JP2020025011A - Manufacturing method for package substrate, substrate, and adhesive member - Google Patents

Abstract

To suppress a step between a device chip and a resin.SOLUTION: A manufacturing method for a package substrate includes: a substrate preparation step ST1 of preparing a substrate on which an adhesive member for fixing a diced device chip is laminated; a device chip fixing step ST3 of pressing multiple device chips to the adhesive member and fixing them to the substrate; a resin sealing step ST4 of sealing the device chip with a resin; and a substrate removing step ST5 of removing the substrate after implementing the resin sealing step ST4. The manufacturing method for the package substrate further includes a groove forming step ST2 of forming a groove having a depth and a width enough for cancelling a projection of the adhesive member generated at an outer edge of the device chip in the device chip fixing step ST3 at a position enclosing each of the device chips of the substrate, prior to the implementation of the resin sealing step ST4, and the device chip is fixed in a region divided by the groove in the device chip fixing step ST3.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for manufacturing a package substrate, a substrate, and an adhesive member.

  In order to reduce the size of a package device including a device chip, a semiconductor package technology called an eWLB (Embedded Wafer Level Ball Grid Array) has attracted attention (for example, see Patent Document 1). In the eWLB technology, when a device chip is fixed to a substrate made of stainless steel or the like on which an adhesive tape is installed, a device surface of the device chip is pressed against the adhesive tape in order to prevent a displacement of the device chip in a later process. It is common to fix.

  eWLB technology forms a rewiring layer on the device surface of a device chip after fixing the device chip to a substrate via an adhesive tape, molding the device chip with a resin, peeling the substrate together with the adhesive tape from the device chip, .

JP 2006-540389 A

  In the eWLB technology, when the device chip was fixed to the substrate via an adhesive tape, the device chip was sunk into the adhesive tape, and the adhesive tape of the sunk device chip was raised on the outer edge of the device chip and sealed with resin. At this time, a phenomenon occurs in which a step occurs between the edge of the device chip and the height of the upper surface of the molded resin.

  In the eWLB technique, when a step is generated between the edge of a device chip and the upper surface of the molded resin when sealing with a resin, the thickness of the rewiring layer is increased in a subsequent step of forming a rewiring layer. It is necessary to eliminate the step, which increases the cost and hinders miniaturization of the rewiring layer.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a method of manufacturing a package substrate, a substrate, and an adhesive member that can suppress a step between a device chip and a resin. It is.

  In order to solve the above-described problems and achieve the object, a method for manufacturing a package substrate according to the present invention is a method for manufacturing a package substrate, wherein an adhesive member for fixing an individualized device chip is laminated. A substrate preparation step of preparing a substrate to be prepared, a device chip fixing step of laminating the adhesive member on the substrate, pressing a plurality of the device chips against the adhesive member and fixing the device chip to the substrate, and fixing the device chip with a resin. A resin sealing step of sealing, and a substrate removing step of peeling the substrate after the resin sealing step is performed, wherein the swelling of the adhesive member generated on the outer edge of the device chip in the device chip fixing step is performed. Forming a groove having a depth and width to offset each other at a position surrounding each device chip on the substrate; In flop fixing step, characterized by fixing the device chip in the regions partitioned by the groove.

  The method for manufacturing a package substrate according to the present invention is a method for manufacturing a package substrate, wherein an adhesive member for preparing an adhesive member in which an adhesive layer for fixing individualized device chips is laminated on a base material layer is provided. A preparing step, a device chip fixing step of pressing the plurality of device chips against the adhesive layer and fixing the device chip to the adhesive member, a resin sealing step of sealing the device chip with a resin, and performing the resin sealing step And an adhesive member removing step of peeling the adhesive member later, wherein a groove having a depth and a width that offsets a bulge of the adhesive layer generated on an outer edge of the device chip in the device chip fixing step is formed by the adhesive layer. Forming a groove in an adhesive member formed at a position surrounding each of the device chips, wherein in the device chip fixing step, the adhesive member is Characterized by fixing the device chip in the regions partitioned by the groove.

  The substrate of the present invention is a substrate on which a plurality of individualized device chips are pressed against an adhesive member laminated on the surface to fix the device chip, and a position surrounding the device chip on the surface. A concave groove is formed from the surface.

  The adhesive member of the package substrate of the present invention includes a base layer and an adhesive layer laminated on the base layer, and a plurality of individualized device chips are pressed against the adhesive layer to form the device. An adhesive member for fixing a chip, wherein a groove recessed from the surface is formed at a position surrounding the device chip on the surface of the adhesive layer.

  The present invention has an effect that a step between the device chip and the resin can be suppressed.

FIG. 1 is a cross-sectional view of a main part of a package substrate manufactured by the method for manufacturing a package substrate according to the first embodiment. FIG. 2 is a flowchart illustrating a flow of the method of manufacturing the package substrate according to the first embodiment. FIG. 3 is a cross-sectional view showing a substrate preparing step of the method for manufacturing the package substrate shown in FIG. FIG. 4 is a cross-sectional view of a main part of the substrate after the groove forming step in the method of manufacturing the package substrate shown in FIG. FIG. 5 is a plan view of a main part of the substrate after the groove forming step in the method of manufacturing the package substrate shown in FIG. FIG. 6 is a cross-sectional view illustrating a state in which adhesive members are stacked in a device chip fixing step in the method of manufacturing the package substrate illustrated in FIG. FIG. 7 is a cross-sectional view showing a state in which device chips are fixed in a device chip fixing step of the method for manufacturing a package substrate shown in FIG. FIG. 8 is a cross-sectional view showing a resin sealing step of the method for manufacturing the package substrate shown in FIG. FIG. 9 is a cross-sectional view showing a substrate removing step of the method of manufacturing the package substrate shown in FIG. FIG. 10 is a cross-sectional view showing a step of forming a redistribution layer in the method of manufacturing the package substrate shown in FIG. FIG. 11 is a flowchart illustrating the flow of the method of manufacturing the package substrate according to the second embodiment. FIG. 12 is a cross-sectional view showing an adhesive member preparing step of the method for manufacturing the package substrate shown in FIG. FIG. 13 is a cross-sectional view of a main part of the adhesive member after the groove forming step in the method of manufacturing the package substrate shown in FIG. FIG. 14 is a plan view of a main part of the adhesive member after a groove forming step in the method of manufacturing the package substrate shown in FIG. FIG. 15 is a cross-sectional view showing a device chip fixing step of the method of manufacturing the package substrate shown in FIG. FIG. 16 is a cross-sectional view showing a resin sealing step of the method for manufacturing the package substrate shown in FIG. FIG. 17 is a cross-sectional view illustrating an adhesive member removing step of the method of manufacturing the package substrate illustrated in FIG. FIG. 18 is a cross-sectional view showing a step of forming a redistribution layer in the method of manufacturing the package substrate shown in FIG.

  An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the spirit of the present invention.

[Embodiment 1]
A method for manufacturing a package substrate and a substrate according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a main part of a package substrate manufactured by the method for manufacturing a package substrate according to the first embodiment. FIG. 2 is a flowchart illustrating a flow of the method of manufacturing the package substrate according to the first embodiment.

  The method for manufacturing the package substrate according to the first embodiment is a method for manufacturing the package substrate 1 shown in FIG. The package substrate 1 manufactured by the method for manufacturing a package substrate according to the first embodiment includes a plurality of device chips 2, a resin 3, and a rewiring layer 4, as shown in FIG.

  The plurality of device chips 2 are formed in a square planar shape, and are arranged at intervals 23 along two directions orthogonal to each other. In the first embodiment, the intervals 23 between the device chips 2 adjacent to each other are all equal. The device chip 2 is a highly integrated semiconductor. A semiconductor wafer or an optical device wafer based on silicon, sapphire, gallium, or the like is divided and divided into individual pieces, and various memories or LSIs (Large Scale Integration) are used. It constitutes. In the device chip 2, a plurality of electrodes 22 are provided on a lower surface 21 in FIG. 1, and an outer surface excluding the lower surface 21 is sealed with a resin 3.

  The rewiring layer 4 is provided on the lower surface 21 of the device chip 2 as shown in FIG. The rewiring layer 4 is provided commonly to the plurality of device chips 2. The rewiring layer 4 is a layer provided with wiring for electrically connecting the electrodes 22 of the device chip 2 and the printed wiring board on which the device chip 2 is mounted. Although FIG. 1 shows the rewiring layer 4 as one layer, in the present invention, the rewiring layer 4 connects the electrodes 22 of the device chip 2 and the wiring pattern of the printed wiring board in a desired pattern. It is formed in the shape which does.

  The package substrate 1 shown in FIG. 1 is divided for each device chip 2 and divided into individual package devices. The package device according to the first embodiment is a semiconductor called eWLB (Embedded Wafer Level Ball Grid Array), which is a form of a semiconductor component package that requires a small occupation area when a single device chip 2 is surface-mounted on a printed circuit board. The packaging technology was used.

  As shown in FIG. 2, the manufacturing method of the package substrate according to the first embodiment includes a substrate preparing step ST1, a groove forming step ST2, a device chip fixing step ST3, a resin sealing step ST4, and a substrate removing step ST5. And a rewiring layer forming step ST6.

(Substrate preparation step)
FIG. 3 is a cross-sectional view showing a substrate preparing step of the method for manufacturing the package substrate shown in FIG. The substrate preparing step ST1 is a step of preparing the substrate 10 shown in FIG.

  In the first embodiment, the substrate 10 is formed in a plate shape in which the planar shape is equal to or larger than the planar shape of the package substrate 1 and both surfaces 101 and 102 are formed in parallel with each other. I have. In the first embodiment, the substrate 10 is made of a hard material having no flexibility. The substrate 10 has an adhesive member 11 shown in FIG. In the substrate 10, the lower surface 21 of the device chip 2 is provided on one surface 101 via the adhesive member 11. In a plan view, the position where the device chip 2 is provided with respect to the substrate 10 is predetermined. That is, the interval 23 between the device chips 2 adjacent to each other on the substrate 10 is predetermined. In the method for manufacturing a package substrate according to the first embodiment, when the substrate 10 is prepared in the substrate preparing step ST1, the process proceeds to the groove forming step ST2.

(Groove forming step)
FIG. 4 is a cross-sectional view of a main part of the substrate after the groove forming step in the method of manufacturing the package substrate shown in FIG. FIG. 5 is a plan view of a main part of the substrate after the groove forming step in the method of manufacturing the package substrate shown in FIG. The groove forming step ST2 is a step of forming a groove 12 on one surface 101 of the substrate 10 at a position surrounding each device chip 2 in a plan view of the substrate 10 before the resin sealing step ST4 is performed.

  The groove forming step ST2 includes an ablation process of irradiating a laser beam to one surface 101, a cutting process of cutting a cutting blade into one surface 101, or a cutting process between device chips 2 adjacent to each other on one surface 101 of the substrate 10. As shown in FIG. 4, a groove 12 is formed by an etching process for etching a position. Further, in the first embodiment, as shown in FIG. 5, the groove forming step ST2 forms the grooves 12 on one surface 101 of the substrate 10 in a lattice shape, and the grooves 12 are adjacent to each other on one surface 101 in plan view. A groove 12 is formed between the matching device chips 2. In the first embodiment, the width 122 of the groove 12 is equal to the interval 23 between the device chips 2.

  Further, in the groove forming step ST2, if the adhesive member 11 is laminated on one surface 101 without forming the groove 12 in the substrate 10, the adhesive member 11 formed on the outer edge of the device chip 2 in the device chip fixing step ST3. The groove 12 having a depth 121 and a width 122 for canceling the swelling is formed. That is, the depth 121 and the width 122 of the groove 12 formed in the groove forming step ST2 are determined by the device chip fixing step when the adhesive member 11 is laminated on one surface 101 without forming the groove 12 in the substrate 10. This value offsets the swelling of the adhesive member 11 that occurs at the outer edge of the device chip 2 in ST3. In the first embodiment, the depth 121 and the width 122 of the groove 12 are different from those of the device chip 2 in the device chip fixing step ST3 when the adhesive member 11 is laminated on one surface 101 without forming the groove 12 in the substrate 10. Is set to a value equivalent to the protrusion amount and width of the bulge of the adhesive member 11 generated at the outer edge of the lower surface 21.

  As described above, the substrate 10 after the groove forming step ST2 fixes the device chip 2 by pressing the plurality of individualized device chips 2 against the adhesive member 11 laminated on one surface 101. In addition, a groove 12 which is concave from one surface 101 is formed at a position surrounding the device chip 2 on one surface 101. In the method of manufacturing the package substrate according to the first embodiment, when the groove 12 is formed on one surface 101 of the substrate 10 in the groove forming step ST2, the process proceeds to a device chip fixing step ST3.

(Device chip fixing step)
FIG. 6 is a cross-sectional view illustrating a state in which adhesive members are stacked in a device chip fixing step of the method of manufacturing the package substrate illustrated in FIG. FIG. 7 is a cross-sectional view showing a state in which device chips are fixed in a device chip fixing step of the method for manufacturing a package substrate shown in FIG.

  The device chip fixing step ST3 is a step of laminating the adhesive member 11 on one surface 101 of the substrate 10, pressing the plurality of device chips 2 against the adhesive member 11, and fixing the device chip 2 to the substrate 10.

  The adhesive member 11 is for fixing the singulated device chip 2 to the substrate 10. In the first embodiment, the adhesive member 11 includes a base layer made of a synthetic resin, and an adhesive layer laminated on both surfaces of the base layer. In the present invention, the configuration of the adhesive member 11 is as follows. It is not limited to. The adhesive member 11 has a planar shape equal to or greater than the planar shape of the package substrate 1, and one adhesive layer is attached to one surface 101 of the substrate 10.

  In the device chip fixing step ST3, one adhesive layer of the adhesive member 11 is attached to the one surface 101, and the entire one adhesive layer is attached tightly to the entire one surface 101. Since the adhesive member 11 laminated on one surface 101 of the substrate 10 has the groove 12 formed on one surface 101, the adhesive member 11 is deformed following the groove 12 as shown in FIG. A groove 13 will be formed in the layer. Since one adhesive layer of the adhesive member 11 is closely adhered to the entire one surface 101, the depth 131 of the groove 13 is equal to the depth 121 of the groove 12, and the width 132 of the groove 13 is Is equivalent to the width 122.

  In the device chip fixing step ST3, the lower surface of each device chip 2 is attached to the other adhesive layer of the adhesive member 11 on the position where the predetermined device chip 2 is disposed on one surface 101 of the substrate 10 in plan view. 21, the device chip 2 is fixed on one surface 101 of the substrate 10 via the adhesive member 11 as shown in FIG. Further, in the first embodiment, in the device chip fixing step ST3, the lower surface 21 of the device chip 2 is pressed against the area of the adhesive member 11 defined by the groove 13 on the groove 12 of the substrate 10 to attach each device chip 2 to the substrate. Fix to 10.

  The groove 13 is formed in the other adhesive layer of the adhesive member 11 laminated on the substrate 10, and the depths 121 and 131 and the widths 122 and 132 of the grooves 12 and 13 are formed to the values described above. When the device chip 2 is pressed against the other adhesive layer of the adhesive member 11, the adhesive member 11 between the device chips 2 is flush with the lower surface 21 of the device chip 2, as shown in FIG. In the method for manufacturing a package substrate according to the first embodiment, when all the device chips 2 constituting the package substrate 1 are fixed to the substrate 10 in the device chip fixing step ST3, the process proceeds to a resin sealing step ST4.

(Resin sealing step)
FIG. 8 is a cross-sectional view showing a resin sealing step of the method for manufacturing the package substrate shown in FIG. The resin sealing step ST4 is a step of sealing the plurality of device chips 2 fixed to the substrate 10 with the resin 3.

  In the resin sealing step ST4, as shown in FIG. 8, the entire substrate 10 is covered with the resin 3, and the outer surface other than the lower surface 21 of the device chip 2 is covered with the resin 3. The chip 2 is embedded and the resin 3 is cured. In the resin sealing step ST4, the cured resin 3 is removed from the device chips 2 because the adhesive members 11 between the device chips 2 are flush with the lower surfaces 21 of the device chips 2 in the device chip fixing step ST3. The resin 3 is flush with the lower surface 21 of the device chip 2. In the method of manufacturing the package substrate according to the first embodiment, when all the device chips 2 fixed to the substrate 10 are sealed with the resin 3 in the resin sealing step ST4, the process proceeds to the substrate removing step ST5.

(Substrate removal step)
FIG. 9 is a cross-sectional view showing a substrate removing step of the method of manufacturing the package substrate shown in FIG. The substrate removing step ST5 is a step of removing the substrate 10 after performing the resin sealing step ST4.

  In the substrate removing step ST5, as shown in FIG. 9, the adhesive member 11 is peeled off together with the substrate 10 from the lower surface 21 of the device chip 2 and the resin 3 between the device chips 2, and the lower surface 21 of the device chip 2 and the electrodes 22 are separated. Expose. In the method for manufacturing a package substrate according to the first embodiment, when the adhesive member 11 is peeled off from the device chip 2 and the resin 3 together with the substrate 10 in the substrate removing step ST5, the process proceeds to a rewiring layer forming step ST6.

(Rewiring layer forming step)
FIG. 10 is a cross-sectional view showing a step of forming a redistribution layer in the method of manufacturing the package substrate shown in FIG. The rewiring layer forming step ST6 is a step of laminating the rewiring layer 4 on the lower surface 21 of the device chip 2 after performing the substrate removing step ST5.

  In the rewiring layer forming step ST6, as shown in FIG. 10, the lower surface 21 of the device chip 2 sealed with the resin 3 and the rewiring layer 4 made of a conductive metal are laminated on the resin 3. The method of manufacturing the package substrate according to the first embodiment ends when the rewiring layer 4 is stacked on the lower surface 21 of the device chip 2 in the rewiring layer forming step ST6 to obtain the package substrate 1. In the present invention, in the rewiring layer forming step ST6, the rewiring layer 4 may be formed in a shape that connects the electrodes 22 of the device chip 2 and the wiring pattern of the printed wiring board in a desired pattern.

  As described above, in the manufacturing method of the package substrate according to the first embodiment, the groove 12 is formed at the position between the device chips 2 on the one surface 101 of the substrate 10 in the groove forming step ST2. In ST3, even if the device chip 2 is pressed against one adhesive layer of the adhesive member 11, the surface of the adhesive member 11 is flush with the lower surface 21 of the device chip 2 between the device chips 2. As a result, the method of manufacturing the package substrate has an effect that a step between the device chip 2 and the resin 3 of the package substrate 1 can be suppressed.

  In the method of manufacturing the package substrate according to the first embodiment, since the depth 121 and the width 122 of the groove 12 are values that offset the rise of the adhesive member 11, the step between the resin 3 and the device chip 2 is further suppressed. You can do it.

  Further, the substrate 10 after the groove forming step ST2 of the method for manufacturing a package substrate according to the first embodiment has the concave groove 12 formed on one surface 101 at a position surrounding the device chip 2; This has the effect that the step between the device chip 2 and the resin 3 can be suppressed.

[Embodiment 2]
A method for manufacturing a package substrate and a substrate according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 11 is a flowchart illustrating the flow of the method of manufacturing the package substrate according to the second embodiment. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description is omitted.

  The method of manufacturing the package substrate according to the second embodiment is a method of manufacturing the package substrate 1 as in the first embodiment. As shown in FIG. 11, an adhesive member preparing step ST11, a groove forming step ST12, The method includes a device chip fixing step ST13, a resin sealing step ST14, an adhesive member removing step ST15, and a rewiring layer forming step ST16.

(Adhesive member preparation step)
FIG. 12 is a cross-sectional view showing an adhesive member preparing step of the method for manufacturing the package substrate shown in FIG. The adhesive member preparing step ST11 is a step of preparing the adhesive tape 15 which is the adhesive member shown in FIG.

  In the second embodiment, the adhesive tape 15 is formed in a plate shape having a planar shape equal to the planar shape of the package substrate 1, and includes a flat base material layer 16 and an adhesive layer 17 laminated on the base material layer 16. Thus, the adhesive layer 17 is laminated on the base material layer 16. The base layer 16 is made of a synthetic resin having flexibility, and the adhesive layer 17 is made of a synthetic resin having adhesive property. The surface 161 of the base layer 16 and the surface 171 of the adhesive layer 17 are formed parallel to each other. The adhesive layer 17 is for fixing the plurality of individualized device chips 2 to the adhesive tape 15. In a plan view, the position at which the device chip 2 is provided with respect to the adhesive tape 15 is predetermined. That is, the interval 23 between the device chips 2 adjacent to each other in the adhesive tape 15 is predetermined. In the method for manufacturing a package substrate according to the second embodiment, when the adhesive tape 15 is prepared in the adhesive member preparing step ST11, the process proceeds to the groove forming step ST12. In the present invention, the state in which the adhesive tape 15 includes the adhesive layers 17 on both sides of the base material layer 16 and is fixed on the substrate 10 as in the first embodiment may be regarded as an adhesive member preparing step ST11.

(Groove forming step)
FIG. 13 is a cross-sectional view of a main part of the adhesive member after the groove forming step in the method of manufacturing the package substrate shown in FIG. FIG. 14 is a plan view of a main part of the adhesive member after a groove forming step in the method of manufacturing the package substrate shown in FIG. The groove forming step ST12 is a step of forming the groove 18 on the surface 171 of the adhesive layer 17 at a position surrounding each device chip 2 in a plan view of the adhesive tape 15 before the resin sealing step ST14 is performed.

  The groove forming step ST12 includes an ablation process of irradiating the surface 171 of the adhesive layer 17 of the adhesive tape 15 with a laser beam, a cutting process of cutting a cutting blade into the surface 171 of the adhesive layer 17 of the adhesive tape 15, or a process of cutting the adhesive tape 15. As shown in FIG. 13, a groove 18 is formed by an etching process for etching a position between the device chips 2 adjacent to each other on the surface 171 of the adhesive layer 17. Further, in the second embodiment, as shown in FIG. 14, in the groove forming step ST12, the grooves 18 are formed in a lattice pattern on the surface 171 of the adhesive layer 17, and the device chips adjacent to each other on the surface 171 in plan view are formed. A groove 18 is formed at a position between the two. In the second embodiment, the width 182 of the groove 18 is equal to the interval 23 between the device chips 2.

  In the groove forming step ST12, if the groove 18 is not formed on the surface 171 of the adhesive layer 17, the depth 181 and the width 182 cancel the bulge of the adhesive layer 17 generated on the outer edge of the device chip 2 in the device chip fixing step ST13. Is formed. That is, the depth 181 and the width 182 of the groove 18 formed in the groove forming step ST12 are determined by the adhesive generated on the outer edge of the device chip 2 in the device chip fixing step ST13 if the groove 18 is not formed on the surface 171 of the adhesive layer 17. This value offsets the swelling of the layer 17. In the second embodiment, the depth 181 and the width 182 of the groove 18 correspond to the bulge of the adhesive layer 17 generated at the outer edge of the device chip 2 in the device chip fixing step ST13 if the groove 18 is not formed on the surface 171 of the adhesive layer 17. It is set to a value equivalent to the amount of protrusion from the lower surface 21 and the width.

  As described above, the adhesive tape 15 as the adhesive member after the groove forming step ST12 includes the base layer 16 and the adhesive layer 17 laminated on the base layer 16, and includes a plurality of individualized devices. The chip 2 is pressed against the adhesive layer 17 to fix the device chip 2, and a concave groove 18 is formed on the surface 171 of the adhesive layer 17 at a position surrounding the device chip 2. I have. In the manufacturing method of the package substrate according to the second embodiment, when the groove 18 is formed on the surface 171 of the adhesive layer 17 of the adhesive tape 15 in the groove forming step ST12, the process proceeds to a device chip fixing step ST13.

(Device chip fixing step)
FIG. 15 is a cross-sectional view showing a device chip fixing step of the method of manufacturing the package substrate shown in FIG. The device chip fixing step ST13 is a step of pressing the plurality of device chips 2 against the adhesive layer 17 and fixing the plurality of device chips 2 to the adhesive tape 15.

  In the device chip fixing step ST13, the lower surface 21 of each device chip 2 is pressed to a position where the predetermined device chip 2 is disposed on the surface 171 of the adhesive layer 17 of the adhesive tape 15 in a plan view, as shown in FIG. As shown, the device chip 2 is fixed on the surface 171 of the adhesive layer 17 of the adhesive tape 15. In the second embodiment, in the device chip fixing step ST13, the lower surface 21 of the device chip 2 is pressed into a region defined by the groove 18 of the adhesive tape 15 and surrounded by the groove 18 so that each device chip 2 is attached to the adhesive tape 15. Fixed to.

  In the groove forming step ST12, the groove 18 is formed on the surface 171 of the adhesive layer 17 of the adhesive tape 15, and the depth 181 and the width 182 of the groove 18 are formed to the values described above. When the device chip 2 is pressed against the surface 171 of the layer 17, the adhesive layer 17 between the device chips 2 is flush with the lower surface 21 of the device chip 2 as shown in FIG. In the method for manufacturing a package substrate according to the second embodiment, when all the device chips 2 constituting the package substrate 1 are fixed to the adhesive tape 15 in the device chip fixing step ST13, the process proceeds to a resin sealing step ST14.

(Resin sealing step)
FIG. 16 is a cross-sectional view showing a resin sealing step of the method for manufacturing the package substrate shown in FIG. The resin sealing step ST14 is a step of sealing the plurality of device chips 2 fixed to the adhesive tape 15 with the resin 3.

  In the resin sealing step ST14, as shown in FIG. 16, the entire adhesive layer 17 of the adhesive tape 15 is covered with the resin 3, and the outer surface other than the lower surface 21 of the device chip 2 is covered with the resin 3. A plurality of device chips 2 are embedded in the inside, and the resin 3 is cured. In the resin encapsulation step ST14, the cured resin 3 is filled with the resin between the device chips 2 because the adhesive layer 17 between the device chips 2 is flush with the lower surface 21 of the device chip 2 in the device chip fixing step ST13. 3 is flush with the lower surface 21 of the device chip 2. In the method of manufacturing the package substrate according to the second embodiment, when all the device chips 2 fixed to the substrate 10 are sealed with the resin 3 in the resin sealing step ST14, the process proceeds to the adhesive member removing step ST15.

(Adhesive member removal step)
FIG. 17 is a cross-sectional view illustrating an adhesive member removing step of the method of manufacturing the package substrate illustrated in FIG. The adhesive member removing step ST15 is a step of peeling off the adhesive tape 15 after performing the resin sealing step ST14.

  In the adhesive member removing step ST15, as shown in FIG. 17, the adhesive tape 15 is peeled from the lower surface 21 of the device chip 2 and the resin 3 between the device chips 2 to expose the lower surface 21 of the device chip 2 and the electrodes 22. . In the method for manufacturing a package substrate according to the second embodiment, when the adhesive tape 15 is separated from the device chip 2 and the resin 3 in the adhesive member removing step ST15, the process proceeds to a rewiring layer forming step ST16.

(Rewiring layer forming step)
FIG. 18 is a cross-sectional view showing a step of forming a rewiring layer in the method of manufacturing the package substrate shown in FIG. The rewiring layer forming step ST16 is a step of laminating the rewiring layer 4 on the lower surface 21 of the device chip 2 after performing the substrate removing step ST5.

  In the rewiring layer forming step ST16, as shown in FIG. 18, the rewiring layer 4 made of a conductive metal is laminated on the lower surface 21 of the device chip 2 sealed with the resin 3 and the resin 3. The method of manufacturing the package substrate according to the first embodiment ends when the rewiring layer 4 is stacked on the lower surface 21 of the device chip 2 in the rewiring layer forming step ST16. In the present invention, in the rewiring layer forming step ST16, the rewiring layer 4 may be formed in a shape that connects the electrodes 22 of the device chip 2 and the wiring pattern of the printed wiring board in a desired pattern.

  As described above, the manufacturing method of the package substrate according to the second embodiment forms the groove 18 at the position between the device chips 2 on the surface 171 of the adhesive layer 17 of the adhesive tape 15 in the groove forming step ST12. In the chip fixing step ST3, even if the device chip 2 is pressed against the adhesive layer 17 of the adhesive tape 15, the surface 171 of the adhesive layer 17 is flush with the lower surface 21 of the device chip 2 between the device chips 2. As a result, the method of manufacturing the package substrate has an effect that a step between the device chip 2 and the resin 3 of the package substrate 1 can be suppressed.

  In the method of manufacturing the package substrate according to the second embodiment, since the depth 181 and the width 182 of the groove 18 are values that offset the rise of the adhesive layer 17, the step between the resin 3 and the device chip 2 is further suppressed. I can do it.

  The adhesive tape 15 after the groove forming step ST2 of the method for manufacturing a package substrate according to the second embodiment has a groove 18 recessed from the surface 171 at a position surrounding the device chip 2 on the surface 171 of the adhesive layer 17. Therefore, there is an effect that a step between the device chip 2 of the package substrate 1 and the resin 3 can be suppressed.

  Note that the present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Package board 2 Device chip 3 Resin 10 Substrate 11 Adhesive member 12, 18 Groove 15 Adhesive tape (adhesive member)
16 Base material layer 17 Adhesive layer 101 One surface (surface)
121,181 Depth 122,182 Width 171 Surface ST1 Substrate preparation step ST2, ST12 Groove formation step ST3, ST13 Device chip fixing step ST4, ST14 Resin sealing step ST5 Substrate removal step ST11 Adhesive member preparation step ST15 Adhesive member removal Steps

Claims (4)

A method of manufacturing a package substrate, comprising:
A substrate preparation step of preparing a substrate on which an adhesive member for fixing the singulated device chip is laminated,
A device chip fixing step of laminating the adhesive member on the substrate and pressing a plurality of the device chips against the adhesive member to fix the device chip to the substrate;
A resin sealing step of sealing the device chip with a resin,
A substrate removing step of peeling the substrate after performing the resin sealing step,
The device chip fixing step further includes a substrate groove forming step of forming a groove having a depth and a width at a position surrounding each device chip of the substrate to offset a bulge of the adhesive member generated at an outer edge of the device chip. Prepared,
In the device chip fixing step,
Fixing the device chip in an area defined by the groove,
Manufacturing method of package substrate. A method of manufacturing a package substrate, comprising:
An adhesive member preparation step of preparing an adhesive member in which an adhesive layer for fixing the singulated device chip is laminated on the base material layer,
A device chip fixing step of pressing a plurality of the device chips against the adhesive layer and fixing the device chip to the adhesive member;
A resin sealing step of sealing the device chip with a resin,
An adhesive member removing step of peeling the adhesive member after performing the resin sealing step,
Forming a groove of a depth and a width at a position surrounding each device chip of the adhesive layer to offset a bulge of the adhesive layer generated at an outer edge of the device chip in the device chip fixing step; Further comprising
In the device chip fixing step,
Fixing a device chip in a region defined by the groove of the adhesive member,
Manufacturing method of package substrate. A plurality of individualized device chips are pressed against the adhesive member laminated on the surface, and a substrate for fixing the device chips,
A substrate, wherein a groove recessed from the surface is formed at a position on the surface surrounding the device chip. A substrate member, comprising an adhesive layer laminated on the substrate layer, and a plurality of individualized device chips are pressed against the adhesive layer, an adhesive member for fixing the device chip,
A pressure-sensitive adhesive member, wherein a concave groove is formed on the surface of the pressure-sensitive adhesive layer at a position surrounding the device chip.

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