JP2019197832A - Single wafer spin etcher - Google Patents

Single wafer spin etcher Download PDF

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JP2019197832A
JP2019197832A JP2018091531A JP2018091531A JP2019197832A JP 2019197832 A JP2019197832 A JP 2019197832A JP 2018091531 A JP2018091531 A JP 2018091531A JP 2018091531 A JP2018091531 A JP 2018091531A JP 2019197832 A JP2019197832 A JP 2019197832A
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top plate
wafer
stage
spin etcher
single wafer
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JP6965825B2 (en
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顕也 出
Akiya Ide
顕也 出
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

To provide a single wafer spin etcher that can prevent liquid splattering without cleaning the top plate.SOLUTION: A stage 1 rotates with a wafer 2 fixed. A chemical nozzle 3 supplies a chemical to the wafer 2 from above the stage 1. A chamber 4 includes the stage 1 and the chemical nozzle 3. The lower surface of the top plate 6 of the chamber 4 is an inclined surface that falls from the center toward the outer periphery. The top plate 6 is provided with a plurality of holes 8 through which airflow passes. The shape of the hole 8 is an ellipse that is long in the inclination direction of the lower surface of the top plate 6.SELECTED DRAWING: Figure 2

Description

本発明は、回転するウエハに薬液を供給してウエハをエッチングする枚葉式スピンエッチャーに関する。   The present invention relates to a single wafer spin etcher that supplies a chemical solution to a rotating wafer to etch the wafer.

枚葉式スピンエッチャーは、回転するウエハに薬液を供給することで、所望の厚みになるまでウエハをエッチングする（例えば、特許文献１参照）。チャンバー内に飛散したミスト状の薬液が留まらないようにするため、ダウンフロー（気流）が通過する複数の穴がチャンバーの天板に設けられている。   A single wafer spin etcher etches a wafer to a desired thickness by supplying a chemical solution to the rotating wafer (see, for example, Patent Document 1). A plurality of holes through which a downflow (airflow) passes are provided in the top plate of the chamber in order to prevent the mist-like chemical liquid scattered in the chamber from staying.

特開２００４−２７３９１２号公報JP 2004-273912 A

天板の穴に溜まった水滴がウエハ上に落ちる液ボテが問題となっていた。液ボテを防ぐために作業者が天板を拭いて水滴を取る天板クリーニングを定期的に実施する必要があり、効率が低下していた。   There was a problem with the liquid drop that drops of water collected in the hole in the top plate fall on the wafer. In order to prevent liquid spilling, it is necessary for the operator to periodically clean the top plate to remove water droplets by wiping the top plate, and the efficiency is lowered.

本発明は、上述のような課題を解決するためになされたもので、その目的は天板クリーニングを行わなくても液ボテを防ぐことができる枚葉式スピンエッチャーを得るものである。   The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a single-wafer spin etcher that can prevent liquid fringe without performing top plate cleaning.

本発明に係る枚葉式スピンエッチャーは、ウエハを固定して回転するステージと、前記ステージの上方から前記ウエハに薬液を供給する薬液ノズルと、前記ステージ及び前記薬液ノズルを内包し、天板を有するチャンバーとを備え、前記天板の下面は中央から外周に向かって下がる傾斜面であり、前記天板には気流が通り抜ける複数の穴が設けられており、前記穴の形状は、前記天板の前記下面の傾斜方向に長い楕円であることを特徴とする。   A single wafer spin etcher according to the present invention includes a stage for fixing and rotating a wafer, a chemical nozzle for supplying a chemical to the wafer from above the stage, the stage and the chemical nozzle included, and a top plate A lower surface of the top plate is an inclined surface that descends from the center toward the outer periphery, the top plate is provided with a plurality of holes through which airflow passes, and the shape of the hole is the top plate It is an ellipse which is long in the inclination direction of the lower surface.

本発明では、天板に設けられた複数の穴の形状を天板の下面の傾斜方向に長い楕円とする。楕円の穴の上部と下部は角度が急であるため、水滴が流れ易くなる。これにより、天板クリーニングを行わなくても液ボテを防ぐことができる。   In the present invention, the shape of the plurality of holes provided in the top plate is an ellipse that is long in the inclination direction of the lower surface of the top plate. Since the upper and lower portions of the oval hole are steep, water droplets can easily flow. As a result, liquid waste can be prevented without cleaning the top plate.

実施の形態１に係る枚葉式スピンエッチャーを示す断面図である。1 is a cross-sectional view showing a single wafer spin etcher according to a first embodiment. 実施の形態１に係る枚葉式スピンエッチャーを示す斜視図である。1 is a perspective view showing a single wafer spin etcher according to Embodiment 1. FIG. チャンバーの天板を示す上面図である。It is a top view which shows the top plate of a chamber. 円形の穴を示す図である。It is a figure which shows a circular hole. 楕円の穴を示す図である。It is a figure which shows an elliptical hole. 実施の形態２に係る枚葉式スピンエッチャーを示す斜視図である。FIG. 6 is a perspective view showing a single wafer spin etcher according to a second embodiment.

実施の形態に係る枚葉式スピンエッチャーについて図面を参照して説明する。同じ又は対応する構成要素には同じ符号を付し、説明の繰り返しを省略する場合がある。   A single wafer spin etcher according to an embodiment will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

実施の形態１．
図１は、実施の形態１に係る枚葉式スピンエッチャーを示す断面図である。図２は、実施の形態１に係る枚葉式スピンエッチャーを示す斜視図である。ステージ１はウエハ２を固定して回転する。薬液ノズル３がステージ１の上方からウエハ２に薬液を供給する。チャンバー４がステージ１及び薬液ノズル３を内包する。搬送アーム５がチャンバー４内のステージ１にウエハ２を搬送する。 Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a single wafer spin etcher according to the first embodiment. FIG. 2 is a perspective view showing the single wafer spin etcher according to the first embodiment. The stage 1 rotates with the wafer 2 fixed. The chemical solution nozzle 3 supplies the chemical solution to the wafer 2 from above the stage 1. The chamber 4 contains the stage 1 and the chemical solution nozzle 3. The transfer arm 5 transfers the wafer 2 to the stage 1 in the chamber 4.

天板６がチャンバー４の上部に設けられている。天板６の上面は水平面であるが、下面に四角錐の凹部が設けられている。このため、天板６の下面は中央から外周に向かって下がる傾斜面となる。この天板６の下面の傾斜面を水滴が流れて天板６の外周から落ちるため、ウエハ２に水滴が落ちない。なお、天板６の下面の凹部は多角錐又は円錐状であればよいが、四角錐の凹部は形成が容易である。   A top plate 6 is provided above the chamber 4. Although the upper surface of the top plate 6 is a horizontal surface, a concave portion of a quadrangular pyramid is provided on the lower surface. For this reason, the lower surface of the top plate 6 becomes an inclined surface that falls from the center toward the outer periphery. Since water droplets flow on the inclined surface of the lower surface of the top plate 6 and fall from the outer periphery of the top plate 6, the water droplets do not fall on the wafer 2. In addition, although the recessed part of the lower surface of the top plate 6 should just be a polygonal pyramid or a cone shape, the recessed part of a square pyramid is easy to form.

ウエハ２の厚みを測定するレーザー厚み測定器７がステージ１の上方において天板６の上面に設けられている。このレーザー厚み測定器７の測定値をもとにステージ１及び薬液ノズル３の動作が制御される。レーザー厚み測定器７は天板６の上面に設けられ、天板６の下面側から突出していないため、レーザー厚み測定器７を伝って水滴がウエハ２に落ちることはない。   A laser thickness measuring instrument 7 for measuring the thickness of the wafer 2 is provided on the top surface of the top plate 6 above the stage 1. The operations of the stage 1 and the chemical nozzle 3 are controlled based on the measurement value of the laser thickness measuring device 7. Since the laser thickness measuring device 7 is provided on the upper surface of the top plate 6 and does not protrude from the lower surface side of the top plate 6, water drops do not fall on the wafer 2 through the laser thickness measuring device 7.

図３は、チャンバーの天板を示す上面図である。チャンバー４内にミストの雰囲気が滞留するのを防ぐため、気流が通り抜ける複数の穴８が天板６全体に均等に設けられている。穴８は天板６を上下に貫通している。天板６の上面に対して垂直方向から見た平面視において、穴８の形状は、天板６の下面の傾斜方向に長い楕円である。天板６の下面の傾斜方向は水滴が流れる方向である。図２及び図３の矢印は水滴が流れる方向を示している。天板６の下面の凹部が四角錐の場合、四角の辺に対して垂直に水滴が流れるため、穴８は四角の辺に対して垂直方向に長い楕円となる。一方、天板６の下面の凹部が円錐の場合、水滴が放射状に流れるため、穴８は放射状に長い楕円となる。   FIG. 3 is a top view showing the top plate of the chamber. In order to prevent the atmosphere of mist from staying in the chamber 4, a plurality of holes 8 through which the airflow passes are provided uniformly on the entire top plate 6. The hole 8 penetrates the top plate 6 up and down. In a plan view as viewed from the direction perpendicular to the top surface of the top plate 6, the shape of the hole 8 is an ellipse that is long in the inclination direction of the bottom surface of the top plate 6. The inclination direction of the lower surface of the top plate 6 is a direction in which water drops flow. The arrows in FIGS. 2 and 3 indicate the direction in which water drops flow. When the concave portion on the lower surface of the top plate 6 is a quadrangular pyramid, a water droplet flows perpendicularly to the square side, so that the hole 8 becomes an ellipse that is long in the direction perpendicular to the square side. On the other hand, when the concave portion on the lower surface of the top plate 6 is a cone, water droplets flow radially, so that the hole 8 becomes a long ellipse radially.

図４は、円形の穴を示す図である。天板６に設けられた複数の穴８の形状が円形の場合、円形の穴８の上部と下部に水滴が溜まって液ボテが生じやすい。そこで、本実施の形態では、天板６に設けられた複数の穴８の形状を天板６の下面の傾斜方向に長い楕円とする。図５は、楕円の穴を示す図である。楕円の穴８の上部と下部は角度が急であるため、水滴が流れやすい。これにより、天板クリーニングを行わなくても液ボテを防ぐことができる。また、天板６に水滴が付着した状態であるため、酸結晶が発生しなくなる。   FIG. 4 is a diagram showing a circular hole. In the case where the shape of the plurality of holes 8 provided in the top plate 6 is circular, water droplets are likely to accumulate in the upper and lower portions of the circular hole 8 and liquid spills are likely to occur. Therefore, in the present embodiment, the shape of the plurality of holes 8 provided in the top plate 6 is an ellipse that is long in the inclination direction of the lower surface of the top plate 6. FIG. 5 is a diagram showing an elliptical hole. Since the upper part and the lower part of the elliptical hole 8 are steep, water droplets easily flow. As a result, liquid waste can be prevented without cleaning the top plate. Further, since water droplets are attached to the top plate 6, acid crystals are not generated.

実態形態２．
図６は、実施の形態２に係る枚葉式スピンエッチャーを示す斜視図である。振動器９が天板６の上面に設けられている。この振動器９により天板６を振動させることで、天板６に付着した水滴が小さいうちに天板６を伝って強制的に落とすことができる。また、天板６に付着した水滴を落とす時間を調整することができる。振動器９は、製品処理時間以外の装置待機状態などでウエハ２がステージ１の上に載っていない時に定期的に動作することが好ましい。これにより、ウエハ２に水滴が落ちない。 Actual form 2.
FIG. 6 is a perspective view showing a single wafer spin etcher according to the second embodiment. A vibrator 9 is provided on the top surface of the top plate 6. By vibrating the top plate 6 with the vibrator 9, the water drops attached to the top plate 6 can be forcibly dropped along the top plate 6 while the water droplets are small. Moreover, the time for dropping the water droplets adhering to the top plate 6 can be adjusted. The vibrator 9 is preferably operated periodically when the wafer 2 is not placed on the stage 1 due to an apparatus standby state other than the product processing time. Thereby, water droplets do not fall on the wafer 2.

１ ステージ、２ ウエハ、３ 薬液ノズル、４ チャンバー、６ 天板、７ レーザー厚み測定器、８ 穴、９ 振動器 1 stage, 2 wafer, 3 chemical nozzle, 4 chamber, 6 top plate, 7 laser thickness measuring device, 8 holes, 9 vibrator

Claims (4)

ウエハを固定して回転するステージと、
前記ステージの上方から前記ウエハに薬液を供給する薬液ノズルと、
前記ステージ及び前記薬液ノズルを内包し、天板を有するチャンバーとを備え、
前記天板の下面は中央から外周に向かって下がる傾斜面であり、
前記天板には気流が通り抜ける複数の穴が設けられており、
前記穴の形状は、前記天板の前記下面の傾斜方向に長い楕円であることを特徴とする枚葉式スピンエッチャー。 A stage that fixes and rotates the wafer;
A chemical nozzle for supplying a chemical to the wafer from above the stage;
Including the stage and the chemical solution nozzle, and a chamber having a top plate,
The lower surface of the top plate is an inclined surface that descends from the center toward the outer periphery,
The top plate is provided with a plurality of holes through which airflow passes,
The single-wafer spin etcher characterized in that the hole has an ellipse that is long in the direction of inclination of the lower surface of the top plate. 前記天板の上面に設けられた振動器を更に備えることを特徴とする請求項１に記載の枚葉式スピンエッチャー。   The single wafer spin etcher according to claim 1, further comprising a vibrator provided on an upper surface of the top plate. 前記振動器は前記ウエハがステージの上に載っていない時に動作することを特徴とする請求項２に記載の枚葉式スピンエッチャー。   3. The single wafer spin etcher according to claim 2, wherein the vibrator operates when the wafer is not placed on a stage. 前記天板の下面に四角錐の凹部が設けられていることを特徴とする請求項１〜３の何れか１項に記載の枚葉式スピンエッチャー。   The single wafer spin etcher according to any one of claims 1 to 3, wherein a quadrangular pyramid recess is provided on a lower surface of the top plate.
JP2018091531A 2018-05-10 2018-05-10 Single-leaf spin etcher Active JP6965825B2 (en)

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