JP2023115096A - Imaging apparatus - Google Patents

Abstract

To improve the air-cooling efficiency while suppressing mixing of dust and liquid like water due to air intake.SOLUTION: An imaging apparatus comprises: a first image pick-up device; an image processing chip which performs signal processing on an output signal of the first image pick-up device; a first member which surrounds the first image pick-up device and the image processing chip; a first heat conduction member whose portion is provided on the outside of the first member and which conducts the heat generated in the first image pick-up device to the first direction side where the first image pick-up device is arranged relative to the image processing chip; a second heat conduction member whose portion is provided on the outside of the first member and which conducts the heat generated in the image processing chip to the first direction side; and a second member which covers the first heat conduction member and the second heat conduction member provided on the outside of the first member from the first direction such that the air flows in contact with the first heat conduction member and the second heat conduction member.SELECTED DRAWING: Figure 13

Description

The present invention relates to an imaging device.

A omnidirectional imaging apparatus has a plurality of imaging optical systems each including a wide-angle lens and an imaging sensor that captures an image of the wide-angle lens. The omnidirectional imaging apparatus obtains an image within a solid angle of 4.pi.

However, in the omnidirectional imaging apparatus of Patent Document 1, no consideration is given to a configuration for dissipating heat from a heat source such as an imaging sensor.

JP 2013-25255 A

An imaging device disclosed in the present application includes a first imaging device, an image processing chip that performs signal processing on an output signal of the first imaging device, a first member that surrounds the first imaging device and the image processing chip, and A first heat transfer member, a part of which is provided outside the first member, and which conducts heat generated by the first imaging element to the first direction side in which the first imaging element is arranged with respect to the image processing chip. a second heat transfer member partly provided outside the first member for conducting heat generated in the image processing chip in the first direction; the first heat transfer member and the second heat transfer member; and a second member that covers the first heat transfer member and the second heat transfer member provided outside the first member from the first direction so that air flows in contact with the heat member.

An imaging device disclosed in the present application includes a first imaging element, an image processing chip that processes an output signal of the first imaging element, the first imaging element, the image processing chip, and the first imaging element. a first member surrounding wiring connecting the image processing chip and the image processing chip; a first heat transfer member partially exposed to the outside of the first member and conducting heat generated by the first imaging element; a second heat transfer member partially exposed to the outside of a member and conducting heat generated in the image processing chip; A flow path is formed through which air flows from the intake port to the exhaust port.

An imaging device disclosed in the present application includes a housing having an air intake port and an air exhaust port, a heat dissipation structure having a flow path through which air flows between the air intake port and the air exhaust port, and the flow path being isolated. and a plurality of heat sources provided within the housing.

1 is a perspective view of an imaging device according to a first embodiment; FIG. FIG. 2 is a plan view or a bottom view of the imaging device according to the first embodiment; FIG. 3 is a cross-sectional view of the imaging device according to the first embodiment; FIG. 4 is a perspective view of an arrangement example of cooling fans on the heat sink according to the first embodiment. FIG. 5 is a side cross-sectional view showing another arrangement example of the heat sources according to the first embodiment. FIG. 6 is a cross-sectional plan view of an imaging device showing another configuration example 1 of the heat sink according to the first embodiment. FIG. 7 is a cross-sectional plan view of an imaging device showing another configuration example 2 of the heat sink according to the first embodiment. FIG. 8 is a cross-sectional plan view of an imaging device showing another configuration example 3 of the heat sink according to the first embodiment. FIG. 9 is a cross-sectional plan view of an imaging device showing another configuration example 4 of the heat sink according to the first embodiment. FIG. 10 is a cross-sectional plan view of an imaging device showing another configuration example 5 of the heat sink according to the first embodiment. FIG. 11 is an external view of an imaging device according to a second embodiment; FIG. 12 is an exploded perspective view of an imaging device according to a second embodiment; FIG. 13 is a cross-sectional view of an imaging device according to a second embodiment; FIG. 14 is a perspective view illustrating an example of mounting a cooling device to an imaging apparatus according to the second embodiment;

<Appearance of imaging device>
FIG. 1 is a perspective view of an imaging device according to the first embodiment, and FIG. 2 is a plan view or a bottom view of the imaging device according to the first embodiment. In FIG. 1, (A) is a front perspective view, and (B) is a rear perspective view. The imaging device 100 has a housing 101 . A front plate 101A of the housing 101 is provided with a wide-angle lens 102A.

A wide-angle lens 102B is provided on the rear plate 101B of the housing 101 . The top plate 101C of the housing 101 is provided with a vent 103C. The bottom plate 101D of the housing 101 is provided with a vent 103D. Slits are formed in the vents 103C and 103D, and air passes through the slits.

Wide-angle lens 102A is provided in housing 101 so as to be exposed from housing 101 . The wide-angle lens 102A receives light from the outside of the housing 101 and outputs the light to an imaging element 302A (see FIG. 3) arranged in the rear stage. Wide-angle lens 102B is provided in housing 101 so as to be exposed from housing 101 in a direction opposite to the direction in which wide-angle lens 102A is exposed. The wide-angle lens 102B receives light from the outside of the housing 101 and emits the light to the imaging element 302B (see FIG. 3) arranged in the rear stage.

At least one of wide-angle lenses 102A and 102B has an angle of view of 180 degrees or more. The image pickup apparatus 100 arranges two image pickup elements 302A and 302B so as to face each other in opposite directions, and arranges a wide-angle lens 102A and a wide-angle lens 102B in front of the respective image pickup elements 302A and 302B, thereby obtaining a solid angle of 4π steradian. to capture the subject.

<Internal Structure of Imaging Device 100>
FIG. 3 is a cross-sectional view of the imaging device 100 according to the first embodiment. (A) is a plan cross-sectional view of the imaging device 100, and (B) is a side cross-sectional view of the imaging device 100. FIG. The imaging device 100 has lens barrels 301A and 301B, imaging elements 302A and 302B, a circuit board 303, a circuit 304, a heat transfer sheet 305, and a heat sink 306 which is an example of a heat dissipation structure. The imaging elements 302A and 302B and the circuit 304 are heat sources. X is an optical axis common to wide-angle lenses 102A and 102B. The direction from the rear plate 101B to the front plate 101A is +X, and the direction from the front plate 101A to the rear plate 101B is -X.

The lens barrels 301A and 301B respectively hold wide-angle lenses 102A and 102B at one end exposed to the outside, and image sensors 302A and 302B at the other end inside the housing 101 .

The imaging devices 302A and 302B are arranged behind the wide-angle lenses 102A and 102B, respectively, and receive light condensed by the wide-angle lenses 102A and 102B and convert the light into electrical signals. The imaging element 302A is connected to a heat sink 306 via a heat transfer sheet 305. As shown in FIG. The imaging element 302B is connected to the heat sink 306. FIG.

Also, the imaging elements 302A and 302B are electrically connected to the circuit 304 via the circuit board 303 by a flexible wiring board (not shown) existing in the internal space 300 . Accordingly, the image signals from the imaging elements 302A and 302B can be output to the circuit 304. FIG. The internal space 300 is a closed space inside the imaging device 100 excluding the heat sink 306 and the through hole 306a.

The imaging devices 302A and 302B may be, for example, XY address solid-state imaging devices (for example, CMOS (Complementary Metal-Oxide Semiconductor) sensors) or sequential scanning solid-state imaging devices (for example, CCD (Charge Coupled Devices)). )).

A plurality of light receiving elements (pixels) are arranged in a matrix on the light receiving surfaces of the imaging elements 302A and 302B. In pixels of the imaging elements 302A and 302B, a plurality of types of color filters that transmit light of different color components are arranged according to a predetermined color arrangement (eg, Bayer arrangement). Therefore, each pixel of the imaging elements 302A and 302B outputs to the circuit 304 an analog electric signal corresponding to each color component through color separation by the color filter. Note that the amounts of heat generated by the imaging elements 302A and 302B may be different as long as they are smaller than the amount of heat generated by the circuit 304 .

The imaging devices 302A and 302B each have an AFE (Analog Front End). The AFE is an analog front-end circuit that performs signal processing on analog electric signals from the imaging devices 302A and 302B. The AFE sequentially performs gain adjustment of electrical signals, analog signal processing (correlated double sampling, black level correction, etc.), A/D conversion processing, and digital signal processing (defective pixel correction, etc.) to generate RAW image data. , to circuit 304 .

The circuit board 303 is a board on which the circuit 304 is mounted. The circuit board 303 is arranged along the direction perpendicular to the optical axis X between the image sensor 302A and the heat sink 306 . The circuit board 303 has wiring that electrically connects the circuits 304 to each other. The circuit board 303 electrically connects the imaging elements 302A and 302B and the circuit 304 by a flexible wiring board (not shown). A circuit 304 is a device mounted on a circuit board 303 and connected to a heat sink 306 directly or via a heat transfer pad (not shown). Heat generated in the circuit 304 is thereby transferred to the heat sink 306 .

Specifically, the circuit 304 includes, for example, processors, memories, and LSIs such as ASICs (Application Specific Integrated Circuits) and FPGAs (Field-Programmable Gate Arrays).

The processor centrally controls the imaging device 100 . A processor executes a program. The memory stores programs executed by the processor, data prepared in advance, and data obtained by execution processing of the processor and LSI.

The LSI performs specific signal processing such as image processing and compression/expansion processing using electrical signals from the imaging devices 302A and 302B. This particular signal processing may be implemented by a processor executing a program stored in memory. For example, an LSI that executes image processing and a processor that executes an image processing program stored in a memory are image processing chips. Since the circuit 304 performs various processes in this way, the amount of heat generated by the circuit 304 is greater than that of the imaging elements 302A and 302B. An LSI that executes image processing is called an image processing chip.

The heat transfer sheet 305 is a sheet having thermal conductivity and flexibility. Heat transfer sheet 305 is, for example, a copper foil or a graphite sheet. One end of the heat transfer sheet 305 is connected to the imaging element 302A directly or through a heat transfer pad (not shown). The other end of heat transfer sheet 305 is connected to the outer surface of heat sink 306 . As a result, the heat transfer sheet 305 absorbs heat generated by the imaging device 302A and transfers the heat to the heat sink 306 .

A heat sink 306 is provided between the circuit 304 and the imaging element 302B. The heat sink 306 is a thermally conductive heat dissipating member such as aluminum. The heat sink 306 has a tubular shape, and a through hole 306a thereof extends in a direction perpendicular to the optical axis X. As shown in FIG. Specifically, for example, one end of through-hole 306a communicates with vent 103D of bottom plate 101D, and the other end of through-hole 306a communicates with vent 103C of top plate 101C.

A lower edge 306c of the heat sink 306 contacts the surface of the bottom plate 101D on the housing 101 side and covers the air vent 103D. Similarly, the upper edge 306b of the heat sink 306 contacts the surface of the top plate 101C facing the housing 101 and covers the vent 103C. As a result, the housing 101 is separated into the through hole 306a and the internal space 300 excluding the heat sink 306 and the through hole 306a. That is, the inner space 300 is hermetically sealed by the inner wall surface of the housing 101 and the outer wall surface of the heat sink 306, thereby preventing entry of dust, water, and other liquids through the vents 103C and 103D and the through hole 306a during air cooling. .

The heat sink 306 is fixed to the circuit 304 and the imaging element 302B either directly or via a heat transfer pad (not shown). Therefore, the heat sink 306 can absorb heat generated by the circuit 304 and the imaging element 302B. Also, the heat sink 306 is connected to the heat transfer sheet 305 on the outer surface. Thereby, the heat sink 306 can absorb the heat generated by the imaging element 302A through the heat transfer sheet 305 .

Assume that the air outside the housing 101 flows in from the air vent 103D of the bottom plate 101D due to the direction of the wind or the movement of the imaging device 100, for example. As described above, the heat sink 306 absorbs heat from the circuit 304 and the imaging elements 302A and 302B, so the incoming air is warmed by the heat from the inner wall surface of the heat sink 306 and flows in the direction of the thick arrow (B). and discharged from the air vent 103C.

As a result, the circuit 304 and the imaging elements 302A and 302B within the internal space 300 are cooled by the air flowing outside the internal space 300 (through hole 306a). Therefore, even if liquid such as dust or water flows into the through hole 306 a together with air, it does not enter the internal space 300 . As a result, it is possible to prevent failures and lens contamination due to the intrusion of dust and liquid such as water.

In addition, the air may flow in from the vent 103C and be discharged from the vent 103D. Also, the heat sink 306 may be arranged such that the through holes 306 a face in a direction perpendicular to both side surfaces of the housing 101 .

<Example of arrangement of cooling fans>
FIG. 4 is a perspective view showing an arrangement example of cooling fans on the heat sink 306 according to the first embodiment. In the first embodiment, as shown in FIG. 3, the image pickup apparatus 100 may be provided without a cooling fan, or as shown in FIG. 4, the image pickup apparatus 100 may be provided with a cooling fan 400. FIG. Cooling fan 400 is arranged in through hole 306 a of heat sink 306 . The cooling fan 400 is electrically connected to the circuit 304 through the circuit board 303 by wiring (not shown) routed inside the heat sink 306 from the inner wall surface of the through hole 306a where the cooling fan 400 and the heat sink 306 are in contact, for example. be done. Further, this allows the imaging apparatus 100 to drive and control the cooling fan 400 from the circuit 304 .

Cooling fan 400 is, for example, an axial fan that takes in air from one side and exhausts air from the opposite side. 4A to 4C, the rotation axis of the cooling fan 400 is in the same direction as the through hole 306a, and the cooling fan 400 sucks air from the lower end opening 306e of the heat sink 306, The air is exhausted from the opening 306d.

(A) is a configuration in which the cooling fan 400 is arranged in the upper end opening 306 d of the heat sink 306 . As a result, the cooling fan 400 draws air into the heat sink 306 through the lower end opening 306e. The air absorbs heat from the inner wall surfaces of the through holes 306 a of the heat sink 306 . Cooling fan 400 absorbs heat and discharges warmed air to the outside of housing 101 .

(B) is a configuration in which the cooling fan 400 is arranged in the lower end opening 306 e of the heat sink 306 . As a result, the cooling fan 400 draws air from the outside of the housing 101 through the lower end opening 306 e and causes the air to flow into the heat sink 306 . The inflowing air absorbs the heat of the inner wall surface of the through hole 306a and is discharged to the outside of the housing 101 toward the upper end opening 306d.

(C) is a configuration in which the cooling fan 400 is arranged inside the through hole 306 a of the heat sink 306 . As a result, the cooling fan 400 causes air to flow in from the lower end opening 306e inside the through hole 306a and to discharge the air to the upper end opening 306d. The air absorbs heat from the inner wall surface of the through-hole 306a from the lower end opening 306e to the upper end opening 306d.

By mounting the cooling fan 400 in this manner, the inside of the housing 101 can be forcibly air-cooled. In addition, in the configurations (A) to (C), the cooling fan 400 is arranged in a different position. configuration is adopted.

<Other layout examples of heat sources>
FIG. 5 is a side cross-sectional view showing another arrangement example of the heat sources according to the first embodiment. In FIG. 5, the ventilation port 103D is an intake port, and the ventilation port 103C is an exhaust port. In FIG. 3, the circuit 304 and the imaging element 302B are connected at the same distance from the bottom plate 101D on opposite sides of the heat sink 306. In FIG. In FIG. 5, the circuit 304 and the imaging element 302B are connected at different distances from the bottom plate 101D on opposite sides of the heat sink 306. In FIG.

Specifically, the image pickup device 302B generates less heat than the circuit 304 does. Therefore, the imaging device 302B is connected to the upstream side of the air flow relative to the circuit 304, for example, to the lower end side of the heat sink 306 near the vent 103D. On the other hand, the circuit 304 generates more heat than the imaging element 302B. Therefore, the circuit 304 is connected to the downstream side of the air flow from the imaging device 302B, for example, to the upper end side of the heat sink 306 near the vent 103C.

In this way, the heat sources (imaging elements 302A and 302B) with relatively small heat generation are connected to the outer surface of the heat sink 306 on the upstream side of the air flow, and the heat source (circuit 304) with relatively large heat generation is connected. It is connected to the outer surface of the heat sink 306 on the downstream side of the air flow. As a result, even if the air that has absorbed heat on the upstream side of the through hole 306a flows downstream, the heat radiation from the circuit 304 is sufficiently absorbed, and the temperature of the heat source (circuit 304) on the downstream side due to the heat transfer from the air on the downstream side is reduced. It can suppress the rise. Therefore, efficient air cooling can be achieved. 5, the cooling fan 400 may be mounted as shown in FIGS. 4A to 4C. This enables rapid air cooling.

<Another configuration example of the heat sink 306>
Next, another configuration example of the heat sink 306 will be described.

FIG. 6 is a plan cross-sectional view of the imaging device 100 showing another configuration example 1 of the heat sink 306 according to the first embodiment. The heat sink 306 has shielding members 601-603. The shielding members 601 to 603 extend in the penetrating direction of the through hole 306a from the upper end opening 306d to the lower end opening 306e. The shielding members 601-603 divide the heat sink 306 into compartments 612, 613, 623 for each heat source. The shielding members 601-603 are made of a material having a lower thermal conductivity than the heat sink 306, such as plastic. This suppresses heat transfer between the sections 612, 613, and 623, making it easier to store heat in the sections 612, 613, and 623.

The positions of the shielding members 601 to 603 are determined by each heat source (circuit 304, imaging elements 302A, 302B) connected to the sections 612, 613, 623. FIG. In order to increase the amount of stored heat, it is desirable to increase the area of a section to which a heat source that generates a large amount of heat is connected. Therefore, the positions of the shielding members 601 to 603 are determined so that the distance between the shielding members 601 to 603 increases as the amount of heat generated increases (for example, proportional to the power consumption of the heat source). Here, the distance between the shielding members 601 and 602 along the heat sink 306 is D12, the distance between the shielding members 601 and 603 is D13, and the distance between the shielding members 602 and 603 is D23.

For example, the circuit 304 generates more heat than the imaging elements 302A and 302B. Therefore, the distance D12 of the section 612 to which the circuit 304 is connected is longer than the distances D12 and D23 of the sections 612 and 613 to which the imaging elements 302A and 302B are connected. As a result, the shielding members 601 to 603 are arranged so that the area of the heat sink 306 to which the circuit 304 is connected is larger than the area of the heat sink 306 to which the imaging elements 302A and 302B are connected.

By providing the shielding members 601 to 603 on the heat sink 306 to form the partitions 612, 613, and 623 in this way, it is possible to suppress heat transfer between heat sources via the heat sinks. It is possible to avoid heating a heat source with a small calorific value by the heat of , and to enable efficient air cooling according to the calorific value. 6, the cooling fan 400 may be mounted as shown in FIGS. 4A to 4C. This enables rapid air cooling.

FIG. 7 is a plan cross-sectional view of the imaging device 100 showing another configuration example 2 of the heat sink 306 according to the first embodiment. Another configuration example 2 is a configuration in which a partition plate 700 is further provided in another configuration example 1 of FIG. The partition plate 700 is a plate-like member that connects the shielding members 601 to 603, and extends in the penetrating direction of the through hole 306a from the upper end opening 306d to the lower end opening 306e. The partition plate 700, like the shielding members 601 to 603, is made of a material having a lower thermal conductivity than the heat sink 306, such as plastic. The partition plate 700 divides the through hole 306 a into three through holes 712 , 713 , 723 .

Air flowing through the through holes 712 thereby cools the compartment 612 to which the heat generated from the circuit 304 is conducted. The air flowing through the through-holes 713 cools the section 613 to which the heat generated from the imaging device 302A is conducted via the heat transfer sheet 305 . The air flowing through the through holes 723 cools the section 623 to which the heat generated from the imaging device 302B is conducted.

By providing the partition plate 700 in the heat sink 306 in this way, heat transfer between the through holes 712, 713, and 723 can be suppressed, and each of the sections 612, 613, and 623 can be air-cooled independently. be able to. 6, the cooling fan 400 may be mounted as shown in FIGS. 4A and 4B. This enables rapid air cooling.

FIG. 8 is a plan cross-sectional view of the imaging device 100 showing another configuration example 3 of the heat sink 306 according to the first embodiment. Another configuration example 3 is an example in which the heat sink 306 is recessed in the optical axis X direction. The heat sink 306 has recesses 800A and 800B at the connection points of the circuit 304 and the imaging device 302B. The distance D1 between the recesses 800A and 800B is shorter than the width D2 in the optical axis X direction of the through hole 306a in which the recesses 800A and 800B are not formed. Therefore, when air flows into the through-hole 306a, the air flows faster in the space 801 between the recesses 800A and 800B than in the space 802 of the through-hole 306a where the recesses 800A and 800B are not formed. It becomes easy to absorb heat from the inner wall surface of 800B. Therefore, the air cooling efficiency in the space 801 is improved.

Further, since the circuit 304 and the imaging device 302B are housed in the concave portions 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the optical axis X direction is reduced accordingly. Therefore, it is possible to reduce the size of the imaging device 100 . In addition, in the configuration of FIG. 8, the cooling fan 400 may be mounted as shown in (A) to (C) of FIG. This enables rapid air cooling.

FIG. 9 is a plan cross-sectional view of the imaging device 100 showing another configuration example 4 of the heat sink 306 according to the first embodiment. Another configuration example 4 is an example in which another configuration example 1 (FIG. 6) and another configuration example 3 (FIG. 8) are combined. As in the other configuration example 1 (FIG. 6), the shielding members 601 to 603 are provided on the heat sink 306 to form the partitions 612, 613, and 623, so that heat transfer between the heat sources via the heat sink can be suppressed. For example, it is possible to prevent heat from a heat source having a large calorific value from heating a heat source having a small calorific value, thereby enabling efficient air cooling according to the calorific value.

Further, as in the configuration example 3 (FIG. 8), the airflow in the space 801 is faster than that in the space 802, so the air cooling efficiency in the space 801 is improved. Further, since the circuit 304 and the imaging device 302B are housed in the concave portions 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the optical axis X direction is reduced accordingly. Therefore, it is possible to reduce the size of the imaging device 100 . 9, the cooling fan 400 may be mounted as shown in FIGS. 4A to 4C. This enables rapid air cooling.

FIG. 10 is a cross-sectional plan view of an imaging device 100 showing another configuration example 5 of the heat sink according to the first embodiment. Another configuration example 5 is an example in which another configuration example 2 (FIG. 7) and another configuration example 3 (FIG. 8) are combined. By providing the partition plate 700 in the heat sink 306 as in the other configuration example 2 (FIG. 7), heat transfer between the through holes 712, 713, and 723 can be suppressed. Each 623 can be air cooled independently.

Further, as in the configuration example 3 (FIG. 8), the airflow in the space 801 is faster than that in the space 802, so the air cooling efficiency in the space 801 is improved. Further, since the circuit 304 and the imaging device 302B are housed in the concave portions 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the optical axis X direction is reduced accordingly. Therefore, it is possible to reduce the size of the imaging device 100 . 10, the cooling fan 400 may be mounted as shown in FIGS. 4A and 4B. This enables rapid air cooling.

As described above, according to the first embodiment, the air cooling efficiency in the image pickup apparatus 100 is improved while suppressing the mixing of dust and liquid such as water due to suction into the space where the circuit 304, the image pickup elements 302A and 302B, and the like exist. can be achieved. Further, in the imaging apparatus 100, the wide-angle lens 102A, the imaging element 302A, the circuit 304, the heat sink 306, the imaging element 302B, and the wide-angle lens 102B are arranged in this order on the X-axis in the -X direction. The imaging apparatus 100 in which the combination of the wide-angle lens 102A and the imaging device 302A and the combination of the wide-angle lens 102B and the imaging device 302B are arranged back-to-back in opposite directions captures an object at a solid angle of 4π steradian.

Therefore, when a new mechanism such as the heat sink 306 is added inside the imaging apparatus 100, the housing 101 needs to be expanded to accommodate the new mechanism. For example, if the housing 101 is elongated in a direction orthogonal to the optical axis X (for example, toward the bottom plate 101D) without changing the thickness of the housing 101 in the direction of the optical axis X, the expanded portion of the housing 101 image is reflected.

Therefore, the heat sink 306, circuit 304 and circuit board 303 are preferably arranged on the optical axis X and between the imaging elements 302A and 302B. By arranging in this way, reflection of the image of the housing 101 can be suppressed.

Next, Example 2 will be described. The imaging apparatus 100 according to the first embodiment has a heat sink 306 having a through hole 306a serving as an air flow path as a heat dissipation structure, and an internal space 300 of a housing 101 that accommodates heat sources such as a circuit 304 and imaging elements 302A and 302B. The structure is such that the through hole 306a is isolated from the . On the other hand, in the image pickup apparatus according to the second embodiment, the circuit 304 and the image pickup elements 302A and 302B, which are heat sources, are housed and sealed in the housing case inside the image pickup apparatus, and are housed in the space outside the housing case inside the image pickup apparatus. A heat dissipation structure is provided in which the heat generated by the heat source inside the case is dissipated to the outside of the imaging device. In addition, the same code|symbol is attached|subjected to the same structure as Example 1, and the description is abbreviate|omitted.

<Appearance of imaging device 1100>
FIG. 11 is an external view of an imaging device 1100 according to the second embodiment. (A) is a perspective view of the imaging device 1100, and (B) is a front view of the imaging device 1100. FIG. The imaging device 1100 has a front plate 1101A, a housing case 1101, and a rear plate 1101B, which constitute a housing. A wide-angle lens 102A is inserted and exposed in the center of the front plate 1101A. Further, vent holes 1102 to 1104 are provided on the left, right, and below the wide-angle lens 102A of the front plate 1101A. The front plate 1101A and the rear plate 1101B sandwich the storage case 1101 and form an upper surface 1101C, a bottom surface 1101D, and a side surface 1101E of the imaging device 1100. FIG.

<Internal Structure of Imaging Device 1100>
FIG. 12 is an exploded perspective view of an imaging device 1100 according to the second embodiment. FIG. 13 is a cross-sectional view of an imaging device 1100 according to the second embodiment. 13, (A) is a side cross-sectional view taken along line AA shown in FIG. 11, (B) is a plan view taken along line BB shown in FIG. 11, and (C) is taken along line CC shown in FIG. is a side cross-sectional view of the. The storage case 1101 has a box portion 1200A and a lid portion 1200B. An opening 1200A0 of the box portion 1200A is sealed with a lid portion 1200B.

The box portion 1200A has a holding portion 1200Aa and openings 1200Ab2 to 1200Ab4. The holding portion 1200Aa has a hollow cylindrical shape, for example, and has a through hole 1200Aa1 into which the lens barrel 1201A can be inserted. The holding portion 1200Aa holds the lens barrel 1201A by inserting the lens barrel 1201A into the through hole 1200Aa1.

Through hole 1200Aa1 is thereby sealed. Therefore, it is possible to capture an image of a subject with the imaging device 302A while suppressing entry of liquid such as dust and water into the storage case 1101 through the through hole 1200Aa1. Also, the holding portion 1200Aa is inserted into the opening 1105A of the front plate 1101A.

Openings 1200Ab2-1200Ab4 are provided at positions facing vent holes 1102-1104, respectively. The opening 1200Ab2 is sealed with a first heat transfer plate 1212, which will be described later. Opening 1200Ab3 is sealed with second heat transfer plate 1213 . The opening 1200Ab4 is sealed with a fourth heat transfer plate 1215, which will be described later. Therefore, it is possible to radiate heat from the inside of the storage case 1101 to the outside of the storage case 1101 while suppressing the entry of liquid such as dust and water into the storage case 1101 through the openings 1200Ab2 to 1200Ab4.

Heat sinks 1202 to 1204 are accommodated in the space between the front plate 1101A and the box portion 1200A. A heat sink 1202 is arranged between the vent 1102 of the front plate 1101A and the opening 1200Ab2. A heat sink 1203 is arranged between the vent 1103 of the front plate 1101A and the opening 1200Ab3. A heat sink 1204 is arranged between the vent 1104 of the front plate 1101A and the opening 1200Ab4. The front plate 1101A is fixed to the box portion 1200A. Note that the back plate 1101B is also fixed to the box portion 1200A.

Also, in FIG. 13C, a vent 1302 serving as an exhaust port is provided in the vicinity of the heat sink 1204 . Vent 1302 communicates with the space between front plate 1101A and storage case 1101 . As a result, a flow path F (see FIG. 14) is formed that reaches the vent 1302 from the vents 1102-1104 via the heat sinks 1202-1204. Accordingly, the heat sinks 1202-1204 are cooled by the air admitted through the vents 1102-1104. Then, the air to which the heat is transferred from the heat sinks 1202 to 1204 is exhausted from the air vent 1302 .

The housing case 1101 houses the imaging elements 302A and 302B, the circuit board 303, the circuit 304, the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215. be. The circuit board 303 electrically connects the imaging elements 302A and 302B and the circuit 304 by a flexible wiring board (not shown). This flexible wiring board is also housed in the housing case 1101 . The first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215 are, for example, thermally conductive plates such as copper plates.

A lens barrel 1201A is attached to the imaging element 302A. The lens barrel 1201A is inserted into the through hole 1200Aa1 of the holding portion 1200Aa. As a result, the through hole 1200Aa1 of the lens barrel 1201A is sealed with the imaging device 302A.

The first heat transfer plate 1212 is arranged parallel to the circuit board 303 so as to be orthogonal to the optical axis X. As shown in FIG. The first heat transfer plate 1212 is fixed directly to the imaging element 302A or via a heat transfer pad (not shown). Thereby, the first heat transfer plate 1212 absorbs heat from the imaging element 302A. Further, the first heat transfer plate 1212 is fixed to the back surface of the box portion 1200A and seals the opening 1200Ab2 of the box portion 1200A. This suppresses entry of liquid such as dust and water into the storage case 1101 through the opening 1200Ab2.

By sealing the opening 1200Ab2, a part of the first heat transfer plate 1212 is exposed from the opening 1200Ab2. As a result, the first heat transfer plate 1212 conducts the heat absorbed from the imaging element 302A to the heat sink 1202 through this exposed surface. That is, the first heat transfer plate 1212 and the heat sink 1202 serve as a heat transfer member that conducts heat generated by the imaging element 302A inside the housing case 1101 to the outside of the housing case 1101 . A heat transfer path R2 is formed from the imaging element 302A to the heat sink 1202. FIG. Therefore, heat generated from the imaging element 302A is transferred to the air outside the housing case 1101 through the heat sink 1202, and the air is discharged to the outside of the imaging apparatus 1100 through the air vent 1102. FIG.

The second heat transfer plate 1213 is arranged parallel to the optical axis X so as to be perpendicular to the circuit board 303 . One end 1213 a and the other end 1213 b of the second heat transfer plate 1213 are bent parallel to the circuit board 303 . The second heat transfer plate 1213 is fixed to the imaging device 302B directly or through a heat transfer pad (not shown) at one bent end 1213a. Thereby, the second heat transfer plate 1213 absorbs heat from the imaging device 302B. Further, the second heat transfer plate 1213 is fixed to the rear surface of the box portion 1200A at the bent other end 1213b to seal the opening 1200Ab3 of the box portion 1200A. This suppresses entry of liquid such as dust and water into the storage case 1101 through the opening 1200Ab3.

By sealing the opening 1200Ab3, the other end 1213b of the second heat transfer plate 1213 is exposed from the opening 1200Ab3. As a result, the second heat transfer plate 1213 conducts the heat absorbed from the imaging device 302B to the heat sink 1203 through the exposed other end 1213b. That is, the second heat transfer plate 1213 and the heat sink 1203 serve as heat transfer members that conduct the heat generated by the imaging device 302B inside the housing case 1101 to the outside of the housing case 1101 . A heat transfer path R3 is formed from the imaging device 302B to the heat sink 1203 . Therefore, the heat generated from the imaging device 302B is transferred to the air outside the housing case 1101 through the heat sink 1203, and the air is discharged from the ventilation port 1103 to the outside of the imaging device 1100. FIG.

The third heat transfer plate 1214 is arranged parallel to the circuit board 303 so as to be perpendicular to the optical axis X. A third heat transfer plate 1214 connects the imaging element 302B and the second heat transfer plate 1213 . The third heat transfer plate 1214 conducts heat generated by the imaging device 302B to the second heat transfer plate 1213 .

The fourth heat transfer plate 1215 is arranged parallel to the circuit board 303 so as to be orthogonal to the optical axis X. As shown in FIG. The fourth heat transfer plate 1215 is fixed via the circuit 304 and the heat transfer pad 1303 (see FIG. 13). Thereby, the fourth heat transfer plate 1215 absorbs heat generated from the circuit 304 . The fourth heat transfer plate 1215 is also fixed to the box portion 1200A and seals the opening 1200Ab4. As a result, entry of liquid such as dust and water into the housing case 1101 through the opening 1200Ab4 is suppressed.

By sealing the opening 1200Ab4, the fourth heat transfer plate 1215 is exposed from the opening 1200Ab4. As a result, the fourth heat transfer plate 1215 conducts the heat absorbed from the circuit 304 to the heat sink 1204 through its exposed surface. That is, the fourth heat transfer plate 1215 and the heat sink 1204 serve as heat transfer members that conduct heat generated in the circuit 304 inside the housing case 1101 to the outside of the housing case 1101 . A heat transfer path R4 is formed from the circuit 304 to the heat sink 1204 . Therefore, the heat generated from the circuit 304 is transferred to the air outside the housing case 1101 through the heat sink 1203, and the air is discharged from the air vent 1104 to the outside of the imaging apparatus 1100. FIG.

Also, first heat transfer plate 1212, second heat transfer plate 1213, third heat transfer plate 1214, and fourth heat transfer plate 1215 do not contact each other. As a result, transfer of heat among the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215 is suppressed. In particular, the heat from the circuit 304, which generates a relatively large amount of heat, is suppressed from being transferred to the imaging elements 302A and 302B, which generate a relatively small amount of heat. As a result, reduction in air cooling efficiency can be suppressed.

In (A) and (C) of FIG. 13 , a battery 1300 is housed in a housing case 1101 . The battery 1300 supplies power to the circuit 304 and the imaging elements 302A and 302B via the circuit board 303 by a flexible wiring board (not shown) inside the housing case 1101 . Battery 1300 may be rechargeable. In Example 2, the battery 1300 is arranged at a position not overlapping the heat sinks 1202, 1203, and 1204 in the optical axis X direction. This makes it possible to prevent the imaging device 1100 from increasing in size. Further, in FIG. 13A, a screw groove 1301 is provided near the heat sink 1204 .

<Mounting example of cooling fan 400>
FIG. 14 is a perspective view showing an example of attaching a cooling device to the imaging device 1100 according to the second embodiment. FIG. 14 shows the internal structures of the imaging device 1100 and the cooling device 1400 so that they can be understood. The cooling device 1400 is detachable from the imaging device 1100 .

Cooling device 1400 accommodates cooling fan 400 in housing 1401 . The housing 101 has, for example, a rectangular parallelepiped shape, and has an attachment/detachment mechanism 1403 on one side thereof. The attachment/detachment mechanism 1403 has a structure having a dial 1403a and a screw (not shown) on its rotating shaft. When the dial 1403a is rotated in one direction, the screw enters the thread groove 1301 shown in FIG. Exit from 1301. Note that the attachment/detachment mechanism 1403 is not limited to coupling/disconnection between the screw and the thread groove 1301, such as a latch mechanism, as long as the attachment/detachment mechanism 1403 is detachable from the imaging device 1100. FIG.

In addition, an air intake port 1401a is provided on the side surface of the housing 101 where the attachment/detachment mechanism 1403 is provided. The intake port 1401 a communicates with the vent port 1302 when the cooling device 1400 is attached to the imaging device 1100 . Further, an exhaust port 1401b is provided on a side surface of the housing 101 different from the side surface on which the attachment/detachment mechanism 1403 is provided.

The cooling fan 400 forcibly takes in the air to which heat has been transferred from the imaging apparatus 1100 through the air intake port 1401a by rotation of the fan, and exhausts it from the air outlet 1401b. The cooling fan 400 receives power from a power source (not shown) in the housing 101 or the battery 1300 of the imaging device 1100, and is rotated or stopped by pressing the operation button 1404. FIG.

In this manner, the cooling device 1400 is made detachable from the imaging device 1100 . As a result, when forced air cooling is unnecessary, the weight of the imaging device 1100 can be reduced by removing the cooling device 1400 . That is, when air cooling is required, the cooling device 1400 is attached to the imaging device 1100 and the cooling fan 400 is driven.

As described above, according to the second embodiment, the air cooling efficiency in the image pickup apparatus 1100 is improved while suppressing the mixing of dust and liquid such as water due to suction into the space where the circuit 304, the image pickup elements 302A and 302B, and the like exist. can be achieved.

Also, heat sinks 1202 and 1203 that dissipate heat from heat sources (imaging elements 302A and 302B) that generate relatively small amounts of heat are arranged near the air vents 1102 and 1103 on the upstream side of the flow path F. FIG. A heat sink 1204 that dissipates heat from a heat source (circuit 304) that generates a relatively large amount of heat is arranged near the vent 1302 on the downstream side of the flow path F. As a result, even if the air that has absorbed heat on the upstream side of the flow path F flows downstream, the heat radiation from the circuit 304 is sufficiently absorbed, and the temperature of the heat source (circuit 304) on the downstream side due to the heat transfer from the air on the downstream side It can suppress the rise. Therefore, efficient air cooling can be achieved.

Further, by providing the vent 1104, the heat sink 1204 absorbs heat not only from the air warmed by the heat sinks 1202 and 1203 but also from the outside of the imaging apparatus 1100 that is not warmed by the heat sinks 1202 and 1203. Thereby, the cooling efficiency of the circuit 304 can be improved.

Further, in the imaging device 1100, the wide-angle lens 102A, the imaging element 302A, the heat sinks 1202 to 1204, the circuit 304, the imaging element 302B, and the wide-angle lens 102B are arranged in this order on the X-axis toward the -X direction. . An imaging apparatus 1100 in which the combination of the wide-angle lens 102A and the imaging device 302A and the combination of the wide-angle lens 102B and the imaging device 302B are arranged back-to-back in opposite directions captures an object at a solid angle of 4π steradian.

Therefore, when adding a new mechanism such as the heat sinks 1202 to 1204 inside the imaging device 1100, the imaging device 1100 needs to be expanded to accommodate the new mechanism. For example, if the imaging device 1100 is elongated in a direction orthogonal to the optical axis X (for example, toward the bottom plate 101D) without changing the thickness of the imaging device 1100 in the optical axis X direction, the expanded portion of the imaging device 1100 image is reflected.

Therefore, the heat sinks 1202-1204, the circuit 304 and the circuit board 303 are preferably arranged on the optical axis X and between the imaging elements 302A and 302B. By arranging in this way, reflection of the image of the imaging device 1100 can be suppressed.

Vents 1102 to 1104 for supplying air from the outside of the imaging apparatus 1100 are integrated in the front plate 1101A as air intakes. As a result, the front plate 1101A receives air and sucks air, so that the imaging elements 302A and 302B and the circuit 304 on the front plate 1101A side can be air-cooled collectively.

For example, when the imaging device 1100 mounted on a moving body (a person, a bicycle, or an automobile) moves along with the moving body in the +X direction, air flows from the air vents 1102 to 1104 between the front plate 1101A and the housing case 1101. flow into the space of Then, the inflowing air is exhausted from the vent 1302 without flowing into the storage case 1101 . Therefore, it is possible to improve the air-cooling efficiency in the image pickup apparatus 1100 while suppressing the mixing of dust and liquid such as water due to intake air.

Also, in the second embodiment described with reference to FIGS. 11 to 14, the heat sink 1202 and the heat sink 1203 are arranged with the optical axis X interposed therebetween. Also, a heat sink 1204 is positioned between heat sink 1202 and heat sink 1203 and vent 1302 . With such a configuration, it is possible to suppress an increase in the size of the imaging device 1100 and perform efficient air cooling.

11 to 14, the heat sink 1202, the heat sink 1203, and the heat sink 1204 are all arranged on one lens barrel 1201A side of the imaging device 1100. FIG. However, the configuration is not limited to this, and one or two of the heat sink 1202, the heat sink 1203, and the heat sink 1204 may be arranged on the other lens barrel 1201B side.

For example, when the heat sink 1202 is arranged on the other lens barrel 1201B side, the heat transfer plate 1212 is formed so as to transfer heat to the heat sink 1202 arranged on the other lens barrel 1201B side, and the other mirror is arranged. An intake port is provided in the cylinder 1201B, and heat is radiated by an air flow formed from the intake port toward the exhaust port 1401b. Heat transfer plates 1213 and 1214 and air inlets are also formed in the configuration where heat sinks 1203 and 1204 are arranged on the other lens barrel 1201B side.

11 to 14, the heat sink 1204 is arranged on the opposite side of the battery 1300 across the optical axis X. It may be configured to be arranged on the side. In this case, a vent 1302 is provided on the end face of the storage case 1101 on the side opposite to the example of FIGS. 11 to 14 .

As described above, in the image pickup apparatuses 100 and 1100 according to the first and second embodiments, heat is transferred from the heat source sealed inside the image pickup apparatuses 100 and 1100 to an open portion inside the image pickup apparatuses 100 and 1100. To dissipate heat to the outside of the imaging device. Therefore, the heat source is not directly exposed to the wind, and the dust and water resistance are improved.

In addition, the present invention is not limited to the above contents, and may be arbitrarily combined. Other aspects conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

Reference Signs List 100 imaging device, 101 housing, 103C, 103D vent, 300 internal space, 302A, 302B imaging element, 303 circuit board, 304 circuit, 305 heat transfer sheet, 306 heat sink, 306a through hole, 400 cooling fan, 601 to 603 Shielding member 1100 Imaging device 1101 Storage case 1101A Front plate 1101B Rear plate 1102 to 1104 Air vent 1200A Box part 1200Aa Holding part 1200B Lid part 1202 to 1204 Heat sink 1212 to 1215 Heat transfer plate 1300 battery, 1302 vent, 1400 cooling device

Claims (1)

a first imaging element;
an image processing chip that performs signal processing on the output signal of the first imaging element;
a first member surrounding the first imaging element and the image processing chip;
A first heat transfer part provided outside the first member for conducting heat generated by the first imaging element in a first direction side in which the first imaging element is arranged with respect to the image processing chip a member;
a second heat transfer member partly provided outside the first member and conducting heat generated in the image processing chip in the first direction;
The first heat transfer member and the second heat transfer member provided outside the first member are moved in the first direction so that air flows in contact with the first heat transfer member and the second heat transfer member. a second member covering from
An imaging device comprising:

Images