JP2019195032A - Electronic component mounting device - Google Patents

Abstract

To provide an electronic component mounting device that can improve the mounting accuracy of electronic components such as semiconductor chips even on thin substrates.SOLUTION: An electronic component mounting device 10 includes: a first block 11 provided with a first surface 11A on which a substrate B on which electronic components are mounted is placed, and a second surface 11B different from the first surface 11A; a heating unit 12 raising the temperature of the first block 11; and a second block 13 provided with a third surface 13A facing the second surface 11B. A through hole 16 having one end 16a opened on the first surface 11A and the other end 16b opened on the second surface 11B is disposed in the first block 11, and a recess 18 is formed on the surface of the third surface 13A, a suction tube 15 communicated with the recess 18 is provided, and a space S formed by the recess 18 through the suction tube 15 is set to a negative pressure.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component mounting apparatus.

  As an electronic component mounting step, for example, there is a step of assembling a package by mounting a semiconductor chip on a wiring board, a lead frame or the like (hereinafter simply referred to as a substrate). In this step, a bonding apparatus for bonding a semiconductor chip onto a substrate or a semiconductor chip that has already been bonded (mounted and bonded) using solder, gold plating, resin, or the like as a bonding material is used.

  Such a bonding apparatus includes a substrate stage on which a heater is disposed and a substrate is placed. When the semiconductor chip is mounted on the substrate via the adhesive, the mounted substrate is heated with a heater to melt the adhesive and pressurize the semiconductor chip to be mounted on the substrate (for example, , See Patent Document 1).

JP 2017-183378 A

  However, not only is the board thinner due to the downsizing of electronic equipment, but also the requirements for mounting accuracy of electronic components due to the increased mounting density of the board are becoming increasingly stringent. It is getting harder to meet.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic component mounting apparatus capable of improving the mounting accuracy of an electronic component such as a semiconductor chip even with a thin substrate.

The present invention employs the following means in order to solve the above problems.
An electronic component mounting apparatus according to the present invention includes a first base on which a first surface on which a substrate on which an electronic component is mounted is placed, and a second surface different from the first surface, and the first base A heating unit that raises the temperature of the substrate, and a second substrate on which a third surface opposite to the second surface is disposed, one end opened on the first surface and the other end opened on the second surface. A through-hole is disposed in the first base, and a recess is formed on at least one surface of the second surface or the third surface. The suction tube communicates with the recess, and the recess is interposed through the suction tube. The inner space is set to negative pressure.

  The electronic component mounting apparatus according to the present invention includes an elastic sealing member that maintains a negative pressure in the space in a state of being positioned around the recess, and an outer position than the arrangement position of the sealing member. A plurality of sealing member deterioration preventing portions that are spaced apart from each other and that protrude from the second surface or the third surface so that the tip faces the third surface or the second surface. The distance between the top of the sealing member deterioration preventing portion and the third surface or the second surface is greater than the maximum protruding height from the second surface or the third surface of the sealing member before elastic deformation. Formed short.

  In the electronic component mounting apparatus according to the present invention, a reference hole and a plurality of long holes are formed at positions outside the sealing member of the first base or the second base, and the reference hole and the long hole The long holes are formed such that projecting portions inserted through the second base or the first base are spaced apart from each other and the longitudinal direction of the long hole passes through the center of the reference hole.

  In the electronic component mounting apparatus according to the present invention, a groove connecting the opening portion of the through hole is disposed on the first surface of the first base.

  According to the present invention, it is possible to improve the mounting accuracy of an electronic component such as a semiconductor chip even with a thin substrate.

It is a top view which shows the outline | summary of the electronic component mounting apparatus which concerns on one Embodiment of this invention. It is a side view which shows the outline | summary of the electronic component mounting apparatus which concerns on one Embodiment of this invention. It is the C section enlarged view of FIG.

An embodiment according to the present invention will be described with reference to FIGS.
The electronic component mounting apparatus 10 according to the present embodiment is used when mounting an electronic component (not shown) supplied from an electronic component supply unit (not shown) on a board B as shown in FIGS. 1 and 2. It is. The electronic component mounting apparatus 10 includes a first block (first substrate) 11 on which the substrate B is placed, a plurality of heating units 12 that raise the temperature of the first block 11, and a first block 11 on which the first block 11 is placed. A two block (second base) 13 and a suction pipe 15 connected to the second block 13 are provided.

  The first block 11 is formed in a substantially rectangular parallelepiped shape, and includes a horizontal first surface 11A on which the substrate B is placed and a second surface 11B facing the second block 13 on the opposite side of the first surface 11A. It is arranged. The first block 11 is provided with a plurality of linear through holes 16 having one end 16a opened on the first surface 11A and the other end 16b opened on the second surface 11B. Although the second surface 11B has a partly stepped shape, it is formed in a flat shape as a whole. In the present embodiment, the through hole 16 is linearly formed in the direction of gravity, but the present invention is not limited to this and may be curved.

  On the first surface 11A of the first block 11, a groove 17 that connects the ends 16a of the through holes 16 is disposed at a position that is point-symmetric and line-symmetric with respect to the center C1 of the first surface 11A. When the substrate B is placed on the first surface 11 </ b> A, the adjacent through holes 16 are communicated with each other through an insertion passage formed by the substrate B and the groove 17.

  A main portion of the heating unit 12 extends between the through holes 16 in a direction substantially orthogonal to the through holes 16 and is embedded in the first block 11.

  The second block 13 is formed in a substantially rectangular parallelepiped shape, a third surface 13A facing the second surface 11B is arranged, a concave portion 18 is formed in the central portion of the third surface 13A, and a space S is formed in the concave portion 18. Has been. Around the recess 18, an elastic O-ring (sealing member) 20 and a plurality of O-ring deterioration preventing portions (sealing member deterioration preventing portions) 21 are arranged. Thereby, the space S is sealed by the second surface 11B and the O-ring 20.

  The O-ring deterioration preventing portions 21 are arranged so as to be spaced apart from each other further outside the position where the O-ring 20 is disposed and project from the third surface 13A. Here, as shown in FIG. 3, the distance H1 between the top portion 21A of the O-ring deterioration preventing portion 21 and the second surface 11B is greater than the maximum protruding height H2 from the third surface 13A of the O-ring 20 before elastic deformation. Is also formed short.

  Reference holes 22 and three long holes 23A, 23B, and 23C are formed at the four corners of the first block 11 facing the second block 13 at the outer position of the O-ring 20, respectively. Each of the long holes 23A, 23B, and 23C has a longitudinal center line L1, L2, and L3, respectively, and is formed so as to pass through the center C2 of the reference hole 22. In addition, shoulder bolts (projections) 25 inserted through the reference hole 22 and the long holes 23A, 23B, and 23C are spaced from each other and are erected at the four corners of the second block 13 outside the O-ring 20, respectively. . The hole diameter of the reference hole 22 corresponds to the diameter of the shoulder bolt 25, but the long holes 23A, 23B, and 23C are formed longer in the longitudinal directions L1, L2, and L3 than the normal hole diameter.

  One end of the suction pipe 15 opens into the recess 18 and communicates with the recess 18. The other end of the suction pipe 15 is connected to a vacuum pump P or the like, and the vacuum pump P is driven to make the inside of the space S sealed with the O-ring 20 a negative pressure.

  A heat insulating portion 26 is disposed around the first block 11 and the second block 13 excluding the first surface 11A of the first block 11. Further, the antistatic portion 27 of the substrate B is connected to the first block 11.

Next, the operation and effect of this embodiment will be described.
First, the substrate B before placing an electronic component (not shown) is placed on the first surface 11 </ b> A of the first block 11. And the vacuum pump P is driven and the inside of the recessed part 18 is made into a negative pressure to a predetermined pressure. At this time, the first block 11 and the second block 13 are more closely attached, and the O-ring 20 is further elastically deformed and contracts. However, if the first surface 11A contracts until the O-ring deterioration preventing portion 21 comes into contact, further contraction is restricted. In this way, the inside of the through hole 16 communicated with the recess 18 also becomes negative pressure, and the back surface of the substrate B is adsorbed to the first surface 11A.

  At this time, since the groove 17 is arranged on the first surface 11A, the substrate B is in close contact with the first surface 11A in a state where the area of the substrate B in close contact with the first surface 11A is smaller than in the case where there is no groove 17.

  When the electronic component is mounted on the board B, the heating unit 12 is heated to heat the first block 11 to a predetermined temperature. At this time, the first block 11 tends to thermally expand with respect to the second block 13. Here, since the hole diameter of the reference hole 22 corresponds to the hole diameter of the shoulder bolt 25, the first block 11 and the second block 13 are fixed at the position of the reference hole 22. That is, the first block 11 is thermally expanded starting from the reference hole 22.

  At this time, since the long holes 23A, 23B, and 23C of the first block 11 have room for the shoulder bolt 25 only in the longitudinal direction, the first block 11 is thermally expanded in the longitudinal direction of the long holes 23A, 23B, and 23C. To do. During this time, as the temperature of the substrate B rises, the adhesive adhering to the electronic component is melted and bonded to the substrate B.

  According to this electronic component mounting apparatus 10, since the concave portion 18 that is made negative pressure is provided, the substrate B is attracted to the first surface 11 </ b> A through the through hole 16 and fixed to the first block 11. be able to. Moreover, since the recessed part 18 is made into a negative pressure, the heat insulation of the recessed part 18 can be improved, and it can suppress that the heat | fever of the 1st block 11 escapes to the 2nd block 13 at the time of the heating by the heating part 12. it can.

  Further, a plurality of O-ring deterioration preventing portions 21 are arranged, and any of the protruding heights H1 is lower than the maximum protruding height H2 from the third surface 13A of the O-ring 20 before elastic deformation. Therefore, when the concave portion 18 is set to a negative pressure, the contact pressure between the first block 11 and the second block 13 is increased and the O ring 20 is deformed and crushed before the tip of the O ring deterioration preventing portion 21 is The O-ring 20 can be prevented from being crushed and the deterioration speed of the O-ring 20 can be regulated.

  Further, the long holes 23A, 23B, and 23C are arranged in the first block 11, and the longitudinal center lines L1, L2, and L3 of the long holes 23A, 23B, and 23C are formed so as to pass through the reference hole 22. Therefore, when the first block 11 is heated and thermally deformed with respect to the second block 13, the long holes 23 </ b> A, 23 </ b> B, and 23 </ b> C can freely move with respect to the shoulder bolt 25. The generation of the internal thermal stress is restricted, and the flatness of the first surface 11A can be maintained.

  In addition, since the groove 17 is formed on the first surface 11A, the contact area between the substrate B and the first surface 11A can be reduced, the generation of bubbles between the substrate B and the first surface 11A, and the substrate B It is possible to regulate the occurrence of wrinkles on the substrate B by regulating the displacement due to the difference in thermal expansion coefficient between the first block 11 and the first block 11.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above embodiment, the first block 11 and the second block 13 are both formed in a substantially rectangular parallelepiped shape, but the shape is not limited to this, and the first surface 11A, the second surface 11B, and the third surface 13A. Any shape that can be formed is acceptable.

  Further, although the recess 18 is formed on the third surface 13A of the second block 13, it may be formed on the second surface of the first block. Furthermore, you may form the recessed part in both the 2nd surface and the 3rd surface.

  In addition, the O-ring deterioration preventing portion 21 is arranged to protrude from the third surface 13A side, but is not limited thereto, and is arranged to protrude from the second surface 11B side and contact the third surface 13A. It doesn't matter. The O-ring 20 may be arranged not on the third surface 13A side but on the second surface side.

  In addition, the reference hole 22 and the plurality of long holes 23A, 23B, and 23C are formed in the first block 11, and the shoulder bolt 25 is arranged in the first block 11, but the reference hole 22 and the plurality of long holes 23A, 23B, and 23C may be formed on the second block side, and the shoulder bolt 25 may be disposed on the first block. Further, the position of the groove 17 formed on the first surface 11A, that is, the through hole 16 communicated by the groove 17 may be any through hole 16, and the arrangement pattern of the groove 17 on the first surface 11A is that of this embodiment. Not limited to.

  The second block 13 may be formed with another recess different from the recess 18 on the surface 13B opposite to the third surface 13A. In this case, the warp of the second block 13 can be restricted when the inside of the space S becomes negative pressure by the suction pipe 15.

10 Electronic Component Mounting Device 11 First Block (First Base)
11A 1st surface 11B 2nd surface 12 Heating part 13 2nd block (2nd base | substrate)
13A Third surface 15 Suction tube 16 Through hole 16a One end 16b The other end 17 Groove 18 Recess 20 O-ring (sealing member)
21 O-ring deterioration prevention part (sealing member deterioration prevention part)
21A Top 22 Reference hole 23A, 23B, 23C Long hole 25 Shoulder bolt S Space

The present invention employs the following means in order to solve the above problems.
An electronic component mounting apparatus according to the present invention includes a first base on which a first surface on which a substrate on which an electronic component is mounted is placed, and a second surface different from the first surface, and the first base A heating unit that raises the temperature of the substrate, and a second substrate on which a third surface opposite to the second surface is disposed, one end opened on the first surface and the other end opened on the second surface. A through-hole is disposed in the first base, and a recess is formed on at least one surface of the second surface or the third surface. The suction tube communicates with the recess, and the recess is interposed through the suction tube. An elastic sealing member that maintains a negative pressure in the space in a state in which the inner space is set to a negative pressure and is positioned around the recess, and is spaced apart from the position where the sealing member is disposed. And a tip projecting from the second surface or the third surface is arranged to face the third surface or the second surface. A plurality of sealing member deterioration preventing portions, and the distance between the top of the sealing member deterioration preventing portion and the third surface or the second surface is the second of the sealing member before elastic deformation. than the maximum protrusion height from the surface or the third surface Ru is shorter.

Claims (4)

A first base on which a first surface on which a substrate on which electronic components are mounted is placed and a second surface different from the first surface are arranged;
A heating section for raising the temperature of the first substrate;
A second substrate on which a third surface facing the second surface is disposed;
With
A through hole having one end opened on the first surface and the other end opened on the second surface is arranged in the first base,
A recess is formed on at least one surface of the second surface or the third surface,
A suction tube communicated with the recess,
An electronic component mounting apparatus in which a space in the concave portion is set to a negative pressure through the suction pipe. An elastic sealing member that maintains a negative pressure in the space in a state of being located around the recess;
The sealing member is arranged so as to be separated from each other at a position outside the arrangement position of the sealing member, and protrudes from the second surface or the third surface so that the tip faces the third surface or the second surface. A plurality of sealing member deterioration preventing portions;
With
The distance between the top of the sealing member deterioration preventing portion and the third surface or the second surface is shorter than the maximum protruding height from the second surface or the third surface of the sealing member before elastic deformation. The electronic component mounting apparatus according to claim 1, which is formed. A reference hole and a plurality of long holes are formed at positions outside the sealing member of the first base or the second base,
Protrusions respectively inserted into the reference hole and the long hole are spaced apart from each other and arranged on the second base or the first base,
The electronic component mounting apparatus according to claim 1, wherein the long hole is formed so that a longitudinal direction of the long hole passes through a center of the reference hole. The electronic component mounting apparatus according to any one of claims 1 to 3, wherein a groove that connects an opening portion of the through hole is disposed on the first surface of the first base.

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