JP2019203763A - Magnetic wire alignment apparatus and magnetic wire alignment method - Google Patents

Abstract

To provide a magnetic wire alignment apparatus that applies uniform internal stress to a magnetic wire, and an alignment method of the magnetic wire.SOLUTION: Magnetic characteristics of a GSR sensor, such as hysteresis characteristic, noise, and linearity (sine wave function output characteristics) can be improved by drawing a magnetic wire with tensile force of 50 kg/mm-100 kg/mm, fixing both ends of the magnetic wire by adhesive applied on a tapered part of a substrate holder for holding and fixing a substrate having a groove formed thereon and further temporarily fixing the magnetic wire in a groove, then cutting the magnetic wire to apply uniform internal stress to the magnetic wire in the groove, keeping the state, and performing following regular fixture using adhesive resist. Downsizing of a GSR element is achieved by using a tightly stretched magnetic wire as baseline to align the magnetic wire with precision of ±1 μm and achieve alignment of the wire into a small groove and a gap between the wires in 100 μm or less.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a magnetic wire alignment apparatus and a wire alignment method that can apply a uniform stress to a magnetic wire that detects a magnetic field in order to improve the magnetic characteristics of a GSR sensor element.

  The MI sensor and GSR sensor, which are ultra-sensitive micro magnetic sensors, use a minute magnetic wire with a diameter of several tens of μm or less as a magnetic sensitive body, and are widely used for electronic compass, medical sensor, security sensor and the like. MI and GSR elements, which are magnetic field detection elements, have an amorphous magnetic wire arranged in the longitudinal direction of the element, and a detection coil that circulates the element, coil ends, and four electrodes at both ends of the wire are integrally assembled on a substrate. I found it. Development of devices for aligning magnetic wires with substrates has been undertaken for device manufacturing.

First, when the internal stress of the magnetic wire is increased in the fabrication of the MI element, the magnetic characteristics are lowered, so that the magnetic wires are aligned without applying tension as much as possible (Patent Documents 1 and 2). It has been difficult to align wires with a problem of productivity (Patent Document 1) and a fine coil interval (Patent Document 2).
Further, when aligning magnetic wires on a substrate having no groove or a substrate having a shallow groove, it has been difficult to make the magnetic wire out of the groove and miniaturization of the coil pitch (Patent Document 3).

In the MI elements disclosed in these patent documents, the magnetic wire is first subjected to a tensile heat treatment (temperature of 500 to 600 degrees) to greatly improve the magnetic characteristics without applying tension so as not to impair the magnetic characteristics. Or by removing the curl and applying a tension (about 10 kg / mm ² ) so that it can be straightened, temporarily fixed to the substrate with the force of a magnet, cutting the magnetic wire, and then fixing it with an adhesive. The The magnetic properties of the magnetic wire after the tensile heat treatment have high permeability and improve the sensitivity of the MI sensor, but have the drawback of having hysteresis and non-linearity. For this reason, the MI sensor has a problem in that 1) the hysteresis is large when the rising pulse detection is used. The current situation is that falling pulse detection is used to increase the power consumption of the sensor. 2) Due to the non-linearity, the linear area is narrow and the measurement range is small. 3) Further improvement is required for asymmetry of about 2%.

  Thereafter, a GSR sensor was developed that has a much higher sensitivity than the MI sensor and solves the drawbacks such as hysteresis, nonlinearity, and measurement range of the MI sensor (Patent Document 4). As a structure of the GSR element, an element with a microcoil in which the distance between the coil and the magnetic wire is set to about 2 μm and the coil pitch is reduced to about 5 μm is disclosed (Patent Document 5). An apparatus for aligning magnetic wires in grooves is disclosed (Patent Document 6).

Furthermore, in the development process of the GSR sensor, it was found that 1) GSR characteristics were improved and noise was reduced when a strong uniform stress was left on the magnetic wire. 2) Although the sensitivity can be further improved by arranging the wires in a strip shape, it is necessary to make the wire interval 100 μm or less. 3) If a wire can be aligned in a shallow groove, in order to directly form a GSR element on the ASIC surface, a shallow and small groove is formed on the coating on the ASIC surface, and the wire is placed there. It has been found that the play between the wire and the groove needs to be controlled at ± 2 μm. Based on the above knowledge, in order to further improve the performance of the GSR sensor, development of a new wire alignment apparatus has been required.

  In the conventional magnetic wire temporary fixing method, after applying tension and cutting, the magnetic wire is temporarily fixed in the groove of the substrate by the force of the magnet, so that a large uniform stress remains on the magnetic wire. I can't. Further, the residual stress could not be stably maintained. For this purpose, it is necessary to establish a new manufacturing technology concept relating to tension loading, cutting, temporary fixing and permanent fixing in order to apply a uniform and large internal stress to the magnetic wire. Further, the GSR element manufactured by the method disclosed in Patent Document 4 has good hysteresis characteristics and can be measured by rising pulse detection. However, the method and conditions for stabilizing the characteristics are not clearly described, and the rising pulse detection cannot be used stably at present.

As for the wire interval, Patent Document 6 certainly discloses a magnetic wire alignment method to micro grooves by a magnet method, and describes that the interval between the magnetic wires can be 30 to 100 μm.
However, when a deep guide groove is used, it can withstand the repulsive force between magnetized magnetic wires, but it is difficult to form the lower coil of the MI element and GSR element along the shallow groove surface, and stable production is achieved. In that sense, the magnetic method has a limit of 100 μm between the magnetic wires.
Further, the repulsive force between the magnetic wires increases in proportion to the square of the distance between the magnetic wires when the interval between the magnetic wires is narrowed. Therefore, it is difficult to align the magnetic wires at a narrow interval of 100 μm or less.
Therefore, in place of the magnet system, development of an apparatus capable of aligning magnetic wires at a narrow interval is required.

The above patent documents are summarized below.

JP 2000-81471 A Republished patent WO2003 / 017299 International Publication No. WO2012-043160A1 Japanese Patent No. 5839527 Patent No. 5747294 Patent No. 5839530

The present invention firstly realizes an alignment apparatus and an alignment method capable of applying a uniform internal stress to a magnetic wire in order to improve the magnetic characteristics of a GSR sensor element.
Secondly, an alignment apparatus that can align the magnetic wires in a narrow groove having a play width of the magnetic wire and the groove of ± 2 μm or less and can align the gap between the magnetic wires to 100 μm or less is realized. .

The present inventor has conducted research on the magnetic wire from 50 kg / mm ² to 100 kg / mm ² since 2013, but the wire cannot be stably held along the groove only by temporarily fixing the magnet. I noticed. When it was temporarily fixed using an adhesive, it was discovered that uniform internal stress remained and the magnetic characteristics of the GSR sensor were greatly improved. Based on this discovery, we came up with the idea of applying a uniform internal stress inside the magnetic wire by maintaining the tension of the strongly tensioned magnetic wire by changing from the magnet method to the adhesive method.
In the adhesive method, first, taper portions are attached to both sides of the substrate holder, and an adhesive is applied to the taper portions. When aligning the magnetic wires, the substrate is raised above the wire drawing height position, and the magnetic wire is strongly pressed against the taper portion of the substrate holder to which the adhesive is applied. It is to fix firmly. Further, it has been found that an adhesive resist is applied in the groove of the substrate, and the magnetic wire is temporarily fixed in the groove with the adhesive force, thereby further firmly fixing.
The effect of uniform internal stress is that the thickness of the surface domain consisting of electron spins in the circumferential direction is increased by the force, and the 90-degree domain wall is pushed into the wire, thereby causing high-speed rotation of the electron spin by the GHz pulse current. This is considered to be because only the phenomenon, that is, the movement of the 90 ° C. domain wall is suppressed and can be detected by the coil.

A specific method based on the above idea will be described in detail.
First, in order to impart a uniform internal stress strongly magnetic ^wire, pull the magnetic wire from the bobbin in a large tension of ^{50kg / mm 2 ~100kg / mm 2} , the drawer chuck after the drawer, the two cutting chuck And grip and fix the magnetic wire with the fixed chuck. This uniform and large internal stress removes the residual stress and bending stress that originally remained inside the magnetic wire base material. Next, the substrate is raised and both ends of the magnetic wire on both sides of the substrate are pressed against the taper portion of the substrate holder, and both ends of the magnetic wire are bonded and fixed to the substrate holder with an adhesive at the taper portion, and the magnetic wire is grooved on the substrate. Place and align to. Due to the structure of the taper portion of the substrate holder and the adhesive force of the adhesive, both ends of the magnetic wire are fixed to the substrate holder while maintaining a large tension, and as a result, the magnetic wire has a thickness of 30 kg / mm ^{2 to} 100 kg / mm ² . Uniform large internal stress can be maintained. It is possible to adjust the magnitude of the remaining internal stress by adjusting the adhesive strength of the adhesive.
Furthermore, when the magnetic wire is aligned in the groove of the substrate coated with the adhesive resist, the magnetic wire can be more strongly bonded and fixed, and the retention of the internal stress of the magnetic wire can be improved.

Next, the magnetic wire is held and fixed by two cutting chucks between the fixed chuck on the wire supply side and the substrate, and the magnetic wire is cut between the cutting chucks. The impact force when cutting a magnetic wire having a large internal stress can be absorbed by the gripping force of two cutting chucks. After cutting the magnetic wire, the cutting chuck and the drawing chuck on the substrate side holding and fixing the magnetic wire are opened. At this time, the uniform internal stress of the magnetic wire is held by the adhesive force of the adhesive.
Thereafter, in the next step, an adhesive resist is applied over the entire surface and the magnetic wire is permanently fixed to the substrate, and then removed from the substrate holder using a predetermined jig.

When pulling out the magnetic wire with a large tension of ^{50kg / mm 2 ~100kg / mm 2} , the problem of breakage easily occurs by sliding friction and chuck the bobbin and the feed reel and the magnetic wire. These problems are that a tension measuring device when pulling the magnetic wire and a feedback system that keeps the tension constant are attached, and the magnetic wire is firmly held and fixed by a plurality of chucks to perform a series of operations of the magnetic wire aligning device. It was also found that the problem can be solved by increasing the frictional force by making the chuck gripping surface uneven.

Also, the trouble magnetic wire magnetic wire off the temporary fixing of the magnetic wire impact force during cutting to cut the wire while applying a large tension of 50kg ^/ mm ² ~100kg / mm 2 pops out from the groove of the substrate Occur. As a countermeasure, at the time of cutting, both ends of the cutting portion of the magnetic wire are held with a cutting chuck to cut the magnetic wire. It was found that by opening the two cutting chucks holding both sides of the magnetic wire after cutting, the impact force at the time of cutting can be absorbed and no trouble occurs. A magnetic wire cutting machine uses a mechanical cutting machine.

Secondly, in order to align the magnetic wires into small grooves with a play width of ± 2 μm or less with respect to the substrate grooves, and to align the gaps between the magnetic wires to 100 μm or less, focus on the magnetic wires that are strongly stretched with peen. Adjust the positional deviation and parallelism deviation with the center line of the groove using the microscope with the center line of the magnetic wire as the reference line, and the deviation amount between the magnetic wire and the center line of the groove of the substrate is less than ± 1μm It is an object of the present invention to realize an aligning device having the ability to align with high accuracy. It has been found that this can be realized by adopting an adhesive method instead of a temporary fixing method using a magnet that generates a repulsive force between magnetic wires.

,
The present invention is a magnetic wire drawer in the magnitude of the tension of ^{50kg / mm 2 ~100kg / mm 2} , the adhesive-magnetic wire with the adhesive of the tapered portion of the substrate holder for gripping fixing the substrate as well as arranged in a groove of the substrate by fixing, by applying a uniform internal stresses simultaneous 30kg ^/ mm ² ~100kg ^/ mm 2 removal of residual stress remaining in the magnetic wire matrix, the GSR sensor hysteresis, noise, and linear Magnetic properties such as characteristics (sinusoidal function output characteristics) are improved.

In addition, the present invention uses a magnetic wire that is taut as a reference line, and observes the positional relationship between the reference line and the base line of a minute groove having a width substantially equal to the diameter of the magnetic wire on the substrate with a microscope. It is possible to obtain a magnetic wire alignment with high accuracy by performing alignment and adjusting the positional deviation with a substrate fixing base capable of precise control, and it is possible to realize a micro-sized GSR sensor element. .
In addition, a large number of magnetic wires can be arranged in a single GSR sensor element at a minute interval of 40 μm or less, which has the effect of increasing the sensitivity of the GSR sensor and extending the measurement range.

It is a conceptual diagram which shows the structure of a magnetic wire alignment apparatus, and is a figure of the preparation stage for drawing out a magnetic wire. It is a conceptual diagram which shows the structure of a magnetic wire aligning apparatus, and is a figure which fixed the fixed tension with four chuck | zippers, and a magnetic wire. FIG. 5 is a diagram in which a magnetic wire is pressed and bonded to a taper portion of a substrate holder to which an adhesive is applied, and is disposed in a groove. It is the conceptual diagram of the aggregate | assembly of the GSR element produced on one board | substrate, and its unit element.

The best mode for carrying out the present invention will be described with reference to FIGS.
The magnetic wire aligning device 1 of the present invention includes a wire supply device unit 10, a wire aligning device unit 20, a positioning device unit 30, a cutting device unit 40, and a control device unit 50.

The wire supply unit 10 includes a wire bobbin 11a and a pull-out chuck 15 that pulls out the magnetic wire 60 wound around the wire bobbin 11a at a constant tension and a constant speed, a fixed chuck 14 that fixes the magnetic wire 60 after the magnetic wire 60 is pulled out, and wire feed-out It consists of a speed control device 12 and a wire tension control device 13 (including 13a and 13b). FIG. 1 shows a mode in which a magnetic wire is conveyed using four wire reels 16.

Moreover, when the wire supply unit 10 holds the magnetic wire with the pull-out chuck and pulls it out at a constant speed, an unexpected load is applied due to the frictional force of the bobbin, reel, or the like. Therefore, a wire feed speed control device 12 comprising a wire feed motor capable of adjusting the feed speed, a plurality of wire reels 16, a wire tension load device 13a, a wire tension measuring device 13b, and a deviation between the load tension and a predetermined tension are calculated. by consist wire tension control device 13 that has the function of adjusting to match the speed pull the feed speed of the feed motor to maintain the wire at a predetermined ^tension, of 50kg / mm ² ~100kg / mm 2 size The disconnection when pulling out with the tension is prevented.

In the wire supply unit 10, the magnetic wire base material is sent out from the wire bobbin 11 around which the base material of the magnetic wire 60 is wound by the wire feed speed control type motor 12 a constituting the wire feed speed control device 12. Residual stresses such as internal stress during manufacturing and winding stress due to the wire bobbin 11 remain in the magnetic wire base material.

A constant tension controlled by the wire tension control device 13 while being measured by the wire tension measuring device 13b is applied to the magnetic wire 60 by the wire tension loading device 13a.
The wire tension load device 13a can apply a constant wire tension by adjusting the load to a range of 1 to 20 g. If the diameter of the magnetic wire and 10 [mu] m, it is appropriate to adjust the tension in the range of ^{50kg / mm 2 ~100kg / mm 2} . Residual stresses such as internal stress and winding stress can be removed by setting it to 50 kg / mm ² or more, and breakage of the magnetic wire can be prevented by setting it to 100 kg / mm ² or less. Moreover, the function as a reference line of a magnetic wire is achieved by this tension load.
The wire reel 16 has a diameter of 20 mm and a V-shaped groove so that the magnetic wire 60 does not fall off the wire reel 16.
In order to maintain a constant tension, the gripping surface of each chuck is made uneven to increase the frictional force and increase the gripping force.

The wire aligning unit 20 includes a substrate fixing base 23 including a substrate 21 having a groove for aligning magnetic wires and a substrate holder 22 for fixing the substrate.
The substrate holder 22 has taper portions on both sides of the substrate holder 22 with respect to the drawing direction of the magnetic wire 60, and an adhesive for adhering and fixing the magnetic wire 60 is applied to the taper portion. By providing the taper portion, both the magnetic wire and the adhesive can be bonded over the entire surface.
Further, an adhesive resist is applied to the grooves of the substrate 21 in advance, and the magnetic wire 60 is adsorbed by the adhesive resist to be fixed more strongly.
By being thus strongly fixed, it is possible to tension imparted to the initial 50kg / mm ² ~100kg / mm ² is maintained as an internal stress of 30kg / mm ² ~100kg / mm ² even after opening of the fixed chuck .

  The positioning device unit 30 includes a microscope 31 that detects a misalignment state between the reference line and the base axis in order to align the magnetic wire 60 with the center line of the groove of the substrate 21 using the center line of the magnetic wire 60 as a reference line. The apparatus includes a substrate fixing table feeding device 32 and a positioning correction arithmetic unit (not shown) that adjust the positional deviation by raising / lowering 321 of the substrate fixing table 23, a lateral feed 322, and a rotation 323.

Since the microscope 31 needs to observe both the magnetic wire 60 and the groove of the substrate 21, a microscope having a resolution of 1 μm or less is used. Since both are in a three-dimensional positional relationship, the focus adjustment of the microscope 31 is delicate, and a microscope that can be easily adjusted with a knob at hand is used. This facilitates adjustment work such as initial adjustment. Two microscopes 31 may be installed or moved for use. Since the countermeasure against vibration is important, the microscope stand is strongly attached to the main body of the magnetic wire aligning apparatus 1 as a countermeasure against vibration.
In addition, if it is a detection apparatus which has said function, it will not be limited to a microscope.

  The substrate fixing table feeding device 32 is mounted with a substrate fixing table 22 for fixing the substrate 21 on which the magnetic wires 60 are aligned, and is laterally fed to the magnetic wires 60 with a precision of ± 1 μm (322). Can be moved up and down (321) at a feed pitch of 1 μm. By lateral feed 322 in the left-right direction, the magnetic wire 60 is used as a reference line, the substrate-side groove is used as a base line, and both parallel shift and lateral shift are detected with an accuracy of ± 1 μm, and the diameter is 5 μm. To 15 μm magnetic wire 60 can be placed in a groove having a width of 9 μm to 19 μm.

The vertical movement 321 keeps the vertical distance between the magnetic wire 60 and the substrate 23 as close as possible to about 1 μm or less in contact or non-contact, and enables observation with the microscope 31 having a resolution of 1 μm. The substrate fixing base 23 is raised so that the magnetic wire 60 can be pressed against the tapered portion 221 after adjustment in the left-right direction, and the magnetic wire 60 is pressed against the tapered portion 221 of the substrate holder 22 and embedded in the groove.
Next, the rotation 323 is adjusted at a rotation pitch of 0.01 ° so that the wire reference line and the groove serving as the base axis are parallel to each other.

The lateral feed 322 in the left-right direction has three different pitches, that is, a pitch between elements, a pitch between wires in the element, and a pitch between wires in the coil for arranging a plurality of magnetic wires 60 in the element. Allows control by feed.
In addition, the element spacing pitch is greatly moved from 200 μm to 400 μm, the wire spacing pitch is as small as 50 μm to 100 μm, and the distance between the wires in the coil enables a fine movement of less than 40 μm to minimize the wire diameter. To do. In addition, since it is necessary to align the wires on the entire substrate, it is necessary to employ a substrate fixing table feeding device 23 that moves the moving distance of about 60 mm to 200 mm with a feeding pitch of ± 1 μm as the size of the substrate. The positional accuracy ± 1 μm between the magnetic wire 60 and the groove is realized by a control system using the magnetic wire as a reference line. However, in the case of using a large number of wires, the feed movement distance in the left-right direction of the substrate fixing base may be a distance divided by the number of wires.

  The control capability of the substrate fixing table feeder 32 is based on the magnetic wire diameter to be used, the groove width is about 1.2 to 3 times the magnetic wire diameter, and the groove depth is 0.5. The feed pitch of the substrate fixing table feeder is 0.1 μm, with the minimum movement amount being from double to 1.2 times. The present invention does not limit this numerical relationship, but it is desirable that the numerical range be within the above range in order to realize micro-sizing of the GSR element.

The magnetic wire 60 is aligned with the groove of the substrate 21 by pulling the magnetic wire 60 to a predetermined position (FIG. 2) with the pull-out chuck 15 and then fixing with the fixed chuck 15 and stretching it straight with a large tension. With the center line of the magnetic wire 60 as a reference line, the positional relationship between the reference line of the magnetic wire 60 and the center line of the groove of the substrate 21 on both sides of the substrate 21 is accurate to ± 1 μm or less with the microscope 31. Observe and calculate the amount of correction of lateral deviation and the amount of correction of rotation angle so that the magnetic wire 60 has a parallel positional relationship with an accuracy of ± 1 μm or less with respect to the center line of the groove, and the substrate fixing table 22 is corrected. And is performed with an accuracy of ± 1 μm.
Further, the substrate fixing table 23 is rotated at a rotation pitch of 0.01 ° by the rotation deviation angle by the rotation 323.

Thereafter, the substrate fixing base 23 is moved upward and downward 321 until the magnetic wire 60 is pressed against the taper portion 221 of the substrate holder 22 and temporarily fixed. An adhesive is applied to the tapered portion 221 of the substrate holder 22 of the substrate fixing base 23. For firm fixation, the substrate surface is raised higher than the position of the wire drawing height, and the magnetic wire 60 is strongly pressed against the adhesive applied to the taper portion 221 of the substrate holder 22 for adsorption. This is observed with the microscope 31 and recorded in the control unit 40 as an initial set value.

The cutting device section 40 includes two cutting chucks 41 (4a and 41b) that fix both sides of the cutting position when cutting the magnetic wire 60, and a cutting machine that cuts the magnetic wire 60 after being fixed by the cutting chuck 41. 42.
The two cutting chucks 41 absorb the impact force at the time of cutting the magnetic wire 60 having a large internal stress, and the magnetic wire 60 can be prevented from jumping out from the temporarily fixed groove.
After the magnetic wire 60 is cut, the substrate-side cutting chuck 41b and the pulling chuck 15 holding and fixing the magnetic wire 60 are opened, and the magnetic wire 60 is in a free state in which uniform internal stress is applied. Become. The magnetic wire 60 is bonded and fixed to the tapered portion 28 of the substrate holder 221 to which an adhesive is applied, and is temporarily fixed to the substrate 21 so as not to protrude from the groove of the substrate.
Further, when the adhesive resist is applied to the groove of the substrate 21, the magnetic wire 60 is fixed with a stronger force by the adsorption force of the adhesive resist in addition to the adhesive force at the taper portion 221. As a result, a more stable and uniform internal stress is applied, and the magnetic wire 60 can be reliably prevented from jumping out of the groove during cutting.

  The control unit 50 inputs the wire characteristics such as the wire diameter and the glass thickness, automatically adjusts the tension of the magnetic wire 60, adjusts each chuck pressure (14, 15, 41), and the wire cutting force. Function for adjusting, origin adjustment and origin return of substrate fixing base 23, automatic return function to work reference position, function for adjusting substrate fixing base 23 left and right based on observation result of deviation amount by microscope 31, substrate 21 It has a function for automatically adjusting the height of the substrate fixing base 23 and managing the production status based on work data such as thickness, groove depth, and wire diameter. Furthermore, it is possible to switch to manual operation in case of emergency.

  The control unit 50 is preferably configured of a program for controlling the combination of pitch feed consisting of the combination of the pitch between the elements and the pitch between the elements and the pitch between the wires in the coil.

  Through the above operation, a plurality of magnetic wires can be arranged in one element with a gap of 1 to 40 μm, and two magnetic wires in one element coil can be arranged with a gap of 1 to 10 μm. They can also be arranged.

  In the continuous operation, these control numerical values are stored in the control numerical value unit 40, preliminarily moved according to the numerical values, and at the position, the magnetic wire 60 is used as a reference line by the microscope 31, and the magnetic wire 60 and the groove are aligned. Correction is performed by a feedback system method for confirming and correcting the positional deviation, and this is continuously repeated.

  In the case of mass production, a large number of wire supply devices 10 are arranged in parallel so that a large number of magnetic wires 60 can be supplied at a time. In this case, as the cutting machine 42 for the magnetic wire 60, a press cutting machine may be used in addition to a mechanical cutting machine composed of a large number of scissors. The important point is that a large impact force is generated when cutting a taut magnetic wire. In order to absorb the impact force, both sides of the cutting position are held by the cutting chuck.

A method for aligning the magnetic wires 60 on the substrate 21 using the magnetic wire aligning apparatus 1 will be described below.
(1) The wire bobbin 11 around which the magnetic wire 60 is wound is attached to the wire supply unit 10, and the magnetic wire 60 is moved to the wire drawing start position (referred to as the position of the drawing chuck 15 in FIG. 1) by the pulling wire feeding motor 12a. And is fixed by the fixing chuck 14 (FIG. 1).

(2) The end of the magnetic wire 60 fed to the drawing start position is firmly held and fixed by the drawing chuck 15 while the fixed chuck is released. The drawer fixed with wire feeding constant tension of 50kg ^/ mm ² ~100kg ^/ mm 2 with a constant speed and the wire tension controller by a motor 12a wire feed speed controller, from the drawer starting position using the pull-out chuck 14 The magnetic wire 60 is pulled out to a position (referred to as the position of the drawer chuck 15 in FIG. 2), and the fixed chuck 14 and two cutting chucks (41a and 41b) in a state where a certain tension is applied to the magnetic wire 60. Then, it is gripped by the drawer chuck 15 and fixed to the drawer (FIG. 2).
Thus, in a state in magnetic wire 60 tension 50kg ^/ mm ² ~100kg ^/ mm 2 is added between the drawer fixing chuck 15 from the fixed chuck 14, magnetic wire 60 stretched strongly strongly straight peen It has become.

(3) The substrate 21 having a groove for aligning the magnetic wires 60 is held and fixed to the substrate holder 22 having the taper portion 221 to which the adhesive is applied, and is used as the substrate fixing table 23 as the substrate fixing table feeding device 32. Has been placed in advance. The height of the upper surface of the substrate when placed is set as the operation origin height of the substrate fixing table feeder 32.
The substrate fixing table 23 is raised from the operation origin height to the height below the magnetic wire 60 by the substrate fixing table feeding device 32. This is because when the magnetic wire 60 is aligned with the groove of the substrate 21, the magnetic wire 60 and the substrate 21 are closest to each other in order to move the substrate 21 for observing and matching the positional relationship between them. To raise to height.

(4) The positional relationship between the center line of the magnetic wire 60 drawn out and fixed and pierced with a strong tension with respect to the base line which is the center line of the groove of the substrate 21 is measured by the microscope 31 with the reference line as the reference line. And the error amount is corrected by the lateral feed 322 and the rotation 323 so that the center line of the magnetic wire 60 as the reference line coincides with the center line of the groove as the base line.

(5) The substrate fixing base 23 is raised again to align the magnetic wire 60 along the groove on the substrate 21, and both ends of the magnetic wire 60 are formed on the tapered portion 221 to which the adhesive of the substrate holder 22 is applied. The both ends of the magnetic wire 60 are fixed to the substrate holder 22 by being pushed over the entire surface until they are bonded (FIG. 3).
The magnetic wire 60 is attached to the substrate holder 22 by both the frictional resistance with the magnetic wire 60 at the boundary portion (tapered structure) between the flat portion of the substrate holder 22 and the tapered portion of the tapered portion 221 and the adhesive force of the adhesive of the tapered portion. Fixed. Further, the magnetic wire 60 is disposed so as to be pressed against the bottom surface of the groove of the substrate 21. Further, by applying an adhesive resist in the groove of the substrate 21 in advance, it can be adsorbed by the adhesive resist and fixed with a stronger force.

(6) Next, a magnetic wire 60, which is temporarily fixed in the groove at both ends fixed and the substrate 21 by the drawer chuck 15 and the cutting chuck 41b ^is a wire bobbin 11 by the tension load on the size of 50kg / mm ² ~100kg / mm 2 The residual stress of the wound magnetic wire base material is removed, and the internal stress of the magnetic wire 60 is uniformly applied in the longitudinal direction.

(7) By cutting the magnetic wire 60 between the two cutting chucks (41a and 41b), the impact force at the time of cutting is absorbed, and both the cutting chuck 41b on the drawer chuck side and the drawer chuck 15 are opened. Te, keeps internal stress imparted to the magnetic wire 60 as a uniform internal stress in the size of 30kg ^/ mm ² ~100kg ^/ mm 2 of the magnetic wire 60 with an adhesive strength of the adhesive.
In addition, the taper structure and temporary fixing with an adhesive to the groove also contribute to maintaining uniform internal stress.

(8) The substrate fixing table 23 is lowered to the operation origin height by the substrate fixing table feeding device 32 and is laterally fed to the next magnetic wire alignment position.

(9) The operation of aligning the magnetic wires 60 of the above (2) to (8) is continuously repeated until the alignment of the magnetic wires 60 on the entire surface of the substrate 21 is completed.
Then, after aligning the magnetic wire 60 over the entire surface of the substrate 21, the process moves to the next step.

In the next step, an adhesive resist is applied to the entire surface of the substrate 21 on which the magnetic wires 60 are aligned, and the magnetic wires 60 are applied with a uniform internal stress applied to the taper portions by adhesion and fixation. Is permanently fixed to the substrate 21. And the magnetic wire 60 is cut | disconnected between the board | substrate 21 and the board | substrate holder 22, and only the board | substrate 21 is taken out.

Next, an embodiment will be described with reference to FIG.
FIG. 4 shows a GSR element (unit element) 63 composed of a magnetic wire 60, a detection coil 61, an electrode (wire electrode, coil electrode) 62, and an assembly 64 of GSR elements formed on the entire surface of the substrate composed of a plurality of unit elements. Indicates.
The size of the GSR element assembly 64 is equivalent to the substrate 21 and has a length 40 mm and a width 40 mm in the longitudinal direction of the magnetic wire 60. The diameter of the magnetic wire 60 is 10 μm (12 μm including the glass coating). The width of the groove of the substrate 21 on which the magnetic wire 60 is aligned is 14 μm. With the apparatus and method of the present invention, a magnetic wire (with glass coating) 60 having a diameter of 12 μm is aligned with a groove of the substrate 21 having a length of 40 mm (40,000 μm) and a width of 14 μm, and uniform internal stress is applied. An assembly 60 of the existing elements is produced.
By the way, the commercially available MI element is 0.6 mm long × 0.4 mm wide. When the GSR element 62 having a size of 1/3 (length 0.2 mm and width 0.4 mm) is manufactured according to the present invention, a magnetic wire 60 having a length of 0.2 mm is formed with a width pitch interval of 50 μm in the width direction. Four can be aligned. As a result, the total length of the magnetic wires 60 increases from 0.6 mm to 0.8 mm, contributing to an increase in the output of the GSR sensor.

In addition, by applying uniform internal stress, the hysteresis characteristics, sine function output characteristics, noise reduction and performance of the GSR sensor can be greatly improved. In addition, the output sensitivity can be increased in accordance with the number of wires by densely stretching a large number of magnetic wires 60.

Furthermore, according to the present invention, the magnetic wires can be aligned with a shallow groove of about ½ of the wire diameter, in other words, with a groove depth of about ½ to 1/10 in the conventional MI element technology. Since the line width of holographic lithography is approximately inversely proportional to the square of the unevenness of the substrate surface, according to the present invention, it is possible to easily form a fine coil pitch about 4 to 100 times that of the prior art. Therefore, the number of coil turns increases by 4 times or more, and the sensitivity can be greatly improved to 5 times or more.

According to the present invention, since the GSR element can be formed using the shallow groove, the GSR element can be directly formed on the film surface on the ASIC surface. In other words, the ASIC and the element can be integrally formed, and the sensor can be significantly reduced in size.

As described above, the magnetic wire alignment apparatus and the wire alignment method of the present invention can realize high performance and downsizing of the GSR sensor.

DESCRIPTION OF SYMBOLS 1: Magnetic wire alignment apparatus 10: Wire supply apparatus part 11: Wire bobbin, 12a: Wire delivery motor, 13a: Wire tension load apparatus, 13b: Tension measuring apparatus, 14: Fixed chuck, 15: Drawer chuck 20: Wire alignment apparatus part
21: Substrate, 22: Substrate holder, 221: Tapered portion, 23: Substrate fixing base 30: Wire positioning device portion
31: Microscope, 32: Substrate fixing table feeder, 321: Lifting, 322: Horizontal feed, 323: Rotation 40: Cutting device part 41a: Cutting chuck, 41b: Cutting chuck, 42: Cutting machine 50; : Magnetic wire 61: Detection coil, 62: Electrode (wire electrode, coil electrode), 63: GSR element (unit element), 64: Assembly of GSR elements

      The present invention relates to a magnetic wire alignment apparatus and a wire alignment method that can apply a uniform stress to a magnetic wire that detects a magnetic field in order to improve the magnetic characteristics of a GSR sensor element.

      The MI sensor and GSR sensor, which are ultra-sensitive micro magnetic sensors, use a minute magnetic wire with a diameter of several tens of μm or less as a magnetic sensitive body, and are widely used for electronic compass, medical sensor, security sensor and the like. MI and GSR elements, which are magnetic field detection elements, have an amorphous magnetic wire arranged in the longitudinal direction of the element, and a detection coil that circulates the element, coil ends, and four electrodes at both ends of the wire are integrally assembled on a substrate. I found it. Development of devices for aligning magnetic wires with substrates has been undertaken for device manufacturing.

First, when the internal stress of the magnetic wire is increased in the fabrication of the MI element, the magnetic characteristics are lowered, so that the magnetic wires are aligned without applying tension as much as possible (Patent Documents 1 and 2). It has been difficult to align wires with a problem of productivity (Patent Document 1) and a fine coil interval (Patent Document 2).
Further, when aligning magnetic wires on a substrate having no groove or a substrate having a shallow groove, it has been difficult to make the magnetic wire out of the groove and miniaturization of the coil pitch (Patent Document 3).

In the MI elements disclosed in these patent documents, the magnetic wire is first subjected to a tensile heat treatment (temperature of 500 to 600 degrees) to greatly improve the magnetic characteristics without applying tension so as not to impair the magnetic characteristics. Or by removing the curl and applying a tension (about 10 kg / mm ² ) so that it can be straightened, temporarily fixed to the substrate with the force of a magnet, cutting the magnetic wire, and then fixing it with an adhesive. The The magnetic properties of the magnetic wire after the tensile heat treatment have high permeability and improve the sensitivity of the MI sensor, but have the drawback of having hysteresis and non-linearity. For this reason, the MI sensor has a problem in that 1) the hysteresis is large when the rising pulse detection is used. The current situation is that falling pulse detection is used to increase the power consumption of the sensor. 2) Due to the non-linearity, the linear area is narrow and the measurement range is small. 3) Further improvement is required for asymmetry of about 2%.

      Thereafter, a GSR sensor was developed that has a much higher sensitivity than the MI sensor and solves the drawbacks such as hysteresis, nonlinearity, and measurement range of the MI sensor (Patent Document 4). As a structure of the GSR element, an element with a microcoil in which the distance between the coil and the magnetic wire is set to about 2 μm and the coil pitch is reduced to about 5 μm is disclosed (Patent Document 5). An apparatus for aligning magnetic wires in grooves is disclosed (Patent Document 6).

Furthermore, in the development process of the GSR sensor, it was found that 1) GSR characteristics were improved and noise was reduced when a strong uniform stress was left on the magnetic wire. 2) Although the sensitivity can be further improved by arranging the wires in a strip shape, it is necessary to make the wire interval 100 μm or less. 3) If a wire can be aligned in a shallow groove, in order to directly form a GSR element on the ASIC surface, a shallow and small groove is formed on the coating on the ASIC surface, and the wire is placed there. It has been found that the play between the wire and the groove needs to be controlled at ± 2 μm. Based on the above knowledge, in order to further improve the performance of the GSR sensor, development of a new wire alignment apparatus has been required.

In the conventional magnetic wire temporary fixing method, after applying tension and cutting, the magnetic wire is temporarily fixed in the groove of the substrate by the force of the magnet, so that a large uniform stress remains on the magnetic wire. I can't. Further, the residual stress could not be stably maintained. For this purpose, it is necessary to establish a new manufacturing technology concept relating to tension loading, cutting, temporary fixing and permanent fixing in order to apply a uniform and large internal stress to the magnetic wire. Further, the GSR element manufactured by the method disclosed in Patent Document 4 has good hysteresis characteristics and can be measured by rising pulse detection. However, the method and conditions for stabilizing the characteristics are not clearly described, and the rising pulse detection cannot be used stably at present.

As for the wire interval, Patent Document 6 certainly discloses a magnetic wire alignment method to micro grooves by a magnet method, and describes that the interval between the magnetic wires can be 30 to 100 μm.
However, when a deep guide groove is used, it can withstand the repulsive force between magnetized magnetic wires, but it is difficult to form the lower coil of the MI element and GSR element along the shallow groove surface, and stable production is achieved. In that sense, the magnetic method has a limit of 100 μm between the magnetic wires.
Further, the repulsive force between the magnetic wires increases in proportion to the square of the distance between the magnetic wires when the interval between the magnetic wires is narrowed. Therefore, it is difficult to align the magnetic wires at a narrow interval of 100 μm or less.
Therefore, in place of the magnet system, development of an apparatus capable of aligning magnetic wires at a narrow interval is required.

The above patent documents are summarized below.

JP 2000-81471 A Republished patent WO2003 / 017299 International Publication No. WO2012-043160A1 Japanese Patent No. 5839527 Patent No. 5747294 Patent No. 5839530

The present invention firstly realizes an alignment apparatus and an alignment method capable of applying a uniform internal stress to a magnetic wire in order to improve the magnetic characteristics of a GSR sensor element.
Secondly, an alignment apparatus that can align the magnetic wires in a narrow groove having a play width of the magnetic wire and the groove of ± 2 μm or less and can align the gap between the magnetic wires to 100 μm or less is realized. .

The present inventor has conducted research on the magnetic wire from 50 kg / mm ² to 100 kg / mm ² since 2013, but the wire cannot be stably held along the groove only by temporarily fixing the magnet. I noticed. When it was temporarily fixed using an adhesive, it was discovered that uniform internal stress remained and the magnetic characteristics of the GSR sensor were greatly improved. Based on this discovery, we came up with the idea of applying a uniform internal stress inside the magnetic wire by maintaining the tension of the strongly tensioned magnetic wire by changing from the magnet method to the adhesive method.
In the adhesive method, first, taper portions are attached to both sides of the substrate holder, and an adhesive is applied to the taper portions. When aligning the magnetic wires, the substrate is raised above the wire drawing height position, and the magnetic wire is strongly pressed against the taper portion of the substrate holder to which the adhesive is applied. It is to fix firmly. Further, it has been found that an adhesive resist is applied in the groove of the substrate, and the magnetic wire is temporarily fixed in the groove with the adhesive force, thereby further firmly fixing.
The effect of uniform internal stress is that the thickness of the surface domain consisting of electron spins in the circumferential direction is increased by the force, and the 90-degree domain wall is pushed into the wire, thereby causing high-speed rotation of the electron spin by the GHz pulse current. This is considered to be due to the fact that only the phenomenon, that is, the movement of the domain wall at 90 degrees is suppressed and can be detected by the coil.

A specific method based on the above idea will be described in detail.
First, in order to impart a uniform internal stress strongly magnetic ^wire, pull the magnetic wire from the bobbin in a large tension of ^{50kg / mm 2 ~100kg / mm 2} , the drawer chuck after drawer, two cutting Grip and fix magnetic wire with chuck and fixed chuck. This uniform and large internal stress removes the residual stress and bending stress that originally remained inside the magnetic wire base material.
Next, the substrate is raised and both ends of the magnetic wire on both sides of the substrate are pressed against the taper portion of the substrate holder, and both ends of the magnetic wire are bonded and fixed to the substrate holder with an adhesive at the taper portion, and the magnetic wire is grooved on the substrate. Place and align to. Due to the structure of the taper portion of the substrate holder and the adhesive force of the adhesive, both ends of the magnetic wire are fixed to the substrate holder while maintaining a large tension, and as a result, the magnetic wire has a thickness of 30 kg / mm ^{2 to} 100 kg / mm ² . Uniform large internal stress can be maintained. It is possible to adjust the magnitude of the remaining internal stress by adjusting the adhesive strength of the adhesive.
Furthermore, when the magnetic wire is aligned in the groove of the substrate coated with the adhesive resist, the magnetic wire can be more strongly bonded and fixed, and the retention of the internal stress of the magnetic wire can be improved.

Next, the magnetic wire is held and fixed by two cutting chucks between the fixed chuck on the wire supply side and the substrate, and the magnetic wire is cut between the cutting chucks . The impact force at the time of cutting of the magnetic wire having the large internal stress can be absorbed by the two cutting chat gripping force of click. After cutting the magnetic wire, the cutting chuck and the drawing chuck on the substrate side holding and fixing the magnetic wire are opened. At this time, the uniform internal stress of the magnetic wire is held by the adhesive force of the adhesive.
Thereafter, in the next step, an adhesive resist is applied over the entire surface and the magnetic wire is permanently fixed to the substrate, and then removed from the substrate holder using a predetermined jig.

When pulling out the magnetic wire with a large tension of ^{50kg / mm 2 ~100kg / mm 2} , the problem of breakage easily occurs by sliding friction and chuck the bobbin and the feed reel and the magnetic wire. These problems are that a tension measuring device when pulling the magnetic wire and a feedback system that keeps the tension constant are attached, and the magnetic wire is firmly held and fixed by a plurality of chucks to perform a series of operations of the magnetic wire aligning device. It was also found that the problem can be solved by increasing the frictional force by making the chuck gripping surface uneven.

Also, the trouble magnetic wire magnetic wire off the temporary fixing of the magnetic wire impact force during cutting to cut the wire while applying a large tension of 50kg ^/ mm ² ~100kg / mm 2 pops out from the groove of the substrate Occur. As a countermeasure, at the time of cutting, both ends of the cutting portion of the magnetic wire are held by a cutting chuck to cut the magnetic wire. It has been found that by releasing the two cutting chucks holding both sides of the magnetic wire after cutting, the impact force during cutting can be absorbed and no trouble occurs. A magnetic wire cutting machine uses a mechanical cutting machine.

Secondly, in order to align the magnetic wires into small grooves with a play width of ± 2 μm or less with respect to the substrate grooves, and to align the gaps between the magnetic wires to 100 μm or less, focus on the magnetic wires that are strongly stretched with peen. The center line of the magnetic wire and the substrate groove (base axis ) is adjusted by using the microscope to adjust the positional deviation and parallelism deviation from the center line of the groove (referred to as the base axis ) using the center line of the magnetic wire as a reference line . An alignment apparatus having a performance of aligning with high accuracy that the deviation amount from the line is set to ± 1 μm or less is realized. It has been found that this can be realized by adopting an adhesive method instead of a temporary fixing method using a magnet that generates a repulsive force between magnetic wires.

The present invention is a magnetic wire drawer in the magnitude of the tension of ^{50kg / mm 2 ~100kg / mm 2} , the adhesive-magnetic wire with the adhesive of the tapered portion of the substrate holder for gripping fixing the substrate with placing the groove of the substrate by fixing, by applying a uniform internal stresses simultaneous 30kg ^/ mm ² ~100kg ^/ mm 2 removal of residual stress remaining in the magnetic wire matrix, the GSR sensor hysteresis, noise, and linear Magnetic properties such as characteristics (sinusoidal function output characteristics) are improved.

In addition, the present invention uses a magnetic wire that is taut as a reference line, and observes the positional relationship between the reference line and the base line of a minute groove having a width substantially equal to the diameter of the magnetic wire on the substrate with a microscope. It is possible to obtain a magnetic wire alignment with high accuracy by performing alignment and adjusting the positional deviation with a substrate fixing base capable of precise control, and it is possible to realize a micro-sized GSR sensor element. .
In addition, a large number of magnetic wires can be arranged in a single GSR sensor element at a minute interval of 40 μm or less, which has the effect of increasing the sensitivity of the GSR sensor and extending the measurement range.

It is a conceptual diagram which shows the structure of a magnetic wire alignment apparatus, and is a figure of the preparation stage for drawing out a magnetic wire. It is a conceptual diagram which shows the structure of a magnetic wire aligning apparatus, and is a figure which fixed the fixed tension with four chuck | zippers, and a magnetic wire. FIG. 5 is a diagram in which a magnetic wire is pressed and bonded to a taper portion of a substrate holder to which an adhesive is applied, and is disposed in a groove. It is the conceptual diagram of the aggregate | assembly of the GSR element produced on one board | substrate, and its unit element.

The best mode for carrying out the present invention will be described with reference to FIGS.
The magnetic wire aligning device 1 of the present invention includes a wire supply device unit 10, a wire aligning device unit 20, a positioning device unit 30, a cutting device unit 40, and a control device unit 50.

The wire supply unit 10 includes a wire bobbin 11a and a pull-out chuck 15 that pulls out the magnetic wire 60 wound around the wire bobbin 11a at a constant tension and a constant speed, a fixed chuck 14 that fixes the magnetic wire 60 after the magnetic wire 60 is pulled out, and wire feed-out It consists of a speed control device 12 and a wire tension control device 13 (including 13a and 13b). FIG. 1 shows a mode in which a magnetic wire is conveyed using four wire reels 16.

Moreover, when the wire supply unit 10 holds the magnetic wire with the pull-out chuck and pulls it out at a constant speed, an unexpected load is applied due to the frictional force of the bobbin, reel, or the like. Therefore, a wire feed speed control device 12 comprising a wire feed motor capable of adjusting the feed speed, a plurality of wire reels 16, a wire tension load device 13a, a wire tension measuring device 13b, and a deviation between the load tension and a predetermined tension are calculated. by consist wire tension control device 13 that has the function of adjusting to match the speed pull the feed speed of the feed motor to maintain the wire at a predetermined ^tension, of 50kg / mm ² ~100kg / mm 2 size The disconnection when pulling out with the tension is prevented.

In the wire supply unit 10, the magnetic wire base material is sent out from the wire bobbin 11 around which the base material of the magnetic wire 60 is wound by the wire feed speed control type motor 12 a constituting the wire feed speed control device 12. Residual stresses such as internal stress during manufacturing and winding stress due to the wire bobbin 11 remain in the magnetic wire base material.

A constant tension controlled by the wire tension control device 13 while being measured by the wire tension measuring device 13b is applied to the magnetic wire 60 by the wire tension loading device 13a.
The wire tension load device 13a can apply a constant wire tension by adjusting the load to a range of 1 to 20 g. If the diameter of the magnetic wire and 10 [mu] m, it is appropriate to adjust the tension in the range of ^{50kg / mm 2 ~100kg / mm 2} . Residual stresses such as internal stress and winding stress can be removed by setting it to 50 kg / mm ² or more, and breakage of the magnetic wire can be prevented by setting it to 100 kg / mm ² or less. Moreover, the function as a reference line of a magnetic wire is achieved by this tension load.
The wire reel 16 has a diameter of 20 mm and a V-shaped groove so that the magnetic wire 60 does not fall off the wire reel 16.
In order to maintain a constant tension, the gripping surface of each chuck is made uneven to increase the frictional force and increase the gripping force.

The wire aligning unit 20 includes a substrate fixing base 23 including a substrate 21 having a groove for aligning magnetic wires and a substrate holder 22 for fixing the substrate.
The substrate holder 22 has taper portions on both sides of the substrate holder 22 with respect to the drawing direction of the magnetic wire 60, and an adhesive for adhering and fixing the magnetic wire 60 is applied to the taper portion. By providing the taper portion, both the magnetic wire and the adhesive can be bonded over the entire surface.
Further, an adhesive resist is applied to the grooves of the substrate 21 in advance, and the magnetic wire 60 is adsorbed by the adhesive resist to be fixed more strongly.
By being thus strongly fixed, it is possible to tension imparted to the initial 50kg / mm ² ~100kg / mm ² is maintained as an internal stress of 30kg / mm ² ~100kg / mm ² even after opening of the fixed chuck .

The positioning device section 30 uses a reference line and a base axis to align the magnetic wire 60 in the groove of the substrate 21 with the center line of the magnetic wire 60 as a reference line and the center line of the groove of the substrate as a base line. And a substrate fixing table feed device 32 that adjusts the position deviation so that the reference line and the base axis line coincide with each other by raising / lowering 321, lateral feed 322, and rotation 323 of the substrate fixing table 23. It consists of a correction arithmetic unit (not shown).

Since the microscope 31 needs to observe both the magnetic wire 60 and the groove of the substrate 21, a microscope having a resolution of 1 μm or less is used. Since both are in a three-dimensional positional relationship, the focus adjustment of the microscope 31 is delicate, and a microscope that can be easily adjusted with a knob at hand is used. This facilitates adjustment work such as initial adjustment. Two microscopes 31 may be installed or moved for use. Since the countermeasure against vibration is important, the microscope stand is strongly attached to the main body of the magnetic wire aligning apparatus 1 as a countermeasure against vibration.
In addition, if it is a detection apparatus which has said function, it will not be limited to a microscope.

      The substrate fixing table feeding device 32 is mounted with a substrate fixing table 22 for fixing the substrate 21 on which the magnetic wires 60 are aligned, and is laterally fed to the magnetic wires 60 with a precision of ± 1 μm (322). Can be moved up and down (321) at a feed pitch of 1 μm. By lateral feed 322 in the left-right direction, the magnetic wire 60 is used as a reference line, the substrate-side groove is used as a base line, and both parallel shift and lateral shift are detected with an accuracy of ± 1 μm, and the diameter is 5 μm. To 15 μm magnetic wire 60 can be placed in a groove having a width of 9 μm to 19 μm.

The vertical movement 321 keeps the vertical distance between the magnetic wire 60 and the substrate 23 as close as possible to about 1 μm or less in contact or non-contact, and enables observation with the microscope 31 having a resolution of 1 μm. The substrate fixing base 23 is raised so that the magnetic wire 60 can be pressed against the tapered portion 221 after adjustment in the left-right direction, and the magnetic wire 60 is pressed against the tapered portion 221 of the substrate holder 22 and embedded in the groove.
Next, the rotation 323 is adjusted at a rotation pitch of 0.01 ° so that the wire reference line and the groove serving as the base axis are parallel to each other.

The lateral feed 322 in the left-right direction has three different pitches, that is, a pitch between elements, a pitch between wires in the element, and a pitch between wires in the coil for arranging a plurality of magnetic wires 60 in the element. Allows control by feed.
In addition, the element spacing pitch is greatly moved from 200 μm to 400 μm, the wire spacing pitch is as small as 50 μm to 100 μm, and the distance between the wires in the coil enables a fine movement of less than 40 μm to minimize the wire diameter. To do. In addition, since it is necessary to align the wires on the entire substrate, it is necessary to employ a substrate fixing table feeding device 23 that moves the moving distance of about 60 mm to 200 mm with a feeding pitch of ± 1 μm as the size of the substrate. The positional accuracy ± 1 μm between the magnetic wire 60 and the groove is realized by a control system using the magnetic wire as a reference line. However, in the case of using a large number of wires, the feed movement distance in the left-right direction of the substrate fixing base may be a distance divided by the number of wires.

      The control capability of the substrate fixing table feeder 32 is based on the magnetic wire diameter to be used, the groove width is about 1.2 to 3 times the magnetic wire diameter, and the groove depth is 0.5. The feed pitch of the substrate fixing table feeder is 0.1 μm, with the minimum movement amount being from double to 1.2 times. The present invention does not limit this numerical relationship, but it is desirable that the numerical range be within the above range in order to realize micro-sizing of the GSR element.

The magnetic wire 60 is aligned with the groove of the substrate 21 by pulling the magnetic wire 60 to a predetermined position (FIG. 2) with the pull-out chuck 15 and then fixing with the fixed chuck 15 and stretching it straight with a large tension. With the center line of the magnetic wire 60 as a reference line, the positional relationship between the reference line of the magnetic wire 60 and the center line of the groove of the substrate 21 on both sides of the substrate 21 is accurate to ± 1 μm or less with the microscope 31. Observe and calculate the amount of correction of lateral deviation and the amount of correction of rotation angle so that the magnetic wire 60 has a parallel positional relationship with an accuracy of ± 1 μm or less with respect to the center line of the groove, and the substrate fixing table 22 is corrected. And is performed with an accuracy of ± 1 μm.
Further, the substrate fixing table 23 is rotated at a rotation pitch of 0.01 ° by the rotation deviation angle by the rotation 323.

Thereafter, the substrate fixing base 23 is moved upward and downward 321 until the magnetic wire 60 is pressed against the taper portion 221 of the substrate holder 22 and temporarily fixed. An adhesive is applied to the tapered portion 221 of the substrate holder 22 of the substrate fixing base 23. For firm fixation, the substrate surface is raised higher than the position of the wire drawing height, and the magnetic wire 60 is strongly pressed against the adhesive applied to the taper portion 221 of the substrate holder 22 for adsorption. This is observed with the microscope 31 and recorded in the control unit 40 as an initial set value.

The cutting device section 40 includes two cutting chucks 41 (4a and 41b) that fix both sides of the cutting position when cutting the magnetic wire 60, and a cutting machine that cuts the magnetic wire 60 after being fixed by the cutting chuck 41. 42.
The two cutting chucks 41 absorb the impact force at the time of cutting the magnetic wire 60 having a large internal stress, and the magnetic wire 60 can be prevented from jumping out from the temporarily fixed groove.
After the magnetic wire 60 is cut, the substrate-side cutting chuck 41b and the pulling chuck 15 holding and fixing the magnetic wire 60 are opened, and the magnetic wire 60 is in a free state in which uniform internal stress is applied. Become. The magnetic wire 60 is bonded and fixed to the tapered portion 28 of the substrate holder 221 to which an adhesive is applied, and is temporarily fixed to the substrate 21 so as not to protrude from the groove of the substrate.
Further, when the adhesive resist is applied to the groove of the substrate 21, the magnetic wire 60 is fixed with a stronger force by the adsorption force of the adhesive resist in addition to the adhesive force at the taper portion 221. As a result, a more stable and uniform internal stress is applied, and the magnetic wire 60 can be reliably prevented from jumping out of the groove during cutting.

      The control unit 50 inputs the wire characteristics such as the wire diameter and the glass thickness, automatically adjusts the tension of the magnetic wire 60, adjusts each chuck pressure (14, 15, 41), and the wire cutting force. Function for adjusting, origin adjustment and origin return of substrate fixing base 23, automatic return function to work reference position, function for adjusting substrate fixing base 23 left and right based on observation result of deviation amount by microscope 31, substrate 21 It has a function for automatically adjusting the height of the substrate fixing base 23 and managing the production status based on work data such as thickness, groove depth, and wire diameter. Furthermore, it is possible to switch to manual operation in case of emergency.

      The control unit 50 is preferably configured of a program for controlling the combination of pitch feed consisting of the combination of the pitch between the elements and the pitch between the elements and the pitch between the wires in the coil.

      Through the above operation, a plurality of magnetic wires can be arranged in one element with a gap of 1 to 40 μm, and two magnetic wires in one element coil can be arranged with a gap of 1 to 10 μm. They can also be arranged.

      In the continuous operation, these control numerical values are stored in the control numerical value unit 40, preliminarily moved according to the numerical values, and at the position, the magnetic wire 60 is used as a reference line by the microscope 31, and the magnetic wire 60 and the groove are aligned. Correction is performed by a feedback system method for confirming and correcting the positional deviation, and this is continuously repeated.

In the case of mass production, a large number of wire supply devices 10 are arranged in parallel so that a large number of magnetic wires 60 can be supplied at a time. In this case, as the cutting machine 42 for the magnetic wire 60, a press cutting machine may be used in addition to a mechanical cutting machine composed of a large number of scissors. The important point is that a large impact force is generated when cutting a taut magnetic wire. In order to absorb the impact force, both sides of the cutting position are gripped by a cutting chuck .

A method for aligning the magnetic wires 60 on the substrate 21 using the magnetic wire aligning apparatus 1 will be described below.
(1) The wire bobbin 11 around which the magnetic wire 60 is wound is attached to the wire supply unit 10, and the magnetic wire 60 is moved to the wire drawing start position (referred to as the position of the drawing chuck 15 in FIG. 1) by the pulling wire feeding motor 12a. And is fixed by the fixing chuck 14 (FIG. 1).

(2) The end of the magnetic wire 60 fed to the drawing start position is firmly held and fixed by the drawing chuck 15 while the fixed chuck is released. The drawer fixed with wire feeding constant tension of 50kg ^/ mm ² ~100kg ^/ mm 2 with a constant speed and the wire tension controller by a motor 12a wire feed speed controller, from the drawer starting position with the drawer chuck 14 The magnetic wire 60 is pulled out to a position (referring to the position of the drawer chuck 15 in FIG. 2), and the fixed chuck 14 and the two cutting chucks (41a and 41b) are loaded with a certain tension applied to the magnetic wire 60. ) And the drawer chuck 15 to fix the drawer (FIG. 2).
Thus, in a state in the magnetic wires 60 the tension of 50kg ^/ mm ² ~100kg ^/ mm 2 is added between the drawer fixing chuck 15 from the fixed chuck 14, magnetic wire 60 stretched strongly strongly straight peen It has become.

(3) The substrate 21 having a groove for aligning the magnetic wires 60 is held and fixed to the substrate holder 22 having the taper portion 221 to which the adhesive is applied, and is used as the substrate fixing table 23 as the substrate fixing table feeding device 32. Has been placed in advance. The height of the upper surface of the substrate when placed is set as the operation origin height of the substrate fixing table feeder 32.
The substrate fixing table 23 is raised from the operation origin height to the height below the magnetic wire 60 by the substrate fixing table feeding device 32. This is because when the magnetic wire 60 is aligned with the groove of the substrate 21, the magnetic wire 60 and the substrate 21 are closest to each other in order to move the substrate 21 for observing and matching the positional relationship between them. To raise to height.

(4) The positional relationship between the center line of the magnetic wire 60 drawn out and fixed and pierced with a strong tension with respect to the base line which is the center line of the groove of the substrate 21 is measured by the microscope 31 with the reference line as the reference line. , And the amount of error is corrected by the lateral feed 322 and the rotation 323 so that the center line of the magnetic wire 60 as the reference line coincides with the center line of the groove as the base line .

(5) The substrate fixing base 23 is raised again to align the magnetic wire 60 along the groove on the substrate 21, and both ends of the magnetic wire 60 are formed on the tapered portion 221 to which the adhesive of the substrate holder 22 is applied. The both ends of the magnetic wire 60 are fixed to the substrate holder 22 by being pushed over the entire surface until they are bonded (FIG. 3).
The magnetic wire 60 is attached to the substrate holder 22 by both the frictional resistance with the magnetic wire 60 at the boundary portion (tapered structure) between the flat portion of the substrate holder 22 and the tapered portion of the tapered portion 221 and the adhesive force of the adhesive of the tapered portion. Fixed. Further, the magnetic wire 60 is disposed so as to be pressed against the bottom surface of the groove of the substrate 21. Further, by applying an adhesive resist in the groove of the substrate 21 in advance, it can be adsorbed by the adhesive resist and fixed with a stronger force.

(6) Next, a magnetic wire 60, which is temporarily fixed in the groove at both ends fixed and the substrate 21 by the drawer chuck 15 and the cutting chuck 41b ^{is, 50kg / mm 2 ~100kg / mm} 2 of the wire bobbin by the magnitude of the tension load 11 The residual stress of the magnetic wire base material wound around is removed, and the internal stress of the magnetic wire 60 is uniformly applied in the longitudinal direction.

(7) By cutting the magnetic wire 60 between the two cutting chucks (41a and 41b), the impact force at the time of cutting is absorbed, and both the cutting chuck 41b on the drawer chuck side and the drawer chuck 15 are opened. to retain the internal stress imparted to the magnetic wire 60 as a uniform internal stress in the adhesive strength by the magnitude of 30kg ^/ mm ² ~100kg ^/ mm 2 of the magnetic wire 60 of adhesive.
In addition, the taper structure and temporary fixing with an adhesive to the groove also contribute to maintaining uniform internal stress.

(8) The substrate fixing table 23 is lowered to the operation origin height by the substrate fixing table feeding device 32 and is laterally fed to the next magnetic wire alignment position.

(9) The operation of aligning the magnetic wires 60 of the above (2) to (8) is continuously repeated until the alignment of the magnetic wires 60 on the entire surface of the substrate 21 is completed.
Then, after aligning the magnetic wire 60 over the entire surface of the substrate 21, the process moves to the next step.

In the next step, an adhesive resist is applied to the entire surface of the substrate 21 on which the magnetic wires 60 are aligned, and the magnetic wires 60 are applied with a uniform internal stress applied to the taper portions by adhesion and fixation. Is permanently fixed to the substrate 21. And the magnetic wire 60 is cut | disconnected between the board | substrate 21 and the board | substrate holder 22, and only the board | substrate 21 is taken out.

Next, an embodiment will be described with reference to FIG.
FIG. 4 shows a GSR element (unit element) 63 composed of a magnetic wire 60, a detection coil 61, an electrode (wire electrode, coil electrode) 62, and an assembly 64 of GSR elements formed on the entire surface of the substrate composed of a plurality of unit elements. Indicates.
The size of the GSR element assembly 64 is equivalent to the substrate 21 and has a length 40 mm and a width 40 mm in the longitudinal direction of the magnetic wire 60. The diameter of the magnetic wire 60 is 10 μm (12 μm including the glass coating). The width of the groove of the substrate 21 on which the magnetic wire 60 is aligned is 14 μm. With the apparatus and method of the present invention, a magnetic wire (with glass coating) 60 having a diameter of 12 μm is aligned with a groove of the substrate 21 having a length of 40 mm (40,000 μm) and a width of 14 μm, and uniform internal stress is applied. An assembly 60 of the existing elements is produced.
By the way, the commercially available MI element is 0.6 mm long × 0.4 mm wide. When the GSR element 62 having a size of 1/3 (length 0.2 mm and width 0.4 mm) is manufactured according to the present invention, a magnetic wire 60 having a length of 0.2 mm is formed with a width pitch interval of 50 μm in the width direction. Four can be aligned. As a result, the total length of the magnetic wires 60 increases from 0.6 mm to 0.8 mm, contributing to an increase in the output of the GSR sensor.

In addition, by applying uniform internal stress, the hysteresis characteristics, sine function output characteristics, noise reduction and performance of the GSR sensor can be greatly improved. In addition, the output sensitivity can be increased in accordance with the number of wires by densely stretching a large number of magnetic wires 60.

Furthermore, according to the present invention, the magnetic wires can be aligned with a shallow groove of about ½ of the wire diameter, in other words, with a groove depth of about ½ to 1/10 in the conventional MI element technology. Since the line width of photolithography is almost inversely proportional to the square of the unevenness of the substrate surface, according to the present invention, it is possible to easily form a fine coil pitch about 4 to 100 times that of the prior art. Therefore, the number of coil turns increases by 4 times or more, and the sensitivity can be greatly improved to 5 times or more.

According to the present invention, since the GSR element can be formed using the shallow groove, the GSR element can be directly formed on the film surface on the ASIC surface. In other words, the ASIC and the element can be integrally formed, and the sensor can be significantly reduced in size.

As described above, the magnetic wire alignment apparatus and the magnetic wire alignment method of the present invention can realize high performance and downsizing of the GSR sensor.

DESCRIPTION OF SYMBOLS 1: Magnetic wire alignment apparatus 10: Wire supply apparatus part 11: Wire bobbin, 12a: Wire delivery motor, 13a: Wire tension load apparatus, 13b: Tension measuring apparatus, 14: Fixed chuck, 15: Drawer chuck 20: Wire alignment apparatus part
21: Substrate, 22: Substrate holder, 221: Tapered portion, 23: Substrate fixing base 30: Wire positioning device portion
31: Microscope, 32: Substrate fixing table feeder, 321: Lifting, 322: Horizontal feed, 323: Rotation 40: Cutting device part 41a: Cutting chuck , 41b: Cutting chuck , 42: Cutting machine 50; Control device Unit 60: magnetic wire 61: detection coil, 62: electrode (wire electrode, coil electrode), 63: GSR element (unit element), 64: aggregate of GSR elements

Claims (7)

Wire having a wire bobbin and a pull-out chuck for pulling out the magnetic wire wound around the wire bobbin at a constant tension and a constant speed, a fixed chuck for fixing the magnetic wire after the magnetic wire is pulled out, a wire feed speed control device, and a wire having a wire tension control device A supply unit;
A wire aligning device portion having a substrate fixing base composed of a substrate having a groove for aligning the magnetic wires and a substrate holder for fixing the substrate;
A microscope for detecting a misalignment state between the reference line and the base axis on both sides of the substrate in order to align the magnetic wire with the center line of the groove using the center line of the magnetic wire as a reference line; A positioning device unit including a substrate fixing table feeding device that adjusts the deviation by raising / lowering the substrate fixing table, lateral feeding, and rotation, and a positioning correction arithmetic unit;
A cutting device portion comprising a cutting chuck for fixing both sides of a cutting position when cutting the magnetic wire, and a cutting machine for cutting the magnetic wire after being fixed by the cutting chuck;
A control unit for controlling the wire tension control unit, the substrate feed base unit, the microscope, the positioning calculation unit, and the cutting unit;
The substrate holder has tapered portions on both sides of the substrate holder with respect to the drawing direction of the magnetic wire,
The magnetic wire, after fixing with adhesive in the tapered portion after being drawn in the magnitude of the tension of ^{50kg / mm 2 ~100kg / mm 2} , and cut by the cutter, uniform magnetic wire A magnetic wire alignment device characterized by applying stress. In claim 1,
After pulling out the magnetic wire to a predetermined position with a pull-out chuck, it is fixed with the fixed chuck and is stretched straight with the tension, and the center line of the magnetic wire is used as a reference line, and the microscope The positional relationship between the magnetic wire reference line and the groove center line on both sides of the substrate is observed with an accuracy of ± 1 μm or less, and the magnetic wire is parallel to the groove center line with an accuracy of ± 1 μm or less. A magnetic wire characterized by calculating a rotation angle correction and a lateral shift correction amount so as to be in a positional relationship, and moving the substrate fixing base by a correction amount to align the magnetic wires with an accuracy of ± 1 μm. Alignment device. In claim 1 or claim 2,
The wire supply unit includes a wire feed speed control device including a wire feed motor capable of automatically adjusting a feed speed, a plurality of wire reels, a wire tension load device, a wire tension measuring device, and a deviation between the load tension and a predetermined tension. was calculated, by becoming the wire feed rate is automatically adjusted from the wire tension control apparatus having a function of maintaining a predetermined tension, when pulling out the magnitude of the tension of 50kg ^/ mm ² ~100kg / mm 2 A magnetic wire alignment device characterized by preventing disconnection. In any one of Claims 1-3,
The magnetic wire aligning apparatus, wherein the magnetic wire is fixed with a stronger force by adhering and temporarily fixing the magnetic wire to the groove with an adhesive resist in addition to fixing by the taper portion of the substrate holder. A magnetic wire alignment method for aligning the magnetic wires with the grooves of the substrate using the magnetic wire alignment apparatus according to claim 1.
(1) The wire bobbin around which the magnetic wire is wound is attached to the wire supply unit, the magnetic wire is pulled out to a pulling start position and fixed with the fixing chuck,
(2) the drawing the magnetic wire at a constant speed and constant tension of 50kg ^/ mm ² ~100kg ^/ mm 2 to the drawer fixed position from the pull-out start position using the take-out chuck, load the tension to the magnetic wire In this state, the fixed chuck is held by the two chucks and the pulling chuck and fixed by pulling.
(3) Raising the substrate fixing table from the operation origin height to the lower height of the magnetic wire by the substrate fixing table feeding device;
(4) Using a microscope to measure the positional relationship with the base line, which is the central line of the groove of the substrate, with the central line of the magnetic wire being pulled and fixed as a reference line, and calculating the positional relationship error between them, By correcting the amount of error with a lateral feed device and a rotary feed device, the center line of the magnetic wire that is a reference line is matched with the center line of the groove that is a base line,
(5) The substrate fixing base is raised again to align the magnetic wire along the groove on the substrate, and both ends of the magnetic wire are coated with the adhesive of the substrate holder. increased to adhere against over the entire said end portions of the magnetic wire is temporarily fixed to the substrate ^{holder, 30kg / mm 2 ~100kg / mm} 2 in size adhesion adhesive so that the internal stress remains in the in the control to (6) Next, the magnetic wire positioned across the fixed and the groove by the drawer chuck and the cutting ^chuck, said by the tension load on the size of 50kg / mm ² ~100kg / mm 2 wire bobbin internal residual stress of the magnetic wire base material wound around is removed, in the longitudinal direction of 30kg ^/ mm ² ~100kg ^/ mm 2 size of In a state where the force was uniformly granted,
(7) By cutting the magnetic wire between the two cutting chucks, the impact force at the time of cutting is absorbed, and both the cutting chuck and the pulling chuck on the pulling chuck side are opened, The internal stress applied to the magnetic wire is held as the uniform internal stress of the magnetic wire by the adhesive force of the adhesive (8) The substrate fixing table is lowered to the operation origin height by the substrate fixing table feeding device, and then To the magnetic wire alignment position of
(9) The operation of aligning the magnetic wires of (2) to (8) is continuously repeated until the alignment of the magnetic wires is completed on the entire surface of the substrate, and the process moves to the next step. Wire alignment method. In claim 5,
A magnetic wire alignment method, wherein an adhesive resist is applied in the groove of the substrate, and the magnetic wire in the groove is temporarily fixed by an adhesive force of the adhesive resist. In claim 5 or claim 6,
In the next step, the adhesive resist is applied to the entire surface of the substrate on which the magnetic wires are aligned, temporarily fixed, and the magnetic wires are applied to the magnetic wires in a state where uniform internal stress is applied to the magnetic wires. A magnetic wire alignment method comprising: cutting the magnetic wire between the substrate and the substrate holder, and taking out only the substrate after being permanently fixed to the substrate.

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