JP2019187526A - Ultrasonic probe and ultrasonic diagnostic apparatus - Google Patents

Abstract

To provide an ultrasonic probe and an ultrasonic diagnostic apparatus capable of suppressing the propagation of vibration in an integrated circuit.SOLUTION: An ultrasonic probe includes a plurality of vibration elements and a transmission/reception circuit. In the transmission/reception circuit, a groove is formed at a position corresponding to a gap between the vibration elements on a first surface arranged on the side of the plurality of vibration elements, and at least one of a circuit for driving the plurality of vibration elements and a circuit for executing signal processing to an echo signal generated in the plurality of vibration elements is formed on a second surface, which is the back of the first surface.SELECTED DRAWING: Figure 3A

Description

  Embodiments described herein relate generally to an ultrasonic probe and an ultrasonic diagnostic apparatus.

  Conventionally, an ultrasonic probe in which an integrated circuit such as an ASIC (application specific integrated circuit) having a function of transmitting and receiving ultrasonic waves is built in the vicinity of an ultrasonic transducer is known. For example, in the case of a two-dimensional array probe in which ultrasonic transducers are arranged in a lattice pattern, such an ultrasonic probe performs a delay addition process on received signals from a certain number of ultrasonic transducers, thereby diagnosing. The number of signals transferred to the device can be reduced. Such an ultrasonic probe can also have a function of digitizing a received signal or a function of reducing signal loss during reception.

  Here, as the integrated circuit incorporated in the ultrasonic probe, for example, an integrated circuit of active circuits formed on a silicon wafer is used. The integrated circuit, for example, gives an electrical pulse for transmission with an appropriate delay to the ultrasonic transducer, or receives the signal reflected from the subject and received by the ultrasonic transducer and converted into an electrical signal. And a delay addition process is performed on a certain number of received signals.

JP 2011-004395 A Special table 2008-509775 gazette JP 2006-094120 A

  The problem to be solved by the present invention is to provide an ultrasonic probe and an ultrasonic diagnostic apparatus that can suppress propagation of vibration in an integrated circuit.

  The ultrasonic probe according to the embodiment includes a plurality of vibration elements and an integrated circuit. In the integrated circuit, a groove is formed at a position corresponding to the gap between the vibration elements on the first surface disposed on the plurality of vibration elements, and the second surface, which is the back surface of the first surface, At least one of a circuit that drives the plurality of vibration elements and a circuit that performs signal processing on echo signals generated by the plurality of vibration elements is formed.

FIG. 1 is a diagram for explaining the overall configuration of the ultrasonic diagnostic apparatus according to the first embodiment. FIG. 2A is a diagram for explaining an ultrasonic probe according to a conventional technique. FIG. 2B is a diagram for explaining an ultrasonic probe according to a conventional technique. FIG. 2C is a diagram for explaining an ultrasonic probe according to a conventional technique. FIG. 3A is a diagram illustrating an example of the configuration of the ultrasonic probe according to the first embodiment. FIG. 3B is a diagram illustrating an example of the configuration of the ultrasonic probe according to the first embodiment. FIG. 3C is a diagram illustrating an example of the configuration of the ultrasonic probe according to the first embodiment. FIG. 4 is a view for explaining a groove according to the first embodiment. FIG. 5A is a diagram for explaining an example of the ultrasonic probe according to the first embodiment. FIG. 5B is a diagram for explaining an example of the ultrasonic probe according to the first embodiment. FIG. 6 is a diagram illustrating an example of the configuration of an ultrasonic probe according to the second embodiment.

(First embodiment)
First, the overall configuration of an ultrasonic diagnostic apparatus to which the ultrasonic probe according to the first embodiment is connected will be described with reference to FIG. FIG. 1 is a diagram for explaining the overall configuration of the ultrasonic diagnostic apparatus according to the first embodiment. As shown in FIG. 1, the ultrasonic diagnostic apparatus 1 according to the first embodiment includes an ultrasonic probe 100, an apparatus main body 200, an input unit 210, and a display 220.

  The ultrasonic probe 100 has a main body held by an operator and a cable for transmitting and receiving signals between the apparatus main body 200 and is detachably connected to the apparatus main body 200 by a connector or the like. As shown in FIG. 1, the ultrasonic probe 100 includes a transmission / reception circuit 110 in the main body, and transmits and receives ultrasonic waves. For example, the ultrasonic probe 100 includes a plurality of ultrasonic transducers, and the plurality of ultrasonic transducers generate ultrasonic waves based on a drive signal supplied from the transmission / reception circuit 110. The ultrasonic probe 100 receives a reflected wave from the subject P and converts it into an electrical signal. In addition, the ultrasonic probe 100 includes a matching layer provided in the ultrasonic transducer, a backing material that prevents propagation of ultrasonic waves from the ultrasonic transducer to the rear, and the like.

  For example, when ultrasonic waves are transmitted from the ultrasonic probe 100 to the subject P, the transmitted ultrasonic waves are reflected one after another on the discontinuous surface of the acoustic impedance in the in-vivo tissue of the subject P, and are reflected as reflected wave signals. The signals are received by a plurality of ultrasonic transducers included in the acoustic probe 100. The amplitude of the received reflected wave signal depends on the difference in acoustic impedance at the discontinuous surface where the ultrasonic wave is reflected. Note that the reflected wave signal when the transmitted ultrasonic pulse is reflected by the moving blood flow or the surface of the heart wall depends on the velocity component of the moving object in the ultrasonic transmission direction due to the Doppler effect. And undergoes a frequency shift.

  Here, the ultrasound probe 100 according to the first embodiment is an ultrasound probe capable of scanning the subject P in two dimensions with ultrasound and scanning the subject P in three dimensions. Specifically, in the ultrasonic probe 100 according to the first embodiment, a plurality of ultrasonic transducers are arranged in a matrix so that the subject P can be ultrasonically scanned in three dimensions. It is a probe. Note that the 2D probe can also scan the subject P in two dimensions by focusing and transmitting ultrasonic waves.

  The transmission / reception circuit 110 includes a pulse generator, a transmission delay circuit, a pulser, and the like, and supplies a drive signal to the ultrasonic transducer. The pulse generator repeatedly generates rate pulses for forming transmission ultrasonic waves at a predetermined rate frequency. The transmission delay circuit also focuses the ultrasonic wave generated from the ultrasonic transducer into a beam, and the pulse generator generates the delay time for each ultrasonic transducer necessary to determine the transmission directivity. Is given for each rate pulse. The pulser applies a drive signal (drive pulse) to the ultrasonic transducer at a timing based on the rate pulse. That is, the transmission delay unit arbitrarily adjusts the transmission direction of the ultrasonic wave transmitted from the ultrasonic transducer surface by changing the delay time given to each rate pulse.

  The transmission / reception circuit 110 has a function capable of instantaneously changing a transmission frequency, a transmission drive voltage, and the like in order to execute a predetermined scan sequence based on an instruction from a processing circuit 270 described later. In particular, the change of the transmission drive voltage is realized by a linear amplifier type transmission circuit capable of instantaneously switching the value or a mechanism for electrically switching a plurality of power supply units.

  The transmission / reception circuit 110 includes a preamplifier, an A / D (Analog / Digital) converter, a reception delay unit, an adder, and the like. The transmission / reception circuit 110 performs various processing on the reflected wave signal received by the ultrasonic transducer and reflects it. Generate wave data. The preamplifier amplifies the reflected wave signal for each channel. The A / D converter A / D converts the amplified reflected wave signal. The reception delay circuit provides a delay time necessary for determining the reception directivity. The adder performs an addition process of the reflected wave signal processed by the reception delay circuit to generate reflected wave data. By the addition processing of the adder, the reflection component from the direction corresponding to the reception directivity of the reflected wave signal is emphasized, and a comprehensive beam for ultrasonic transmission / reception is formed by the reception directivity and the transmission directivity. The form of the output signal from the transmission / reception circuit 110 can be selected from various forms such as a signal including phase information called an RF (Radio Frequency) signal or amplitude information after envelope detection processing. Is possible.

  The input unit 210 includes a mouse, a keyboard, a button, a panel switch, a touch command screen, a foot switch, a trackball, a joystick, and the like, receives various setting requests from an operator of the ultrasonic diagnostic apparatus 1, and enters the apparatus main body 200. The various setting requests received are transferred.

  The display 220 displays a GUI (Graphical User Interface) for the operator of the ultrasound diagnostic apparatus 1 to input various setting requests using the input unit 210, and displays various image data generated in the apparatus main body 200. Or display.

  The apparatus main body 200 includes a B-mode processing circuit 230, a Doppler processing circuit 240, an image memory 250, a storage circuit 260, and a processing circuit 270, as shown in FIG. In the ultrasonic diagnostic apparatus 1 shown in FIG. 1, each processing function is stored in the storage circuit 260 in the form of a program that can be executed by a computer. The transmission / reception circuit 110, the B-mode processing circuit 230, the Doppler processing circuit 240, and the processing circuit 270 are processors that realize functions corresponding to each program by reading the program from the storage circuit 260 and executing it. In other words, each circuit that has read each program has a function corresponding to the read program.

  The term “processor” used in the above description is, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an application specific integrated circuit (ASIC), a programmable logic device ( For example, it means circuits such as a simple programmable logic device (SPLD), a complex programmable logic device (CPLD), and a field programmable gate array (FPGA). The function is realized by reading and executing the program stored in the memory circuit, but the program may be directly incorporated in the processor circuit instead of storing the program in the memory circuit. In this case, the processor realizes the function by reading and executing the program incorporated in the circuit, but each processor of this embodiment is not limited to being configured as a single circuit for each processor, Independent circuits may be combined to form a single processor that implements its function.

  The B-mode processing circuit 230 receives the reflected wave data from the transmission / reception circuit 110, performs logarithmic amplification, envelope detection processing, etc., and generates data (B-mode data) in which the signal intensity is expressed by brightness. .

  The Doppler processing circuit 240 performs frequency analysis on velocity information from the reflected wave data received from the transmission / reception circuit 110, extracts blood flow, tissue, and contrast agent echo components due to the Doppler effect, and obtains moving body information such as velocity, dispersion, and power. Data extracted for multiple points (Doppler data) is generated. The moving body according to the present embodiment is a fluid such as blood flowing in a blood vessel or lymph fluid flowing in a lymph vessel.

  Note that the B-mode processing circuit 230 and the Doppler processing circuit 240 according to the first embodiment can process both two-dimensional reflected wave data and three-dimensional reflected wave data. That is, the B-mode processing circuit 230 generates two-dimensional B-mode data from the two-dimensional reflected wave data, and generates three-dimensional B-mode data from the three-dimensional reflected wave data. The Doppler processing circuit 240 generates two-dimensional Doppler data from the two-dimensional reflected wave data, and generates three-dimensional Doppler data from the three-dimensional reflected wave data. The three-dimensional B-mode data is data to which a luminance value corresponding to the reflection intensity of the reflection source located at each of a plurality of points (sample points) set on each scanning line in the three-dimensional scanning range is assigned. In the three-dimensional Doppler data, a luminance value corresponding to the value of blood flow information (speed, dispersion, power) is assigned to each of a plurality of points (sample points) set on each scanning line in the three-dimensional scanning range. Data.

  The image memory 250 is a memory for storing display image data generated by a processing circuit 270 described later. The image memory 250 can also store data generated by the B-mode processing circuit 230 and the Doppler processing circuit 240. The B mode data and Doppler data stored in the image memory 250 can be called by an operator after diagnosis, for example, and become ultrasonic image data for display via the processing circuit 270.

  The storage circuit 260 stores a control program for performing ultrasonic transmission / reception, image processing, and display processing, diagnostic information (for example, patient ID, doctor's findings, etc.), various data such as a diagnostic protocol and various body marks. . The storage circuit 260 is also used for storing image data stored in the image memory 250 as necessary. Further, data stored in the storage circuit 260 can be transferred to an external device via an interface (not shown).

  The processing circuit 270 controls the entire processing of the ultrasonic diagnostic apparatus 1. Specifically, the processing circuit 270 performs various processes by reading out the programs corresponding to the image generation function 271 and the control function 272 shown in FIG. 1 from the storage circuit 260 and executing them.

  The image generation function 271 generates ultrasonic image data from the data generated by the B mode processing circuit 230 and the Doppler processing circuit 240. That is, the image generation function 271 generates B-mode image data in which the intensity of the reflected wave is expressed by luminance from the two-dimensional B-mode data generated by the B-mode processing circuit 230. The B-mode image data is data in which the tissue shape in the ultrasonically scanned region is depicted. The image generation function 271 generates Doppler image data representing moving body information from the two-dimensional Doppler data generated by the Doppler processing circuit 240. The Doppler image data is velocity image data, distributed image data, power image data, or image data obtained by combining these. The Doppler image data is data indicating fluid information regarding the fluid flowing in the ultrasonically scanned region.

  Here, the image generation function 271 generally converts (scan converts) a scanning line signal sequence of ultrasonic scanning into a scanning line signal sequence of a video format typified by a television or the like, and displays ultrasonic waves for display. Generate image data. Specifically, the image generation function 271 generates ultrasonic image data for display by performing coordinate conversion in accordance with the ultrasonic scanning mode of the ultrasonic probe 100. In addition to the scan conversion, the image generation function 271 includes various image processes such as an image process (smoothing process) for regenerating an average brightness image using a plurality of image frames after the scan conversion, Image processing (edge enhancement processing) using a differential filter is performed in the image. Further, the image generation function 271 synthesizes character information, scales, body marks, and the like of various parameters with the ultrasonic image data.

  That is, the B-mode data and the Doppler data are ultrasonic image data before the scan conversion process, and the data generated by the image generation function 271 is the display ultrasonic image data after the scan conversion process. The B-mode data and the Doppler data are also called raw data (Raw Data).

  Further, the image generation function 271 generates three-dimensional B-mode image data by performing coordinate conversion on the three-dimensional B-mode data generated by the B-mode processing circuit 230. The image generation function 271 generates three-dimensional Doppler image data by performing coordinate conversion on the three-dimensional Doppler data generated by the Doppler processing circuit 240. The three-dimensional B-mode data and the three-dimensional Doppler image data are volume data before the scan conversion process. That is, the image generation function 271 generates “three-dimensional B-mode image data or three-dimensional Doppler image data” as “volume data that is three-dimensional ultrasound image data”.

  Further, the image generation function 271 performs a rendering process on the volume data in order to generate various two-dimensional image data for displaying the volume data on the display 220. The rendering processing performed by the image generation function 271 includes processing for generating MPR image data from volume data by performing a cross-section reconstruction method (MPR: Multi Planer Reconstruction). The rendering processing performed by the image generation function 271 includes processing for performing “Curved MPR” on volume data and processing for performing “Maximum Intensity Projection” on volume data. The rendering processing performed by the image generation function 271 includes volume rendering (VR) processing that generates two-dimensional image data reflecting three-dimensional information.

  The control function 272 executes various controls in the entire apparatus described above. For example, the control function 272 is based on various setting requests input from the operator via the input unit 210 and various data read from the storage circuit 260, the transmission / reception circuit 110, the B-mode processing circuit 230, and the Doppler processing circuit 240. Control the processing. The control function 272 controls the display 220 to display the ultrasonic image data for display stored in the image memory 250 and the storage circuit 260.

  The overall configuration of the ultrasonic diagnostic apparatus 1 according to the first embodiment has been described above. With this configuration, the ultrasonic probe and the ultrasonic diagnostic apparatus according to the first embodiment can reduce vibration in the integrated circuit. Specifically, the ultrasonic probe 100 is configured to suppress propagation of vibration in the transmission / reception circuit 110.

  Here, first, vibrations in the transmission / reception circuit arranged in the ultrasonic probe will be described with reference to FIGS. 2A to 2C. 2A to 2C are views for explaining an ultrasonic probe according to a conventional technique. Here, in FIG. 2A and FIG. 2B, it is a figure which shows the prior art example which has arrange | positioned the transmission / reception circuit in the main-body part of an ultrasonic probe, and shows sectional drawing inside a main-body part. Moreover, in FIG. 2C, it is a figure which shows an example of the vibration transmitted through the transmission / reception circuit arrange | positioned at the ultrasonic probe.

  For example, in a conventional ultrasonic probe, as shown in FIG. 2A, gold bumps 130a are installed on a circuit formation surface (active surface) on which a circuit for transmitting and receiving ultrasonic waves is stacked in a transmission / reception circuit 110a. Signal wiring is performed by conducting conductive bonding with the signal electrode of the sonic transducer 120a. In the conventional ultrasonic probe shown in FIG. 2A, a signal is extracted from the transmission / reception circuit 110a to the substrate (for example, FPC: Flexible Printed Circuits) 140a by the wire bonding 160a outside the region of the ultrasonic transducer. In the conventional ultrasonic probe shown in FIG. 2A, the back material 150a is disposed on the base material surface (surface facing the active surface) side of the transmission / reception circuit 110a.

  Further, for example, in the conventional ultrasonic probe, as shown in FIG. 2B, the substrate 140a is provided with a through electrode 170a that conducts both surfaces through independent through holes, and the signal electrode of the ultrasonic transducer 120a and the transmission / reception circuit 110a. A signal wiring is performed by conductively joining the active surface of the first through the through electrodes 170a. In the conventional ultrasonic probe shown in FIG. 2B, the back material 150a is disposed on the base material side of the transmission / reception circuit 110a.

  Such a conventional ultrasonic probe has an advantage that the signal is hardly deteriorated because the length of the wiring is short. However, since the base material of the transmission / reception circuit 110a has low acoustic attenuation, the vibration generated by the ultrasonic transducer is not attenuated, and is localized in the transmission / reception circuit 110a. For example, in the conventional ultrasonic probe, as shown in FIG. 2C, the vibration generated by the ultrasonic transducer 120a during transmission of the ultrasonic wave is transmitted at a constant ratio in the direction of the arrow 60 in the figure, and the transmission / reception circuit 110a. Is transmitted in the direction of arrows 61 and 62.

  Here, the base material forming the transmission / reception circuit 110a is, for example, a silicon single crystal, and has a longitudinal wave sound velocity of about 5500 m / sec and almost no attenuation. Therefore, the vibration propagated to the transmission / reception circuit 110a repeats reflection inside and becomes localized. A part of this standing vibration returns to the ultrasonic transducer 120a and appears as noise on the image, so this vibration is unnecessary vibration. In particular, when the transmission timing is changed for each element in order to change the ultrasonic beam in a certain direction, the delay time given between the element A and the element B and the transmission / reception circuit that enters the transmission / reception circuit 110a from the element A At an angle at which the transmission times reflected on the back surface of 110a and reaching the element B coincide with each other, unnecessary vibrations strongly appear due to the resonance phenomenon.

  Conventionally, in order to avoid this, a method of making the transmission / reception circuit itself very thin (50 to 100 μm) is used. Normally, the thickness of the transmission / reception circuit 110a is about 500 μm, but it can be reduced to 100 μm or less by a technique of grinding the back surface (base material surface) of the transmission / reception circuit 110a. However, in the case of a grounded transmitter / receiver circuit, it becomes fragile, so a special back load material with high hardness and high flatness on the base material side and high attenuation to absorb the radiation energy to the back surface is required. It becomes. Moreover, since grinding is performed, an extra step is required, which causes an increase in cost.

  Furthermore, since it is necessary to perform the output of the received signal and the input of the power source and the control signal at the acoustic invalid portion, when the above-described method is used, the total area as the ultrasonic probe is increased. Therefore, in the present embodiment, an ultrasonic wave that uses a transmission / reception circuit having a normal thickness, inhibits unnecessary vibration transmission in the surface direction, and minimizes the area of the acoustically ineffective portion required for signal input / output. Provide the structure of the probe.

  3A to 3C are diagrams illustrating an example of the configuration of the ultrasonic probe 100 according to the first embodiment. Here, FIG. 3A shows a cross-sectional view of the inside of the main body of the ultrasonic probe 100. FIG. 3B shows an external view of the transmission / reception circuit 110. 3C shows a top view of the transmission / reception circuit 110. FIG. 3A to 3C show a part of the main body of the ultrasonic probe 100. FIG.

  For example, as shown in FIG. 3A, the ultrasonic probe 100 includes a transmission / reception circuit (for example, ASIC) 110, an ultrasonic transducer 120, a bump 180, a substrate (for example, FPC) 140, and a back material (for example). Backing material) 150.

  The ultrasonic transducer 120 is, for example, PZT (lead zirconate titanate), and has electrodes facing the acoustic radiation surface side (upper side in the figure) and the back side (lower side in the figure), and is used for transmission and reception. Ultrasound is transmitted and received under the control of the circuit 110. In the ultrasonic probe 100 according to this embodiment, an ultrasonic transducer group in which the ultrasonic transducers 120 are arranged in a two-dimensional matrix is formed. In addition, on the acoustic radiation surface side of the ultrasonic transducer 120, an acoustic matching layer that relaxes the mismatch of acoustic impedance between the ultrasonic transducer and the subject, a contact member with the subject, and the like are further provided. It is done.

  As shown in FIG. 3A, the transmission / reception circuit 110 includes a base 111 formed of a silicon single crystal or the like, and a circuit layer 112 on which circuits for controlling transmission / reception of ultrasonic waves are stacked. Here, the transmission / reception circuit 110 according to the first embodiment is disposed in the gap between the ultrasonic transducers 120 on the first surface (surface on the base material 111 side) arranged on the plurality of ultrasonic transducers 120 side. A groove 113 is formed at a corresponding position, and a circuit that drives the plurality of ultrasonic transducers 120 and a plurality of ultrasonic transducers 120 are formed on a second surface (surface on the circuit layer side) that is the back surface of the first surface. At least one of the circuits for performing signal processing on the echo signal generated in step (b) is formed.

  That is, in the transmission / reception circuit 110, as shown in FIG. 3A, the acoustic radiation surface side (the ultrasonic transducer 120 side) is the base material 111, and the back surface side is the circuit layer 112. In the transmission / reception circuit 110, a groove 113 is formed in the base 111 as shown in FIG. 3A. Here, the groove 113 is provided so that a space is formed between positions where the ultrasonic transducer 120 is disposed on the base material 111. For example, the groove 113 is formed at a position corresponding to the gap between the ultrasonic transducers 120 as shown in FIG. 3A. That is, the groove 113 is formed to have the same width as the gap between the ultrasonic transducers 120 and a depth that does not reach the circuit layer 112.

  Furthermore, the transmission / reception circuit 110 includes a through electrode 114 to electrically connect the signal electrode of each ultrasonic transducer 120 and the circuit corresponding to each ultrasonic transducer 120 stacked on the circuit layer 112. . For example, as shown in FIG. 3A, a through electrode 114 that penetrates through the base material 111 is formed so as to connect the signal electrode of each ultrasonic transducer 120 and the circuit layer 112.

  In the ultrasonic probe 100 according to the first embodiment, the substrate 140 is disposed on the surface on the circuit layer 112 side, and the input to the circuit formed in the transmission / reception circuit 110 and the circuit formed in the transmission / reception circuit 110 are performed. At least one of the outputs is executed. That is, the I / O substrate 140 is arranged on the circuit layer 112 side of the transmission / reception circuit 110. Here, the transmission / reception circuit 110 is flip-chip mounted on the substrate 140. For example, as shown in FIG. 3A, the transmission / reception circuit 110 and the substrate 140 are connected via bumps 180 formed in a region including directly below the ultrasonic transducer 120. The substrate 140 is connected to a signal line included in a cable for connecting to the apparatus main body 200. Further, the backing material 150 attenuates and absorbs the ultrasonic waves from the ultrasonic transducer 120 to the rear, thereby preventing the ultrasonic waves from propagating backward.

  As described above, in the ultrasonic probe 100 according to the present embodiment, the transmission / reception circuit 110 is disposed so that the base 111 of the transmission / reception circuit 110 is on the ultrasonic vibrator 120 side, and the ultrasonic vibrator in the base 111 is provided. A groove 113 is formed at a position corresponding to 120. That is, in the transmission / reception circuit 110, as shown in FIGS. 3B and 3C, the grooves 113 are respectively provided between the plurality of through electrodes 114 provided on the base 111. Therefore, even if vibration is transmitted from the ultrasonic transducer 120 and propagates in the base material 111 in the lateral direction, unnecessary vibration transmitted to the adjacent ultrasonic transducer 120 can be attenuated, and noise in the image is reduced. be able to.

  Here, the groove 113 is desirably formed to a deeper position in order to further suppress the propagation of unnecessary vibration. FIG. 4 is a view for explaining the groove 113 according to the first embodiment. Here, FIG. 4 shows a cross-sectional view of the transmission / reception circuit 110. For example, the groove 113 is formed to a depth of 0.1 mm or less from the surface on the circuit layer 112 side. That is, the groove 113 is formed to such a depth that the distance “a” shown in FIG. 4 is 0.1 mm or less. Thereby, propagation of an unnecessary vibration wave within the ultrasonic band (-10 MHz) can be reliably inhibited.

  Hereinafter, an example of the ultrasonic probe 100 will be described with reference to FIGS. 5A and 5B. 5A and 5B are views for explaining an example of the ultrasonic probe 100 according to the first embodiment. Here, FIGS. 5A and 5B are cross-sectional views of the inside of the main body of the ultrasonic probe 100. FIG. For example, in the ultrasonic probe 100, as shown in FIG. 5A, the circuit 112a of the transmission / reception circuit 110 is disposed on the back side. In the transmission / reception circuit 110, a through electrode 114 that connects the signal electrode of the ultrasonic transducer 120 and the circuit 112 a is provided on the base material 111, and is flip-chip bonded to a substrate 140 such as an FPC by a bump 180.

  Here, since the reception signal received by the ultrasonic transducer 120 is partly delayed and added by the transmission / reception circuit, the number of signal connections may be smaller than the number of the ultrasonic transducers 120. Accordingly, the bumps 180 may be disposed in the gaps of the circuit 112a as shown in FIG. 5A. An underfill material 190 is filled between the transmission / reception circuit 110 and the substrate 140.

  In the transmission / reception circuit 110, a groove 113 is formed in the base material 111. Here, for example, as shown in FIG. 5A, when the groove 113 is formed with the same width as the divided groove of the ultrasonic transducer 120, the groove 113 is formed when the ultrasonic transducer 120 is divided. Also good. That is, when the ultrasonic transducer 120 is cut by a diamond blade or the like, the groove 113 may be formed by cutting all the way to the middle of the base material 111 of the transmission / reception circuit 110.

  The formation of the groove 113 is not limited to the collective cutting method described above, and may be formed in two stages. For example, after the ultrasonic transducer 120 is cut once, a groove having a width different from the width of the divided groove of the ultrasonic transducer 120 may be formed on the base 111 of the transmission / reception circuit 110. . Alternatively, for example, the ultrasonic transducer 120 may be stacked and cut after the groove 113 is formed on the base material 111 of the transmission / reception circuit 110.

  Further, the ultrasonic probe 100 is not limited to the configuration described above. For example, as shown in FIG. 5B, a bump 181 is disposed between the ultrasonic transducer 120 and the transmission / reception circuit 110, and the connection between the signal electrode of the ultrasonic transducer 120 and the through electrode 114 is made via the bump 181. May be performed. In this case, an underfill material 191 is filled between the transmission / reception circuit 110 and the ultrasonic transducer 120. By connecting the bumps 181 in this way, the connection between the signal electrode of the ultrasonic transducer 120 and the through electrode 114 can be easily ensured.

  As described above, according to the first embodiment, the transmission / reception circuit 110 corresponds to the gap between the ultrasonic transducers 120 on the surface of the base material 111 side disposed on the plurality of ultrasonic transducers 120 side. A groove is formed at a position, and a circuit for driving the plurality of ultrasonic transducers 120 and an echo signal generated by the plurality of ultrasonic transducers 120 are formed on the surface on the circuit layer 112 side which is the back surface of the surface on the base material 111 side. At least one of the circuits for performing signal processing is formed. Therefore, the ultrasonic probe 100 according to the first embodiment can suppress propagation of unnecessary vibrations in the surface direction of the base 111 of the transmission / reception circuit 110 without changing the thickness of the transmission / reception circuit 110 itself. As a result, the ultrasonic probe 100 can suppress deterioration of the ultrasonic image due to unnecessary vibration.

  Further, according to the first embodiment, the groove 113 is formed at a position corresponding to the gap between the vibration elements. Therefore, the ultrasonic probe 100 according to the first embodiment can form the groove 113 by extending the dividing groove of the ultrasonic transducer 120 and can be easily realized.

  Further, according to the first embodiment, the substrate 140 is disposed on the circuit layer 112 side, and at least one of the input to the circuit formed in the transmission / reception circuit 110 and the output from the circuit formed in the transmission / reception circuit 110 is received. Then, the circuit side surface of the transmission / reception circuit 110 is flip-chip mounted on the substrate 140. The substrate 140 is a flexible printed board. In addition, an electrical connection portion between the transmission / reception circuit 110 and the substrate 140 is formed in a region including directly below the ultrasonic transducer 120. Therefore, the ultrasonic probe 100 according to the first embodiment can use the acoustically effective portion (vibrator effective portion) for signal extraction, and can reduce the size of the probe. As a result, an easy-to-operate ultrasonic probe can be provided, and costs can be reduced. Note that the above-described acoustic effective portion (vibrator effective portion) means a portion in the ultrasonic transducer 120 that is electrically connected to the transmission / reception circuit 110 and the received reflected wave is reflected in the image.

  Further, according to the first embodiment, the groove 113 is formed to a depth of 0.1 mm or less from the surface on the circuit layer 112 side. Therefore, the ultrasonic probe 100 according to the first embodiment can further suppress the propagation of unnecessary vibration.

  Further, according to the first embodiment, the plurality of ultrasonic transducers 120 are arranged in a substantially lattice shape, and the grooves 113 are arranged in a substantially lattice shape. Therefore, the ultrasonic probe 100 according to the first embodiment can comprehensively suppress the propagation of unnecessary vibration between adjacent ultrasonic transducers in the two-dimensional array probe.

  Further, according to the first embodiment, electrodes connected to the plurality of ultrasonic transducers 120 are formed on the surface on the base material 111 side, and the circuits formed on the electrodes and the circuit layer 112 side pass through. The electrodes 114 are connected. Therefore, the ultrasonic probe 100 according to the first embodiment can reliably ensure connection.

(Second Embodiment)
Although the first embodiment has been described so far, the present invention may be implemented in various different forms other than the first embodiment described above.

  In the above-described first embodiment, the case where the groove 113 is formed with the same width as the divided groove of the ultrasonic transducer 120 has been described. However, the embodiment is not limited to this. For example, the groove 113 may be formed with a width different from that of the divided groove of the ultrasonic transducer 120. FIG. 6 is a diagram illustrating an example of the configuration of an ultrasonic probe according to the second embodiment. Here, FIG. 6 differs from FIG. 3A only in the groove 113. Hereinafter, this will be mainly described.

  For example, the groove 113 according to the second embodiment may be formed with a width narrower than the division groove of the ultrasonic transducer 120 as shown in FIG. Further, the groove 113 can be formed not only in the example shown in FIG. 6 but also in various forms. For example, the groove 113 may be formed with a width wider than the divided groove of the ultrasonic transducer 120, or may be formed at a position shifted from the position of the divided groove. That is, in the base material 111, the groove 113 may be formed in any form as long as the groove 113 is formed so that a space is generated in the base material portion between the ultrasonic transducers 120.

  As described above, according to the first and second embodiments, the ultrasonic probe and the ultrasonic diagnostic apparatus according to the present embodiment can suppress the propagation of vibrations in the integrated circuit.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Ultrasonic diagnostic apparatus 100 Ultrasonic probe 110 Transmission / reception circuit 113 Groove 120 Ultrasonic transducer

Claims (8)

A plurality of vibration elements;
A groove is formed at a position corresponding to a gap between the vibration elements on the first surface disposed on the plurality of vibration elements, and the plurality of vibrations are formed on a second surface which is the back surface of the first surface. An integrated circuit in which at least one of a circuit for driving an element and a circuit for performing signal processing on an echo signal generated by the plurality of vibration elements is formed;
An ultrasonic probe. A substrate disposed on the second surface side for performing at least one of an input to a circuit formed in the integrated circuit and an output from the circuit formed in the integrated circuit;
The ultrasonic probe according to claim 1, wherein the second surface of the integrated circuit is flip-chip mounted on the substrate.   The ultrasonic probe according to claim 2, wherein the substrate is a flexible printed circuit board.   The ultrasonic probe according to claim 1, wherein the groove is formed to a depth of 0.1 mm or less from the second surface.   The ultrasonic probe according to claim 2, wherein an electrical connection portion between the integrated circuit and the substrate is formed in a region including immediately below the vibration element. The plurality of vibration elements are arranged in a substantially lattice shape,
The ultrasonic probe according to claim 1, wherein the grooves are arranged in a substantially lattice shape. An electrode connected to the plurality of vibration elements is formed on the first surface,
The ultrasonic probe according to claim 1, wherein the electrode and the circuit formed on the second surface are connected by a through electrode. An image generation unit that generates an ultrasonic image based on a signal output from the ultrasonic probe according to any one of claims 1 to 7,
A display control unit for displaying the ultrasonic image on a display unit;
An ultrasonic diagnostic apparatus comprising:

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