JP2019203203A5 - - Google Patents

Download PDF

Info

Publication number
JP2019203203A5
JP2019203203A5 JP2019153409A JP2019153409A JP2019203203A5 JP 2019203203 A5 JP2019203203 A5 JP 2019203203A5 JP 2019153409 A JP2019153409 A JP 2019153409A JP 2019153409 A JP2019153409 A JP 2019153409A JP 2019203203 A5 JP2019203203 A5 JP 2019203203A5
Authority
JP
Japan
Prior art keywords
plating
abs resin
resin surface
surface according
abs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019153409A
Other languages
Japanese (ja)
Other versions
JP2019203203A (en
JP6953484B2 (en
Filing date
Publication date
Priority claimed from JP2017168258A external-priority patent/JP2019044229A/en
Application filed filed Critical
Priority to JP2019153409A priority Critical patent/JP6953484B2/en
Priority claimed from JP2019153409A external-priority patent/JP6953484B2/en
Publication of JP2019203203A publication Critical patent/JP2019203203A/en
Publication of JP2019203203A5 publication Critical patent/JP2019203203A5/ja
Application granted granted Critical
Publication of JP6953484B2 publication Critical patent/JP6953484B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (8)

ＡＢＳ系樹脂を硫酸を電気分解した溶液で処理する、ＡＢＳ系樹脂表面のめっき前処理方法。 A pre-plating method for the surface of an ABS resin, which treats the ABS resin with a solution obtained by electrolyzing sulfuric acid. 硫酸を電気分解した溶液が、硫酸のみを電気分解したものである請求項１記載のＡＢＳ系樹脂表面のめっき前処理方法。The method for pre-plating an ABS resin surface according to claim 1, wherein the solution obtained by electrolyzing sulfuric acid is obtained by electrolyzing only sulfuric acid. 前記溶液の硫酸濃度が６０〜８７質量％である、請求項１または２に記載のＡＢＳ系樹脂表面のめっき前処理方法。 The sulfuric acid concentration of the solution is 60 to 87 mass%, before plating ABS resin surface according to claim 1 or 2 treatment methods. 前記処理の温度が５０〜８０℃である、請求項１〜３の何れか１に記載のＡＢＳ系樹脂表面のめっき前処理方法。 The method for pre-plating an ABS resin surface according to any one of claims 1 to 3 , wherein the treatment temperature is 50 to 80 ° C. 前記溶液の過硫酸濃度が３ｇ／Ｌ以上である、請求項１〜４のいずれか１に記載のＡＢＳ系樹脂表面のめっき前処理方法。 The persulfate concentration of the solution is that 3 g / L or more, claim 1 pretreatment method plating ABS resin surface according to any one of the four. 前記処理の時間が５〜２０分間である、請求項１〜５のいずれか１に記載のＡＢＳ系樹脂表面のめっき前処理方法。The method for pre-plating an ABS resin surface according to any one of claims 1 to 5, wherein the treatment time is 5 to 20 minutes. 請求項１〜６のいずれか１に記載のＡＢＳ系樹脂表面のめっき前処理方法により処理した後、該ＡＢＳ系樹脂表面に無電解めっき又は電気めっきを施す、ＡＢＳ系樹脂表面のめっき処理方法。 After processing by the plating pretreatment method of the ABS resin surface according to any one of claims 1-6, electroless plating or electroplating in the ABS resin surface, plating method ABS resin surface. 請求項７に記載のＡＢＳ系樹脂表面のめっき処理方法によりめっき処理を施した、ＡＢＳ系樹脂めっき製品。 An ABS-based resin-plated product that has been plated by the method of plating the ABS-based resin surface according to claim 7 .
JP2019153409A 2017-09-01 2019-08-26 ABS-based resin surface plating pretreatment method, ABS-based resin surface plating treatment method, and ABS-based resin plating products Active JP6953484B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019153409A JP6953484B2 (en) 2017-09-01 2019-08-26 ABS-based resin surface plating pretreatment method, ABS-based resin surface plating treatment method, and ABS-based resin plating products

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017168258A JP2019044229A (en) 2017-09-01 2017-09-01 Plating pretreatment method for abs resin surface, plating treatment method for abs resin surface, and abs resin-plated product
JP2019153409A JP6953484B2 (en) 2017-09-01 2019-08-26 ABS-based resin surface plating pretreatment method, ABS-based resin surface plating treatment method, and ABS-based resin plating products

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2017168258A Division JP2019044229A (en) 2017-09-01 2017-09-01 Plating pretreatment method for abs resin surface, plating treatment method for abs resin surface, and abs resin-plated product

Publications (3)

Publication Number Publication Date
JP2019203203A JP2019203203A (en) 2019-11-28
JP2019203203A5 true JP2019203203A5 (en) 2020-10-08
JP6953484B2 JP6953484B2 (en) 2021-10-27

Family

ID=68726251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019153409A Active JP6953484B2 (en) 2017-09-01 2019-08-26 ABS-based resin surface plating pretreatment method, ABS-based resin surface plating treatment method, and ABS-based resin plating products

Country Status (1)

Country Link
JP (1) JP6953484B2 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2025708T3 (en) * 2007-08-10 2010-03-31 Enthone Chromium-free etchant for plastic surfaces
JP5403535B2 (en) * 2008-12-10 2014-01-29 奥野製薬工業株式会社 Method for electrolytic treatment of etching solution
JP5271345B2 (en) * 2010-12-21 2013-08-21 クロリンエンジニアズ株式会社 Conductive diamond electrode, sulfuric acid electrolysis method and sulfuric acid electrolysis apparatus using the same
US10260000B2 (en) * 2012-01-23 2019-04-16 Macdermid Acumen, Inc. Etching of plastic using acidic solutions containing trivalent manganese
JP2017101304A (en) * 2015-12-04 2017-06-08 株式会社Ｊｃｕ Etching method of resin surface, and plating method on resin utilizing the same

Similar Documents

Publication Publication Date Title
MX2013001838A (en) Process for the electroless copper plating of metallic substrates
WO2013113810A3 (en) Electroless nickel plating bath
MX2016010851A (en) Treatment for electroplating racks to avoid rack metallization.
FR3042715B1 (en) PROCESS FOR GRAFTING BIOACTIVE POLYMER ON IMPLANTS
MX369015B (en) Method for forming multi-layered coating film.
PH12016500567A1 (en) Reductive electroless gold plating solution, and electroless gold plating method using said plating solution
JP2017075384A5 (en)
PL397081A1 (en) Method for electrorefining of copper
BR112015020701A2 (en) Method for the continuous treatment of the surface of a laminate made of stainless steel in a sulfuric acid based solution
JP2019203203A5 (en)
WO2015187402A8 (en) Aqueous electroless nickel plating bath and method of using the same
RU2015146698A (en) METHOD FOR PREPARING CLEAN ELECTROLYTE CuSO4 FROM MULTICOMPONENT SOLUTIONS AND ITS REGENERATION IN PRODUCTION OF CATHODE COPPER ELECTROLYZES WITH AN INSOLUBLE ANODE
MY185286A (en) Electroless nickel-phosphorous plating baths with reduced ion concentration and methods of use
CN103820823A (en) Method for preventing whitening of plating pearl nickel product
RU2016148650A (en) SOLUTION FOR METALIZING THREADED CONNECTIONS OF PIPELINES OR PIPES AND METHOD OF PRODUCING THREADED CONNECTIONS FOR PIPELINES OR PIPES
TW201529885A (en) Polyimide substrate metallization method
JP2016092153A5 (en)
RU2013130273A (en) METHOD FOR PREPARING SURFACE OF PRODUCTS FROM STAINLESS STEEL BEFORE GALVANIZED COPPER
EA201790673A1 (en) NEW COMPLEXES OF IRON HYDROXIDE (III) WITH SYROPES FROM ACTIVATED GLUCOSE AND METHOD FOR THEIR PRODUCTION
RU2013113455A (en) METHOD FOR PRODUCING NICKEL (II) -AMMONIUM PHOSPHATES
刘明星 et al. Investigation of a new cyanide-free silver electroplating process
CN104087914A (en) Electroless copper plating method for steel wire
JP2005324143A5 (en)
CN104593837A (en) Tire steel cord acid copper plating method
MY193246A (en) High phosphorus electroless nickel