JP2020013027A - Display - Google Patents

Abstract

To provide a display that can suppress a reduction in display quality.SOLUTION: A display comprises: a metal wire 30 located outside a display part DA; an organic insulating film located on the metal wire 30; a first metal electrode 41 located on the organic insulating film outside the display part DA; a first insulating film located on the organic insulating film and having a first through hole CH1 penetrating to the first metal electrode 41; a first transparent conductive layer 31 located on the first insulating film, electrically connected to the metal wire 30, and in contact with the first metal electrode 41 in the first through hole CH1; a second insulating film located on the first insulating film and having a second through hole CH2 penetrating to the first transparent conductive layer 31; and a second transparent conductive layer 32 located on the second insulating film and in contact with the first transparent conductive layer 31 in the second through hole CH2. The second through hole CH2 is superimposed on the first metal electrode 41 and the first through hole CH1.SELECTED DRAWING: Figure 3

Description

  Embodiments described herein relate generally to a display device.

  In recent years, various technologies for improving the display quality of a display device have been studied. In one example, a technique of covering a lead line electrically connected to a scan line with a shield electrode is disclosed. Such a shield electrode is electrically connected to the common wiring via the connection electrode. These shield electrodes and connection electrodes are formed of indium tin oxide (ITO).

JP 2009-265484 A

  An object of the present embodiment is to provide a display device capable of suppressing a decrease in display quality.

According to the present embodiment,
A display unit including a plurality of pixels, a metal wiring positioned outside the display unit, an organic insulating film positioned over the metal wiring, and a second metal wiring positioned over the organic insulating film outside the display unit. A first metal electrode, a first insulating film located on the organic insulating film and having a first through hole penetrating to the first metal electrode, and a first insulating film located on the first insulating film and electrically connected to the metal wiring. A first transparent conductive layer that is connected to the first metal electrode in the first through hole, and a second transparent hole that is located on the first insulating film and penetrates to the first transparent conductive layer. 2 insulating film, and a second transparent conductive layer located on the second insulating film and in contact with the first transparent conductive layer in the second through hole, wherein the second through hole is formed of the first metal. A display device is provided, wherein the display device overlaps an electrode and the first through hole.
According to the present embodiment,
A display unit including a plurality of pixels; a first metal line located outside the display unit; a second metal line located outside the first metal line; the first metal line and the second metal line And an organic insulating film having a first through hole penetrating to the second metal wiring, and an organic insulating film located on the organic insulating film outside the display unit, wherein the second through hole is formed in the first through hole. A metal electrode in contact with a metal wiring; a first insulating film having a second through-hole located on the organic insulating film and penetrating to the metal electrode; and a second through-hole located on the first insulating film. A first transparent conductive layer in contact with the metal electrode, a second insulating film located on the first insulating film and having a third through-hole penetrating to the first transparent conductive layer; And is in contact with the first transparent conductive layer at the third through hole. With 2 and a transparent conductive layer, wherein the third through hole, the metal electrodes and superimposed on the second through-hole, a display device is provided.
According to the present embodiment,
A display unit including a plurality of pixels, an organic insulating film, a first metal electrode located on the organic insulating film outside the display unit, a first transparent conductive layer in contact with the first metal electrode, An inorganic insulating film having a through-hole overlapping the first metal electrode, a second transparent conductive layer located on the inorganic insulating film and in contact with the first metal electrode or the first transparent conductive layer in the through-hole, Is provided.

FIG. 1 is a plan view illustrating a configuration example of the display device DSP according to the present embodiment. FIG. 2 is a diagram illustrating a basic configuration and an equivalent circuit of the pixel PX. FIG. 3 is an enlarged plan view of a region A3 of the display panel PNL shown in FIG. FIG. 4 is a cross-sectional view of the display device DSP along the line AB shown in FIG. FIG. 5 is a cross-sectional view of the display panel PNL along the line CD shown in FIG. FIG. 6 is a cross-sectional view of the display panel PNL along the line EF shown in FIG. FIG. 7 is a sectional view of the display panel PNL along the line GH shown in FIG. FIG. 8 is an enlarged plan view of a region A3 of the display panel PNL shown in FIG. FIG. 9 is a cross-sectional view of the display panel PNL along the line IJ shown in FIG. FIG. 10 is another cross-sectional view of the display panel PNL along the line IJ shown in FIG. FIG. 11 is a cross-sectional view of the display panel PNL along the line KL shown in FIG. FIG. 12 is a cross-sectional view of another configuration example of the display panel PNL along the line CD shown in FIG. FIG. 13 is a cross-sectional view of another configuration example of the display panel PNL along the line CD shown in FIG.

  Hereinafter, the present embodiment will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the invention, which are naturally included in the scope of the present invention. In addition, in order to make the description clearer, the drawings may be schematically illustrated with respect to the width, thickness, shape, and the like of each unit as compared with actual embodiments, but are merely examples, and the present invention is not limited thereto. It does not limit the interpretation. In the specification and the drawings, components that perform the same or similar functions as those described in regard to a drawing thereinabove are marked with the same reference numerals, and a repeated detailed description may be omitted as appropriate. .

  In the present embodiment, a liquid crystal display device will be described as an example of the display device DSP. The main configuration disclosed in the present embodiment includes a self-luminous display device having an organic electroluminescence display element and a μLED, an electronic paper display device having an electrophoretic element, a MEMS (Micro Electro Mechanical Systems). ) Or a display device using electrochromism.

  FIG. 1 is a plan view illustrating a configuration example of the display device DSP according to the present embodiment. In one example, the first direction X, the second direction Y, and the third direction Z are orthogonal to each other, but may intersect at an angle other than 90 degrees. The first direction X and the second direction Y correspond to directions parallel to the main surface of the substrate constituting the display device DSP, and the third direction Z corresponds to the thickness direction of the display device DSP. In this specification, the position on the tip side of the arrow indicating the third direction Z is referred to as “up”, and the position on the opposite side to the tip of the arrow is referred to as “down”. In addition, it is assumed that there is an observation position for observing the display device DSP on the tip side of the arrow indicating the third direction Z, and from this observation position, an XY plane defined by the first direction X and the second direction Y is provided. Viewing is called planar view.

  The display device DSP includes a display panel PNL, a flexible printed circuit board 1, an IC chip 2, and a circuit board 3.

The display panel PNL is a liquid crystal display panel, and includes a first substrate SUB1, a second substrate SUB2, a liquid crystal layer LC, a seal SE, and a light shielding layer LS. The display panel PNL includes a display section DA for displaying an image, and a frame-shaped non-display section NDA surrounding the display section DA. The second substrate SUB2 faces the first substrate SUB1. The first substrate SUB1 has a mounting portion MA extending in the second direction Y from the second substrate SUB2.
The light shielding layer LS is located in the non-display portion NDA and is provided on the second substrate SUB2. The seal SE is located in the non-display portion NDA, and bonds the first substrate SUB1 and the second substrate SUB2 and seals the liquid crystal layer LC. The seal SE is provided at a position overlapping with the light shielding layer LS in plan view. The non-display portion NDA includes an area A1 where the light shielding layer LS and the liquid crystal layer LC overlap, and an area A2 where the seal SE and the light shielding layer LS overlap. The area A1 surrounds the display section DA, and the area A2 surrounds the area A1. In FIG. 1, the display area DA in which the area A1, the area A2, and the liquid crystal layer LC are arranged are indicated by different oblique lines.

  The display unit DA includes a plurality of pixels PX arranged in a matrix in a first direction (column direction) X and a second direction (row direction) Y.

  The flexible printed circuit board 1 is mounted on the mounting section MA and connected to the circuit board 3. The IC chip 2 is mounted on the flexible printed circuit board 1. Note that the IC chip 2 may be mounted on the mounting section MA. The IC chip 2 has a built-in display driver DD. The display driver DD outputs a signal required for image display in an image display mode for displaying an image. Further, in the illustrated example, the IC chip 2 has a built-in touch controller TC. The touch controller TC controls a touch sensing mode for detecting approach or contact of an object with the display device DSP.

  Although a detailed description of the configuration of the display panel PNL is omitted here, the display panel PNL uses a display mode using a horizontal electric field along the main surface of the substrate and a vertical electric field along a normal to the main surface of the substrate. Display mode, a display mode using an inclined electric field inclined in an oblique direction with respect to the main surface of the substrate, and further, any of the above-described horizontal electric field, vertical electric field, and a display mode using an appropriately combined inclined electric field A configuration may be provided. Here, the substrate main surface is a surface parallel to the XY plane defined by the first direction X and the second direction Y.

  FIG. 2 is a diagram illustrating a basic configuration and an equivalent circuit of the pixel PX. The plurality of scanning lines G are connected to a scanning line driving circuit GD. The plurality of signal lines S are connected to a signal line driving circuit SD. Note that the scanning lines G and the signal lines S do not necessarily have to extend linearly, and some of them may be bent. For example, it is assumed that the signal line S extends in the second direction Y even if a part thereof is bent.

  The common electrode CE is arranged over a plurality of pixels PX. The common electrode CE is connected to the voltage supply unit CD and the touch controller TC shown in FIG. In the image display mode, the voltage supply unit CD supplies a common voltage (Vcom) to the common electrode CE. In the touch sensing mode, the touch controller TC supplies a touch drive voltage different from the common voltage to the common electrode CE.

  Each pixel PX includes a switching element SW, a pixel electrode PE, a common electrode CE, a liquid crystal layer LC, and the like. The switching element SW is composed of, for example, a thin film transistor (TFT), and is electrically connected to the scanning line G and the signal line S. The scanning line G is electrically connected to the switching element SW in each of the pixels PX arranged in the first direction X. The signal line S is electrically connected to the switching element SW in each of the pixels PX arranged in the second direction Y. The pixel electrode PE is electrically connected to the switching element SW. Each of the pixel electrodes PE faces the common electrode CE, and drives the liquid crystal layer LC by an electric field generated between the pixel electrode PE and the common electrode CE. The capacitor CS is formed, for example, between an electrode having the same potential as the common electrode CE and an electrode having the same potential as the pixel electrode PE.

  FIG. 3 is an enlarged plan view of a region A3 of the display panel PNL shown in FIG. Here, the main part of the first substrate SUB1 will be described. The illustrated display unit DA corresponds to an example in which an FFS (Fringe Field Switching) mode, which is one of display modes using a horizontal electric field, is applied.

The scanning lines G1 to G3 extend linearly along the first direction X, and are arranged at intervals in the second direction Y. The signal lines S1 to S3 each extend substantially along the second direction Y, and are arranged at intervals in the first direction X. The scanning lines G1 to G3 and the signal lines S1 to S3 cross each other. The metal wirings M1 to M3 are superimposed on the signal lines S1 to S3, respectively. The common electrode CE is arranged in the display section DA and overlaps the signal lines S1 to S3 and the metal wirings M1 to M3.
The pixel electrodes PE are arranged in a matrix in the first direction X and the second direction Y in the display section DA. For example, the pixel electrode PE1 located in an odd-numbered row between the scanning lines G1 and G2 has a plurality of band electrodes Pa1 extending along the direction D1. The pixel electrode PE2 located on the even-numbered row between the scanning lines G2 and G3 has a plurality of band electrodes Pa2 extending along the direction D2. In the illustrated example, there are three band electrodes Pa1 and Pa2, respectively, but the number of each of the band electrodes Pa1 and Pa2 is not limited to the illustrated example.

  Next, attention is paid to the area A1 outside the display section DA. The metal wiring 30 and the transparent conductive layers 31 and 32 are arranged so as to surround the display section DA. The metal electrode 41 is formed in an island shape at a position overlapping the transparent conductive layers 31 and 32. The metal electrode 42 is formed in an island shape at a position overlapping the metal wiring 30 and the transparent conductive layer 31.

  The metal wiring 30 is a wiring located in the same layer as the signal line S1 and the like, and formed of the same material as the signal line S1. The metal electrodes 41 and 42 are located in the same layer as the metal wiring M1 and the like, and are formed of the same material as the metal wiring M1. The transparent conductive layer 31 is a wiring located in the same layer as the common electrode CE and formed of the same material as the common electrode CE. The transparent conductive layer 32 is a wiring located in the same layer as the pixel electrode PE and formed of the same material as the pixel electrode PE.

  The metal electrode 41 is arranged at a position shifted from the metal wiring 30. The transparent conductive layer 31 and the metal electrode 41 are electrically connected to each other in the through hole CH1. The transparent conductive layers 31 and 32 are electrically connected to each other at the through hole CH2. The through holes CH1 and CH2 overlap with the metal electrode 41 and are provided at positions shifted from the metal wiring 30. The edge of the through hole CH2 is located inside the through hole CH1 without crossing the edge of the through hole CH1 over the entire circumference. Similar metal electrodes 41 are arranged at intervals in the first direction X.

  The metal electrode 42 is arranged at a position shifted from the transparent conductive layer 32. The metal wiring 30 and the metal electrode 42 are electrically connected to each other in the through hole CH3. The metal electrode 42 and the transparent conductive layer 31 are electrically connected to each other at the through hole CH4. The through holes CH3 and CH4 are arranged at intervals in the second direction Y. Further, the through holes CH3 and CH4 overlap with the metal electrode 42 and are provided at positions shifted from the transparent conductive layer 32. Although not shown, the similar metal electrodes 42 are arranged at intervals in the second direction Y between the display section DA and the scanning line drive circuit GD.

  Thus, the metal wiring 30 and the transparent conductive layers 31 and 32 are all electrically connected to each other and have the same potential. The metal wiring 30 supplies a common voltage (Vcom) in, for example, the image display mode and the touch sensing mode. That is, in the touch sensing mode, the transparent conductive layers 31 and 32 have a potential different from that of the common electrode CE to which the touch drive voltage is applied.

  The linear electrode EL is located in the non-display portion NDA and overlaps the transparent conductive layer 31. The linear electrode EL crosses the scanning line G2 and is adjacent to the signal line S3 and the metal wiring M3. The linear electrode EL has an electrode portion EL1 extending along the direction D1, an electrode portion EL2 extending along the direction D2, and a base EL3.

  The metal electrode 43 is formed in an island shape at a position overlapping the transparent conductive layer 31 and the base EL3. The transparent conductive layer 31 and the metal electrode 43 are electrically connected to each other in the through hole CH5. The transparent conductive layer 31 and the base EL3 are electrically connected to each other at the through hole CH6. The through holes CH5 and CH6 overlap the metal electrode 43. The edge of the through hole CH6 is located inside the through hole CH5 without crossing the edge of the through hole CH5 over the entire circumference.

  The metal electrode 43 is an electrode located in the same layer as the metal wiring M1 and the like, and formed of the same material as the metal wiring M1. The linear electrode EL is a transparent electrode located in the same layer as the pixel electrode PE and formed of the same material as the pixel electrode PE.

FIG. 4 is a cross-sectional view of the display device DSP along the line AB shown in FIG.
The first substrate SUB1 includes an insulating substrate 10, insulating films 11 to 16, a semiconductor layer SC, signal lines S1 and S2, metal wires M1 and M2, a common electrode CE, a pixel electrode PE1, an alignment film AL1, and the like. The insulating substrate 10 is a transparent substrate such as a glass substrate or a flexible resin substrate. The semiconductor layer SC is located on the insulating film 11 and is covered by the insulating film 12. The semiconductor layer SC is formed of, for example, polycrystalline silicon, but may be formed of amorphous silicon or an oxide semiconductor. The scanning lines G1 and the like shown in FIG. 3 are located between the insulating films 12 and 13.

  The signal lines S1 and S2 are located on the insulating film 13 and are covered by the insulating film 14. The metal wirings M1 and M2 are located on the insulating film 14 and are covered by the insulating film 15. In one example, the signal line S1 and the metal wiring M1 are a first stacked body in which a layer containing titanium (Ti), a layer containing aluminum (Al), and a layer containing titanium (Ti) are stacked in this order, or This is a second stacked body in which a layer containing molybdenum (Mo), a layer containing aluminum (Al), and a layer containing molybdenum (Mo) are stacked in this order.

  The common electrode CE is located on the insulating film 15 and is covered by the insulating film 16. The pixel electrode PE1 is located on the insulating film 16 and is covered by the alignment film AL1. The pixel electrode PE1 and the common electrode CE are formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

  Each of the insulating films 11 to 13 and the insulating film 16 is an inorganic insulating film formed using silicon oxide, silicon nitride, silicon oxynitride, or the like, and may have a single-layer structure or a multilayer structure. You may. The insulating films 14 and 15 are, for example, organic insulating films formed of an acrylic resin or the like. Note that the insulating film 15 may be an inorganic insulating film.

  The second substrate SUB2 includes an insulating substrate 20, a light shielding layer BM, a color filter layer CF, an overcoat layer OC, an alignment film AL2, and the like. The insulating substrate 20 is a transparent substrate such as a glass substrate or a flexible resin substrate. The light shielding layer BM is formed integrally with the light shielding layer LS shown in FIG. The color filter layer CF includes a red color filter CFR, a green color filter CFG, and a blue color filter CFB. The color filter CFB faces the pixel electrode PE1. The other color filters CFR and CFG also face the other pixel electrodes PE, respectively. The overcoat layer OC covers the color filter layer CF. The overcoat layer OC is a transparent organic insulating film. The alignment film AL2 covers the overcoat layer OC.

  The liquid crystal layer LC is located between the first substrate SUB1 and the second substrate SUB2, and is held between the alignment films AL1 and AL2.

  The optical element OD1 including the polarizing plate PL1 is bonded to the insulating substrate 10. The optical element OD2 including the polarizing plate PL2 is bonded to the insulating substrate 20. Note that the optical elements OD1 and OD2 may include a retardation plate, a scattering layer, an antireflection layer, and the like as necessary.

  In such a display panel PNL, in an off state where no electric field is formed between the pixel electrode PE1 and the common electrode CE, the liquid crystal molecules LM are initially aligned in a predetermined direction between the alignment films AL1 and AL2. ing. In such an off state, the illumination light emitted from the illumination device IL toward the display panel PNL is absorbed by the optical elements OD1 and OD2, resulting in a dark display. On the other hand, in an ON state in which an electric field is formed between the pixel electrode PE1 and the common electrode CE, the liquid crystal molecules LM are oriented in a direction different from the initial orientation direction by the electric field, and the orientation direction is controlled by the electric field. . In such an ON state, a part of the illumination light passes through the optical elements OD1 and OD2, and a bright display is obtained.

FIG. 5 is a cross-sectional view of the display panel PNL along the line CD shown in FIG. In the first substrate SUB1, the metal electrode 41 is located on the insulating film. The insulating film 15 has a through-hole CH <b> 1 located on the insulating film 14 and the metal electrode 41 and penetrating to the metal electrode 41. The transparent conductive layer 31 is located on the insulating film 15 and is in contact with the metal electrode 41 in the through hole CH1.
The insulating film 16 is located on the insulating film 15 and the transparent conductive layer 31, and has a through hole CH2 penetrating to the transparent conductive layer 31. In particular, the insulating film 16 extends to the inside of the through-hole CH1, and covers a portion near the edge of the through-hole CH1 in a portion where the metal electrode 41 and the transparent conductive layer 31 are in contact with each other. The through-hole CH2 is provided at the center of the portion where the metal electrode 41 and the transparent conductive layer 31 are in contact with each other. That is, the through-hole CH2 is provided at a position where the whole thereof overlaps with the metal electrode 41 and the through-hole CH1.
The transparent conductive layer 32 is located on the insulating film 16 and is in contact with the transparent conductive layer 31 at the through hole CH2. The portions where the transparent conductive layers 31 and 32 are in contact with each other entirely overlap the metal electrode 41. That is, the insulating film 15 does not intervene between the portion where the transparent conductive layers 31 and 32 are in contact and the metal electrode 41. The alignment film AL1 covers the transparent conductive layer 32.

FIG. 6 is a cross-sectional view of the display panel PNL along the line EF shown in FIG. In the first substrate SUB1, the metal wiring 30 is located on the insulating film 13. The insulating film 14 has a through-hole CH3 that is located on the insulating film 13 and the metal wiring 30 and penetrates to the metal wiring 30. The metal electrode 42 is located on the insulating film 14 and is in contact with the metal wiring 30 in the through hole CH3.
The insulating film 15 is located on the insulating film 14 and the metal electrode 42, and has a through hole CH4 penetrating to the metal electrode 42. The insulating film 15 is also arranged in the through hole CH3. The through hole CH4 is provided at a position shifted from the through hole CH3. The transparent conductive layer 31 is located on the insulating film 15 and is in contact with the metal electrode 42 at the through hole CH4. The insulating film 16 is located on the insulating film 15 and the transparent conductive layer 31, and is also arranged in the through hole CH4.

  In the configuration examples shown in FIGS. 3 to 6, the metal electrode 41 corresponds to a first metal electrode, the metal electrode 42 corresponds to a second metal electrode, the transparent conductive layer 31 corresponds to a first transparent conductive layer, The transparent conductive layer 32 corresponds to a second transparent conductive layer, the through hole CH1 corresponds to a first through hole, the through hole CH2 corresponds to a second through hole, the through hole CH3 corresponds to a third through hole, The through hole CH4 corresponds to a fourth through hole, the insulating film 14 corresponds to an organic insulating film or a first organic insulating film, the insulating film 15 corresponds to a first insulating film or a second organic insulating film, and the insulating film 16 Corresponds to the second insulating film or the inorganic insulating film.

For example, moisture from the outside is more likely to enter the organic insulating film than the inorganic insulating film, and moisture is easily transmitted at a portion where two electrodes formed of ITO which are not covered with the inorganic insulating film are in contact with each other. Such infiltration of water may cause deterioration of display quality.
According to the present embodiment, the portion where the transparent conductive layers 31 and 32 are in contact with each other in the through hole CH2 overlaps with the metal electrode 41 on the insulating film 14 which is an organic insulating film, and is not in contact with the insulating film 14. . For this reason, even if the transparent conductive layers 31 and 32 transmit moisture more easily than the metal electrode 41 and the insulating film 16, the moisture that has entered through the insulating film 14 is blocked by the metal electrode 41. Therefore, intrusion of moisture into the liquid crystal layer LC can be suppressed, and a decrease in display quality can be suppressed.
Further, a transparent conductive film such as ITO has a higher resistance than a metal wiring. When ITO is used for a wiring, a bridge, an electrode, or the like, it is preferable that the resistance be low. According to the present embodiment, the resistance can be reduced by laminating the metal electrode 41 on the portion where the two ITOs are in contact with each other, and as a result, the deterioration of the display quality can be suppressed.

FIG. 7 is a sectional view of the display panel PNL along the line GH shown in FIG. In the first substrate SUB1, the metal electrode 43 is located on the insulating film. The insulating film 15 is located on the insulating film 14 and the metal electrode 43 and has a through hole CH5 penetrating to the metal electrode 43. The transparent conductive layer 31 is located on the insulating film 15 and is in contact with the metal electrode 43 at the through hole CH5. The insulating film 16 is located on the insulating film 15 and the transparent conductive layer 31, and has a through hole CH6 penetrating to the transparent conductive layer 31. The through-hole CH6 is provided at a position where the whole thereof overlaps the metal electrode 43. The base EL3 of the linear electrode EL is located on the insulating film 16 and is in contact with the transparent conductive layer 31 at the through hole CH6. A portion where the transparent conductive layer 31 and the base EL3 are in contact with each other entirely overlaps the metal electrode 43.
The portion where the linear electrode EL contacts the transparent conductive layer 31 also overlaps the metal electrode 43 on the insulating film 14 and does not contact the insulating film 14. For this reason, the moisture that has entered through the insulating film 14 is blocked by the metal electrode 43, and the entry of moisture into the liquid crystal layer LC can be suppressed. In addition, a portion where the linear electrode EL and the transparent conductive layer 31 are in contact has a low resistance.

  FIG. 8 is an enlarged plan view of a region A3 of the display panel PNL shown in FIG. Here, an area further away from the display section DA than the area shown in FIG. 3 is shown. The illustration of the display section DA is omitted, and the details of the metal wiring 30 and the transparent conductive layers 31 and 32 are also omitted. The metal electrodes 60 and 80 are indicated by dashed lines in the figure, and the transparent conductive layers 51 and 71 are indicated by dashed lines in the figure.

The metal wiring 50 is located outside the metal wiring 30. The transparent conductive layer 52 overlaps with the metal wiring 50. The metal electrode 60 and the transparent conductive layer 51 are formed in an island shape at positions overlapping the metal wiring 50 and the transparent conductive layer 52.
The metal wiring 50 and the metal electrode 60 are electrically connected to each other in the through hole CH11. The transparent conductive layer 51 and the metal electrode 60 are electrically connected to each other at the through hole CH12. The transparent conductive layers 51 and 52 are electrically connected to each other at the through hole CH13. The through holes CH11 to CH13 overlap the metal electrode 60. The edge of the through hole CH13 is located inside the through hole CH12 without crossing the edge of the through hole CH12 over the entire circumference. Similar metal electrodes 60 are arranged at intervals in the first direction X.
Thereby, the metal wiring 50 and the transparent conductive layer 52 are electrically connected to each other and have the same potential. In one example, the metal wiring 50 is set to have a different potential from the metal wiring 30. For example, the metal wiring 50 is a wiring of a fixed potential, and may be relatively low potential or high potential with respect to the potential of the metal wiring 30. The metal wiring 50 may be set to have the same potential as the metal wiring 30.

The metal wiring 70 is located outside the metal wiring 50. The transparent conductive layer 72 overlaps the metal wiring 70. Part of the metal electrode 80 is formed in an island shape at a position overlapping the metal wiring 70 and the transparent conductive layer 72. The transparent conductive layer 71 is arranged at a position shifted from the metal wiring 70 and overlaps the metal electrode 80.
The metal wiring 70 and the metal electrode 80 are electrically connected to each other at the through hole CH21. The transparent conductive layer 71 and the metal electrode 80 are electrically connected to each other at the through hole CH22. The transparent conductive layers 71 and 72 are electrically connected to each other at the through hole CH23. The through holes CH21 to CH23 overlap the metal electrode 80. The through hole CH21 overlaps with the metal wiring 70 and the transparent conductive layer 72. The through holes CH22 and CH23 are provided at positions shifted from the metal wiring 70. The edge of the through hole CH23 is located inside the through hole CH22 without crossing the edge of the through hole CH22 over the entire circumference. Similar metal electrodes 80 are arranged at intervals in the first direction X. Although not shown, other plural metal wirings are arranged further outside the metal wiring 70 (on the side separated from the display unit DA). The transparent conductive layer 72 overlaps these other metal wirings and shields an electric field from the metal wirings.
Thus, the metal wiring 70 and the transparent conductive layer 72 are electrically connected to each other and have the same potential. In one example, the metal wiring 70 is set to have the same potential as the metal wiring 30.

  The metal wirings 50 and 70 are wirings located in the same layer as the signal line S1 and the like shown in FIG. 4 and formed of the same material as the signal line S1. The metal electrodes 60 and 80 are located in the same layer as the metal wiring M1 and the like shown in FIG. 4 and are formed of the same material as the metal wiring M1. The transparent conductive layers 51 and 71 are located in the same layer as the common electrode CE shown in FIG. 4 and are transparent electrodes formed of the same material as the common electrode CE. The transparent conductive layers 52 and 72 are located on the same layer as the pixel electrode PE shown in FIG. 4, and are wiring formed of the same material as the pixel electrode PE.

FIG. 9 is a cross-sectional view of the display panel PNL along the line IJ shown in FIG. In the first substrate SUB1, the metal wiring 50 is located on the insulating film 13. The insulating film 14 has a through-hole CH11 which is located on the insulating film 13 and the metal wiring 50 and penetrates to the metal wiring 50. The metal electrode 60 is located on the insulating film 14 and is in contact with the metal wiring 50 at the through hole CH11.
The insulating film 15 has a through hole CH <b> 12 that is located on the insulating film 14 and the metal electrode 60 and penetrates to the metal electrode 60. The insulating film 15 is also arranged in the through hole CH11. The through-hole CH12 is provided at a position shifted from the through-hole CH11. The transparent conductive layer 51 is located on the insulating film 15 and is in contact with the metal electrode 60 at the through hole CH12. The insulating film 16 has a through-hole CH <b> 13 located on the insulating film 15 and the transparent conductive layer 51 and penetrating to the transparent conductive layer 51. In the illustrated example, the two through holes CH13 are arranged in the first direction X. The through-hole CH13 is provided at a position that entirely overlaps the metal electrode 60 and the through-hole CH12.
The transparent conductive layer 52 is located on the insulating film 16 and is in contact with the transparent conductive layer 51 at the through hole CH13. The portions where the transparent conductive layers 51 and 52 are in contact with each other entirely overlap the metal electrode 60. That is, the insulating film 15 does not intervene between the portion where the transparent conductive layers 51 and 52 are in contact and the metal electrode 60.

  FIG. 10 is another cross-sectional view of the display panel PNL along the line IJ shown in FIG. The example shown in FIG. 10 is different from the example shown in FIG. 9 in that the through hole CH13 is unified and the contact area between the transparent conductive layers 51 and 52 is increased.

FIG. 11 is a cross-sectional view of the display panel PNL along the line KL shown in FIG. In the first substrate SUB1, the metal wiring 70 is located on the insulating film 13. The insulating film 14 has a through-hole CH <b> 21 located above the insulating film 13 and the metal wiring 70 and penetrating to the metal wiring 70. The metal electrode 80 is located on the insulating film 14 and is in contact with the metal wiring 70 in the through hole CH21.
The insulating film 15 has a through hole CH22 that is located on the insulating film 14 and the metal electrode 80 and penetrates to the metal electrode 80. The insulating film 15 is also arranged in the through hole CH21. The through-hole CH22 is provided at a position shifted from the through-hole CH21. The transparent conductive layer 71 is located on the insulating film 15 and is in contact with the metal electrode 80 at the through hole CH22. The insulating film 16 is located on the insulating film 15 and the transparent conductive layer 71 and has a through hole CH23 penetrating to the transparent conductive layer 71. The through-hole CH23 is provided at a position where the whole thereof overlaps with the metal electrode 80.
The transparent conductive layer 72 is located on the insulating film 16 and is in contact with the transparent conductive layer 71 at the through hole CH23. The portion where the transparent conductive layers 71 and 72 are in contact with each other entirely overlaps the metal electrode 80. That is, the insulating film 15 does not intervene between the portion where the transparent conductive layers 71 and 72 are in contact and the metal electrode 80.

  8 to 11, the metal wiring 30 corresponds to the first metal wiring, the metal wirings 50 and 70 correspond to the second metal wiring, the metal electrodes 60 and 80 correspond to the metal electrodes, The transparent conductive layers 51 and 71 correspond to a first transparent conductive layer, the transparent conductive layers 52 and 72 correspond to a second transparent conductive layer, the through holes CH11 and CH21 correspond to the first through holes, the through holes CH12 and CH22 corresponds to the second through hole, through holes CH13 and CH23 correspond to the third through hole, the insulating film 14 corresponds to the organic insulating film or the first organic insulating film, and the insulating film 15 corresponds to the first insulating film or The insulating film 16 corresponds to a second insulating film or an inorganic insulating film.

  The portion where the transparent conductive layers 51 and 52 located outside the display section DA are in contact with each other overlaps with the metal electrode 60, and the portion where the transparent conductive layers 71 and 72 are in contact with each other overlaps with the metal electrode 80. That is, the portion where the transparent conductive layers 51 and 52 are in contact and the portion where the transparent conductive layers 71 and 72 are in contact are not in contact with the insulating film 14 which is an organic insulating film. Therefore, also in these portions, it is possible to suppress the intrusion of the moisture that has entered through the insulating film 14 into the liquid crystal layer LC. In addition, the resistance of the portion where the transparent conductive layers 51 and 52 are in contact can be reduced.

  Next, another configuration example will be described with reference to FIGS. Here, description will be made focusing on a portion where the transparent conductive layers 31 and 32 are in contact with each other. The configuration examples shown in FIGS. 12 and 13 are different from the above configuration examples in that the first substrate SUB1 does not include the insulating film 15 between the insulating films 14 and 16. .

  In the configuration example shown in FIG. 12, the metal electrode 41 is located on the insulating film 14 and is formed in an island shape. The transparent conductive layer 31 is located on the insulating film 14, overlaps the metal electrode 41, and is in contact with the metal electrode 41. The insulating film 16 is located on the insulating film 14 and the transparent conductive layer 31 and has a through hole CH2 penetrating to the transparent conductive layer 31. The through-hole CH2 is provided at a position where the whole thereof overlaps the metal electrode 41. The transparent conductive layer 32 is located on the insulating film 16 and is in contact with the transparent conductive layer 31 at the through hole CH2. The portion where the transparent conductive layers 31 and 32 are in contact with each other is entirely overlapped with the metal electrode 41 and is not in contact with the insulating film 14.

  In the configuration example shown in FIG. 13, the transparent conductive layer 31 is located on the insulating film 14. The metal electrode 41 is located on the transparent conductive layer 31, is formed in an island shape, and is in contact with the transparent conductive layer 31. The insulating film 16 has a through hole CH2 that is located on the insulating film 14, the transparent conductive layer 31, and the metal electrode 41 and penetrates to the metal electrode 41. The through-hole CH2 is provided at a position where the whole thereof overlaps the metal electrode 41. The transparent conductive layer 32 is located on the insulating film 16 and is in contact with the metal electrode 41 in the through hole CH2. The portion where the transparent conductive layers 31 and 32 are in contact with each other is entirely overlapped with the metal electrode 41 and is not in contact with the insulating film 14.

  In these configuration examples, the same effects as in the above configuration example can be obtained. The configuration examples shown in FIGS. 12 and 13 respectively correspond to a portion where the transparent conductive layer 31 and the linear electrode EL shown in FIG. 7 are in contact with each other, and the transparent conductive layers 51 and 52 shown in FIGS. The present invention is also applicable to a portion where the transparent conductive layers 71 and 72 shown in FIG. 11 are in contact with each other.

  In the above-described embodiment, the edges of each through-hole are shown as squares in plan view, but each corner may have a rounded shape, and the edge of each through-hole may have another shape such as a circle or an ellipse. It may be. The edge of the through hole can be defined as an outer peripheral edge of a portion where the two conductive layers are in contact with each other via the through hole in plan view.

  As described above, according to the present embodiment, it is possible to provide a display device capable of suppressing a decrease in display quality.

  Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and their equivalents.

DSP: display device PNL: display panel SUB1: first substrate SUB2: second substrate LC: liquid crystal layer DA: display unit NDA: non-display unit CE: common electrode PE: pixel electrode EL: linear electrode 30: metal wiring 31, 32: transparent conductive layer 41-42: metal electrode

Claims (12)

A display unit having a plurality of pixels;
Metal wiring located outside the display unit,
An organic insulating film located on the metal wiring,
A first metal electrode located on the organic insulating film outside the display unit;
A first insulating film which is located on the organic insulating film and has a first through hole penetrating to the first metal electrode;
A first transparent conductive layer located on the first insulating film, electrically connected to the metal wiring, and in contact with the first metal electrode in the first through hole;
A second insulating film located on the first insulating film and having a second through hole penetrating to the first transparent conductive layer;
A second transparent conductive layer located on the second insulating film and in contact with the first transparent conductive layer in the second through hole.
The display device, wherein the second through-hole overlaps the first metal electrode and the first through-hole.   The display device according to claim 1, wherein the first through-hole and the second through-hole are provided at positions shifted from the metal wiring in a plan view. A second metal electrode located between the organic insulating film and the first insulating film outside the display unit;
The organic insulating film has a third through hole penetrating to the metal wiring,
The first insulating film has a fourth through hole penetrating to the second metal electrode,
The second metal electrode is in contact with the metal wiring in the third through hole;
The display device according to claim 1, wherein the first transparent conductive layer is in contact with the second metal electrode in the fourth through hole.   The display device according to claim 3, wherein the third through-hole and the fourth through-hole are provided at positions shifted from the second transparent conductive layer in a plan view. A display unit having a plurality of pixels;
A first metal wiring located outside the display unit;
A second metal wiring located outside the first metal wiring,
An organic insulating film having a first through hole located on the first metal wiring and the second metal wiring and penetrating to the second metal wiring;
A metal electrode located on the organic insulating film outside the display unit and in contact with the second metal wiring in the first through hole;
A first insulating film which is located on the organic insulating film and has a second through hole penetrating to the metal electrode;
A first transparent conductive layer located on the first insulating film and in contact with the metal electrode in the second through hole;
A second insulating film located on the first insulating film and having a third through-hole penetrating to the first transparent conductive layer;
A second transparent conductive layer located on the second insulating film and in contact with the first transparent conductive layer in the third through hole.
The display device, wherein the third through hole overlaps the metal electrode and the second through hole.   The display device according to claim 5, wherein the second metal wiring has a different potential from the first metal wiring.   The display device according to claim 6, wherein the metal electrode and the first transparent conductive layer overlap with the second metal wiring and the second transparent conductive layer in a plan view.   The display device according to claim 6, wherein the first through-hole, the second through-hole, and the third through-hole overlap the metal electrode in a plan view.   The display device according to claim 5, wherein the second metal wiring has the same potential as the first metal wiring.   The display device according to claim 9, wherein the first transparent conductive layer is arranged at a position shifted from the second metal wiring in a plan view.   In plan view, the first through-hole overlaps the second metal wiring and the second transparent conductive layer, and the second through-hole and the third through-hole are provided at positions shifted from the second metal wiring. The display device according to claim 9, wherein: A display unit having a plurality of pixels;
An organic insulating film,
A first metal electrode located on the organic insulating film outside the display unit;
A first transparent conductive layer in contact with the first metal electrode;
An inorganic insulating film having a through hole overlapping the first metal electrode;
A second transparent conductive layer located on the inorganic insulating film and in contact with the first metal electrode or the first transparent conductive layer in the through hole;
Display device provided with.

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