JP6781008B2 - Ultrasonic probe and ultrasonic diagnostic equipment - Google Patents

Description

Embodiments of the present invention relate to ultrasonic probes and ultrasonic diagnostic equipment.

In the current ultrasonic diagnostic imaging, an ultrasonic probe that can be inserted into the body cavity of a subject and can observe the organs around the body cavity is used. Such an ultrasonic probe is called an intracoelomic probe. One of the intracavitary probes is the transesophageal (TEE) probe. Transesophageal probes are used, for example, when performing ultrasonography of the heart. Some transesophageal probes have two-dimensionally arranged vibrating elements. Such an intracoelomic probe is called a two-dimensional transesophageal (2D-TEE) probe.

In a two-dimensional intracavitary probe, a group of vibrating elements that transmit and receive ultrasonic waves may be arranged on an electronic circuit such as an ASIC (Application Specific Integrated Circuit). With this arrangement, the tip portion in which the vibrating element group and the electronic circuit are housed is downsized. In addition, the electronic circuit has realized high performance of the two-dimensional intracavitary probe.

Japanese Unexamined Patent Publication No. 2008-295749

An object to be solved by the present invention is to provide an ultrasonic probe and an ultrasonic diagnostic apparatus capable of suppressing a temperature rise of a tip portion during transmission and reception of ultrasonic waves.

The ultrasonic probe of the embodiment includes a tip portion, an operation portion, a bending portion, and a heat conduction portion. The tip portion includes a vibrating element that transmits and receives ultrasonic waves, an electronic circuit that is electrically connected to the vibrating element, and a frame provided with the electronic circuit. The operation unit accepts operations from the operator. The bent portion has a cable that is electrically connected to the electronic circuit, and the direction of the tip portion is changed by bending in response to an operation on the operating portion. The heat conductive portion has a single member extending from the tip portion to at least the bent portion, is in contact with the frame at the tip portion, and is adjacent to the cable at the bent portion.

FIG. 1 is a diagram for explaining an example of the configuration of the ultrasonic diagnostic apparatus according to the embodiment. FIG. 2 is a diagram showing an example of the appearance of the ultrasonic probe according to the embodiment. FIG. 3 is a diagram showing an example of the configuration of the ultrasonic probe according to the embodiment. FIG. 4 is a diagram for explaining an example of the high heat conductive member according to the embodiment. FIG. 5 is a diagram for explaining an example of a method of attaching the high thermal conductive member. FIG. 6 is a cross-sectional view taken along the line AA of FIG. FIG. 7 is a cross-sectional view taken along the line BB of FIG. FIG. 8 is a cross-sectional view taken along the line CC of FIG. FIG. 9 is a sectional view taken along line DD of FIG. FIG. 10 is a cross-sectional view of a cable around which a high thermal conductive member is wound in step 6. FIG. 11 is a cross-sectional view of a cable around which the high thermal conductive member according to the first modification is wound. FIG. 12 is a diagram for explaining an example of the high heat conductive member according to the second modification. FIG. 13 is a diagram for explaining an example of the high heat conductive member according to the third modification. FIG. 14 is a diagram for explaining an example of the high heat conductive member according to the fourth modification. FIG. 15 is a diagram for explaining an example of a method of attaching the high thermal conductive member according to the fourth modification. FIG. 16 is a diagram for explaining an example of the high heat conductive member according to the fifth modification. FIG. 17 is a diagram for explaining an example of a method of attaching the high heat conductive member according to the fifth modification.

Hereinafter, the ultrasonic probe and the ultrasonic diagnostic apparatus according to the embodiment will be described with reference to the drawings. The embodiment is not limited to the following embodiments.

(Embodiment)
First, an example of the configuration of the ultrasonic diagnostic apparatus having the ultrasonic probe according to the embodiment will be described. FIG. 1 is a diagram for explaining an example of the configuration of the ultrasonic diagnostic apparatus 100 according to the embodiment. As shown in FIG. 1, the ultrasonic diagnostic apparatus 100 according to the embodiment includes an ultrasonic probe 1, a display 91, an input device 92, and an apparatus main body 10.

The ultrasonic probe 1 has an ultrasonic transducer. The ultrasonic transducer has a plurality of vibrating elements that transmit ultrasonic waves and receive echoes (reflected waves). The plurality of vibrating elements are arranged two-dimensionally. Each vibrating element generates ultrasonic waves based on a drive signal supplied from an electronic circuit 22 described later. Then, each vibrating element receives the echo from the subject P and converts the received echo into an echo signal which is an electric signal. The ultrasonic transducer also has an acoustic matching layer provided on the vibrating element, a back load material (backing material) that suppresses the propagation of ultrasonic waves from the vibrating element to the rear, and the like. The ultrasonic probe 1 is detachably connected to the apparatus main body 10 via a connector 7 described later.

For example, when ultrasonic waves are transmitted from the ultrasonic probe 1 to the subject P, the transmitted ultrasonic waves are reflected one after another on the discontinuity surface of the acoustic impedance in the body tissue of the subject P, and the ultrasonic probe is used as an echo. It is received by a plurality of vibrating elements possessed by 1. The echo is converted into an echo signal by the vibrating element that receives the echo. The amplitude of the echo signal depends on the difference in acoustic impedance on the discontinuity where the ultrasonic waves are reflected. The echo signal when the transmitted ultrasonic pulse is reflected by the moving blood flow or the surface of the heart wall or the like depends on the velocity component of the moving body with respect to the ultrasonic transmission direction due to the Doppler effect. , Receives frequency shift.

The display 91 displays a GUI (Graphical User Interface) for the operator of the ultrasonic diagnostic apparatus 100 to input various setting requests using the input device 92, and displays an ultrasonic image or the like generated by the apparatus main body 10. To display. For example, the display 91 is realized by a liquid crystal monitor, a CRT (Cathode Ray Tube) monitor, a touch panel, or the like. The display 91 is connected to a control circuit 17 described later, and converts various information and various image data sent from the control circuit 17 into electrical signals for display and outputs the data.

The input device 92 receives various instructions and various information input operations from the operator. For example, the input device 92 is realized by a trackball, a switch, a dial, a touch command screen, a foot switch, a joystick, or the like. The input device 92 receives various setting requests from the operator of the ultrasonic diagnostic apparatus 100, and transfers the received various setting requests to the apparatus main body 10. For example, the input device 92 receives various setting requests for controlling the ultrasonic probe 1 and transfers them to the control circuit 17 described later.

The apparatus main body 10 is an apparatus that controls the transmission and reception of ultrasonic waves by the ultrasonic probe 1 and generates an ultrasonic image based on an echo signal based on the echo received by the ultrasonic probe 1. As shown in FIG. 1, the apparatus main body 10 includes a transmission / reception circuit 11, a B mode processing circuit 12, a Doppler processing circuit 13, an image generation circuit 14, an image storage circuit 15, an internal storage circuit 16, and a control circuit. It has 17.

The transmission / reception circuit 11 transmits a control signal to the ultrasonic probe 1 for causing the electronic circuit 22 described later to perform control for driving the vibrating element in accordance with the control of the control circuit 17. When the transmission / reception circuit 11 receives the echo data from the ultrasonic probe 1, the transmission / reception circuit 11 transmits the received echo data to the B mode processing circuit 12 and the Doppler processing circuit 13.

The B-mode processing circuit 12 receives the echo data output from the transmission / reception circuit 11, performs logarithmic amplification, envelope detection processing, etc. on the received echo data, and the signal strength is expressed by the brightness of the brightness. Generate data (B mode data). The B-mode processing circuit 12 is realized by, for example, a processor.

The Doppler processing circuit 13 receives the echo data output from the transmission / reception circuit 11, frequency-analyzes the velocity information from the received echo data, extracts the blood flow, tissue, and contrast agent echo component due to the Doppler effect, and averages the velocity. Generate data (Dopla data) that extracts moving object information such as dispersion and power for multiple points. The Doppler processing circuit 13 is realized by, for example, a processor.

The image generation circuit 14 generates an ultrasonic image from the data generated by the B mode processing circuit 12 and the Doppler processing circuit 13. That is, the image generation circuit 14 generates a B-mode image in which the echo intensity is represented by the brightness from the B-mode data generated by the B-mode processing circuit 12. Further, the image generation circuit 14 generates an average velocity image, a distributed image, a power image, or a color Doppler image as a combination image thereof representing moving object information from the Doppler data generated by the Doppler processing circuit 13. That is, the image generation circuit 14 generates an ultrasonic image based on the output from the ultrasonic probe 1. The image generation circuit 14 is an example of an image generation unit.

The image storage circuit 15 stores the ultrasonic image generated by the image generation circuit 14. The image storage circuit 15 can also store the data generated by the B-mode processing circuit 12 and the Doppler processing circuit 13. For example, the image storage circuit 15 is realized by a semiconductor memory element such as a RAM (Random Access Memory) or a flash memory, a hard disk, an optical disk, or the like.

The internal storage circuit 16 stores various data such as a control program for performing ultrasonic transmission / reception, image processing, and display processing, diagnostic information (for example, patient ID, doctor's findings, etc.), diagnostic protocol, and various body marks. To do. The internal storage circuit 16 is also used for storing images stored in the image storage circuit 15 as needed. For example, the internal storage circuit 16 is realized by a semiconductor memory element such as a RAM or a flash memory, a hard disk, an optical disk, or the like.

The control circuit 17 realizes a function as an information processing device (computer). The control circuit 17 controls the entire processing of the ultrasonic diagnostic apparatus 100. For example, the control circuit 17 has a transmission / reception circuit 11 and a B-mode processing circuit 12 based on various setting requests input from the operator via the input device 92, various control programs and various data read from the internal storage circuit 16. , Controls the processing of the Doppler processing circuit 13 and the image generation circuit 14. For example, the control circuit 17 controls the transmission / reception circuit 11 so as to generate a control signal and transmit the generated control signal to the ultrasonic probe 1. Further, the control circuit 17 is a processing result of an ultrasonic image stored in the image storage circuit 15, various images stored in the internal storage circuit 16, a GUI for processing by the image generation circuit 14, and an image generation circuit 14. Etc. are controlled to be displayed on the display 91. The control circuit 17 is realized by, for example, a processor.

The word "processor" used in the above description means, for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an integrated circuit for a specific application (Application Specific Integrated Circuit: ASIC)), or a programmable logic device (for example, , Simple Programmable Logic Device (SPLD), Complex Programmable Logic Device (CPLD), and Field Programmable Gate Array (FPGA). Instead of storing the program in the internal storage circuit 16, the program may be directly incorporated in the circuit of the processor. In this case, the processor realizes the function by reading and executing the program embedded in the circuit.

The overall configuration of the ultrasonic diagnostic apparatus 100 according to the embodiment has been described above.

Next, the ultrasonic probe 1 according to the present embodiment will be described. FIG. 2 is a diagram showing an example of the appearance of the ultrasonic probe 1 according to the embodiment. Hereinafter, the case where the ultrasonic probe 1 is a two-dimensional transesophageal probe will be described as an example, but the ultrasonic probe 1 is not limited to this.

As shown in the example of FIG. 2, the ultrasonic probe 1 includes a tip portion 2, a bending portion 3, a guiding center portion 4, an operating portion 5, a cable 6, and a connector 7.

The tip portion 2 includes a tip exterior member 2a. The tip exterior member 2a is formed of, for example, a biocompatible resin. The tip exterior member 2a houses a frame 21, which will be described later, an electronic circuit 22, which will be described later, an ultrasonic transducer 24, which will be described later, and the like.

The bent portion 3 includes an exterior member 3a. The exterior member 3a is a tubular member that houses the bending mechanism 31 described later, the cable 8 described later, and the like. The exterior member 3a has flexibility. The exterior member 3a is formed of, for example, flexible rubber or resin. One end of the exterior member 3a is connected to the tip exterior member 2a. The other end of the exterior member 3a is connected to the exterior member 4a, which will be described later.

The guiding middle portion 4 is inserted into the body cavity of the subject P together with the tip portion 2 and the bent portion 3 when taking an ultrasonic image of the subject P. The guiding center portion 4 includes an exterior member 4a. The exterior member 4a is a tubular member that houses the flexible tube 41 described later, the cable 8 described later, and the like. The exterior member 4a is connected to the exterior member 51, which will be described later.

The operation unit 5 receives an operation from the operator. The operation unit 5 includes an exterior member 51, a first knob 521, a first no-block lever 522, a second knob 531, a second no-block lever 532, a first rotation switch 541, and a second rotation switch 542. The window 55 and the suspension ring 56 are provided.

The exterior member 51 is attached with a first knob 521, a first no-block lever 522, a second knob 531, a second no-block lever 532, a first rotation switch 541, a second rotation switch 542, a window 55, a suspension ring 56, and the like. It is a tubular member.

The first knob 521, the first no-block lever 522, the second knob 531 and the second no-block lever 532 are operated by an operator when bending the bending mechanism 31, which will be described later. The first knob lever 522 is attached to the first knob 521. The second no-block lever 532 is attached to the second knob 531. The first knob 521, the first no-block lever 522, the second knob 531 and the second no-block lever 532 will be described later.

The first rotation switch 541 and the second rotation switch 542 are switches for rotating the captured ultrasonic image when performing a diagnosis. By operating the first rotary switch 541 and the second rotary switch 542, the operator can observe the ultrasonic image from an angle suitable for diagnosis.

The window 55 is a window for confirming the bent state of the bent portion 3. As shown in FIG. 2, the suspension ring 56 is an annular member provided on the exterior member 51. The suspension ring 56 is used to suspend the ultrasonic probe 1 on a hook or the like provided on the apparatus main body 10 when the ultrasonic image is not taken.

The cable 6 electrically connects the device main body 10 and the cable 8 described later at the tip portion 2. One end of the cable 6 is electrically connected to the connector 7, and the other end is electrically connected to the cable 8 described later.

The connector 7 is connected to the device main body 10 to electrically connect the ultrasonic probe 1 and the device main body 10. One end of a signal line for transmitting a signal exchanged between the apparatus main body 10 and the tip portion 2 is connected to the connector 7. Further, the connector 7 has a terminal for electrically connecting these signal lines and the device main body 10.

An example of the appearance of the ultrasonic probe 1 according to the embodiment has been described above.

Here, when the ultrasonic probe 1 transmits and receives ultrasonic waves, in addition to the power consumption due to the driving of the vibration element included in the ultrasonic transducer 24, the power consumption of the electronic circuit 22 causes the vibration element and electrons. The circuit 22 serves as a heat source for generating heat, and the tip portion 2 generates heat. Since the tip portion 2 is a portion that comes into contact with the patient P, it is necessary to keep the temperature of the tip portion 2 within a safe range. Further, the angle piece 31a in the bent portion 3 described later is formed of an alloy such as stainless steel having low thermal conductivity. Therefore, the heat generated by the heat source is stagnant at the bent portion 3, and the heat is not easily transferred from the bent portion 3 to the guiding center portion 4. Therefore, as described below, the ultrasonic probe 1 according to the present embodiment is configured to be able to suppress a temperature rise of the tip portion 2 when transmitting and receiving ultrasonic waves.

An example of the configuration of the ultrasonic probe 1 according to the embodiment will be described. FIG. 3 is a diagram showing an example of the configuration of the ultrasonic probe 1 according to the embodiment. In the example of FIG. 3, the tip exterior member 2a, the exterior member 3a, and the exterior member 4a are not shown.

As shown in the example of FIG. 3, the tip portion 2 of the ultrasonic probe 1 includes a frame 21, an electronic circuit 22, and an ultrasonic transducer 24.

The frame 21 is provided with an electronic circuit 22, an ultrasonic transducer 24, and the like. The frame 21 is a member that holds the electronic circuit 22, the ultrasonic transducer 24, and the like. The frame 21 is made of a material having thermal conductivity. As the material having thermal conductivity, for example, a metal is used. Further, the frame 21 also has a function as a frame for ensuring the rigidity of the tip portion 2.

The ultrasonic transducer 24 includes a plurality of vibrating elements 24a. The vibrating element 24a transmits and receives ultrasonic waves. The vibrating element 24a is arranged two-dimensionally. Each vibrating element 24a generates ultrasonic waves based on a drive signal supplied from the electronic circuit 22. Further, each vibrating element 24a receives an echo from the subject P and converts the received echo into an echo signal which is an electric signal. Then, each vibrating element 24a outputs an echo signal. In this way, the vibrating element 24a generates heat when transmitting and receiving ultrasonic waves. The ultrasonic transducer 24 also has an acoustic matching layer provided on the vibrating element 24a, a back load material that suppresses the propagation of ultrasonic waves from the vibrating element 24a to the rear, and the like.

The electronic circuit 22 is electrically connected to the vibrating element 24a and processes data related to ultrasonic waves transmitted and received by the vibrating element 24a. The electronic circuit 22 includes a drive signal generation circuit, a delay circuit, an addition circuit, and a transmission / reception channel control circuit.

The drive signal generation circuit repeatedly generates a rate pulse for forming a transmission ultrasonic wave at a predetermined rate frequency (PRF: Pulse Repetition Frequency), and the generated rate pulse is used as a drive signal for driving the vibrating element 24a. Is output to the delay circuit.

The delay circuit has a function of executing a predetermined delay process on the drive signal output from the drive signal generation circuit and supplying the drive signal on which the predetermined delay process is executed to the vibrating element 24a. In the present embodiment, for example, one channel is assigned to one vibrating element 24a, and a delay circuit is provided for each channel. For example, in the delay circuit, the delay amount for each vibrating element 24a required for focusing the ultrasonic waves generated from the vibrating element 24a in a beam shape and determining the transmission directivity is supplied from the drive signal generation circuit. Performs delay processing given to the signal.

Further, in addition to the above-mentioned functions, the delay circuit performs delay processing that gives a delay amount necessary for determining the reception directivity to the received echo signal when the echo signal output from the vibrating element 24a is received. Has a function of outputting the echo signal to which the delay processing has been executed to the adder circuit.

One addition circuit is provided for the group of vibrating elements 24a constituting the sub-array (group). The adder circuit executes an addition process of adding the echo signals output from the delay circuit corresponding to the vibrating element 24a constituting the subarray corresponding to the adder circuit. Then, the addition circuit converts the echo signal in which the addition process is executed into digital data, performs phase-alignment addition processing to generate echo data, and outputs the generated echo data to the apparatus main body 10.

The transmission / reception channel control circuit selects a channel to be transmitted / received, and controls each of the above-mentioned circuits so that transmission / reception of the selected channel is performed. The electronic circuit 22 may not include all the circuits of the drive signal generation circuit, the delay circuit, the addition circuit, and the transmission / reception channel control circuit described above, and some circuits may be provided by the transmission / reception circuit 11 described above. Good. For example, the electronic circuit 22 may include at least one of a drive signal generation circuit, a delay circuit, an addition circuit, and a transmission / reception channel control circuit.

A high thermal conductive member 9 composed of one sheet-like member (thermally conductive sheet, thermally conductive member) having high thermal conductivity is adhered to the surface of the frame 21 opposite to the surface 21b. .. The high thermal conductive member 9 may be composed of at least one member having high thermal conductivity (thermally conductive sheet, thermally conductive member). The high heat conductive member 9 is an example of a heat conductive portion. In the following description, the surface 21b of the frame 21 provided with the electronic circuit 22 and the ultrasonic transducer 24 is referred to as the “front surface” of the frame 21, and the surface opposite to the front surface 21b is referred to as the “back surface” of the frame 21. That is, the vibrating element 24a of the electronic circuit 22 and the ultrasonic transducer 24 is located on the front surface 21b side of the frame 21. Here, the high heat conductive member 9 bonded to the back surface of the frame 21 of the tip portion 2 will be described with reference to FIG. FIG. 4 is a diagram for explaining an example of the high thermal conductive member 9 according to the embodiment. In the example of FIG. 4, the members and the like constituting the bent portion 3 and the guiding portion 4 are not shown.

As shown in FIG. 4, one end of the cable 8 is electrically connected to the tip portion 2. More specifically, one end of the cable 8 is electrically connected to the FPC (Flexible Printed Circuits) 30 described later at the tip portion 2. The other end of the cable 8 is electrically connected to the cable 6 described above.

The high heat conductive member 9 is a member for dissipating the heat generated at the tip portion 2.

The high thermal conductive member 9 is attached to the cable 8 so as to cover the cable 8. As a result, the high thermal conductive member 9 comes into contact with the cable 8. The high thermal conductive member 9 does not have to come into contact with the cable 8. For example, the high thermal conductive member 9 may be provided around the cable 8 via another member. That is, the high thermal conductive member 9 may be adjacent to the cable 8.

Further, one end of the high thermal conductive member 9 is adhered to the back surface of the frame 21 of the tip portion 2 as described above, and the other end is adhered to the cable 8 in the guiding center portion 4 as shown in FIG. That is, in the examples of FIGS. 3 and 4, the high heat conductive member 9 extends from the tip portion 2 to the guiding center portion 4. The stretching direction of the high thermal conductive member 9 is the same as the central axis of the cable 8.

The other end of the high thermal conductive member 9 may be attached to the cable 8 at the bent portion 3. That is, the high thermal conductive member 9 may extend from the tip portion 2 to at least the bent portion 3. Even in this case, the high thermal conductive member 9 does not have to come into contact with the cable 8. For example, the high thermal conductive member 9 may be adjacent to the cable 8.

The high thermal conductive member 9 is composed of, for example, a thermal conductive sheet which is a single member (single member) in which a plastic film is laminated on carbon graphite. That is, the heat conductive sheet, which is a single member of the high heat conductive member 9, is formed of a member containing carbon graphite. Carbon graphite has anisotropy in the way heat is transferred, and the way heat is transferred differs between the thickness direction and the surface direction. For example, carbon graphite has a thermal conductivity of 1 W / m · k or more in the thickness direction and a thermal conductivity of 300 W / m · k or more in the plane direction. The plane direction is, for example, a direction along a plane orthogonal to the thickness direction. As described above, since the high thermal conductivity member 9 has high thermal conductivity in the surface direction, the heat generated at the tip portion 2 at the time of transmitting and receiving ultrasonic waves is efficiently transferred to the guiding center portion 4 or the bending portion 3 in the surface direction. Can be made to. That is, the high heat conductive member 9 can efficiently dissipate the heat generated at the tip portion 2. Therefore, the ultrasonic probe 1 according to the embodiment can suppress the temperature rise of the tip portion 2 when transmitting and receiving ultrasonic waves.

The high thermal conductivity member 9 may be formed of, for example, a member containing carbon nanotubes having high thermal conductivity.

From the above, the high thermal conductive member 9 has a single member (thermally conductive sheet) extending from the tip portion 2 to at least the bent portion 3, and comes into contact with the frame 21 at the tip portion 2 and at the bent portion 3. Adjacent to cable 8.

Further, as shown in the example of FIG. 4, the high thermal conductive member 9 is processed into a mesh shape. Since the shape is mesh-like, even if the high heat conductive member 9 is bent due to the bending of the bent portion 3, the high heat conductive member 9 is bent so as to follow the bending of the bent portion 3, so that the heat is high. The conductive member 9 is less likely to be damaged. Further, as shown in the example of FIG. 3, the high thermal conductive member 9 is provided inside the angle coma 31a described later. Therefore, the fluctuation range of the curvature of the high thermal conductive member 9 when the bent portion 3 is bent becomes smaller than that in the case where the high thermal conductive member 9 is provided outside the angle piece 31a described later. The curvature is the reciprocal of the radius of curvature of the bent member. As the fluctuation range of the curvature of the high thermal conductive member 9 becomes small, the degree of expansion / contraction of the high thermal conductive member 9 decreases. Therefore, it is possible to reduce the accumulation of mechanical fatigue in the high thermal conductive member 9. Therefore, the ultrasonic probe 1 can maintain the thermal conductivity and flexibility of the high thermal conductive member 9 for a long period of time.

Here, as a result of conducting an experiment of measuring the heat conduction efficiency of the high heat conduction member 9 processed into a mesh shape after repeating bending tens of thousands of times (for example, about 90,000 times), the heat conduction efficiency was measured tens of thousands of times. Even if the high heat conductive member 9 was bent, the heat conduction efficiency of the high heat conductive member 9 did not change substantially. From this experimental result, it can be seen that the ultrasonic probe 1 can maintain the thermal conductivity and flexibility of the high thermal conductive member 9 for a long period of time.

Returning to the description of FIG. 3, the bending portion 3 has a bending mechanism 31. The bending mechanism 31 changes the direction of the tip portion 2 by bending in response to an operation on the operation portion 5 shown in FIG. The bending mechanism 31 has a plurality of angle pieces 31a. The angle frame 31a is deformed in response to an operation on the operation unit 5 shown in FIG. As a result, the bending mechanism 31 bends. Then, when the bending mechanism 31 bends, the direction of the tip portion 2 is changed. That is, the bending mechanism 31 changes the direction of the tip portion 2 by bending according to the operation with respect to the operation portion 5.

For example, the bending mechanism 31 has a plurality of wires. One end of the wire is connected to the angle piece 31a, and the other end is connected to a member interlocking with the first knob 521 shown in FIG. Further, one end of the other wire is connected to the angle piece 31a, and the other end is connected to a member interlocking with the second knob 531 shown in FIG.

The first knob 521 is operated by an operator when the bent portion 3 is bent in a predetermined plane. When the operator operates the first knob 521, the angle piece 31a connected to the wire connected to the member interlocking with the first knob 521 is pulled, and the angle piece 31a is deformed. When the angle piece 31a is deformed, the bending mechanism 31 is bent in a predetermined plane, and the direction of the tip portion 2 is changed in the predetermined plane.

The first block lever 522 is operated by an operator when fixing the direction of the tip portion 2 on a predetermined plane.

The second knob 531 is operated by an operator when the bent portion 3 is bent in a plane orthogonal to a predetermined plane. When the operator operates the second knob 531, the angle piece 31a connected to the wire connected to the member interlocking with the second knob 531 is pulled, and the angle piece 31a is deformed. When the angle piece 31a is deformed, the bending mechanism 31 is bent in a plane orthogonal to the predetermined plane, and the direction of the tip portion 2 is changed in the plane orthogonal to the predetermined plane.

The second no-block lever 532 is operated by an operator when fixing the direction of the tip portion 2 in a plane orthogonal to a predetermined plane.

Therefore, the ultrasonic probe 1 can orient the vibrating element 24a in a direction suitable for taking an ultrasonic image by operating the first knob 521 and the second knob 531.

Returning to the description of FIG. 3, the guiding center 4 has a flexible tube 41. The flexible tube 41 is covered with the high heat conductive member 9 and the cable 8 in order to protect the high heat conductive member 9 and the cable 8.

Next, an example of the method of attaching the high thermal conductive member 9 according to the present embodiment will be described. FIG. 5 is a diagram for explaining an example of a method of attaching the high thermal conductive member 9. As shown in the example of FIG. 5, first, in step 1, the high thermal conductive member 9 is joined to the back surface 21a of the frame 21. That is, the high thermal conductive member 9 contacts the back surface 21a of the frame 21 at the tip portion 2.

FIG. 6 is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 6, a high thermal conductive member 9 is joined to the back surface 21a of the frame 21. Further, an electronic circuit 22 is adhered to the front surface 21b of the frame 21 with a resin having thermal conductivity. Further, a rewiring layer 23 is provided on the surface of the electronic circuit 22 opposite to the side on which the frame 21 is located. The electronic circuit 22 is electrically connected to the FPC 30 via the rewiring layer 23.

The FPC 30 mediates the electrical connection between the electronic circuit 22 and the cable 8. The FPC 30 is electrically connected to the cable 8. Since the cable 8 is electrically connected to the cable 6, the electronic circuit 22 can receive the control signal from the device main body 10. Further, the electronic circuit 22 can transmit echo data to the device main body 10. As shown in FIG. 6, the electronic circuit 22 receives the echo signal from the vibrating element 24a via the rewiring layer 23.

As shown in the example of FIG. 5, in step 2, the FPC 30 shown on the left side in FIG. 6 is folded back so as to pass through the back surface 21a side of the frame 21. FIG. 7 is a cross-sectional view taken along the line BB of FIG. As shown in FIG. 7, the FPC 30 is folded back along the shape of the frame 21 so as to pass through the back surface 21a side.

As shown in the example of FIG. 5, in step 3, the high heat conductive member 9 is folded inward along the folding lines 71 and 72. FIG. 8 is a cross-sectional view taken along the line CC of FIG. As shown in FIG. 8, by folding back the high thermal conductive member 9, the FPC 30 passing through the back surface 21a side is sandwiched by the high thermal conductive member 9. That is, the high heat conductive member 9 has a folded sheet-like member (heat conductive sheet).

As shown in the example of FIG. 5, in step 4, the high thermal conductive member 61 having the same shape as the high thermal conductive member 9 folded back in step 3 is bonded to the high thermal conductive member 9. FIG. 9 is a sectional view taken along line DD of FIG. As shown in FIG. 9, a vibrating element 24a and an electronic circuit 22 which are members that generate heat are provided on the front surface 21b of the frame 21, and a high heat conductive member 9 that covers the periphery of the FPC 30 is provided on the back surface 21a of the frame 21. There is. A high thermal conductive member 61 is attached to the high thermal conductive member 9.

Here, it is conceivable that the FPC 30 is provided directly on the frame 21 and the high heat conductive member 9 comes into contact with the frame 21 via the FPC 30. However, in such a case, since the FPC 30 has poor thermal conductivity, it becomes difficult for heat to be transferred from the FPC 30 to the high thermal conductive member 9. Therefore, the heat generated at the tip portion 2 cannot be efficiently dissipated.

On the other hand, in the present embodiment, as shown in FIG. 9, the FPC 30 is not directly provided on the frame 21. In the present embodiment, as shown in FIG. 9, when the heat from the vibrating element 24a and the electronic circuit 22 is transferred to the high heat conductive member 9 via the frame 21, heat is efficiently transferred to the surface direction of the high heat conductive member 9. It is propagated and heat can be efficiently transferred to the high thermal conductive member 61. As described above, the FPC 30 is provided so as not to interfere with the thermal contact between the frame 21 and the high heat conductive member 9.

Further, in the present embodiment, the high thermal conductive member 61 is attached to the high thermal conductive member 9. Therefore, the cross-sectional area of the entire high thermal conductive member becomes large. In a high thermal conductive member, the total amount of heat propagating increases as the cross-sectional area increases. Therefore, in the present embodiment, since the total amount of heat propagating is large, the heat can be dissipated efficiently. Although the case where the two high heat conductive members 9 and the high heat conductive member 61 are bonded together has been described, three or more high heat conductive members may be bonded together, or one high heat conductive member may be used. ..

As shown in the example of FIG. 5, in step 5, the high heat conductive member 9 to which the high heat conductive member 61 is attached is folded back from the tip 2 side to the cable 8 side along the folding line 73. Then, in step 6, the high thermal conductive member 9 to which the high thermal conductive member 61 is bonded is wound around the cable 8. As a result, for example, the high thermal conductive member 9 is wound around the cable 8 at the bent portion 3.

FIG. 10 is a cross-sectional view of the cable 8 around which the high thermal conductive member 9 is wound in the step 6. As shown in the example of FIG. 10, in this embodiment, since the width of the high thermal conductive member 9 is equal to or larger than the peripheral length of the cable 8, the high thermal conductive member 9 covers the entire circumference of the cable 8. That is, since the heat dissipation area of the high heat conductive member 9 is sufficiently large, the heat of the heat source can be efficiently dissipated.

The ultrasonic probe 1 and the ultrasonic diagnostic apparatus 100 according to the embodiment have been described above. According to the ultrasonic probe 1 and the ultrasonic diagnostic apparatus 100 according to the embodiment, as described above, it is possible to suppress the temperature rise of the tip portion 2 when transmitting and receiving ultrasonic waves.

(First modification according to the embodiment)
Here, in the above-described embodiment, the case where the width of the high thermal conductive member 9 is equal to or larger than the peripheral length of the cable 8 has been described. However, the width of the high thermal conductive member 9 may be shorter than the peripheral length of the cable 8. Therefore, such an embodiment will be described as a first modification according to the embodiment.

FIG. 11 is a cross-sectional view of the cable 8 around which the high thermal conductive member 9 according to the first modification is wound. As shown in the example of FIG. 11, the width of the high thermal conductive member 9 is shorter than the peripheral length of the cable 8. Therefore, the high thermal conductive member 9 covers a part of the circumference of the cable 8. As described above, in the first modification, a high heat conductive member having a small size is used as the high heat conductive member 9. As the size becomes smaller, costs such as price can be kept low. Therefore, according to the first modification, the high thermal conductive member 9 having a small size can be used to suppress the temperature rise of the tip portion 2 at the time of transmitting and receiving ultrasonic waves while keeping the cost low.

(Second modification according to the embodiment)
Further, in the above-described embodiment, the case where the high heat conductive member 9 has a mesh shape has been described. However, the shape of the high thermal conductive member 9 is not limited to this. Therefore, as a second modification and a third modification according to the embodiment, another shape of the high heat conductive member 9 will be described.

First, a second modification will be described. FIG. 12 is a diagram for explaining an example of the high heat conductive member according to the second modification. As shown in the example of FIG. 12, the shape of the high thermal conductive member 9a according to the second modification is a narrow ribbon shape. The high heat conductive member 9a has a heat dissipation area large enough to dissipate the heat generated at the tip portion 2. As shown in the example of FIG. 12, the high thermal conductive member 9a is spirally wound around the cable 8 at a predetermined pitch. For example, the high thermal conductive member 9a is spirally wound around the cable 8 at the bent portion 3. Further, as in the above-described embodiment, one end of the high thermal conductive member 9a is connected to the back surface 21a of the frame 21, and the other end is connected to the cable 8 in the bent portion 3 or the guiding portion 4. Since the high heat conductive member 9a is wound around the cable 8, the high heat conductive member 9a follows the bending of the bent portion 3 even when the high heat conductive member 9a is bent due to the bending of the bent portion 3. Is bent, so that the high thermal conductive member 9a is less likely to be damaged. Therefore, the ultrasonic probe according to the second modification can maintain the thermal conductivity and flexibility of the high thermal conductive member 9a for a long period of time.

Further, as in the above-described embodiment, in the second modification, the temperature rise of the tip portion 2 at the time of transmitting and receiving ultrasonic waves can be suppressed.

(Third variant according to the embodiment)
Next, a third modification will be described. FIG. 13 is a diagram for explaining an example of the high heat conductive member according to the third modification. As shown in the example of FIG. 13, the high heat conductive member according to the third modification is divided into a plurality of high heat conductive members 9b along the extending direction. The plurality of high thermal conductive members 9b have a heat dissipation area large enough to dissipate the heat generated at the tip portion 2. Further, as in the above-described embodiment, one end of the high thermal conductive member 9b is connected to the back surface 21a of the frame 21, and the other end is connected to the cable 8 in the bent portion 3 or the guiding portion 4. By being divided into a plurality of high heat conductive members 9b, the high heat conductive member 9b follows the bending of the bent portion 3 even when the high heat conductive member 9b is bent due to the bending of the bent portion 3. Since it bends, the high thermal conductive member 9b is less likely to be damaged. Therefore, the ultrasonic probe according to the third modification can maintain the thermal conductivity and flexibility of the high thermal conductive member 9b for a long period of time.

Further, as in the above-described embodiment, in the third modification, the temperature rise of the tip portion 2 at the time of transmitting and receiving ultrasonic waves can be suppressed.

(Fourth variant according to the embodiment)
Further, as a fourth modification and a fifth modification according to the embodiment, another shape of the high thermal conductive member 9 will be further described.

FIG. 14 is a diagram for explaining an example of the high heat conductive member according to the fourth modification. As shown in the example of FIG. 14, the first high thermal conductive member 9d of the high thermal conductive member 9c and the third high thermal conductive member 9f of the high thermal conductive member 9h according to the fourth modification are spiral at the bent portion 3. It is wound around the cable 8 so as to intersect with each other. As shown in the example of FIG. 14, the first high heat conductive member 9d and the third high heat conductive member 9f intersect in a spiral shape.

The first high heat conductive member 9d and the third high heat conductive member 9f have a heat dissipation area large enough to dissipate the heat generated at the tip portion 2. Further, as in the above-described embodiment, one end of the first high heat conductive member 9d and the third high heat conductive member 9f is connected to the cable 8 in the bent portion 3 or the guiding middle portion 4. When the first high heat conductive member 9d and the third high heat conductive member 9f are wound around the cable 8 and the first high heat conductive member 9d and the third high heat conductive member 9f are bent as the bent portion 3 is bent. Even if there is, since the first high heat conductive member 9d and the third high heat conductive member 9f are bent so as to follow the bending of the bent portion 3, the first high heat conductive member 9d and the third high heat conductive member 9f are less likely to be damaged. .. Therefore, the ultrasonic probe according to the fourth modification can maintain the thermal conductivity and flexibility of the first high thermal conductive member 9d and the third high thermal conductive member 9f for a long period of time.

Further, as in the above-described embodiment, in the fourth modification, the temperature rise of the tip portion 2 at the time of transmitting and receiving ultrasonic waves can be suppressed.

Here, with reference to FIG. 15, an example of a method of attaching the high thermal conductive member according to the fourth modification will be described. FIG. 15 is a diagram for explaining an example of a method of attaching the high thermal conductive member according to the fourth modification.

As shown in FIG. 15, the high heat conductive member according to the fourth modification is divided into three high heat conductive members 9c, 9h, and 9 m.

The high heat conductive member 9c includes a first high heat conductive member 9d and a second high heat conductive member 9e. The first high thermal conductive member 9d and the second high thermal conductive member 9e are integrally molded. The first high thermal conductive member 9d has a substantially parallelogram shape when viewed from above. The second high thermal conductive member 9e has a rectangular shape when viewed from above.

The high heat conductive member 9h includes a third high heat conductive member 9f and a fourth high heat conductive member 9 g. The third high thermal conductive member 9f and the fourth high thermal conductive member 9g are integrally molded. The third high thermal conductive member 9f has a substantially parallelogram shape when viewed from above. The fourth high thermal conductive member 9g has a rectangular shape when viewed from above.

The shape of the high thermal conductive member 9c and the shape of the high thermal conductive member 9h are different in top view.

The high heat conductive member 9m includes a fifth high heat conductive member 9i, a sixth high heat conductive member 9j, and a seventh high heat conductive member 9k. The fifth high heat conductive member 9i, the sixth high heat conductive member 9j, and the seventh high heat conductive member 9k are integrally molded.

Explaining an example of the method of attaching the high heat conductive member according to the fourth modification, first, as shown in FIG. 14, the fifth high heat conductive member 9i of the high heat conductive member 9 m is joined to the side surface 21c of the frame 21 to have high heat. The sixth high thermal conductive member 9j of the conductive member 9m is joined to the side surface 21d of the frame 21. Further, the seventh high thermal conductive member 9k of the high thermal conductive member 9m is joined to the back surface 21a of the frame 21.

Then, as shown in FIG. 14, the fourth high thermal conductive member 9g of the high thermal conductive member 9h is attached to the fifth high thermal conductive member 9i. Then, as shown in FIG. 14, the third high thermal conductive member 9f of the high thermal conductive member 9h is spirally wound around the cable 8.

Then, as shown in FIG. 14, the second high thermal conductive member 9e of the high thermal conductive member 9c is attached to the sixth high thermal conductive member 9j. Then, as shown in FIG. 14, the first high thermal conductive member 9d of the high thermal conductive member 9c is spirally wound around the cable 8 so as to intersect the third high thermal conductive member 9f.

In this way, in the fourth modification, the spirally intersecting high thermal conductive members are wound around the cable 8.

(Fifth modification according to the embodiment)
Next, an example of the high thermal conductive member according to the fifth modification will be described. FIG. 16 is a diagram for explaining an example of the high heat conductive member according to the fifth modification. As shown in the example of FIG. 16, the first high thermal conductive member 9d of the high thermal conductive member 9c and the eighth high thermal conductive member 9o of the high thermal conductive member 9n according to the fifth modification are spiral in the bent portion 3. It is wound around the cable 8 in the same direction. As shown in the example of FIG. 16, the first high heat conductive member 9d and the eighth high heat conductive member 9o have a double helix. The first high thermal conductive member 9d and the eighth high thermal conductive member 9o may overlap.

The first high thermal conductive member 9d and the eighth high thermal conductive member 9o have a heat dissipation area large enough to dissipate the heat generated at the tip portion 2. Further, as in the above-described embodiment, one end of the first high heat conductive member 9d and the eighth high heat conductive member 9o is connected to the cable 8 in the bent portion 3 or the guiding middle portion 4. When the first high heat conductive member 9d and the eighth high heat conductive member 9o are wound around the cable 8 and the first high heat conductive member 9d and the eighth high heat conductive member 9o are bent as the bent portion 3 is bent. Even if there is, since the first high heat conductive member 9d and the eighth high heat conductive member 9o bend so as to follow the bending of the bent portion 3, the first high heat conductive member 9d and the eighth high heat conductive member 9o are less likely to be damaged. .. Therefore, the ultrasonic probe according to the fifth modification can maintain the thermal conductivity and flexibility of the first high thermal conductive member 9d and the eighth high thermal conductive member 9o for a long period of time.

Further, as in the above-described embodiment, in the fifth modification, the temperature rise of the tip portion 2 at the time of transmitting and receiving ultrasonic waves can be suppressed.

Here, an example of a method of attaching the high thermal conductive member according to the fifth modification will be described with reference to FIG. FIG. 17 is a diagram for explaining an example of a method of attaching the high heat conductive member according to the fifth modification.

As shown in FIG. 17, the high heat conductive member according to the fifth modification is divided into three high heat conductive members 9c, 9n, and 9 m. The high thermal conductive members 9c and 9m according to the fifth modification have the same configuration as the high thermal conductive members 9c and 9m according to the fourth modification, and thus the description thereof will be omitted.

The high heat conductive member 9n includes an eighth high heat conductive member 9o and a ninth high heat conductive member 9p. The eighth high thermal conductive member 9o and the ninth high thermal conductive member 9p are integrally molded. The eighth high thermal conductive member 9o has a substantially parallelogram shape when viewed from above. The ninth high thermal conductive member 9p has a rectangular shape when viewed from above.

The shape of the high thermal conductive member 9c and the shape of the high thermal conductive member 9n are substantially the same in top view.

Explaining an example of the method of attaching the high heat conductive member according to the fifth modification, first, as shown in FIG. 16, the fifth high heat conductive member 9i of the high heat conductive member 9 m is framed as in the fourth modified example. It is joined to the side surface 21c of the 21 and the sixth high heat conductive member 9j of the high heat conductive member 9m is joined to the side surface 21d of the frame 21. Further, the seventh high thermal conductive member 9k of the high thermal conductive member 9m is joined to the back surface 21a of the frame 21.

Then, as shown in FIG. 16, the ninth high thermal conductive member 9p of the high thermal conductive member 9n is attached to the fifth high thermal conductive member 9i. Then, as shown in FIG. 16, the eighth high thermal conductive member 9o of the high thermal conductive member 9n is spirally wound around the cable 8.

Then, as shown in FIG. 16, the second high heat conductive member 9e of the high heat conductive member 9c is attached to the sixth high heat conductive member 9j. Then, as shown in FIG. 14, the first high thermal conductive member 9d of the high thermal conductive member 9c is spirally wound around the cable 8.

In this way, in the fifth modification, the high thermal conductive member forming a double helix is wound around the cable 8.

In the fourth modification described above, the case where the high heat conductive member is divided into three high heat conductive members 9c, 9h and 9 m is illustrated, but the three high heat conductive members 9c, 9h and 9 m are integrally molded. You may. Similarly, in the fifth modification, the case where the high thermal conductive member is divided into three high thermal conductive members 9c, 9n, 9m is illustrated, but the three high thermal conductive members 9c, 9n, 9m are integrally molded. May be good.

According to the ultrasonic probe and the ultrasonic diagnostic apparatus according to at least one embodiment or modification described above, it is possible to suppress a temperature rise of the tip portion 2 when transmitting and receiving ultrasonic waves.
Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention as well as the invention described in the claims and the equivalent scope thereof.

1 Ultrasonic probe 2 Tip part 3 Bending part 5 Operation part 9 High heat conductive member

Claims (13)

A tip portion having a vibrating element for transmitting and receiving ultrasonic waves, an electronic circuit electrically connected to the vibrating element, and a frame provided with the electronic circuit.
An operation unit that accepts operations from the operator,
A bent portion having a cable electrically connected to the electronic circuit and bending in response to an operation on the operating portion to change the direction of the tip portion.
A heat conductive portion having a single member extending from the tip portion to at least the bent portion, contacting the frame at the tip portion, and adjacent to the cable at the bent portion.
Ultrasonic probe with. The ultrasonic probe according to claim 1, wherein the heat conductive portion is wound around the cable at the bent portion. The ultrasonic probe according to claim 1, wherein the tip portion has FPCs (Flexible Printed Circuits) that mediate the electrical connection between the electronic circuit and the cable. The vibrating element is located on the front side of the frame.
The ultrasonic probe according to claim 1, wherein the heat conductive portion contacts the back surface of the frame at the tip portion. The electronic circuit is located on the front side of the frame and
The ultrasonic probe according to claim 4, wherein the tip portion has an FPC that mediates an electrical connection between the electronic circuit and the cable and passes through the back side of the frame. The ultrasonic probe according to any one of claims 1 to 5, wherein the heat conductive portion is composed of at least one heat conductive sheet. The thermal conductivity sheet has a thermal conductivity of 1 W / m · k or more in the thickness direction and a thermal conductivity of 300 W / m · k or more in the direction along a plane orthogonal to the thickness direction. 6. The ultrasonic probe according to 6. The ultrasonic probe according to any one of claims 1 to 7, wherein the electronic circuit includes at least one of a drive signal generation circuit, a delay circuit, an addition circuit, and a transmission / reception channel control circuit. The bent portion has an angle top that deforms in response to an operation on the operating portion.
The ultrasonic probe according to any one of claims 1 to 8, wherein the heat conductive portion is located inside the angle top at the bent portion. The single member is a sheet-shaped heat conductive member.
The heat conductive portion has the folded heat conductive member.
The ultrasonic probe according to any one of claims 1 to 9. The heat conductive portion is spirally wound around the cable at the bent portion.
The ultrasonic probe according to any one of claims 1 to 10. The single member is made of a member containing carbon graphite.
The ultrasonic probe according to any one of claims 1 to 11. The ultrasonic probe according to any one of claims 1 to 12 .
An image generator that generates an ultrasonic image based on the output from the ultrasonic probe ,
An ultrasonic diagnostic device equipped with.

Images