JP2019220006A - Dual interface card and manufacturing method thereof, and method for inspecting position of antenna incorporated in card - Google Patents

Abstract

To provide a dual interface card capable of specifying the position of a built-in antenna and a manufacturing method thereof, and a method for inspecting the position of the antenna incorporated in the card.SOLUTION: A dual interface card having a contact communication function and a non-contact communication function includes: a card base material including one or more core sheets and having an embedding scheduled area for embedding an IC module; and the IC module embedded in the embedding scheduled area. An antenna is disposed in one of the one or more core sheets and the antenna is electrically connected to a terminal of the IC module. Within a range observable from the embedding scheduled area in a state before the IC module is embedded, the dual interface card has a print pattern whose position relative to the antenna is specified on at least one surface of the core sheet in which the antenna is disposed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a dual interface card and a method for manufacturing the same, and a method for inspecting the position of an antenna built in the dual interface card.

  As an IC card, a contact communication type IC card in which an IC module is embedded from the surface of a card base material, and a non-contact communication type in which an IC chip and an antenna circuit connected to the IC chip are built in the card base material. 2. Description of the Related Art There is known an IC card of a type, and an IC card provided with both functions of contact communication and contactless communication.

  An IC card provided with both functions of contact communication and non-contact communication is generally an IC module embedded from the surface of a card base, and an IC module disposed inside the card base, and The card can be used in combination with an antenna that is electrically connected to the card. Such a card is generally called a dual interface card (hereinafter, also referred to as a “DIF card”), and in some cases, a combination card, a combination card, or a complex IC card.

  DIF cards are usually manufactured by the following manufacturing method.

  First, a core sheet (or an antenna sheet) on which an antenna is arranged is formed. Next, the core sheet on which the antenna is arranged is laminated so as to be sandwiched by other core sheets or other functional sheets, pressed, and punched into a card shape to form a card base material. . After that, an area for embedding the IC module is cut from the surface of the formed card base material, and the terminals of the IC module are electrically connected to the antenna so that the IC module is embedded in the area for embedding. Manufactures DIF cards.

  As described above, when manufacturing a card base material of a DIF card, a core sheet on which an antenna is arranged and another core sheet or another functional sheet may be shifted from each other during pressing. Such a shift cannot be observed from the outside.

  If the position of the antenna is shifted, when the manufactured DIF card is embossed, the antenna may be cut off by the embossing. Also, if the position of the antenna is shifted, the connection between the antenna and the IC chip may be defective.

  For this reason, it is necessary to specify the position of the antenna built in the card base material of the manufactured DIF card.

  Patent Document 1 discloses an antenna circuit multi-faced sheet for use in manufacturing a non-contact communication type IC card. Specifically, this antenna circuit multi-layered sheet is provided with a plurality of antenna circuits corresponding to respective IC cards on one sheet, and the plurality of antenna circuits is provided on two inner sheets. The sheet is sandwiched from the front and back and integrated. At this time, a position confirmation mark is printed on one of the inner sheets based on the end. With this position confirmation mark, the position of the antenna circuit sandwiched inside can be confirmed.

  Further, in Patent Document 2, prior to cutting a sheet-like IC module in which a protection plate for protecting an IC chip is arranged at a predetermined position with respect to a winding coil, the position of the protection plate is detected by a detection unit, and the control unit A technique has been disclosed in which the position of the IC module is accurately detected and cut by controlling the driving of the web transfer means to position the sheet-like IC module, and that different types of products are prevented from being mixed.

JP-A-2006-224508 JP 2005-149352 A

  In order to identify the position of the antenna built in the card base of the DIF card, inspection by X-rays or inspection by light such as infrared rays is considered.

  However, when performing an X-ray inspection, the equipment to be used is expensive, and it is necessary to educate the user and apply for use to labor standards supervision. In addition, when performing inspection using light such as infrared light, it is difficult to determine the position of the antenna if the printed design on the surface of the DIF and the shape of the built-in antenna overlap. Furthermore, for example, in the case of manufacturing a DIF card having a magnetic tape, there is a problem that light such as infrared light is hardly transmitted due to concealment printing for concealing the magnetic tape.

  Therefore, the present invention has been made to solve the above-described problems, and a DIF card capable of specifying a position of a built-in antenna, a method of manufacturing the same, and a position of an antenna built in the DIF card can be specified. It is intended to provide an inspection method.

  The present inventors have found that the above problem can be solved by the following means.

<Aspect 1>
A dual interface card having a contact communication function and a contactless communication function,
A card base material including one or a plurality of core sheets and having an area to be embedded for embedding an IC module;
An IC module embedded in the area to be embedded;
Has,
An antenna is disposed on one of the one or more core sheets, and the antenna is electrically connected to a terminal of the IC module;
A print in which a position relative to the antenna is specified on at least one surface of the core sheet on which the antenna is arranged, within a range that can be observed from the area to be embedded before the IC module is embedded. Having a pattern,
Dual interface card.
<Aspect 2>
The dual interface card according to aspect 1, wherein the antenna is a wound antenna.
<Aspect 3>
The dual interface card according to aspect 1 or 2, wherein a surface of the core sheet on which the antenna is disposed, on a side on which the antenna is disposed, faces a rear surface of the dual interface card.
<Aspect 4>
The dual interface card according to aspect 1 or 2, wherein the surface of the core sheet on which the antenna is disposed, on the side where the antenna is disposed, faces the front side of the dual interface card.
<Aspect 5>
The dual interface card according to any one of aspects 1 to 4, wherein the printing pattern is present on a surface of the core sheet on which the antenna is arranged, the surface facing a back surface side of the dual interface card. .
<Aspect 6>
The dual interface card according to any one of aspects 1 to 4, wherein the printing pattern is present on a surface of the core sheet on which the antenna is arranged, the surface facing the front side of the dual interface card. .
<Aspect 7>
The dual interface card according to any one of aspects 1 to 4, wherein the print pattern is present on both sides of the core sheet on which the antenna is arranged.
<Aspect 8>
The dual interface card according to any one of aspects 1 to 7, wherein the core sheet on which the antenna is arranged is a transparent or translucent core sheet.
<Aspect 9>
The dual interface card according to any one of aspects 1 to 8, wherein the print pattern is a point or a group of points, a line, a cross, a circle, or a combination thereof.
<Aspect 10>
An inspection method for inspecting a position of an antenna in manufacturing the dual interface card according to any one of aspects 1 to 9,
Before embedding the IC module in the embedding expected area, the method includes visually evaluating or observing the position of the print pattern with a camera.
Inspection methods.
<Aspect 11>
The inspection method according to aspect 10, wherein the evaluation includes comparing a position where the print pattern should exist and a position of the observed print pattern.
<Aspect 12>
The method for manufacturing a dual interface card according to any one of aspects 1 to 9, including the inspection method according to aspect 10 or 11.

  According to the present invention, the position of the antenna built in the DIF card can be specified.

FIG. 1 is a plan view showing one embodiment of the DIF card of the present invention. FIG. 2 is a diagram showing one embodiment of the embedding scheduled area according to the present invention. FIG. 2A is an enlarged plan view illustrating a region to be embedded on the card base material. FIG. 2B is a diagram showing the vicinity of a region to be embedded in the cross section taken along the line AA in FIG. FIG. 3 is a schematic view showing one embodiment of the production method of the present invention. FIG. 4 is a schematic diagram illustrating a card base manufacturing process and an inspection method for inspecting a position of an antenna according to the first embodiment. FIG. 5 is a schematic diagram illustrating a card base manufacturing process and an inspection method for inspecting a position of an antenna according to the second embodiment. FIG. 6 is a schematic diagram illustrating an inspection method for inspecting the position of the antenna on the card base material manufactured in the third embodiment. FIG. 7 is a schematic plan view of an area to be embedded on the card base material of each of Example 1, Example 4, and Comparative Example 1.

≪DIF card≫
The DIF card of the present invention
A dual interface card having a contact communication function and a contactless communication function,
A card base material including one or a plurality of core sheets and having an area to be embedded for embedding an IC module;
An IC module embedded in the area to be embedded;
Has,
An antenna is disposed on one of the one or more core sheets, and the antenna is electrically connected to a terminal of the IC module;
A print pattern whose relative position to the antenna is specified is provided on at least one surface of the core sheet on which the antenna is arranged within a range that can be observed from the area to be embedded before the IC module is embedded.

  For example, FIG. 1 is a plan view showing one embodiment of the DIF card of the present invention. The DIF card 100 of the present invention includes: a card base material 1 including one or a plurality of core sheets and having an embedding area 3 for embedding an IC module; and an IC module embedded in the embedding area 3. Have. In FIG. 1, the IC module is omitted for convenience of explanation. The antenna 2 is arranged on one of one or a plurality of core sheets included in the card base 1. The antenna 2 can be electrically connected to terminals of an IC module (not shown) via the contact terminals 2a and 2b. Before embedding the IC module, a position relative to the antenna 2 is specified on at least one surface of the core sheet on which the antenna 2 is arranged within a range observable from the embedding expected area 3 of the card base material 1. The printed pattern 4 is provided.

  As described above, the DIF card of the present invention can specify the position of a built-in antenna. This is because the DIF card according to the present invention has at least one surface of the core sheet on which the antenna is arranged, in a range that can be observed from the area to be embedded before embedding the IC module on the surface of the card base material. This is because it has a print pattern whose relative position to the antenna is specified. More specifically, before embedding the IC module, by observing the print pattern within a range observable from the area to be embedded, the position of the antenna having a specific relative positional relationship with the print pattern can be recognized. . As a result, if the position of the antenna is shifted, it can be recognized, and if necessary, the card base having been shifted can be discarded before mounting the IC module.

  In the present invention, observation is not particularly limited, and may be, for example, visual observation, or may use a device such as a camera.

  Hereinafter, the components of the DIF card of the present invention will be described in detail.

<Card base material>
The card base material includes one or a plurality of core sheets and has an area to be embedded for embedding the IC module. Further, the antenna is arranged on one of one or a plurality of core sheets included in the card base material.

  The thickness of the card base material is not particularly limited, and may be, for example, 500 μm or more, 550 μm or more, 600 μm or more, 650 μm or more, 680 μm or more, 700 μm or more, 750 μm or more, or 800 μm or more, or 1000 μm or less, 950 μm. Hereinafter, it may be 900 μm or less, 850 μm or less, or 800 μm or less.

(Embedded area)
An embedding area for embedding the IC module (hereinafter, also simply referred to as “embedding area”) is usually formed by cutting from the front side of the card base material, that is, from the front side of the DIF card.

  The position of the area to be embedded is not particularly limited. However, from the viewpoint of easy contact between the contact terminal portion of the antenna built in the DIF card and the terminal of the IC module, the contact terminal portion of the antenna is usually viewed from a direction perpendicular to the surface of the card base material. It is preferable to set the embedding scheduled area so as to partially overlap. Further, when forming the buried region, a part of the end of the contact terminal portion of the antenna may be cut off by cutting.

  For example, as shown in FIG. 1, when viewed from a direction perpendicular to the surface of the card base 1, the card base 1 partially overlaps the contact terminals 2 a and 2 b of the antenna 2. And an embedding area 3 for embedding an IC module.

  The size and shape of the area to be embedded can be appropriately set according to the size and shape of the IC module to be used.

  For example, the area to be embedded can include a first recess, a second recess formed substantially at the center of the first recess, and a contact opening present in the first recess. Here, the first recess is capable of accommodating a substrate portion of an IC module described later, and the second recess is capable of accommodating a sealing portion of the IC module described later. Further, the contact opening in the first recess is an opening for making electrical contact between the terminal of the IC module and the contact terminal of the antenna.

  In the present invention, when the embedding region includes the first concave portion, the second concave portion, and the contact opening as described above, it is preferable that the printing pattern can be observed from the first concave portion of the embedding region. Note that the print pattern may not be completely exposed because the print pattern is covered by the core sheet as long as the print pattern can be observed through the core sheet in the embedding expected area.

  Generally, when viewed from a direction perpendicular to the surface of the card substrate, preferably, the area of the first recess is larger than the area of the second recess, and the depth of the first recess is preferably larger. Therefore, the depth of the second concave portion is deeper.

  More specifically, for example, the depth of the first concave portion can be a depth at which the printed pattern and the contact terminal portion of the antenna are not exposed.

  In addition, since the contact terminal of the antenna contacts the terminal of the IC module, it is preferable that the contact opening existing in the first recess has a depth until the contact terminal of the antenna is exposed.

  In addition, the second concave portion may have a depth until the second concave portion penetrates through a contact terminal portion of a conductor present inside the card base material.

  For example, FIG. 2 is a diagram showing one embodiment of an area to be embedded according to the present invention. FIG. 2A is an enlarged plan view illustrating a region to be embedded on the card base material. FIG. 2B is a diagram showing the vicinity of a region to be embedded in the cross section taken along the line AA in FIG.

  As shown in FIG. 2A, the to-be-buried region 30 includes a first recess 30a, a second recess 30b, and contact openings 30c and 30d present in the first recess 30a. . At this time, the print patterns 40a, 40b, 40c, 40d, 40e, and 40f can be observed in the first recess 30a. It should be noted that none of these print patterns is directly exposed to the first concave portion 30a, but can be observed through a core sheet on the print pattern.

  Further, as shown in FIG. 2B, the first recess 30a is wider than the second recess 30b, and each of the antennas 20a and 30b is formed from the contact openings 30c and 30d in the first recess 30a. Are cut so that the contact terminal portions 20a and 20b are exposed. The second concave portion 20b is cut deeper than the depth positions of the contact terminal portions 20a and 20b. At this time, a part (dotted line) of each end of the contact terminal portions 20a and 20b is cut off by cutting.

  In FIG. 2B, these print patterns 40a, 40b, 40c, 40d, 40e, and 40f are present on the surface of the core sheet 10 on which the antenna 20 is disposed, on the side opposite to the antenna 20. Although neither is directly exposed to the first recess 30a, the first recess may be formed so as to be directly exposed to the first recess 30a.

(Core sheet)
In the present invention, one or more core sheets are included in the card base material. The antenna is arranged on one of the one or more core sheets. In the following description, the phrase "core sheet on which the antenna is arranged" includes the concept of "antenna sheet" in the case of an etched antenna.

  In the present invention, at least one surface of the core sheet on which the antenna is arranged has an antenna and a print pattern whose relative position is specified. Note that the antenna and the print pattern only need to be present on the same core sheet, and may be present on the same side surface of the core sheet, or may be present on the opposite side surface.

  The antenna is not particularly limited, and may be a wound antenna or an etched antenna. Generally, it is preferable to use a wound antenna from the viewpoint of manufacturing cost.

  In addition, when a wire-wound antenna is used, the effects of the present invention can be more remarkably exhibited. This is because, when embossing is performed on the surface of the DIF card, if the position of the antenna cannot be specified and overlaps with the position of the embossing, the wound antenna is easier to break than the etched antenna. ADVANTAGE OF THE INVENTION According to this invention, since the position of an antenna can be specified, the winding antenna which is easy to design can be used advantageously.

  An antenna generally has an antenna unit and a contact terminal unit. The antenna unit is a part having a non-contact communication function, and may be formed by winding a coil (spiral) with a conductive wire, for example. The contact terminal portion is a portion having a role of making electrical contact with a terminal of the IC module. For example, the antenna 2 shown in FIG. 1 is a wound antenna, and includes an antenna portion wound in a coil shape of about three turns, and contact terminal portions 2a and 2b extending from an end of the antenna portion. Having.

  In the case of a wound antenna, the number of turns of the antenna unit is not particularly limited, and can be appropriately set according to the purpose and application. Further, the shape of the contact terminal portion is not particularly limited, and may be formed in a meandering or spiral shape by conducting wires, or may be formed in a plate shape by etching.

  The material of the conductive wire used for the wound antenna is not particularly limited as long as it has a communication function and a conductive function. For example, a metal wire such as copper, aluminum, or gold may be used. Further, the conductive wire may be coated with an insulating material such as a resin as necessary.

  In the card base material according to the present invention, the direction of the surface of the core sheet on which the antenna is disposed on the side on which the antenna is disposed is not particularly limited, and may be directed to the back side of the DIF card. It may face the front side of the card.

  According to the present invention, a print pattern whose relative position to the antenna is specified on at least one surface of the core sheet on which the antenna is arranged within a range that can be observed from the area to be embedded before the IC module is embedded. Having.

  According to the present invention, the position of the built-in antenna can be specified by observing the print pattern before the IC module is embedded. That is, since the antenna and the print pattern are present on the same core sheet, even if the core sheet is shifted when forming the card base material, the relative positions of the antenna and the print pattern do not shift, Therefore, by observing the printed pattern, the position of the built-in antenna can be specified.

  The print pattern only needs to be present on at least one surface of the core sheet on which the antenna is arranged within a range that can be observed from the area to be embedded before the IC module is embedded.

  More specifically, the printed pattern may be present on the surface of the core sheet on which the antenna is arranged, facing the back side of the DIF card, and the printed pattern of the core sheet on which the antenna is arranged is arranged on the DIF card. May be present on the surface facing the front side of the core sheet, or may be present on both surfaces of the core sheet on which the antenna is arranged.

  The printing pattern is not particularly limited, and may have any shape or any size. The print pattern is preferably a dot or a group of dots, a line, a cross, a circle, or a combination thereof. For example, in FIG. 1, the print pattern 4a is linear.

  The color of the print pattern is not particularly limited, and can be appropriately set within a range that can be visually observed or observed with a camera. Further, the color of the print pattern is preferably a color that is clearly different from the color of the core sheet in order to make it easier to observe.

  The print pattern only needs to be present in at least one place within a range that can be observed from the area to be embedded before embedding the IC module. In order to improve the accuracy of specifying the position of the antenna, the print pattern is , Two or more locations. For example, in FIG. 1, the print pattern exists only in one place. Further, in FIG. 2A, the print patterns exist in a total of six places.

  Further, the print pattern may overlap with the contact terminal portion of the antenna within a range that can be observed from the area to be embedded before the IC module is embedded. For example, the print patterns 40a and 40b shown in FIG. 2A overlap the contact terminal portions 20a, and the print patterns 40c and 40d overlap the contact terminal portions 20b.

  The material of the core sheet is not particularly limited. For example, polyolefin resins such as polyethylene and polypropylene, polystyrene resins, polyvinyl chloride resins (PVC), poly (meth) acrylate resins, acrylic resins, polyacetal resins, Crystalline polyester resins such as crystalline polyethylene terephthalate (PET), polybutylene terephthalate and polyethylene naphthalate (PEN), and amorphous polyesters such as a copolymer of terephthalic acid with ethylene glycol and cyclohexanedimethanol (PET-G) It is possible to use a thermoplastic resin such as a resin, a polyamide resin, a polycarbonate (PC) resin, a polyphenylene sulfide resin, and a polyimide resin, or a polymer alloy formed by mixing at least two or more of these resins. That.

  The core sheet may be a single layer using these resins, or may be a laminate thereof.

  Also, the core sheet may be an opaque, translucent, or transparent core sheet. In addition, the degree of transparency of the translucent core sheet is not particularly limited, and may be, for example, a degree through which the printed pattern can be visually observed. Further, the opaque core sheet may be capable of visually observing a printed pattern through the opaque core sheet when it is cut and thinned to form a region to be embedded.

  If the printed pattern is present on the surface of the core sheet on which the antenna is disposed, facing the back side of the DIF card, from the viewpoint of making it easier to observe the printed pattern, the core sheet on which the antenna is disposed Is preferably a transparent or translucent core sheet. Further, as a core sheet adjacent to the core sheet on which the antenna is arranged, it is preferable to use a transparent or translucent core sheet from the same viewpoint.

  The thickness of each core sheet is not particularly limited. For example, 50 μm or more, 75 μm or more, 90 μm or more, 100 μm or more, 125 μm or more, 150 μm or more, 175 μm or more, 180 μm or more, 200 μm or more, 250 μm or more, 300 μm or more, 350 μm or more Or 400 μm or more. Further, from the viewpoint of pursuing the thinness of the DIF card, it may be 500 μm or less, 450 μm or less, 400 μm or less, 350 μm or less, 300 μm or less, 280 μm or less, 250 μm or less, or 200 μm or less.

  The number of core sheets included in the card base material according to the present invention is one or more. That is, the number of core sheets may be one or more. For example, the number of core sheets can be freely set in a range of two or more and ten or less according to a desired thickness of the card base material. In addition, one of these core sheets has the above-mentioned print pattern, and the core sheet on which the antenna is arranged is indispensable.

(Other layers)
The card base material according to the present invention may further include other layers in addition to the core sheet. For example, an over film or the like can be included.

  The over film has a function of protecting the core sheet and the like, and is preferably located at least on the outermost surface of the card substrate, and more preferably located on the outermost surface on both the front side and the back side of the card substrate. .

  The thickness of the over film is not particularly limited, and may be, for example, 30 μm or more, 35 μm or more, 40 μm or more, 45 μm or more, 50 μm or more, or 55 μm or more, and 80 μm or less, 75 μm or less, 70 μm or less, 65 μm or less. Or 60 μm or less.

  The material of the over film is not particularly limited, and for example, the above-described material of the core sheet can be appropriately used.

  The overfilm may be opaque, translucent, or transparent.

<IC module>
The IC module is embedded from the surface of the card base described above. The IC module may have a substrate portion and a sealing portion for sealing the IC chip.

(Board part)
The material constituting the substrate is not particularly limited, and may be, for example, glass-epoxy or polyimide.

  The substrate has a terminal on the back side that can be connected to the above-mentioned contact terminal of the antenna. The material forming the terminal may be a conductive material, for example, a metal such as copper, gold, or aluminum.

  The substrate part may have its front side exposed from the surface of the card base material. Further, an external contact terminal that can make contact with the outside can be provided on the front surface of the substrate unit. The external contact terminal may be, for example, an external contact terminal in which a plating layer made of nickel, gold, silver, or the like is laminated on a pattern made of copper.

(Sealing part)
The sealing portion may be embedded into the card base material. The material of the sealing portion is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin, an acrylic resin, a urethane resin, or a phenol resin.

  An IC chip is sealed in the sealing portion. The connection between the IC chip and the terminal can be performed by a connection member such as wire bonding or an anisotropic conductive paste.

  Normally, the above-described substrate, sealing portion, and IC chip are collectively referred to as “Chip On Tape”, or simply as “COT”.

検 査 Inspection method for inspecting antenna position の
The present invention also provides an inspection method for inspecting a position of an antenna in manufacturing a DIF card. Note that the details of the DIF card can be referred to the description of the item “DIF card” described above, and thus redundant description will be omitted.

The inspection method of the present invention
Before embedding the IC module in the embedding expected area, this includes visually evaluating the position of the print pattern or observing with a camera and evaluating the position.

  Here, the evaluation can include comparing the position where the print pattern should exist with the position of the observed print pattern.

  For example, the position of the print pattern when the antenna is at the correct position is referred to as “the position where the print pattern should exist”, and after forming the card base material, before embedding the IC module in the planned embedding area, When the print pattern observed from is defined as “the position of the observed print pattern”, the position where the print pattern should exist and the position of the observed print pattern are compared before and after the formation of the card base material. Of the print pattern can be evaluated.

  Since the relative positions of the antenna and the print pattern are specified, the degree of the positional shift of the antenna can be specified from the degree of the observed shift of the print pattern.

  Therefore, the position of the antenna built in the DIF card can be specified by the inspection method of the present invention.

  For example, by using the inspection method of the present invention, embossing can be performed while taking care not to cut the antenna in accordance with the position of the specified antenna. In addition, depending on the degree of displacement, a card substrate having a displaced antenna can be discarded before attaching a relatively expensive IC module to the card substrate.

製造 Manufacturing method of DIF card≫
The present invention also provides a method for manufacturing a DIF card. Note that the details of the DIF card can be referred to the description of the item “DIF card” described above, and thus redundant description will be omitted.

  The manufacturing method of the present invention includes the above-described inspection method.

  The manufacturing method of the present invention for manufacturing a DIF card is not particularly limited except that the above-described inspection method is essentially included. For example, the DIF card of the present invention is manufactured according to the following steps shown in FIG. can do. FIG. 3 is a schematic view showing one embodiment of the manufacturing method of the present invention.

<Step (a)>
In the step (a), the position of the antenna is determined on the core sheet, and the print pattern is printed so that the positional relationship with the determined antenna position can be specified. This print pattern may be present on the same side as the antenna or on the opposite side.

  For example, as shown in FIG. 3A, the position of the antenna is determined on the core sheet 11, and the print patterns 12a and / or 12b are printed so as to have a specific positional relationship with the position of the antenna. .

  This step (a) may be performed after the step (b) described later. That is, after arranging the antenna on the core sheet, the print pattern may be printed so that the positional relationship with the position of the antenna can be specified.

<Step (b)>
In the step (b), the antenna is arranged on the core sheet.

  As shown in FIG. 3B, the antenna 13 is arranged on the core sheet 11. At this time, the antenna 13 is arranged so that the antenna 13 and the print patterns 12a and / or 12b have a specific positional relationship. In FIG. 3B, 13a and 13b indicate contact terminal portions of the antenna 13.

  The method for arranging the antenna on the core sheet is not particularly limited. For example, in the case of an etching antenna, an etching method may be used. May be formed in an air-core coil shape and then embedded in the core sheet, or a conductor drawing method in which a conductor is drawn on the core sheet while applying heat.

<Step (c)>
In the step (c), a core sheet on which the antenna is arranged, another optional core sheet and an over film are laminated, and hot pressing is performed to form a card base material.

  For example, as shown in FIG. 3C, the core sheet 11 on which the antenna is arranged, other core sheets 12 and 13, and the over films 14 and 15 are laminated, and hot pressing is performed. By doing so, the card base material 16 is formed. Here, the surface of the core sheet 11 on which the antenna 13 is disposed, on the side where the antenna 13 is disposed, faces the back side of the DIF card.

<Step (d)>
In the step (d), a region to be embedded in which the IC module is to be embedded is cut from the front side of the card base material. At this time, it is preferable that the first concave portion in the embedding region is cut to a depth at which the print pattern can be seen through the core sheet on the print pattern.

  For example, as shown in FIG. 3D, an area to be embedded 17 in which the IC module 18 is to be embedded is cut from the front side of the card base material 16. At this time, the first concave portion of the to-be-buried region 17 is cut to a depth at which the print pattern 12a can be seen through the core sheet 12 on the print pattern 12a and / or 12b.

<Step (e)>
In the step (e), the position of the print pattern is evaluated visually or with a camera. By this step, the position of the antenna having a specific positional relationship with the print pattern can be substantially inspected.

  For example, as shown in FIG. 3E, the position of the print pattern 12a is observed and evaluated with a camera.

<Step (f)>
In the step (f), the IC module is embedded in the area to be embedded.

  For example, as shown in FIG. 3F, the IC module 18 is embedded in the planned embedding area 17.

  As described above, the method of the present invention for manufacturing a DIF card can specify the position of the antenna built in the DIF card by including the above-described inspection method.

<Example 1>
Using the configuration of the card base material shown in Table 1 below, based on the steps (a) to (c) shown in FIG. Sheets / second core sheet / third core sheet / fourth core sheet / second over film were laminated in this order and hot pressed to form a card base material.

  At this time, the surface of the second core sheet on which the antenna is arranged faces the back surface of the DIF card, and the printed patterns 41a, 41b, 41c, and 41d are on the surface on the opposite side of the antenna. Set to exist. A copper wire wound antenna was used as the antenna.

  Then, as shown in FIG. 4D, an area to be embedded for embedding the IC module was cut from the front side of the card base material to produce the card base material of Example 1.

  As shown in FIG. 4E, it is possible to identify the position of the built-in antenna by visually observing the printed pattern or observing the image with a camera on the card base material thus manufactured. it can.

<Example 2>
Using the configuration of the card base material shown in Table 1 above, based on steps (a) to (c) shown in FIG. Sheets / second core sheet / third core sheet / fourth core sheet / second over film were laminated in this order and hot pressed to form a card base material.

  At this time, the surface of the second core sheet on which the antenna is arranged faces the front side of the DIF card, and the printed pattern is the core sheet on which the antenna is arranged, on the front side of the DIF card. It was set to exist on the surface facing. A copper wire wound antenna was used as the antenna.

  Then, as shown in FIG. 5D, an area to be embedded for embedding the IC module was cut from the front side of the card base material to produce a card base material of Example 2.

  As shown in FIG. 5E, it is possible to identify the position of the built-in antenna by visually or observing the printed pattern on the card base material thus manufactured. it can.

<Example 3>
In the first embodiment, the transparent core sheet is used as the second core sheet, and the printed pattern exists on the surface of the core sheet on which the antenna is arranged, facing the back surface of the DIF card. The card base material of Example 3 was produced in the same manner except that the setting was made as described above.

  In the card base material thus manufactured, since the transparent core sheet was used as the second core sheet, as shown in FIG. 6, the printed pattern was visually observed or observed with a camera through the second core sheet. By doing so, the position of the built-in antenna can be specified.

<Example 4>
In Example 1, the card base material of Example 4 in which the position of the antenna was shifted was produced in the same manner except that the second core sheets were intentionally shifted and laminated.

<Comparative Example 1>
A card base material of Comparative Example 1 in which the position of the antenna was shifted was produced in the same manner as in Example 4 except that no print pattern was applied.

(Comparison evaluation)
FIG. 7 is a schematic plan view of an area to be embedded on the card base material of each of Example 1, Example 4, and Comparative Example 1. In addition, the configuration inside the card base material in each drawing of FIG. 7, that is, a part that cannot be observed from the outside (for example, a part of the contact terminal part of the antenna, a part that cannot be observed from the outside due to displacement) is indicated by a dotted line. .

  As shown in FIG. 7, a print pattern 41a whose relative position to the antenna 21 is specified within a range observable from the embedding expected area 31 of the first embodiment (mainly, the first concave portion 31a). By observing 41b, 41c, and 41d, the position of the antenna 21 can be specified.

  In addition, only the print patterns 44a and 44c whose relative position with respect to the antenna 24 is specified can be observed within the range observable from the embedding expected area 34 of the fourth embodiment (mainly, the first concave portion 34a). Was. In particular, when compared with the print patterns 41a, 41b, 41c, and 41d of the first embodiment, it can be recognized that the antenna 24 built in the card base material of the embodiment is shifted. In the fourth embodiment, the position where the print patterns 44a, 44b, 44c, and 44d should exist and the observed position are also compared to recognize that the built-in antenna 24 is shifted. it can.

  On the other hand, in Comparative Example 1, since the print pattern was not applied, the antenna 25 was not observed within a range that could be observed from the embedding expected area 35, and the antenna was partially removed from the two contact openings 35c and 35d. Observation is possible, but it is impossible to determine whether the position of the antenna is shifted.

1 Card base material 2, 20, 21, 24, 25 Antennas 2a, 2b, 20a, 20b Antenna contact terminal portions 21a, 21b, 24a, 24b, 25a, 25b Antenna contact terminal portions 3, 30 Embedding area 3a, 30a, 31a, 34a, 35a First recess 3b, 30b, 31b Second recess 3c, 3d Contact opening 30c, 30d, 31c, 31d, 34c, 34d, 35c, 35d Contact opening 4, 40a, 40b, 40c, 40d, 40e, 40f Print patterns 41a, 41b, 41c, 41d, 44a, 44b, 44c, 44d Print patterns 12a, 12b Print patterns 10 Core sheets 11, 12, 13 Core sheets 14, 15 on which antennas are arranged Over film 16 Card base material 17 Area to be embedded 18 I Module 100 DIF card

Claims (12)

A dual interface card having a contact communication function and a contactless communication function,
A card base material including one or a plurality of core sheets and having an area to be embedded for embedding an IC module;
An IC module embedded in the area to be embedded;
Has,
An antenna is disposed on one of the one or more core sheets, and the antenna is electrically connected to a terminal of the IC module;
A print in which a position relative to the antenna is specified on at least one surface of the core sheet on which the antenna is arranged, within a range that can be observed from the area to be embedded before the IC module is embedded. Having a pattern,
Dual interface card.   The dual interface card according to claim 1, wherein the antenna is a wound antenna.   3. The dual interface card according to claim 1, wherein a surface of the core sheet on which the antenna is disposed, on a side on which the antenna is disposed, faces a rear surface of the dual interface card. 4.   3. The dual interface card according to claim 1, wherein a surface of the core sheet on which the antenna is disposed, on a side on which the antenna is disposed, faces a front side of the dual interface card. 4.   The dual interface according to any one of claims 1 to 4, wherein the print pattern is present on a surface of the core sheet on which the antenna is arranged, the surface facing a back surface side of the dual interface card. card.   The dual interface according to any one of claims 1 to 4, wherein the print pattern is present on a surface of the core sheet on which the antenna is disposed, the surface facing the front side of the dual interface card. card.   The dual interface card according to any one of claims 1 to 4, wherein the printing pattern is present on both sides of the core sheet on which the antenna is arranged.   8. The dual interface card according to claim 1, wherein the core sheet on which the antenna is arranged is a transparent or translucent core sheet. 9.   The dual interface card according to any one of claims 1 to 8, wherein the printing pattern is a point or a group of points, a line, a cross, a circle, or a combination thereof. An inspection method for inspecting a position of an antenna in manufacturing the dual interface card according to any one of claims 1 to 9,
Before embedding the IC module in the embedding expected area, the method includes visually evaluating or observing the position of the print pattern with a camera.
Inspection methods.   The inspection method according to claim 10, wherein the evaluation includes comparing a position where the print pattern should exist and an observed position of the print pattern.   The method for manufacturing a dual interface card according to claim 1, comprising the inspection method according to claim 10.

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