheet 303A and the inner wall surface of the housing 101, and guides the air to the image sensor 301B.

  FIG. 6 is an explanatory diagram illustrating the flow of air in the imaging device 100 according to the second embodiment. 6, thick black arrows indicate the flow of air and the flow path formed in the housing 101. When the cooling fan 500 is driven to rotate the fan 500 a, air outside the housing 101 is drawn into the housing 101 from the air inlet 103.

  The air sucked from the air inlet 103 passes through the gap (flow path) formed by the heat sink 304A and the wide-angle lens 102A, and passes through the gap between the heat radiation sheet 303A and the support member 501. Since heat from the image sensor 301A is transmitted to the heat radiation sheet 303A and the heat sink 304A, the image sensor 301A is thereby cooled.

  The air guided by the support member 501 and the inner wall surface of the upper plate portion 101D is in contact with the heat sink 304B, the gap between the heat radiation sheet 303B and the battery case 310, the gap between the heat sink 304B and the battery case 310, and It passes through the gap with the inner wall surface of the bottom plate portion 101C of the housing 101. Since heat from the image sensor 301B is transmitted to the heat radiation sheet 303B and the heat sink 304B, the image sensor 301B is thereby cooled. Thereafter, the air cools the heat sink 308, the circuit board 305, and the circuit group 306.

  The air that has cooled the circuit board 305 and the circuit group 306 is sucked into the storage case 500b from the opening 500cB, and is discharged out of the housing 101 from the opening 500cC through the exhaust port 200. As described above, while the air that has cooled the radiator plate 308, the circuit board 305, and the circuit group 306 flows to the exhaust port 200, the other imaging elements 301A (radiator sheet 303A) and 301B (radiator sheet 303B) do not exist. . With such a configuration, the cooling efficiency of the circuit group 306 and the image sensor 301B is improved. By improving the cooling efficiency in this way, it is possible to reduce the influence of noise on image data caused by heat generation.

  In addition, regarding the flow path of the air from the intake port 103 to the exhaust port 200, if the air flow to be cooled in the order of the image sensor 301A → the image sensor 301B → the circuit group 306, the arrangement of the intake port 103 and the exhaust port 200 and The number is not limited to FIG. 1 and FIG.

  In addition, the rechargeable battery 309, the circuit board 305, the circuit group 306, and the cooling fan 500 are arranged between the image sensors 301A and 301B. The circuit group 306 and the cooling fan 500 may be arranged so that their longitudinal directions extend along the optical axis X.

  Further, in the above-described embodiment, the configuration in which the cooling fans 300 and 500 are built in the imaging device 100 has been described, but the cooling fans 300 and 500 may not be built in. For example, a configuration may be adopted in which an intake-type external fan as described in the first and second embodiments is mounted near the exhaust port. If you do this, the attached external fan will take in air. Air is taken in from the air inlet, and the heat source can be cooled in the same manner as in the first and second embodiments.

  The present invention is not limited to the above-described contents, and may be arbitrarily combined. Further, other embodiments that can be considered within the scope of the technical idea of the present invention are also included in the scope of the present invention.

REFERENCE SIGNS LIST 100 imaging device, 101 housing, 102A, 102B wide-angle lens, 103 intake port, 200 exhaust port, 300, 500 cooling fan, 301A, 301B image sensor, 306 circuit group

Claims (14)

A housing having an intake port and an exhaust port,
A first image sensor arranged in the housing;
A second image sensor arranged in the housing;
The first imaging device is disposed between the first imaging device and the second imaging device in the housing and performs image processing based on electric signals from the first imaging device and the second imaging device. An image processing unit that generates a larger amount of heat than the element and the second imaging element;
A cooling fan that is disposed between one of the first image sensor and the second image sensor and the image processing unit and that takes in air from the intake port and exhausts air from the exhaust port;
An imaging device having: The imaging device according to claim 1,
The second image sensor is located farther from the intake port than the first image sensor, and is disposed at a position in the housing at a predetermined distance from the first image sensor,
The cooling fan is disposed at a position in the housing closer to the exhaust port than the first image sensor, the second image sensor, and the image processing unit, and takes in air from the air inlet and exhausts air from the air outlet. , Imaging device. The imaging device according to claim 1, wherein:
The imaging device, wherein the cooling fan is disposed between the second imaging element and the image processing unit, and takes in air from each of the second imaging element and the image processing unit and exhausts air from the exhaust port. The imaging device according to claim 3,
The housing has a structure having an air flow path from the intake port to the exhaust port therein,
The imaging device, wherein the cooling fan draws air passing through the first image sensor from the intake port according to the flow path from each of the second image sensor and the image processing unit and exhausts the air from the exhaust port. The imaging device according to claim 1, wherein:
The imaging device, wherein the cooling fan is arranged to face the image processing unit, and takes in air from the image processing unit and exhausts air from the exhaust port. The imaging device according to claim 5, wherein
The housing has a structure having an air flow path from the intake port to the exhaust port therein,
The imaging device, wherein the cooling fan draws air passing through the first imaging device, the second imaging device, and the image processing unit in this order from the intake port according to the flow path, and exhausts the air from the exhaust port. The imaging device according to claim 1, wherein:
A first lens provided on the housing so as to be exposed from the housing, and receiving light from outside the housing and emitting the light to the first imaging element;
A second lens that is provided on the housing so as to be exposed from the housing in a direction opposite to a direction in which the first lens is exposed, and that receives light from outside the housing and emits the light to the second imaging element. And a lens,
The first image sensor converts light from the first lens into an electric signal,
The imaging device, wherein the second imaging element converts light from the second lens into an electric signal. The imaging device according to claim 7,
The imaging device, wherein an angle of view of at least one of the first lens and the second lens is 180 degrees or more. The imaging device according to claim 8,
The imaging device, wherein the image processing unit generates image data of a spherical image by combining images obtained from the first imaging device and the second imaging device. The imaging device according to claim 7, wherein:
The imaging device, wherein the cooling fan is disposed on an optical axis of the first lens and the second lens. An imaging device in which a flow path through which air flows from an intake port to an exhaust port is formed,
A first image sensor;
A second image sensor,
An image processing unit that performs signal processing on output signals of the first image sensor and the second image sensor;
A first heat transfer member that conducts heat generated by the first imaging element;
A second heat transfer member that conducts heat generated by the second imaging element;
A third heat transfer member that conducts heat generated in the image processing unit,
At least a part of the first heat transfer member and the second heat transfer member is different from a section from a point where the third heat transfer member is in contact with the air in the flow path to the exhaust port, and is a part of the flow path. An imaging device in contact with air. An imaging device in which a flow path through which air flows from an intake port to an exhaust port is formed,
A first image sensor;
A second image sensor,
An image processing unit that performs signal processing on output signals of the first image sensor and the second image sensor;
A first heat transfer member that conducts heat generated by the first imaging element;
A second heat transfer member that conducts heat generated by the second imaging element;
A third heat transfer member that conducts heat generated in the image processing unit,
The flow path is branched into at least a first flow path and a second flow path different from the first flow path from the intake port to the exhaust port,
At least one of the first heat transfer member and the second heat transfer member is in contact with air in a flow path from a branch point of the flow path to the exhaust port including the first flow path,
The imaging device, wherein the third heat transfer member is in contact with air in a flow path from a branch point of the flow path to the exhaust port including the second flow path. An imaging device in which a flow path through which air flows from an intake port to an exhaust port is formed,
A first image sensor;
A second image sensor,
An image processing unit that performs signal processing on output signals of the first image sensor and the second image sensor;
A first heat transfer member that conducts heat generated by the first imaging element;
A second heat transfer member that conducts heat generated by the second imaging element;
A third heat transfer member that conducts heat generated in the image processing unit,
At least one of the first heat transfer member and the second heat transfer member contacts air in a flow path from a first intake port to the exhaust port including a first flow path,
The imaging device, wherein the third heat transfer member is in contact with air in a flow path from a second intake port to the exhaust port including a second flow path different from the first flow path. A housing having an intake port and an exhaust port,
A first image sensor arranged in the housing;
A second image sensor arranged in the housing;
An image processing unit disposed in the housing and performing signal processing on output signals of the first image sensor and the second image sensor;
The heat generated in each of the first image sensor, the second image sensor, and the image processing unit is transmitted to the air flowing through the flow path from the intake port to the exhaust port and is radiated,
An imaging apparatus, wherein heat generated by the first imaging element and the second imaging element is transmitted to air in a section of the flow path that is different from a section in which air in which the heat generated in the image processing section flows.

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