JP7187350B2 - Ultrasonic probe and ultrasonic diagnostic equipment - Google Patents

Description

An embodiment of the present invention relates to an ultrasonic probe and an ultrasonic diagnostic apparatus.

Conventionally, there is an ultrasonic probe (two-dimensional array probe) having a large number of transducer elements arranged in a lattice. For example, in a two-dimensional array probe, a dedicated transmission/reception IC (Integrated Circuit) is mounted in the probe handle to cause the transducer to transmit and receive ultrasonic waves. For example, the transmitting/receiving IC performs partial delay addition processing on echo signals output by transducers that have received reflected waves of ultrasonic waves.

The transmitting/receiving IC generates heat by consuming power during operation. Therefore, temperature control is more important in an ultrasonic probe equipped with a transmission/reception IC than in an ultrasonic probe without a transmission/reception IC. For example, a case will be described where the equilibrium temperature of the portion of the ultrasonic probe that contacts the body surface of the subject (body surface contact portion) is predicted to exceed a predetermined regulation temperature. In this case, the ultrasonic diagnostic apparatus including the ultrasonic probe performs temperature control so as to stop the operation of the ultrasonic probe before the temperature of the body surface contact portion exceeds the regulation temperature. For example, the ultrasonic diagnostic apparatus performs temperature control (feedback control) using a detection signal indicating the temperature from a temperature detection unit such as a thermistor for detecting temperature, which is placed near the contact portion on the body surface. conduct.

JP 2018-29747 A JP 2013-154139 A JP 2010-98558 A JP 2011-72584 A

The problem to be solved by the present invention is to provide an ultrasonic probe and an ultrasonic diagnostic apparatus that can detect the highest temperature in a transducer array while suppressing an increase in the number of temperature detection units that detect temperature. That is.

An ultrasound probe of an embodiment comprises a plurality of modules. The module includes: a plurality of transducer elements arranged in a grid pattern in first and second directions that intersect with the radiation direction of the ultrasonic waves; and a back load member provided so as to face the surface opposite to the ultrasonic wave emitting surface of the vibrating element. A plurality of modules are provided side by side in the first direction. At least two modules among the plurality of modules have temperature detection units provided on the backing load material. Two modules adjacent in the first direction among the plurality of modules have different layout patterns indicating the layout of the temperature detection units in the second direction.

FIG. 1 is a block diagram showing an example of the configuration of an ultrasonic diagnostic apparatus according to the first embodiment. FIG. 2 is a diagram showing an example of the configuration of the ultrasonic probe according to the first embodiment. FIG. 3 is a diagram illustrating an example of the configuration of a module according to the first embodiment; FIG. 4 is a diagram for explaining a module of an ultrasonic probe according to a first comparative example; FIG. 5 is a diagram for explaining a module of an ultrasonic probe according to a second comparative example. FIG. 6 is a diagram for explaining the module of the ultrasonic probe according to the first embodiment; 7A is a diagram illustrating an example of an arrangement pattern according to the first embodiment; FIG. 7B is a diagram illustrating an example of an arrangement pattern according to the first embodiment; FIG. 7C is a diagram illustrating an example of an arrangement pattern according to the first embodiment; FIG. 7D is a diagram illustrating an example of an arrangement pattern according to the first embodiment; FIG. 7E is a diagram illustrating an example of an arrangement pattern according to the first embodiment; FIG. FIG. 8 is a diagram showing an example of the configuration of an ultrasonic probe according to the second embodiment. FIG. 9 is a diagram for explaining a module of an ultrasonic probe according to the second embodiment; FIG. 10 is a diagram for explaining a module of an ultrasonic probe according to the third embodiment;

Hereinafter, an ultrasonic probe and an ultrasonic diagnostic apparatus according to embodiments will be described with reference to the drawings. Note that the contents described in one embodiment or modified example may be similarly applied to other embodiments or other modified examples.

(First embodiment)
First, an example configuration of an ultrasonic diagnostic apparatus to which the ultrasonic probe according to the first embodiment is applied will be described. FIG. 1 is a block diagram showing an example of the configuration of an ultrasonic diagnostic apparatus 1 according to the first embodiment. As illustrated in FIG. 1, the ultrasonic diagnostic apparatus 1 according to the first embodiment has an apparatus main body 100, an ultrasonic probe 101, an input device 102, and a display 103.

The ultrasonic probe 101 has, for example, a plurality of vibration elements (piezoelectric transducers) arranged in a grid (two-dimensional) in the elevation direction and the azimuth direction. The azimuth direction is a direction perpendicular to the elevation direction. Moreover, the elevation direction and the azimuth direction are orthogonal to the radiation direction of the ultrasonic waves emitted from the ultrasonic wave radiation surface of the transducer element. Note that the elevation direction and the azimuth direction need only intersect each other. Moreover, the elevation direction and the azimuth direction need only intersect with the radiation direction of the ultrasonic waves. The elevation direction is an example of the first direction. The azimuth direction is an example of the second direction.

The plurality of transducer elements generate ultrasonic waves based on drive signals supplied from the transmission/reception circuit 110 of the device body 100 . Also, the ultrasonic probe 101 receives reflected waves from the subject P. FIG. Then, the ultrasonic probe 101 converts the reflected wave into a reflected wave signal, which is an electrical signal, and outputs the reflected wave signal to the apparatus main body 100 . The ultrasonic probe 101 also has, for example, a matching layer provided on the transducer element, and a backing material (backing material) 101s (see FIG. 3) that prevents ultrasonic waves from propagating backward from the transducer element. The back load material 101s will be described later. Note that the ultrasonic probe 101 is detachably connected to the device main body 100 .

When ultrasonic waves are transmitted from the ultrasonic probe 101 to the subject P, the transmitted ultrasonic waves are successively reflected by discontinuous surfaces of acoustic impedance in the body tissue of the subject P, and are reflected by the ultrasonic probe 101 as reflected waves. is received by a plurality of transducer elements possessed by . The amplitude of the received reflected wave depends on the difference in acoustic impedance at the discontinuity from which the ultrasonic waves are reflected. When the transmitted ultrasonic pulse is reflected by the moving blood flow or the surface of the heart wall, the reflected wave depends on the velocity component of the moving body relative to the transmission direction of the ultrasonic wave due to the Doppler effect. subject to frequency shifts. Then, the ultrasonic probe 101 executes delay processing for giving a delay amount necessary for determining reception directivity to a plurality of reflected wave signals for each subarray. The subarray refers to a set of a predetermined number of transducer elements belonging to each of the plurality of groups when all the transducer elements of the ultrasonic probe 101 are divided into a plurality of groups. For example, the number of vibration elements belonging to each group is plural. Then, the ultrasonic probe 101 performs an addition process of adding a plurality of delayed reflected wave signals for each subarray. Then, the ultrasonic probe 101 outputs the reflected wave signal after addition by the addition process to the transmission/reception circuit 110 for each subarray.

The ultrasonic probe 101 is provided detachably from the apparatus main body 100 . When performing scanning (two-dimensional scanning) of a two-dimensional region within the subject P, the operator connects, for example, a one-dimensional array probe in which a plurality of transducer elements are arranged in a row as the ultrasonic probe 101 to the apparatus main body 100. do. Further, when scanning a three-dimensional region within the subject P (three-dimensional scanning), the operator connects, for example, a mechanical four-dimensional probe or a two-dimensional array probe as the ultrasonic probe 101 to the apparatus main body 100 . A mechanical 4D probe is capable of two-dimensional scanning using multiple transducers arranged in a row like a one-dimensional array probe, and the multiple transducers are oscillated at a predetermined angle (oscillation angle). Three-dimensional scanning is possible by In addition, the two-dimensional array probe is capable of three-dimensional scanning by means of a plurality of transducer elements arranged in a matrix, and is also capable of two-dimensional scanning by focusing and transmitting ultrasonic waves. Types of two-dimensional array probes include linear ultrasonic probes, sector ultrasonic probes, and the like. A case where the ultrasonic probe 101 is a two-dimensional array probe and a linear ultrasonic probe will be described below.

The input device 102 is implemented by input means such as a mouse, keyboard, button, panel switch, touch command screen, foot switch, trackball, joystick, or the like. The input device 102 receives various setting requests from the operator of the ultrasonic diagnostic apparatus 1 and transfers the received various setting requests to the apparatus main body 100 .

The display 103 displays, for example, a GUI (Graphical User Interface) for the operator of the ultrasonic diagnostic apparatus 1 to input various setting requests using the input device 102, and displays an ultrasonic image generated in the apparatus main body 100. An ultrasound image or the like indicated by the data is displayed. The display 103 is realized by a liquid crystal display, a CRT (Cathode Ray Tube) display, or the like.

The device main body 100 generates ultrasonic image data based on reflected wave signals transmitted from the ultrasonic probe 101 . Note that the ultrasound image data is an example of image data. As shown in FIG. 1, the apparatus main body 100 has a transmission/reception circuit 110, a communication control circuit 120, a signal processing circuit 130, an image generation circuit 140, a storage circuit 150, and a control circuit 160.

The transmission/reception circuit 110 is controlled by the control circuit 160 to transmit ultrasonic waves from the ultrasonic probe 101 and to receive ultrasonic waves (reflected ultrasonic waves) by the ultrasonic probe 101 . That is, the transmitting/receiving circuit 110 performs scanning via the ultrasonic probe 101 . Note that scanning is also referred to as scanning, ultrasonic scanning, or ultrasonic scanning. The transmission/reception circuit 110 is an example of a transmission/reception section.

For example, the transmission/reception circuit 110 is controlled by the control circuit 160 to cause the ultrasonic probe 101 to transmit ultrasonic waves. That is, the transmission/reception circuit 110 causes the ultrasonic probe 101 to transmit an ultrasonic beam. The transmission/reception circuit 110 has a rate pulser generation circuit, a transmission delay circuit, and a transmission pulser, and supplies drive signals to the ultrasonic probe 101 .

A rate pulse generator circuit repeatedly generates a rate pulse for forming a transmission ultrasonic wave (transmission beam) at a predetermined rate frequency (PRF: Pulse Repetition Frequency). By passing the rate pulse through the transmission delay circuit, a voltage is applied to the transmission pulser with different transmission delay times. For example, the transmission delay circuit generates a transmission delay time for each transducer element necessary for focusing the ultrasonic waves generated from the ultrasonic probe 101 into a beam and determining the transmission directivity by the rate pulsar generation circuit. given for each rate pulse. The transmission pulser supplies a driving signal (driving pulse) to the ultrasonic probe 101 at a timing based on the rate pulse. The transmission delay circuit arbitrarily adjusts the transmission direction of ultrasonic waves from the ultrasonic wave radiation surface of the transducer element by changing the transmission delay time given to each rate pulse.

The drive pulse is transmitted from the transmission pulser through the cable to the transducer element in the ultrasonic probe 101, and then converted from an electric signal to mechanical vibration in the transducer element. Ultrasonic waves generated by this mechanical vibration are transmitted to the inside of the subject P. As shown in FIG. Here, the ultrasonic waves having different transmission delay times for each transducer element are converged and propagated in a predetermined direction.

The transmitting/receiving circuit 110 has a function capable of instantaneously changing the transmission frequency, the transmission driving voltage, etc. in order to execute a predetermined scanning sequence under the control of the control circuit 160 . In particular, the change of the transmission drive voltage is realized by a linear amplifier type oscillator circuit capable of instantaneously switching the value of the transmission drive voltage, or by a mechanism for electrically switching a plurality of power supply units.

Further, the transmitting/receiving circuit 110 has an A/D (Analog to Digital) converter, a receiving beamformer, etc., and performs various processing on the reflected wave signal transmitted from the ultrasonic probe 101 to convert it into digital data. Generate some reflected wave data. The transmitting/receiving circuit 110 then transmits the generated reflected wave data to the signal processing circuit 130 .

The communication control circuit 120 is a circuit that performs communication between the apparatus body 100 and the ultrasonic probe 101 . For example, the communication control circuit 120 transmits the received detection signal to the control circuit 160 upon receiving a detection signal transmitted from the conversion circuit 101l described later.

The signal processing circuit 130 performs various signal processing on the reflected wave data transmitted from the transmitting/receiving circuit 110, and outputs the reflected wave data subjected to various signal processing to the image generating circuit 140 as B-mode data or Doppler data. Output. The signal processing circuit 130 is implemented by, for example, a processor. The signal processing circuit 130 is an example of a signal processing section.

For example, the signal processing circuit 130 performs logarithmic amplification and envelope detection processing on the reflected wave data to generate B-mode data in which the signal strength (amplitude strength) at each sample point is represented by the brightness of luminance. Generate. The signal processing circuit 130 then outputs the generated B-mode data to the image generation circuit 140 .

Further, the signal processing circuit 130 performs signal processing for performing harmonic imaging that visualizes harmonic components. Harmonic imaging includes contrast harmonic imaging (CHI) and tissue harmonic imaging (THI). Also, in contrast harmonic imaging and tissue harmonic imaging, the following scanning methods are known. For example, such scanning methods include phase modulation (PM) called amplitude modulation (AM), pulse subtraction method (Pulse Subtraction method) or pulse inversion method (Pulse Inversion method), and AM and PM AMPM and the like are known in which both the effect of AM and the effect of PM are obtained by combining .

Further, the signal processing circuit 130 performs frequency analysis of the reflected wave data to extract motion information of a moving body (blood flow, tissue, contrast agent echo component, etc.) based on the Doppler effect from the reflected wave data, and extracts the extracted motion information. Generate informative Doppler data. For example, the signal processing circuit 130 extracts an average velocity, an average dispersion value, an average power value, and the like at multiple points as motion information of the moving object, and generates Doppler data representing the extracted motion information of the moving object. The signal processing circuit 130 outputs the generated Doppler data to the image generation circuit 140 .

The image generation circuit 140 generates ultrasound image data from the B-mode data and Doppler data output from the signal processing circuit 130 . For example, from the B-mode data generated by the signal processing circuit 130, the image generation circuit 140 generates B-mode image data representing the intensity of the reflected wave in luminance. The image generation circuit 140 also generates Doppler image data in which motion information is visualized from the Doppler data generated by the signal processing circuit 130 . Doppler image data is, for example, velocity image data, dispersion image data, power image data, or image data combining these. The image generation circuit 140 is implemented by a processor.

Here, the image generation circuit 140 generally converts (scan-converts) a scanning line signal train of ultrasonic scanning into a scanning line signal train of a video format typified by a television or the like, and converts the ultrasonic waves for display. Generate image data. For example, the image generation circuit 140 performs coordinate transformation on the data output from the signal processing circuit 130 according to the scanning mode of the ultrasonic waves by the ultrasonic probe 101, thereby generating ultrasonic image data for display. do. In addition, the image generation circuit 140 performs various image processing other than scan conversion, such as image processing (smoothing processing) for regenerating an average brightness image using a plurality of image frames after scan conversion, Image processing (edge enhancement processing) or the like using a differential filter is performed within the image. In addition, the image generation circuit 140 synthesizes character information of various parameters, scales, body marks, etc. with the ultrasonic image data.

Note that the image generation circuit 140 performs coordinate transformation on the three-dimensional B-mode data generated by the signal processing circuit 130 to generate three-dimensional B-mode image data. The image generation circuit 140 also performs coordinate transformation on the three-dimensional Doppler data generated by the signal processing circuit 130 to generate three-dimensional Doppler image data. That is, the image generating circuit 140 generates "three-dimensional B-mode image data and three-dimensional Doppler image data" as "three-dimensional ultrasound image data (volume data)". The image generation circuit 140 then performs various rendering processes on the volume data in order to generate various types of two-dimensional image data for displaying the volume data on the display 103 .

Rendering processing performed by the image generation circuit 140 includes, for example, processing for generating MPR image data from volume data using a cross-sectional reconstruction method (MPR: Multi Planer Reconstruction). Rendering processing performed by the image generation circuit 140 includes, for example, volume rendering (VR) processing for generating two-dimensional image data reflecting three-dimensional information. The image generation circuit 140 is an example of an image generation section.

The B-mode data and Doppler data are ultrasound image data before scan-conversion processing, and the data generated by the image generation circuit 140 are ultrasound image data for display after scan-conversion processing. B-mode data and Doppler data are also called raw data.

The storage circuit 150 stores various image data generated by the image generation circuit 140 . The storage circuit 150 also stores data generated by the signal processing circuit 130 . The B-mode data and Doppler data stored in the storage circuit 150 can be called up by the operator after diagnosis, for example, and become ultrasonic image data for display via the image generation circuit 140 . For example, the storage circuit 150 is implemented by a semiconductor memory device such as flash memory, a hard disk, or an optical disk.

The storage circuit 150 also stores control programs for scanning (transmitting and receiving of ultrasonic waves), image processing, and display processing, diagnostic information (for example, patient ID, doctor's findings, etc.), diagnostic protocols, various body marks, and the like. Stores various data of

The control circuit 160 controls the entire processing of the ultrasonic diagnostic apparatus 1 . Specifically, the control circuit 160 controls the transmission/reception circuit 110 and the communication control circuit based on various setting requests input by the operator via the input device 102 and various control programs and various data read from the storage circuit 150 . 120 , signal processing circuit 130 and image generation circuit 140 . The control circuit 160 also controls the display 103 to display the ultrasonic image indicated by the display ultrasonic image data stored in the storage circuit 150 . The control circuit 160 is an example of a display control section or control section. The control circuit 160 is implemented by, for example, a processor. An ultrasound image is an example of an image.

The term "processor" used in the above description is, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an application specific integrated circuit (ASIC), or a programmable logic device (e.g., Circuits such as Simple Programmable Logic Device (SPLD), Complex Programmable Logic Device (CPLD), or Field Programmable Gate Array (FPGA). The processor implements its functions by reading and executing programs stored in the storage circuit 150 . Note that instead of storing the program in the memory circuit 150, the program may be configured to be directly installed in the circuit of the processor. In this case, the processor implements its functions by reading and executing the program embedded in the circuit. Note that each processor of the present embodiment is not limited to being configured as a single circuit for each processor, and may be configured as one processor by combining a plurality of independent circuits to realize its function. good. Furthermore, a plurality of circuits (eg, signal processing circuit 130, image generation circuit 140, and control circuit 160) in FIG. 1 may be integrated into one processor to realize its functions. That is, the signal processing circuit 130, the image generation circuit 140 and the control circuit 160 may be integrated into one processing circuit implemented by a processor.

The overall configuration of the ultrasonic diagnostic apparatus 1 according to the embodiment has been described above. Next, an example of the configuration of the ultrasonic probe 101 will be described with reference to FIG. FIG. 2 is a diagram showing an example of the configuration of the ultrasonic probe 101 according to the first embodiment.

As illustrated in FIG. 2, the ultrasonic probe 101 includes multiple modules 101a, cables 101b, and connectors 101c.

Each of the plurality of modules 101a is provided for each subarray 101f. That is, one module 101a corresponds to one subarray 101f. For this reason, for example, when a transducer element array composed of all the transducer elements 101e of the ultrasonic probe 101 is divided into four sub-arrays 101f, as shown in the example of FIG. 2, the number of modules 101a is becomes four. Note that the number of sub-arrays 101f and the number of modules 101a are not limited to this. For example, the number of subarrays 101f and the number of modules 101a may be two or more. A module 101a according to the first embodiment includes a transmission/reception IC 101d, a plurality of vibration elements 101e forming a subarray 101f, and a temperature detection element 101g. The temperature detection element 101g is an example of a temperature detection unit such as a thermistor. Note that FIG. 2 simply shows a configuration example of the module 101a. A detailed configuration of the module 101a will be described later.

Upon receiving the drive signal transmitted from the device main body 100, the transceiver IC 101d supplies the received drive signal to the vibration element 101e corresponding to the received drive signal.

Further, the transmitting/receiving IC 101d executes delay processing to give a delay amount necessary for determining the reception directivity to the plurality of reflected wave signals output from the plurality of transducer elements 101e forming the subarray 101f. Then, the transmitting/receiving IC 101d executes addition processing for adding the plurality of delayed reflected wave signals. Then, the transmitting/receiving IC 101d executes addition processing for adding the plurality of delayed reflected wave signals. Then, the transmission/reception IC 101d transmits the reflected wave signal after addition by the addition processing to the transmission/reception circuit 110 via the cable 101b and the connector 101c.

The transmitting/receiving IC 101d consumes power during operation and thus generates heat. Further, the vibration element 101e generates heat due to conversion loss during transmission of ultrasonic waves and attenuation absorption by the backing material and the acoustic lens. The temperature inside the ultrasonic probe 101 rises due to the heat generated by the transmission/reception IC 101d and the vibration element 101e.

Therefore, in order for the ultrasonic diagnostic apparatus 1 to perform temperature control, a temperature detection element 101 g such as a thermistor is provided inside the ultrasonic probe 101 to detect the temperature inside the ultrasonic probe 101 . The temperature detection element 101g transmits a detection signal indicating the detected temperature to the later-described conversion circuit 101l in the connector 101c via the cable 101b. Therefore, the conversion circuit 101l receives the detection signal transmitted from each of the plurality (four in the example of FIG. 2) of the transmission/reception ICs 101d. In the case shown in FIG. 2, conversion circuit 101l receives four detection signals.

The cable 101b is a cable for performing communication between the transmission/reception IC 101d and the device main body 100. FIG. For example, one end of the cable 101b is connected to each of four transmission/reception ICs 101d. A connector 101c is connected to the other end of the cable 101b. By connecting the connector 101c to a port (not shown) of the apparatus main body 100, communication can be performed between the transmission/reception IC 101d and the apparatus main body 100 via the cable 101b and the connector 101c.

In the first embodiment, connector 101c includes conversion circuit 101l. The conversion circuit 101l converts the received multiple (four in the example of FIG. 2) detection signals into a single detection signal. For example, the conversion circuit 101l identifies the detection signal indicating the highest temperature among the plurality of detection signals. Then, conversion circuit 101l transmits the specified detection signal to communication control circuit 120 of apparatus main body 100 . That is, the conversion circuit 101l outputs the detection signal indicating the highest temperature among the plurality of detection signals. The conversion circuit 101l is an example of a conversion unit.

Here, solid lines shown in FIG. 2 indicate communication paths for analog signals, and dashed lines indicate communication paths for digital data. For example, the driving signal transmitted from the transmission/reception circuit 110 to the transmission/reception IC 101d via the connector 101c and the cable 101b is an analog signal as indicated by the solid line. Similarly, the drive signal supplied from the transmission/reception IC 101d to the vibration element 101e is also an analog signal, as indicated by the solid line.

On the other hand, reflected wave data transmitted from the transmission/reception circuit 110 to the signal processing circuit 130, detection signals transmitted from the communication control circuit 120 to the control circuit 160, and various types of signals transmitted from the signal processing circuit 130 to the image generation circuit 140 Data and the like are also digital data, as indicated by dashed lines.

Next, the details of the module 101a will be described. FIG. 3 is a diagram showing an example of the configuration of the module 101a according to the first embodiment. As illustrated in FIG. 3, the module 101a includes a plurality of vibration elements 101e, a flexible printed circuit board (FPC: Flexible Printed Circuits) 101h for extracting signals, a back load material 101s, a substrate 101k, and a transmission/reception IC 101d. have.

The vibrating element 101e has an ultrasonic wave radiation surface. A ground electrode is provided on the ultrasonic wave radiation surface of the transducer element 101e. A signal electrode is provided on the surface (rear surface) of the transducer element 101e opposite to the ultrasonic wave emitting surface. A flexible wiring board (not shown) for grounding, for example, is connected to the ground electrode. A flexible wiring board 101h is connected to the signal electrode. The vibrating element 101e is driven by a drive signal to radiate ultrasonic waves from an ultrasonic wave radiation surface. Further, when receiving a reflected wave of an ultrasonic wave, the transducer element 101e converts the received reflected wave into a reflected wave signal and outputs the reflected wave signal from the signal electrode.

Flexible wiring board 101h is, for example, a double-sided FPC. When the flexible wiring board 101h is a double-sided FPC, a wiring pattern connected to each of the signal electrodes of the plurality of vibrating elements is provided on the surface (rear surface) of the flexible wiring board 101h opposite to the surface on the vibrating element 101e side. each is provided. Each of the wiring patterns is connected to an adhesive pad provided on the surface of the flexible wiring board 101h on the vibrating element 101e side via a through hole that electrically connects both surfaces of the flexible wiring board 101h. Each bonding pad is provided at a position facing the signal electrode to be connected. Each bonding pad is then bonded to the corresponding signal electrode.

As shown in FIG. 3, the flexible wiring board 101h is bent so as to be substantially parallel to the side surface of the back load member 101s. For example, the flexible wiring board 101h is bent so as to sandwich the back load member 101s and the substrate 101k.

The back load member 101s is provided so as to face the surfaces of the plurality of transducer elements 101e opposite to the ultrasonic wave radiation surfaces. The back load member 101s has an acoustic member 101i and a high thermal conductivity member 101j. The acoustic member 101i suppresses propagation of ultrasonic waves from the vibrating element 101e in the back direction (direction opposite to the transmission direction of ultrasonic waves). For example, the acoustic member 101i attenuates and absorbs ultrasonic waves radiated from the vibration element 101e in a direction opposite to the direction in which the ultrasonic waves are radiated. The acoustic member 101i uses resin (for example, epoxy resin) filled with metal oxide such as zinc oxide as a base material, and at least one of tungsten powder, zinc oxide powder, tungsten carbide, and carbon fiber is kneaded and cured. It is a thing. The acoustic member 101i is, for example, a substantially rectangular parallelepiped. The surface of the acoustic member 101i facing the vibrating element 101e (the surface on the side of the vibrating element 101e) is acoustically coupled to the plurality of signal electrodes provided on the plurality of vibrating elements 101e forming the subarray 101f via the flexible wiring board 101h. It is connected to the. Acoustic member 101i is an example of a first layer.

The high thermal conductivity member 101j is provided on the side of the acoustic member 101i opposite to the vibrating element 101e side, and is made of a member having a thermal conductivity equal to or higher than a predetermined value. The high thermal conductivity member 101j is, for example, aluminum, copper, carbon fiber, or high thermal conductivity ceramic. The high thermal conductivity member 101j is, for example, a substantially rectangular parallelepiped. One surface of the high thermal conductivity member 101j is bonded to the surface of the acoustic member 101i opposite to the surface of the acoustic member 101e on the vibrating element 101e side. The high thermal conductivity member 101j includes a back load member 101s (specifically, an acoustic member 101i) through which the heat generated by the vibration element 101e and the heat generated by the transmission/reception IC 101d are propagated by heat conduction within the high thermal conductivity member 101j. Uniform heat. The high thermal conductivity member 101j is an example of the second layer.

A transmission/reception IC 101d is mounted on the substrate 101k. The transceiver IC 101d is connected to a wiring pattern provided on the substrate 101k. The wiring pattern connected to the transmitting/receiving IC 101d is electrically connected to the wiring pattern provided for each transducer element 101e on the surface of the flexible wiring board 101h facing the transducer element 101e through a through hole formed in the flexible wiring board 101h. It is connected to the.

A wiring pattern electrically connected to the ground electrode of the vibrating element 101e and provided on a flexible wiring board (not shown) for grounding, and a wiring pattern connected to the transmission/reception IC 101d. are electrically connected.

Therefore, the transmission/reception IC 101d, the signal electrode of the vibration element 101e, and the ground electrode of the vibration element 101e are electrically connected.

Upon receiving the drive signal transmitted from the device main body 100, the transmission/reception IC 101d transmits the received drive signal to the vibration element 101e corresponding to the received drive signal, that is, the vibration element 101e to be driven. The transmission/reception IC 101d transmits a drive signal to apply a voltage corresponding to the drive signal between both electrodes (the signal electrode and the ground electrode) of the vibration element 101e to be driven. As a result, the vibration element 101e to be driven is driven and emits ultrasonic waves. Note that the transceiver IC 101d may be directly mounted on the flexible wiring board 101h. For example, the transmitting/receiving IC 101d may be directly mounted on the flexible wiring board 101h by mounting technology such as "Chip on film".

Here, an ultrasonic probe according to a comparative example will be described with reference to FIGS. 4 and 5. FIG. FIG. 4 is a diagram for explaining a module of an ultrasonic probe according to a first comparative example; The ultrasonic probe according to the first comparative example illustrated in FIG. 4 is a sector-type ultrasonic probe and a two-dimensional array probe. The ultrasonic probe according to the first comparative example includes a thermistor 204 for temperature control.

The upper part of FIG. 4 is a view of a part of the module of the ultrasonic probe according to the first comparative example, viewed from a plane orthogonal to the azimuth direction and along the elevation direction. Further, the lower part of FIG. 4 is a bottom view of part of the module of the ultrasonic probe according to the first comparative example.

As shown in the upper part of FIG. 4, the ultrasonic probe according to the first comparative example includes a transducer array 201, an acoustic member 202, and a high thermal conductivity member 203. FIG. The vibrating element array 201 is composed of a plurality of vibrating elements arranged in a grid pattern in the elevation direction and the azimuth direction.

Here, in the ultrasonic probe, it is preferable that a temperature as high as possible is detected as the internal temperature of the ultrasonic probe when temperature control is performed. Therefore, in the ultrasonic probe according to the first comparative example, the thermistor 204 is provided at the position of the high thermal conductivity member 203 corresponding to the central position of the transducer element array 201, as shown in the lower part of FIG. An example of the reason for providing the thermistor 204 at such a position will be described. It is considered that the ultrasonic probe according to the first comparative example, which is a sector type ultrasonic probe and a two-dimensional array probe, drives all transducer elements when transmitting and receiving ultrasonic waves. Therefore, it is considered that the temperature of the central portion of the vibrating element array 201 is the highest. Also, even if the diameter of the transmission aperture or the reception aperture is narrower than the diameter for driving all the transducer elements, it is considered that the transducer elements in the central portion of the transducer array 201 are being driven. Therefore, even in this case, the temperature of the central portion of the transducer array 201 is considered to be the highest. Therefore, the thermistor 204 is provided at the position of the high thermal conductivity member 203 corresponding to the position of the central portion of the vibrating element array 201 .

The size of the transducer array 201 included in the ultrasonic probe according to the first comparative example, which is a sector-type ultrasonic probe, is smaller than that of a linear-type ultrasonic probe or the like. Further, as shown in the upper and lower portions of FIG. 4, the back load member composed of the acoustic member 202 and the high heat conductive member 203 is not divided but integrally formed. Therefore, the high thermal conductivity member 203 can uniform the heat of the back load member (specifically, the acoustic member 202). Therefore, as shown in the lower part of FIG. 4, the thermistor 204 may be provided at the position of the high thermal conductivity member 203 corresponding to the end position of the vibrating element array 201 instead of the central portion.

FIG. 5 is a diagram for explaining a module of an ultrasonic probe according to a second comparative example. The ultrasonic probe according to the second comparative example illustrated in FIG. 5 is a linear ultrasonic probe and a two-dimensional array probe. The ultrasonic probe according to the second comparative example includes a thermistor 301d for temperature control.

The upper part of FIG. 5 is a view of a part of the module of the ultrasonic probe according to the second comparative example, viewed from a plane orthogonal to the azimuth direction and along the elevation direction. Further, the lower part of FIG. 5 is a bottom view of part of the module of the ultrasonic probe according to the second comparative example.

As shown in the upper part of FIG. 5, the ultrasonic probe according to the second comparative example includes multiple modules each having a subarray 301a, an acoustic member 301b, and a high thermal conductivity member 301c. A plurality of modules are provided side by side in the elevation direction. The sub-array 301a here refers to a set of a predetermined number of transducer elements belonging to each of the plurality of groups when all the transducer elements of the ultrasonic probe according to the second comparative example are divided into a plurality of groups. The sub-array 301a is composed of a plurality of vibrating elements arranged in a grid pattern in the elevation direction and the azimuth direction.

Here, the size of the transducer element array composed of all the transducer elements of the ultrasonic probe according to the second comparative example is large compared to sector-type ultrasonic probes and the like. Therefore, when the ultrasonic probe according to the second comparative example performs scanning while moving the position of the transmission aperture and the position of the reception aperture, only some of the transducer elements are driven. Therefore, the portion of the vibrating element array where the temperature is the highest is not constant but changes.

Moreover, since the ultrasonic probe according to the second comparative example has a large number of transducer elements, a plurality of modules are provided. Each of the plurality of modules processes reflected wave signals output from the plurality of transducer elements forming the subarray 301a. Therefore, in the ultrasonic probe according to the second comparative example, the acoustic member and the high thermal conductivity member are divided into a plurality of acoustic members 301b and a plurality of high thermal conductivity members 301c. Therefore, the thermal resistance between two adjacent modules is relatively high. That is, the heat transfer coefficient between two adjacent modules is relatively low. Therefore, there tends to be a large temperature difference between two adjacent modules. Therefore, each module needs to detect the temperature.

Here, the vibrating element array has a rectangular shape when viewed from above. In the ultrasonic probe according to the second comparative example, in order to realize signal extraction, a sufficient size of the extraction surface is ensured by dividing the transducer element array into a plurality of sub-arrays 301a in the lateral direction. is desirable. For this reason, the shape of one backing material included in one module is an elongated rectangle with an extreme ratio of long side to short side. For example, the shape of the back load member is a rectangle whose longitudinal direction is the azimuth direction. For this reason, the high thermal conductivity member 301c cannot achieve sufficient temperature uniformity, and the difference between the highest temperature and the lowest temperature in the longitudinal direction of one backing load member increases to some extent. Also, the position of the transmission aperture and the position of the reception aperture change, and the hottest part of the backing material also changes. Therefore, when the highest temperature of one backing load material is detected by the thermistor 301d, it is necessary to provide a plurality of thermistors 301d at a plurality of positions in the longitudinal direction.

For example, as shown in the lower part of FIG. 5, in each module, it is necessary to provide a plurality of thermistors 301d at a plurality of (four) different positions in the azimuth direction of the high heat conduction member 301c. However, in this case, since the number of modules is six, it is necessary to provide a large number (24 (4×6)) of thermistors 301d. Therefore, the scale of the circuit for detecting the highest temperature increases, the power consumption of the thermistor 301d increases, the number of cables for transmitting the detection signal from the thermistor 301d increases, and the thermistor 301d purchase cost increases.

Therefore, the ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1 according to the first embodiment can detect the highest temperature in the transducer array while suppressing an increase in the number of temperature detecting elements 101g that detect temperature. In order to be able to do so, it is configured as described below.

FIG. 6 is a diagram for explaining the module 101a of the ultrasonic probe 101 according to the first embodiment. The ultrasonic probe 101 illustrated in FIG. 6 is a linear ultrasonic probe and a two-dimensional array probe as described above. The module 101a of the ultrasonic probe 101 according to the first embodiment includes a temperature detection element 101g for temperature control.

The upper part of FIG. 6 is a view of part of the module 101a of the ultrasonic probe 101 according to the first embodiment, viewed from a plane perpendicular to the azimuth direction and along the elevation direction. 5 is a bottom view of part of the module 101a of the ultrasonic probe 101 according to the first embodiment.

The ultrasonic probe 101 includes a plurality of modules 101a each having a subarray 101f, an acoustic member 101i, and a high thermal conductivity member 101j, as shown in the upper part of FIG. A plurality of modules 101a are provided side by side in the elevation direction. The sub-array 101f is composed of a plurality of vibrating elements 101e arranged in a grid pattern in the elevation direction and the azimuth direction.

Here, as shown in FIG. 6, in the first embodiment, the temperature detection elements 101g are arranged in the azimuth direction between two modules 101a adjacent in the elevation direction among the plurality (six) of the modules 101a. The arrangement pattern shown is different.

An example of an arrangement pattern will be described with reference to FIGS. 7A to 7E. Here, five types of layout patterns will be described. 7A to 7E are diagrams showing examples of layout patterns according to the first embodiment. A case will be described in which the temperature detection elements 101g are arranged at four different positions in the azimuth direction on the high heat conduction member 101j. FIG. 7A shows an arrangement pattern (1) indicating that the temperature detection element 101g is arranged at the first position in the azimuth direction. FIG. 7B shows an arrangement pattern (2) indicating that the temperature detection element 101g is arranged at the second position in the azimuth direction. FIG. 7C shows an arrangement pattern (3) indicating that the temperature detection element 101g is arranged at the third position in the azimuth direction. FIG. 7D shows an arrangement pattern (4) indicating that the temperature detection element 101g is arranged at the fourth position in the azimuth direction. FIG. 7E shows an arrangement pattern (5) indicating that the temperature detection element 101g is not arranged. Thus, the arrangement pattern differs depending on the arrangement position of the temperature detection element 101g. The arrangement pattern also includes the case where the temperature detection element 101g is not arranged. In this embodiment, at least two modules 101a among the plurality of modules 101a included in the ultrasonic probe 101 should have the temperature detection element 101g provided on the back load material 101s.

In FIG. 6, as described above, two adjacent modules 101a have different layout patterns. For example, the layout pattern of the leftmost module 101a is layout pattern (1), and the layout pattern of the second module 101a from the left is layout pattern (4). The arrangement pattern of the third module 101a from the left is arrangement pattern (2), and the arrangement pattern of the third module 101a from the right is arrangement pattern (3). The layout pattern of the second module 101a from the right is layout pattern (1), and the layout pattern of the rightmost module 101a is layout pattern (4).

The reason why the layout patterns are different between two adjacent modules 101a will be described. For example, even if the transmit and receive apertures are narrow, the transmit and receive apertures tend to be set across multiple sub-arrays 101f of multiple modules. Therefore, between two adjacent modules 101a, the vibration elements 101e at approximately the same position in the azimuth direction tend to generate heat. Therefore, between two adjacent modules 101a, temperatures at substantially the same position in the azimuth direction tend to be substantially the same.

Therefore, it is better to detect temperatures at different positions in the azimuth direction between the two adjacent modules 101a. Maximum temperature can be detected. For these reasons, in the ultrasonic probe 101 according to the first embodiment, two adjacent modules 101a have different layout patterns indicating the layout of the temperature detection elements 101g in the azimuth direction.

Both the ultrasonic probe 101 shown in FIG. 6 and the ultrasonic probe according to the second comparative example shown in FIG. 5 are linear ultrasonic probes and two-dimensional array probes. However, in the ultrasonic probe according to the second comparative example, 24 thermistors 301d are used for temperature control. In contrast, in the ultrasonic probe 101 according to the first embodiment, one module 101a has one temperature detection element 101g, so the number of temperature detection elements 101g used for temperature control is six.

Therefore, according to the ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1 according to the first embodiment, it is possible to detect the highest temperature in the transducer array while suppressing an increase in the number of temperature detecting elements 101g that detect temperature. be able to. Therefore, according to the ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1, it is possible to suppress an increase in the scale of the circuit for detecting the highest temperature. Further, according to the ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1, it is possible to suppress an increase in power consumption of the temperature detection element 101g. Further, according to the ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1, it is possible to suppress an increase in the number of cables for transmitting detection signals from the temperature detection element 101g. Further, according to the ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1, it is possible to suppress an increase in costs such as the purchase cost of the temperature detecting element 101g.

Next, an example of processing executed by the control circuit 160 in temperature control will be described. For example, as described above, the conversion circuit 101l transmits to the communication control circuit 120 the detection signal indicating the highest temperature among the plurality of received detection signals. Communication control circuit 120 transmits the received detection signal to control circuit 160 .

Upon receiving the detection signal, the control circuit 160 compares the temperature indicated by the received detection signal with a first threshold. to stop the scanning operation (scanning operation). Alternatively, when the temperature indicated by the detection signal is equal to or higher than the first threshold, the control circuit 160 stops power supply to the ultrasonic probe 101 to stop the operation of the ultrasonic probe 101 .

Also, the control circuit 160 compares the temperature indicated by the detection signal with a second threshold that is smaller than the first threshold. Then, when the temperature indicated by the detection signal is equal to or higher than the second threshold and lower than the first threshold, the control circuit 160 determines that when the ultrasonic probe 101 is separated from the subject P and left in the air, , controls the ultrasonic probe 101 to stop transmitting ultrasonic waves.

Also, the control circuit 160 compares the temperature indicated by the detection signal with a third threshold that is smaller than the second threshold. Then, when the temperature indicated by the detection signal is equal to or higher than the third threshold and lower than the second threshold, the control circuit 160 controls the ultrasonic probe 101 so as to lower the transmission voltage by a predetermined value. Here, the transmission voltage refers to, for example, a voltage applied between both electrodes (a signal electrode and a ground electrode) of the vibration element 101e to be driven and corresponding to a drive signal.

The ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1 according to the first embodiment have been described above. According to the ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1, as described above, it is possible to detect the highest temperature in the transducer array while suppressing an increase in the number of temperature detecting elements 101g that detect temperature.

Incidentally, in the first embodiment, a thermocouple may be used as the temperature detecting element 101g. A thermocouple detects temperature and outputs a detection signal indicative of the detected temperature. A thermocouple is an example of a temperature detector.

(First Modification of First Embodiment)
In the above-described embodiment, a case has been described in which the conversion circuit 101l outputs the detection signal indicating the highest temperature among the plurality of detection signals. However, the conversion circuit 101l may switch and output each of the plurality of detection signals at regular time intervals. Therefore, such a modified example will be described as a first modified example according to the first embodiment.

For example, the conversion circuit 101l sequentially selects each of the plurality of detection signals at regular time intervals. Then, the conversion circuit 101l transmits the selected detection signal to the communication control circuit 120 every time it selects the detection signal. Upon receiving the detection signal, communication control circuit 120 transmits the received detection signal to control circuit 160 .

Each time the control circuit 160 receives a detection signal, it identifies the detection signal indicating the highest temperature among the detection signals received during a certain period. The fixed period here is, for example, a period from the timing (receiving timing) at which the control circuit 160 receives the detection signal to a predetermined time before the receiving timing. The control circuit 160 then uses the highest temperature indicated by the specified detection signal to perform the same processing as in the first embodiment. That is, the control circuit 160 performs the same processing as in the first embodiment using the highest temperature among the multiple temperatures indicated by the multiple detection signals output from the conversion circuit 101l during a certain period.

The ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1 according to the first modification of the first embodiment have been described above. According to the first modification, similarly to the first embodiment, it is possible to detect the highest temperature in the vibrating element array while suppressing an increase in the number of temperature detecting elements 101g that detect temperature.

(Second embodiment)
In the embodiment and modification described above, the case where the vibration element 101e is included in the module 101a has been described. However, the vibrating element 101e may not be included in the module 101a. Therefore, such an embodiment will be described as a second embodiment. In the description of the second embodiment, the same reference numerals may be given to the same configurations as in the first embodiment, and the description thereof may be omitted. Also, in the description of the second embodiment, mainly the differences from the first embodiment will be described.

FIG. 8 is a diagram showing an example of the configuration of the ultrasonic probe 101 according to the second embodiment. FIG. 9 is a diagram for explaining the module 101a of the ultrasonic probe 101 according to the second embodiment. In the first embodiment described above, a case has been described in which the transducer element array composed of all the transducer elements 101e of the ultrasonic probe 101 is divided into four sub-arrays 101f. In the second embodiment, as shown in FIGS. 8 and 9, a vibrating element array 101m composed of all vibrating elements 101e is used without being divided. That is, in the second embodiment, a vibration element array 101m in which all the vibration elements 101e are integrated without being divided is used. In the second embodiment, the ultrasonic probe 101 includes the transducer array 101m, but the module 101a does not include the transducer array 101m.

The ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1 according to the second embodiment have been described above. According to the second embodiment, similarly to the first embodiment, it is possible to detect the highest temperature in the vibrating element array while suppressing an increase in the number of temperature detecting elements 101g that detect temperature.

(Third embodiment)
In the above-described embodiment and modifications, the case where the back load member 101s includes the high thermal conductivity member 101j and the high thermal conductivity member 101j is provided with the temperature detection element 101g has been described. However, the back load member 101s does not have to include the high thermal conductivity member 101j. Therefore, such an embodiment will be described as a third embodiment. In the description of the third embodiment, the same reference numerals may be assigned to the same configurations as in the first and second embodiments, and the description thereof may be omitted. Also, in the explanation of the third embodiment, mainly the points different from the first and second embodiments will be explained.

FIG. 10 is a diagram for explaining the module 101a of the ultrasonic probe 101 according to the third embodiment. An embodiment in which the module 101a according to the second embodiment does not include the high thermal conductivity member 101j will be described below as a third embodiment. The contents described below also apply to the embodiment without the .

As illustrated in FIG. 10, a module 101a according to the third embodiment does not include a high thermal conductivity member 101j, but includes an acoustic member 101i. As illustrated in the lower part of FIG. 10, the acoustic member 101i is provided with temperature detection elements 101g at four different positions in the azimuth direction. The acoustic member 101i according to the third embodiment is an example of a layer. As shown in the lower part of FIG. 10, in the third embodiment, similarly to the first embodiment, the arrangement showing the arrangement of temperature detection elements 101g in the azimuth direction between two modules 101a adjacent in the elevation direction. Different patterns.

The ultrasonic probe 101 and the ultrasonic diagnostic apparatus 1 according to the third embodiment have been described above. According to the third embodiment, similarly to the first and second embodiments, the highest temperature is detected in the vibrating element array while suppressing an increase in the number of temperature detecting elements 101g that detect temperature. can do.

In the above-described embodiment, one high thermal conductivity member 101j or one acoustic member 101i is provided with one temperature detection element (for example, one thermistor or one thermocouple) 101g, or the temperature detection element 101g is not provided. However, one high thermal conductivity member 101j or one acoustic member 101i may be provided with two or more temperature detection elements 101g.

According to at least one embodiment or modification described above, it is possible to detect the highest temperature in the vibrating element array while suppressing an increase in the number of temperature detecting elements 101g that detect temperature.

While several embodiments of the invention have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, as well as the scope of the invention described in the claims and equivalents thereof.

While several embodiments of the invention have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, as well as the scope of the invention described in the claims and equivalents thereof.

1 Ultrasonic Diagnostic Apparatus 101 Ultrasonic Probe 101a Module 101e Vibration Element 101f Sub Array 101g Temperature Detection Element 101s Back Load Material

Claims (12)

a plurality of transducer elements arranged in a grid pattern in a first direction and a second direction that intersect with a radiation direction of an ultrasonic wave, and the plurality of vibrators; a plurality of modules each having a back load member provided to face the surface of the element opposite to the ultrasonic wave emitting surface;
The plurality of modules are arranged side by side in the first direction,
At least two modules among the plurality of modules have temperature detection units provided on the backing load material,
An arrangement pattern indicating the arrangement of the temperature detection units in the second direction is different between two modules adjacent in the first direction among the plurality of modules,
ultrasound probe. a plurality of vibrating elements arranged in a grid pattern in first and second directions that intersect the radiation direction of the ultrasonic waves and that intersect with each other;
A back surface load provided for each corresponding predetermined number of transducer elements among the plurality of transducer elements and provided so as to face a surface of the predetermined number of transducer elements on the opposite side to the ultrasonic wave radiation surface. a plurality of modules having material;
with
The plurality of modules are arranged side by side in the first direction,
At least two modules among the plurality of modules have temperature detection units provided on the backing load material,
An arrangement pattern indicating the arrangement of the temperature detection units in the second direction is different between two modules adjacent in the first direction among the plurality of modules,
ultrasound probe. 3. The ultrasonic probe according to claim 1, wherein each of said plurality of modules has said temperature detector. 4. The ultrasonic probe according to claim 3, wherein each of said plurality of modules has one said temperature detector. The back load material is
a first layer that attenuates and absorbs ultrasonic waves radiated from the vibration element in a direction opposite to the direction in which the ultrasonic waves are radiated;
a second layer provided on the side opposite to the vibrating element side of the first layer and formed of a member having a thermal conductivity equal to or higher than a predetermined value;
has
The temperature detection unit is provided in the second layer,
The ultrasonic probe according to any one of claims 1-4. The backing material has a layer that attenuates and absorbs ultrasonic waves from the vibration element that propagate in a direction opposite to the radiation direction of the ultrasonic waves,
The temperature detection unit is provided in the layer,
The ultrasonic probe according to any one of claims 1-4. The ultrasonic probe according to any one of claims 1 to 6, further comprising a converter that converts a plurality of detection signals output by said plurality of temperature detectors into a single detection signal. 8. The ultrasonic probe according to claim 7, wherein said converter outputs a detection signal indicating the highest temperature among said plurality of detection signals. 8. The ultrasonic probe according to claim 7, wherein said conversion unit switches and outputs each of said plurality of detection signals at regular time intervals. The ultrasonic probe according to any one of claims 7 to 9,
The temperature indicated by the detection signal output from the conversion unit, or the highest temperature among a plurality of temperatures indicated by the plurality of detection signals output from the conversion unit during a certain period of time, is a first threshold. In the case above, a control unit that stops the scanning operation of the ultrasonic probe or stops the supply of power to the ultrasonic probe;
An ultrasound diagnostic device. The control unit is configured such that the temperature indicated by the detection signal output from the conversion unit or the highest temperature among the plurality of temperatures is equal to or higher than a second threshold smaller than the first threshold and the first 11. The ultrasonic diagnosis according to claim 10, further comprising controlling the ultrasonic probe so as to stop transmission of ultrasonic waves when the ultrasonic probe is left in the air if it is less than a threshold. Device. wherein the temperature indicated by the detection signal output from the conversion unit or the highest temperature among the plurality of temperatures is equal to or higher than a third threshold smaller than the second threshold and the second 12. The ultrasonic diagnostic apparatus according to claim 11, wherein said ultrasonic probe is controlled so as to lower the transmission voltage when it is less than a threshold.

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