JP2020026475A - Adhesive composition and photosemiconductor device - Google Patents

Abstract

To provide an adhesive composition that has high adhesive force and can exhibit excellent mountability and humidity resistance.SOLUTION: The adhesive composition contains [A] an epoxy resin having a bisphenol skeleton, [B] a dilutable monomer including two or more kinds of alicyclic epoxy compounds having a cyclohexene oxide group, [C] a photocationic polymerization initiator including [C1] a bissulfonium salt and [C2] a monosulfonium salt, [D] a silane coupling agent and [E] a silica particle, has a mass ratio of [C1] and [C2] of 3:1 to 1:1, has a content of component [A] of 15 to 50 pts.mass based on 100 pts.mass of the total amount of components [A] and [B], and has a content of component [C] of 0.3 to 0.5 pt.mass, a content of component [D] of 0.5 to 0.8 pt.mass and a content of component [F] of 100 to 400 pts.mass, each based on 100 pts.mass of the total amount of components [A] to [D].SELECTED DRAWING: None

Description

  The present invention relates to an adhesive composition and an optical semiconductor device.

  2. Description of the Related Art Conventionally, a laser module including a lens that converts or condenses laser light emitted from a laser light source into parallel light is known. In a conventional laser module, an optical component, a laser chip, and the like are housed in a metal housing and fixed to a mounting board with a solder material to form a module. On the other hand, a metal housing is an obstacle to realizing miniaturization and cost reduction of the laser module. In addition, the functions of laser modules have become more sophisticated, optical components have been mounted at high density in small housings, and the materials of housings have been shifting from metal housings to plastic housings. For this reason, the laser module components that have existed in a hermetically sealed environment are exposed to the atmosphere, and the laser module components are required to have moisture resistance. On the other hand, in order to fix a laser light source (LD chip or the like) to a predetermined mounting substrate, high mounting accuracy is required in a mounting stage.

  When mounting an optical component on a mounting board having a high integration density, the optical component is generally temporarily fixed by irradiating ultraviolet rays using an ultraviolet-curing adhesive, and then, in a heating step, temporarily fixing the optical component. A technique for increasing the adhesive strength of a fixed optical component is widely known (for example, see Patent Document 1).

JP 2016-117905 A

  In a highly integrated laser module, it is necessary for the optical components mounted inside the module to mount the optical components in a close positional relationship, and the ultraviolet rays necessary for temporary fixing are sufficiently irradiated on the adhesive. Is not in a situation. Therefore, heat is applied to the temporarily fixed adhesive to increase the adhesiveness with the mounting substrate, but the application of the heat may significantly shift the mounting position of the optical component. Conventionally, a laser module is mounted inside a metal package, and a technique of hermetically sealing the entire package with metal parts has been adopted.However, expensive parts, especially metal package parts, are often used. It is essential and hinders cost reduction. Therefore, there is a trend to change to a package made of engineering plastic (for example, polyetherimide) instead of a conventional metal package, and it is necessary to secure the fixing strength of an optical component to be mounted in a situation where airtightness is not maintained. Has occurred.

  The present invention provides an ultraviolet-curable adhesive composition having high adhesive strength, capable of exhibiting excellent mountability and moisture resistance, and an optical semiconductor device obtained using the composition. The purpose is to:

  Means for Solving the Problems The present inventors have conducted intensive studies on a resin composition of a light and thermosetting adhesive in order to solve the above problems, and as a result, have completed the present invention.

  The adhesive composition according to one embodiment of the present invention comprises [A] an epoxy resin having a bisphenol skeleton, [B] a dilutable monomer containing two or more types of alicyclic epoxy compounds having a cyclohexene oxide group, and [C] It contains a photocationic polymerization initiator containing a bissulfonium salt [C1] and a monosulfonium salt [C2], [D] a silane coupling agent, and [E] silica particles, and has a mass of [C1] and [C2]. The ratio is 3: 1 to 1: 1 and the content of [A] is 15 to 50 parts by mass with respect to 100 parts by mass of the total amount of [A] and [B], and [A], [ B], the content of [C] is 0.3 to 0.5 part by mass, and the content of [D] is 0.5 to 0.1 part by mass with respect to 100 parts by mass of the total amount of [C] and [D]. 8 parts by mass, and the content of [E] is 100 to 400 parts by mass.

  Advantageous Effects of Invention According to the present invention, it is possible to provide an adhesive composition having high adhesive strength, capable of exhibiting excellent mountability and moisture resistance, and an optical semiconductor device obtained using the composition. . More specifically, the adhesive composition according to the present invention, in a situation where the optical component / electronic component group is highly dense, even when the optical component is actively aligned at a predetermined location, with a smaller amount of ultraviolet light, The curing reaction required for the temporary fixing of the optical component proceeds, and the optical component can be provided with excellent optical characteristics with almost no mounting displacement due to additional ultraviolet irradiation or thermal curing.

  Hereinafter, embodiments for carrying out the present invention will be described in detail, but the present invention is not limited to the following embodiments.

  The ultraviolet-curable adhesive composition of the present embodiment comprises [A] an epoxy resin having a bisphenol skeleton, [B] an alicyclic epoxy compound containing two or more compounds having two or more cyclohexene oxide groups, and [C] ] A cationic photopolymerization initiator containing a bissulfonium salt [C1] and a monosulfonium salt [C2], [D] a silane coupling agent, and [E] silica particles. In the adhesive composition, the mass ratio of [C1] and [C2] is 3: 1 to 1: 3, and the total amount of [A] and [B] is 100 parts by mass; The content is 15 to 50 parts by mass, and the total content of [A], [B], [C] and [D] is 100 parts by mass, and the content of [C] is 0.3 to 0.5. Parts by mass, the content of [D] is 0.5 to 0.8 parts by mass, and the content of [F] is 100 to 400 parts by mass.

  The adhesive composition of the present embodiment, having the above-described configuration, has high adhesive strength, and can exhibit excellent mounting properties and moisture-proof properties.

(1) Component [A]
Component [A] is an epoxy resin having a bisphenol skeleton. The component [A] can provide the adhesive composition of the present embodiment with mechanical strength, durability, and the like necessary for fixing the optical component.

  Examples of the component [A] include a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol AD epoxy resin, a bisphenol S epoxy resin, and the like. These epoxy resins can be obtained by reacting bisphenol compounds such as bisphenol A, bisphenol F, bisphenol AD and bisphenol S with epichlorohydrin in the presence of an alkali catalyst. Among them, the component [A] preferably contains a bisphenol A type epoxy resin or a bisphenol F type epoxy resin, and more preferably contains a bisphenol A type epoxy resin.

  Examples of commercial products of the component [A] include YP-115, YP-127 and YP-128 manufactured by Nippon Steel & Sumitomo Metal Corporation; jER825, jER827, jER828, jER1001, jER1002, jER1003 and jER1055 manufactured by Mitsubishi Chemical Corporation. , JER1007, jER1009, jER1010, jER1256, jER4250, jER4275, jER1256B40 and the like.

  The weight average molecular weight (Mw) of the component [A] is preferably from 300 to 10,000, more preferably from 300 to 5,000, from the viewpoint of the curability and viscosity of the adhesive composition. The Mw of the component [A] can be measured using, for example, gel permeation chromatography (GPC).

(2) Component [B]
Component [B] is a dilutable monomer containing an alicyclic epoxy compound. Here, the dilutable monomer in the present embodiment refers to a component that can reduce the viscosity and improve the fluidity by being mixed into the adhesive composition.

  The alicyclic epoxy compound is a compound having an alicyclic structure and an epoxy group. As an alicyclic epoxy compound, for example, a compound having an epoxy group (alicyclic epoxy group) composed of two adjacent carbon atoms and oxygen atoms constituting an alicyclic ring, an epoxy group having a single bond directly to an alicyclic ring Compounds and the like that are bound are exemplified. The diluent monomer according to the present embodiment contains two or more types of alicyclic epoxy compounds having a cyclohexene oxide group.

The alicyclic epoxy compound according to the present embodiment may include a compound represented by the following formula (b1) from the viewpoint of the curing speed (high-precision mounting) and the moisture resistance of the adhesive composition.

X in the formula (1) represents a single bond, an ether bond (-O-), a thioether bond (-S-), or an alkylene group having 1 to 3 carbon atoms. The alkylene _{group, -CH 2 -, - CH (} CH 3) - or -C _{(CH 3) 2} - or a group represented by the.

The alicyclic epoxy compound according to the present embodiment is represented by the following formula (b2-1), (b2-2) or (b2-3) from the viewpoint of the curing speed (high-precision mounting) of the adhesive composition. May be included.

  From the viewpoint of achieving both high-density mounting and moisture resistance, a compound represented by the formula (b1) and a compound represented by the formula (b2-1), (b2-2) or (b2-3) are used in combination. Is preferred. As the compound represented by the formula (b1), for example, a commercially available product such as “CELLOXIDE 8000” (3,4,3 ′, 4′-diepoxybicyclohexane) manufactured by Daicel Corporation may be used. it can. Examples of the compound represented by the formula (b2-1), (b2-2) or (b2-3) include, for example, “Celoxide 2021P” (trade name, manufactured by Daicel Corporation) (3 ′, 4′-epoxycyclohexylmethyl 3) , 4-epoxycyclohexanecarboxylate) "and commercial products such as" Celoxide 2081 "([epsilon] -caprolactone-modified 3 ', 4'-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate). .

  The component [B] may contain another epoxy compound functioning as a diluent monomer together with the alicyclic epoxy compound. Other epoxy compounds include, for example, 2,2-bis (4-glycidyloxyphenyl) propane.

  The viscosity of the component [B] is preferably 0.1 to 1 Pa · s at 25 ° C.

(3) Component [C]
Component [C] is a cationic photopolymerization initiator that is a photopolymerization reaction initiator, and contains a bissulfonium salt [C1] and a monosulfonium salt [C2]. The cationic polymerization initiator according to this embodiment is an onium salt that releases a Lewis acid upon irradiation with energy rays. The bissulfonium salt [C1] and the monosulfonium salt [C2] are salts of a cation and an anion.

The cation of the component [C1] is a compound having two sulfonio groups. The sulfur atom constituting the sulfonio group is preferably bonded to an aromatic ring. The aromatic ring may be substituted by a fluorine atom, ethylene glycol, or the like. Examples of the aromatic ring include a benzene ring. Examples of the cation of the component [C1] include compounds represented by the following formulas (1) and (2).

成分〔Ｃ１〕と成分〔Ｃ２〕の陰イオンは、一般式：ＬＭ_ｂ ⁻で表すことができる。Ｌは、金属又は半金属であり、Ｂ、Ｐ、Ａｓ、Ｓｂ、Ｆｅ、Ｓｎ、Ｂｉ、Ａｌ、Ｃａ、Ｉｎ、Ｔｉ、Ｚｎ、Ｓｃ、Ｖ、Ｃｒ、Ｍｎ、Ｃｏ等の元素が挙げられる。Ｍは、ハロゲン原子であり、ｂは、３〜７の整数である。 The cation of the component [C2] is a compound having one sulfonio group. The sulfur atom constituting the sulfonio group is preferably bonded to an aromatic ring. The aromatic ring may be substituted by a fluorine atom or the like. Examples of the aromatic ring include a benzene ring. Examples of the cation of the component [C1] include compounds represented by the following formulas (3) and (4).

Anionic component [C1] and the component [C2] have the general formula: LM _b ^- can be represented by. L is a metal or metalloid, and examples thereof include elements such as B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, and Co. M is a halogen atom, and b is an integer of 3 to 7.

As anions, for example, tetrakis (pentafluorophenyl) borate, tetra (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroborate (BF ₄ ⁻ ), and hexafluorophosphate from the viewpoint of sensitivity and availability. (PF ₆ ⁻ ), hexafluoroantimonate (SbF ₆ ⁻ ), hexafluoroarsenate (AsF ₆ ⁻ ) and hexachloroantimonate (SbCl ₆ ⁻ ).

From the viewpoint of the liquid storage stability of the adhesive composition, the component [C1] may include at least one selected from the group consisting of compounds represented by the following formula (C1-1) or (C1-2). preferable.

From the viewpoint of the curing rate, the component [C2] preferably contains at least one selected from the group consisting of compounds represented by the following formula (C2-1) or (C2-2).

  The mass ratio ([C1]: [C2]) of the component [C1] and the component [C2] contained in the adhesive composition of the present embodiment is from 3: 1 to 1: 1. Component [C], which is a photocationic polymerization initiator, generally does not initiate a polymerization reaction unless a certain amount of ultraviolet light is irradiated. However, the component [C1] and the component [C2] have a difference in the cleavage reaction due to ultraviolet irradiation due to a difference in molecular structure. Therefore, when the same amount of ultraviolet light is irradiated, the component [C1] is more likely to be the component [C1]. As compared to C2], the amount of photoacid generated is higher, and the curing speed is higher. That is, in the component [C1], the cation portion absorbs ultraviolet light by irradiation with ultraviolet light to generate three radicals (two of which are ionic radicals), and photoacids are generated by the subsequent hydrogen abstraction reaction of the ionic radicals. I do. In the case of the component [C1], two molecules of photoacid are generated, and the curing speed is increased. On the other hand, the composition [C2] has a tendency to increase the viscosity of the composition because the cleavage reaction proceeds gradually even at room temperature due to ionic impurities. By setting the ratio [C1]: [C2] to 3: 1 to 1: 1, an appropriate curing speed can be obtained in the step of irradiating with ultraviolet rays.

  When preparing the adhesive composition of the present embodiment, the component [C] is dissolved in acetonitrile, propylene carbonate or the like for the purpose of improving the compatibility between the component [C] and the components [A] and [B]. You may use it.

(4) Component [D]
Component [D] is a silane coupling agent that is added to the adhesive composition of the present embodiment for the purpose of improving adhesion to a substrate or the like. As the component [D], for example, at least one silane coupling agent selected from the group consisting of vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane is preferable, and -Glycidoxypropyltrimethoxysilane is more preferred.

(5) Component [E]
Component [E] is silica particles. The component [E] is preferably selected in consideration of the compatibility with the resin component and the filling rate.

  As the component [E], particles in which an organic substance is coated on the outer periphery of silica fine particles may be used. The particle size of such silica particles may be from 0.01 to 10 μm. It is preferable to select the organic substance that coats the silica fine particles in consideration of compatibility with components contained in the adhesive composition. For example, in the case of silica particles whose outer periphery is coated with stearic acid, the degree of polarity of the components [A] and [B] constituting the base resin contained in the adhesive composition can be reduced because of high hydrophobicity. Further, as the component [E], silica particles not coated with an organic substance may be used. The silica particles may be of a fused type. When using silica particles that are not coated with an organic substance, there is a possibility that the viscosity of the adhesive composition may increase due to strong interaction between the silanol groups on the surface of the silica particles and the component (A). B] can be suppressed to an appropriate viscosity.

  The shape of the component [E] is preferably substantially spherical. The average particle diameter of the component [E] is preferably from 0.1 to 10 μm, more preferably from 3 to 5 μm. Commercially available products corresponding to the component [E] include, for example, fused silica (FB-SDC series) manufactured by Denka Corporation.

  The average particle diameter of the silica particles can be measured by a known technique (laser diffraction method / laser scattering method).

  In the present embodiment, in addition to the components (A) to (E) described above, the adhesive composition may further contain, if necessary, a thermal cationic polymerization initiator, a filler, an antifoaming agent, a leveling agent, a solvent, and the like. Good. In addition, from the viewpoint of increasing the adhesive strength after irradiation with ultraviolet rays, it is preferable to perform heat curing (80 to 120 ° C.) for a certain time (30 to 120 minutes).

  The content of the component [A] in the adhesive composition is 15 to 50 parts by mass, preferably 20 to 40 parts by mass, based on 100 parts by mass of the total of [A] and [B]. When the component [A] is less than 15 parts by mass, the toughness of the adhesive tends to be insufficient. On the other hand, when the component [A] is more than 50 parts by mass, Tg tends to decrease and heat resistance tends to decrease.

  The content of the component [B] in the adhesive composition is 50 to 85 parts by mass, preferably 60 to 80 parts by mass, based on 100 parts by mass of the total of the components [A] and [B]. When the component [B] is less than 50 parts by mass, it is difficult to obtain mechanical properties (Young's modulus) of a cured product of the adhesive composition, and it is difficult to maintain high curability. On the other hand, when the component [B] is more than 80 parts by mass, the surface hardness of the cured product of the adhesive composition tends to be high and brittle.

  From the viewpoint of improving the moisture resistance, when the component [B] contains the compound represented by the formula (b1) as an alicyclic epoxy compound, the content of the compound represented by the formula (b1) is determined by the content of the component [A ] And [B] may be 40 to 70 parts by mass with respect to 100 parts by mass in total.

  The content of the component [C] in the composition is 100 in total of [A], [B], [C] and [D] (hereinafter referred to as “components [A] to [D]”). The amount is from 0.3 to 0.5 part by mass, preferably from 0.35 to 0.45 part by mass, based on the parts by mass. When the amount of the component [C] is less than 0.3 parts by mass, the progress of the cationic polymerization reaction is slowed, and it becomes necessary to increase the irradiation time of the ultraviolet rays, which leads to a decrease in productivity. On the other hand, when the component [C] exceeds 0.5 parts by mass, an excess amount of photoacid is generated by irradiation with ultraviolet rays, and at the same time, a large amount of counter anions are generated in the adhesive, so that the amount of outgas generated increases. May adversely affect electronic components and optical components.

  The content of the component [D] in the composition is 0.5 to 0.8 part by mass with respect to 100 parts by mass of the total amount of the components [A] to [D], and is 0.55 to 0.75. Parts by weight are preferred. When the component [D] is less than 0.5 parts by mass, an appropriate adhesive force is not generated between the optical component and the mounting substrate for fixing the optical component. Peeling may occur. On the other hand, if the amount of the component [D] is more than 0.8 parts by mass, the components [D] may aggregate with each other to cause curing inhibition.

  The content of the component [E] in the composition is 100 to 400 parts by mass, preferably 150 to 300 parts by mass, based on 100 parts by mass of the total of the components [A] to [D]. When the content of the component [E] is less than 100 parts by mass, the mechanical properties (for example, the coefficient of linear expansion) of the cured product of the adhesive composition become insufficient, and the optical semiconductor using the adhesive composition It becomes difficult for the device to exhibit desired optical performance. On the other hand, when the component [E] is more than 400 parts by mass, the proportion of the silica particles in the adhesive composition becomes excessive, and it becomes difficult to generate necessary adhesive strength.

  The adhesive composition of the present embodiment preferably has a viscosity (resin viscosity) at room temperature (25 ° C.) of 5 to 50 Pa · s, and more preferably 10 to 40 Pa · s. The viscosity of the adhesive composition can be measured using a viscometer (for example, TV-22 viscometer manufactured by Toki Sangyo Co., Ltd.). The adhesive set composition of the present embodiment exhibits thixotropic properties (structural viscosity) by containing the above-mentioned components and having the above-mentioned viscosity. The thixotropic coefficient of the adhesive composition is preferably from 1.0 to 2.0 from the viewpoint of the form stability of the adhesive composition at the time of application.

  In order for the optical component to be fixed at a predetermined position on the mounting board with almost no displacement via the adhesive which is cured by the irradiation of the ultraviolet light, the contact between the optical component and the adhesive is caused by the curing shrinkage of the adhesive during the irradiation of the ultraviolet light. It is important that the stress generated on the surface does not become uneven. In order to prevent stress from becoming non-uniform, it is important to uniformly wet the bottom surface of the optical component with an adhesive without any gap. Also, when handling a plurality of optical components, the optical components to be mounted later provide a kind of shielding effect due to the presence of the optical component mounted earlier (although it is transparent), and the optical component mounted later is The adhesive strength required for temporarily fixing the component cannot be obtained, and the mounting accuracy may be reduced. Therefore, in order to obtain high mounting accuracy even with weak ultraviolet light, a material that has a mounting performance that can fix optical components at a predetermined mounting position even with weak light, that is, a material that has a high curing rate even under irradiation with low illuminance ultraviolet light is essential Becomes

  Furthermore, in addition to the mounting accuracy described above, with the shift from a metal housing to a plastic housing, the adhesive that has fixed the optical component also needs to be moisture resistant. That is, when the adhesive is exposed to a high-temperature and high-humidity environment, for example, if an adhesive containing a resin component having high hydrolyzability is used, the mounted optical component may be detached. Further, even if the resin does not become hydrolyzable, the use of a resin component having high hygroscopicity may cause the adhesive to swell, thereby lowering the fixing accuracy of the optical component.

  In view of the above problems, the present inventors have formulated a predetermined amount of specific components [A] to [D] as a base resin, and highly filled silica particles as the component [E], so that even when irradiated with ultraviolet light, We have succeeded in finding an adhesive that has high mounting durability and high durability even under high temperature and high humidity.

The optical semiconductor device of the present embodiment includes a mounting substrate and an optical component mounted on the mounting substrate via a cured product of the adhesive composition. Such an optical semiconductor device is specifically manufactured as follows. First, a mounting substrate is prepared, and an optical component having an adhesive composition applied to an adhesive surface is mounted on a predetermined position of the mounting substrate. Next, low-intensity ultraviolet rays (for example, 25 mW / cm ² ) are irradiated for a fixed time (for example, 15 to 30 seconds) to temporarily fix the optical components. Next, high-intensity ultraviolet rays (for example, 300 mW / cm ² ) are irradiated for a certain period of time (for example, 1 to 2 minutes) to permanently fix the optical component. Finally, predetermined thermal curing (for example, application temperature of 100 to 120 ° C. and leaving time of 1 to 3 hours) to release thermal strain due to ultraviolet irradiation and to improve adhesive strength between the mounting substrate and the adhesive composition. I do.

  Thereby, an optical semiconductor device including the mounting substrate and the optical component mounted on the mounting substrate with the cured product of the adhesive composition by ultraviolet curing can be obtained. The optical semiconductor device of the present embodiment has excellent moisture proof properties. In addition, examples of the mounting substrate include aluminum nitride, alumina, quartz, silicon, and the like. Further, examples of the optical semiconductor device include an optical transmitting and receiving module such as TOSA and ROSA.

  Hereinafter, the present invention will be described more specifically with reference to Examples, but the present invention is not limited to the following Examples.

[Preparation of adhesive composition]
(Example 1)
The following components were mixed and stirred to prepare a desired adhesive composition.
Component [A]: 40 parts by mass of bisphenol A type epoxy resin (jER828 / manufactured by Mitsubishi Chemical Corporation) Component [B1]: (3,4,3 ′, 4′-diepoxy) bicyclohexane (Celoxide 8000 / Daicel Corporation) 49 parts by mass of component [B2] 3 ', 4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (Celloxide 2021 / manufactured by Daicel Corporation) 10 parts by mass of component [C1]: bis [4- 0.25 parts by mass of (diphenylsulfonio) phenyl] sulfide hexafluoroantimonate Component [C2] (4-phenylthiophenyl) diphenylsulfonium 0.1 part by mass of hexfluoroantimonate Component [D]: 3-glycide Propyltrimethoxysiloxane (KBM403 / Shin-Etsu Chemical Co., Ltd. Company Ltd.) 0.65 parts by weight component (E): fused silica particles having an average particle diameter of 3 to 5 [mu] m (FB-SDC Series / Denka Co.) 200 parts by weight

(Examples 2 to 7 and Comparative Examples 1 to 7)
An adhesive composition was prepared in the same manner as in Example 1 except that the blending amount (parts by mass) of each component was changed as shown in Table 1 or Table 2.

[Various evaluations]
The following evaluations were performed on the adhesive compositions obtained in each of the examples and comparative examples. The evaluation results are summarized in Tables 1 and 2.

(1) Measurement of viscosity of composition After the prepared resin composition was left in a frozen environment for 24 hours, the adhesive composition was measured using a TV-22 viscometer (manufactured by Toki Sangyo Co., Ltd.). The viscosity (Pa · s) at 25 ° C. was measured at a rotor rotation speed of 5 rpm. The case where the viscosity was 10 to 40 Pa · s was “A”, and the case where the viscosity was less than 10 Pa · s or larger than 50 Pa · s was “C”.

(2) Optical axis displacement A light source (eg, a semiconductor laser) was placed on the positioning mark on the mounting board and fixed with solder or the like. Then, in consideration of the focal point of the collimator lens mounted on the mounting substrate, a fixed amount of the adhesive composition was applied to a predetermined position from the light source in the light emitting direction of the light source. Thereafter, the probe or the like was brought into contact with the light source, and in a state where a weak current was flowing, the collimating lens was gripped by the centering equipment, and the position was adjusted on the adhesive composition coated with the optical lens. At this time, the aspheric lens arranged near the emission end face of the laser light source converts the laser light emitted from the laser light source into parallel light, and the laser light converted into the parallel light flies in a space for a predetermined distance. (C3077-80 / Hamamatsu Photonics KK). The amount of displacement of the collimating lens was converted from the amount of change in the parallel light during ultraviolet irradiation obtained through the near infrared CCD camera. Prior to the conversion of the displacement amount, prior to fixing the adhesive composition by ultraviolet irradiation, the lens is operated and moved using a predetermined alignment device, and the displacement amount of the collimated light center displayed on the camera is read. Was. From the converted value of the read value, the displacement amount of the lens after the irradiation of the ultraviolet rays was calculated. The case where the displacement amount was less than 0.5 μm was “A”, the case where the displacement amount was 0.5 to 1.0 μm was “B”, and the case where the displacement amount exceeded 1.0 μm was “C”.

(3) Evaluation of Adhesive Strength After applying a predetermined amount of an adhesive composition (80 to 100 μg) on a predetermined mounting substrate (eg, alumina), optically using an alignment device (manufactured by Fukuko System Co., Ltd.) After the bottom part (1.0 × 0.6 mm) of the component (1.0 × 1.0 × 0.6 mm collimated lens / manufactured by Alps Electric Co., Ltd.) is brought into contact with the mounting substrate, ultraviolet rays are irradiated. Then, thermosetting was performed off-line to prepare a sample for evaluation. Next, using a predetermined die shear tester (manufactured by XYZTEC / CondorEZ series), the sample was measured for the breaking strength of a cured product of the adhesive composition in an atmosphere at a temperature of 25 ± 2 ° C. and a humidity of 50 ± 10%, The average value of the measured values was defined as the adhesive strength of the adhesive composition. The case where the adhesive force exceeded 2.0 kgf was designated as "A", the case where the adhesive force was 1.0 to 2.0 kgf was designated as "B", and the case where the adhesive force was less than 1.0 kgf was designated as "C".

(4) Evaluation of Moisture Resistance The sample for evaluation prepared in (3) was stored for 500 hours in a high temperature and high humidity (85 ° C., 85%) environment, and then the shear strength (adhesive strength) was measured. The value obtained by dividing the shear strength of the sample stored under high temperature and high humidity by the shear strength of the sample not stored under high temperature and high humidity was defined as the strength retention. The measuring method of the shear strength was in accordance with (3). The case where the strength retention was 60% or more was “A”, the case where the strength retention was 30% or more and less than 60% was “B”, and the case where the strength retention was less than 30% was “C”.

  The adhesive composition of the present invention is suitable for mounting an optical component constituting an optical transmission device on a predetermined mounting substrate.

  The adhesive composition of the present invention is suitably used when fixing a group of optical components mounted in an optical transmitting / receiving device on a predetermined substrate with high accuracy.

Claims (4)

(A) an epoxy resin having a bisphenol skeleton;
[B] a dilutable monomer containing two or more alicyclic epoxy compounds having a cyclohexene oxide group,
[C] a cationic photopolymerization initiator comprising a bissulfonium salt [C1] and a monosulfonium salt [C2];
[D] a silane coupling agent,
(E) silica particles,
Containing
Wherein the mass ratio of [C1] and [C2] is 3: 1 to 1: 1;
The content of (A) is 15 to 50 parts by mass with respect to 100 parts by mass of the total amount of (A) and (B),
[A], [B], [C] and the total amount of the [D] 100 parts by mass, the content of the [C] is 0.3 to 0.5 parts by mass, the [D ] Is 0.5 to 0.8 parts by mass, and the content of the above [E] is 100 to 400 parts by mass. [C1] contains at least one kind selected from compounds represented by the following formula (C1-1) or (C1-2), and [C2] represents the following formula (C2-2) or (C2- The adhesive composition according to claim 1, comprising at least one selected from the compounds represented by 2).

The adhesive composition according to claim 1, wherein the alicyclic epoxy compound includes a compound represented by the following formula (b1).

[X in the formula (b1) represents a single bond, an ether bond, a thioether bond, or an alkylene group having 1 to 3 carbon atoms. ]   An optical semiconductor device comprising: a mounting substrate; and an optical component mounted on the mounting substrate via a cured product of the adhesive composition according to claim 1.