JP2020025048A - Electronic component, manufacturing method thereof, and mounting method of electronic component - Google Patents

Abstract

To provide an electronic component which can easily attach a protective film so as to cover an opening, can use a storage container such as a general-purpose carrier tape, and can more easily peel off the protective film, a manufacturing method thereof, and a mounting method of the electronic component.SOLUTION: A protective film 1 for covering an opening 4 is attached to a surface of a package of an electronic component 10 in which a sensor chip 5 is sealed with a sealing resin 2. The protective film has a convex portion 7, and the convex portion is cut on a side surface of the electronic component to form a first void portion. Alternatively, a step is formed on the surface of the package of the electronic component, the protective film is attached to the surface, and then a second void portion is formed on the side surface of the electronic component by cutting. After the mounting, the first or second void portion is gripped with a tweezer or the like and then lifted to be separated.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component, a method for manufacturing the same, and a method for mounting the electronic component. In particular, the present invention relates to an electronic component having a protective film for closing an opening in an electronic component having an opening exposed to the outside in a state where a chip component such as a sensor element is packaged, a method for manufacturing the electronic component, and a method for mounting the electronic component. is there.

  In recent years, demand for various sensors has been increasing due to the mounting of such sensors on communication devices such as smartphones and tablet terminals, mounting on healthcare devices such as pedometers and activity meters, and an increase in sensors for in-vehicle and industrial devices. Increasingly, various sensors are being developed. For example, as a humidity sensor, in addition to a conventional resistance sensor, a capacitance sensor that can be widely used in an ambient temperature range has been developed. In the pressure sensor, a semiconductor strain gauge is formed on the surface of the diaphragm, and a resistance type that depends on a change in electric resistance due to a piezoresistance effect generated when the diaphragm is deformed by pressure, or a fixed electrode and a movable electrode are opposed to each other. 2. Description of the Related Art A capacitance-type sensor has been developed in which a capacitor to be disposed is formed, and a change in capacitance generated when a movable electrode is deformed by pressure is measured.

  Such a humidity sensor or a pressure sensor has an opening that mounts a sensor element in a package formed of ceramic or resin and exposes or communicates at least a part of a detection unit that measures a physical quantity to the outside. A package structure is employed (for example, Patent Document 1).

  When mounting an electronic component having such an opening on a mounting board, various problems occur. For example, when mounting an electronic component on a mounting board, it is common to use solder, and it is necessary to perform high-temperature processing for melting the solder. At that time, volatile components are emitted as outgas from the flux used together with the solder, and the entire electronic component is exposed to the outgas. Then, the outgas adheres to the sensor element exposed in the opening of the electronic component, thereby deteriorating the performance of the sensor.

  Therefore, for example, a method of closing the opening by applying a protective film to the opening of the electronic component has been adopted. Specifically, as shown in FIG. 11, a structure is adopted in which outgas does not enter the electronic component 30 by closing the opening 16 of the electronic component 30 with a heat-resistant protective film 15 such as a polyimide film. .

JP 2010-203857 A

  By the way, in the electronic component 30 with the protective film as shown in FIG. 11, it is necessary to peel off the protective film 15 after mounting on the mounting board. At this time, a part of the protective film is longer than the electronic component 30 so that the protective film 15 can be easily gripped. Therefore, when storing the electronic component 30 having such a structure in a container such as a carrier tape, it is necessary to prepare a storage container having a special shape corresponding to the protective film 15 protruding from the electronic component 30, and the production cost is reduced. Was causing the increase.

  In addition, the protective film 15 having the structure shown in FIG. 11 needs to be attached to each electronic component, which is a cause of deteriorating productivity.

  Therefore, the present invention provides an electronic component having an excellent productivity, in which an electronic component having an opening can be easily attached with a protective film so as to cover the opening, and a general-purpose storage container can be used. It is intended to provide a manufacturing method. It is still another object of the present invention to provide a method for mounting an electronic component that can easily remove a protective film during mounting.

  In order to achieve the above object, an electronic component according to claim 1 of the present application is an electronic component having a protective film attached to a surface, wherein a chip component mounted inside the electronic component and at least a part of the chip component are externally mounted. A package portion having an opening that is exposed or communicated with, and the protective film attached to the surface of the package portion and covering the opening portion and having a plurality of convex portions and formed on the surface of the package portion and the protective film. The electronic device further includes a first void portion that is opened on a side surface of the electronic component surrounded by an inner wall of the protrusion exposed from a cut portion of the at least one protrusion.

  An electronic component according to a second aspect of the present invention is the electronic component according to the first aspect, and has an opening on a side surface of the electronic component surrounded by a step formed on a part of the surface of the package portion and the protective film. It has a second void portion.

  According to a third aspect of the present invention, there is provided a method of manufacturing an electronic component, comprising a package having an opening through which at least a part of a chip component mounted inside is exposed or communicated to the outside, and a plurality of protrusions so as to cover the opening. A method of manufacturing an electronic component, comprising: attaching a protective film having a portion to a surface of the package portion, wherein each of the electronic components is cut by cutting the package portion and at least one of the protrusions of the protective film for individualization. Forming a first void portion surrounded by the surface of the package portion and an inner wall of the projection exposed by cutting the projection for each component.

  A method of manufacturing an electronic component according to a fourth aspect of the present invention is the method of manufacturing an electronic component according to the third aspect, wherein a concave portion is formed on the surface of the package portion, and the protection is provided on the surface of the package portion where the concave portion is formed. A step of forming a second void portion surrounded by the step portion and the protective film for each electronic component by attaching a film and cutting the concave portion and the protective film for singulation. It is characterized by including.

  The mounting method of an electronic component according to claim 5 of the present application includes a package unit having an opening in which at least a part of the chip component is exposed or communicated to the outside, and a plurality of the package units are closed so as to cover the opening on the surface of the package unit. A mounting method for mounting an electronic component on which a protective film having a convex portion is attached, on a mounting substrate, wherein after mounting the electronic component on a mounting substrate, peeling off the protective film, the package part surface and the protective film A first void portion opened on a side surface of the electronic component surrounded by an inner wall of the convex portion exposed from a cut portion of the at least one convex portion formed on at least a part of the surface of the package portion; By gripping the protective film of the second gap exposed on the side surface of the electronic component surrounded by the formed step portion and the protective film, and then pulling up, Characterized in that it comprises a step of peeling the serial protective film.

  In the electronic component of the present invention, since the opening of the electronic component is covered with the protective film, the sensor element and the like are exposed to the outgas even when the outgas released from the flux or the like due to the high-temperature treatment when mounted on the mounting board is generated. Therefore, the performance of the chip component does not deteriorate. Further, since the size of the protective film attached to the electronic component of the present invention is substantially equal to the size of the electronic component, a specially shaped storage container is not required, and the production cost does not increase.

  Further, according to the method for manufacturing an electronic component of the present invention, a protective film can be attached to the surface of an electronic component assembly including a plurality of electronic components at a time, so that a highly productive manufacturing method can be realized. Becomes

  Further, when the electronic component assembly is singulated, for example, even if a singulation method using a dicing saw is adopted, since the opening is closed with the protective film, cutting waste generated during singulation and Water and the like can be prevented from entering the inside of the electronic component from the opening, and a manufacturing method without deterioration of the quality of the electronic component can be realized.

  Furthermore, according to the electronic component mounting method of the present invention, since there is a gap opened on the side surface between the electronic component surface and the protective film attached to the surface, for example, the tip is securely protected by tweezers. The protective film can be easily removed by grasping the film and pulling it up. As a result, it is not necessary to use a long protective film as in the conventional example, a general-purpose storage container can be used, and there is no increase in production cost.

FIG. 2 is a diagram illustrating an electronic component according to a first embodiment of the present invention. FIG. 4 is a diagram illustrating a method for manufacturing an electronic component according to the first embodiment of the present invention. FIG. 4 is a diagram illustrating a method for manufacturing an electronic component according to the first embodiment of the present invention. FIG. 4 is a diagram illustrating a method for manufacturing an electronic component according to the first embodiment of the present invention. FIG. 2 is a diagram illustrating an electronic component according to a first embodiment of the present invention. FIG. 4 is a diagram illustrating a method for mounting an electronic component according to the first embodiment of the present invention. FIG. 6 is a diagram illustrating an electronic component according to a second embodiment of the present invention. FIG. 6 is a diagram illustrating a method for manufacturing an electronic component according to a second embodiment of the present invention. FIG. 6 is a diagram illustrating a method for manufacturing an electronic component according to a second embodiment of the present invention. FIG. 6 is a diagram illustrating an electronic component according to a second embodiment of the present invention. FIG. 9 is a diagram illustrating a conventional electronic component.

  According to the present invention, when an electronic component having an opening is mounted on a mounting board, the opening of the electronic component is closed with a protective film, so that the influence of outgas released from a flux or the like can be reliably prevented. Further, by providing a gap between the protective film and the electronic component by a convex portion of the protective film, the protective film can be easily peeled from the electronic component after the electronic component is mounted on the mounting board. Hereinafter, embodiments of the present invention will be described in detail with respect to an electronic component including a sensor element such as a humidity sensor and a pressure sensor, and the structure, manufacturing method, and mounting method thereof will be described in detail.

First, a first embodiment of the present invention will be described.
FIG. 1 is a sectional view of an electronic component 10 according to the first embodiment. The electronic component 10 has a sensor chip 5 (chip component) mounted therein. Electrode pads are formed on the surface of the sensor chip 5 and are connected to the leads 3 by metal wires 6. The opening 4 is provided so that a sensor part (not shown) of the sensor chip 5 is exposed from the sealing resin 2. Further, a protective film 1 is stuck on the surface side of the package portion where the opening 4 is provided, and the opening 4 is closed. Further, the protective film 1 of the present invention has a shape having a plurality of independent convex portions 7.

  When manufacturing an electronic component having such a structure, first, as shown in FIG. 2, an electronic component assembly 11 is formed. FIG. 2A is a top view of the electronic component assembly 11, and FIG. 2B is a cross-sectional view of the electronic component assembly 11 along the AA ′ plane in FIG. FIG. 2 shows an aggregate of four electronic components. A sensor portion is formed on the surface of the sensor chip 5, and has a structure exposed from the opening 4 to the outside of the sealing resin 2. Such an opening 4 can be formed by resin sealing using a sealing mold having a projection corresponding to the opening.

  Subsequently, as shown in FIG. 3, the protective film 1 is attached to the surface of the sealing resin 2. The protective film 1 is formed by embossing a heat-resistant film made of a polyimide resin or the like, and is attached to the surface of the sealing resin 2 so as to cover the opening 4. In order to improve the adhesion between the electronic component and the protective film 1, an adhesive layer such as a silicone resin is formed on the adhesive surface of the protective film 1 in advance. However, it is necessary to select an adhesive layer that does not generate outgas during the mounting step described later. FIG. 3 shows a structure in which the protrusions 7 are not arranged on the openings 4. However, if the protection film 1 has a structure in which a plurality of independent protrusions 7 are arranged, The opening 4 is closed by the protective film 1 even when the projection 7 is disposed on the projection 4.

  Subsequently, FIG. 4 shows a step of dividing the wafer into individual pieces. The surface of the protective film 1 opposite to the surface in contact with the sealing resin 2 is attached to a protective tape 8 such as a dicing tape. The adhesiveness between the protective film 1 and the sealing resin 2 or the protective tape 8 can be adjusted by appropriately setting the adhesive area between the protective film 1 and the sealing resin 2 or the protective tape 8.

  Next, the lead 3, the sealing resin 2, and a part of the protective film 1 are cut and removed from the lead 3 side by using a dicing saw 12 to singulate. Since the opening 4 is closed with the protective film 1 and the protective tape 8 in the singulation process, water used for singulation and cutting chips generated from a sealing resin, a lead frame, and the like are not used. Intrusion into the opening 4 can be prevented. For singulation, a method of irradiating a laser beam or the like may be used other than the method using a dicing saw.

FIG. 5 shows the electronic component after singulation. FIG. 5A is a top view of the electronic component 10, and FIG. 5B is a cross-sectional view of the electronic component 10 taken along a plane BB ′ in FIG. Illustration of the sensor chip 5 and the like is omitted.
In the present embodiment, the protruding portion 7 is cut in this singulation process. As a result, the cut surface of the protrusion 7 is arranged at the end of the electronic component 10 after the individualization, and the inner wall of the protrusion 7 is exposed. A space surrounded by the inner wall of the convex portion 7 and the sealing resin 2 becomes a first void portion 9a opened on the side surface of the electronic component 10.

  As shown in FIG. 5B, the formation of the first gap 9 a opening on the side surface of the electronic component 10 facilitates peeling of a protective film 1 described later. As described above, in the electronic component 10 of the present embodiment, the protective film 1 is attached to the electronic component assembly 11 and the protection film 1 and the electronic component assembly 11 are cut by the singulation process. The size is the same as the size of the electronic component 10. Therefore, for example, when storing in a container such as a carrier tape, a storage container such as a carrier tape having a general shape can be used.

  Next, a description will be given of a mounting method for mounting the electronic component 10 having the protective film 1 adhered to the surface thereof on a mounting board using a solder paste or the like. In accordance with a normal method for manufacturing an electronic component, a solder paste is formed on a connection electrode portion formed on a mounting board, and then the solder is melted using a reflow device to form a solder connection. At the time of this high-temperature heat treatment, the volatile component is released as an outgas from the flux contained in the solder paste. However, since the electronic component 10 covers the opening 4 with the protective film 1, the volatile component does not enter the opening. In addition, it is possible to prevent the performance of the chip component from lowering.

  Subsequently, the protective film 1 is peeled from the electronic component 10 mounted on the mounting board. Since the electronic component 10 has the first gap 9a opened on the side surface, a tip such as tweezers 13 is inserted into the first gap 9a (FIG. 6), and the protection film 1 is gripped. The protective film 1 can be easily peeled off from the electronic component 10 by pulling it up.

  Next, a second embodiment will be described. FIG. 7 shows an electronic component 20 according to the second embodiment. In the first embodiment, the first gap 9a is formed only by cutting the protective film 1, but in the second embodiment, a part of the surface of the sealing resin 2 is cut out to form the second gap 9a. The portion 9c is formed. By forming the second gap 9c, the protective film 1 can be more easily peeled off, and improvement in productivity is expected.

  The electronic component 20 has the sensor chip 5 mounted therein. Electrode pads are formed on the surface of the sensor chip 5 and are connected to the leads 3 by metal wires 6. An opening 4 is provided so that a sensor portion (not shown) of the sensor chip 5 is exposed from the sealing resin 2. At the end of the electronic component 20, a second gap 9c is provided between the protective film 1 and a part of the sealing resin 2. Further, a protective film 1 is adhered to the surface side of the sealing resin 2 provided with the opening 4 and the opening is closed. The size of the second gap 9c is not particularly limited, but may be any size that does not hinder the operation of peeling the protective film 1.

  When manufacturing an electronic component having such a structure, first, as shown in FIG. 8, an electronic component assembly 21 is formed. FIG. 8A is a top view of the electronic component assembly 21, and FIG. 8B is a cross-sectional view of the electronic component assembly 21 taken along the line CC ′ in FIG. FIG. 8 shows an aggregate of four electronic components. A sensor portion is formed on the surface of the sensor chip 5, and has a structure exposed from the opening 4 to the outside of the sealing resin 2. Further, on the surface of the sealing resin 2, a step portion 9 b in which a part of the sealing resin 2 is cut out in a concave shape is formed. The opening 4 and the step 9b can be formed by resin-sealing using a sealing mold having a projection corresponding to the opening and the step.

  Subsequently, as shown in FIG. 9, the protective film 1 is attached to the surface of the sealing resin 2. The protective film 1 is formed by embossing a heat-resistant film made of a polyimide resin or the like, and is attached to the surface of the sealing resin 2 having the opening 4 and the step 9b. Reference numeral 22 denotes an electronic component assembly. In order to improve the adhesion between the sealing resin 2 and the protective film 1, an adhesive layer such as a silicone resin is formed on the adhesive surface of the protective film 1 in advance. However, it is necessary to select an adhesive layer that does not generate outgas during the mounting step described later. FIG. 9 shows a structure in which the protrusions 7 are not arranged on the opening 4. Even when the protrusions 7 are arranged on the openings 4, the openings 4 are closed by the protective film 1. As a matter of course, the opening 4 and the step 9b do not communicate with each other via the projection 7.

  Subsequently, the electronic component 22 is attached to the protective tape 8 for singulation as in the first embodiment (not shown). The adhesiveness between the protective film 1 and the sealing resin 2 or the protective tape 8 can be adjusted by appropriately setting the adhesive area between the protective film 1 and the sealing resin 2 or the protective tape 8.

  Next, the lead 3, the sealing resin 2, and a part of the protective film 1 are cut and removed from the lead 3 side using a dicing saw, thereby performing individualization (corresponding to FIG. 4). Since the opening 4 is closed by the protective film 1 and the protective tape 8 in this singulation step, for example, water, sealing resin, lead frame, or the like used when singulation is performed using a dicing saw. The generated cutting chips can be prevented from entering the opening.

  In the present embodiment, the first gap 9a is formed by cutting the projection 7 as in the first embodiment. At the same time, by configuring the step 9b to be cut by the singulation, the cut surface of the step 9b is arranged at the end of the electronic component 20, and the inner wall of the step 9b is exposed. A space surrounded by the inner wall of the step 9b and the protective film 1 becomes a second gap 9c opening to the side surface of the electronic component 20.

  FIG. 10A is a top view of the electronic component 20, and it can be seen that the first gap 9a and the second gap 9c are formed. FIG. 10B is a cross-sectional view of the electronic component 20 along the DD ′ plane of FIG. 10A in which the first gap 9a and the second gap 9c are formed. The formation of the first gap 9a and the second gap 9c makes it easier to peel a protective film 1 described later. As described above, also in the electronic component 20 of the present embodiment, the size of the protection film 1 after the singulation is the same size as the electronic component. Therefore, for example, when storing in a container such as a carrier tape, a storage container such as a carrier tape having a general shape can be used.

  Subsequently, a mounting method for mounting the electronic component 20 on a mounting board using a solder paste or the like will be described. After a solder paste is formed on the leads 3 and the connection electrodes formed on the mounting board according to a normal method for manufacturing an electronic component, the solder connection is formed by melting the solder using a reflow device. At the time of this high-temperature heat treatment, a volatile component is emitted as an outgas from the flux contained in the solder paste. . In addition, the volatile component entering from the second gap 9c does not cause deterioration of the sensor element similarly to the volatile component entering the first gap 9a.

  Subsequently, the protective film 1 is peeled from the electronic component 20 mounted on the mounting board. Since the electronic component 20 has the first gap 9a or the second gap 9c at the end, a tip such as tweezers 13 is inserted into the first gap 9a or the second gap 9c. Then, the protective film 1 can be easily peeled off from the electronic component 20 by grasping and lifting the protective film 1 (corresponding to FIG. 6). Note that the first gap 9a and the second gap 9c may be configured to open at the same place. With such a configuration, there is also an advantage that the height of the projection 7 can be reduced.

  Although the embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to the above embodiments. For example, there is no particular limitation on the size of the protrusions formed on the protective film and the arrangement of adjacent protrusions. It is sufficient that the first gap 9a or the second gap 9c is formed at one end, and the first gap 9a or the second gap 9c is formed at a plurality of ends of the electronic component. The arrangement of the protrusions may be set as appropriate. The arrangement of the convex portions may be a lattice shape or a staggered shape. Further, the arrangement may be irregular.

  Also, the case where the sensor chip is mounted inside the electronic component has been described, but the present invention is not limited to this, and an electronic device having an opening formed so that the sensor chip mounted inside is exposed or communicates. It can be applied to parts.

1: protective film, 2: sealing resin, 3: lead, 4: opening, 5: sensor chip, 6: metal wire, 7: convex, 9a: first void, 9b: step, 9c: Second void portion, 10: electronic component, 11: electronic component assembly, 12: dicing saw, 20: electronic component, 21: electronic component assembly, 22: electronic component assembly

Claims (5)

In electronic parts with a protective film attached to the surface,
A chip component mounted inside the electronic component,
A package portion having an opening at least a part of the chip component is exposed or communicated to the outside,
Attached to the surface of the package unit, comprising the protective film having a plurality of convex portions while closing the opening,
A first void portion opening on a side surface of the electronic component surrounded by the package portion surface and an inner wall of the convex portion exposed from a cut portion of the at least one convex portion formed on the protective film; Electronic components characterized by the following.   2. The electronic component according to claim 1, further comprising a second gap that is opened on a side surface of the electronic component surrounded by a step formed on a part of the surface of the package and the protective film. 3. . At least a part of the chip component mounted therein has a package portion having an opening that is exposed or communicates with the outside,
A method for manufacturing an electronic component in which a protective film having a plurality of convex portions is attached to a surface of the package portion so as to cover the opening,
By cutting the package portion and at least one protrusion of the protective film for singulation, the surface of the package portion and the inner wall of the protrusion exposed by cutting the protrusion for each electronic component. Forming a first void portion surrounded by a circle.   By forming a concave portion on the surface of the package portion, attaching the protective film to the surface of the package portion where the concave portion is formed, and cutting the concave portion and the protective film for individualization, each electronic component 4. The method according to claim 3, further comprising the step of forming a second gap surrounded by the step and the protective film every time. At least a part of the chip component has a package portion having an opening that is exposed or communicated to the outside,
A mounting method for mounting an electronic component on which a protective film having a plurality of convex portions is attached so as to cover the opening on the surface of the package portion, on a mounting substrate,
After mounting the electronic component on a mounting board, when peeling off the protective film, the package portion surface and the inner wall of the convex portion exposed from the cut portion of at least one of the convex portions formed on the protective film. A first void portion opening on the side surface of the enclosed electronic component or a step exposed on a side surface of the electronic component surrounded by a step formed on a part of the surface of the package portion and the protective film; 2. A method for mounting an electronic component, comprising a step of removing the protective film by gripping and then pulling up the protective film in the void portion.

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