JP2020052039A - 感知アセンブリ - Google Patents
感知アセンブリ Download PDFInfo
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- JP2020052039A JP2020052039A JP2019165922A JP2019165922A JP2020052039A JP 2020052039 A JP2020052039 A JP 2020052039A JP 2019165922 A JP2019165922 A JP 2019165922A JP 2019165922 A JP2019165922 A JP 2019165922A JP 2020052039 A JP2020052039 A JP 2020052039A
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Medical Informatics (AREA)
- Molecular Biology (AREA)
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- Animal Behavior & Ethology (AREA)
- Pathology (AREA)
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- Veterinary Medicine (AREA)
- Physiology (AREA)
- Cardiology (AREA)
- Computer Networks & Wireless Communication (AREA)
- Pulmonology (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
Abstract
Description
固定されてよい。
12 読み取り装置
14 モニタリング装置
100、100a〜100d、100(0)〜100(3) 感知装置
110 電池モジュール
112 上面
114 底面
116 側面
120、120a〜120d 回路板モジュール
122 第1の外側面
124 第2の外側面
126 フレキシブルプリント回路(FPC)板
127 第1の回路板
127a 第1のピン
128 第2の回路板
128a 第2のピン
129 コネクタ
130 プリントアンテナ
131〜133 通信
140 体調センサ
142 センサ領域
142(0)〜142(3) 感知電極
160 無線通信スイッチ
170 分離層
180 分離コーティング
190 電源スイッチ
192 電源パッド
194 充電パッド
300 内側ポケット
400、400a、400b 結合要素
400a 密着ズボン
410 周辺領域
Claims (18)
- 電池モジュール(110)と、回路板モジュール(120、120a〜120d)と、体調センサ(140)と、を備える感知装置(100、100a〜100d、100(0)〜100(3))であって、前記回路板モジュール(120、120a〜120d)は、前記電池モジュール(100)の上面(112)、前記上面(112)の反対側の底面(114)、及び前記上面(112)と前記底面(114)を接続する側面(116)を覆い、前記体調センサ(140)は、前記回路板モジュール(120、120a〜120d)の外側面に配置され、ユーザの感知領域と接触して、前記感知領域の体調信号を検知するように構成される感知装置(100、100a〜100d、100(0)〜100(3))と、
前記感知装置(100、100a〜100d、100(0)〜100(3))に結合され、前記感知装置(100、100a〜100d、100(0)〜100(3))と前記ユーザの前記感知領域とを固定する、結合要素(400、400a、400b)と、
を備える感知アセンブリ(10、10a〜10c)。 - 前記回路板モジュール(120)は、前記上面(112)、前記底面(114)、及び前記側面(116)を覆うように曲げられているフレキシブル回路(FPC)板(126)である、請求項1の感知アセンブリ(10、10a〜10c)。
- 前記回路板モジュール(120a)は、第1の回路板(127)と、第2の回路板(128)と、コネクタ(129)と、を備え、
前記第1の回路板(127)は、前記上面(112)を覆い、複数の第1のピン(127a)を備え、
前記第2の回路板(128)は、前記底面(114)を覆い、複数の第2のピン(128a)を備え、
前記コネクタ(129)は、前記側面(116)を覆い、その反対同士の端は、それぞれ、前記第1ピン(127a)と第2のピン(128a)とを係合して、前記第1の回路板及び前記第2の回路板を電気的に接続する、
請求項1の感知アセンブリ(10、10a〜10c)。 - 前記回路板モジュール(120b)は、第1の回路板(127)と、第2の回路板(128)と、を備え、
前記第1の回路板(127)は、前記上面(112)を覆い、複数のピン(127a)を備え、
第2の回路板(128)は、前記底面(114)を覆い、前記複数のピン(127a)に対応するコネクタ(129)を備え、
前記コネクタ(129)は、前記側面(116)を覆い、前記複数のピン(127a)と係合して、前記第1の回路板(127)及び前記第2の回路板(128)を電気的に接続する、
請求項1の感知アセンブリ(10、10a〜10c)。 - 前記回路板モジュール(120c)は、第1の回路板(127)と、FPC板(126)と、第2の回路板と、を備え、
前記第1の回路板(127)は、前記上面(112)を覆い、前記FPC板(126)に接続され、
前記第2の回路板(128)は、前記底面(114)を覆い、コネクタ(129)を備え、
前記フレキシブル回路板は、前記側面(116)を覆い、かつ前記コネクタ(129)と係合するように曲げられて、前記第1の回路板(127)及び第2の回路板(128)を電気的に接続する、
請求項1の感知アセンブリ(10、10a〜10c)。 - 前記回路板モジュール(120d)は、FPC板(126)と、プリント回路板(127)と、を備え、
前記FPC板(126)は、前記上面(112)及び前記側面(116)を覆うように曲げられ、
前記プリント回路板(127)は、前記底面(114)を覆い、前記FPC板(126)と係合するコネクタ(129)を備え、前記FPC板(126)及び前記プリント回路板(127)を電気的に接続する、
請求項1の感知アセンブリ(10、10a〜10c)。 - 前記回路板モジュール(120、120a〜120d)にプリントされるプリントアンテナ(130)をさらに備える、請求項1乃至6のいずれかの感知アセンブリ(10、10a〜10c)。
- 前記回路板モジュール(120、120a〜120d)上に配置され、前記プリントアンテナ(130)と電気的に接続される無線通信スイッチ(160)をさらに備える、請求項7の感知アセンブリ(10、10a〜10c)。
- 前記電池モジュール(110)及び前記回路板モジュール(120、120a〜120d)を覆い、前記体調センサ(140)の少なくとも一部を露出させる分離層(170)をさらに備える、請求項1乃至8のいずれかの感知アセンブリ(10、10a〜10c)。
- 前記分離層(170)の材料は、熱可塑性材料を含み、
前記分離層(170)は、射出成形によって形成される、
請求項9の感知アセンブリ(10、10a〜10c)。 - 前記感知領域は、ユーザの股間である、請求項1乃至10のいずれかの感知アセンブリ(10、10a〜10c)。
- 前記結合要素(400、400a、400b)は、密着ズボン(400a)を備え、前記感知装置(100、100a〜100d、100(0)〜100(3))を収容するための内側ポケット(300)を有する、請求項1乃至11のいずれかの感知アセンブリ(10、10a〜10c)。
- 前記結合要素(400、400a、400b)は、前記ユーザの股間に固定されるゴムバンド(400b)を備える、請求項1乃至11のいずれかの感知アセンブリ(10、10a〜10c)。
- 前記結合要素(400、400a、400b)は、前記底面(114)を覆う回路板モジュール(120、120a〜120d)の一部の上に配置される接着層(400)を備える、請求項1乃至11のいずれかの感知アセンブリ(10、10a〜10c)。
- 前記結合要素(400、400a、400b)は、前記上面(112)を覆う前記回路板モジュール(120、120a〜120d)の一部の上に配置される接着層(400)を備え、前記接着層(400)の外周領域は、前記ユーザに接着される、請求項1乃至11のいずれかの感知アセンブリ(10、10a〜10c)。
- 前記感知装置(100)は、複数の感知装置(100(0)〜100(3))を備え、
前記複数の感知装置(100(0)〜100(3))は、読み取り装置(12)を無線通信するように構成される、
請求項1乃至15のいずれかの感知アセンブリ(10、10a〜10c)。 - 前記感知領域は、前記ユーザの脇である、請求項1乃至10のいずれかの感知アセンブリ(10、10a〜10c)。
- 前記結合要素(400、400a、400b)は、前記回路板モジュール(120、120a〜120d)上に配置される1つの面及び前記ユーザに取り付けられる他の面を有する両面テープである、請求項1乃至10又は17のいずれかの感知アセンブリ(10、10a〜10c)。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862736418P | 2018-09-25 | 2018-09-25 | |
US201862736426P | 2018-09-25 | 2018-09-25 | |
US62/736,418 | 2018-09-25 | ||
US62/736,426 | 2018-09-25 |
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JP2020052039A true JP2020052039A (ja) | 2020-04-02 |
JP6896816B2 JP6896816B2 (ja) | 2021-06-30 |
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JP (1) | JP6896816B2 (ja) |
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GB201712326D0 (en) * | 2017-08-01 | 2017-09-13 | Univ Southampton | Wearable antenna and intra-uterine monitoring system |
US10998091B2 (en) * | 2019-02-07 | 2021-05-04 | Sandeep Patil | Systems for monitoring compliance with a patch dosage regimen and methods of using the same |
CN113432757A (zh) * | 2021-06-24 | 2021-09-24 | 深圳市爱保护科技有限公司 | 基于智能手表腕部动态体温监测的设计和实现 |
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JP2007212302A (ja) * | 2006-02-09 | 2007-08-23 | Semiconductor Energy Lab Co Ltd | 温度センサ素子、温度センサ、半導体装置および表示装置 |
JP2013090894A (ja) * | 2011-10-26 | 2013-05-16 | Tetsu Nemoto | 身体装着型熱中症警告装置 |
JP2016214731A (ja) * | 2015-05-25 | 2016-12-22 | ローム株式会社 | バイタルセンサモジュールおよびその動作方法 |
JP2017535332A (ja) * | 2014-11-21 | 2017-11-30 | クアルコム,インコーポレイテッド | アンテナ拡張を有する装着型電子パッチ |
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US5677515A (en) * | 1991-10-18 | 1997-10-14 | Trw Inc. | Shielded multilayer printed wiring board, high frequency, high isolation |
CA2538940A1 (en) * | 2006-03-03 | 2006-06-22 | James W. Haslett | Bandage with sensors |
JP5327798B2 (ja) * | 2009-06-25 | 2013-10-30 | ニスカ株式会社 | 光学読取装置 |
CN102005640B (zh) * | 2009-08-28 | 2015-04-15 | 深圳富泰宏精密工业有限公司 | 无线通信装置 |
KR101048662B1 (ko) * | 2010-05-03 | 2011-07-14 | 한국과학기술원 | 신체 부착형 센서 및 모니터링 장치 |
JP5844199B2 (ja) * | 2012-03-30 | 2016-01-13 | シチズンホールディングス株式会社 | 接触式内部温度計 |
US10542917B2 (en) * | 2014-02-10 | 2020-01-28 | Battelle Memorial Institute | Printed circuit board with embedded sensor |
KR101970084B1 (ko) * | 2014-12-31 | 2019-04-17 | 블루 스파크 테크놀러지스, 인크. | 체온 로깅 패치 |
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- 2019-09-04 CN CN201910832784.7A patent/CN110934570A/zh active Pending
- 2019-09-04 TW TW108131791A patent/TWI755627B/zh active
- 2019-09-10 EP EP19196315.6A patent/EP3628216A1/en not_active Withdrawn
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Patent Citations (4)
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JP2007212302A (ja) * | 2006-02-09 | 2007-08-23 | Semiconductor Energy Lab Co Ltd | 温度センサ素子、温度センサ、半導体装置および表示装置 |
JP2013090894A (ja) * | 2011-10-26 | 2013-05-16 | Tetsu Nemoto | 身体装着型熱中症警告装置 |
JP2017535332A (ja) * | 2014-11-21 | 2017-11-30 | クアルコム,インコーポレイテッド | アンテナ拡張を有する装着型電子パッチ |
JP2016214731A (ja) * | 2015-05-25 | 2016-12-22 | ローム株式会社 | バイタルセンサモジュールおよびその動作方法 |
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US20200093375A1 (en) | 2020-03-26 |
TWI755627B (zh) | 2022-02-21 |
TW202011890A (zh) | 2020-04-01 |
EP3628216A1 (en) | 2020-04-01 |
CN110934570A (zh) | 2020-03-31 |
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