JP2019216139A - Heat radiation device - Google Patents

Abstract

To provide a small heat radiation device having high cooling performance.SOLUTION: A heat radiation device 10 includes a heat radiation portion 11 that radiates the heat of a heating element, and a fan 13 provided on a surface of the heat radiation portion 11 opposite to a surface on which the heating element is located. The heat radiation portion 11 is formed by laminating a plurality of plate-shaped heat radiating plates 11a to 11f, and around each of the heat radiating plates 11a to 11f, a comb-shaped fin portion extending radially in an in-plane direction is formed.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a heat radiating device that radiates a heat generating element of an electronic device.

  BACKGROUND ART Conventionally, there is a heat radiating device that cools a CPU (Central Processing Unit) of a personal computer or the like (for example, see Patent Document 1). This heat dissipation device has a heat sink disposed on the CPU and a cooling fan disposed on the heat sink.

JP 2014-183284 A

  The heat dissipation device can improve the cooling performance by increasing the size of the heat sink or increasing the rotation speed of the fan.

  However, there is a problem that increasing the heat sink increases the size of the entire apparatus, and increasing the rotation speed of the fan increases noise.

  The non-limiting embodiment of the present disclosure contributes to providing a heat radiating device having a small size and high cooling performance.

  The heat dissipation device according to an aspect of the present disclosure includes: a heat dissipation unit that dissipates heat of a heating element; and a fan provided on a surface of the heat dissipation unit opposite to a surface on which the heating element is located. The portion is formed by laminating a plurality of plate-shaped heat radiating plates, and around each of the heat radiating plates, a comb-shaped fin portion extending radially in an in-plane direction is formed.

  Note that these comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a recording medium, and any of a system, an apparatus, a method, an integrated circuit, a computer program, and a recording medium. It may be realized by any combination.

  According to one aspect of the present disclosure, high cooling performance can be achieved with a small size.

  Further advantages and effects in one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some embodiments and features described in the description and drawings, respectively, but all need to be provided in order to obtain one or more identical features. There is no.

Perspective view showing an example of a heat dissipation device Side view showing an example of heat dissipation device AA arrow sectional view of the heat dissipation device of FIG. An exploded perspective view showing an example of a heat dissipation device Perspective view showing an example of heat sink Perspective view showing an example of heat sink The figure explaining an example of the manufacturing method of a thermal radiation apparatus The figure explaining an example of the manufacturing method of a thermal radiation apparatus The figure explaining an example of the manufacturing method of a thermal radiation apparatus The figure explaining an example of the manufacturing method of a thermal radiation apparatus Perspective view showing a part of the heat dissipation part Perspective view showing a part of the heat dissipation part

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed descriptions of already well-known matters and repeated descriptions for substantially the same configuration may be omitted. This is to avoid the following description from becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.

  The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

  Automobiles are equipped with various electronic devices. For example, automobiles include ECUs (Engine Control Units), HUDs (Head-Up Displays), ADASs (Advanced Driver-Assistance Systems), digital meter clusters, headlamp LED (Light Emitting Diode) drive circuits, or car navigation systems. Electronic equipment.

  These electronic devices have, for example, a heating element such as a CPU or an SOC (System-On-a-Chip). In order to suppress malfunction of the electronic device, it is important to radiate heat from the CPU or SOC by the heat radiating device.

  For example, electronic devices mounted on automobiles are required to be reduced in size depending on the installation location, and are also required to be quiet. For example, since the digital meter cluster is arranged in front of the driver, it is important to suppress the noise of the fan so that the driver cannot hear the sound of the fan of the heat dissipation device. That is, it is important that the heat dissipating device is small and can sufficiently dissipate the heat generating element without rotating the fan at a high speed.

  FIG. 1 is a perspective view showing an example of the heat radiating device 10. As shown in FIG. 1, the heat radiating device 10 includes a heat radiating part 11, a frame 12, and a fan 13. The radiator 11, the frame 12, and the fan 13 are integrated. Hereinafter, the x, y, and z axes of the three axes shown in FIG. Further, the + z-axis direction is defined as the upper side, and the -z-axis direction is defined as the lower side.

  The heat radiating portion 11 has, for example, a quadrangular prism shape. As will be described below, the heat radiating portion 11 is configured by laminating a plurality of plate-shaped heat radiating plates (for example, see the heat radiating portion 11 and the heat radiating plates 11a to 11f in FIG. 4).

  The heat dissipating part 11 is arranged on the upper surface of the heat generating element that generates heat (for example, see the heat dissipating part 11 and the heat generating element 21 in FIG. 2). The heat radiating part 11 radiates heat generated from the heat generator. The heat dissipating part 11 and the heating element may be in contact with each other, and, for example, grease or the like is applied between the heat dissipating part 11 and the heating element so that the heat of the heating element is smoothly transmitted to the heat dissipating part 11. May be. Hereinafter, “contact” may include a case where grease or the like is applied between objects.

  The frame 12 is provided on a surface of the heat radiating unit 11 opposite to the surface on which the heating element is located. The periphery of the frame 12 has the same shape as the periphery of the heat dissipating part 11, and has, for example, a quadrangular prism shape.

  The fan 13 is provided in the frame 12. The fan 13 is provided in the frame 12 such that the rotation axis is located at the center of the frame 12. The fan 13 is rotated by a motor.

  FIG. 2 is a side view illustrating an example of the heat dissipation device 10. In FIG. 2, the same components as those in FIG. In FIG. 2, a heating element 21 is shown.

  As shown in FIG. 2, the heat radiating device 10 is arranged such that the lower surface of the heat radiating unit 11 is located on the upper surface of the heating element 21. The heating element 21 is an electronic component that generates heat, such as a CPU or an SOC. The heat of the heating element 21 is absorbed by the heat radiating unit 11 and radiated. The frame 12 and the fan 13 accommodated in the frame 12 are provided on the surface of the heat dissipating part 11 opposite to the surface on which the heating element 21 is located.

  FIG. 3 is a cross-sectional view of the heat dissipation device 10 of FIG. In FIG. 3, the same components as those in FIG. The fan 13 is accommodated in the frame 12.

  The fan 13 has a motor 13a and a blade 13b. The motor 13a is, for example, a fluid bearing motor.

  The blade 13b is connected to a rotation shaft of the motor 13a. The blades 13 b are located above the heat radiating part 11. The blade 13b rotates as the rotation shaft of the motor 13a rotates. When the blade 13 b rotates, the air above the fan 13 is sent into the heat radiating unit 11. Thereby, the thermal radiation part 11 is cooled and a heat generating body is also cooled.

  FIG. 4 is an exploded perspective view showing an example of the heat dissipation device 10. In FIG. 4, the same components as those in FIG.

  As shown in FIG. 4, the frame 12 has a cover 12a. The cover 12a has, for example, a circular opening for taking in air that cools the heat dissipating unit 11 and the heating element. The diameter of the opening of the cover 12 a may be, for example, the same as the diameter of the fan 13 (including substantially the same, hereinafter the same) or larger than the diameter of the fan 13.

  The heat radiating section 11 has heat radiating plates 11a to 11f. The heat sinks 11a to 11f are stacked. For example, grease or the like may be applied between each of the heat sinks 11a to 11f to be stacked so that heat is smoothly transmitted.

  The heat radiating plates 11a to 11f are rectangular plate-shaped members. The material of the heat sinks 11a to 11f is a material having a high thermal conductivity, for example, aluminum or copper. For example, the heat sinks 11a to 11f may be formed by A1050 or C1020 of Japanese Industrial Standard.

  Further, the heat radiating plates 11a to 11f may be stacked not only by one material but also by combining different materials. For example, the materials applied to the heat sinks 11a to 11f may be alternated. Specifically, the radiator plate 11a may be aluminum, the radiator plate 11b may be copper, the radiator plate 11c may be aluminum, the radiator plate 11d may be copper, the radiator plate 11e may be aluminum, and the radiator plate 11f may be copper.

  FIG. 5 is a perspective view showing an example of the heat sink 11a. As shown in FIG. 5, the heat sink 11 a has a core plate portion 31, extension plate portions 32 a to 32 d, and a fin portion 33.

  The core plate part 31 is a flat area and has a square shape. The heating element is disposed on the core plate portion 31. In other words, the heating element is brought into contact with the core plate portion 31. The shape and size of the core plate portion 31 may be formed in accordance with, for example, the shape and size of the heating element.

  The extension plate portions 32a to 32d are flat regions, and extend outward (in a radial manner) from four corners of the square core plate portion 31.

  The fin portions 33 are formed around the core plate portion 31 and around the extension plate portions 32a to 32d. The fin portions 33 extend outward from the periphery of the core plate portion 31 and the periphery of the extension plate portions 32a to 32d in an in-plane direction (a direction perpendicular to the normal to the heat radiating plate 11a).

  The fin portion 33 may be formed by, for example, press working. Moreover, the fin part 33 may be formed by laser processing, for example. In the case of forming the fin portion 33 by laser processing, for example, a rectangular flat plate is prepared, and a groove is formed from one side of the prepared flat plate toward the side facing the one side by a laser. Form.

  For example, a groove is formed by laser from the side indicated by arrow A11 in FIG. 5 toward the side indicated by arrow A12. The length of the groove is the same in the vicinity of the center of the side, and is shortened as it approaches the end of the side. This is done on each side of the rectangular flat plate. Thereby, the heat radiating plate 11a having the core plate portion 31, the extension plate portions 32a to 32d, and the fin portions 33 as shown in FIG. 5 is formed.

  The core plate portion 31 receives the heat of the heating element. The received heat is transmitted to the extension plate portions 32a to 32d. The heat received by the core plate portion 31 and the heat transmitted to the extension plate portions 32a to 32d are radiated by the fin portions 33 radially extending from the core plate portion 31 and the extension plate portions 32a to 32d. The fin portion 33 is air-cooled by the fan 13.

  In FIG. 5, the radiator plate 11a has been described, but the radiator plate 11b also has the same shape and size as the radiator plate 11a.

  FIG. 6 is a perspective view showing an example of the heat sink 11f. In FIG. 6, the same components as those in FIG. The heat dissipating plate 11f is different from the heat dissipating plate 11a shown in FIG. 5 in that a circular opening 41 is provided in the central portion (including substantially the central portion, the same applies hereinafter).

  The opening 41 is formed at the center of the heat sink 11f. The extension plate portions 32a to 32d extend outward in all directions from a region around the opening portion 41.

  The opening 13 accommodates the fan 13 and a part of the frame 12. For example, as shown by an arrow A1 in FIG. 3, the fan 41 and a part of the frame 12 are accommodated in the opening 41.

  The fins 33 shown in FIG. 6 may be formed by, for example, press working like the fins 33 shown in FIG. Moreover, the fin part 33 may be formed by laser processing, for example. For example, when the fin portion 33 is formed by laser processing, a rectangular flat plate is prepared, and a groove is formed from one side of the prepared flat plate by a laser toward a side opposite to the one side, and the fin portion 33 is formed. Form.

  In FIG. 6, the radiator plate 11f has been described, but the radiator plates 11c to 11e also have the same shape and size as the radiator plate 11f. As described above, the openings of the heat radiating plates 11c to 11f are provided to accommodate a part of the frame 12 and the fan 13, whereby the height of the heat radiating device 10 can be suppressed.

  The heat sinks 11a to 11f are stacked. The heat radiating plate 11a in contact with the heating element has a core plate portion and an extended plate portion, and the heat radiating plate 11b disposed on the heat radiating plate 11a also has a core plate portion and an extended plate portion. The core plate portion and the extension plate portion of the heat radiating plate 11b are stacked so as to overlap the core plate portion and the extension plate portion of the heat radiating plate 11a in plan view (as viewed from the + z-axis direction).

  The heat radiating plates 11c to 11f disposed on the heat radiating plate 11b have openings and extension plate portions. The opening of the heat radiating plate 11c overlaps the core plate portion of the heat radiating plate 11b, and the extending plate portion of the heat radiating plate 11c is stacked so as to overlap the extending plate portion of the heat radiating plate 11b. Further, the heat radiating plates 11c to 11f are stacked such that the respective openings and the extension plate portions overlap. That is, the extension plate portions of the heat radiating plates 11c to 11f having the openings are formed at positions overlapping with the extension plate portions of the heat radiating plates 11a and 11b having the core plate portion in plan view.

  Thus, the heat received by the heat radiating plate 11a from the heating element is transmitted to the heat radiating plate 11b via the core plate portion and the extension plate portion. The heat transmitted to the radiator plate 11b is transmitted to each of the radiator plates 11c to 11f via the extension plate portion of the radiator plate 11b. The heat transmitted to the heat radiating plates 11a to 11f is radiated by the fins provided in each of the heat radiating plates 11a to 11f. Each of the fin portions of the heat radiating plates 11 a to 11 f is air-cooled by the fan 13.

  The radiating plates 11a to 11f are stacked so that the respective fin portions also overlap in plan view. Therefore, the heat received by the heat radiating plate 11a from the heating element is transmitted to each of the heat radiating plates 11b to 11f via the fin portion.

  7A to 7D are diagrams illustrating an example of a method for manufacturing the heat dissipation device 10. 7A to 7D, the same components as those in FIG. 4 are denoted by the same reference numerals.

  As shown in FIG. 7A, the cover 12a, the fan 13, the frame 12, and the heat radiating plates 11a to 11f of the heat radiating device 10 are separated. From the state shown in FIG. 7A, as shown in FIG. 7B, heat radiating plates 11a to 11f are laminated, and the laminated heat radiating plates 11a to 11f (heat radiating portions 11) are fixed to the frame 12.

  The center of the bottom of the frame 12 has a recess for accommodating the bottom of the fan 13 as shown by an arrow A21 in FIG. 7A. The center of the bottom of the frame 12 is accommodated in an opening (see, for example, the opening 41 in FIG. 6) provided in the heat sinks 11c to 11f (for example, see an arrow A1 in FIG. 3).

  The radiator 11 (radiator plates 11a to 11f) may be fixed to the frame 12 by, for example, screws. For example, the screw tip of the screw may be inserted into a screw hole provided in the frame 12 through a hole (not shown) provided in the heat radiating part 11, and the heat radiating part 11 may be fixed to the frame 12.

  Further, the heat sinks 11a to 11f may be fixed (integrated) by, for example, caulking. Then, the heat radiating plates 11a to 11f fixed by caulking may be fixed to the frame 12 with screws.

  For example, grease or the like may be applied between each of the stacked heat radiating plates 11a to 11f in order to improve heat conduction.

  When the radiator 11 and the frame 12 are integrated, the fan 13 is accommodated in the frame 12 and fixed as shown in FIG. 7C. The bottom portion of the fan 13 (the portion indicated by the arrow A22 in FIG. 7B) is accommodated in a recessed portion at the bottom center portion of the frame 12 (see, for example, the arrow A1 in FIG. 3). In other words, the bottom of the fan 13 is housed in the openings of the heat sinks 11c to 11f together with the center of the bottom of the frame 12.

  When the fan 13 is fixed to the frame 12, the cover 12a is fixed to the frame 12, as shown in FIG. 7D. For example, the cover 12a is fixed to the frame 12 with screws.

  FIGS. 8A and 8B are perspective views showing a part of the heat radiating portion 11. 8A and 8B, the same components as those in FIGS. 4 to 6 are denoted by the same reference numerals.

  As described above, the extension plate portions and the fin portions of the heat sinks 11a to 11f are formed in the same shape and at the same positions. Therefore, when the heat radiating plates 11a to 11f are stacked, as shown in FIGS. 8A and 8B, the extending plate portions and the fin portions of the heat radiating plates 11a to 11f are aligned at the same position vertically.

  The positions of the fin portions of the heat radiating plates 11a to 11f were changed, and the heat radiation amount of the heat radiating device 10 was examined. For example, the heat radiation amount of the heat radiating device 10 was examined by slightly shifting the fin portions adjacent to each other vertically. As a result, when the positions of the fin portions of the heat radiating plates 11a to 11f were aligned at the same position in the upper and lower directions (that is, the state shown in FIGS. 8A and 8B), a good heat radiation amount was obtained.

  An arrow A31 in FIG. 8B indicates the width of the fin portion 33. The arrow A32 in FIG. 8B indicates the pitch of the fin portion. The ratio between the width of the fin portion 33 and the pitch of the fin portion 33 is “1: 1”.

  The ratio of the width of the fins 33 to the pitch of the fins 33 was changed, and the amount of heat radiated by the heat radiator 10 was examined. As a result, when the ratio between the width of the fin portion 33 and the pitch of the fin portion 33 was “1: 1”, a good heat dissipation amount was obtained.

  Assuming that the heat radiating device 10 is applied to, for example, an electronic device mounted on an automobile, the size of the outer shape of the heat radiating plate (length × width) is set to “45 mm × 45 mm”. Further, the thickness (thickness of the heat radiating part) when the heat radiating plates are laminated is set to “3 mm”. Further, the ratio between the width of the fin portion and the pitch of the fin portion is “1: 1”. The rotation speed of the fan is set to “3000 to 4000 r / min”.

  Under these conditions, the number of heat sinks, the thickness, and the width of the fin portion were changed, and the thermal resistance of the heat sink 10 was measured. When the number of heat sinks was “6”, the thickness was “0.5 mm”, and the width of the fin portion was “1.0 mm”, a thermal resistance of “2.6 K / W” was obtained.

  The number of heat sinks to be stacked may be “2 to 16”. The thickness of the heat sink may be “2.0 mm or less”. The width of the fin portion may be “0.5 mm to 2.5 mm”. The rotation speed of the fan may be “1500 r / min to 8000 r / min” or “1500 r / min or more”. Even in this case, the target thermal resistance of “2.7 K / W” or less was obtained.

  As described above, the heat radiating device 10 includes the heat radiating portion 11 that radiates the heat of the heating element 21 and the fan 13 provided on the surface of the heat radiating portion 11 opposite to the surface on which the heating element 21 is located. The heat radiating portion 11 is formed by laminating a plurality of plate-shaped heat radiating plates 11a to 11f, and around each of the heat radiating plates 11a to 11f, there is formed a comb-shaped fin portion 33 extending radially in an in-plane direction. Have been. Thereby, the thermal radiation apparatus 10 is small and can implement | achieve high cooling performance. Moreover, the heat radiating device 10 does not need to increase the rotational speed of the fan 13 due to the high cooling capacity of the heat radiating unit 11, and can suppress noise.

  Further, of the heat radiating plates 11a to 11f, the heat radiating plates 11a and 11b have a core plate portion 31 that receives the heat of the heating element 21 and extension plate portions 32a to 32d that radially extend from the core plate portion 31. The fins 33 of the heat sinks 11a and 11b extend radially from the core plate 31 and the extension plates 32a to 32d. Thereby, the thermal radiation apparatus 10 is small and can implement | achieve high cooling performance. Moreover, the heat radiating device 10 does not need to increase the rotational speed of the fan 13 due to the high cooling capacity of the heat radiating unit 11, and can suppress noise.

  In the radiator plates 11c to 11f of the radiator plates 11a to 11f, an opening 41 for accommodating the fan 13 is formed at the center portion, and the extension plate portions 32a to 32f extending radially from a region around the opening 41. The fins 33 of the heat radiating plates 11c to 11f radially extend from the region around the opening 41 and the extension plate portions 32a to 32d. Thereby, the thermal radiation apparatus 10 is small and can implement | achieve high cooling performance. Moreover, the heat radiating device 10 does not need to increase the rotational speed of the fan 13 due to the high cooling capacity of the heat radiating unit 11, and can suppress noise.

  The extension plate portions 32a to 32d of the heat radiation plates 11c to 11f are formed at positions overlapping the extension plate portions 32a to 32d of the heat radiation plates 11a and 11b in plan view. Thereby, the thermal radiation apparatus 10 is small and can implement | achieve high cooling performance. Moreover, the heat radiating device 10 does not need to increase the rotational speed of the fan 13 due to the high cooling capacity of the heat radiating unit 11, and can suppress noise.

  The width of the fins 33 and the pitch of the fins 33 are substantially the same. Thereby, the thermal radiation apparatus 10 is small and can implement | achieve high cooling performance. Moreover, the heat radiating device 10 does not need to increase the rotational speed of the fan 13 due to the high cooling capacity of the heat radiating unit 11, and can suppress noise.

  The pitch of the fins 33 is smaller than the thickness of the heat radiating portion 11 (thickness of the stacked heat radiating plates 11a to 11f). Thereby, the thermal radiation apparatus 10 is small and can implement | achieve high cooling performance. Moreover, the heat radiating device 10 does not need to increase the rotational speed of the fan 13 due to the high cooling capacity of the heat radiating unit 11, and can suppress noise. Further, by stacking the heat radiating plates 11a to 11f, the pitch of the fin portions 33 can be easily made smaller than the thickness of the heat radiating portion 11.

  In the above description, the heat radiating plates 11a and 11b have the core plate portion, and the heat radiating plates 11c to 11f have the openings, but the present invention is not limited to this. For example, if the fan 13 does not have a portion protruding to the bottom (for example, a portion indicated by an arrow A22 in FIG. 7B), the heat radiating plates 11c to 11f have no opening and have a core plate. You may.

  In addition, the fan 13 takes in the upper air and sends it to the heat radiating unit 11, but is not limited thereto. For example, the fan 13 may take in air on the side of the heating element 21 and send it out above the frame 12.

  Further, the shape of the heat radiating portion 11 (heat radiating plates 11a to 11f) and the surroundings of the frame 12 are not limited to the shapes illustrated. For example, it may be circular or polygonal. Further, the shape of the openings formed in the heat sinks 11c to 11f is not limited to the illustrated shape. For example, a polygonal shape or the like may be used. Further, the shape of the opening of the cover 12a is not limited to the illustrated shape. For example, a polygonal shape or the like may be used.

  The present disclosure is useful, for example, as a heat radiating device for a heating element such as a CPU or an SOC of an electronic device mounted on an automobile.

REFERENCE SIGNS LIST 10 radiator 11 radiator 11 a to 11 f radiator plate 12 frame 12 a cover 13 fan 13 a motor 13 b blade 21 heating element 31 core plate part 32 a to 32 d extension plate part 33 fin part 41 opening

Claims (6)

A heat dissipating part that dissipates the heat of the heating element;
A fan provided on a surface opposite to the surface on which the heating element of the heat radiating portion is located;
With
The heat radiating portion is formed by stacking a plurality of plate-shaped heat radiating plates,
Comb-shaped fin portions extending radially in the in-plane direction are formed around each of the heat dissipation plates,
Heat dissipation device. The first heat sink of the heat sink is:
A heat receiving region for receiving the heat of the heating element,
A first extension region extending radially from the heat receiving region;
Have
The fin portion of the first heat sink extends radially from the heat receiving region and the first extension region.
The heat dissipation device according to claim 1. The second heat dissipating plate of the heat dissipating plate has an opening for accommodating the fan at the center, and has a second extending region extending radially from the region around the opening,
The fin portion of the second heat sink extends radially from a region around the opening and the second extension region.
The heat radiating device according to claim 2. The second extension region is formed at a position overlapping the first extension region in plan view,
The heat dissipation device according to claim 3. The width of the fin portion and the pitch of the fin portion are substantially the same.
The heat dissipation device according to claim 1. The pitch of the fin portion is smaller than the thickness of the heat dissipation portion,
The heat dissipation device according to claim 1.

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