JP2020009899A5 - - Google Patents
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- JP2020009899A5 JP2020009899A5 JP2018129461A JP2018129461A JP2020009899A5 JP 2020009899 A5 JP2020009899 A5 JP 2020009899A5 JP 2018129461 A JP2018129461 A JP 2018129461A JP 2018129461 A JP2018129461 A JP 2018129461A JP 2020009899 A5 JP2020009899 A5 JP 2020009899A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- flattening
- spool
- pressing member
- flattening layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims 30
- 238000003825 pressing Methods 0.000 claims 23
- 239000000463 material Substances 0.000 claims 15
- 230000032258 transport Effects 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000005452 bending Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 230000002093 peripheral Effects 0.000 claims 1
- 230000003313 weakening Effects 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Claims (10)
前記基板を保持する基板保持部と、
前記基板保持部の上の空間に配置された第１スプールおよび第２スプールを有し、前記第１スプールから繰り出された前記押圧部材を前記第２スプールで巻き取る給送部と、
前記第１スプールと前記第２スプールとの間における前記押圧部材の張力を調整する調整部と、
前記基板の上の平坦化材を硬化させる硬化部と、
を有し、
前記調整部により前記張力を弱めて前記押圧部材を撓ませていくことにより、前記第１スプールと前記第２スプールとの間の前記押圧部材を前記基板の上の前記平坦化材と接触させ、
前記押圧部材を前記平坦化材と接触させた状態で前記硬化部により前記平坦化材を硬化させることにより、前記基板の上に前記平坦化層を形成し、
前記調整部により前記張力を強めることにより、前記平坦化層から前記押圧部材を分離させる
ことを特徴とする平坦化層形成装置。 A flattening layer forming device for forming a flattening layer of a flattening material on a substrate using a pressing member.
A substrate holding portion that holds the substrate and
A feeding unit having a first spool and a second spool arranged in a space above the substrate holding portion, and winding the pressing member unwound from the first spool with the second spool.
An adjusting unit that adjusts the tension of the pressing member between the first spool and the second spool.
A cured portion that cures the flattening material on the substrate,
Have,
By weakening the tension by the adjusting portion and bending the pressing member, the pressing member between the first spool and the second spool is brought into contact with the flattening material on the substrate.
The flattening layer is formed on the substrate by curing the flattening material with the cured portion in a state where the pressing member is in contact with the flattening material.
A flattening layer forming apparatus, characterized in that the pressing member is separated from the flattening layer by increasing the tension by the adjusting portion.
平面視で前記第１スプールと前記基板保持部との間の前記押圧部材の搬送経路に配置され、前記押圧部材を挟持しながら搬送する第１搬送ローラ対と、
平面視で前記基板保持部と前記第２スプールとの間の前記押圧部材の搬送経路に配置され、前記押圧部材を挟持しながら搬送する第２搬送ローラ対と、
を含むことを特徴とする請求項１に記載の平坦化層形成装置。 The adjusting part
A pair of first transport rollers arranged in a transport path of the pressing member between the first spool and the substrate holding portion in a plan view and transporting while sandwiching the pressing member.
A second transport roller pair, which is arranged in the transport path of the pressing member between the substrate holding portion and the second spool in a plan view and transports while sandwiching the pressing member,
The flattening layer forming apparatus according to claim 1, wherein the flattening layer forming apparatus includes.
前記補助プレートの高さを調整する調整機構と、
を更に有することを特徴とする請求項１乃至５のいずれか１項に記載の平坦化層形成装置。 An auxiliary plate provided on the substrate holding portion along the outer peripheral portion of the substrate, and
An adjustment mechanism that adjusts the height of the auxiliary plate,
The flattening layer forming apparatus according to any one of claims 1 to 5, further comprising.
前記下地層の上に平坦化材を供給する工程と、
第１スプールから押圧部材を繰り出して第２スプールで巻き取る給送部の下の位置に、前記平坦化材が供給された前記基板を配置する工程と、
前記第１スプールと前記第２スプールとの間における前記押圧部材の張力を緩めて前記押圧部材を撓ませていくことにより、前記第１スプールと前記第２スプールとの間の前記押圧部材を前記基板の上の前記平坦化材と接触させる工程と、
前記押圧部材を前記平坦化材と接触させた状態で前記平坦化材を硬化させることにより、前記基板の上に前記平坦化層を形成する工程と、
前記張力を強めることにより、前記平坦化層から前記押圧部材を分離させる工程と、
を有することを特徴とする製造方法。 A method for manufacturing a flattening layer in which a flattening layer is formed on a substrate on which a base layer is formed.
The process of supplying the flattening material on the base layer and
A step of arranging the substrate to which the flattening material is supplied at a position below the feeding portion in which the pressing member is fed out from the first spool and wound up by the second spool.
By loosening the tension of the pressing member between the first spool and the second spool and bending the pressing member, the pressing member between the first spool and the second spool is pressed. The process of contacting the flattening material on the substrate and
A step of forming the flattening layer on the substrate by curing the flattening material in a state where the pressing member is in contact with the flattening material.
A step of separating the pressing member from the flattening layer by increasing the tension, and
A manufacturing method characterized by having.
前記平坦化された平坦化材を有する基板を処理する工程と、
を有し、前記処理された基板から物品を製造することを特徴とする物品製造方法。 A step of flattening a flattening material of a substrate by using the method for producing a flattening layer according to claim 8.
The step of processing the substrate having the flattened flattening material, and
A method for producing an article, which comprises the present invention and comprises producing an article from the treated substrate.
前記基板を保持する基板保持部と、
第１ローラから繰り出された前記型を第２ローラで巻き取る給送部と、
前記第１ローラと前記第２ローラとの間における前記型の張力を調整する調整部と、
前記基板の上の組成物を硬化させる硬化部と、
を有し、
前記第１ローラと前記第２ローラを用いて前記型を撓ませていくことにより、前記第１ローラと前記第２ローラとの間の前記型を前記基板の上の前記組成物と接触させ、
前記型を前記組成物と接触させた状態で前記硬化部により前記組成物を硬化させることにより、前記基板の上に前記組成物の平坦化層を形成し、
前記第１ローラと前記第２ローラを用いて前記型の張力を強めることにより、前記組成物から前記型を分離させる
ことを特徴とする平坦化層形成装置。 A flattening layer forming apparatus for forming a flattening layer of a composition on a substrate using a sheet-like mold.
A substrate holding portion that holds the substrate and
A feeding unit that winds the mold unwound from the first roller with the second roller,
An adjusting unit that adjusts the tension of the mold between the first roller and the second roller,
A cured portion that cures the composition on the substrate,
Have,
By bending the mold using the first roller and the second roller, the mold between the first roller and the second roller is brought into contact with the composition on the substrate.
By curing the composition with the cured portion in a state where the mold is in contact with the composition, a flattening layer of the composition is formed on the substrate.
A flattening layer forming apparatus, characterized in that the mold is separated from the composition by increasing the tension of the mold using the first roller and the second roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018129461A JP7104577B2 (en) | 2018-07-06 | 2018-07-06 | Flattening layer forming apparatus, flattening layer manufacturing method, and article manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018129461A JP7104577B2 (en) | 2018-07-06 | 2018-07-06 | Flattening layer forming apparatus, flattening layer manufacturing method, and article manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020009899A JP2020009899A (en) | 2020-01-16 |
| JP2020009899A5 true JP2020009899A5 (en) | 2021-07-26 |
| JP7104577B2 JP7104577B2 (en) | 2022-07-21 |
Family
ID=69152190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018129461A Active JP7104577B2 (en) | 2018-07-06 | 2018-07-06 | Flattening layer forming apparatus, flattening layer manufacturing method, and article manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7104577B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7507641B2 (en) | 2020-09-08 | 2024-06-28 | キヤノン株式会社 | Molding apparatus and method for manufacturing an article |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691223A (en) * | 1992-09-09 | 1994-04-05 | Toshiba Corp | Method for smoothing resin film |
| JPH08152718A (en) * | 1994-11-28 | 1996-06-11 | Nippon Seiko Kk | Exposure device |
| US20150111005A1 (en) | 2012-05-08 | 2015-04-23 | Asahi Kasei E-Materials Corporation | Transfer method and thermal nanoimprinting apparatus |
| KR20140109624A (en) | 2013-03-06 | 2014-09-16 | 삼성전자주식회사 | Large scaled imprint apparatus and method |
| CN105682808B (en) | 2013-08-19 | 2018-03-27 | 德克萨斯大学系统董事会 | With the film of the deposition User Defined profile of nanoscale accuracy programmable |
-
2018
- 2018-07-06 JP JP2018129461A patent/JP7104577B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7507641B2 (en) | 2020-09-08 | 2024-06-28 | キヤノン株式会社 | Molding apparatus and method for manufacturing an article |
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