JP2019186525A - Coil component - Google Patents

Abstract

To provide a coil component in which a coil portion is embedded in an element body including a resin material, and miniaturization is advantageously achieved.SOLUTION: A coil component 1a includes an element body including a filler and a resin material, a coil portion configured by a coil conductor embedded in the element body, and a pair of external electrodes 4a and 5a electrically connected to the coil conductor. The coil conductor is covered with a glass layer.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to coil components.

  As a coil component in which a coil conductor is embedded in an element body, a coil component in which an α-winding coil is embedded in an element body made of a composite material including metal particles and a resin material is known (Patent Document 1). ).

JP, 2014-201466, A

  A coil component using a composite material containing a resin material as described above is prepared by preparing a sheet of composite material containing a resin material, placing a coil thereon, and covering another sheet of composite material from above the coil. It is manufactured by covering and compression molding. When manufacturing a coil component by sandwiching a separately formed α-wound coil in a composite material sheet, it is difficult to reduce the size of the coil, and the strength of the coil portion decreases as the size is reduced. Therefore, compression molding becomes difficult.

  An object of the present invention is to provide a coil component in which a coil portion is embedded in an element body including a resin material, which is advantageous for further downsizing.

The present disclosure includes the following aspects.
[1] An element body including a filler and a resin material, a coil portion composed of a coil conductor embedded in the element body, and a pair of external electrodes electrically connected to the coil conductor A coil component,
A coil component, wherein the coil conductor is covered with a glass layer.
[2] The coil component according to [1], wherein the glass layer has a thickness of 3 μm or more and 30 μm or less.
[3] The coil component according to [1] or [2], wherein the thickness of the coil conductor is 3 μm or more and 200 μm or less.
[4] The coil component according to any one of [1] to [3], wherein the external electrode is provided on a lower surface of the element body.
[5] The coil component according to any one of [1] to [4], wherein the filler is metal particles, ferrite particles, or glass particles.
[6] The coil component according to [5], wherein the filler is metal particles.
[7] The coil component according to any one of [1] to [6], wherein an axial direction of the coil portion is substantially parallel to a lower surface of the element body.
[8] The coil component according to any one of [1] to [7], wherein the coil conductor is fired and the element body is not fired.
[9] An element body including a filler and a resin material, a coil portion composed of a coil conductor embedded in the element body, and a pair of external electrodes electrically connected to the coil conductor. A method of manufacturing a coil component in which the coil conductor is covered with a glass layer,
Forming a conductor paste layer with a photosensitive metal paste containing a metal constituting the coil conductor on a substrate using a photolithography method;
A step of forming a glass paste layer so as to cover the conductor paste layer with a photosensitive glass paste containing glass constituting the glass layer using a photolithography method,
Forming a holding layer with a photosensitive paste that can be removed after firing in a region where the conductive paste layer and the glass paste layer do not exist on the substrate; and the conductive paste layer, the glass paste layer, and the holding layer The manufacturing method of the coil components including the process of baking the board | substrate with which it was formed, and forming a coil part on a board | substrate.
[10] Furthermore, a step of press-fitting an element body sheet containing an element element material into the coil portion formed on the substrate;
Removing the substrate;
The method for manufacturing a coil component according to the above [9], including a step of applying an element sheet to a portion from which the substrate has been removed.

  According to the present disclosure, it is possible to provide a coil component that is advantageous for downsizing.

FIG. 1 is a perspective view of a coil component 1a according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view showing a cut surface along the line xx of the coil component 1a of FIG. FIG. 3 is a perspective view of the coil portion 3a of the coil component 1a of FIG. 4 (1) to 4 (6) are diagrams for explaining a method of manufacturing the coil component 1a in the embodiment. 5 (1) to 5 (4) are diagrams for explaining a method of manufacturing the coil component 1a in the embodiment. 6 (1) to 6 (3) are diagrams for explaining a method of manufacturing the coil component 1a in the embodiment. 7 (1) to 7 (4) are diagrams for explaining a method of manufacturing a coil component in another embodiment. FIG. 8 is a cross-sectional view showing a cut surface of another coil component. FIG. 9 is a perspective view of a coil portion 3a 'of another coil component. FIG. 10 is a perspective view of a coil component 1b according to an embodiment of the present disclosure. 11 is a cross-sectional view showing a cut surface along the line xx of the coil component 1b of FIG. FIG. 12 is a perspective view of the coil portion 3b of the coil component 1b of FIG. FIGS. 13 (1) to (6) are diagrams for explaining a method of manufacturing the coil component 1b in the embodiment. 14 (1) to 14 (4) are diagrams for explaining a method of manufacturing the coil component 1b in the embodiment. FIG. 15 is a perspective view of a coil component 1c according to an embodiment of the present disclosure. 16 is a cross-sectional view showing a cut surface along the line xx of the coil component 1c of FIG. FIG. 17 is a perspective view of the coil portion 3c of the coil component 1c of FIG. 18 (1) to 18 (6) are diagrams for explaining a method of manufacturing the coil component 1c in the embodiment. FIGS. 19 (1) to 19 (8) are diagrams for explaining a method of manufacturing the coil component 1c in the embodiment.

  Hereinafter, the coil component of the present disclosure will be described in detail with reference to the drawings. However, the shape and arrangement of the coil component and each component of the present embodiment are not limited to the illustrated example.

(Embodiment 1)
A perspective view of the coil component 1a of the present embodiment is schematically shown in FIG. 1, and a sectional view is schematically shown in FIG. A perspective view of the coil portion 3a of the coil component 1a is schematically shown in FIG. However, the shape and arrangement of the coil components and the constituent elements of the following embodiments are not limited to the illustrated examples.

  As shown in FIGS. 1 to 3, the coil component 1 a of the present embodiment has a substantially rectangular parallelepiped shape. In the coil component 1a, the left and right surfaces of FIG. 2 are referred to as “end surfaces”, the upper surface of the drawing is referred to as “upper surface”, the lower surface of the drawing is referred to as “lower surface”, and the front surface of the drawing is referred to as “front surface”. The front side is called “front side”, and the surface on the side of the drawing is called “back side”. The coil component 1a schematically includes an element body 2a, a coil portion 3a embedded therein, and a pair of external electrodes 4a and 5a. The coil portion 3a has an axis in the front-back direction of the element body, that is, an axis parallel to the mounting surface. As shown in FIG. 3, the coil portion 3a has lead portions 6a and 7a, and the lead portions 6a and 7a are electrically connected to the external electrodes 4a and 5a, respectively. As shown in FIG. 2, the coil conductor 8a of the coil portion 3a is covered with a glass layer 9a. The coil component 1a is covered with an insulating layer 10a except for the external electrodes 4a and 5a.

  In this specification, the length of the coil component 1a is referred to as “L”, the width as “W”, and the thickness (height) as “T” (see FIG. 1). In this specification, a surface parallel to the front surface and the back surface is referred to as an “LT surface”, a surface parallel to the end surface is referred to as a “WT surface”, and a surface parallel to the upper surface and the lower surface is referred to as an “LW surface”.

  The element body 2a is composed of a composite material including a filler and a resin material.

  Although it does not specifically limit as said resin material, For example, thermosetting resins, such as an epoxy resin, a phenol resin, a polyester resin, a polyimide resin, a polyolefin resin, are mentioned. Only one type of resin material may be used, or two or more types may be used.

  The filler is preferably metal particles, ferrite particles or glass particles, more preferably metal particles. You may use this filler only by 1 type or in combination of multiple types.

  In one embodiment, the filler preferably has an average particle size of 0.5 μm to 50 μm, more preferably 0.5 μm to 30 μm, and still more preferably 0.5 μm to 10 μm. By setting the average particle size of the filler to 0.5 μm or more, handling of the filler becomes easy. In addition, by setting the average particle size of the filler to 50 μm or less, it is possible to increase the filling rate of the filler and to obtain the filler characteristics more effectively. For example, when the filler is metal particles, the magnetic properties are improved.

  Here, the average particle diameter is calculated from the equivalent circle diameter of the filler in the SEM (scanning electron microscope) image of the cross section of the element body. For example, the average particle diameter is obtained by photographing a plurality of (for example, 5) regions (for example, 130 μm × 100 μm) with a SEM on the cross-section obtained by cutting the coil component 1a, and using this image analysis software ( For example, it can be obtained by analyzing using Asahi Kasei Engineering Co., Ltd. (A image-kun (registered trademark)) and calculating and calculating an equivalent circle diameter for 500 or more metal particles.

  Although it does not specifically limit as a metal material which comprises the said metal particle, For example, the alloy containing iron, cobalt, nickel, or gadolinium, or these 1 type, or 2 or more types is mentioned. Preferably, the metal material is iron or an iron alloy. The iron may be iron itself or an iron derivative such as a complex. The iron derivative is not particularly limited, and examples thereof include carbonyl iron that is a complex of iron and CO, preferably pentacarbonyl iron. In particular, a hard grade carbonyl iron (for example, a hard grade carbonyl iron manufactured by BASF) having an onion skin structure (a structure in which a concentric spherical layer is formed from the center of the particle) is preferable. Although it does not specifically limit as an iron alloy, For example, Fe-Si type alloy, Fe-Si-Cr type alloy, Fe-Si-Al type alloy, Ne-Ni type alloy, Fe-Co type alloy, Fe-Si- B-Nb-Cu based alloys and the like can be mentioned. The alloy may further contain B, C, etc. as other subcomponents. The content of the subcomponent is not particularly limited, but may be, for example, 0.1 wt% or more and 5.0 wt% or less, preferably 0.5 wt% or more and 3.0 wt% or less. The metal material may be only one type or two or more types.

  The surface of the metal particles may be covered with a coating of an insulating material (hereinafter also simply referred to as “insulating coating”). By covering the surface of the metal particles with an insulating coating, the specific resistance inside the element body can be increased.

  The surface of the metal particles only needs to be covered with an insulating film to such an extent that the insulating property between the particles can be increased, and only a part of the surface of the metal particles may be covered with the insulating film. The shape of the insulating coating is not particularly limited, and may be a mesh or a layer. In a preferred embodiment, a region of 30% or more, preferably 60% or more, more preferably 80% or more, further preferably 90% or more, particularly preferably 100% of the surface of the metal particle is covered with an insulating coating. May be.

  The thickness of the insulating coating is not particularly limited, but is preferably 1 nm to 100 nm, more preferably 3 nm to 50 nm, still more preferably 5 nm to 30 nm, for example, 10 nm to 30 nm, or 5 nm to 20 nm. By increasing the thickness of the insulating coating, the specific resistance of the element body can be further increased. Further, by reducing the thickness of the insulating coating, the amount of metal material in the element body can be increased, the magnetic characteristics of the element body can be improved, and the coil parts can be easily downsized. Become.

In one embodiment, the insulating coating is formed of an insulating material containing Si. Examples of the insulating material containing Si include a silicon-based compound, for example, SiO _x (x is 1.5 to 2.5, typically SiO ₂ ).

  In one embodiment, the insulating coating is an oxide film formed by oxidizing the surface of metal particles.

  The method of coating the insulating film is not particularly limited, and coating methods known to those skilled in the art, such as sol-gel method, mechanochemical method, spray drying method, fluidized bed granulation method, atomizing method, barrel sputtering, etc. Can be used.

  Although it does not specifically limit as a ferrite material which comprises the said ferrite particle, For example, the ferrite material which contains Fe, Zn, Cu, and Ni as a main component is mentioned.

  In one embodiment, the ferrite particles may be covered with an insulating coating similarly to the metal particles. By covering the surfaces of the ferrite particles with an insulating coating, the specific resistance inside the element body can be increased.

  Although it does not specifically limit as a glass material which comprises the said glass particle, For example, Bi-BO type | system | group glass, VPO type | system | group glass, Sn-PO type | system | group glass, V-Te-O type | system | group glass, etc. are mentioned. Can be mentioned.

  In the coil component 1a of the present embodiment, as shown in FIG. 2 and FIG. 3, the coil part 3a is pulled out below the element body 2a by the extraction parts 6a and 7a. Exposed on the bottom surface. The axis of the coil portion 3a is parallel to the mounting surface, that is, parallel to the direction from the front surface to the back surface of the element body 2a (that is, the W direction). By making the axis of the coil part parallel to the mounting surface, it is possible to reduce the number of lead parts formed on the side of the winding part of the coil part, or to form the lead part on the side of the winding part There is no. In other words, in the plan view, the region where the winding portion and the lead portion overlap can be made smaller or eliminated. Therefore, the stray capacitance generated between the winding part and the external electrode can be reduced. Further, since the diameter of the winding can be increased, the L value acquisition efficiency can be increased. The number of turns of the coil portion 3a of the coil component 1a is 1.5. However, the number of turns of the coil component of the present disclosure is not particularly limited, and can be appropriately selected according to the purpose.

  In the coil component 1a, the coil conductor 8a constituting the coil portion 3a is laminated in the W direction. Therefore, the cross section of the coil conductor 8a constituting the coil portion 3a is long in the T direction and short in the L direction. By forming the coil conductor 8a as described above, the stray capacitance between the coil portion 3a and the external electrodes 4a and 5a can be reduced.

  Although the electroconductive material which comprises the said coil conductor 8a is not specifically limited, For example, gold | metal | money, silver, copper, palladium, nickel etc. are mentioned. The conductive material is preferably silver or copper, more preferably silver. Only one type of conductive material or two or more types may be used.

  The thickness of the coil conductor 8a (thickness in the left-right direction in FIG. 2) is preferably 3 μm or more and 200 μm or less, more preferably 5 μm or more and 100 μm or less, and further preferably 10 μm or more and 100 μm or less. By increasing the thickness of the coil conductor, the resistance of the coil conductor 8a can be further reduced. Further, the coil component can be further reduced in size by reducing the thickness of the coil conductor 8a.

  The width of the coil conductor 8a (the width in the vertical direction in FIG. 2) is preferably 5 μm or more and 1 mm or less, more preferably 10 μm or more and 500 μm or less, further preferably 15 μm or more and 300 μm or less, and even more preferably 20 μm or more and 100 μm or less. possible. By making the width of the coil conductor smaller, the coil conductor can be made smaller, which is advantageous for downsizing of the coil component. Further, by increasing the width of the coil conductor, the resistance of the conductive wire can be further reduced.

  The coil part 3a has lead-out parts 6a and 7a. The lead portion is drawn from the winding portion of the coil portion toward the external electrode, and is electrically connected to the external electrodes 4a and 5a, respectively.

  The width of the lead portion is preferably 1.0 to 6.0 times the width of the winding portion, more preferably more than 1.0 times to 6.0 times, and even more preferably 1.5 times to 5. It is 0 times or less, more preferably 2.0 times or more and 4.0 times or less. Here, the width of the lead-out portion is a width at a portion in contact with the external electrode, and means a width in the L direction in the present embodiment. By making the width of the lead-out portion 1.0 times or more of the width of the coil conductor, particularly larger than the width of the coil conductor, the connection with the external electrode becomes more reliable and the reliability is improved.

  In the coil component of the present disclosure, the coil conductor 8a is covered with a glass layer 9a.

Glass material forming the glass layer 9a is not particularly limited, for _example, SiO 2 _-B 2 _{O 3} based _{glass, SiO 2 -B 2 O 3 -K} 2 O based _glasses, SiO 2 _-B 2 _{O 3} - Li ₂ O—CaO based glass, SiO ₂ —B ₂ O ₃ —Li ₂ O—CaO—ZnO based glass, Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ based glass, etc. . In a preferred embodiment, the glass material is SiO ₂ —B ₂ O ₃ —K ₂ O-based glass. By using the SiO ₂ —B ₂ O ₃ —K ₂ O-based glass, the sinterability increases when the glass layer is formed.

  In one aspect, the glass layer 9a may further contain a filler. Examples of the filler contained in the glass layer include quartz, alumina, magnesia, silica, forsteride, steatite, and zirconia.

  The glass layer 9a may have a thickness of preferably 3 μm or more and 30 μm or less, more preferably 5 μm or more and 20 μm or less. By setting the thickness of the glass layer 9a to 3 μm or more, the coil portion can be supported more strongly, and the insulation between the coil portion and the element body can be enhanced. Moreover, coil components can be further reduced in size by setting the thickness of the glass layer 9a to 30 μm or less.

  The external electrodes 4a and 5a are respectively provided on the lower surface of the coil component 1a. By providing the external electrode on the lower surface, the surface mounting of the coil component 1a becomes possible. In addition, the stray capacitance is smaller than when the external electrode is provided on the end face.

  The external electrodes 4a and 5a are respectively provided on the lead portions 6a and 7a of the coil portion 3a that is led to the lower surface of the element body 2a. That is, the external electrodes 4a and 5a are electrically connected to the lead portions 6a and 7a of the coil portion 3a, respectively.

  In one embodiment, the external electrodes 4a, 5a are not only on the lead portions 6a, 7a of the coil portion 3a drawn to the bottom surface of the element body 2a, but beyond the end portions of the coil conductor, It may extend to the part.

  In one embodiment, the external electrodes 4a and 5a are provided in a region where the insulating layer 10a does not exist, that is, the entire region where the element body 2a and the coil portion 3a are exposed.

  In one aspect, the external electrodes 4a and 5a may extend to the end surface of the coil component.

  The thickness of the external electrode is not particularly limited, but may be, for example, 1 μm to 100 μm, preferably 5 μm to 50 μm, more preferably 5 μm to 20 μm.

  The external electrode is made of a conductive material, preferably one or more metal materials selected from Au, Ag, Pd, Ni, Sn and Cu.

  The external electrode is formed by applying plating or a paste containing a conductive material, and curing or baking, but is preferably formed by plating.

  The external electrode may be a single layer or a multilayer.

  In one embodiment, the external electrode is multilayer. The external electrode may preferably be a Cu layer, a Ni layer and a Sn layer, or a Ni layer and a Sn layer. By forming the Cu layer on the element body 2a, the adhesion of the plating to the element body can be improved.

  In another aspect, the external electrode can be preferably three layers of an Ag layer, a Ni layer, and a Sn layer. The Ag layer may be formed by applying a paste containing Ag powder and resin and thermally curing, or may be formed by applying and baking a paste containing Ag powder and resin. A Ni layer and an Sn layer are sequentially formed thereon by plating.

  The coil component 1a is covered with an insulating layer 10a except for the external electrodes 4a and 5a.

  The thickness of the insulating layer 10a is not particularly limited, but may be preferably 3 μm or more and 20 μm or less, more preferably 3 μm or more and 10 μm or less, and further preferably 3 μm or more and 8 μm or less. By setting the thickness of the insulating layer in the above range, it is possible to ensure the insulation of the surface of the coil component 1a while suppressing an increase in the size of the coil component 1a.

  Examples of the insulating material constituting the insulating layer 10a include resin materials having high electrical insulation such as acrylic resin, epoxy resin, and polyimide. The insulating layer 10a is formed of two or more types of resin materials. Also good. A two-layer structure of an acrylic resin and an epoxy resin is more preferable because impact resistance is improved.

  In the coil component of the present disclosure, the insulating layer 10a is not essential and may not exist.

  The coil component of the present disclosure can be miniaturized while maintaining excellent electrical characteristics. In one aspect, the length (L) of the coil component of the present disclosure is preferably 0.38 mm or more and 1.75 mm or less, more preferably 0.38 mm or more and 1.05 mm or less. In one aspect, the width (W) of the coil component of the present disclosure is preferably 0.18 mm or more and 0.95 mm or less, more preferably 0.18 mm or more and 0.55 mm or less. In a preferred embodiment, the coil component of the present disclosure has a length (L) of 1.0 mm and a width (W) of 0.5 mm, preferably a length (L) of 0.6 mm and a width (W) of 0.3 mm. More preferably, the length (L) may be 0.4 mm and the width (W) may be 0.2 mm. In one embodiment, the height (or thickness (T)) of the coil component of the present disclosure is preferably 0.95 mm or less, more preferably 0.55 mm or less.

  Next, the manufacturing method of the coil component 1a is demonstrated.

-Production of magnetic sheet (element sheet) Prepare metal particles (filler) and resin material. Metal particles and other filler components as necessary (glass powder, ceramic powder, ferrite powder, etc.) are wet mixed with the resin material to form a slurry, and then a sheet of a predetermined thickness is formed using a doctor blade method or the like. Mold and dry. Thus, a magnetic material sheet made of a composite material of metal particles and resin is produced.

-Photosensitive conductor paste Conductive particles, for example, Ag powder are prepared. A photosensitive conductor paste is prepared by mixing a predetermined amount of conductive particles with a varnish prepared by mixing a solvent and an organic component.

・ Photosensitive glass paste Prepare glass powder. A photosensitive conductor paste is prepared by mixing a predetermined amount of glass powder with a varnish prepared by mixing a solvent and an organic component.

Shape-retaining photosensitive paste A material that disappears in the firing stage and, if desired, a powder of an inorganic material that does not sinter in the firing stage are prepared. Examples of the material that disappears in the firing step include organic materials, preferably the above varnishes. Examples of the inorganic material include ceramic powder such as alumina. D50 of the inorganic material is preferably 0.1 μm or more and 10 μm or less. A shape-retaining photosensitive paste is prepared by mixing a predetermined amount of a powder of an inorganic material that is not sintered in a firing step with a varnish prepared by mixing a solvent and an organic component.

-Production of element First, a sintered ceramic substrate 21 is prepared as a substrate (FIG. 4A).

  A glass paste layer 22 is formed on the substrate 21 with the photosensitive glass paste using a photolithography method. Specifically, a photosensitive glass paste is applied, photocured through a mask, and developed to form a glass paste layer 22 (FIG. 4 (2)). Next, a shape-retaining paste layer 23 is formed with a shape-retaining photosensitive paste around the glass paste layer 22 using a photolithography method. Specifically, a shape-retaining photosensitive paste is applied, photocured through a mask, developed, and a shape-retaining paste layer 23 is formed around the glass paste layer 22 (FIG. 4B). If necessary, this procedure may be repeated to form the glass paste layer 22 and the shape retaining paste layer 23 having a predetermined thickness.

  Next, the conductive paste layer 24 is formed on the glass paste layer 22 by using a photolithography method. Specifically, a conductive paste layer 24 is formed by applying a photosensitive conductive paste, photocuring through a mask, and developing (FIG. 4 (3)). The conductive paste layer 24 is formed inside the previously formed glass paste layer 22.

  Next, a glass paste layer 25 is formed on the conductor paste layer 24 by using a photolithography method. Specifically, a photosensitive glass paste is applied, photocured through a mask, and developed to form a glass paste layer 25 so as to cover the conductor paste layer 24 (FIG. 4 (4)). At this time, the glass paste layer 25 is formed so as to expose a region to be a lead portion and a region to be a connection portion with the conductor paste layer 27 to be formed next in the region of the conductor paste layer 24. Next, a shape-retaining paste layer 26 is formed with a shape-retaining photosensitive paste around the glass paste layer 25 by using a photolithography method. Specifically, a shape-retaining photosensitive paste is applied, photocured through a mask, developed, and a shape-retaining paste layer 26 is formed around the glass paste layer 25 (FIG. 4D). If necessary, this procedure may be repeated to form the glass paste layer 25 and the shape retaining paste layer 26 having a predetermined thickness.

  Next, the conductor paste layer 27 is formed on the glass paste layer 25 by using a photolithography method. Specifically, a conductive paste layer 27 is formed by applying a photosensitive conductive paste, photocuring through a mask, and developing (FIG. 4 (5)). The conductor paste layer 27 is formed inside the previously formed glass paste layer 25.

  Next, a glass paste layer 28 is formed on the conductor paste layer 27 by using a photolithography method. Specifically, a photosensitive glass paste is applied, photocured through a mask, and developed to form a glass paste layer 28 so as to cover the conductive paste layer 27 (FIG. 4 (6)). Next, a shape-retaining paste layer 29 is formed with a shape-retaining photosensitive paste around the glass paste layer 28 using a photolithography method. Specifically, a shape-retaining photosensitive paste is applied, photocured through a mask, developed, and a shape-retaining paste layer 29 is formed around the glass paste layer 28 (FIG. 4 (4)). If necessary, this procedure may be repeated to form the glass paste layer 28 and the shape retaining paste layer 29 having a predetermined thickness.

  A laminate is formed on the substrate as described above.

  The obtained laminate is fired at a temperature of 650 to 950 ° C. The organic material of the shape-retaining paste layer disappears upon firing, and non-sintered inorganic materials such as alumina do not sinter and remain in powder form. By removing the powder of the inorganic material, the coil portion 3a covered with the glass layer 9a is obtained on the substrate (FIG. 5 (1)). Since the coil portion 3a covered with the glass layer 9a is in close contact with the substrate 21, it is advantageous for handling such as transportation.

  Next, the magnetic material sheet is press-fitted into the coil portion 3a. The magnetic sheet 31 is disposed on the coil portion 3a and can be press-fitted by pressurizing with a mold or the like (FIG. 5 (2)).

  Next, the substrate 21 is removed by grinding or the like (FIG. 5 (3)).

  Separately, a magnetic sheet is adhered to the surface from which the substrate 21 has been removed by pressing or the like (FIG. 5 (4)). Then, it cut | disconnects with a dicer etc. and is separated into pieces.

  Next, the insulating layer 10a is formed on the entire surface of the separated element body 2a. For the formation of the insulating layer, a known method can be used. For example, a method of impregnating the insulating material by spraying the insulating material to cover the surface of the element can be used.

  Next, the insulating layer 10a where the external electrode of the element body 2a is to be formed is removed. The removal can be performed by laser irradiation or a mechanical technique (FIG. 6 (1)).

  Next, the Cu layer 35 is formed (FIG. 6 (2)). By forming the Cu layer, the external electrode can be satisfactorily formed even on the element body having low conductivity. Next, a Ni layer and a Sn layer are formed in order by plating (FIG. 6 (3)).

  As described above, the coil component 1a of the present invention is manufactured.

  In the coil component 1a described above, the number of turns of the coil part 3a is 1.5, but the number of turns of the coil component of the present disclosure is not particularly limited. For example, a coil component with 2.5 turns performs the steps shown in FIGS. 7 (1) to (4) as follows between the steps shown in FIGS. 4 (4) and 4 (5). Can be manufactured. FIG. 8 is a cross-sectional view of a coil component having 2.5 turns, and FIG. 9 is a perspective view of the coil portion 3a 'having 2.5 turns.

  After the step of FIG. 4 (4), the conductor paste layer 41 is formed on the glass paste layer 25 by using a photolithography method. Specifically, a conductive paste layer 41 is formed by applying a photosensitive conductive paste, photocuring through a mask, and developing (FIG. 7 (1)). The conductor paste layer 41 is formed inside the previously formed glass paste layer 25.

  Next, a glass paste layer 42 is formed on the conductor paste layer 41 by using a photolithography method. Specifically, a photosensitive glass paste is applied, photocured through a mask, and developed to form a glass paste layer 42 so as to cover the conductor paste layer 41 (FIG. 7 (2)). At this time, the glass paste layer 42 is formed so as to expose a region to be a lead portion and a region to be a connection portion with a conductor paste layer 44 to be formed next in the region of the conductor paste layer 41. Next, a shape-retaining paste layer 43 is formed with a shape-retaining photosensitive paste around the glass paste layer 42 using a photolithography method. Specifically, a shape-retaining photosensitive paste is applied, photocured through a mask, developed, and a shape-retaining paste layer 43 is formed around the glass paste layer 42 (FIG. 7 (2)). If necessary, this procedure may be repeated to form the glass paste layer 42 and the shape retaining paste layer 43 having a predetermined thickness.

  Next, in the same manner as in the steps shown in FIGS. 7A and 7B, a conductive paste layer 44 is formed on the glass paste layer 42 using a photolithography method (FIG. 7C). Then, a glass paste layer 45 is formed on the conductor paste layer 44, and a shape maintaining paste layer 46 is formed around the glass paste layer 45 (FIG. 7 (4)).

  Next, a coil component having a number of turns of 2.5 can be obtained by performing the steps after FIG.

Accordingly, the present disclosure
An element body including a filler and a resin material; a coil portion formed of a coil conductor embedded in the element body; and a pair of external electrodes electrically connected to the coil conductor; A method of manufacturing a coil component in which a conductor is covered with a glass layer,
Forming a conductor paste layer with a photosensitive metal paste containing a metal constituting the coil conductor on a substrate using a photolithography method;
A step of forming a glass paste layer so as to cover the conductor paste layer with a photosensitive glass paste containing glass constituting the glass layer using a photolithography method,
Forming a holding layer with a photosensitive paste that can be removed after firing in a region where the conductive paste layer and the glass paste layer do not exist on the substrate; and the conductive paste layer, the glass paste layer, and the holding layer The manufacturing method of the coil components including the process of baking the board | substrate with which was formed and forming a coil part on a board | substrate is provided.

In preferred embodiments, the present disclosure provides:
Removing the substrate;
The above manufacturing method further includes a step of applying an element sheet to the portion from which the substrate has been removed.

(Embodiment 2)
A perspective view of the coil component 1b of this embodiment is schematically shown in FIG. 10, and a cross-sectional view is schematically shown in FIG. A perspective view of the coil portion 3b of the coil component 1b is schematically shown in FIG. However, the shape and arrangement of the coil components and the constituent elements of the following embodiments are not limited to the illustrated examples.

  10-12, the coil component 1b of this embodiment differs in the axial direction of a coil part compared with above-described coil component 1a. Specifically, the coil component 1b has the following configuration. The coil component 1b has a substantially rectangular parallelepiped shape. The coil component 1b schematically includes an element body 2b, a coil portion 3b embedded therein, and a pair of external electrodes 4b and 5b. The coil portion 3b has an axis in the upper surface-lower surface direction of the element body, that is, an axis perpendicular to the mounting surface. As shown in FIG. 12, the coil portion 3b has lead portions 6b and 7b, and the lead portions 6b and 7b are electrically connected to the external electrodes 4b and 5b, respectively. As shown in FIG. 11, the coil conductor 8b of the coil portion 3b is covered with a glass layer 9b. The coil component 1b is covered with an insulating layer 10b except for the external electrodes 4b and 5b.

  A method for manufacturing the coil component 1b will be described.

  First, a sintered ceramic substrate 51 is prepared as a substrate (FIG. 13 (1)).

  A glass paste layer 52 is formed with the photosensitive glass paste on the substrate 51 using a photolithography method, and a conductor paste layer 54 for a lead portion is formed with the photosensitive conductive paste (FIG. 13). (2)). Next, a shape-retaining paste layer 53 is formed with a shape-retaining photosensitive paste around the glass paste layer 52 by photolithography (FIG. 13B). If necessary, this procedure may be repeated to form a glass paste layer 52, a shape maintaining paste layer 53, and a conductor paste layer 54 having a predetermined thickness.

  Next, a conductor paste layer 55 is formed on the glass paste layer 52 by using a photolithography method (FIG. 13 (3)). Further, the conductor paste layer 55 is also formed on the conductor paste layer 54 for the lead portion.

  Next, a glass paste layer 56 is formed on the conductor paste layer 55 by using a photolithography method (FIG. 13 (4)). At this time, the conductor paste layer 57 is formed in the region to be the connection portion of the coil conductor (FIG. 13 (4)). Next, a shape-retaining paste layer 58 is formed with a shape-retaining photosensitive paste around the glass paste layer 56 using a photolithography method (FIG. 13 (4)). If necessary, this procedure may be repeated to form a glass paste layer 56, a conductor paste layer 57, and a shape maintaining paste layer 58 having a predetermined thickness.

  Next, a conductor paste layer 59 is formed on the glass paste layer 56 by using a photolithography method (FIG. 13 (5)).

  Next, a glass paste layer 60 is formed on the conductor paste layer 59 by using a photolithography method (FIG. 13 (6)). Next, a shape-retaining paste layer 61 is formed with a shape-retaining photosensitive paste around the glass paste layer 60 using a photolithography method (FIG. 13 (6)). If necessary, this procedure may be repeated to form the glass paste layer 60 and the shape retaining paste layer 61 having a predetermined thickness.

  A laminate is formed on the substrate as described above.

  Thereafter, similarly to the coil component 1a, the laminate is fired, the element body portion is formed with a magnetic sheet, and the external electrode is formed by plating, whereby the coil component 1b is manufactured.

  In the coil component 1b described above, the number of turns of the coil part 3b is 1.5, but the number of turns of the coil component of the present disclosure is not particularly limited. For example, a coil component having 2.5 turns performs the steps shown in FIGS. 14 (1) to (4) as follows between the steps shown in FIGS. 13 (4) and 13 (5). Can be manufactured.

  After the step of FIG. 13 (4), a conductive paste layer 62 is formed on the glass paste layer 56 by using a photolithography method (FIG. 14 (1)).

  Next, a glass paste layer 63 is formed on the conductor paste layer 62 by using a photolithography method (FIG. 14 (2)). At this time, the conductor paste layer 64 is formed in the region of the conductor paste layer 62 in the region to be the lead portion and the region to be connected to the conductor paste layer 66 to be formed next (FIG. 14 (2)). . Next, a shape-retaining paste layer 65 is formed with a shape-retaining photosensitive paste around the glass paste layer 63 by using a photolithography method (FIG. 14B). If necessary, this procedure may be repeated to form a glass paste layer 63, a conductor paste layer 64, and a shape maintaining paste layer 65 having a predetermined thickness.

  Next, similarly to the steps shown in FIGS. 14A and 14B, a conductive paste layer 66 is formed on the glass paste layer 63 by using a photolithography method (FIG. 14C), and further Then, a glass paste layer 67 and a conductor paste layer 68 are formed on the conductor paste layer 66, and a shape maintaining paste layer 69 is formed around the glass paste layer 67 (FIG. 14 (4)).

  Next, a coil component having a number of turns of 2.5 can be obtained by performing the steps after FIG.

(Embodiment 3)
A perspective view of the coil component 1c of the present embodiment is schematically shown in FIG. 15, and a sectional view is schematically shown in FIG. A perspective view of the coil portion 3c of the coil component 1c is schematically shown in FIG. However, the shape and arrangement of the coil components and the constituent elements of the following embodiments are not limited to the illustrated examples.

  As shown in FIGS. 15 to 17, the coil component 1 c of the present embodiment differs from the coil component 1 a described above in the axial direction of the coil portion and the exposure direction of the lead-out portion. Specifically, the coil component 1c has the following configuration. The coil component 1c has a substantially rectangular parallelepiped shape. The coil component 1c schematically includes an element body 2c, a coil portion 3c embedded therein, and a pair of external electrodes 4c and 5c. The external electrodes 4c and 5c are so-called five-face electrodes. The coil portion 3c has an axis in the upper surface-lower surface direction of the element body, that is, an axis perpendicular to the mounting surface. As shown in FIG. 17, the coil portion 3c has lead portions 6c and 7c, and the lead portions 6c and 7c are electrically connected to the external electrodes 4c and 5c on the left and right end surfaces, respectively. As shown in FIG. 16, the coil conductor 8c of the coil portion 3c is covered with a glass layer 9c. The coil component 1c is covered with an insulating layer 10c except for the external electrodes 4c and 5c.

  A method for manufacturing the coil component 1c will be described.

  First, a sintered ceramic substrate 71 is prepared as a substrate (FIG. 18 (1)).

  A glass paste layer 72 is formed with the photosensitive glass paste on the substrate 71 by using a photolithography method (FIG. 18B). Next, a shape-retaining paste layer 73 is formed with a shape-retaining photosensitive paste around the glass paste layer 72 by using a photolithography method (FIG. 18B). If necessary, this procedure may be repeated to form a glass paste layer 72 and a shape retaining paste layer 73 having a predetermined thickness.

  Next, a conductor paste layer 74 is formed on the glass paste layer 72 by using a photolithography method (FIG. 18 (3)).

  Next, a glass paste layer 75 is formed on the conductor paste layer 74 by using a photolithography method (FIG. 18 (4)). At this time, the conductor paste layer 76 is formed in the region to be the connection portion of the coil conductor (FIG. 18 (4)). Next, a shape-retaining paste layer 77 is formed with a shape-retaining photosensitive paste around the glass paste layer 75 using a photolithography method (FIG. 18 (4)). If necessary, this procedure may be repeated to form a glass paste layer 75, a conductor paste layer 76, and a shape maintaining paste layer 77 having a predetermined thickness.

  Next, a conductor paste layer 78 is formed on the glass paste layer 75 by using a photolithography method (FIG. 18 (5)).

  Next, a glass paste layer 79 is formed on the conductor paste layer 78 by photolithography (FIG. 18 (6)). Next, a shape-retaining paste layer 80 is formed with a shape-retaining photosensitive paste around the glass paste layer 79 by photolithography (FIG. 18 (6)). If necessary, this procedure may be repeated to form the glass paste layer 79 and the shape retaining paste layer 80 having a predetermined thickness.

  A laminate is formed on the substrate as described above.

  Thereafter, similarly to the coil component 1a, the laminate is fired, the element body portion is formed with a magnetic sheet, and the external electrode is formed by plating, whereby the coil component 1c is manufactured.

  In the coil component 1c described above, the number of turns of the coil part 3c is 1.5, but the number of turns of the coil component of the present disclosure is not particularly limited. For example, the coil component having the number of turns of 3.5 performs the steps shown in FIGS. 19 (1) to (8) as follows between the steps shown in FIGS. 18 (4) and 18 (5). Can be manufactured.

  After the step of FIG. 18 (4), a conductive paste layer 81 is formed on the glass paste layer 75 by using a photolithography method (FIG. 19 (1)).

  Next, a glass paste layer 82 is formed on the conductor paste layer 81 by using a photolithography method (FIG. 19 (2)). At this time, the conductor paste layer 83 is formed in the region of the conductor paste layer 81, which is a connection portion with the conductor paste layer 85 to be formed next (FIG. 19 (2)). Next, a shape-retaining paste layer 84 is formed with a shape-retaining photosensitive paste around the glass paste layer 82 using a photolithography method (FIG. 19 (2)). If necessary, this procedure may be repeated to form the glass paste layer 82, the conductor paste layer 83, and the shape maintaining paste layer 84 having a predetermined thickness.

  Next, in the same manner as in the steps shown in FIGS. 19A and 19B, a conductive paste layer 85 is formed on the glass paste layer 82 using a photolithography method (FIG. 19C), and further Then, a glass paste layer 86 and a conductor paste layer 87 are formed on the conductor paste layer 85, and a shape maintaining paste layer 88 is formed around the glass paste layer 86 (FIG. 19 (4)). Further, a conductive paste layer 89 is formed on the glass paste layer 86 using a photolithography method (FIG. 19 (5)), and a glass paste layer 90 and a conductive paste layer 91 are formed on the conductive paste layer 89. Then, a shape maintaining paste layer 92 is formed around the glass paste layer 90 (FIG. 19 (6)). Further, a conductive paste layer 93 is formed on the glass paste layer 90 by using a photolithography method (FIG. 19 (7)), and a glass paste layer 94 and a conductive paste layer 95 are formed on the conductive paste layer 93. Then, a shape maintaining paste layer 96 is formed around the glass paste layer 94 (FIG. 19 (8)).

  Next, a coil component having a number of turns of 3.5 can be obtained by performing the steps after FIG.

  The coil component and the manufacturing method thereof according to the present disclosure have been described above. However, the present invention is not limited to the above-described embodiment, and the design can be changed without departing from the gist of the present invention.

  In above-described Embodiments 1 to 3, the element body is formed using a magnetic sheet that is a composite material including a filler and a resin material, and the element body has not undergone the firing step. However, the coil component of the present disclosure is not limited to this.

  In one embodiment, the coil component of the present disclosure is not limited thereto, and the element body 2a may be formed by firing the filler portion and then filling the gap portion with resin.

  In another embodiment, the element body may be formed by casting a slurry containing a composite material including a filler and a resin material, and thermally curing the slurry.

  In the first to third embodiments described above, after the coil portion covered with the glass layer is obtained by firing, a magnetic material sheet is press-fitted to obtain an element body, and Cu plating, Ni plating, and Sn are formed on the element body. External electrodes are formed by plating. However, the coil component of the present disclosure is not limited to this.

  In one aspect, after press-fitting a magnetic material sheet into the coil portion, thermosetting to obtain an element body, and then forming an external electrode by applying Cu plating, Ni plating, Sn plating, etc. on the element body May be.

  In another embodiment, a magnetic material sheet is press-fitted into the coil portion, and then thermoset to obtain an element body, and then a base electrode is formed on the element body by baking Ag, and Ni plating is formed thereon. The external electrode may be formed by applying Sn plating or the like.

  In another aspect, a magnetic sheet is press-fitted into the coil portion, and then fired to obtain a sintered body. Ag is baked on the sintered body to form a base electrode, and then a resin is formed in the voids of the sintered body. The external electrode may be formed by impregnating with Ni and finally performing Ni plating, Sn plating or the like.

  In another embodiment, after obtaining the coil portion, a slurry containing a composite material including a filler and a resin material is cast, and this is thermally cured to obtain an element body, and then an external electrode is provided on the element body. It may be formed.

-Preparation of magnetic material sheet An Fe-Si alloy powder having a D50 (particle size equivalent to 50% cumulative percentage on a volume basis) of 5 m was prepared. For the alloy powder, orthosilicic acid tetraester (TEOS) was used as a metal alkoxide in advance, and a SiO ₂ film of about 50 nm was formed on the powder surface by a sol-gel method. A predetermined amount of the alloy powder and the epoxy resin were wet mixed and formed into a sheet (100 μm thickness) by the doctor blade method to obtain a magnetic sheet.

Preparation of photosensitive glass paste A borosilicate glass (SiO ₂ —B ₂ O ₃ —K ₂ O) glass powder having a D50 of 1 μm was prepared, and a copolymer of methyl methacrylate and methacrylic acid (acrylic polymer), di Pentaerythritol pentaacrylate (photosensitive monomer), dipropylene glycol monomethyl ether (solvent), 2,4-diethylthioxanthone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one Bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (photopolymerization initiator) and a dispersant were mixed to prepare a photosensitive glass paste.

・ Photosensitive conductor paste D50 prepared Ag powder of 2 μm, copolymer of methyl methacrylate and methacrylic acid (acrylic polymer), dipentaerythritol pentaacrylate (photosensitive monomer), dipropylene glycol monomethyl ether (solvent), 2,4-diethylthioxanthone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (photopolymerization) A photosensitive conductor paste was prepared by mixing with an initiator) and a dispersant.

・ Shape-retaining photosensitive paste Prepared alumina powder with D50 of 10μm, copolymer of methyl methacrylate and methacrylic acid (acrylic polymer), dipentaerythritol pentaacrylate (photosensitive monomer), dipropylene glycol monomethyl ether (solvent) ), 2,4-diethylthioxanthone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide ( A photosensitive alumina paste was prepared by mixing with a photopolymerization initiator) and a dispersant.

-Production of coil components A substrate (ceramic sintered substrate having a thickness of 0.5 mm or more) was prepared (Fig. 4 (1)). Next, the photosensitive glass paste was screen-printed on the substrate and dried, and then photocured by irradiating ultraviolet rays through a mask. A glass paste layer having a predetermined shape was formed by removing the uncured portion with a developer aqueous solution of TMAH (TetraMethyl Ammonium Hydroxide). Next, a photosensitive alumina paste was printed and exposed and developed in the same manner to form an alumina layer around the glass layer (FIG. 4 (2)).

  Next, a photosensitive conductor paste was printed, and exposed and developed in the same manner as described above, thereby forming a conductor paste layer (coil pattern 1) having a predetermined shape on the glass paste layer. Next, a glass paste layer was formed around the conductor layer by applying a photosensitive glass paste, photocuring and developing through a mask (FIG. 4 (3)). Next, a photosensitive alumina paste was applied and photocured through a mask to form an alumina layer around the glass paste layer (FIG. 4 (3)). This process was repeated 5 times to form a coil pattern 1.

  Next, a glass paste layer is formed in a portion excluding the connection portion conductor layer by applying a photosensitive glass paste, photocuring through a mask, and developing (FIG. 4 (4)). Next, a photosensitive alumina paste was applied and photocured through a mask to form an alumina layer around the glass paste layer (FIG. 4 (4)).

  Next, a photosensitive conductive paste was printed in the same manner as described above, and a conductive paste layer (coil pattern 2) having a predetermined shape was formed on the glass paste layer by exposure and development as described above (FIG. 4). (5)). This process was repeated 5 times to form the coil pattern 2.

  Next, in the same manner as described above, a photosensitive glass paste was applied, photocured through a mask, and developed to form a glass paste layer in a portion excluding the connection portion conductor layer (FIG. 4 (6)).

  Through the above steps, a laminate of a conductive paste layer and a glass layer supported by a shape maintaining paste layer was obtained on the substrate.

  The laminate obtained above was fired at 700 ° C. By firing, the metal of the conductor paste layer and the glass of the glass paste layer were sintered to become a coil conductor and a glass layer, respectively. On the other hand, the alumina of the shape maintaining paste layer was not sintered and remained as unsintered alumina powder. The alumina powder was removed, and the coil part whose surface was covered with a glass layer and supported by the substrate was obtained (FIG. 5 (1)).

  Next, the magnetic material sheet was disposed on the side of the substrate where the coil portion was formed, and was sandwiched between molds and pressed with a press to press-fit the magnetic material sheet into the coil portion (FIG. 5 (2)).

  Next, the substrate was removed by polishing (FIG. 5 (3)).

  Next, the magnetic material sheet was placed on the surface from which the substrate was removed, sandwiched between molds, and pressed with a press to adhere the magnetic material sheet (FIG. 5 (4)).

  Next, each element was cut into pieces by cutting with a dicer.

  An epoxy resin was sprayed and sprayed while the singulated element was swung, and then thermally cured to form an insulating layer on the element surface.

  Next, the part of the insulating layer forming the external electrode of the element body was removed by laser irradiation (FIG. 6 (1)). Thereafter, Cu plating, Ni coating, and Sn coating were sequentially deposited on the exposed coil by electrolytic plating to form an external electrode.

  Thus, a coil component was obtained. The obtained coil component had a length (L) of 1.0 mm, a width (W) of 0.5 mm, and a height (T) of 0.5 mm. Moreover, the thickness of the coil conductor was 100 μm, the width of the coil conductor was 120 μm, the width of the lead portion was 300 μm, and the thickness of the glass layer was 15 μm.

  The coil component of the present invention can be used in a wide variety of applications as an inductor or the like.

1a, 1b, 1c ... Coil parts 2a, 2b, 2c ... Element 3a, 3b, 3c ... Coil parts 4a, 5a, 4b, 5b, 4c, 5c ... External electrodes 6a, 7a, 6b, 7b, 6c, 7c ... Lead portions 8a, 8b, 8c ... Coil conductors 9a, 9b, 9c ... Glass layer 10a, 10b, 10c ... Insulating layer 21 ... Substrate; 22 ... Glass paste layer; 23 ... Shape retaining paste layer;
24 ... Conductive paste layer; 25 ... Glass paste layer; 26 ... Shape-retaining paste layer;
27 ... Conductive paste layer; 28 ... Glass paste layer; 29 ... Shape retaining paste layer;
31 ... Magnetic material sheet; 32 ... Magnetic material sheet; 35 ... Cu layer; 37 ... Sn layer;
41 ... Conductive paste layer; 42 ... Glass paste layer; 43 ... Shape retaining paste layer;
44 ... Conductive paste layer; 45 ... Glass paste layer; 46 ... Shape retaining paste layer;
51 ... Substrate; 52 ... Glass paste layer; 53 ... Shape retaining paste layer;
54 ... conductor paste layer; 55 ... conductor paste layer; 56 ... glass paste layer;
57 ... Conductive paste layer; 58 ... Shape retaining paste layer; 59 ... Conductive paste layer;
60 ... Glass paste layer; 61 ... Shape retaining paste layer; 62 ... Conductive paste layer;
63 ... Glass paste layer; 64 ... Conductive paste layer; 65 ... Shape retaining paste layer;
66 ... conductor paste layer; 67 ... glass paste layer; 68 ... conductor paste layer;
69 ... shape retention paste layer;
71 ... Substrate; 72 ... Glass paste layer; 73 ... Shape retention paste layer;
74 ... Conductive paste layer; 75 ... Glass paste layer; 76 ... Conductive paste layer;
77 ... shape retaining paste layer; 78 ... conductor paste layer; 79 ... glass paste layer;
80 ... shape retaining paste layer; 81 ... conductor paste layer; 82 ... glass paste layer;
83 ... Conductive paste layer; 84 ... Shape retaining paste layer; 85 ... Conductive paste layer;
86 ... Glass paste layer; 87 ... Conductive paste layer; 88 ... Shape retaining paste layer;
89 ... Conductive paste layer; 90 ... Glass paste layer; 91 ... Conductive paste layer;
92 ... shape retaining paste layer; 93 ... conductor paste layer; 94 ... glass paste layer;
95: Conductive paste layer; 96: Shape retaining paste layer

Claims (10)

A coil component comprising: an element body including a filler and a resin material; a coil portion composed of a coil conductor embedded in the element body; and a pair of external electrodes electrically connected to the coil conductor. There,
A coil component, wherein the coil conductor is covered with a glass layer.   The coil component according to claim 1, wherein the glass layer has a thickness of 3 μm or more and 30 μm or less.   The coil component according to claim 1 or 2, wherein the coil conductor has a thickness of 3 µm or more and 200 µm or less.   The coil component according to claim 1, wherein the external electrode is provided on a lower surface of the element body.   The coil component according to claim 1, wherein the filler is metal particles, ferrite particles, or glass particles.   The coil component according to claim 5, wherein the filler is metal particles.   The coil component according to any one of claims 1 to 6, wherein an axial direction of the coil portion is substantially parallel to a lower surface of the element body.   The coil component according to any one of claims 1 to 7, wherein the coil conductor is fired and the element body is not fired. An element body including a filler and a resin material; a coil portion formed of a coil conductor embedded in the element body; and a pair of external electrodes electrically connected to the coil conductor; A method of manufacturing a coil component in which a conductor is covered with a glass layer,
Forming a conductor paste layer with a photosensitive metal paste containing a metal constituting the coil conductor on a substrate using a photolithography method;
A step of forming a glass paste layer so as to cover the conductor paste layer with a photosensitive glass paste containing glass constituting the glass layer using a photolithography method,
Forming a holding layer with a photosensitive paste that can be removed after firing in a region where the conductive paste layer and the glass paste layer do not exist on the substrate; and the conductive paste layer, the glass paste layer, and the holding layer The manufacturing method of the coil components including the process of baking the board | substrate with which it was formed, and forming a coil part on a board | substrate. A step of press-fitting an element sheet containing an element element material into the coil portion formed on the substrate;
Removing the substrate;
The manufacturing method of the coil component of Claim 9 including the process of providing an element | base_body sheet | seat to the part which removed the said board | substrate.

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