JP2020003390A - Pressure-sensitive sensor manufacturing method and pressure-sensitive sensor - Google Patents

Abstract

To provide a pressure-sensitive sensor with which the density of pressure detection points is heightened and a resolution is improved while suppressing the dispersion of sensitivity at a plurality of detection points from increasing.SOLUTION: A coating of ink that includes second conductive particles whose electrical conductivity is lower than first conductive particles is applied to the entire surface of a first region by screen printing and the ink is dried thereafter, and the second conductive particles electrically bound to each other by a polymer binder form a first pressure-sensitive layer that is in contact with the first conductive particles of a first electrode. First pattering is performed by which the first pressure-sensitive layer in a plurality of first insulating regions between mutually adjacent first electrodes among a plurality of first electrodes is cut off along a first direction using a pulse oscillation laser in wavelength of 2 μm or less to separate the first pressure-sensitive layer into a plurality of insulated first pressure-sensitive zones, and each of the plurality of first electrodes extended in the first direction is arranged adjoining one of the plurality of pressure-sensitive zones that corresponds.SELECTED DRAWING: Figure 7

Description

  The technical field relates to a method of manufacturing a pressure-sensitive sensor, and more particularly to a method of manufacturing a pressure-sensitive sensor of a resistive film type having a plurality of detection points, and a pressure-sensitive sensor manufactured by the manufacturing method.

As described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2011-133421), among the conventionally known pressure-sensitive sensors, a relationship between a magnitude of a pressure applied to two electrodes and a magnitude of a resistance value is described. There is a pressure sensor (or also referred to as a pressure-sensitive sensor) that detects the magnitude of the pressure applied to two electrodes by using. The two electrodes are formed by applying a conductive paste such as a silver paste to the two plastic films using screen printing or the like. In addition, pressure-sensitive layers are formed on surfaces of the two electrodes facing each other in order to convert the magnitude of pressure into the magnitude of resistance. These pressure-sensitive layers are formed, for example, by applying a carbon paste to the electrode surface using screen printing or the like.
Such a pressure-sensitive sensor is provided with a spacer so that the pressure-sensitive layers provided on the surfaces of the two electrodes do not come into contact with each other when no pressure is applied between the two electrodes.

JP 2011-133421 A

In order to arrange a plurality of detection points in which the pressure-sensitive ink members described in Patent Document 1 are arranged in a matrix, for example, one of two plastic films arranged in parallel to the XY plane is parallel to the X axis. It is conceivable to form a plurality of electrodes in parallel with each other and to form a plurality of electrodes parallel to the Y axis on the other. As described above, when a plurality of detection locations are arranged in a matrix, the plurality of detection locations are distributed over a wide range.
In such a pressure-sensitive sensor in which the detection points are arranged in a matrix, even if the distance between the electrodes is reduced to increase the number of detection points distributed per unit area, the sensitivity of the detection points may vary due to the influence of the spacer. In addition, it is difficult to increase the density of the detection points in order to secure a place where the spacer is provided.

  A pressure sensor having a plurality of detection points has a problem of improving the resolution by increasing the density of the pressure detection points while suppressing a variation in sensitivity at the plurality of detection points. There is a problem of facilitating the manufacture of the sensor.

Hereinafter, a plurality of modes will be described as means for solving the problems. These embodiments can be arbitrarily combined as needed.
A manufacturing method of a pressure-sensitive sensor according to a first aspect includes preparing a first insulating substrate made of a resin including a first region where sensing is performed and having a thickness of 200 μm or less, and applying a conductive paste to the first region by screen printing. Forming a plurality of first electrodes containing first conductive particles electrically coupled to each other in a polymer binder, and forming a plurality of first electrodes. After forming the plurality of first electrodes, the plurality of first electrodes are more conductive than the first conductive particles. An ink containing the second conductive particles having a low ratio is applied to the entire surface of the first region by screen printing and then dried, and the second conductive particles electrically connected to each other by the polymer binder become the first conductive particles. Forming a first pressure-sensitive layer in contact with the first pressure-sensitive layer in a plurality of first insulating regions between adjacent first electrodes among the plurality of first electrodes; Cutting along the first direction using an oscillation laser The first pressure-sensitive layer is separated into a plurality of first pressure-sensitive zones, and a first patterning is performed to insulate the first pressure-sensitive layer. Each of the plurality of first electrodes extending in the first direction is connected to a plurality of first electrodes. A plurality of third conductive particles which are arranged in contact with a corresponding one of the one pressure-sensitive zones, extend in a second direction intersecting the first direction, and are electrically coupled to each other; And a plurality of fourth electrodes extending in contact with the plurality of second electrodes along the second direction and including fourth conductive particles having a lower conductivity than the third conductive particles in the polymer binder. A second insulating substrate made of a resin having a thickness of 200 μm or less and having two pressure-sensitive zones formed in a second region where sensing is performed is prepared, the first region and the second region are overlapped, and a plurality of first regions are provided. A pressure-sensitive zone and a plurality of second pressure-sensitive zones are arranged facing each other at positions where they can come into contact with each other, and the first conductive particles and the third The contact value of the contact resistance between the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones is determined by using the second conductive particles and the fourth conductive particles having lower conductivity than the conductive particles. The first insulating substrate and the second insulating substrate are combined so as to change according to the pressure applied to the first and second substrates.
According to the manufacturing method of the pressure-sensitive sensor configured as described above, the ink is applied to the entire surface of the first region, so that the ink swells at the edges of the plurality of first pressure-sensitive zones. It is possible to prevent the saddle phenomenon in which the layers rise. As a result, the first pressure-sensitive band is flattened, and variation in sensitivity of pressure detection can be reduced.

In addition, since the first patterning for patterning the first pressure-sensitive layer formed on the entire surface of the first region is performed by a pulsed laser having a wavelength of 2 μm or less, the cutting width can be reduced by adjusting the laser output. The position for irradiating the laser can be set accurately. As a result, the interval between the first pressure-sensitive zones adjacent to each other and the interval between the first electrodes adjacent to each other can be reduced, so that the installation density of a plurality of detection points arranged along the second direction can be increased.
The method of manufacturing the pressure-sensitive sensor includes forming a plurality of spacers on the surface of the first pressure-sensitive layer in the first insulating region after forming the first pressure-sensitive layer, before or after cutting the first pressure-sensitive layer. May be configured as follows.
According to the manufacturing method of the pressure-sensitive sensor configured as described above, since the spacer is formed on the surface of the first pressure-sensitive layer, the spacer is formed as compared with the case where the spacer is formed directly on the surface of the first insulating substrate. And the variation in height of the spacers can be reduced, and the variation in sensitivity can be suppressed.

In the method of manufacturing a pressure-sensitive sensor, the preparation of the second insulating substrate in which the plurality of second electrodes and the plurality of second pressure-sensitive zones are formed in the second region is performed using a resin-made second insulating layer having a thickness of 200 μm or less. A substrate is prepared, a conductive paste containing third conductive particles is applied to the second region by screen printing, and then dried to form a second conductive layer. After the formation of the second conductive layer, the fourth conductive particles are formed. Is applied to the entire surface of the second region, and then dried to form a second pressure-sensitive layer in contact with the second conductive layer. The second pressure-sensitive layer is formed along the second direction using a pulsed laser having a wavelength of 2 μm or less. A second patterning is performed by cutting the second pressure-sensitive layer to separate the second pressure-sensitive layer into a plurality of second pressure-sensitive zones and to insulate the second pressure-sensitive layer, and to form a plurality of second electrodes extending in the second direction. Each may be configured to be arranged in contact with a corresponding one of the plurality of second pressure-sensitive zones.
According to the method of manufacturing the pressure-sensitive sensor configured as described above, the ink is applied to the entire surface of the second region, so that the ink swells at the edges of the plurality of second pressure-sensitive zones. It is possible to prevent the saddle phenomenon in which the layers rise. As a result, the portion of the second pressure sensitive zone overlapping the second electrode is flattened, and the variation in sensitivity of pressure detection can be reduced.
Further, since the second patterning for patterning the second pressure-sensitive layer formed on the entire surface of the second region is performed by a pulsed laser having a wavelength of 2 μm or less, the width of cutting can be reduced by adjusting the output of the laser. The position for irradiating the laser can be set accurately. As a result, the interval between the second pressure-sensitive zones adjacent to each other and the interval between the second electrodes adjacent to each other can be reduced, so that the arrangement density of the detection points arranged along the first direction can be increased.

In the method of manufacturing the pressure-sensitive sensor, at the time of the first patterning, the plurality of spacer supporting portions that support the plurality of spacers by separating and insulating the first pressure-sensitive layer from the plurality of first pressure-sensitive zones. A plurality of abutting portions which are insulated and formed in the first insulating region and which abut on the plurality of spacers by separating and insulating the second pressure-sensitive layer during the second patterning are formed on the plurality of second sensing portions. It may be configured to be insulated from the band and formed in a plurality of second insulating regions between adjacent second electrodes among the plurality of second electrodes.
According to the manufacturing method of the pressure-sensitive sensor configured as described above, since the spacer abuts on the surface of the abutting portion, which is the surface of the second pressure-sensitive layer, the spacer directly abuts on the surface of the second insulating substrate. In comparison with the above, the height of the spacer can be reduced, and the variation in the height of the spacer can be reduced to suppress the variation in sensitivity.
The method of manufacturing the pressure-sensitive sensor may be configured such that the plurality of spacers are formed using ink.
According to the manufacturing method of the pressure-sensitive sensor configured as described above, the ink used for forming the first pressure-sensitive layer can be used for forming the plurality of spacers, so that the material is shared and the cost is reduced. Is done.

In the method of manufacturing a pressure-sensitive sensor, an adhesive frame also serving as a spacer extends around the first region and the second region along the first direction and has a first edge and a second edge facing each other. The distance between the first and second edges is set to 50 mm or less, and an adhesive frame is screen-printed on at least one of the first and second insulating substrates, so that the first and second insulating substrates are separated from each other. When combining with a board | substrate, you may comprise so that a 1st insulating substrate and a 2nd insulating substrate may be bonded together with an adhesive frame.
According to the manufacturing method of the pressure-sensitive sensor configured as described above, the bonding frame is also used as the spacer, and the spacer is not arranged between the first electrodes adjacent to each other and between the second electrodes adjacent to each other. The interval at which the first electrode and the plurality of second electrodes are arranged can be reduced, and the installation density of the plurality of detection locations can be increased.
The method of manufacturing the pressure-sensitive sensor is such that a first conductive layer is formed on the entire first region by screen printing, and the first conductive layer is cut along a first direction using a pulsed laser having a wavelength of 2 μm or less. A third patterning that separates one conductive layer into a plurality of first electrodes and insulates the plurality of first electrodes may be performed to form a plurality of first electrodes.
According to the manufacturing method of the pressure-sensitive sensor thus configured, the third patterning for patterning the first conductive layer formed on the entire surface of the first region is performed by the pulse oscillation laser having a wavelength of 2 μm or less. By adjusting the output of the laser beam, the width of cutting can be reduced, and the position to be irradiated with the laser can be set accurately. As a result, the width of the first electrodes adjacent to each other can be reduced and the first electrodes can be formed thin, so that the installation density of a plurality of detection points arranged along the second direction can be increased.

A pressure-sensitive sensor according to a first aspect includes a first insulating substrate made of a resin having a thickness of 200 μm or less and a first insulating substrate made of a resin having a thickness of 200 μm or less, and a resin made of a resin having a thickness of 200 μm or less containing a second region where the sensing is performed. A second insulating substrate, a plurality of first electrodes extending in the first region along the first direction and including first conductive particles electrically coupled to each other in the polymer binder; A plurality of first pressure-sensitive zones extending along and in contact with corresponding ones of the plurality of first electrodes, respectively, and including, in the polymer binder, second conductive particles electrically coupled to each other; A plurality of second electrodes extending in a second region along a second direction intersecting the first direction and including third conductive particles electrically coupled to each other in a polymer binder; Extending along and contacting corresponding ones of the plurality of second electrodes, respectively. A plurality of second pressure-sensitive zones including electrically conductive fourth conductive particles in a polymer binder and at least one first pressure-sensitive zone between adjacent first electrodes among the plurality of first electrodes. At least one spacer support including a first pressure-sensitive layer disposed in one insulating region and having the same configuration as the plurality of first pressure-sensitive zones, and a plurality of spacers disposed on a surface of the spacer support. A first insulating substrate and a second insulating substrate, wherein the first region and the second region overlap each other, and the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones are arranged so as to face each other at positions where they can come into contact with each other; In a state in which no pressure is applied between the first and second pressure-sensitive zones, the gap between the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones is maintained by the plurality of spacers. A plurality of first pressure-sensitive zones and a plurality of first pressure-sensitive zones using second conductive particles and fourth conductive particles having low electrical conductivity; As the resistance value of the contact resistance of the contact portion of the second pressure sensing cuff is changed by pressure applied to the contact portion, and combining the first insulating substrate and the second insulating substrate is intended.
According to the pressure sensor configured as described above, since the spacer is supported by the spacer supporting portion including the first pressure-sensitive layer having the same configuration as the plurality of first pressure-sensitive zones, the spacer is supported on the surface of the first insulating substrate. Compared to the case where the spacer is directly formed, the height of the spacer can be reduced, and the variation in the height of the spacer can be reduced to suppress the variation in sensitivity.

A pressure-sensitive sensor according to another aspect includes a first insulating substrate made of a resin having a thickness of 200 μm or less and a first insulating substrate made of a resin having a thickness of 200 μm or less. A second insulating substrate, a plurality of first electrodes extending in the first direction along the first direction and including first conductive particles electrically coupled to each other in a polymer binder; A plurality of first pressure-sensitive zones extending in a direction, contacting with corresponding ones of the plurality of first electrodes, and including, in the polymer binder, second conductive particles electrically coupled to each other; A plurality of second electrodes extending in a second region along a second direction intersecting the first direction, the second electrodes including third conductive particles in the polymer binder electrically coupled to each other; Extending along and in contact with corresponding ones of the plurality of second electrodes, respectively. A plurality of second pressure-sensitive zones each including a fourth conductive particle electrically connected to each other in a polymer binder, and a first insulating substrate and a second insulating substrate are adhered to each other, and a distance between each other is 50 mm or less. An adhesive frame having opposing first and second edges and also serving as a spacer around the first and second regions, wherein the first region and the second region are overlapped and a plurality of The first pressure-sensitive zone and the plurality of second pressure-sensitive zones are arranged so as to face each other at positions where they can come into contact with each other, and when no pressure is applied between the first insulating substrate and the second insulating substrate, the plurality of second pressure-sensitive zones are bonded by an adhesive frame. A gap between the first pressure sensitive zone and the plurality of second pressure sensitive zones is maintained, and the second conductive particles and the fourth conductive particles having a lower conductivity than the first conductive particles and the third conductive particles. The resistance value of the contact resistance at the contact point between the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones is applied to the contact point. So as to change the pressure, and combining the first insulating substrate and the second insulating substrate is intended.
According to the manufacturing method of the pressure-sensitive sensor configured as described above, the bonding frame is also used as the spacer, and the spacer is not arranged between the first electrodes adjacent to each other and between the second electrodes adjacent to each other. The interval at which the first electrode and the plurality of second electrodes are arranged can be reduced, and the installation density of the plurality of detection locations can be increased.
In the pressure-sensitive sensor, the first insulating substrate includes a third region around the first region, the first insulating substrate is arranged in the third region, is connected to the plurality of first electrodes, and has a width of 2 times the electrode width of the plurality of first electrodes. It may be configured to have a plurality of first extraction wirings having a wiring width twice or more.
According to the pressure sensor configured as described above, the wiring width of the first extraction wiring is twice or more the electrode width of the first electrode. It is possible to reduce the voltage drop by lowering the resistance value of the first lead wiring while increasing the resistance, and it is easy to improve the detection accuracy.

  According to the method of manufacturing a pressure-sensitive sensor according to the present disclosure, it is possible to increase the density of pressure-detecting points and improve resolution while suppressing a variation in sensitivity at a plurality of detecting points of the pressure-sensitive sensor. . According to the pressure-sensitive sensor of the present disclosure, it is possible to improve resolution while reducing variation in sensitivity at a plurality of detection points.

FIG. 2 is a schematic diagram illustrating an example of a configuration of a pressure detection device using a pressure-sensitive sensor. FIG. 4 is a schematic diagram of the pressure detection device for explaining the operation of the pressure detection device. FIG. 2 is an exploded perspective view of the pressure detection device. FIG. 2 is a schematic diagram for explaining a configuration of a detection portion of a pressure-sensitive sensor. FIG. 3 is a schematic cross-sectional view in which a detection position of a pressure-sensitive sensor is enlarged. FIG. 2 is a schematic cross-sectional view enlarging the periphery of a dot spacer. 5 is a flowchart illustrating an example of a manufacturing flow of a pressure-sensitive sensor. FIG. 4 is a schematic plan view of a first insulating substrate for describing first patterning by a laser. FIG. 4 is a schematic plan view of a second insulating substrate for explaining second patterning by laser. The typical top view for explaining the 1st insulating substrate and the 2nd insulating substrate which were stuck. FIG. 4 is a schematic cross-sectional view of a pressure-sensitive band in which a saddle phenomenon has occurred. 6 is a graph showing the relationship between the diameter of the dot spacer and the height of the dot spacer under various manufacturing conditions. FIG. 9 is a schematic plan view illustrating an example of a configuration of a pressure-sensitive sensor according to Modification Example 1A. FIG. 13 is a schematic plan view illustrating an example of a configuration of a pressure-sensitive sensor according to Modification Example 1B. FIG. 13 is a schematic plan view of a first insulating substrate for describing a pressure-sensitive sensor according to Modification Example 1C. FIG. 9 is a schematic plan view of a second insulating substrate for describing a pressure-sensitive sensor according to Modification Example 1C. 13 is a flowchart showing an example of the flow of manufacturing a pressure-sensitive sensor according to Modification Example 1E. FIG. 4 is a plan view of a first conductive layer for describing third patterning by laser. FIG. 4 is a schematic plan view of a first insulating substrate for describing first patterning by a laser. FIG. 4 is a schematic cross-sectional view of a first insulating substrate for describing first patterning by a laser. FIG. 9 is a schematic plan view of a first insulating substrate for explaining first patterning by a laser according to a second embodiment. FIG. 9 is a schematic plan view of a first insulating substrate for describing second patterning by a laser according to the second embodiment. The typical top view for explaining the 1st insulating substrate and the 2nd insulating substrate which were stuck. FIG. 3 is a schematic cross-sectional view in which a detection position of a pressure-sensitive sensor is enlarged. FIG. 4 is a schematic plan view in which a connection portion between a first electrode or a second electrode and a first extraction wiring or a second extraction wiring is enlarged.

<First embodiment>
(1) Outline of Pressure Detector FIG. 1 shows an outline of a configuration of a pressure detector 1 using a pressure-sensitive sensor 10. The pressure detecting device 1 electrically connects the pressure-sensitive sensor 10, an integrated circuit 2 (hereinafter, also referred to as an IC) for detecting a pressure applied to the pressure-sensitive sensor 10, and the pressure-sensitive sensor 10 and the IC2. A flexible printed circuit board 3 (hereinafter, also referred to as FPC) for connection.
The pressure detecting device 1 can be used, for example, as a measuring device or an input device of an apparatus. As a measuring device, there is a pressure distribution measuring device which measures a distribution of a pressure applied to a sole of a human foot or a distribution of a pressing pressure of a press machine. Examples of the input device include an operation module such as a keyboard of a music device. When measuring the distribution of the pressure applied to the sole of the human, the human stands on the pressure-sensitive sensor 10 and measures the pressure applied to the plurality of detection points DS to measure the distribution of the pressure applied to the sole of the foot. Is done. The detection location DS is disposed at an intersection of a plurality of first electrodes FE extending along the X-axis direction (first direction) and a plurality of second electrodes SE extending along the Y-axis direction (second direction). You. When distinguishing each of the plurality of first electrodes FE, different reference numerals are given like first electrodes X1, X2, X3, X4, and X5 to distinguish each of the plurality of second electrodes SE. Are denoted by different reference numerals like the second electrodes Y1, Y2, Y3, Y4, Y5, Y6, and Y7. Here, a case is described where the pressure-sensitive sensor 10 includes five first electrodes X1 to X5 and seven second electrodes Y1 to Y7, and as a result, there are 35 detection locations DS. Is an example, and is not limited to the configuration including the first electrodes X1 to X5 and the second electrodes Y1 to Y7.

The IC 2 includes, for example, a drive circuit 4 and a resistance value detection circuit 5. Here, an example of the pressure detecting operation will be briefly described with reference to FIG. The drive circuit 4 includes a power supply 4a, a plurality of switches 4b, and a plurality of reference resistors 4c. The switch 4b is formed of, for example, a transistor in the IC2, and the reference resistor 4c is formed of, for example, a semiconductor in the IC2, or may be formed using an external chip resistor.
The case where pressure is applied to the detection location DS where the first electrode X4 and the second electrode Y2 intersect will be described. The switches 4b are sequentially closed, and the voltage Vcc is sequentially applied from the power supply 4a to the first electrodes X1 to X5. Even if the voltage Vcc is applied to the first electrode X1, since the first electrode X1 and the second electrodes Y1 to Y7 are in an insulated state, the resistance detection circuit 5 determines that the voltage at one end of the reference resistor 4c is 0V. Detect that there is. In this case, the IC 2 can detect that no pressure is applied to the detection point DS where the first electrode X1 and the second electrodes Y1 to Y7 intersect. When the voltage Vcc is applied to the first electrodes X2, X3 and X5 from the power supply 4a, the IC2 is connected to the first electrodes X2, X3 and X5 in the same manner as when the voltage Vcc is applied to the first electrode X1. It is possible to detect that no pressure is applied to the detection point DS where the second electrodes Y1 to Y7 intersect.
When the switch 4b connected to the first electrode X4 is closed and the voltage Vcc is applied from the power supply 4a to the first electrode X4, the first electrode X4 is insulated from the second electrodes Y1, Y3 to Y7. Because of the state, the resistance value detection circuit 5 detects that the voltage at one end of the reference resistance 4c connected to the second electrodes Y1 and Y3 to Y7 is 0 V, and the IC2 detects the voltage of the first electrode X4 and the second electrode Y4. It is possible to detect that no pressure is applied to the detection point DS where the electrodes Y1, Y3 to Y7 intersect. Then, pressure is applied to the detection point DS where the first electrode X4 and the second electrode Y2 intersect, and the first electrode X4 and the second electrode Y2 are electrically connected, so that they are connected to the second electrode Y2. A voltage is generated at one end of the reference resistor 4c. When a voltage is generated at one end of the reference resistor 4c connected to the second electrode Y2, the IC 2 detects that pressure is applied to the detection point DS where the first electrode X4 and the second electrode Y2 intersect. be able to.

Since a first pressure-sensitive band FB4 and a second pressure-sensitive band SB2 (see FIG. 3) to be described later exist between the first electrode X4 and the second electrode Y2, the first pressure-sensitive band FB4 and the second pressure-sensitive band SB2 (see FIG. 3) are provided. The resistance value of the contact resistance generated between the pressure zone FB4 and the second pressure-sensitive zone SB2 changes. When the pressure is large, the resistance value of the contact resistance generated between the first pressure-sensitive band FB4 and the second pressure-sensitive band SB2 decreases, and conversely, when the pressure is small, the first pressure-sensitive band FB4 The resistance value of the contact resistance generated between the second pressure-sensitive zones SB2 increases. Here, mainly, the conduction resistance of the first extraction wiring 21, the conduction resistance of the first electrode X4, the contact resistance generated between the first pressure-sensitive band FB4 and the second pressure-sensitive band SB2, and the second electrode The voltage Vcc of the power supply 4a is divided by the conduction resistance of Y2, the conduction resistance of the second extraction wiring 22, and the reference resistance 4c.
In the pressure-sensitive sensor 10, the resistance value related to the pressure is a contact resistance generated between the first pressure-sensitive band FB4 and the second pressure-sensitive band SB2. As the resistance value of the contact resistance increases, the potential difference between both ends of the reference resistor 4c decreases, and as the resistance value of the contact resistance decreases, the potential difference between both ends of the reference resistor 4c increases. The resistance value detection circuit 5 detects the resistance value of the contact resistance from the potential difference generated between both ends of the reference resistance 4c, whereby the IC 2 detects the pressure applied between the first electrode X4 and the second electrode Y2.
As described above, when the pressure is detected from the potential difference between both ends of the reference resistor 4c, the conduction resistance of the first extraction wiring 21, the conduction resistance of the first electrode X4, the conduction resistance of the second electrode Y2, and the resistance of the second extraction wiring 22 Since the combined resistance of the conduction resistances may cause an error, the combined resistance is preferably small. Normally, the resistance value of the combined resistance is set to be sufficiently smaller than the resistance value of the contact resistance and the resistance value of the reference resistance 4c.

(2) Structure of Pressure-Sensitive Sensor 10 (2-1) Outline of Structure of Pressure-Sensitive Sensor 10 FIG. 3 schematically shows an exploded portion of the pressure-sensitive sensor 10 in the pressure detecting device 1. I have.
The pressure-sensitive sensor 10 includes a first insulating substrate 11 made of resin, a second insulating substrate 12 made of resin, a plurality of first electrodes FE, a plurality of first pressure-sensitive zones FB1 to FB5, and a plurality of second The electrode SE, the plurality of second pressure-sensitive zones SB1 to SB7, the plurality of spacer supporting portions SS1 to SS4, the plurality of contact portions CP1 to CP6, the bonding frame 13, the first lead-out wiring 21, and the second lead-out. Wiring 22 (see FIG. 1). The first pressure-sensitive band FB, the second pressure-sensitive band SB, the spacer support portion SS, and the contact portion CP may be described. When it is not necessary to individually distinguish a plurality of pressure-sensitive bands, these are used. May be described. The plurality of first electrodes FE, the plurality of first pressure-sensitive zones FB, and the plurality of spacer supporting portions SS1 to SS4 are formed on the main surface of the first insulating substrate 11 that faces the bonding frame 13 among the two main surfaces. However, FIG. 3 illustrates a case where the first insulating substrate 11 is transparent, and thus is seen through the first insulating substrate 11 from the side on which the IC 2 is mounted. In FIG. 3, a plurality of first electrodes FE, a plurality of first pressure-sensitive zones FB, a plurality of second electrodes SE, a plurality of second pressure-sensitive zones SB, a plurality of spacer support portions SS1 to SS4, and a plurality of The sizes and the like of the contact portions CP1 to CP6 and the adhesive frame 13 are schematically described in a deformed manner in consideration of the legibility on the drawing.
The first insulating substrate 11 includes a first region AR1 where sensing is performed, and the second insulating substrate 12 includes a second region AR2 where sensing is performed. As shown in FIG. 1, in a state where the first insulating substrate 11 and the second insulating substrate 12 are combined, the first region AR1 and the second region AR2 overlap. The plurality of first electrodes FE extend in the first region AR1 along the X-axis direction (first direction). The plurality of second electrodes SE extend in the second region AR2 along the Y-axis direction (second direction). Further, the first insulating substrate 11 includes a third region AR3 around the first region AR1, and the second insulating substrate 12 includes a fourth region AR4 around the second region AR2. The plurality of first extraction wirings 21 are arranged in the third region AR3. Each first extraction wiring 21 of the plurality of first extraction wirings 21 is connected to a corresponding first electrode FE. Further, the plurality of second extraction wirings 22 are arranged in the fourth region AR4. Each second extraction wiring 22 of the plurality of second extraction wirings 22 is connected to the corresponding second electrode SE. The plurality of first extraction wirings 21 and the plurality of second extraction wirings 22 are connected to the IC 2 via the FPC 3.

The spacer supporting portion SS1 is arranged in the first insulating region AR5 located between the first electrode X1 and the first electrode X2 adjacent to each other. Similarly, spacer support portions SS2 to SS4 are arranged in the first insulating region AR5 located between the first electrodes X2 to X4 and the first electrodes X3 to X5 adjacent to each other. The spacer supporting portions SS1 to SS4 include a first pressure-sensitive layer L1 (see FIG. 8) having the same configuration as the plurality of first pressure-sensitive zones FB1 to FB5. Here, the spacer supporting portions SS1 to SS4 are constituted only by the first pressure-sensitive layer L1. Although not shown in FIG. 3, a plurality of dot spacers 15 (see FIG. 6) are arranged on the spacer supporting portions SS1 to SS4.
Similarly, the contact portion CP1 is disposed in the second insulating region AR6 located between the second electrode Y1 and the second electrode Y2 adjacent to each other. Similarly, the contact portions CP2 to CP6 are arranged in the second insulating region AR6 located between the second electrodes Y2 to X6 and the second electrodes Y3 to Y7 adjacent to each other. The contact portions CP1 to CP6 include a second pressure-sensitive layer L2 (see FIG. 9) having the same configuration as the plurality of second pressure-sensitive zones SB1 to SB7. Here, the contact portions CP1 to CP6 are constituted only by the second pressure-sensitive layer L2. Although not shown in FIG. 3, the dot spacer 15 (see FIG. 6) abuts on the contact portions CP1 to CP6, so that the first pressure-sensitive zone FB and the second pressure-sensitive zone FB are not pressed. The gap between the pressure-sensitive zones SB is maintained.

(2-2) Detection location DS of pressure-sensitive sensor 10
FIG. 4 schematically shows a cross-sectional structure of a detection point DS (intersection between the first electrode X4 and the second electrode Y2) of the pressure-sensitive sensor 10 shown in FIG. The first electrode X4 includes a plurality of first conductive particles 31 electrically coupled to each other. That is, many first conductive particles 31 are contained in the polymer binder 41. The first conductive particles 31 are fixed to the first insulating substrate 11 by the polymer binder 41, and the electrical connection between the first conductive particles 31 is maintained. The resistivity of the first electrode X4 mainly depends on the resistivity and the state of the first conductive particles 31. The other first electrodes X1 to X3 and X5 also have the same configuration as the first electrode X4, and include a plurality of first conductive particles 31 electrically coupled to each other in the polymer binder 41. Has become.
The first pressure-sensitive band FB4 includes a plurality of second conductive particles 32 electrically connected to each other. That is, many second conductive particles 32 are contained in the polymer binder 42. The polymer binder 42 fixes the second conductive particles 32 to the first electrode X4, maintains the electrical connection between the second conductive particles 32, and forms the second conductive particles 32 with the first conductive particles 32. 31 is electrically connected. The resistivity of the first pressure-sensitive band FB4 mainly depends on the resistivity and the state of the second conductive particles 32. The other first pressure-sensitive zones FB1 to FB3 and FB5 also have a configuration similar to that of the first pressure-sensitive zone FB4, and include a plurality of second conductive particles 32 electrically coupled to each other in the polymer binder 42. Is included.
The second electrode Y2 includes a plurality of third conductive particles 33 electrically connected to each other. That is, many third conductive particles 33 are contained in the polymer binder 43. The third conductive particles 33 are fixed to the second insulating substrate 12 by the polymer binder 43, and the electrical connection between the third conductive particles 33 is maintained. The resistivity of the second electrode Y2 mainly depends on the resistivity and the state of the third conductive particles 33. The other second electrodes Y1, Y3 to Y7 also have the same configuration as the second electrode Y2, and include a plurality of third conductive particles 33 electrically connected to each other in the polymer binder 43. Has become.

Second pressure-sensitive band SB2 includes a plurality of fourth conductive particles 34 electrically connected to each other. That is, many fourth conductive particles 34 are contained in the polymer binder 44. By the polymer binder 44, the fourth conductive particles 34 are fixed to the second electrode Y2, the electrical connection between the fourth conductive particles 34 is maintained, and the fourth conductive particles 34 are separated from the second conductive particles 34. 32. The resistivity of the second pressure-sensitive band SB2 mainly depends on the resistivity and the state of the fourth conductive particles 34. The other second pressure-sensitive zones SB1, SB3 to SB7 have the same configuration as the second pressure-sensitive zone SB2, and a plurality of fourth conductive particles 34 electrically connected to each other are placed in the polymer binder 44. Is included.
The conductivity of the second conductive particles 32 is smaller than the conductivity of the first conductive particles 31, and the conductivity of the fourth conductive particles 34 is smaller than the conductivity of the third conductive particles 33. Since the first pressure-sensitive band FB4 and the second pressure-sensitive band SB2 are set so as to have such a relationship, for example, the conductivity of the second conductive particles 32 and the fourth conductive particles 34 is set to the first conductivity band. As compared with the case where the electric conductivity of the conductive particles 31 and the electric conductivity of the third conductive particles 33 are the same, the contact resistance can be largely changed with respect to the change of the pressure. In FIG. 4, the particle diameters of the first conductive particles 31 and the third conductive particles 33 are smaller than the particle diameters of the second conductive particles 32 and the fourth conductive particles 34. The particle sizes of the first conductive particles 31 and the third conductive particles are not necessarily smaller than the particle sizes of the second conductive particles 32 and the fourth conductive particles 34. The particle diameters of the first conductive particles 31 and the third conductive particles may be larger than the particle diameters of the second conductive particles 32 and the fourth conductive particles.

(2-3) Size of Each Part of Pressure-Sensitive Sensor 10 FIGS. 5 and 6 show a part of the cross-sectional shape of the pressure-sensitive sensor 10 in an enlarged manner. In FIG. 5, the magnification in the Y-axis direction (second direction) is different from that in the Z-axis direction (direction perpendicular to the first direction and the second direction) for easy viewing. The enlargement ratio in the Z-axis direction is much larger than that in the Y-axis direction.
First, the size in the Y-axis direction shown in FIG. 5 will be described. The width W1 of the first electrode FE is, for example, 2500 μm. The interval between the first electrodes FE, that is, the width W2 of the first insulating region AR5 is, for example, 1500 μm. The width W3 of the spacer supporting portion SS is, for example, 740 μm. The width W4 from the end of the first electrode FE to the end of the first pressure-sensitive band FB is 350 μm. Here, the distance between the first pressure-sensitive band FB and the spacer supporting portion SS is 30 μm. That is, the first pressure-sensitive layer L1 was removed in a straight line having a width of 30 μm by one irradiation of the laser processing described later. Here, an example is shown in which one linear removal portion is formed in the first pressure-sensitive layer L1 by one laser irradiation, but one linear removal portion is formed by a plurality of laser irradiations. May be formed.
In the present embodiment, the width of the second electrode SE is also set to be the same as the width W1 of the first electrode FE, and the width of the second insulating region AR6 is also set to be the same as the width W2 of the first insulating region AR5. The width of the contact portion CP is set to be the same as the width W3 of the spacer supporting portion SS, and the width from the end of the second electrode SE to the end of the second pressure-sensitive band SB is also set to 350 μm. Here, the distance between the second pressure-sensitive band SB and the contact portion CP is also 30 μm.

Next, the size in the Z-axis direction shown in FIG. 5 will be described. The thickness H1 of the first insulating substrate 11 is preferably, for example, 20 μm or more. When the thickness of the first insulating substrate 11 is thinner than 20 μm, the film strength becomes weak and handling becomes difficult. Further, the thickness H1 of the first insulating substrate 11 is preferably equal to or less than 200 μm. When the thickness of the first insulating substrate 11 is greater than 200 μm, the rigidity of the film increases, and the sensitivity deteriorates. Note that the thickness of the second insulating substrate 12 is also preferably 20 μm or more, and more preferably 200 μm or less. The thickness H2 of the first electrode FE is, for example, 2 μm to 10 μm, and the thickness of the second electrode SE is set similarly. The thickness H3 of the first pressure-sensitive band FB is, for example, 10 μm to 20 μm, and the thickness of the second pressure-sensitive band SB is similarly set. The thickness H4 of the shield layers 51, 53 constituting the bonding frame 13 is, for example, 10 μm to 50 μm, and the thickness H5 of the adhesive layers 52, 54 is, for example, 10 μm to 50 μm. The shield layers 51 and 53 and the glue layers 52 and 54 provide insulation between the first electrode FE and the second electrode SE.
As shown in FIG. 6, the cross-sectional shape of the dot spacer 15 is a dome shape. The dot spacer 15 has a circular shape when viewed in the Z-axis direction. The height H6 of the dot spacer 15 is, for example, 10 μm to 30 μm, and the width W5 is, for example, 50 μm to 200 μm.

(2-4) Constituent materials of the pressure-sensitive sensor 10 The first insulating substrate 11 and the second insulating substrate 12 are made of engineering plastics such as polycarbonate, polyamide, polyimide, or polyetherketone, or acrylic, A thermoplastic resin such as polyethylene terephthalate or polyolefin can be used. Examples of the polyimide-based engineering plastic include polyimide (PI), and examples of the polyethylene terephthalate-based resin include polyethylene terephthalate (PET).
Fine particles made of metal can be used for the first conductive particles 31 included in the first electrode FE and the third conductive particles 33 included in the second electrode SE. Examples of the metal fine particles include gold, silver, copper, and nickel. These particle diameters are smaller than the height of the first electrode FE and the second electrode SE. As the second conductive particles 32 included in the first pressure-sensitive band FB and the fourth conductive particles 34 included in the second pressure-sensitive band SB, a high-resistance material having lower conductivity than metal fine particles is used. Examples of the high resistance material include carbon and PEDOT (poly (3,4-ethylenedioxythiophene)). A thermoplastic resin can be used for the polymer binders 41 to 44 included in the first electrode FE, the second electrode SE, the first pressure-sensitive band FB, and the second pressure-sensitive band SB. When screen printing is performed, a thermoplastic resin is dissolved in a solvent and used. An insulating inorganic fine powder may be added to the first pressure-sensitive band FB and the second pressure-sensitive band SB. As the inorganic fine powder, for example, a fine powder composed of silicon dioxide, aluminum dioxide, or titanium dioxide, or a mixture thereof can be used.
As a material for the dot spacer for forming the dot spacer 15, a thermosetting resin, a thermoplastic resin, or a mixture thereof can be used. Further, an insulating inorganic fine powder may be added to the dot spacer material. As the inorganic fine powder, for example, a fine powder composed of silicon dioxide, aluminum dioxide, or titanium dioxide, or a mixture thereof can be used. When performing screen printing, a resin is dissolved in a solvent and used.
A material for forming the shield layers 51 and 53 can be composed of a resin, an inorganic fine powder and a solvent. As a material for forming the glue layers 52 and 54, for example, a solvent type or emulsion type adhesive is used. Can be.

(3) Method of Manufacturing Pressure-Sensitive Sensor 10 FIG. 7 shows an example of a flow of a manufacturing process of the pressure-sensitive sensor 10. Steps S1 to S9 shown in FIG. 7 are manufacturing steps related to the first insulating substrate 11, steps S11 to S17 are manufacturing steps related to the second insulating substrate 12, and step S21 is a first insulating substrate. This is a manufacturing process related to both the first and second insulating substrates 12. Here, an example is shown in which steps S1 to S9 and steps S11 to S17 proceed in parallel, but one of steps S1 to S9 and steps S11 to S17 may proceed after the other, and the order may be any. May be first.
First, the first insulating substrate 11 is prepared (Step S1). Specifically, a roll of a resin film is prepared, or one resin film is cut out from a roll and prepared. The manufacturing process after step S1 may be performed while unwinding the resin film from the roll, or may be performed while moving one resin film relatively to the manufacturing apparatus.
A silver paste pattern is applied by screen printing to the first region AR1 of the prepared first insulating substrate 11 to form the first electrode FE (step S2). The silver paste is also used for forming alignment marks for positioning in a subsequent step. In this case, the first conductive particles 31 constituting the first electrode FE are silver fine particles. At this time, a pattern for forming the first extraction wiring 21 is simultaneously applied by screen printing using a silver paste.

Next, the first insulating substrate 11 coated with the silver paste is dried to form a first conductive layer (Step S3). Here, since the silver paste is applied only to the portion where the first electrode FE is formed by screen printing and patterning is performed at the same time, the formation of the first conductive layer, that is, the formation of the first electrode FE is performed. Since the first insulating substrate 11 is made of a resin and the polymer binder contained in the silver paste is also made of a resin, the drying is preferably performed at a relatively low temperature equal to or lower than the heat resistance temperature of the resin. It is preferably performed in the following.
Carbon ink is applied by screen printing to the entire surface of the first region AR1 including the exposed surface of the first region AR1 of the first insulating substrate 11 as well as the exposed surface of the first electrode FE ( Step S4). For alignment, the alignment mark formed in step S3 is used. The carbon ink applied on the entire surface of the first region AR1 is dried (Step S5), and a first pressure-sensitive layer L1 (see FIG. 8) is formed on the entire surface of the first region AR1.
Then, a dot spacer material containing insulating fine particles, a resin, and a solvent is circularly applied to the surface of the first pressure-sensitive layer L1 in the first insulating region AR5 by screen printing (step S6). For alignment, the alignment mark formed in step S3 is used. The target height of the dot spacer 15 can be set from the radius of the dot spacer material using, for example, data on the contact angle between the first pressure-sensitive layer L1 and the dot spacer material obtained by experiments. By drying the dot spacer material printed by the screen printing in this manner (step S7), the dot spacer 15 having a desired height is formed. Of course, when the dot spacer 15 contracts or expands during drying as compared to the state of the dot spacer material, a change in dimension due to the contraction or expansion is also considered. When the thermosetting resin is contained in the dot spacer material, the resin is cured simultaneously with drying.
Note that the first patterning using laser (step S8) may be performed before the formation of the dot spacers 15 (steps S6 and S7).

Next, the first pressure-sensitive layer L1 is cut a plurality of times along the X-axis direction (first direction) using a pulsed laser having a wavelength of 2 μm or less (step S8). For example, a ruby laser, a YAG laser, and a YFL laser can be used as the pulsed laser having a wavelength of 2 μm or less. This step S8 is the first patterning using the pulsed laser. The alignment mark formed in step S3 is also used for alignment at this time. A portion indicated by a two-dot line 91 in FIG. 8 is a portion cut by the pulsed laser. The conditions of the pulsed laser are adjusted, and the first pressure-sensitive layer L1 is separated and insulated while keeping the first insulating substrate 11 from separating. For example, the first pressure-sensitive layer L1 is cut by a laser over a width of 30 μm. The interval at which separation is performed using a pulsed laser having a wavelength of 2 μm or less is set, for example, in the range of 20 μm to 100 μm. As a result of this first patterning, a plurality of first pressure-sensitive zones FB1 to FB5 are formed, and a plurality of spacer support portions SS1 to SS4 are formed.
Next, screen printing of the adhesive frame 13 is performed (step S9). For alignment, the alignment mark formed in step S3 is used. Since the bonding frame 13 is formed by laminating the shield layer 51 and the glue layer 52, in the screen printing of the bonding frame 13, printing is performed twice while changing the plate.
The manufacturing process related to the second insulating substrate 12 can be performed in the same manner as the manufacturing process related to the first insulating substrate 11, except for the manufacturing process of the dot spacer 15. After the second insulating substrate 12 is prepared (after step S11), a pattern of a silver paste is applied by screen printing on the second region AR2 of the second insulating substrate 12 to form the second electrode SE ( Step S12). At this time, a pattern for forming the second extraction wiring 22 is simultaneously applied by screen printing using a silver paste.

Next, the second insulating substrate 12 to which the silver paste has been applied is dried to form the second conductive layer, thereby forming the second electrode SE (Step S13). For the subsequent alignment, the alignment mark formed in step S13 is used.
Carbon ink is applied by screen printing to the entire surface of the second region AR2 including the exposed surface of the second region AR2 of the second insulating substrate 12 as well as the exposed surface of the second electrode SE ( Step S14). The carbon ink applied on the entire surface of the second region AR2 is dried (Step S15), and the second pressure-sensitive layer L2 (see FIG. 9) is formed on the entire surface of the second region AR2.
Next, the second pressure-sensitive layer L2 is cut a plurality of times along the Y-axis direction (second direction) using a pulsed laser having a wavelength of 2 μm or less (step S16). The alignment mark formed in step S13 is also used for alignment at this time. This step S16 is the second patterning using the pulsed laser. The portion indicated by the two-dot line 92 in FIG. 9 is the portion cut by the pulsed laser. The condition of the pulsed laser is adjusted, and the second pressure-sensitive layer L2 is separated and insulated while keeping the second insulating substrate 12 from separating. For example, the second pressure-sensitive layer L2 is cut by a laser over a width of 30 μm. As a result of the second patterning, a plurality of second pressure-sensitive zones SB1 to SB7 are formed, and a plurality of contact portions CP1 to CP6 are formed.

Next, screen printing of the adhesive frame 13 is performed (step S17). Since the bonding frame 13 is formed by laminating the shield layer 53 and the glue layer 54, in the screen printing of the bonding frame 13, printing is performed twice while changing the plate.
Finally, the glue layer 52 formed on the first insulating substrate 11 and the glue layer 54 formed on the second insulating substrate 12 are overlapped and bonded. Since the arrangement positions and thicknesses of the glue layer 52 and the glue layer 54 are appropriately set, the first area AR1 and the second area AR2 overlap, and the plurality of first pressure-sensitive zones FB1 to FB5 and the plurality of second The pressure zones SB1 to SB7 can be arranged facing each other at positions where they can come into contact with each other. Further, since the arrangement positions and thicknesses of the glue layer 52 and the glue layer 54 are appropriately set, the plurality of first pressure-sensitive zones FB1 to FB5 are formed using the second conductive particles 32 and the fourth conductive particles 34. The first insulating substrate 11 and the second insulating substrate 12 can be combined so that the resistance value of the contact resistance at the contact location of the plurality of second pressure-sensitive zones SB1 to SB7 changes according to the pressure applied to the contact location.
FIG. 10 shows a state in which the first insulating substrate 11 and the second insulating substrate 12 are combined.

(4) Features (4-1)
In the method of manufacturing the pressure-sensitive sensor 10 according to the first embodiment, the carbon ink for forming the first pressure-sensitive layer L1 is applied to the entire first region AR1 by screen printing. By applying the carbon ink to the entire surface of the first region AR1 in this manner, it is possible to prevent the carbon ink from rising at the edges of the plurality of first electrodes FE, and thereby prevent the saddle phenomenon in which the first pressure-sensitive layer L1 rises. it can. In FIG. 11, a first pressure-sensitive zone 111 or a second pressure-sensitive zone 112 is formed along a strip-shaped first electrode 101 or a second electrode 102 formed on the first insulating substrate 11 or the second insulating substrate 12. For this purpose, a saddle phenomenon that occurs when carbon ink is applied in a belt shape by screen printing is schematically shown. In FIG. 11, the portions indicated by reference numerals 121 and 122 are raised portions. The bulges indicated by reference numerals 121 and 122 are continuously formed like the mountain range along the edges 113 and 114 of the first pressure-sensitive zone 111 or the second pressure-sensitive zone 112. As a result of preventing such a saddle phenomenon, the first pressure-sensitive band FB is flattened, and variations in sensitivity of pressure detection can be reduced. The variation in the sensitivity of the pressure detection means that when the same pressure is applied to a plurality of detection points, the detected pressures have different values.
Further, since the first patterning (step S8) for patterning the first pressure-sensitive layer L1 formed on the entire surface of the first region AR1 is performed by a pulsed laser having a wavelength of 2 μm or less, the laser output is adjusted to cut. The width of the laser irradiation can be reduced, and the position for irradiating the laser can be set accurately. As a result, the distance between the first pressure-sensitive zones FB adjacent to each other (the width W3 of the spacer supporting portion SS + the width cut by the laser × 2) and the distance W2 between the first electrodes FE adjacent to each other can be reduced, so that the distance W2 between the first electrodes FE along the second direction can be reduced. The installation density of a plurality of detection locations arranged in a horizontal direction can be increased.

(4-2)
In the method of manufacturing the pressure-sensitive sensor 10 according to the first embodiment, since the dot spacers 15 are formed on the surface of the first pressure-sensitive layer L1, the dot spacers 15 are formed directly on the surface of the first insulating substrate 11. In comparison with the above, the height of the dot spacer 15 can be reduced, and the variation in the height of the dot spacer 15 can be reduced to suppress the variation in sensitivity. FIG. 12 is a graph illustrating the relationship between the diameter and the height of the dot spacer 15. The graph shown by the solid line and the graph shown by the dashed line are the graphs when the thickness of the screen printing plate is 60 μm. The graph shown by the broken line and the graph shown by the two-dot line are graphs when the thickness of the screen printing plate is 100 μm. Furthermore, the graph shown by the solid line and the graph shown by the dashed line are graphs when printing is performed under the same first condition as the condition of screen printing, and is shown by the graph shown by the one-point difference line and the two-point difference line. The graph shown is a graph when printing is performed under the same second condition as the condition of screen printing. As can be seen from FIG. 12, even if the diameter of the dot spacer is the same, the height of the dot spacer varies depending on the printing conditions. The variation in height tends to increase as the diameter of the dot spacer is increased and the height of the dot spacer is increased. In other words, the smaller the diameter of the dot spacer and the lower the height, the more the variation in the height of the dot spacer can be reduced.

(4-3)
The items described in (4-1) above also apply to the formation of the second pressure-sensitive zone SB. By applying the carbon ink to the entire surface of the second region AR2, the saddle phenomenon can be prevented, the second pressure-sensitive band SB is flattened, and the variation in sensitivity of pressure detection can be reduced. .
Further, since the second patterning (step S16) for patterning the second pressure-sensitive layer L2 formed on the entire surface of the second region AR2 is performed by a pulsed laser having a wavelength of 2 μm or less, the laser output is adjusted to cut. The width of the laser irradiation can be reduced, and the position for irradiating the laser can be set accurately. As a result, the interval between the second pressure-sensitive zones SB adjacent to each other and the interval between the second electrodes SE adjacent to each other can be reduced, so that the installation density of the plurality of detection points arranged along the first direction can be increased. it can.
(4-4)
In the pressure-sensitive sensor 10, since the dot spacer 15 abuts on the surface of the abutting portion CP, which is the surface of the second pressure-sensitive layer L <b> 2, compared with the case where the dot spacer 15 directly abuts on the surface of the second insulating substrate 12. The height of the dot spacer 15 can be reduced. By reducing the height of the dot spacer in this way, as described in (4-3), the variation in the height of the dot spacer 15 can be reduced and the variation in sensitivity can be suppressed.

(5) Modification (5-1) Modification 1A
In the first embodiment, the dot spacers 15 arranged in the adjacent spacer support portion SS are arranged at the same position on the X axis, but the arrangement of the dot spacers 15 is not limited to such an arrangement. For example, as shown in FIG. 13, the dot spacers 15 may be arranged in a staggered manner. As shown in FIG. 13, by disposing the dot spacers 15 in a staggered manner and reducing the installation density of the dot spacers 15, the load range detected by the pressure-sensitive sensor 10 decreases. That is, the pressure-sensitive sensor 10 shown in FIG. 13 can detect a pressure smaller than the lower limit pressure that can be detected by the pressure-sensitive sensor 10 shown in FIG.
(5-2) Modification 1B
In the first embodiment, the case where the spacer is the dot spacer 15 has been described, but the type of the spacer is not limited to the dot spacer. For example, as shown in FIG. 14, a spacer 15A formed in a linear shape may be used. When such a linear spacer 15A is used, the load range detected by the pressure-sensitive sensor 10 is higher than when the dot spacer 15 shown in FIG. 10 is used. That is, the pressure-sensitive sensor 10 shown in FIG. 14 can detect a pressure higher than the upper limit pressure that can be detected by the pressure-sensitive sensor 10 shown in FIG.

(5-3) Modification 1C
In the first embodiment, as shown in FIG. 8, one first insulating region AR5 is irradiated with laser twice, and two cut grooves are formed along two two-dot lines 91. It is formed on the first pressure-sensitive layer L1. Similarly, as shown in FIG. 9, one second insulating region AR6 is irradiated with laser twice, and two cut grooves are formed along the two two-dot lines 92 with the second pressure-sensitive groove. It is formed in the layer L2. However, the number of laser irradiations on one first insulating region AR5 and one second insulating region AR6 is not limited to two. As shown in FIGS. 15 and 16, the number of laser irradiations on one first insulating region AR5 and one second insulating region AR6 may be one. Further, the number of laser irradiations on one first insulating region AR5 and one second insulating region AR6 may be three or more.
(5-4) Modification 1D
In the first embodiment, the material for forming the dot spacer 15 and the material for forming the first pressure-sensitive layer L1 are different. However, the material for forming the dot spacer 15 and the material for forming the first pressure-sensitive layer L1 can be the same. Since the spacer support portion SS supporting the dot spacer 15 and the contact portion CP with which the dot spacer 15 abuts are separated and insulated from the first pressure sensitive zone FB and the second pressure sensitive zone SB, the dot spacer 15 Does not have a problem even if carbon contains conductive particles.
By using the same material for the dot spacer 15 to form the dot spacer 15 and the material to form the first pressure-sensitive layer L1, the carbon ink used to form the first pressure-sensitive layer L1 for forming the dot spacer 15 is formed. Can be used, so that the material can be used in common and the cost can be reduced.

(5-5) Modification 1E
In the first embodiment, the carbon ink is applied to the entire surface of the first region AR1 and the second region AR2, and the silver paste is already patterned at the time of screen printing. However, after applying a paste containing conductive particles (silver paste in the first embodiment) to the entire surface of the first region AR1 and / or the second region AR2, the third patterning using a pulsed laser having a wavelength of 2 μm or less is performed. The first electrode FE and / or the second electrode SE may be formed by and / or fourth patterning.
FIG. 17 shows another example of the flow of the manufacturing process of the pressure-sensitive sensor 10. The manufacturing process of the pressure-sensitive sensor 10 of Modification Example 1E is different from the manufacturing process of the pressure-sensitive sensor 10 of the first embodiment in that a silver paste is applied to the entire surface of the first region AR1 using screen printing in step S2. And step S3A is further provided after step S3. In this step S3A, the first conductive layer L3 formed in step S3 is separated and insulated by irradiating the laser on the two-dot line 93 shown in FIG. 18A. At this time, the distance at which the first conductive layer L3 is separated is, for example, 30 μm. The first electrode FE is formed by the third patterning using the laser performed in step S3A (see FIG. 18B). As shown in FIG. 18B, in step S8, first patterning by laser is performed, and the first pressure-sensitive layer L1 is separated along the two-dot line 91 using a pulsed laser having a wavelength of 2 μm or less. And is insulated. At this time, the first conductive layer L3 is further separated and insulated together with the first pressure-sensitive layer L1. Therefore, the spacer supporting portion SS includes the first conductive layer L3 together with the first pressure-sensitive layer L1. When manufactured in this manner, the surface roughness of the first pressure-sensitive zone FB of the pressure-sensitive sensor 10 is further reduced, and the variation in sensitivity is further reduced.

  The manufacturing process of the pressure-sensitive sensor 10 of the modified example 1E is different from the manufacturing process of the pressure-sensitive sensor 10 of the first embodiment. In step S12, a silver paste is applied to the entire surface of the second area AR2 using screen printing. And step S13A is further provided after step S13. In step S13A, the second conductive layer formed in step S13 is separated and insulated by irradiating the laser. The second electrode SE is formed by the fourth patterning using the laser performed in step S13A. In step S16, the second patterning is performed using a laser, and the second pressure-sensitive layer is separated and insulated using a pulsed laser having a wavelength of 2 μm or less. At this time, the second conductive layer is further separated and insulated together with the second pressure-sensitive layer. Therefore, the contact portion includes the second conductive layer together with the second pressure-sensitive layer. When manufactured in this manner, the surface roughness of the second pressure-sensitive band SB of the pressure-sensitive sensor 10 is further reduced, and the variation in sensitivity is further reduced.

(5-6) Modification 1F
In the first embodiment, in order to form the first pressure-sensitive band FB and the second pressure-sensitive band SB, the first pressure-sensitive layer L1 and the second pressure-sensitive layer L2 are formed using a pulse oscillation laser having a wavelength of 2 μm or less. Patterned. However, instead of patterning both the first pressure-sensitive band FB and the second pressure-sensitive band SB with the laser, one of the first pressure-sensitive band FB and the second pressure-sensitive band SB may be screen-printed with a carbon ink pattern in the same manner as in the related art. As described above, by using screen printing when forming one of the first pressure-sensitive band FB and the second pressure-sensitive band SB by patterning, the manufacturing cost can be reduced.
(5-7) Modification 1G
In the first embodiment, at the time of the first patterning, only the first pressure-sensitive layer L1 is cut and separated and insulated. However, in order to further increase the installation density of the detection locations DS, it may be permitted to simultaneously cut the ends of the dot spacers 15 using a pulsed laser having a wavelength of 2 μm or less in the first patterning. As shown in FIG. 6, since the dot spacer 15 has a flat shape, it can function as a spacer even if the end is cut while leaving the center portion. In this manner, by reducing the width of the first insulating region AR5, it is easy to increase the installation density of the detection points DS.

<Second embodiment>
FIG. 21 schematically illustrates a configuration of a pressure-sensitive sensor 10A according to the second embodiment. The pressure sensor 10A according to the second embodiment differs from the pressure sensor 10 according to the first embodiment in that the formation of the dot spacer 15 is omitted. That is, the pressure-sensitive sensor 10A according to the second embodiment does not include the dot spacer 15. Therefore, in the manufacturing process of the pressure-sensitive sensor 10A, steps S6 and S7 are omitted from the manufacturing process of the pressure-sensitive sensor 10 shown in FIG. Steps other than steps S6 and S7 can apply the manufacturing process of the pressure-sensitive sensor 10 to the manufacturing process of the pressure-sensitive sensor 10A, and thus a detailed description of the manufacturing process of the pressure-sensitive sensor 10A is omitted.
In FIG. 19, when the carbon ink is screen-printed on the first insulating substrate 11, the carbon ink is dried (a manufacturing process corresponding to step S5), and then the first patterning by laser is performed (corresponding to step S8). Of the manufacturing process). The portion indicated by the two-dot line 95 in FIG. 19 is the portion where the first pressure-sensitive layer L1 is cut by the pulse oscillation laser having a wavelength of 2 μm or less.
FIG. 20 shows the case where the carbon ink is dried after the screen printing of the carbon ink on the second insulating substrate 12 (a manufacturing process corresponding to step S15), and then the second patterning by laser is performed (corresponding to step S16). Of the manufacturing process). The portion indicated by the two-dot line 96 in FIG. 20 is the portion where the second pressure-sensitive layer L2 is cut by the pulse oscillation laser having a wavelength of 2 μm or less.

(6) Structure of Pressure-Sensitive Sensor 10A (6-1) Outline of Structure of Pressure-Sensitive Sensor 10A Similarly to the pressure-sensitive sensor 10, the pressure-sensitive sensor 10A also includes a first insulating substrate 11 made of resin and a resin-made first insulating substrate 11A. 2 insulating substrate 12, a plurality of first electrodes FE, a plurality of first pressure-sensitive zones FB, a plurality of second electrodes SE, a plurality of second pressure-sensitive zones SB, an adhesive frame 13, and a first drawer. A wiring 21 and a second extraction wiring 22 are provided. FIG. 21 is viewed from the first electrode FE side to the second electrode SE side, and describes a case where the first insulating substrate 11 is transparent. Thus, the first electrode FE and the adhesive frame 13 are visible.
The first insulating substrate 11 includes a first region AR1 where sensing is performed, and the second insulating substrate 12 includes a second region AR2 where sensing is performed. As shown in FIG. 21, in a state where the first insulating substrate 11 and the second insulating substrate 12 are combined, the first region AR1 and the second region AR2 overlap. The plurality of first electrodes FE extend in the first region AR1 along the X-axis direction (first direction). The plurality of second electrodes SE extend in the second region AR2 along the Y-axis direction (second direction). Further, the first insulating substrate 11 includes a third region AR3 around the first region AR1, and the second insulating substrate 12 includes a fourth region AR4 around the second region AR2. The plurality of first extraction wirings 21 are arranged in the third region AR3. Each first extraction wiring 21 of the plurality of first extraction wirings 21 is connected to a corresponding first electrode FE. Further, the plurality of second extraction wirings 22 are arranged in the fourth region AR4. Each second extraction wiring 22 of the plurality of second extraction wirings 22 is connected to the corresponding second electrode SE. Also in the pressure sensor 10A, similarly to the pressure sensor 10, the plurality of first lead wires 21 and the plurality of second lead wires 22 are connected to the IC 2 via the FPC 3.

(6-2) Detection location DS of pressure-sensitive sensor 10A
FIG. 22 schematically illustrates a cross-sectional structure of two detection points DS of the pressure-sensitive sensor 10A illustrated in FIG. In FIG. 22, the size of the first electrode FE, the first pressure-sensitive band FB, the plurality of second electrodes SE, the plurality of second pressure-sensitive bands SB, the size of the bonding frame 13, and the like are shown in the drawing for ease of viewing. Considered, deformed and described schematically. Like the first electrode FE of the pressure-sensitive sensor 10, the first electrode FE of the pressure-sensitive sensor 10A also includes a plurality of first conductive particles 31 electrically connected to each other. Further, many first conductive particles 31 are included in the polymer binder 41. The first conductive particles 31 are fixed to the first insulating substrate 11 by the polymer binder 41, and the electrical connection between the first conductive particles 31 is maintained. Similarly to the second electrode SE of the pressure-sensitive sensor 10, the second electrode SE of the pressure-sensitive sensor 10A also includes a plurality of third conductive particles 33 electrically connected to each other, and includes a large number of third conductive particles. The structure is such that the particles 33 are contained in the polymer binder 43. In the small pressure-sensitive sensor 10A, the average particle diameter of the first conductive particles 31 and the third conductive particles 33 is preferably 2 μm or less, more preferably 1 μm or less.
Similarly to the first pressure-sensitive band FB of the pressure-sensitive sensor 10, the first pressure-sensitive band FB of the pressure-sensitive sensor 10A includes a plurality of second conductive particles 32 electrically connected to each other. The structure is such that the second conductive particles 32 are contained in the polymer binder 42. Similarly to the second pressure-sensitive band SB of the pressure-sensitive sensor 10, the second pressure-sensitive band SB of the pressure-sensitive sensor 10A includes a plurality of fourth conductive particles 34 electrically connected to each other. The fourth conductive particles 34 are included in a polymer binder 44. The conductivity of the second conductive particles 32 is smaller than the conductivity of the first conductive particles 31, and the conductivity of the fourth conductive particles 34 is smaller than the conductivity of the third conductive particles 33. .

(6-3) Size of Each Part of Pressure Sensor 10A First, the size in the Y-axis direction shown in FIG. 22 will be described. The width W11 of the first electrode FE is, for example, 100 μm. The interval between the first electrodes FE, that is, the width W12 of the first insulating region AR5 is, for example, 100 μm. By the single irradiation of the laser processing, the first pressure-sensitive layer L1 is removed in a linear shape having a width W13 of 30 μm. In the second embodiment, the width of the second electrode SE is set to be the same as the width W11 of the first electrode FE, and the width of the second insulating region AR6 is set to be the same as the width W12 of the first insulating region AR5. I have. Further, the second pressure-sensitive layer L2 is removed linearly with a width of 30 μm by one irradiation of the laser processing. Here, an example is shown in which one linear removal portion is formed in the second pressure-sensitive layer L2 by one laser irradiation. However, one linear removal portion is formed by a plurality of laser irradiations. May be formed.
As shown in FIG. 19, the adhesive frame 13 also serving as a spacer extends along the X-axis direction (first direction) and has a first edge 13a and a second edge 13b facing each other. have. The distance between the first edge 13a and the second edge 13b is set to 50 mm or less. When the thickness of the first insulating substrate 11 and the second insulating substrate 12 is 50 μm or less, the rigidity of the first insulating substrate 11 and the second insulating substrate 12 is small, so that the first edge 13a and the second edge 13b It is preferable to set the interval to 20 mm or less.
Next, the size in the Z-axis direction shown in FIG. 22 will be described. The thickness H11 of the first insulating substrate 11 and the second insulating substrate 12 of the pressure-sensitive sensor 10A is preferably not less than 20 μm and not more than 200 μm as in the pressure-sensitive sensor 10. The thickness H12 of the first electrode FE and the second electrode SE is, for example, 2 μm to 10 μm, and the thickness H13 of the first pressure-sensitive band FB and the second pressure-sensitive band SB is, for example, 10 μm to 20 μm. The thickness H14 of the shield layers 51 and 53 constituting the bonding frame 13 is, for example, 10 μm to 50 μm, and the thickness H15 of the adhesive layers 52, 54 is, for example, 10 μm to 50 μm.

FIG. 23 shows the first electrode FE and the second electrode SE arranged in the first region AR1 and the second region AR2, and the first extraction wiring 21 arranged in the third region AR3 and the fourth region AR4. The connection portion with the second extraction wiring 22 is shown in an enlarged manner. When the width W11 of the first electrode FE and the second electrode SE is 100 μm, the first extraction wiring 21 and the second extraction wiring 22 are connected to be expanded to 200 μm, which is twice as large. Note that the wiring interval between the first electrode FE and the second electrode SE and the wiring interval between the first extraction wiring 21 and the second extraction wiring 22 are all 100 μm. Since the wiring width of the first extraction wiring 21 and the second extraction wiring 22 is twice or more of the electrode width of the first electrode FE and the second electrode SE, the first electrode FE and the second electrode SE are made thinner to form a plurality of wirings. The voltage drop at the first lead-out wiring 21 and the second lead-out wiring 22 can be reduced while increasing the installation density of the detection points, and the detection accuracy can be easily improved.
In the second embodiment, the case has been described where the wiring width of the first lead wiring 21 and the second lead wiring 22 is increased to twice the electrode width of the first electrode FE and the second electrode SE. The wiring width of the wiring 21 and / or the second lead wiring 22 may be expanded to be larger than twice the electrode width of the first electrode FE and / or the second electrode SE. The line width is expanded when connecting from the first electrode FE or the second electrode SE to the wiring of the first extraction wiring 21 and the second extraction wiring 22, for example, the first extraction wiring 21 and / or the second extraction wiring. When changing the wiring direction of the line 22, the line width may be expanded.

(7) Features (7-1)
The method of manufacturing the pressure-sensitive sensor 10A according to the second embodiment also has the same effect as the method of manufacturing the pressure-sensitive sensor 10 according to the first embodiment described in (4-1) and (4-3).
(7-2)
In the second embodiment, since the electrode width of the first electrode FE and the second electrode SE is small, the wiring width of the first extraction wiring 21 and the second extraction wiring 22 is set to the width of the electrode width of the first electrode FE and the second electrode SE. Since the first electrode FE and / or the second electrode SE are thinned to increase the installation density of the plurality of detection sections, the voltage drop at the first extraction wiring 21 and the second extraction wiring 22 is increased. Can be reduced, and the detection accuracy can be easily improved.

(8) Modification (8-1) Modification 2A
Also in the second embodiment, as in Modification 1C, the number of laser irradiations for irradiating one first insulating region AR5 and one second insulating region AR6 may be changed.
(8-2) Modification 2B
Also in the second embodiment, as in the modification 1E, the third region is patterned on the entire surface of the first region AR1 and / or the second region AR2 by using the third patterning by laser and / or the fourth patterning by laser. The first conductive layer and / or the second conductive layer formed by patterning may be patterned to form the first electrode and / or the second electrode.
(8-3) Modification 2C
Also in the second embodiment, as in Modification 1F, both the first pressure-sensitive band FB and the second pressure-sensitive band SB are not patterned by laser, and either one is screen-printed in the same manner as in the related art. An ink pattern may be printed.

DESCRIPTION OF SYMBOLS 1 Pressure detecting device 10 and 10A Pressure sensor 11 First insulating substrate 12 Second insulating substrate 13 Adhesive frame 15 Dot spacer 15A Spacer 21 First extraction wiring 22 Second extraction wiring 31 First conductive particle 32 Second conductive particle 33 Third conductive particles 34 Fourth conductive particles 41 to 44 Polymer binder 51, 53 Shield layer 52, 54 Glue layer CP, CP1 to CP6 Contact part DS Detection point FB, FB1 to FB5 First pressure sensitive zone FE 1st electrode L1 1st pressure sensitive layer L2 2nd pressure sensitive layer L3 1st conductive layer SB, SB1-SB7 2nd pressure sensitive zone SE 2nd electrode SS, SS1-SS4 Spacer support part X1-X5 1st electrode Y1- Y7 second electrode

Claims (10)

A first insulating substrate made of resin including a first region where sensing is performed and having a thickness of 200 μm or less is prepared,
Applying a conductive paste to the first region by screen printing and then drying to form a plurality of first electrodes including first conductive particles electrically coupled to each other in a polymer binder;
After forming the plurality of first electrodes, an ink containing second conductive particles having a lower conductivity than the first conductive particles is applied to the entire surface of the first region by screen printing, and then dried to obtain a polymer. Forming a first pressure-sensitive layer in which the second conductive particles electrically connected to each other by a binder are in contact with the first conductive particles;
The first pressure-sensitive layer in a plurality of first insulating regions between adjacent first electrodes among the plurality of first electrodes is moved along a first direction using a pulsed laser having a wavelength of 2 μm or less. The first pressure-sensitive layer is cut and separated into a plurality of first pressure-sensitive zones to perform first patterning for insulation, and each of the plurality of first electrodes extending in the first direction is Placed in contact with a corresponding one of the plurality of first pressure-sensitive zones,
A plurality of second electrodes that extend in a second direction intersecting the first direction and are electrically coupled to each other and that include third conductive particles in a polymer binder; and the plurality of second electrodes along the second direction. A plurality of second pressure-sensitive zones that extend in contact with the second electrode and that include fourth conductive particles having a lower conductivity than the third conductive particles in the polymer binder; A resin-made second insulating substrate having a thickness of 200 μm or less formed in two regions is prepared,
The first region and the second region overlap each other, and the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones are arranged so as to face each other at positions where they can come into contact with each other, and the first conductive particles and Contact between the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones using the second conductive particles and the fourth conductive particles having lower conductivity than the third conductive particles. A method for manufacturing a pressure-sensitive sensor, comprising combining the first insulating substrate and the second insulating substrate such that a resistance value of a resistor changes according to a pressure applied to the contact portion. After forming the first pressure-sensitive layer, before or after cutting the first pressure-sensitive layer, forming a plurality of spacers on the surface of the first pressure-sensitive layer in the first insulating region;
A method for manufacturing the pressure-sensitive sensor according to claim 1. The preparation of the second insulating substrate in which the plurality of second electrodes and the plurality of second pressure-sensitive zones are formed in the second region includes:
Preparing the second insulating substrate made of resin having a thickness of 200 μm or less,
A second conductive layer is formed by applying a conductive paste containing the third conductive particles to the second region by screen printing and then drying the paste.
After forming the second conductive layer, an ink containing the fourth conductive particles is applied to the entire surface of the second region and then dried to form a second pressure-sensitive layer in contact with the second conductive layer. ,
Using a pulsed laser having a wavelength of 2 μm or less, cutting the second pressure-sensitive layer along the second direction to separate and insulate the second pressure-sensitive layer into the plurality of second pressure-sensitive zones. Patterning, and disposing each of the plurality of second electrodes extending in the second direction in contact with a corresponding one of the plurality of second pressure-sensitive zones,
A method for manufacturing the pressure-sensitive sensor according to claim 1. At the time of the first patterning, the plurality of spacer supporting portions that support the plurality of spacers by separating and insulating the first pressure-sensitive layer are insulated from the plurality of first pressure-sensitive zones. Formed in the first insulating region,
At the time of the second patterning, a plurality of contact portions that contact the plurality of spacers by separating and insulating the second pressure-sensitive layer are insulated from the plurality of second pressure-sensitive zones, Forming a plurality of second insulating regions between adjacent second electrodes among the plurality of second electrodes;
A method for manufacturing the pressure-sensitive sensor according to claim 3. The plurality of spacers are formed using the ink,
A method for manufacturing the pressure-sensitive sensor according to claim 4. An adhesive frame also used as a spacer around the first region and the second region extends along the first direction and has a first edge and a second edge facing each other, and The distance between the edge and the second edge is set to 50 mm or less,
The adhesive frame is screen-printed on at least one of the first insulating substrate and the second insulating substrate, and the first insulating substrate and the second insulating substrate are combined with the first insulating substrate when the first insulating substrate and the second insulating substrate are combined. Bonding a substrate and the second insulating substrate,
A method for manufacturing the pressure-sensitive sensor according to claim 1. A first conductive layer is formed on the entire surface of the first region by screen printing, and the first conductive layer is cut along the first direction using a pulsed laser having a wavelength of 2 μm or less to form the first conductive layer. Forming a plurality of first electrodes by performing third patterning for separating and insulating the plurality of first electrodes;
A method for manufacturing the pressure-sensitive sensor according to claim 1. A first insulating substrate made of a resin including a first region where sensing is performed and having a thickness of 200 μm or less;
A second insulating substrate made of a resin including a second region where sensing is performed and having a thickness of 200 μm or less;
A plurality of first electrodes extending in the first region along the first direction and including first conductive particles electrically coupled to each other in a polymer binder;
A plurality of first conductive particles extending in the first direction and contacting corresponding ones of the plurality of first electrodes, respectively, and including second conductive particles electrically coupled to each other in a polymer binder. Pressure sensitive zone,
A plurality of second electrodes extending in the second region along a second direction intersecting with the first direction and including third conductive particles electrically coupled to each other in a polymer binder;
A plurality of second conductive particles extending in the second direction and in contact with corresponding ones of the plurality of second electrodes and electrically connected to each other and including fourth conductive particles in a polymer binder; Pressure sensitive zone,
At least including a first pressure-sensitive layer disposed in at least one first insulating region between adjacent first electrodes in the plurality of first electrodes and having the same configuration as the plurality of first pressure-sensitive zones. One spacer support,
A plurality of spacers arranged on the surface of the spacer support,
With
The first region and the second region overlap each other, and the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones are arranged so as to face each other at positions where they can come into contact with each other, and the first insulating substrate and the When no pressure is applied between the second insulating substrates, a gap between the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones is maintained by the plurality of spacers, and the first conductive particles are formed. And using the second conductive particles and the fourth conductive particles having a lower conductivity than the third conductive particles to determine a contact point between the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones. A pressure-sensitive sensor, wherein the first insulating substrate and the second insulating substrate are combined so that a resistance value of a contact resistance changes according to a pressure applied to the contact portion. A first insulating substrate made of a resin including a first region where sensing is performed and having a thickness of 200 μm or less;
A second insulating substrate made of a resin including a second region where sensing is performed and having a thickness of 200 μm or less;
A plurality of first electrodes extending in the first region along the first direction and including first conductive particles electrically coupled to each other in a polymer binder;
A plurality of first conductive particles extending in the first direction and contacting corresponding ones of the plurality of first electrodes, respectively, and including second conductive particles electrically coupled to each other in a polymer binder. Pressure sensitive zone,
A plurality of second electrodes extending in the second region along a second direction intersecting with the first direction and including third conductive particles electrically coupled to each other in a polymer binder;
A plurality of second conductive particles extending in the second direction and in contact with corresponding ones of the plurality of second electrodes and electrically connected to each other and including fourth conductive particles in a polymer binder; Pressure sensitive zone,
The first insulating substrate and the second insulating substrate are bonded to each other, have a first edge and a second edge facing each other with a distance of 50 mm or less, and are provided around the first region and the second region. An adhesive frame also used as a spacer,
With
The first region and the second region overlap each other, and the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones are arranged so as to face each other at positions where they can come into contact with each other, and the first insulating substrate and the In a state where pressure is not applied between the second insulating substrates, a gap between the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones is maintained by the adhesive frame, and the first conductive particles and Contact between the plurality of first pressure-sensitive zones and the plurality of second pressure-sensitive zones using the second conductive particles and the fourth conductive particles having lower conductivity than the third conductive particles. A pressure-sensitive sensor, wherein the first insulating substrate and the second insulating substrate are combined so that a resistance value of a resistor changes according to a pressure applied to the contact portion. The first insulating substrate includes a third region around the first region, is disposed in the third region, is connected to the plurality of first electrodes, and has an electrode width of 2 of the plurality of first electrodes. Having a plurality of first extraction wirings having a wiring width twice or more,
The pressure sensor according to claim 9.

Images