JP2019536217A - Led照明アセンブリを製造する方法 - Google Patents
Led照明アセンブリを製造する方法 Download PDFInfo
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- JP2019536217A JP2019536217A JP2019524955A JP2019524955A JP2019536217A JP 2019536217 A JP2019536217 A JP 2019536217A JP 2019524955 A JP2019524955 A JP 2019524955A JP 2019524955 A JP2019524955 A JP 2019524955A JP 2019536217 A JP2019536217 A JP 2019536217A
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- led lighting
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- led
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000000465 moulding Methods 0.000 claims description 25
- 238000004804 winding Methods 0.000 claims description 21
- 239000000969 carrier Substances 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- 239000011253 protective coating Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- 238000001723 curing Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/15—Strips of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
- F21S43/195—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (15)
- LED照明アセンブリを製造する方法であって、
複数の発光ダイオードのためのフレキシブル・キャリアを準備するステップ;
前記発光ダイオードを前記フレキシブル・キャリアに取り付けるステップ;
所望の形状又は形態に曲げることが可能な材料により構成されるフレキシブル成形要素を提供し、ヒート・スプレッダを組み込むステップ;及び
前記フレキシブル・キャリアを前記フレキシブル成形要素の周りに螺旋状に巻き付けるステップ;
を含む方法。 - 巻き付けた後に所望のLED配置を達成するように巻き付けピッチを決定するステップが、前記巻き付けるステップに先行している、請求項1に記載の方法。
- 前記巻き付けピッチは、前記フレキシブル成形要素の寸法及び/又は前記フレキシブル・キャリアの寸法に基づいて決定される、請求項2に記載の方法。
- 前記フレキシブル・キャリアを準備するステップは、前記発光ダイオード間の取り付けピッチを、巻き付けた後の所望のLED配置に基づいて決定するステップを含む、請求項1−3のうち何れか1項に記載の方法。
- 前記発光ダイオード及び前記フレキシブル・キャリアに保護コーティングを塗布するステップが、前記巻き付けるステップに先行している、請求項1−4のうち何れか1項に記載の方法。
- 前記螺旋状に巻き付けられたキャリア及び前記発光ダイオードを、半透明のフレキシブル材料の中に封入するステップを含む、請求項1−5のうち何れか1項に記載の方法。
- 前記フレキシブル成形要素を提供するステップは、フレキシブル材料の支持要素の周りにワイヤ・コイルを巻き付け、それにより動作中に前記ワイヤ・コイルが前記LEDからの熱を放散できるようにするステップを含む、請求項1−3のうち何れか1項に記載の方法。
- LED照明アセンブリであって、
所望の形状又は形態に曲げることが可能な材料により構成され、ヒート・スプレッダを組み込むフレキシブル成形要素;
フレキシブル・キャリアに取り付けられる複数の発光ダイオード;
を含み、前記フレキシブル・キャリアは前記フレキシブル成形要素の周りに螺旋状に巻き付けられる、LED照明アセンブリ。 - フレキシブル・キャリアは、独立に制御可能なLEDの2つ以上のセットのためにトラックを提供するように準備されている、請求項8に記載のLED照明アセンブリ。
- 共有されるフレキシブル成形要素の周りに巻き付けられた2つ以上のフレキシブル・キャリアを含む、請求項8又は請求項9に記載のLED照明アセンブリ。
- 前記フレキシブル成形要素は長尺支持要素を含み、前記長尺支持要素はシリコーン・ゴムにより構成されている、請求項8−10のうち何れか1項に記載のLED照明アセンブリ。
- 前記フレキシブル成形要素は、前記長尺支持要素の周りに巻き付けられたワイヤ・コイルを含む、請求項11に記載のLED照明アセンブリ。
- LEDの線状配置を達成するように前記フレキシブル成形要素の周りにフレキシブル・キャリアが巻き付けられている、請求項8−11のうち何れか1項に記載のLED照明アセンブリ。
- コンテナ内に配置される請求項8−13のうち何れか1項に記載のLED照明アセンブリを含み、前記コンテナは、複数の部分的に反射する側壁と前記側壁により規定される光出口開口とを含み、前記LED照明アセンブリは半透明のフレキシブル材料中に埋め込まれる、LED照明ユニット。
- 車両の後方照明ユニットとして実現される請求項14に記載のLED照明ユニットであって、フレキシブル・キャリアは、前記フレキシブル・キャリアに取り付けられるレッドLED及びイエローLEDの独立に制御可能なセットのためのトラックを含む、LED照明ユニット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16198676.5 | 2016-11-14 | ||
EP16198676 | 2016-11-14 | ||
PCT/EP2017/078435 WO2018087072A1 (en) | 2016-11-14 | 2017-11-07 | Method of manufacturing an led lighting assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019536217A true JP2019536217A (ja) | 2019-12-12 |
JP7059271B2 JP7059271B2 (ja) | 2022-04-25 |
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Application Number | Title | Priority Date | Filing Date |
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JP2019524955A Active JP7059271B2 (ja) | 2016-11-14 | 2017-11-07 | Led照明アセンブリ製造方法、led照明アセンブリ及びled照明ユニット |
Country Status (6)
Country | Link |
---|---|
US (1) | US10883694B2 (ja) |
EP (1) | EP3539355B1 (ja) |
JP (1) | JP7059271B2 (ja) |
CN (1) | CN109983843B (ja) |
TW (1) | TWI753047B (ja) |
WO (1) | WO2018087072A1 (ja) |
Families Citing this family (4)
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DE102019131817A1 (de) * | 2019-11-25 | 2021-05-27 | Audi Ag | Lichtelement für ein Kraftfahrzeug und Kraftfahrzeug |
US11867373B2 (en) | 2020-06-03 | 2024-01-09 | Lumileds Llc | Bendable lighting device |
US20230417378A1 (en) * | 2021-12-31 | 2023-12-28 | Encai Lin | Decorative lampstring and method for manufacturing same |
CN114811472B (zh) * | 2022-06-30 | 2022-09-20 | 深圳市兴连鑫光源有限公司 | 一种突破性实现高效便携式供电的软灯条 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0950253A (ja) * | 1995-08-07 | 1997-02-18 | Sharp Corp | フレキシブル発光表示体 |
US20040095078A1 (en) * | 2002-11-19 | 2004-05-20 | Leong Susan J. | Tubular housing with light emitting diodes |
US20110019433A1 (en) * | 2008-03-17 | 2011-01-27 | Osram Gesellschaft Mit Beschraenkter Haftung | Led lighting device |
US20150260361A1 (en) * | 2014-03-17 | 2015-09-17 | Looma Lighting Company Limited | Illuminating device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20119861U1 (de) * | 2001-12-07 | 2002-06-20 | Schuetz Winfried | Lichtschlauch |
US20040037080A1 (en) * | 2002-08-26 | 2004-02-26 | Luk John F. | Flexible led lighting strip |
US7210818B2 (en) * | 2002-08-26 | 2007-05-01 | Altman Stage Lighting Co., Inc. | Flexible LED lighting strip |
GB0413576D0 (en) * | 2004-06-15 | 2004-07-21 | Maiolino Simona | Lamp |
US8567992B2 (en) * | 2006-09-12 | 2013-10-29 | Huizhou Light Engine Ltd. | Integrally formed light emitting diode light wire and uses thereof |
TWM315805U (en) * | 2007-01-30 | 2007-07-21 | Unity Opto Technology Co Ltd | Illuminating device |
JP2009037795A (ja) * | 2007-07-31 | 2009-02-19 | Toshiba Lighting & Technology Corp | ランプ装置 |
TWM376709U (en) * | 2009-09-02 | 2010-03-21 | Liquidleds Lighting Corp | Curved tubular LED lamp |
TWM386437U (en) * | 2010-03-26 | 2010-08-11 | li-cheng Zhang | Illuminating device structure |
AU2011363028B2 (en) * | 2011-03-24 | 2016-05-26 | Steward Plastics, Inc. | Flexible tubing with embedded helical conductors and method of making |
JP2015533449A (ja) * | 2012-11-02 | 2015-11-24 | ザ ウォンド ライト カンパニー リミテッド | 照明装置 |
CN202931522U (zh) * | 2012-12-13 | 2013-05-08 | 童亮 | Led话筒套 |
US9528689B2 (en) * | 2013-03-13 | 2016-12-27 | Palo Alto Research Center Incorporated | LED lighting device with cured structural support |
US9353932B2 (en) * | 2013-03-13 | 2016-05-31 | Palo Alto Research Center Incorporated | LED light bulb with structural support |
US10132478B2 (en) * | 2016-03-06 | 2018-11-20 | Svv Technology Innovations, Inc. | Flexible solid-state illumination devices |
-
2017
- 2017-11-07 US US16/348,859 patent/US10883694B2/en active Active
- 2017-11-07 CN CN201780070391.6A patent/CN109983843B/zh active Active
- 2017-11-07 WO PCT/EP2017/078435 patent/WO2018087072A1/en active Application Filing
- 2017-11-07 JP JP2019524955A patent/JP7059271B2/ja active Active
- 2017-11-07 EP EP17794333.9A patent/EP3539355B1/en active Active
- 2017-11-13 TW TW106139088A patent/TWI753047B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0950253A (ja) * | 1995-08-07 | 1997-02-18 | Sharp Corp | フレキシブル発光表示体 |
US20040095078A1 (en) * | 2002-11-19 | 2004-05-20 | Leong Susan J. | Tubular housing with light emitting diodes |
US20110019433A1 (en) * | 2008-03-17 | 2011-01-27 | Osram Gesellschaft Mit Beschraenkter Haftung | Led lighting device |
US20150260361A1 (en) * | 2014-03-17 | 2015-09-17 | Looma Lighting Company Limited | Illuminating device |
Also Published As
Publication number | Publication date |
---|---|
TWI753047B (zh) | 2022-01-21 |
WO2018087072A1 (en) | 2018-05-17 |
EP3539355B1 (en) | 2020-03-04 |
CN109983843A (zh) | 2019-07-05 |
JP7059271B2 (ja) | 2022-04-25 |
US20200191353A1 (en) | 2020-06-18 |
CN109983843B (zh) | 2022-09-13 |
US10883694B2 (en) | 2021-01-05 |
TW201832616A (zh) | 2018-09-01 |
EP3539355A1 (en) | 2019-09-18 |
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