JP2020049646A - Microfabrication device, microfabrication method, transfer mold, and transfer object - Google Patents

Abstract

To provide a novel and improved microfabrication device, microfabrication method, transfer mold and transfer object that can inhibit generation of defects.SOLUTION: A microfabrication device comprises a tool mounting portion, a predetermined cutting tool, an oscillator, and a controller. The controller performs a cutting process to satisfy at least one of: a cutting condition (1) that oscillations at a start point and an end point of each set are in phase with each other; and a cutting condition (2) that oscillations of the sets are in phase with each other.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to a fine processing device, a fine processing method, a transfer mold, and a transferred product.

  As one of the fine processing techniques, an imprint technique is known in which a master having a fine uneven structure formed on a surface thereof is pressed against a resin sheet or the like to transfer the fine uneven structure on the master to a resin sheet or the like.

  As a method of manufacturing a master, there is known a technique of forming a concavo-convex structure on the surface of a base material for a master by lithography using laser light and dry etching. According to this technique, a concavo-convex structure having an average period equal to or shorter than the wavelength of visible light can be formed on the surface of the master substrate. Therefore, according to this technique, an ultra-fine uneven structure can be manufactured. On the other hand, this technique requires a high-precision mask, so that the cost of manufacturing the master is increased. Further, since the manufacturing equipment becomes large, the cost for maintenance is large in addition to the initial cost.

  As a method of manufacturing another master, for example, as disclosed in Patent Documents 1 to 3, there is known a technique of forming a concavo-convex structure on the surface of a base material for a master by cutting using a cutting tool. . In this technique, the base material for a master is cut using a cutting tool having a tip (cutting portion) formed at the tip, so that fine concave portions are formed in a lattice shape on the surface of the base material for the master. The portion surrounded by the fine concave portions becomes the fine convex portions. Thereby, a fine uneven structure is formed on the surface of the master substrate. With this technique, it is difficult to form an ultrafine uneven structure as in the technique described above, but there is an advantage that a master can be manufactured at a relatively low cost. In the technique using a cutting tool, the base material for a master is cut by moving the cutting tool relative to the base material for a master.

  By the way, in a technique using a cutting tool, as disclosed in, for example, Patent Document 1, there is a case where a base material for a master is cut while vibrating the cutting tool. By performing such cutting, a vibration waveform can be formed on the side wall or the bottom of the fine concave portion. Although the purpose of vibrating the cutting tool is various, for example, when the transcript is used for optical use, improvement of the optical characteristics of the transcript can be expected.

JP-A-2005-73030 JP 2008-272925 A JP 2004-344916 A

  However, when the present inventor studied the technique of vibrating the cutting tool in detail, it was found that a defect in which the continuity of the vibration waveform was interrupted sometimes occurred on the surface of the transferred material. Such a defect not only impairs the appearance of the transferred product, but also significantly reduces the optical characteristics of the transferred product when the transferred product is used for optical applications.

  Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a new and improved fine processing device, a fine processing method, capable of suppressing the occurrence of defects, Transfer type and a transcript.

In order to solve the above-described problems, according to an aspect of the present invention, a tool setting unit, a cutting tool provided in the tool setting unit, capable of forming a fine recess in the base material, and a tool setting unit with respect to the base material A driving unit that moves the cutting tool relative to the substrate, a vibrating unit that is provided in the tool setting unit, and can vibrate the cutting tool in at least one of the depth direction and the surface direction of the base material, and the tool setting unit with respect to the base material. And a control unit for performing a plurality of sets of cutting steps of cutting the substrate while causing the cutting tool to vibrate while vibrating the cutting tool, wherein the control unit satisfies at least one of the following cutting conditions (1) and (2). A micromachining device characterized by performing a cutting step so as to perform the cutting process.
Cutting condition (1): Vibration phases are aligned at the start point and end point of each set.
Cutting condition (2): Vibration phases are uniform between each set.

  Here, the cutting step may include a deep digging step of repeatedly cutting the same portion and making the current set cutting depth deeper than the previous set cutting depth.

  Further, the cutting step may include a parallel cutting step of cutting the current set at a position adjacent to the cutting position of the previous set.

  Further, the base material has a cylindrical or cylindrical shape, and the driving unit includes a base material driving unit that rotates the base material around a center axis of the base material and a tool that moves the tool installation unit in a direction parallel to the rotation axis. The controller may include a moving unit, and the control unit may move the tool installation unit relative to the base material by rotating the base material and moving the tool installation unit in a direction parallel to the rotation axis.

According to another aspect of the present invention, there is provided a micro-machining method using the above-described micro-machining apparatus, wherein a step of providing a cutting tool at a tool installation section and a step of installing the tool installation section at a position facing the base material. And a step of performing a plurality of sets of a cutting process of cutting the base material while moving the tool installation portion relative to the base material and vibrating the cutting tool, and includes the following cutting conditions (1) and (2). Wherein the cutting step is performed such that at least one of the above is satisfied.
Cutting condition (1): Vibration phases are aligned at the start point and end point of each set.
Cutting condition (2): Vibration phases are uniform between each set.

According to another aspect of the present invention, there is provided a base material having one or a plurality of fine recesses formed on a surface, and at least one of a side wall and a bottom of the fine recess has the following vibration waveform conditions (1) to (4). The present invention provides a transfer mold having a vibration waveform that satisfies at least one of the above conditions.
Vibration waveform condition (1): The vibration waveform is continuous.
Vibration waveform condition (2): The vibration waveform is a composite waveform of a plurality of vibration waveforms, and the phases of the plurality of vibration waveforms are aligned.
Vibration waveform condition (3): A plurality of rows of fine concave portions are formed on the base material, and the phases of the vibration waveforms are aligned between adjacent fine concave portions.
Vibration waveform condition (4): A plurality of rows of fine recesses are formed on the base material, and the phase of the vibration waveform is uniform between the fine recesses every two pitches.

  Here, the substrate may have a cylindrical or cylindrical shape.

According to another aspect of the present invention, there is provided a base material having one or a plurality of fine recesses formed on a surface, and at least one of a side wall and a bottom of the fine recess has the following vibration waveform conditions (1) to (4). A) a transcript characterized by having a vibration waveform satisfying at least one of the following.
Vibration waveform condition (1): The vibration waveform is continuous.
Vibration waveform condition (2): The vibration waveform is a composite waveform of a plurality of vibration waveforms, and the phases of the plurality of vibration waveforms are aligned.
Vibration waveform condition (3): A plurality of rows of fine concave portions are formed on the base material, and the phases of the vibration waveforms are aligned between adjacent fine concave portions.
Vibration waveform condition (4): A plurality of rows of fine recesses are formed on the base material, and the phase of the vibration waveform is uniform between the fine recesses every two pitches.

  As described above, according to the present invention, since the cutting that satisfies at least one of the cutting conditions (1) and (2) is performed, the occurrence of defects can be suppressed.

FIG. 1 is a block diagram illustrating an overall configuration of a microfabrication device 1 according to an embodiment of the present invention. It is a block diagram showing the whole composition of micromachining device 1 concerning another embodiment of the present invention. It is a sectional view showing the detailed composition of the cutting device concerning one embodiment. It is a side view which shows the spiral cutting pattern which is an example of a cutting pattern. It is a side view which shows the ring-section cutting pattern which is an example of a cutting pattern. It is a side view which shows the thrust cutting pattern which is an example of a cutting pattern. It is a side view which shows the diagonal thrust cutting pattern which is an example of a cutting pattern. 6 is a timing chart showing a rotation angle of a master substrate and a vibration waveform of a cutting tool in comparison. It is a perspective view which shows the specific example of a fine recessed part. It is a top view which shows the specific example of a fine recessed part. It is a top view which shows the specific example of a fine recessed part. It is a perspective view which shows the specific example of a fine recessed part. It is a top view which shows the specific example of a fine recessed part. It is a perspective view which shows the specific example of a fine recessed part. It is a top view which shows the specific example of a fine recessed part. It is a flowchart of an example of a fine processing method. It is a flowchart of an example of a fine processing method. It is a perspective view showing an example of a master (transfer type). It is a perspective view showing an example of a master (transfer type). It is a perspective view showing an example of a master (transfer type). It is a perspective view showing an example of a transcript. It is a top view which shows an example of a transcript. It is a graph which shows an example of the vibration waveform of a cutting tool. 5 is a graph illustrating an example of a vibration waveform of a fine concave portion. It is a graph which shows an example of the vibration waveform of a cutting tool. 5 is a graph illustrating an example of a vibration waveform of a fine concave portion. It is a graph which shows an example of the vibration waveform of a cutting tool. 5 is a graph illustrating an example of a vibration waveform of a fine concave portion. It is a graph which shows an example of the vibration waveform of a cutting tool. It is a graph which shows an example of the vibration waveform of a cutting tool. 5 is an SEM image of a fine concave portion according to an example. 9 is a microscope image of a fine concave portion according to a comparative example. 5 is an SEM image of a fine concave portion according to a comparative example.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

<1. Configuration of micromachining equipment>
First, the configuration of the micromachining device 1 according to the present embodiment will be described with reference to FIGS. 1A and 2. FIG. 1A is a block diagram illustrating an overall configuration of a micromachining apparatus 1 that performs cutting by synchronizing vibration of a cutting tool and rotation of a base material (roll) for a master. The microfabrication apparatus 1 forms the fine concave portions 110 on the surface of the master substrate 100 by cutting the master substrate (roll) 100. Thereby, the master 120 shown in FIG. 10 is manufactured. The master substrate 100 has a columnar or cylindrical shape. The master 120 is, for example, a master for imprinting, and the transcript 200 shown in FIGS. 11A and 11B can be manufactured using the master 120 as a transfer mold. The master 120 and the transcript 200 will be described later. In addition, the configuration of FIG. 1A can be adopted, for example, when processing a round cutting pattern or a spiral cutting pattern described later.

  The micromachining device 1 includes a main rotation device 10 (substrate driving unit), a driven rotation device 12, a cutting device 20, and a control device 70.

The main rotation device 10, the central axis of the master substrate 100, and the driven rotation device 12 are coaxially arranged. 1A has a built-in encoder (not shown), and transmits rotation information (rotation information) relating to the rotation angle of the main rotation device 10 from the encoder to the control device 70. The rotation information is, for example, a pulse signal, and transmits the rotation information to the control device 70 every time the main rotation device 10 rotates a predetermined angle. Here, the predetermined angle is determined by the resolution of the encoder. For example, when the resolution of the encoder is 1440000 pulses, the predetermined angle may be 360/1440000 °. In the present embodiment, the rotation direction of the main rotating device 10 (in other words, the circumferential direction of the master substrate 100) is defined as the y-axis. The positive direction of the y-axis is counterclockwise as viewed from the driven rotation device 12. The rotation speed (number of rotations) of the master substrate 100 by the main rotation device 10 is not particularly limited, but may be, for example, ¹ to 100 min ^-1 .

The cutting device 20 includes a processing stage 30 (tool moving unit), a feed shaft 31, a tool setting unit 40, a vibration unit 50, and a cutting tool 60. A tool setting unit 40 is set on the processing stage 30. The processing stage 30 is movable along a feed axis 31. The feed shaft 31 extends in a direction parallel to the rotation axis of the main rotating device 10 (in other words, the length direction of the master substrate 100) (the surface direction of the base material, that is, the direction parallel to the surface of the base material). In the present embodiment, the extending direction of the feed axis 31 and x ₁ axis, the right direction in FIG. 1 and the positive direction of the x ₁ axis. Further, the processing stage 30 is also movable in the cutting axis direction (the depth direction of the base material). In this embodiment, the infeed axis and z ₁ axis, the Figure 1 upward direction (direction approaching the master base material 100) and the positive direction of the z ₁ axis. Therefore, the processing stage 30 (more specifically, the cutting tool 60 to be installed in the tool installation portion 40) the tool installation portion 40 can be moved to the x ₁ axial or z ₁ axially. Thus, in the present embodiment, the main rotating unit 10 while rotating the master substrate for 100 in the y-axis direction, working stages 30 moves the tool installation portion 40 in x ₁ axis or z ₁ axially. As a result, the tool setting unit 40 relatively moves with respect to the master substrate 100. Therefore, the main rotation device 10 and the processing stage 30 function as a driving unit that relatively moves the tool setting unit 40 with respect to the master substrate 100.

Tool installation portion 40 is located at a processing stage 30, moves together with the working stages 30 in _{x 1} axial or _{z 1} axially. Position of the tool installation portion 40 is measured as a coordinate value on x ₁ z ₁ plane. The measurement is performed by a displacement measuring device (not shown). Displacement measuring device outputs _x 1 _{z 1} coordinate information about the measured _x 1 _{z 1} coordinate values of the tool installation portion 40 to the controller 70. A recess 41 for housing a case is formed in the tool installation section 40, and the vibrating section 50 and the cutting tool 60 are housed in the recess 41 for housing a case.

Vibrating unit 50 vibrates the cutting tool 60 in _{x 2} axial or _{z 2} axially. As described above, in the present embodiment, a processing axis (x ₂ z ₂ axis) different from the processing axis (x ₁ z ₁ axis) by the processing stage 30 is created, and these are independently controlled. Specifically, the vibration unit 50 includes a tool storage case 51, tool vibration elements 52a and 53a, and displacement measuring devices 52b and 53b.

The tool storage case 51 stores the cutting tool 60. The tool storage case 51 is installed in the case storage recess 41 formed in the tool installation section 40. The tool vibration element 52 a connects the base end (bottom surface) of the cutting tool 60 and the bottom surface of the tool storage case 51. Then, the tool vibrating element 52a vibrates the cutting tool 60 to the _{z 2} axis. z ₂ axis is the axis parallel to the z ₁ axis, the positive direction of the z ₂ axis is a positive direction in the same direction of z ₁ axis. Types of tools vibrating element 52a is not particularly limited, the cutting tool 60 may be any as long a device that can be moved to the z ₂ axis direction, but with high accuracy and high rigidity linear stage Preferably, there is. Preferable examples of the tool vibration element 52a include a piezo element, a linear motor, and an ultrasonic element. A particularly preferred example of the tool vibration element 52a is a piezo element. The vibration of the tool vibration element 52a is controlled by the control device 70.

Displacement measuring device 52b measures the displacement of the vibration of the _{z 2} axis direction of the cutting tool 60 as _{z 2} coordinates. Displacement measuring device 52b is a displacement of the vibration of the z ₂ axis direction of the cutting tool 60 may be any as long a device that can measure, but it is highly accurate and small, that hysteresis is small Is preferred. Preferred examples of the displacement measuring device 52b include measuring devices of a capacitance type, a laser interference type, a pressure-sensitive pick tester type and the like. Displacement measuring device 52b outputs _{z 2} coordinate information about the measured _{z 2} coordinate value to the control unit 70.

Tool vibrating element 53a is extended in the x ₂ axial direction, connecting the outer wall surface and the outer wall surface of the case accommodating recess 41 of the tool storage case 51. Then, the tool vibrating element 53a moves the cutting tool 60 in _{x 2} axially. x ₂ axis is the axis parallel to the x ₁ axis, the positive direction of the x ₂ axis is positive in the same direction as that of the x ₁ axis. Preferred examples of the tool vibration element 53a include a piezo element, a linear motor, and an ultrasonic element. A particularly preferred example of the tool vibration element 53a is a piezo element. The vibration of the tool vibration element 53a is controlled by the control device 70.

Displacement measuring device 53b measures the displacement of the vibration of the _{x 2} axial cutting tool 60 as _{x 2} coordinate values. Displacement measuring device 53b is What is may be but if a device capable of measuring the displacement of the x ₂ axial cutting tool 60, a high precision and small size, as the hysteresis is small is preferred . Preferable examples of the displacement measuring device 53b include measuring devices of a capacitance type, a laser interference type, a pressure-sensitive pick tester type and the like. Displacement measuring device 53b outputs _{x 2} coordinate information on the measured _{x 2} coordinate values to the controller 70. In the present embodiment, _x 2 _{z 2} coordinates of the cutting tool 60, and _x 2 _{z 2} coordinates of the tool tip 63 to be described later.

The cutting tool 60 is provided movably in the tool installation section 40. The cutting tool 60 includes a tool main body 61 and a tool cutting part (tip) 62. The tool body 61 is a rod-like member extending in the z ₂ axis. The bottom surface of the cutting tool 60 is preferably smooth. This is because the above-described tool vibration element 52a and the like are installed on the bottom surface. The tool cutting part 62 is attached to the tip of the tool main body 61. The tool cutting portion 62 has a tapered shape. The tool tip portion 63 (action point) at the tip of the tool cutting section 62 is pressed against the master substrate 100 to cut the master substrate 100. The shape of the tool tip 63 is not particularly limited, but may be, for example, rectangular or curved. Thereby, the fine concave portions 110 are formed on the surface of the master substrate 100. The shape of the bottom 110a of the fine recess 110 reflects the shape of the tool tip 63. The material of the tool cutting portion 62 may be, for example, diamond, cemented carbide, high-speed tool steel, CBN (cubic boron nitride), or the like. The tool cutting section 62 is manufactured by polishing these materials. It can also be manufactured by laser irradiation, ion milling, or the like.

  2 and the like schematically show the cutting tool 60. Therefore, the shape of the cutting tool 60 is not necessarily limited to that shown in FIG. For example, the tool main body 61 and the tool cutting portion 62 may be integrally formed. In the example shown in FIG. 2, one set of the tool setting unit 40, the vibration unit 50, and the cutting tool 60 is formed on the processing stage 30, but a plurality of sets are formed on the processing stage 30. You may.

The control device 70 in FIG. 1A is connected to the main rotating device 10 and the cutting device 20 by a communication cable or the like, and information (for example, rotation information of the main rotating device 10, x of the tool setting unit 40) is provided between these devices. ₁ z ₁ coordinate information, exchange of _x 2 _{z 2} coordinate information) of the cutting tool 60 is possible.

Specifically, the control device 70 includes a control operation unit 71, a control unit 72, and an amplification unit 73. The control device 70 includes, as a hardware configuration, a CPU (Central Processing Unit, that is, a processor), a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk, various input operation devices (a keyboard, a mouse, etc.), a display, an arbitrary It includes a waveform generator, a communication device, and the like. Information necessary for processing by the control device 70, for example, a processing program and the like is recorded in the ROM. The CPU reads out and executes the machining program stored in the ROM. Arbitrary waveform generator is a device for generating an arbitrary waveform at an arbitrary frequency and voltage, it is used to output the x ₂ z ₂ coordinates of the cutting tool 60 to be described later.

1A based on the information given from the main rotating device 10, the x ₁ z ₁ coordinate value of the tool setting unit 40 and the x ₂ z ₂ coordinate value of the cutting tool 60 (generally x ₂ axis direction or z ₂ axis direction). The control calculation unit 71 outputs coordinate information on the calculated coordinate values to the control unit 72.

The control unit 72 controls the operation of the cutting device 20 based on the coordinate information given from the control calculation unit 71. Specifically, the control unit 72 generates the vibration control information to the effect of moving the cutting tool 60 in x ₂ z ₂ coordinates the control calculation unit 71 calculates and outputs to the amplifier 73. The amplification unit 73 amplifies the vibration control information and outputs the information to the vibration unit 50. The tool vibration elements 52a and 53a of the vibration unit 50 are driven based on vibration control information. Thereby, the cutting tool 60 vibrates. Further, the control unit 72, by controlling the processing stage 30 based on the coordinate information and moves the tool installation portion 40 in x ₁ axial or z ₁ axially. As a result, the fine concave portions 110 are formed on the master substrate 100 in a desired cutting pattern. The details of the control performed by the control unit 72 will be described later.

  FIG. 1B is a block diagram showing the entire configuration of the micromachining apparatus 1 that performs cutting by synchronizing the vibration of the cutting tool with the coordinates of the feed axis of the cutting tool. 1B is substantially the same as FIG. 1A except that the method of synchronizing the vibration of the cutting tool is different. In addition, the configuration of FIG. 1B can be employed, for example, when processing a thrust cutting pattern or an oblique thrust cutting pattern described below. Hereinafter, only different points from FIG. 1A will be described.

  The feed shaft 31 in FIG. 1B has a built-in scale (not shown), and transmits position information relating to the coordinates of the feed shaft 31 from the scale to the control device 70. The position information is, for example, a pulse signal, and the position information can be transmitted to the control device 70 every time the feed shaft 31 moves by a predetermined distance. The feed speed (moving speed) of the feed shaft 31 is not particularly limited, but may be 1,000 to 20,000 mm / min, and is preferably 10,000 mm / min.

The control device 70 in FIG. 1B is connected to the feed shaft 31 and the cutting device 20 by a communication cable or the like, and information (for example, position information of the feed shaft 31 and x ₁ z of the tool setting unit 40) is provided between these devices. _It is possible to exchange ₁ coordinate information and x ₂ z ₂ coordinate information of the cutting tool 60.

Control calculation unit 71 in FIG. 1B, on the basis of the information provided by the feed shaft 31, _{z 1} coordinates and _x 2 _{z 2} coordinates of the cutting tool 60 of the tool installation portion 40 (the schematically _{x 2} axial or to calculate the z vibration waveform of _two axial directions). The control calculation unit 71 outputs coordinate information on the calculated coordinate values to the control unit 72.

The control unit 72 controls the operation of the cutting device 20 based on the coordinate information given from the control calculation unit 71. Specifically, the control unit 72 generates the vibration control information to the effect of moving the cutting tool 60 in x ₂ z ₂ coordinates the control calculation unit 71 calculates and outputs to the amplifier 73. The amplification unit 73 amplifies the vibration control information and outputs the information to the vibration unit 50. The tool vibration elements 52a and 53a of the vibration unit 50 are driven based on vibration control information. Thereby, the cutting tool 60 vibrates. Further, the control unit 72, by controlling the processing stage 30 based on the coordinate information and moves the tool installation portion 40 z ₁ axially. As a result, the fine concave portions 110 are formed on the master substrate 100 in a desired cutting pattern. The details of the control performed by the control unit 72 will be described later.

<2. Overview of processing by control unit>
Next, an outline of processing by the control unit 72 will be described based on FIGS. 3, 4A, 4B, and 4C. The control unit 72 controls the operation of the cutting device 20 as described above. More specifically, the control unit 72 performs a plurality of sets of the cutting process. Here, the cutting step is a step of cutting the base material 100 for the master while moving the tool setting unit 40 relative to the base material 100 for the master and vibrating the cutting tool 60. By relatively moving the tool setting unit 40 with respect to the master substrate 100, a fine concave portion 110 is formed on the master substrate 100, and the spiral cutting pattern shown in FIG. 3 and the ring cutting pattern shown in FIG. The thrust cutting pattern shown in FIG. 4B or the oblique thrust cutting pattern shown in FIG. 4C is realized. The spiral cutting pattern, the ring cutting pattern, the thrust cutting pattern, and the oblique thrust cutting pattern are examples of the parallel cutting process of cutting the current set at a position adjacent to the cutting position of the previous set. The fine recess 110 has a bottom 110a and a side wall 110b. The boundary between the adjacent minute concave portions 110 becomes the minute convex portion 111.

The spiral cutting pattern is a pattern in which the fine concave portion 110 is spirally formed on the master substrate 100. This spiral cutting pattern is roughly produced by the following steps. That is, while rotating the master substrate for 100, is relatively slowly moving the tool installation portion 40 in x ₁ axial direction. Thereby, a spiral cutting pattern is formed on the master substrate 100. When a spiral cutting pattern is formed on the master substrate 100, one or a plurality of rounds of the master substrate 100 are cut as one set of cutting steps. The control unit 72 forms the spiral fine concave portion 110 from one end to the other end of the master substrate 100 by performing a plurality of sets of cutting processes. After the spiral cutting pattern is formed on the base material for a master 100, the spiral cutting pattern may be formed again by reversing the inclination direction of the spiral. This embodiment is also called a cross spiral cutting pattern.

In the ring cutting pattern, the fine concave portions 110 are formed along the circumferential direction of the master substrate 100. The extending direction of the fine concave portions 110 is a direction perpendicular to the axial direction of the master substrate 100. This round section cutting pattern is roughly produced by the following steps. That is, in terms of fixing the x ₁ coordinates of the tool installation portion 40, rotates the master base material 100. As a result, the fine concave portions 110 are formed on the master substrate 100. After the fine recesses 110 are formed one turn on the master base material 100, the tool installation portion 40 is moved by one pitch in the x ₁ direction and the same process is repeated. Here, the pitch means a distance between adjacent fine concave portions 110, more specifically, a distance between center lines in the width direction of the fine concave portions 110. As a result, a ring-shaped cutting pattern is formed on the master substrate 100. When forming a ring-cutting pattern on the base material for master 100, the cutting for one or more circumferences of the base material for master 100 is a set of cutting steps. The control unit 72 forms a plurality of sets of cutting processes to form the ring-shaped fine concave portions 110 from one end of the master substrate 100 to the other end.

In the thrust cutting pattern, the fine concave portions 110 are formed along the axial direction of the master substrate 100. The extending direction of the fine concave portion 110 is a direction parallel to the axial direction of the master substrate 100. This thrust cutting pattern is roughly produced by the following steps. That is, without rotating the master base material 100, to move the tool installation portion 40 in x ₁ axial direction. As a result, the fine concave portions 110 are formed on the master substrate 100. After the fine concave portions 110 are formed in one row from one end to the other end of the master substrate 100, the tool setting unit 40 is moved to the start position, and the master substrate 100 is moved in the y-axis direction. The rotation is stopped by one pitch in the direction or the negative direction, and the same processing is repeated. Here, the pitch means a distance between adjacent fine concave portions 110, more specifically, a distance between center lines in the width direction of the fine concave portions 110. Thus, a thrust cutting pattern is formed on the master substrate 100. When a thrust cutting pattern is formed on the master substrate 100, one or a plurality of rows of the master substrate 100 are cut as one set of cutting steps. The control unit 72 forms a plurality of rows of fine concave portions 110 parallel to the axial direction of the master substrate 100 by performing a plurality of sets of cutting processes on the peripheral surface of the master substrate 100.

In the oblique thrust cutting pattern, the fine concave portions 110 are formed so as to be inclined with respect to the axial direction of the master substrate 100. This oblique thrust cutting pattern is roughly produced by the following steps. That is, while for relatively slowly rotating the master base material 100, to move the tool installation portion 40 in x ₁ axial direction. As a result, the fine concave portions 110 are formed on the master substrate 100. After the fine recesses 110 are formed in one row from one end to the other end of the master substrate 100 (or after the fine recesses 110 are formed on the master substrate 100 for one or a plurality of rounds) ), The tool setting unit 40 is moved to the start position, and the start rotation angle (y coordinate) of the master substrate 100 is rotated by one pitch in the positive or negative y-axis direction and stopped, and the same processing is performed. repeat. Thus, an oblique thrust cutting pattern is formed on the master substrate 100. When forming the oblique thrust cutting pattern on the master substrate 100, one or more rows of cutting of the master substrate 100 (or cutting of one or more circumferences of the master substrate 100) are performed in one set. The cutting process. The control unit 72 forms a plurality of rows of fine concave portions 110 inclined with respect to the axial direction of the master substrate 100 by performing a plurality of sets of cutting processes on the peripheral surface of the master substrate 100.

  The inclination angle of the fine concave portion 110 of the spiral cutting pattern with respect to a direction perpendicular to the axial direction of the master substrate 100 is typically more than 0 ° and less than 1 °. On the other hand, the fine concave portion 110 of the oblique thrust cutting pattern has an inclination angle of typically 1 ° or more and less than 180 ° with respect to a direction perpendicular to the axial direction of the master substrate 100 (axial direction of the master substrate 100). Is typically greater than 0 ° and less than or equal to 179 °). However, since the selection of the spiral cutting pattern or the oblique thrust cutting pattern is determined in consideration of the load of the cutting tool, the cutting time, and the like, the above-described range of the inclination angle is not limited. For example, in the present embodiment, a helical cutting pattern having an inclination angle of more than 1 ° with respect to a direction perpendicular to the axial direction of the master substrate 100 can be selected.

  In any of the cutting patterns, the control unit 72 may perform a deep digging step of repeatedly cutting the same portion. When performing the deep digging step, any one of the above-described cutting patterns is repeatedly performed while changing the cutting depth. Therefore, the cutting at each cutting depth may be one set of the deep digging cutting process. Therefore, the control unit 72 makes the cutting depth of the current set deeper than the cutting depth of the previous set.

  Further, the control unit 72 performs cutting while vibrating the cutting tool 60 in any cutting pattern. As a result, at least one of the bottom 110a and the side wall 110b of the fine recess 110 has a vibration waveform.

Further, the control unit 72 performs a cutting process so that at least one of the following cutting conditions (1) and (2) is satisfied. Preferably, cutting is performed such that both cutting conditions (1) and (2) are satisfied. In addition, “the phases are uniform among the sets” in the cutting condition (2) means that the phases for the same rotation angle (y coordinate) of the master substrate 100 are uniform between the sets.
Cutting condition (1): Vibration phases are aligned at the start point and end point of each set.
Cutting condition (2): Vibration phases are uniform between each set.

Here, as an example, cutting conditions (1) and (2) in the case of using the configuration of FIG. 1A will be described based on FIG. The horizontal axis in FIG. 5 indicates time. The upper graph L1 shows the output timing of the rotation information of the master substrate 100. At times t ₀ , t ₁ , t ₂ , t ₃ , and t ₄ , the rotation angles of the master substrate 100 are 0 °, 90 °, 180 °, 270 °, 360 ° (= 0 °). Here, in order to facilitate understanding, the output timing of the rotation information indicating that the rotation angle of the master substrate 100 is 0 ° (= 360 °) is shown. Graph L2, L3 of the lower shows the vibration waveform of the cutting tool 60 (i.e., _{z 2} coordinates of the cutting tool 60 at each time). In the example of FIG. 5, the cutting for one rotation of the master substrate 100 is one set. That is, the graph L2 shows the vibration waveform of the current set, and the graph L3 shows the vibration waveform of the next set.

  As shown in FIG. 5, the phases of the vibrations are the same at the start point and end point of each set (both are 0 °). Therefore, the cutting condition (1) is satisfied. Further, the phases are aligned between sets. For example, the phase at the start point of each set is 0 ° in each set, and the phases at the same rotation angle (y coordinate value) are the same. Therefore, the cutting condition (2) is satisfied.

As described above, the control unit 72 performs the cutting in which the vibration of the cutting tool 60 and the rotation of the master substrate 100 are synchronized. As a result, the continuity of vibration between sets is maintained, and the occurrence of defects is suppressed. For example, in any of the above-described cutting patterns, the phases of the vibration waveforms can be aligned for one or a plurality of sets. That is, the phases of the vibration waveforms can be aligned between the adjacent minute concave portions 110. In the spiral cutting pattern (and the oblique thrust cutting pattern), in addition to the above, the phases of the vibration waveforms of the minute concave portions 110 are aligned at the connection portion between the sets. In the round cutting pattern, in addition to the above, the phases of the vibration waveforms of the fine concave portion 110 are aligned at the connection between the start point and the end point of the set. In addition, in the thrust cutting pattern (and the oblique thrust cutting pattern), in addition to the above, the phases of the vibration waveforms of the fine concave portion 110 are uniform at the start point and the end point of the set. Furthermore, when the deep digging process is performed, the vibration waveforms of the fine concave portions 110 have a shape that accurately reflects the vibration waveform of the cutting tool 60 in each set because the phases of the vibrations are aligned between the deep digging sets. ing. Note that the control calculation unit 71 calculates the x ₁ z ₁ coordinate value of the tool setting unit 40, the x ₂ z ₂ coordinate value of the cutting tool 60, and the like so that the control unit 72 can perform the above-described processing. Becomes The waveform of the vibration is not particularly limited. For example, the vibration waveform is a Sin waveform, but is not limited to this, and may be an arbitrary vibration waveform. For example, the waveform of the vibration may be a trapezoidal wave or the like. In the present embodiment, a “defect” is a point where the continuity of the vibration waveform is interrupted (a point where the shape of a step or the like is disturbed) and is visually observed or by any microscope (for example, a scanning electron microscope or a microscope). Means what is observable.

Furthermore, in the present embodiment, a processing axis (x ₂ z ₂ axis) different from the processing axis (x ₁ z ₁ axis) by the processing stage 30 is created, and these are independently controlled to control the position of the cutting tool 60. I do. Therefore, so-called point cloud data becomes unnecessary. The point cloud data is three-dimensional position data of the cutting tool 60. For example, it is possible to move the cutting tool 60 by attaching the cutting tool 60 to an NC device and controlling the NC device with point cloud data. However, fine processing becomes difficult. For example, the pitch of the spiral cutting pattern is 0.01 mm, and the point group data is 10,000 points per pitch. In this case, it becomes necessary instruct every 0.01 / 10000 mm in _{x 1} axial cutting tool 60 (feed direction) (movement instruction of the cutting tool 60). However, conventional NC devices cannot be driven at such a resolution. Therefore, the number of point group data per pitch is reduced, but in this case, processing accuracy is reduced. In the present embodiment, the point cloud data becomes unnecessary, and fine processing becomes possible.

<3. Specific Example of Processing by Control Unit>
Next, a specific example of the process will be described with reference to FIGS. 6A to 8B. FIG. 6A and FIG. 6B are an example of a ring cutting pattern. In this example, the control unit 72 performs cutting along the above-described ring-section cutting pattern. Further, the control unit 72, the above-mentioned cutting conditions (1) to vibrate the cutting tool 60 so as to satisfy (2) to the z ₂ axis. Here, the cutting for one round of the master substrate 100 is a set of cutting steps. Further, the control unit 72 causes the cutting area by the cutting tool 60 to overlap between the pitches of the fine concave portions 110. As a result, the fine recess 110 shown in FIGS. 6A and 6B is formed. The bottom 110a, the side wall 110b, and the fine convex portion 111 of the fine concave portion 110 are linear in plan view. On the other hand, the height of the upper end portion of the fine protrusion 111 is vibrated in the z ₂ axis. Further, the vibration waveforms of the fine convex portions 111 are uniform between the adjacent fine convex portions 111. When the cutting area by the cutting tool 60 is separated at the pitch of the fine concave portions 110, the fine concave portions 110 shown in FIG. 6C are formed. In this example, the bottom 110a of the fine recess 110 is a straight line in a plan view. On the other hand, the shape of the side wall 110b of the fine recess 110 has a vibration waveform in plan view. The phase of the vibration waveform of the side wall 110b is uniform between the adjacent minute concave portions 110. Since the tool cutting portion 62 of the cutting tool 60 has a tapered shape, such a vibration waveform is formed.

FIG. 7A and FIG. 7B are an example of a ring cutting pattern. In this example, the control unit 72 performs cutting along the above-described ring-section cutting pattern. Further, the control unit 72, the above-mentioned cutting conditions (1) to vibrate the cutting tool 60 so as to satisfy (2) x ₂ axially. Here, the cutting for one round of the master substrate 100 is a set of cutting steps. As a result, the fine recess 110 shown in FIGS. 7A and 7B is formed. The shapes of the bottom 110a, the side wall 110b, and the fine protrusion 111 of the fine recess 110 have a vibration waveform in plan view. The phases of these vibration waveforms are aligned between the adjacent fine concave portions 110.

FIG. 8A and FIG. 8B are an example of a ring cutting pattern. In this example, the control unit 72 performs cutting along the above-described ring-section cutting pattern. Further, the control unit 72, the above-mentioned cutting conditions (1) to vibrate the cutting tool 60 so as to satisfy (2) to the z ₂ axis. Here, the cutting for two rounds of the master substrate 100 is a set of cutting steps. Further, the control unit 72 causes the cutting area by the cutting tool 60 to be adjacent to each other at a pitch of the fine concave portion 110. As a result, the fine concave portion 110 shown in FIGS. 8A and 8B is formed. The bottom 110a of the fine concave portion 110 is a straight line in a plan view, and the side wall 110b and the fine convex portion 111 have a vibration waveform in a plan view. On the other hand, the height of the upper end portion of the fine protrusion 111 is vibrated in the z ₂ axis. Further, the phases of the vibration waveforms of the fine projections 111 are aligned every two pitches (that is, once every two rounds). The phases of the vibration waveforms of the adjacent minute convex portions 111 are shifted by 180 °. Since the tool cutting portion 62 of the cutting tool 60 has a tapered shape, such a vibration waveform is formed. Similar cutting can be performed with a spiral cutting pattern. Also in this case, the cutting for two rounds of the master substrate 100 may be a set of cutting steps. FIG. 20 shows the surface shape (SEM photograph) of the produced master 120. As shown in FIG. 20, no defect is found.

  The specific example of the process of the control unit 72 has been described above, but the process performed by the control unit 72 is not limited to the above example. For example, the control unit 72 may perform the deep digging step so as to satisfy the cutting conditions (1) and (2) in each of the above specific examples. Further, the control unit 72 may perform cutting that satisfies the cutting conditions (1) and (2) in the spiral cutting pattern, the thrust cutting pattern, or the oblique thrust cutting pattern.

<4. About error>
Here, as shown by the cutting conditions (1) and (2), in this embodiment, it is very important that the phases of the vibrations of the cutting tool are aligned between sets or at the start point and end point of the same set. However, in the actual cutting process, it is difficult to completely align the phases of the vibrations. Thus, the present inventor has studied the allowable error and found that the generation of defects is suppressed within a certain allowable error range.

  For example, an error of the cutting condition (1) may occur in the ring cutting pattern. Specifically, in any of the sets, the y-coordinate value of the start point and the y-coordinate value of the end point overlap (that is, the y-coordinate value of the end point is shifted to the positive side of the y-axis from the y-coordinate value of the start point). An error can occur (Case 1). Further, in any of the sets, an error may occur in which the end point of the cutting does not reach the start point (that is, the y coordinate value of the end point is shifted more in the negative direction of the y axis than the y coordinate value of the start point) (case 2). In case 1, if the deviation (step) of the cutting depth due to the overlap is less than 0.5 μm, the occurrence of defects is suppressed. In Case 2, a portion between the start point and the end point is a flat portion. When the length of the flat portion in the y-axis direction is less than 0.5 μm, generation of defects is suppressed. Therefore, a range where the depth of the step or the length of the flat portion is less than 0.5 μm is an allowable error. If these errors are within the allowable error range, it can be said that the cutting condition (1) is satisfied.

  In the spiral cutting pattern, the ring cutting pattern, the thrust cutting pattern, and the oblique thrust cutting pattern, an error in the phase of the vibration waveform between adjacent minute concave portions 60 may occur as an error of the cutting condition (2). If such an error is less than 5 °, the occurrence of defects is suppressed. Therefore, a range where the phase shift is less than 5 ° is an allowable error. In the deep cutting process, an error in the phase of the vibration between sets may occur as an error of the cutting condition (2). If such an error is less than 5 °, the occurrence of defects is suppressed. Therefore, a range where the phase shift is less than 5 ° is an allowable error. If these errors are within the allowable error range, it can be said that the cutting condition (2) is satisfied.

<5. Fine processing method using fine processing equipment>
Next, an example of a fine processing method using the fine processing apparatus 1 will be described with reference to a flowchart shown in FIG. 9A. An operator prepares a master by performing the steps described below.

  In step S10, the operator prepares the master substrate 100. Here, the shape of the master substrate 100 is not particularly limited. The shape of the master substrate 100 is, for example, a column or a cylinder. The material of the master substrate 100 is also not particularly limited, but is preferably an amorphous material or a material having a small particle size in order to maintain the smoothness of the processed surface. The master substrate 100 is preferably made of, for example, copper, copper alloy, nickel, nickel alloy, austenitic stainless steel, duralumin, or the like. More specific examples include S45C and SUS304.

  A coating layer may be formed on the surface of the master substrate 100. In this case, fine concave portions 110 are formed in the coating layer. The method of forming the coating layer on the surface of the master substrate 100 is not particularly limited, and examples thereof include the following method. First, an operator plating a material (for example, Cu, Ni-P alloy or the like) constituting the coating layer on the peripheral surface of the master substrate 100. The type of plating is not particularly limited, but may be, for example, electrolytic plating. The coating layer immediately after plating often has a rough surface. Therefore, after forming the coating layer on the peripheral surface of the master substrate 100, the coating layer may be smoothed. Although the content of the smoothing process is not particularly limited, for example, it may be performed using a cutting tool (a cutting tool having a curved surface-shaped cutting tool). In this method, for example, an operator attaches the master substrate 100 on which the coating layer is formed and a smoothing tool to a precision lathe. Next, the master substrate 100 is rotated around the center axis of the master substrate 100 as a rotation axis. Then, the cut portion of the smoothing tool is pressed against one axial end of the coating layer. Here, the axial direction means the central axis direction of the master substrate 100. Then, while rotating the master substrate 100, the smoothing tool is moved from one axial end to the other axial end. Through the above steps, the coating layer is smoothed.

  Next, the operator places the master substrate 100 on the main rotating device 10.

  In step S20, the operator sets the tool setting unit 40 on the processing stage 30. Further, the operator provides the tool installation section 40 with the vibration section 50. In addition, you may prepare the tool installation part 40 in which the vibration part 50 was provided beforehand. In step S30, the operator stores the cutting tool 60 in the tool storage case 51.

  In step S40, the operator sets the control system, and in step S50, the operator sets the rotation speed of the main rotating device 10. Specifically, the operator inputs necessary information to the control device 70 to obtain a desired fine uneven pattern. Such information includes, for example, the rotation speed of the master substrate 100, the movement trajectory of the tool setting unit 40, the movement speed, the depth of cutting by the cutting tool 60, the direction of vibration, the waveform of vibration, the frequency of vibration, and And the amplitude of vibration. For example, the control unit 72 displays an input screen on a display. The operator inputs the above information using the input operation device. The control unit 72 may urge the operator to correct the information when the provided information cannot perform control satisfying the above-described cutting conditions (1) and (2). At this time, the control unit 72 may display an example of numerical values necessary to satisfy the cutting conditions (1) and (2) on the input screen. The control unit 72 outputs information on the rotation speed of the master substrate 100 to the main rotation device 10.

  In step S60, the main rotating device 10 starts rotating the master substrate 100. Along with this, the main rotating device 10 outputs rotation information on the rotation angle of the master substrate 100 to the control device 70.

In step S70～S80, the control unit 72, by driving the working stages 30, moves the _{x 1} axial and _{z 1} axial position of the tool installation portion 40 to the start position. That is, the tool setting unit 40 is set at a position facing the base material for a master 100.

In step S90, the operator starts operation of the control system (that is, the micromachining device 1). In step S100, the control device 70 starts the synchronous operation of the vibration unit 50. That is, the control calculation unit 71 calculates the x ₂ z ₂ coordinate value of the cutting tool 60 using the rotation information given from the main rotating device 10 as a trigger. Here, the calculation control unit 71, cutting conditions vibration is above the cutting tool 60 (1), (2) so as to satisfy at least one, and calculates the x ₂ z ₂ coordinates of the cutting tool 60. The control calculation unit 71 outputs coordinate information on the calculated coordinate values to the control unit 72. The control unit 72 generates vibration control information for moving the cutting tool 60 to the coordinate values calculated by the control calculation unit 71, and outputs the vibration control information to the amplification unit 73. The amplification unit 73 amplifies the vibration control information and outputs the information to the vibration unit 50. The tool vibration elements 52a and 53a of the vibration unit 50 are driven based on vibration control information. Thus, the cutting tool 60 vibrates in synchronization with the rotation of the master substrate 100.

In step S110, the control calculation unit 71 calculates the x ₁ z ₁ coordinate value of the tool setting unit 40 based on the rotation information given from the main rotation device 10. Here, the arithmetic control unit 71 calculates the x ₁ z ₁ coordinate value of the tool setting unit 40 so that at least one of the above-described cutting conditions (1) and (2) is satisfied. The control calculation unit 71 outputs coordinate information on the calculated coordinate values to the control unit 72. The control unit 72 moves the tool setting unit 40 according to the coordinate information, the machining program, and the information input by the operator. Thus, in step S120, a groove is formed. That is, the fine concave portions 110 are formed on the surface of the master substrate 100. That is, the control unit 72 performs a plurality of sets of the cutting process of moving the tool setting unit 40 relative to the master substrate 100 and cutting the master substrate 100 while vibrating the cutting tool 60. Further, the control unit 72 performs the cutting step so that at least one of the above-described cutting conditions (1) and (2) is satisfied. When the value of the coordinate information provided from the displacement measuring devices 52b, 53b and the like is different from the content of the instruction, the control unit 72 may perform any abnormality occurrence processing (eg, stop driving and notify the worker). Good.

  In step S130, the cutting (working) of the master substrate 100 is completed. That is, the cutting from one end to the other end of the master substrate 100 is completed. When performing the deep cutting process, the following steps S140 to S160 are further performed. In step S140, the operator changes the cutting tool 60 as needed. In step S150, the operator positions the cutting tool 60. Specifically, the positioning of the cutting tool 60 is performed so that the cutting depth is deeper than in the deep drilling process of the previous set. Thereafter, the worker repeats the processing of steps S70 to S130 described above. After that, the process ends.

  Further, another example of the fine processing method using the fine processing apparatus 1 will be described with reference to the flowchart shown in FIG. 9B. An operator prepares a master by performing the steps described below.

  Steps S10 to S30 are the same as those described above.

  In step S40, the operator sets the control system, and in step S50 ', the operator sets the feed speed of the feed shaft 31. Specifically, the operator inputs necessary information to the control device 70 to obtain a desired fine uneven pattern. Such information includes, for example, the feed speed of the feed shaft 31, the movement trajectory of the tool setting unit 40, the depth of cutting by the cutting tool 60, the direction of vibration, the waveform of vibration, the frequency of vibration, and the amplitude of vibration. No. For example, the control unit 72 displays an input screen on a display. The operator inputs the above information using the input operation device. The control unit 72 may urge the operator to correct the information when the provided information cannot perform control satisfying the above-described cutting conditions (1) and (2). At this time, the control unit 72 may display an example of numerical values necessary to satisfy the cutting conditions (1) and (2) on the input screen. The control unit 72 outputs information on the feed speed of the feed shaft 31 to the feed shaft 31.

In step S70, S75, S80, the control unit 72, by driving the machining stage to move the _{x 1} axial and _{z 1} axial position of the tool installation portion 40 to the start position. That is, the tool setting unit 40 is set at a position facing the base material for a master 100. Further, the control unit 72 moves the rotation axis of the master substrate 100 to the start position (start rotation angle).

In step S90, the operator starts operation of the control system (that is, the micromachining device 1). In step S100, the control device 70 starts the synchronous operation of the vibration unit 50. That is, the control calculation unit 71 as a trigger the coordinate information of the feed axis 31 _{(x 1} coordinate values) to calculate the _x 2 _{z 2} coordinates of the cutting tool 60. Here, the calculation control unit 71, cutting conditions vibration is above the cutting tool 60 (1), (2) so as to satisfy at least one, and calculates the x ₂ z ₂ coordinates of the cutting tool 60. The control calculation unit 71 outputs coordinate information on the calculated coordinate values to the control unit 72. The control unit 72 generates vibration control information for moving the cutting tool 60 to the coordinate values calculated by the control calculation unit 71, and outputs the vibration control information to the amplification unit 73. The amplification unit 73 amplifies the vibration control information and outputs the information to the vibration unit 50. The tool vibration elements 52a and 53a of the vibration unit 50 are driven based on vibration control information. Thereby, the cutting tool 60 vibrates in synchronization with the coordinates of the feed shaft 31.

In step S110, the control calculation unit 71, based on the position information provided from the feed shaft 31, and calculates the z ₁ coordinate values of the tool installation portion 40. Here, the calculation control unit 71, the above-mentioned cutting conditions (1), to be filled at least one of (2) to calculate the z ₁ coordinate values of the tool installation portion 40. The control calculation unit 71 outputs coordinate information on the calculated coordinate values to the control unit 72. The control unit 72 moves the tool setting unit 40 according to the coordinate information, the machining program, and the information input by the operator. Thus, in step S120, a groove is formed. That is, the fine concave portions 110 are formed on the surface of the master substrate 100. That is, the control unit 72 performs a plurality of sets of the cutting process of moving the tool setting unit 40 relative to the master substrate 100 and cutting the master substrate 100 while vibrating the cutting tool 60. Further, the control unit 72 performs the cutting step so that at least one of the above-described cutting conditions (1) and (2) is satisfied. Further, when the value of the coordinate information given from the displacement measuring devices 52b, 53b and the like is different from the instruction content, the control unit 72 may perform some kind of abnormality occurrence processing (eg, stop driving and notify the worker). Good.

  In step S130, the cutting (working) of the master substrate 100 is completed. That is, the cutting from one end to the other end of the master substrate 100 is completed. When the deep excavation step is performed, the processing of steps S140 to S160 is further performed. Steps S140 to S160 are the same as those described above. After that, the process ends.

  The cutting distance by the cutting tool 60 is not particularly limited. For example, the cutting distance may be 100 km or less, or may be 20 km or less. Cutting can be continued until the tool cutting portion 62 is damaged.

  The depth of the fine recess 110 is not particularly limited. For example, the depth of the fine concave portion 110 may be 1 to 200 μm, preferably 3 to 30 μm. Further, the distance (so-called pitch) between the fine concave portions 110 is not particularly limited. For example, the pitch of the fine concave portions 110 may be 5 to 500 μm, preferably 10 to 100 μm.

<6. Master Structure>
FIG. 10A, FIG. 10B, and FIG. 10C show an example of the master 120 produced by the above-described fine processing method. The master 120 is a transfer type used for an imprint technique, for example. The master 120 has a columnar or cylindrical shape, and a large number of fine concave portions 110 are formed on a peripheral surface thereof. At least one of the side wall 110b and the bottom 110a of the fine recess 110 has a vibration waveform satisfying at least one or more (preferably all) of the following vibration waveform conditions (1) to (4).
Vibration waveform condition (1): The vibration waveform is continuous.
Vibration waveform condition (2): The vibration waveform is a composite waveform of a plurality of vibration waveforms, and the phases of the plurality of vibration waveforms are aligned.
Vibration waveform condition (3): A plurality of rows of fine concave portions 110 are formed on the master substrate 100, and the phases of the vibration waveforms are aligned between the adjacent fine concave portions 110.
Vibration waveform condition (4): A plurality of rows of fine recesses 110 are formed on the master substrate 100, and the phase of the vibration waveform is uniform between the fine recesses every two pitches (ie, once every two turns). I have.

  The vibration waveform condition (1) corresponds to the above-described cutting condition (1). It can be said that the vibration waveform condition (1) is satisfied if the error generated by the cutting of the cutting condition (1) is within the allowable error range. The vibration waveform condition (2) corresponds to a deep digging cutting process that satisfies the cutting condition (2). The vibration waveform conditions (3) and (4) correspond to a ring cutting pattern or a spiral cutting pattern that satisfies the cutting condition (2). “The phases are aligned” in the vibration waveform conditions (2) to (4) means that the phases for the same y coordinate of the master 120 are aligned, that is, the error generated by the cutting under the cutting condition (2) is within an allowable range. Means that In the vibration waveform condition (4), the phases of the vibration waveforms of the adjacent fine concave portions 110 are shifted by 180 °. 6A to 8B show examples of the shape of the fine concave portion 110. FIG.

  Since the vibration waveform of the master 120 satisfies at least one of the vibration waveform conditions (1) to (4), continuity of the vibration waveform is maintained, and generation of defects is suppressed.

<7. Structure of transcript>
FIG. 11A and FIG. 11B show an example of a transfer product 200 produced by transferring the surface shape of the master 120. The transcript 200 has a transcript substrate 210 and a fine uneven layer 220 formed on the surface of the transcript substrate 210. The fine concave-convex layer 220 has a large number of fine concave portions 230 and fine convex portions 240 formed between the fine concave portions 230. The surface shape of the fine uneven layer 220 is an inverted shape of the surface shape of the master 120. That is, the shape of the fine concave portion 230 is an inverted shape of the fine convex portion 111, and the shape of the fine convex portion 240 is an inverted shape of the fine concave portion 110. The transfer product 200 shown in FIGS. 11A and 11B is manufactured using the master 120 shown in FIGS. 7A and 7B.

At least one of the side wall 230b and the bottom 230a of the fine recess 230 has a vibration waveform satisfying at least one or more (preferably all) of the following vibration waveform conditions (1) to (4).
Vibration waveform condition (1): The vibration waveform is continuous.
Vibration waveform condition (2): The vibration waveform is a composite waveform of a plurality of vibration waveforms, and the phases of the plurality of vibration waveforms are aligned.
Vibration waveform condition (3): A plurality of rows of fine concave portions 230 are formed on the transfer material base 210, and the phases of the vibration waveforms are aligned between the adjacent fine concave portions 230.
Vibration waveform condition (4): A plurality of rows of fine concave portions 230 are formed on the transfer material base material 210, and the phase of the vibration waveform is uniform between the fine concave portions 230 every two pitches.

  The vibration waveform conditions (1) to (4) correspond to the vibration waveform conditions (1) to (4) of the master 120. In addition, “the phases are aligned” in the vibration waveform conditions (2) to (4) of the transfer product 200 means that the phases with respect to the same y coordinate are aligned when the extending direction of the minute concave portion 230 is the y-axis. Means that In the vibration waveform condition (4), the phases of the vibration waveforms of the adjacent minute concave portions 230 are shifted by 180 °.

  Since the vibration waveform of the transcript 200 satisfies at least one of the vibration waveform conditions (1) to (3), continuity of the vibration waveform is maintained, and generation of defects is suppressed.

  <8. Method for producing transcript>

  The transcript 200 is produced by transferring the fine concave portion 110 of the master 120. For example, an uncured curable resin layer is formed on the transfer material base 210. The material of the transfer material base 210 may be appropriately selected according to the use of the transfer material 200. Examples of the material of the transfer material substrate 210 include acrylic resin (eg, polymethyl methacrylate), polycarbonate, PET (polyethylene terephthalate), TAC (triacetyl cellulose), polyethylene, polypropylene, cycloolefin polymer, cycloolefin copolymer, and vinyl chloride. And the like.

  The material of the curable resin may be appropriately selected according to the use of the transferred material 200. Examples of the material of the curable resin include an epoxy-based curable resin and an acrylic-based curable resin.

  Next, the surface of the master 120 is pressed against the curable resin layer. In this state, the curable resin layer is cured. Thereby, the surface shape of the master 120 is transferred to the curable resin layer. That is, the fine uneven layer 220 is formed on the transfer material base 210. Next, the transferred material 200 is prepared by peeling the master 120 from the fine uneven layer 220. In the present embodiment, since the master 120 has a cylindrical or cylindrical shape, the transferred material 200 can be continuously manufactured by a so-called roll-to-roll.

  Note that the above is merely an example of a method for manufacturing the transfer product 200, and it is a matter of course that the transfer product 200 may be manufactured by another manufacturing method. For example, the transfer material base 210 may be made of a thermoplastic resin. In this case, the surface of the master 120 is pressed against the transfer material base 210 that has been softened by heating. By cooling the substrate 210 for transfer material in this state, the fine uneven layer 220 may be formed on the surface of the substrate 210 for transfer material.

<1. Example 1>
Next, an example of the present embodiment will be described. In Example 1, a columnar master substrate 100 having a diameter of 250 mm and a length of 1000 mm was prepared. The material was S45C. Next, a coating layer was formed on the master substrate 100 by subjecting the master substrate 100 to a nickel phosphorous plating treatment. Further, the coating layer was flattened. The specific processing for flattening is as described above.

Next, the fine processing apparatus 1 was prepared. Here, as a cutting tool 60, a diamond tool having a V-shaped tool tip 63 was prepared. The rotation speed of the master substrate 100 was set to 20 min ⁻¹ , the vibration waveform of the cutting tool 60 was set to a Sin waveform, the amplitude was set to 10 μm, and the frequency was set to 300 Hz. Direction of the vibration was z ₂ axially. Then, the spiral cutting pattern was cut so as to satisfy the above cutting conditions (1) and (2). The pitch of the fine concave portions 110 was 70 μm. Further, two sets of deep excavation processes satisfying the above-described cutting conditions (1) and (2) were performed. The difference between the cutting depth of the first set and the cutting depth of the second set (specifically, the difference between the maximum values of vibration displacement), that is, the cutting depth, was 3 μm.

  Then, a transcript was prepared using the prepared master 120, and the surface shape of the transcript was observed with a microscope having a magnification of 450 times and a scanning electron microscope (SEM) having a magnification of 100 times. As a result, a vibration waveform was continuously formed in the fine concave portion 110, and no defect was observed.

<2. Example 2>
The same test as in Example 1 was conducted except that the cutting pattern was a round cutting pattern. The pitch of the ring cutting pattern was the same as in Example 1. As a result, a vibration waveform was continuously formed in the fine concave portion 110, and no defect was observed.

<3. Example 3>
The same test as in Example 1 was performed except that the cutting pattern was a cross spiral cutting pattern. The pitch of the cross spiral cutting pattern was the same as in Example 1. As a result, a vibration waveform was continuously formed in the fine concave portion 110, and no defect was observed.

<4. Comparative Example 1>
In Comparative Example 1, the same processing as in Example 1 was performed except that the phase of the first set of deep cutting processes and the phase of the second set of deep cutting processes were shifted by 45 °, and the cutting difference was set to 0. . That is, in Comparative Example 1, cutting that did not satisfy the cutting condition (2) was performed. FIG. 12 shows a vibration waveform. The horizontal axis in FIG. 12 indicates the phase (°) of the vibration, and the vertical axis indicates the displacement of the vibration (z ₂ coordinate value + cutting difference). The graph L11 shows the vibration waveform of the first set of the deep cutting process, and the graph L12 shows the vibration waveform of the second set of the deep cutting process. The maximum value D (hereinafter, also referred to as “depth variation amount”) D between the graph L11 and the graph L12 is about 25% of the depth setting value (amplitude + cutting difference). A graph L13 in FIG. 13 shows a vibration waveform of the fine concave portion 110. The horizontal axis indicates the phase (°) of the vibration of the fine recess 110, and the vertical axis indicates the amplitude of the fine recess 110. In Examples 1 to 3, the phases of the graphs L11 and L12 match.

  The surface shape of the transcript produced in Comparative Example 1 was observed with a microscope with a magnification of 450 times and a scanning electron microscope (SEM) with a magnification of 100 times. As a result, a defect was found in the fine concave portion 110. FIG. 21 shows a microscope image as an example of the observation image. As is clear from FIG. 21, a defect A was found in some of the fine concave portions 110.

<5. Comparative Example 2>
In Comparative Example 2, the same processing as in Comparative Example 1 was performed, except that the phase difference between the first set of deep digging and the second set of deep digging was set to 90 °. In Comparative Example 2, the depth variation D is 50% of the depth set value. A defect was also found in Comparative Example 2.

<6. Comparative Example 3>
In Comparative Example 3, the same processing as in Comparative Example 1 was performed except that the phase difference between the first set of deep digging and the second set of deep digging was set to 180 °. In Comparative Example 3, the depth variation D is 100% of the depth set value. A defect was also found in Comparative Example 3.

<7. Comparative Example 4>
In Comparative Example 4, the same processing as in Comparative Example 1 was performed except that the phase difference between the first set of deep drilling and the second set of deep drilling was set to 10 °. In Comparative Example 4, the depth variation D is 5% of the depth set value. A defect was also found in Comparative Example 4.

<8. Comparative Example 5>
In Comparative Example 5, the same processing as in Comparative Example 1 was performed, except that the phase difference between the first set of deep digging and the second set of deep digging was set to 5 °. In Comparative Example 5, the depth variation D is 3% of the depth set value. A defect was also found in Comparative Example 5.

<9. Comparative Example 6>
In Comparative Example 6, the same processing as in Comparative Example 1 was performed except that the cutting difference was 3 μm. FIG. 14 shows a vibration waveform. The horizontal axis of FIG. 14 shows the vibration of the phase (°), the vertical axis represents the displacement of the vibrating (z ₂ coordinates + cut difference). The graph L11 shows the vibration waveform of the first set of the deep cutting process, and the graph L12 shows the vibration waveform of the second set of the deep cutting process. The depth variation D is about 25% of the set depth value. A graph L13 in FIG. 15 shows a vibration waveform of the fine concave portion 110. The horizontal axis indicates the phase (°) of the vibration of the fine recess 110, and the vertical axis indicates the amplitude of the fine recess 110. A defect was also found in Comparative Example 6.

<10. Comparative Example 7>
In Comparative Example 7, the same processing as in Comparative Example 2 was performed except that the cutting difference was 3 μm. The depth variation D is about 50% of the set depth value. A defect was also found in Comparative Example 7.

<11. Comparative Example 8>
In Comparative Example 8, the same processing as in Comparative Example 3 was performed except that the cut depth was 3 μm. The depth variation D is about 100% of the depth set value. A defect was also found in Comparative Example 8. FIG. 22 shows an SEM image as an example of the observation image. As is clear from the SEM image, the defect A was found in Comparative Example 8.

<12. Comparative Example 9>
In Comparative Example 9, the same processing as in Example 1 was performed except that the cutting difference was 3 μm and the phase difference was 40 °. The depth variation D is about 22% of the set depth value. A defect was also found in Comparative Example 9.

<13. Comparative Example 10>
In Comparative Example 10, the same processing as in Example 1 was performed except that the cutting difference was 3 μm and the phase difference was 50 °. The depth variation D is about 27% of the set depth value. A defect was also found in Comparative Example 10.

<14. Comparative Example 11>
In Comparative Example 11, the same processing as in Comparative Example 2 was performed except that the amplitude was set to 3 μm and the cut depth was set to 1.5 μm. FIG. 16 shows a vibration waveform. The horizontal axis of FIG. 16 indicates the phase (°) of the vibration, and the vertical axis indicates the displacement of the vibration (z ₂ coordinate value + cutting difference). The graph L11 shows the vibration waveform of the first set of the deep cutting process, and the graph L12 shows the vibration waveform of the second set of the deep cutting process. The depth variation D is about 50% of the set depth value. A graph L13 in FIG. 17 shows a vibration waveform of the fine concave portion 110. The horizontal axis indicates the phase (°) of the vibration of the fine recess 110, and the vertical axis indicates the amplitude of the fine recess 110. A defect was also found in Comparative Example 11.

<15. Comparative Example 12>
In Comparative Example 12, the same processing as in Comparative Example 3 was performed except that the amplitude was set to 3 μm and the cut depth was set to 1.5 μm. The depth variation D is about 100% of the depth set value. A defect was also found in Comparative Example 12.

<16. Comparative Example 13>
In Comparative Example 13, the same processing as in Comparative Example 1 was performed except that the cutting pattern was a round cutting pattern. A defect was also found in Comparative Example 13.

<17. Comparative Example 14>
In Comparative Example 14, the same processing as in Comparative Example 2 was performed except that the cutting pattern was a round cutting pattern. A defect was also found in Comparative Example 14.

<18. Comparative Example 15>
In Comparative Example 15, the same processing as in Comparative Example 3 was performed except that the cutting pattern was a round cutting pattern. A defect was also found in Comparative Example 15.

<19. Comparative Example 16>
In Comparative Example 16, the cutting pattern was a round cutting pattern. Further, a cutting not satisfying the cutting condition (1) was performed without performing the deep cutting step. Specifically, in case 1 described above, cutting was performed so that the overlap length was 110 μm and the step was 0.6 μm. FIG. 18 shows the vibration waveform of the cutting. The horizontal axis in FIG. 18 indicates the y coordinate value (°), and the vertical axis indicates the displacement (μm) of the vibration. Graph L4 shows a vibration waveform near the start point, and graph L5 shows a vibration waveform near the end point. The distance D2 indicates the depth of the step, and the distance D3 indicates the length of the overlap. In Comparative Example 16, a defect was found at the boundary between the start point and the end point.

<20. Example 4>
The same processing as in Comparative Example 16 was performed except that the length of the overlap was 6.2 μm and the step was 0.003 μm. As a result, no defect was found.

<21. Comparative Example 17>
In Comparative Example 17, the cutting pattern was a round cutting pattern. Further, a cutting not satisfying the cutting condition (1) was performed without performing the deep cutting step. Specifically, in case 2 described above, cutting was performed so that the length of the flat portion was 0.55 μm. FIG. 19 shows the vibration waveform of the cutting. The horizontal axis in FIG. 19 indicates the y coordinate value (°), and the vertical axis indicates the displacement (μm) of the vibration. Graph L6 shows a vibration waveform near the start point, and graph L7 shows a vibration waveform near the end point. The distance D4 indicates the length of the flat portion (the length in the y-axis direction). In Comparative Example 17, a defect was found at the boundary between the start point and the end point.

<22. Example 5>
The same processing as in Comparative Example 17 was performed except that the length of the flat portion was set to 0.2 μm. As a result, no defect was found.

<23. Example 6>
The same test as in Example 1 was performed except that the cutting pattern was a thrust cutting pattern. In Example 6, the cutting tool 60 was vibrated in synchronization with the coordinates of the feed shaft 31. The output x ₂ z ₂ coordinate values of the cutting tool 60 were generated using an arbitrary waveform generator. In addition, processing is started without rotating the master substrate 100, and when the first trigger of the encoder of the feed shaft 31 is detected, an arbitrary waveform is generated and the tool setting unit 40 is driven. . As a result, a vibration waveform was continuously formed in the fine concave portion 110, and no defect was found.

<24. Example 7>
The same test as in Example 6 was performed except that the cutting pattern was an oblique thrust cutting pattern. In the oblique thrust cutting pattern of Example 7, the inclination angle of the fine concave portion 110 with respect to the axial direction of the master substrate 100 was set to 15 °. As a result, a vibration waveform was continuously formed in the fine concave portion 110, and no defect was found.

  The above results are summarized in Tables 1 and 2.

  No defect was found in Examples satisfying the cutting conditions (1) and (2), whereas defects were found in Comparative Examples 1 to 17 not satisfying the cutting conditions (1) and (2).

  As described above, the preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to such examples. It is apparent that those skilled in the art to which the present invention pertains can conceive various changes or modifications within the scope of the technical idea described in the claims. It is understood that these also belong to the technical scope of the present invention. For example, in the above embodiment, the vibration waveform of the cutting tool 60 is a Sin waveform, but is not limited thereto, and may be an arbitrary vibration waveform. For example, the waveform of the vibration may be a trapezoidal wave or the like.

  Further, for example, in the above embodiment, the master substrate 100 has a columnar or cylindrical shape, but the present invention is not limited to such an example. For example, the master substrate 100 may be flat. In this case, the y-axis may be set to the length direction of the fine concave portion. Further, although the cutting symmetry is used as the base material for the master, the present embodiment may be applied to the cutting of other base materials.

DESCRIPTION OF SYMBOLS 1 Micromachining device; 10 Main rotation device; 12 Subsequent rotation device; 20 Cutting device; 30 Processing stage; 31 Feed shaft; 40 Tool installation part; 41 Case storage recessed part; 50 Vibration part; 51 Tool storage case; Tool vibrating element; 52b, 53b Displacement measuring device; 60 cutting tool; 61 tool main body; 62 tool cutting section; 63 tool tip; 70 control device; 71 control calculation section; 72 control section; 73 amplification section; Material 110; Fine concave part; 110a Bottom part; 110b Side wall; 111 Fine convex part; 120 Master disk; 200 Transferred matter; 210 Substrate for transferred material; 220 Fine concave and convex layer; 230 Fine concave part; 230a Bottom part;

Claims (8)

A tool installation section,
A cutting tool that is provided in the tool installation section and can form a fine concave portion on the base material,
A drive unit that relatively moves the tool installation unit with respect to the base material,
A vibrating unit that is provided in the tool installation unit and that can vibrate the cutting tool in at least one of a depth direction and a surface direction of the base material,
A control unit that performs a plurality of sets of a cutting process of cutting the base material while moving the tool installation unit relative to the base material and vibrating the cutting tool,
The said control part performs the said cutting process so that at least one of the following cutting conditions (1) and (2) is satisfy | filled, The micro-machining apparatus characterized by the above-mentioned.
Cutting condition (1): Vibration phases are aligned at the start point and end point of each set.
Cutting condition (2): Vibration phases are uniform between each set.   2. The micromachining apparatus according to claim 1, wherein the cutting step includes a deep digging step of repeatedly cutting the same portion and making a cutting depth of a current set larger than a cutting depth of a previous set.   The micromachining apparatus according to claim 1, wherein the cutting step includes a parallel cutting step of cutting the current set at a position adjacent to a cutting position of the previous set. The substrate has a cylindrical or cylindrical shape,
The driving unit includes a substrate driving unit that rotates the substrate around a central axis of the substrate as a rotation axis, and a tool moving unit that moves the tool installation unit in a direction parallel to the rotation axis,
The control unit is characterized in that the tool installation unit is moved relative to the base material by rotating the base material and moving the tool installation unit in a direction parallel to the rotation axis. The microfabrication apparatus according to any one of claims 1 to 3. A fine processing method using the fine processing apparatus according to any one of claims 1 to 4,
A step of providing the cutting tool in the tool installation section,
A step of installing the tool installation section at a position facing the base material,
Performing a plurality of sets of cutting steps of cutting the substrate while moving the tool installation portion relative to the substrate, and vibrating the cutting tool,
A micromachining method, wherein the cutting step is performed so that at least one of the following cutting conditions (1) and (2) is satisfied.
Cutting condition (1): Vibration phases are aligned at the start point and end point of each set.
Cutting condition (2): Vibration phases are uniform between each set. Having a substrate on which one or more fine concave portions are formed,
At least one of the side wall and the bottom of the fine recess has a vibration waveform satisfying at least one of the following vibration waveform conditions (1) to (4).
Vibration waveform condition (1): The vibration waveform is continuous.
Vibration waveform condition (2): The vibration waveform is a composite waveform of a plurality of vibration waveforms, and the phases of the plurality of vibration waveforms are aligned.
Vibration waveform condition (3): A plurality of rows of fine concave portions are formed on the base material, and the phases of the vibration waveforms are aligned between adjacent fine concave portions.
Vibration waveform condition (4): A plurality of rows of fine recesses are formed on the base material, and the phase of the vibration waveform is uniform between the fine recesses every two pitches.   The transfer die according to claim 6, wherein the substrate has a cylindrical or cylindrical shape. Having a substrate on which one or more fine concave portions are formed,
At least one of the side wall and the bottom of the fine recess has a vibration waveform satisfying at least one of the following vibration waveform conditions (1) to (4).
Vibration waveform condition (1): The vibration waveform is continuous.
Vibration waveform condition (2): The vibration waveform is a composite waveform of a plurality of vibration waveforms, and the phases of the plurality of vibration waveforms are aligned.
Vibration waveform condition (3): A plurality of rows of fine concave portions are formed on the base material, and the phases of the vibration waveforms are aligned between adjacent fine concave portions.
Vibration waveform condition (4): A plurality of rows of fine recesses are formed on the base material, and the phase of the vibration waveform is uniform between the fine recesses every two pitches.