JP2020013130A - 基板処理方法 - Google Patents
基板処理方法 Download PDFInfo
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- JP2020013130A JP2020013130A JP2019132911A JP2019132911A JP2020013130A JP 2020013130 A JP2020013130 A JP 2020013130A JP 2019132911 A JP2019132911 A JP 2019132911A JP 2019132911 A JP2019132911 A JP 2019132911A JP 2020013130 A JP2020013130 A JP 2020013130A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02101—Cleaning only involving supercritical fluids
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
1000 インデックスモジュール
2000 工程モジュール
3000 液処理チャンバー
3010 第1液処理チャンバー
3020 第2液処理チャンバー
4000 高圧チャンバー
Claims (11)
- 露光処理及びポストベーク処理された基板に対して現像流体を塗布して現像処理する段階と、
現像処理された基板に対してリンス流体を塗布する段階と、
前記リンス流体が塗布された基板を高圧チャンバーに移動させて超臨界流体を利用して処理する段階と、
を遂行する基板処理方法。 - 前記リンス流体は、フルオロ化水素エーテル(HYDROFLUOROETHER;HFE)である請求項1に記載の基板処理方法。
- 前記リンス流体は、N−ブチルアセテート(N−BUTYL ACETATE)である請求項1に記載の基板処理方法。
- 前記リンス流体は、2−ヘプタノン(2−HEPTANONE)である請求項1に記載の基板処理方法。
- 前記リンス流体は、イソプロパノールアルコール(IPA)である請求項1に記載の基板処理方法。
- 前記現像流体は、ネガティブ感光液の現像に使用される請求項1に記載の基板処理方法。
- 前記現像流体は、N−ブチルアセテート(N−BUTYL ACETATE)又はイソプロパノールアルコール(IPA)である請求項1に記載の基板処理方法。
- 前記超臨界流体は、二酸化炭素である請求項1に記載の基板処理方法。
- 露光処理及びポストベーク処理された基板を第1チャンバーに移送する段階と、
前記第1チャンバーで現像流体を塗布して現像処理する段階と、
前記現像処理された基板を第2チャンバーに移送する段階と、
前記第2チャンバーでリンス流体を塗布する段階と、
前記リンス流体が塗布された基板を高圧チャンバーに移動させる段階と、
前記高圧チャンバーで超臨界流体を利用して処理する段階と、
を遂行する基板処理方法。 - 前記リンス流体は、フルオロ化水素エーテル(HYDROFLUOROETHER;HFE)、N−ブチルアセテート(N−BUTYL ACETATE)、2−ヘプタノン(2−HEPTANONE)、又はイソプロパノールアルコール(IPA)の中から選択される請求項9に記載の基板処理方法。
- 前記現像流体は、N−ブチルアセテート(N−BUTYL ACETATE)又はイソプロパノールアルコール(IPA)である請求項9に記載の基板処理方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021078383A JP2021122058A (ja) | 2018-07-20 | 2021-05-06 | 基板処理方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180084781A KR20200009841A (ko) | 2018-07-20 | 2018-07-20 | 기판 처리 방법 |
KR10-2018-0084781 | 2018-07-20 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021078383A Division JP2021122058A (ja) | 2018-07-20 | 2021-05-06 | 基板処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2020013130A true JP2020013130A (ja) | 2020-01-23 |
Family
ID=69162995
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2019132911A Ceased JP2020013130A (ja) | 2018-07-20 | 2019-07-18 | 基板処理方法 |
JP2021078383A Pending JP2021122058A (ja) | 2018-07-20 | 2021-05-06 | 基板処理方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021078383A Pending JP2021122058A (ja) | 2018-07-20 | 2021-05-06 | 基板処理方法 |
Country Status (4)
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US (1) | US20200026194A1 (ja) |
JP (2) | JP2020013130A (ja) |
KR (1) | KR20200009841A (ja) |
CN (1) | CN110739203A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022053517A (ja) * | 2020-09-24 | 2022-04-05 | セメス カンパニー,リミテッド | 接着剤層除去ユニット及びこれを利用する接着剤層除去方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102195007B1 (ko) * | 2018-10-11 | 2020-12-29 | 세메스 주식회사 | 기판 세정 조성물, 이를 이용한 기판 처리 방법 및 기판 처리 장치 |
KR102278629B1 (ko) * | 2019-07-22 | 2021-07-19 | 세메스 주식회사 | 기판 처리 장치 |
KR102392039B1 (ko) * | 2019-09-11 | 2022-04-27 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
TWI831152B (zh) * | 2022-03-18 | 2024-02-01 | 韓商細美事有限公司 | 基板處理裝置與其方法 |
Citations (4)
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JP2014048397A (ja) * | 2012-08-30 | 2014-03-17 | Fujifilm Corp | パターン形成方法、並びに、これを用いた電子デバイスの製造方法、及び、電子デバイス |
JP2015014726A (ja) * | 2013-07-05 | 2015-01-22 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法及び電子デバイス |
WO2017002497A1 (ja) * | 2015-06-30 | 2017-01-05 | 富士フイルム株式会社 | パターン形成方法、及び電子デバイスの製造方法 |
KR20180045588A (ko) * | 2016-10-26 | 2018-05-04 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
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JP3920696B2 (ja) * | 2001-04-24 | 2007-05-30 | 株式会社神戸製鋼所 | 微細構造体の乾燥方法および該方法により得られる微細構造体 |
JP2003142368A (ja) * | 2001-10-31 | 2003-05-16 | Matsushita Electric Ind Co Ltd | パターン形成方法 |
JP4084235B2 (ja) * | 2002-08-22 | 2008-04-30 | 株式会社神戸製鋼所 | 保護膜積層微細構造体および該構造体を用いた微細構造体の乾燥方法 |
JP4242396B2 (ja) * | 2006-05-24 | 2009-03-25 | 大日本スクリーン製造株式会社 | 基板洗浄装置および基板洗浄方法 |
JP5088335B2 (ja) * | 2009-02-04 | 2012-12-05 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理システム |
US20140060575A1 (en) * | 2012-08-31 | 2014-03-06 | Semes Co. Ltd | Substrate treating method |
KR20170116093A (ko) * | 2015-03-13 | 2017-10-18 | 후지필름 가부시키가이샤 | 패턴 형성 방법, 레지스트 패턴, 전자 디바이스의 제조 방법, 및 전자 디바이스 |
-
2018
- 2018-07-20 KR KR1020180084781A patent/KR20200009841A/ko not_active IP Right Cessation
-
2019
- 2019-07-12 US US16/510,641 patent/US20200026194A1/en not_active Abandoned
- 2019-07-18 JP JP2019132911A patent/JP2020013130A/ja not_active Ceased
- 2019-07-19 CN CN201910653248.0A patent/CN110739203A/zh active Pending
-
2021
- 2021-05-06 JP JP2021078383A patent/JP2021122058A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014048397A (ja) * | 2012-08-30 | 2014-03-17 | Fujifilm Corp | パターン形成方法、並びに、これを用いた電子デバイスの製造方法、及び、電子デバイス |
JP2015014726A (ja) * | 2013-07-05 | 2015-01-22 | 富士フイルム株式会社 | パターン形成方法、電子デバイスの製造方法及び電子デバイス |
WO2017002497A1 (ja) * | 2015-06-30 | 2017-01-05 | 富士フイルム株式会社 | パターン形成方法、及び電子デバイスの製造方法 |
KR20180045588A (ko) * | 2016-10-26 | 2018-05-04 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2022053517A (ja) * | 2020-09-24 | 2022-04-05 | セメス カンパニー,リミテッド | 接着剤層除去ユニット及びこれを利用する接着剤層除去方法 |
Also Published As
Publication number | Publication date |
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JP2021122058A (ja) | 2021-08-26 |
US20200026194A1 (en) | 2020-01-23 |
KR20200009841A (ko) | 2020-01-30 |
CN110739203A (zh) | 2020-01-31 |
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