JP2019515502A - レンズおよび複合封入材を含む照明装置、およびその製造方法 - Google Patents
レンズおよび複合封入材を含む照明装置、およびその製造方法 Download PDFInfo
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- JP2019515502A JP2019515502A JP2018556863A JP2018556863A JP2019515502A JP 2019515502 A JP2019515502 A JP 2019515502A JP 2018556863 A JP2018556863 A JP 2018556863A JP 2018556863 A JP2018556863 A JP 2018556863A JP 2019515502 A JP2019515502 A JP 2019515502A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/154,576 US20170331016A1 (en) | 2016-05-13 | 2016-05-13 | A lighting device having an optical lens formed on composite encapsulant comprising nanoparticles covering a light-emitting diode (led) |
| US15/154,576 | 2016-05-13 | ||
| PCT/US2017/032707 WO2017197397A1 (en) | 2016-05-13 | 2017-05-15 | Lighting devices including a lens and a composite encapsulant, and methods of making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2019515502A true JP2019515502A (ja) | 2019-06-06 |
Family
ID=58993198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018556863A Pending JP2019515502A (ja) | 2016-05-13 | 2017-05-15 | レンズおよび複合封入材を含む照明装置、およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20170331016A1 (de) |
| JP (1) | JP2019515502A (de) |
| DE (1) | DE112017002467B4 (de) |
| WO (1) | WO2017197397A1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021241511A1 (ja) * | 2020-05-29 | 2021-12-02 | Ａｇｃ株式会社 | 樹脂組成物、光学素子及び紫外線発光装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10431723B2 (en) * | 2017-01-31 | 2019-10-01 | Apple Inc. | Micro LED mixing cup |
| JP7248379B2 (ja) * | 2017-07-24 | 2023-03-29 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| US10662310B2 (en) * | 2018-04-24 | 2020-05-26 | Osram Opto Semiconductors Gmbh | Optoelectronic component having a conversation element with a high refractive index |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141556A (ja) * | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
| JP2005209795A (ja) * | 2004-01-21 | 2005-08-04 | Koito Mfg Co Ltd | 発光モジュール及び灯具 |
| JP2009024116A (ja) * | 2007-07-23 | 2009-02-05 | Sony Corp | 硬化性樹脂材料−微粒子複合材料及びその製造方法、光学材料、並びに発光装置 |
| JP2009506557A (ja) * | 2005-08-30 | 2009-02-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクスデバイス |
| JP2009185120A (ja) * | 2008-02-04 | 2009-08-20 | Sony Corp | 硬化性樹脂材料−微粒子複合材料及びその製造方法、光学材料、並びに発光装置 |
| CN103137829A (zh) * | 2011-12-02 | 2013-06-05 | 日立空调·家用电器株式会社 | 照明装置 |
| JP2014011364A (ja) * | 2012-06-29 | 2014-01-20 | Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 | Ｌｅｄモジュール |
| US20150287893A1 (en) * | 2014-04-02 | 2015-10-08 | Genesis Photonics Inc. | Package material for packaging photoelectric device and package |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005083037A1 (en) | 2004-02-20 | 2005-09-09 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a radiation source and a fluorescent material |
| EP1919000A1 (de) | 2005-08-05 | 2008-05-07 | Matsushita Electric Industries Co., Ltd. | Lichtemittierendes halbleiterbauelement |
| JP4724618B2 (ja) * | 2005-11-11 | 2011-07-13 | 株式会社 日立ディスプレイズ | 照明装置及びそれを用いた液晶表示装置 |
| EP1979954B1 (de) * | 2006-01-24 | 2015-03-18 | Philips Intellectual Property & Standards GmbH | Lichtemittierende vorrichtung |
| US8791631B2 (en) * | 2007-07-19 | 2014-07-29 | Quarkstar Llc | Light emitting device |
| US9287469B2 (en) * | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
| WO2010141235A1 (en) * | 2009-06-01 | 2010-12-09 | Nitto Denko Corporation | Light-emitting divice comprising a dome-shaped ceramic phosphor |
| US8455898B2 (en) * | 2011-03-28 | 2013-06-04 | Osram Sylvania Inc. | LED device utilizing quantum dots |
| WO2013043844A1 (en) * | 2011-09-20 | 2013-03-28 | The Regents Of The University Of California | Light emitting diode with conformal surface electrical contacts with glass encapsulation |
| US20150380615A1 (en) * | 2014-06-27 | 2015-12-31 | Paul A. Zimmerman | Light emitting diodes with improved efficiency |
-
2016
- 2016-05-13 US US15/154,576 patent/US20170331016A1/en not_active Abandoned
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2017
- 2017-05-15 DE DE112017002467.6T patent/DE112017002467B4/de active Active
- 2017-05-15 WO PCT/US2017/032707 patent/WO2017197397A1/en active Application Filing
- 2017-05-15 JP JP2018556863A patent/JP2019515502A/ja active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141556A (ja) * | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
| JP2005209795A (ja) * | 2004-01-21 | 2005-08-04 | Koito Mfg Co Ltd | 発光モジュール及び灯具 |
| JP2009506557A (ja) * | 2005-08-30 | 2009-02-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクスデバイス |
| JP2009024116A (ja) * | 2007-07-23 | 2009-02-05 | Sony Corp | 硬化性樹脂材料−微粒子複合材料及びその製造方法、光学材料、並びに発光装置 |
| JP2009185120A (ja) * | 2008-02-04 | 2009-08-20 | Sony Corp | 硬化性樹脂材料−微粒子複合材料及びその製造方法、光学材料、並びに発光装置 |
| CN103137829A (zh) * | 2011-12-02 | 2013-06-05 | 日立空调·家用电器株式会社 | 照明装置 |
| JP2014011364A (ja) * | 2012-06-29 | 2014-01-20 | Ｈｏｙａ Ｃａｎｄｅｏ Ｏｐｔｒｏｎｉｃｓ株式会社 | Ｌｅｄモジュール |
| US20150287893A1 (en) * | 2014-04-02 | 2015-10-08 | Genesis Photonics Inc. | Package material for packaging photoelectric device and package |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021241511A1 (ja) * | 2020-05-29 | 2021-12-02 | Ａｇｃ株式会社 | 樹脂組成物、光学素子及び紫外線発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112017002467T5 (de) | 2019-01-24 |
| WO2017197397A1 (en) | 2017-11-16 |
| DE112017002467B4 (de) | 2024-03-14 |
| US20170331016A1 (en) | 2017-11-16 |
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