JP6521518B2 - Apparatus for producing conductive material / article with microstructure, and method for producing conductive material / article with microstructure - Google Patents

Description

  The present invention relates to an apparatus for producing an article with a conductive material / microstructure and a method for producing an article with a conductive material / microstructure.

  An article (an article with a conductive material and a microstructure) 307 in which a fine structure 303 and an electrode 305 are provided in a resin film 301 is shown in FIG. The article 307 is expected to be used as a cell structure for sealing an organic light emitting body of an organic EL display.

  Conventionally, when manufacturing the article 307, after providing a material to be a structure on the resin film 301, a fine structure is formed from the above material by photolithography (photoresist application, exposure (patterning), development, etching, resist removal). After forming a body 303, an electrode 305 is provided by vapor deposition (see, for example, Patent Document 1).

International Publication No. WO2011 / 0202042

  By the way, in the above-mentioned conventional manufacturing method, since the photolithography method and the vapor deposition method are used, there is a problem that the manufacturing process is complicated. Further, in the above-mentioned conventional manufacturing method, an expensive dedicated device for performing the photolithography method and the vapor deposition method is required, and there is a problem that the manufacturing cost is increased.

  The present invention has been made in view of the above problems, and it is an object of the present invention to simplify the manufacturing process in a device for producing an article with a conductive material / microstructure and a method for producing an article with a conductive material / microstructure. To provide products that can be manufactured at low cost.

The invention according to claim 1 includes a resin layer setting step of providing an uncured resin layer on a substrate, and a conductive material setting step of providing an uncured conductive material on an original plate provided with a fine transfer pattern. A transfer step of transferring the fine transfer pattern of the original plate and the conductive material provided in the conductive material setting step onto the resin layer provided in the resin layer setting step; and the transfer step in the transfer step possess a curing step of curing the transferred and made resin layer and the conductive material, the substrate is formed into a film shape having a predetermined width, a take-up roll from the roll in a roll-to-roll The original plate is formed in a cylindrical or cylindrical shape, the fine transfer pattern is provided on the outer periphery of the original plate, and the resin layer setting step is performed by Anti and the said winding It is a process of providing an uncured resin layer on one side in the thickness direction of the substrate between the rolls, and the transfer step is a substrate between the raw material roll and the take-up roll. Conductive material / microstructure in which the transfer is performed by winding the base material on which the uncured resin layer is provided in the resin layer setting step so that the resin layer is in contact with the original plate It is a manufacturing method of an attached article.

The invention according to claim 2 is the method according to claim 1 , wherein the curing step includes a resin layer curing step of curing the resin layer, and the conductive material. Conductive material curing step of curing the resin layer, and the resin layer curing step is a step of curing the resin layer when the base material is wound around the original plate, the conductive material The curing step is a method of producing an article with a conductive material / microstructure, which is a step of curing the conductive material downstream of the original plate in the feed direction of the substrate.

The invention according to claim 3 is the method for producing an article with a conductive material / microstructure according to claim 1 or claim 2 , wherein the conductive material setting step is performed by using an anilox roll to form the fine plate of the original plate. Method for producing an article with a conductive material / microstructure, which is a step of providing an uncured conductive material at the tip of a transfer pattern.

In the method according to the fourth aspect of the present invention, in the method of manufacturing an article with a conductive material / microstructure according to the second aspect or the second aspect , the conductive material installing step includes uncured conductive material in an anilox roll. Providing the uncured conductive material on the original plate by transferring the uncured conductive material provided on the anilox roll to the original plate, and providing the uncured conductive material provided on the anilox roll It is a manufacturing method of the article with a conductive material and a microstructure, which has a conductive material dryness adjustment step of adjusting the dryness of the conductive material before transferring the material to the original plate.

The invention according to claim 5 is the method for producing an article with a conductive material / microstructure according to claim 1 or 2 , wherein the conductive material setting step is a conductive material not cured on the anilox roll. Forming the uncured conductive material on the original plate by transferring the uncured conductive material provided on the anilox roll to the original plate, and from the anilox roll in the conductive material setting step. It is a method of manufacturing an article with a conductive material / microstructure, comprising a cleaning step of cleaning the anilox roll after transferring an uncured conductive material to the original plate.

The invention according to claim 6 relates to the method for producing an article with a conductive material / microstructure according to claim 1 or 2 , wherein the conductive material setting step is a conductive material which is not cured on the anilox roll. Forming the uncured conductive material on the original plate by transferring the uncured conductive material provided on the anilox roll to the original plate, and providing the uncured conductive material provided on the anilox roll. The conductive material is not transferred from the anilox roll to the original plate in the conductive material dryness adjustment step of adjusting the dryness of the conductive material before the conductive material is transferred to the original plate, and the conductive material installation step. And a cleaning step of cleaning the anilox roll after transferring the conductive material of curing, which is a method for producing an article with a conductive material and a microstructure.

In the method according to the seventh aspect of the present invention, in the method of manufacturing an article with a conductive material / microstructure according to any one of the fourth to sixth aspects, the conductive material setting step includes It is a process of providing an uncured conductive material at the tip of a transfer pattern, which is a method for producing a conductive material / microstructure-attached article.

The invention according to claim 8 comprises a resin layer installation part for providing an uncured resin layer on a substrate, and a conductive material installation part for providing an uncured conductive material on an original plate provided with a fine transfer pattern. A transfer portion for transferring the fine transfer pattern of the original plate and the conductive material provided in the conductive material setting portion to the resin layer provided in the resin layer setting portion; transfer by the transfer portion a curing section for curing the transferred resin layer was made and the conductive material possess, the substrate is formed into a film having a predetermined width, the film-like substrate is wound into a roll A roll material installation section for installing a roll material roll, and a take-up roll installation unit provided with a take-up roll for taking up a substrate fed from the roll material fabric installed in the roll material installation section Have been installed in the roll material installation section The base material between the roll material roll and the take-up roll installed in the take-up roll setting portion is configured to be sent from the roll material roll to the take-up roll by roll-to-roll, The resin layer installation portion is one surface of the base material in the thickness direction between the roll material roll installed in the roll material installation portion and the winding roll installed in the winding roll installation portion. The original plate is formed in a cylindrical or cylindrical shape, the fine transfer pattern is provided on the outer periphery of the original plate, and the transfer portion is formed by It is a base material between the roll material roll installed in the roll material roll installation part and the winding roll installed in the winding roll installation part, and the uncured resin layer is the resin layer installation part The resin layer provided on the substrate Way that wound around the original contact, a manufacturing apparatus of a conductive material, the microstructure with the article being configured to perform the transfer.

The invention according to claim 9 is the apparatus for manufacturing an article with a conductive material / microstructure according to claim 8 , wherein the curing section cures the resin layer, and the conductive material. A conductive material curing portion for curing the resin layer, and the resin layer curing portion is configured to cure the resin layer when the base material is wound around the original plate, The conductive material curing portion is an apparatus for producing a conductive material / microstructure-attached article configured to cure the conductive material downstream of the original plate in the feed direction of the base material.

The invention according to claim 10 is the apparatus for manufacturing an article with a conductive material / microstructure according to claim 8 or claim 9 , wherein the conductive material installation portion uses an anilox roll to make the fine size of the original plate. An apparatus for manufacturing an article with a conductive material / microstructure configured to provide an uncured conductive material at the tip of a transfer pattern.

The invention according to claim 11 is the apparatus for manufacturing an article with a conductive material / microstructure according to claim 8 or 9 , wherein the conductive material setting portion is a conductive material which is not cured on the anilox roll. And the uncured conductive material provided on the anilox roll is transferred to the original plate to provide the uncured conductive material on the original plate, and the uncured conductive material provided on the anilox roll is provided. An apparatus for producing an article with a conductive material / microstructure having a conductive material dryness adjusting portion for adjusting the dryness of a conductive material before transferring the conductive material of curing to the original plate. It is.

The invention according to claim 12 is the apparatus for manufacturing an article with a conductive material / microstructure according to claim 8 or 9 , wherein the conductive material installation portion is a conductive material not cured on the anilox roll. The uncured conductive material is provided on the original plate by transferring the uncured conductive material provided on the anilox roll to the original plate, and the uncured conductive material is provided on the original plate. It is an apparatus for manufacturing an article with a conductive material / microstructure having a cleaning unit that cleans the anilox roll after transferring the uncured conductive material from the anilox roll to the original plate.

The invention according to a thirteenth aspect is the apparatus for manufacturing an article with a conductive material / microstructure according to the eighth aspect or the ninth aspect , wherein the conductive material setting portion is a conductive material not cured on the anilox roll. And the uncured conductive material provided on the anilox roll is transferred to the original plate to provide the uncured conductive material on the original plate, and the uncured conductive material provided on the anilox roll is provided. A conductive material drying degree adjusting unit for adjusting the drying degree of the conductive material before the conductive material is transferred to the original plate, and the conductive material installation portion from the anilox roll in the conductive material setting portion. It is an apparatus for manufacturing an article with a conductive material / microstructure having a cleaning unit for cleaning the anilox roll after transferring an uncured conductive material to an original plate.

The invention according to claim 14 is the apparatus for manufacturing an article with a conductive material and a fine structure according to any one of claims 11 to 13 , wherein the conductive material installation portion is a fine structure of the original plate. An apparatus for manufacturing an article with a conductive material / microstructure configured to provide an uncured conductive material at the tip of a transfer pattern.

  According to the present invention, it is possible to simplify the manufacturing process and to manufacture at low cost, in an apparatus for manufacturing an article with a conductive material / microstructure and a method for manufacturing an article with a conductive material / microstructure. The effect of being able to

It is a perspective view showing a schematic structure of an article with a conductive material and a microstructure concerning an embodiment of the present invention. It is a figure which shows schematic structure of the manufacturing apparatus of the electroconductive material and the object with a microstructure concerning the embodiment of the present invention. It is a figure which shows schematic structure of the manufacturing apparatus of the electroconductive material and the articles | goods with a microstructure concerning the modification.

  An article 1 produced by the method for producing a conductive material / microstructure-attached article according to an embodiment of the present invention is used in the same manner as the conventional one.

  A conductive material / microstructure-attached article (hereinafter sometimes referred to as "article") 1 comprises a resin film (base material) 3, a microstructure 5 and an electrode 7 as shown in FIG. It is configured to be equipped.

  The substrate 3 is formed in a long (long) thin plate shape (film shape) with a predetermined width, and the microstructure 5 is provided on one surface in the thickness direction of the substrate 3 . The electrode 7 is provided at the bottom of the recess 9 of the microstructure 5.

  Microstructure 5 is, for example, layered with a predetermined thickness to cover one surface in the thickness direction of substrate 3, and recess 9 is a surface of substrate 5 (substrate 3). It is recessed on the side of the base material 3 by a predetermined depth from the surface opposite to the surface in contact). A plurality of recesses 9 are provided, and they are arranged at predetermined intervals.

  Next, a method of manufacturing the article (product or semi-finished product) 1 will be described with reference to FIG.

  First, an uncured (before curing) resin layer (for example, a layer of an ultraviolet light curable resin; a layer of a photocurable resin) 11 is provided on one surface of the film-like substrate 3 in the thickness direction (resin layer setting) Process).

  When the resin layer 11 is provided in the resin layer installation step, the thickness direction of the substrate 3 and the thickness direction of the resin layer 11 coincide with each other, and one surface of the substrate 3 in the thickness direction is It is covered with an uncured resin layer 11.

  Subsequently, an uncured conductive material (for example, a conductive material) is applied to the fine transfer pattern 13 of the original plate 15 on which the fine transfer pattern (transfer pattern formed with fine irregularities; convex fine structure) 13 is provided. Ink) 17 is provided (conductive material installation step).

  Subsequently, the fine transfer pattern 13 of the original plate 15 and the uncured conductive material 17 provided in the conductive material installation step are simultaneously transferred to the uncured resin layer 11 provided in the resin layer installation step. (Transfer process).

  Subsequently, the resin layer 11 and the conductive material 17 which have been transferred by transfer in the transfer step are cured (curing step).

  In the curing step, the shape of the microstructure 5 formed in the transfer step is maintained as it is and the resin layer 11 is cured, and the shape of the conductive material 17 formed in the transfer step is maintained as it is. The conductive material 17 is to be cured.

  The resin layer 11 cured in the curing step becomes the microstructure 5, and the conductive material 17 cured in the curing step becomes the electrode 7.

  Further, in the case shown in FIG. 2, the conductive material 17 (electrode 7) is provided on the resin layer 11 (fine structure 5) provided on the substrate 3 by the transfer step and to which the fine transfer pattern has been transferred. However, the electrode 7 may be provided directly on the substrate 3 in contact with the substrate 3. Even in this case, a part of the electrode 7 is in contact with the microstructure 5.

  By the way, the base material 3 is formed in the shape of a long film with a predetermined width, and is configured to be fed from the raw roll material 19 to the take-up roll 21 by roll-to-roll.

  The original plate 15 is formed in a cylindrical or cylindrical shape, and the fine transfer pattern 13 is provided, for example, seamlessly on the outer periphery of the original plate 15.

In the resin layer setting step, for example, a horizontally long base material between the raw roll 19 and the take-up roll 21 (from the raw roll 19 to the take-up roll 21 at a constant speed) The uncured resin layer 11 is provided on one surface (for example, the upper surface) of the base material 3 in the thickness direction.

In the transfer step, the resin layer 11 is brought into contact with the base material 3 between the raw roll 19 and the take-up roll 21 and provided with the uncured resin layer 11 in the resin layer installation step. The transfer is performed by rotating the original plate 15 in synchronization with, for example, the lower side of the original plate 15 and in synchronization with the feed speed of the substrate 3 from the raw roll 19 to the take-up roll 21 There is.

  In the curing step, the resin layer 11 and the conductive material 17 are cured in a state where the base material 3 is sent from the raw roll material 19 to the take-up roll 21 at a constant speed.

  Further, the curing process is configured of a resin layer curing process of curing the resin layer 11 and a conductive material curing process of curing the conductive material 17.

In the resin layer curing step, the resin layer 11 is cured when the base material 3 between the raw roll 19 and the take-up roll 21 is wound around the original plate 15.

In the conductive material curing step, after the base material 3 wound around the original plate 15 between the raw roll 19 and the take-up roll 21 is separated from the original plate 15, the feed direction of the base material 3 (from the raw roll 19) The conductive material 17 is hardened on the downstream side (winding roll 21 side) of the original plate 15 in the direction toward the winding roll 21).

  In the conductive material setting step, the uncured conductive material 17 is provided only on the tip 25 of the fine transfer pattern 13 of the original plate 15 using the anilox roll 23.

  In the conductive material installation step, the anilox roll 23 is provided with the uncured conductive material 17. Then, by transferring the uncured conductive material 17 provided on the anilox roll 23 to the original plate 15, the uncured conductive material 17 is provided on the original plate 15.

  The uncured conductive material 17 provided on the anilox roll 23 is semi-dried by, for example, a conductive material dryness adjustment step using heating of the heater 51 before the conductive material 17 is transferred to the original plate 15. It is designed to be in the state (semi-dry state ink).

  Further, after transferring the uncured conductive material 17 from the anilox roll 23 to the original plate 15 in the conductive material installation step, the conductive material 17 remaining on the anilox roll 23 is cleaned by a cleaning step using an adhesive, for example. It is adhered and removed, and the anilox roll 23 is cleaned.

  According to the manufacturing method of the article 1, the fine transfer pattern 13 and the conductive material 17 are made of the resin material 11 of the base material 3 using the original plate 15 instead of using the photolithography method or the vapor deposition method as in the prior art. Since the manufacturing process is simplified, the article 1 can be manufactured at low cost.

  Moreover, according to the method of manufacturing the article 1, since the fine transfer pattern 13 and the conductive material 17 are provided on the resin material 11 of the base 3 using the original plate 15, the case of enlarging the area of the article 1 In the case where the size of the article 1 is increased, the original plate 15 may be enlarged. This makes it easy to increase the area of the article 1 as compared to the conventional case of using the photolithography method and the vapor deposition method.

Further, according to the method of manufacturing the article 1, the substrate 3 is configured to be fed from the raw roll 19 to the take-up roll 21 by roll-to-roll, and the raw roll 19 and the take-up roll 21 Since the transfer process is performed by winding the base plate 3 between the base plate 3 and the uncured resin layer 11 provided on the master plate 15, the article 1 can be continuously and efficiently manufactured. While being possible, the area of the article 1 can be further increased.

  Further, according to the manufacturing method of the article 1, since the resin layer 11 is cured when the substrate 3 is wound around the original plate 15, the shape of the fine transfer pattern 13 transferred from the original plate 15 to the resin layer 11 The resin layer 11 can be provided with a fine transfer pattern 13 of an accurate shape without breaking.

  Further, according to the method of manufacturing the article 1, since the conductive material 17 is cured on the downstream side of the original plate 15, an external force is applied to the conductive material 17 which is less likely to be elastically deformed than the resin layer 11 when cured. The external force (generated by winding around the original plate 15) is not applied, and a defect such as deformation of the electrode 7 can be prevented.

  Further, according to the manufacturing method of the article 1, since the uncured conductive material 17 is provided on the tip 25 of the fine transfer pattern 13 of the original plate 15 using the anilox roll 23, the fine transfer of the original plate 15 is performed. The conductive material 17 can be provided uniformly at the tip 25 of the pattern 13, and the conductive material 17 can be provided only at the bottom of the microstructure 5 formed on the resin layer 11. The clogging of the fine transfer pattern 13 with the conductive material 17 can be reduced.

  Further, in the manufacturing method of the article 1, if a metal paste is used instead of the conductive ink 17, for example, a deflection plate or the like in which an electrode is formed by vapor-depositing metal after forming the microstructure 5 as in the prior art The optical element (wire grid type polarizer) can be further manufactured in a large area at low cost.

  Further, according to the manufacturing method of the article 1, the uncured conductive material 17 provided on the anilox roll 23 is semi-dried before the conductive material 17 is transferred to the original plate 15 by the conductive material dryness adjustment step. In this state, the shape of the conductive material 17 is not easily deformed, and the conductive material 17 can be provided on the resin layer 11 in an accurate manner.

  In addition, the conductive material 17 is easily transferred from the anilox roll 23 to the original plate 15 by adjusting the drying degree of the conductive material 17 in the conductive material dryness adjusting step, and the conductive material 17 from the anilox roll 23 to the original plate 15 The conductive material 17 is less likely to remain on the anilox roll 23 when the transfer is completed.

  Further, according to the manufacturing method of the article 1, since the anilox roll 23 is cleaned after transferring the uncured conductive material 17 from the anilox roll 23 to the original plate 15 in the cleaning step, the conductive material 17 is anilox roll 23 To the original plate 15 in an accurate manner.

  Further, according to the manufacturing method of the article 1, the uncured conductive material 17 provided on the anilox roll 23 is semi-dried before the conductive material 17 is transferred to the original plate 15 by the conductive material dryness adjustment step. The anilox roll 23 is cleaned after transferring the uncured conductive material 17 from the anilox roll 23 to the original plate 15 by the cleaning process, so the semi-dry conductive material 17 is removed when the anilox roll 23 is cleaned. It may be removed from the anilox roll 23 and the anilox roll 23 can be easily cleaned.

  By the way, the method of manufacturing the article 1 described above can be performed, for example, by one manufacturing apparatus 27 described below.

  The manufacturing apparatus (apparatus for manufacturing an article with a conductive material / microstructure) 27 is configured to include a resin layer setting unit 61, a conductive material setting unit 63, a transfer unit 65, and a curing unit 35. .

  In the resin layer setting portion 61, the uncured resin layer 11 is provided on the base material 3. In the conductive material setting portion 63, the uncured conductive material 17 is provided on the original plate 15 on which the fine transfer pattern 13 is provided.

  In the transfer unit 65, the fine transfer pattern 13 of the original plate 15 and the conductive material 17 provided in the conductive material setting unit 63 are transferred onto the resin layer 11 provided in the resin layer setting unit 61. ing.

  The curing unit 35 cures the resin layer 11 and the conductive material 17 which have been transferred by transfer in the transfer unit 65.

  Further, the manufacturing apparatus 27 is provided with a roll material installation portion 29 and a winding roll installation portion 31.

  In the roll material setting portion 29, a roll material 19 in which a film-like base 3 is wound in a roll shape is provided.

  A take-up roll 21 is provided on the take-up roll setting unit 31. The take-up roll 21 takes up the base material 3 drawn from the roll raw fabric 19 installed in the roll raw fabric installation unit 29.

And the base material 3 between the roll original fabric 19 installed in the roll original fabric installation part 29 and the winding roll 21 installed in the winding roll installation part 31 is a roll-to-roll roll. For example, it is comprised so that it may be sent at a fixed speed from the material roll 19 to the winding roll 21. As shown in FIG.

The resin layer setting unit 61 is provided in the thickness direction of the base material 3 between the roll material 19 installed in the roll material installation unit 29 and the winding roller 21 installed in the winding roll installation unit 31. It is comprised so that the unhardened resin layer 11 may be provided in one side.

  The original plate 15 is formed in a cylindrical or cylindrical shape, and the fine transfer pattern 13 is provided seamlessly over the outer periphery of the original plate 15, for example, all around.

The transfer unit 65 is a base material 3 between the roll material roll 19 installed in the roll material installation part 29 and the take-up roll 21 provided in the take-up roll installation part 31, and the resin layer is provided. The transfer is performed by winding the base material 3 provided with the uncured resin layer 11 in the portion 61 on the original plate 15 so that the resin layer 11 is in contact.

  The curing unit 35 includes a resin layer curing unit 37 that cures the resin layer 11 and a conductive material curing unit 39 that cures the conductive material 17.

  The resin layer curing unit 37 is configured to cure the resin layer 11 when the base material 3 is wound around the original plate 15.

  The conductive material curing portion 39 is configured to cure the conductive material 17 on the downstream side (the take-roll installation portion 31 side) of the original plate 15 in the feed direction of the base material 3.

  In the curing section 35, the resin layer 11 and the conductive material 17 are cured in a state in which the base material 3 is sent from the roll stock 19 to the take-up roll 21 at a constant speed.

  The conductive material setting portion 63 is configured to provide the uncured conductive material 17 at the tip 25 of the fine transfer pattern 13 of the original plate 15 using the anilox roll 23.

  Further, the conductive material setting portion 63 provides the anilox roll 23 with the uncured conductive material 17 and transfers the uncured conductive material 17 provided in the anilox roll 23 to the original plate 15 to obtain the original plate 15. An uncured conductive material 17 is provided.

  In addition, the manufacturing apparatus 27 is provided with a conductive material dryness adjustment unit 67 and a cleaning unit 69 shown in FIG.

  The conductive material dryness adjusting portion 67 heats the uncured conductive material 17 provided on the anilox roll 23 with the heater 51, for example, before the conductive material 17 is transferred to the original plate 15. To dryness (semi-dry ink).

  After the cleaning section (cleaning module) 69 transfers the uncured conductive material 17 from the anilox roll 23 to the original plate 15 at the conductive material installation section 63, for example, the conductive material remaining on the anilox roll 23 using an adhesive. The anilox roll 23 is cleaned by adhering and removing the elastic material (the rest of the semi-dried conductive material) 17.

  To explain further, the manufacturing apparatus 27 is configured to include one base body (not shown), and the roll material installation part 29, the winding roll installation part 31, the resin layer installation part 61, and the anilox The roll 23, the original plate 15, the curing unit 35 and the like are provided on the one base body. Thus, the manufacturing device 27 is formed as a single device. Therefore, when the manufacturing apparatus 27 is transported and installed, the one base body may be transported and installed.

  The raw roll material 19 is formed in a cylindrical shape by winding a long film-like base material 3 having a predetermined width around a cylindrical core member 41 in a roll shape. The take-up roll 21 also becomes cylindrical by winding the long base material 3 having a predetermined width around the cylindrical core member 43 in a roll shape. The base material 3 is moved from the roll stock 19 to the winding roll 21 at a predetermined speed by roll to roll (Roll to Roll) by appropriately rotating the roll stock 19 and the winding roll 21. It is supposed to The original plate 15 and the anilox roll 23 are also formed in a cylindrical shape.

  The base material 3 is configured to be wound around the lower side of the outer periphery of the original plate 15 about a half turn. The manufacturing device 27 is provided with a cylindrical first film transport roll 45 and a cylindrical second film transport roll 47.

  The base material 3 is wound around the first film transport roll 45 and the second film transport roll 47. Thus, the base material 3 is guided and wound around the original plate 15 about a half turn.

  The central axis of the roll material 19 installed in the roll material installation unit 29, the central axis of the take-up roll 21 installed in the take-up roller installation unit 31, the central axis of the anilox roll 23, and the center of the original plate 15. The axis and the central axes of the film transport rolls 45 and 47 are parallel to each other, and extend in the direction orthogonal to the paper surface of FIG. Further, the direction orthogonal to the paper surface of FIG. 2 is the width direction of the base material 3.

  An uncured conductive material 17 is supplied to the outer periphery of the anilox roll 23 from an ink supply device (not shown) via a doctor blade 49. The uncured conductive material 17 supplied to the outer periphery of the anilox roll 23 is smoothed and adjusted by the doctor blade 49.

  The outer periphery of the original plate 15 and the outer periphery of the anilox roll 23 are in contact with each other with a predetermined biasing force, and the anilox roll 23 rotates around this central axis, and the original plate 15 rotates around this central axis. It rotates in the opposite direction to the roll 23. The anilox roll 23 and the original plate 15 form a rolling pair, and the circumferential speed at the outer periphery of the anilox roll 23 and the circumferential speed at the outer periphery of the original plate 15 coincide with each other.

  Then, the uncured conductive material 17 is transferred from the anilox roll 23 to the outer periphery of the original plate 15 (for example, the flat end 25 of the fine transfer pattern 13).

  As described above, the base material 3 is wound around the original plate 15 about a half turn. The wound base material 3 includes the roll original fabric 19 installed in the roll original fabric installation unit 29, the winding roll 21 installed in the winding roll installation unit 31, the original plate 15, and the respective films. As the transport rolls 45 and 47 rotate, they move in the longitudinal direction at a predetermined speed (from the roll stock 19 to the winding roll 21).

  The moving speed (feed speed) of the base 3, the peripheral speed of the outer periphery of the original plate 15, and the peripheral speeds of the outer peripheries of the respective film transport rolls 45 and 47 coincide with each other.

  Then, the uncured conductive material 17 is transferred from the original plate 15 to the uncured resin layer 11 of the substrate 3 wound around the original plate 15, and the fine transfer pattern 13 of the original plate 15 is transferred. ing.

  The resin layer curing unit 37 is configured to generate ultraviolet light. For example, the resin layer curing unit 37 is disposed below the original plate 15, and ultraviolet light is directed upward from the outside of the base 3 wound around the original plate 15. The light is irradiated to cure the photocurable resin layer (the resin layer to which the fine transfer pattern 13 is transferred) 11 provided on the base material 3. The ultraviolet light is transmitted through the substrate 3.

The conductive material curing portion 39 is formed of, for example, a heater, and a base ( long in the horizontal direction) elongated on the downstream side of the original plate 15 (the fine transfer pattern 13 is transferred and cured, and the conductive layer is conductive It is disposed above the substrate 3 on which the material 17 is provided. Then, the base material 3 (conductive material 17) is heated. The conductive material 17 is crystallized by this heating to form the electrode 7.

  In this manner, the formation of the microstructure 5 and the formation of the electrode 7 can be continuously performed by one manufacturing device 27, and the article 1 can be continuously and efficiently manufactured.

  Here, the cleaning unit 69 will be described in detail with reference to FIG. 3 (a).

  As described above, the cleaning unit 69 is a device for removing the residue of the anilox roll 23, and, for example, unnecessary matter on the outer periphery of the anilox roll 23 (the conductive material 17 remaining without being transferred to the original plate 15) By removing the anilox roll 23.

  The cleaning unit 69 is configured to include a delivery roll setting unit 71, an adhesive film winding unit 73, and an adhesive film backup roll 75.

  A delivery roll 77 is installed on the delivery roll installation section 71. The delivery roll 77 is formed in a roll shape (cylindrical or cylindrical shape) by winding the adhesive film 79.

  Describing in detail, the delivery roll 77 is formed in a cylindrical or cylindrical shape by overlapping and winding the adhesive film 79 before use on the outer periphery of the cylindrical or cylindrical core member 81. The pressure-sensitive adhesive film 79 before use has a layered pressure-sensitive adhesive portion (pressure-sensitive adhesive) 85 provided on one surface in the thickness direction of a sheet-like base material 83 formed to have a predetermined width and a long length. In addition, the width method of the adhesive film 79 is a direction orthogonal to the paper surface of FIG.

  In the adhesive film winding unit 73, the adhesive film 79 fed out from the delivery roll 77 installed in the delivery roll installation unit 71 is taken up and formed into a roll shape.

  Specifically, a cylindrical or cylindrical core member 87 is installed in the adhesive film take-up portion 73, and the core member 87 winds up the adhesive film 79 which is being fed from the delivery roll 77. The pressure-sensitive adhesive film 79 is formed in a roll shape (a winding roll 89 is formed).

  A cylindrical or cylindrical adhesive film backup roll 75 is configured to be wound with an adhesive film 79 which is fed out from a delivery roll 77 installed in a delivery roll installation section 71.

  Then, the adhesive film backup roll 75 is extended from the delivery roll 77 installed in the delivery roll installation portion 71 (the extension between the delivery roll 77 and the take-up roll 89 with a predetermined tension without slack). The sheet-like adhesive film 79 is held in cooperation with the anilox roll 23 such that the adhesive 85 of the adhesive film 79 contacts the anilox roll 23.

  Then, when the anilox roll 23 rotates in a state where the adhesive film 79 is sandwiched between the anilox roll 23 and the adhesive film backup roll 75, the adhesive film backup roll 75 also rotates in synchronization with the anilox roll 23. There is.

  Then, the anilox roll 23 and the adhesive film backup roll 75 sandwich the adhesive film 79 and synchronously rotate so that the surface of the adhesive film 79 on which the adhesive 85 is provided temporarily contacts the anilox roll 23. It sticks and the unnecessary substance adhering to the anilox roll 23 is stuck to the adhesive 85, and is removed, and the anilox roll 23 is cleaned.

  In the cleaning unit 69 configured in this way, the cleaning unit 69 (adhesive film 79) is intermittently brought into contact with the anilox roll 23 without constantly cleaning the anilox roll 23, and the anilox roll 23 is intermittently It may be configured to be cleaned.

  Also, the cleaning unit 69 may be configured as shown in FIG. That is, the unnecessary matter adhering to the outer periphery of the anilox roll 23 may be scraped off by the blade 93, and the scraped unnecessary matter may be sucked by the suction unit 95.

DESCRIPTION OF SYMBOLS 1 electroconductive material and articles with microstructures 3 base material 11 resin layer 13 transfer pattern 15 original plate 17 electroconductive material 19 roll material 21 take-up roll 23 anilox roll 25 tip of fine transfer pattern 27 electroconductive material and microstructure Equipment for manufacturing articles with body 29 Roll raw material installation part 31 Take-up roll installation part 35 Cured part 37 Resin layer cured part 39 Conductive material cured part 61 Resin layer installation part 63 Conductive material installation part 65 Transfer part 67 Conductive material Drying degree adjustment unit 69 Cleaning unit

Claims (14)

A resin layer setting step of providing an uncured resin layer on the substrate;
A conductive material setting step of providing an uncured conductive material on an original plate provided with a fine transfer pattern;
A transfer step of transferring the fine transfer pattern of the original plate and the conductive material provided in the conductive material setting step onto the resin layer provided in the resin layer setting step;
And a curing step of curing the conductive layer and the resin layer on which the transfer has been performed in the transfer step , wherein the substrate is formed into a film having a predetermined width, and is roll-to-roll. It is configured to be sent from the roll material to the take-up roll,
The original plate is formed in a cylindrical or cylindrical shape, and the fine transfer pattern is provided on the outer periphery of the original plate,
The resin layer setting step is a step of providing an uncured resin layer on one surface of the base material in the thickness direction between the raw material roll and the winding roll,
In the transfer step, the resin layer is in contact with the base material between the raw material roll and the take-up roll, on which the uncured resin layer is provided in the resin layer installation step. It is a process which performs the said transfer by winding on the said original plate, The manufacturing method of the electroconductive material and the article with a microstructure characterized by the above-mentioned . In the method of producing an article with a conductive material / microstructure according to claim 1 ,
The curing step includes a resin layer curing step of curing the resin layer, and a conductive material curing step of curing the conductive material.
The resin layer curing step is a step of curing the resin layer when the base material is wound around the original plate,
The method for manufacturing a conductive material / microstructure-containing article, wherein the conductive material curing step is a step of curing the conductive material on the downstream side of the original plate in the feed direction of the base material. In the method of producing an article with a conductive material / microstructure according to claim 1 or 2 ,
The conductive material setting step is a step of providing an uncured conductive material at the tip of the fine transfer pattern of the original plate using an anilox roll, and producing an article with a conductive material and a microstructure. Method. In the method of producing an article with a conductive material / microstructure according to claim 1 or 2 ,
In the conductive material setting step, the anilox roll is provided with an uncured conductive material, and the uncured conductive material provided in the anilox roll is transferred to the original plate to obtain an uncured conductive material in the original plate. Process of providing
The uncured conductive material provided on the anilox roll is characterized by having a conductive material dryness adjustment step for adjusting the dryness of the conductive material before the conductive material is transferred to the original plate. Method of producing an article with a conductive material and a microstructure. In the method of producing an article with a conductive material / microstructure according to claim 1 or 2 ,
In the conductive material setting step, the anilox roll is provided with an uncured conductive material, and the uncured conductive material provided in the anilox roll is transferred to the original plate to obtain an uncured conductive material in the original plate. Process of providing
An article with a conductive material and a microstructure, comprising a cleaning step of cleaning the anilox roll after transferring the uncured conductive material from the anilox roll to the original plate in the conductive material setting step Production method. In the method of producing an article with a conductive material / microstructure according to claim 1 or 2 ,
In the conductive material setting step, the anilox roll is provided with an uncured conductive material, and the uncured conductive material provided in the anilox roll is transferred to the original plate to obtain an uncured conductive material in the original plate. Process of providing
A conductive material drying degree adjusting step of adjusting the degree of drying of the conductive material before the conductive material is transferred to the original plate, the uncured conductive material provided on the anilox roll;
A cleaning step of cleaning the anilox roll after transferring the uncured conductive material from the anilox roll to the original plate in the conductive material setting step;
A method for producing a conductive material / microstructure-attached article characterized by comprising: In the method of producing an article with a conductive material / microstructure according to any one of claims 4 to 6 ,
The method for producing an article with a conductive material / microstructure, wherein the conductive material setting step is a step of providing an uncured conductive material at the tip of the fine transfer pattern of the original plate. A resin layer setting unit for providing an uncured resin layer on a substrate;
A conductive material setting unit for providing an uncured conductive material on an original plate provided with a fine transfer pattern;
A transfer unit for transferring the fine transfer pattern of the original plate and the conductive material provided in the conductive material setting unit onto the resin layer provided in the resin layer setting unit;
A curing portion for curing the resin layer on which the transfer has been performed by the transfer at the transfer portion and the conductive material;
Have a, the substrate is formed into a film having a predetermined width,
A roll material installation section for installing a roll material fabric in which the film-like substrate is wound in a roll shape;
A take-up roll setting unit on which a take-up roll for taking up a base material fed from a roll material roll installed in the roll material roll installation unit is installed;
The base material between the roll material roll installed in the roll material roll installation part and the winding roll set in the winding roll installation part is a roll material roll by roll-to-roll Are configured to be sent to the take-up roll from
The resin layer installation portion is one surface of the base material in the thickness direction between the roll material roll installed in the roll material installation portion and the winding roll installed in the winding roll installation portion. To provide an uncured resin layer on the
The original plate is formed in a cylindrical or cylindrical shape, and the fine transfer pattern is provided on the outer periphery of the original plate,
The transfer portion is a base material between a roll material roll installed in the roll material roll installation portion and a winding roll installed in the winding roll installation portion, and has not been transferred by the resin layer installation portion A conductive material / microstructure characterized in that the transfer is performed by winding a base material provided with a cured resin layer on the original plate so that the resin layer is in contact with the base material. Equipment for manufacturing of attached items. In the apparatus for producing an article with a conductive material / microstructure according to claim 8 ,
The curing unit includes a resin layer curing unit that cures the resin layer, and a conductive material curing unit that cures the conductive material.
The resin layer curing unit is configured to cure the resin layer when the base material is wound around the original plate,
The conductive material cured portion is configured to cure the conductive material on the downstream side of the original plate in the feed direction of the base material, the conductive material / microstructure-attached article manufacturing device. In the apparatus for producing an article with a conductive material / microstructure according to claim 8 or 9 ,
The conductive material installation portion is configured to provide an uncured conductive material at the tip of the fine transfer pattern of the original plate using an anilox roll. Article manufacturing equipment. In the apparatus for producing an article with a conductive material / microstructure according to claim 8 or 9 ,
The conductive material installation unit provides an anilox roll with an uncured conductive material, and transfers the uncured conductive material provided in the anilox roll to the original plate to obtain an uncured conductive material in the original plate. Are configured to provide
The uncured conductive material provided on the anilox roll is characterized by having a conductive material drying degree adjusting portion for adjusting the drying degree of the conductive material before the conductive material is transferred to the original plate. Manufacturing equipment for conductive materials and articles with microstructures. In the apparatus for producing an article with a conductive material / microstructure according to claim 8 or 9 ,
The conductive material installation unit provides an anilox roll with an uncured conductive material, and transfers the uncured conductive material provided in the anilox roll to the original plate to obtain an uncured conductive material in the original plate. Are configured to provide
An article provided with a conductive material / microstructure, comprising: a cleaning unit that cleans the anilox roll after transferring the uncured conductive material from the anilox roll to the original plate at the conductive material setting unit manufacturing device. In the apparatus for producing an article with a conductive material / microstructure according to claim 8 or 9 ,
The conductive material installation unit provides an anilox roll with an uncured conductive material, and transfers the uncured conductive material provided in the anilox roll to the original plate to obtain an uncured conductive material in the original plate. Are configured to provide
An uncured conductive material provided on the anilox roll, a conductive material dryness adjusting portion for adjusting the dryness of the conductive material before the conductive material is transferred to the original plate;
A cleaning unit configured to clean the anilox roll after transferring the uncured conductive material from the anilox roll to the original plate at the conductive material installation unit;
An apparatus for producing a conductive material / microstructure-attached article characterized by comprising: The apparatus for producing a conductive material / microstructure-attached article according to any one of claims 11 to 13 ,
The apparatus for manufacturing an article with a conductive material / microstructure, wherein the conductive material setting unit is configured to provide an uncured conductive material at the tip of the fine transfer pattern of the original plate.

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