JP2007027354A - Laminated electronic component and manufacturing method thereof - Google Patents

Laminated electronic component and manufacturing method thereof Download PDF

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JP2007027354A
JP2007027354A JP2005206541A JP2005206541A JP2007027354A JP 2007027354 A JP2007027354 A JP 2007027354A JP 2005206541 A JP2005206541 A JP 2005206541A JP 2005206541 A JP2005206541 A JP 2005206541A JP 2007027354 A JP2007027354 A JP 2007027354A
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metal magnetic
electronic component
laminated
conductor pattern
manufacturing
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JP4794929B2 (en
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Mitsuo Sakakura
光男 坂倉
Seiichi Kobayashi
小林　　清一
Kuniaki Watanabe
邦昭 渡辺
Makoto Yamamoto
誠 山本
Kenta Kajiwara
健太 梶原
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Toko Inc
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Toko Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated electronic component which has good DC current superimposition characteristic and can be applied with a large current while it is small and low height, and a manufacturing method thereof. <P>SOLUTION: In the laminated electronic component, metal magnetic layers 11A-11F and conductor patterns 12A-12E are laminated, and a coil is formed inside the laminated body. This stacked body is baked at a temperature of not less than 400°C. A baking atmosphere for baking the laminated body is a non-oxidization atmosphere such as vacuum, oxygen-free or low oxygen partial pressure, and after baking the laminated body, a thermosetting resin is impregnated into a gap of the laminated body. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、磁性体と導体パターンを積層して積層体内にコイルが形成された積層型電子部品及びその製造方法に関するものである。   The present invention relates to a laminated electronic component in which a magnetic body and a conductor pattern are laminated and a coil is formed in the laminated body, and a manufacturing method thereof.

大電流が流れる電源回路やＤＣ／ＤＣコンバータ回路用のインダクタやトランス等として使用される電子部品に、コイル状に巻回された巻線の周りが金属磁性体粉末を圧粉した金属磁性体で覆われるものがある（例えば、特許文献１を参照。）。
特開2004-153068号公報 A metal magnetic body in which a metal magnetic powder is compressed around a coil wound around an electronic component used as an inductor or transformer for a power supply circuit or a DC / DC converter circuit through which a large current flows. Some are covered (see, for example, Patent Document 1).
JP 2004-153068 A

近年、電子機器の小型化に伴い、この種の電子部品も小型化が望まれている。しかしながら、この様な電子部品は、巻線を巻回し、この巻線部分を金属磁性体で覆っているため、形状が大型化し、小型の電子機器に用いることができなかった。   In recent years, with the miniaturization of electronic devices, it is desired to reduce the size of this type of electronic component. However, since such an electronic component has a winding wound and the winding portion is covered with a metal magnetic material, the size of the electronic component increases, and the electronic component cannot be used for a small electronic device.

一方、小型が進んだ電子部品としては、フェライトからなる磁性体層と導体パターンを積層し、積層体内にコイルが形成された積層型コイルや積層型トランスが知られている。   On the other hand, as electronic components that have become smaller in size, there are known a laminated coil and a laminated transformer in which a magnetic layer made of ferrite and a conductor pattern are laminated and a coil is formed in the laminated body.

しかしながら、この様な積層型の電子部品は、磁性体層を構成しているフェライトの飽和磁束密度が低いため、直流重畳特性が悪く、大電流を流すことができなかった。   However, in such a multilayer electronic component, since the saturation magnetic flux density of the ferrite constituting the magnetic layer is low, the direct current superimposition characteristic is poor and a large current cannot be passed.

本発明は、小型・低背でありながら、直流重畳特性が良好で、大電流を流すことができる積層型電子部品及びその製造方法を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer electronic component that is small in size and low in profile, has good direct current superposition characteristics, and allows a large current to flow, and a method for manufacturing the same.

本発明の積層型電子部品は、磁性体層を構成する材質を工夫することにより前述の課題を解決するものである。すなわち、本発明は、金属磁性体層と導体パターンを積層し、積層体内にコイルが形成される。また、金属磁性体層の金属磁性体がガラスを含有する金属磁性材料によって構成される。
また、本発明の積層型電子部品の製造方法は、金属磁性体粒子を主成分とする金属磁性体と導体パターンを積層して積層体内にコイルが形成された後、積層体が４００℃以上の温度で焼成される。積層体を焼成する際の焼成雰囲気は真空又は、無酸素あるいは低酸素分圧の非酸化雰囲気であり、積層体が焼成された後積層体の空隙に熱硬化性樹脂が含浸される。 The multilayer electronic component of the present invention solves the above-mentioned problems by devising the material constituting the magnetic layer. That is, in the present invention, a metal magnetic layer and a conductor pattern are laminated, and a coil is formed in the laminated body. Further, the metal magnetic body of the metal magnetic layer is made of a metal magnetic material containing glass.
In addition, in the method for manufacturing a multilayer electronic component according to the present invention, after a metal magnetic body mainly composed of metal magnetic particles and a conductor pattern are stacked to form a coil in the multilayer body, the multilayer body is 400 ° C. or higher. Baked at temperature. The firing atmosphere when firing the laminate is a vacuum or a non-oxidizing atmosphere of oxygen-free or low oxygen partial pressure, and after the laminate is fired, the voids of the laminate are impregnated with a thermosetting resin.

本発明の積層型電子部品は、金属磁性体層と導体パターンを積層し、積層体内にコイルが形成されるので、小型・低背でありながら、直流重畳特性が良好で、大電流を流すことができる。
また、本発明の積層型電子部品の製造方法は、金属磁性体粒子を主成分とする金属磁性体と導体パターンを積層して積層体内にコイルが形成された後、積層体が４００℃以上の温度で焼成されるので、導体パターンの抵抗を低下させることができ、小型・低背でありながら、直流重畳特性が良好で、大電流を流すことができる。 In the multilayer electronic component of the present invention, a metal magnetic layer and a conductor pattern are laminated, and a coil is formed in the laminate, so that the DC superposition characteristics are good and a large current flows while being small and low-profile. Can do.
In addition, in the method for manufacturing a multilayer electronic component according to the present invention, after a metal magnetic body mainly composed of metal magnetic particles and a conductor pattern are stacked to form a coil in the multilayer body, the multilayer body is 400 ° C. or higher. Since the firing is performed at a temperature, the resistance of the conductor pattern can be reduced, and the direct current superimposition characteristics are good and a large current can flow while being small and low-profile.

本発明の積層型電子部品は、金属磁性体粒子を主成分とし、ガラスを含有する金属磁性体ペーストを用いて形成される金属磁性体層と、銀等の金属を含有する導体ペーストを用いて形成される導体パターンを積層して、積層体内にコイルパターンが形成される。この積層体は、窒素雰囲気中において４００℃以上の温度で焼成される。焼成された積層体は、積層体内の空隙に熱硬化性樹脂が含浸される。また、導体パターンは、乾燥した金属磁性体層間において導体体積率が６５％以上有するように金属磁性体層表面に導体ペーストを印刷すると共に、金属磁性体と導体パターンが積層された積層体は１回以上加圧される。
従って、本発明の積層型電子部品は、金属磁性体内にコイルが形成されると共に、導体パターンを構成する導体ペーストが焼成されて充分に導体化させることができる。 The multilayer electronic component of the present invention uses a metal magnetic layer formed by using a metal magnetic paste containing metal magnetic particles as a main component and glass, and a conductor paste containing a metal such as silver. The conductor pattern to be formed is laminated, and a coil pattern is formed in the laminate. This laminate is fired at a temperature of 400 ° C. or higher in a nitrogen atmosphere. In the fired laminate, the voids in the laminate are impregnated with a thermosetting resin. The conductor pattern is printed on the surface of the metal magnetic layer so that the conductor volume ratio is 65% or more between the dried metal magnetic layers, and the laminate in which the metal magnetic body and the conductor pattern are laminated is 1 Pressurized more than once.
Therefore, in the multilayer electronic component of the present invention, the coil is formed in the metal magnetic body, and the conductor paste constituting the conductor pattern can be fired to be sufficiently made into a conductor.

以下、本発明の積層型電子部品及びその製造方法を図１乃至図４を参照して説明する。
図１は本発明の積層型電子部品の実施例の分解斜視図、図２は本発明の積層型電子部品の実施例の斜視図である。
図１において、１１Ａ〜１１Ｆは金属磁性体層、１２Ａ〜１２Ｅは導体パターンである。
金属磁性体層１１Ａ〜１１Ｆは、鉄、ステンレス、パーマロイ、アモルファス、Ｃｒを含有する金属磁性体等の金属磁性体粒子を主成分とし、硼珪酸ガラスや水ガラス等のガラスを含有し、ターピネオール、ブチルカルビトール、２−２−４トリメチルペンタンジオールモノイン酪酸エステル（ＭＩＢＥ）等の溶剤とバインダーを混合してペースト状にした金属磁性体ペーストを用いて形成される。また、導体パターン１２Ａ〜１２Ｅは、銀、銀系、金、金系、銅、銅系等の金属材料に、ターピネオール、ブチルカルビトール、２−２−４トリメチルペンタンジオールモノイン酪酸エステル（ＭＩＢＥ）等の溶剤とバインダーを混合してペースト状にした導体ペーストを用いて形成される。
金属磁性体層１１Ａの表面には、導体パターン１２Ａが形成される。この導体パターン１２Ａは、１ターン未満分が形成され、一端が金属磁性体層１１Ａの端面に引き出される。
金属磁性体層１１Ｂの表面には、導体パターン１２Ｂが形成される。この導体パターン１２Ｂは３／４ターン分が形成される。導体パターン１２Ｂの一端は金属磁性体層１１Ｂのスルーホール内の導体を介して導体パターン１２Ａの他端に接続される。
金属磁性体層１１Ｃの表面には、導体パターン１２Ｃが形成される。導体パターン１２Ｃは、３／４ターン分が形成され、その一端が金属磁性体層１１Ｃのスルーホール内の導体を介して導体パターン１２Ｂの他端に接続される。
金属磁性体層１１Ｄの表面には、３／４ターン分の導体パターン１２Ｄが形成される。この導体パターン１２Ｄの一端は金属磁性体層１１Ｄのスルーホール内の導体を介して導体パターン１２Ｃの他端に接続される。
金属磁性体層１１Ｅの表面には、１ターン未満の導体パターン１２Ｅが形成され、一端が金属磁性体層１１Ｅのスルーホール内の導体を介して導体パターン１２Ｃの他端に接続される。導体パターン１２Ｅの他端は、金属磁性体層１１Ｅの端面に引き出される。
この導体パターン１２Ｅが形成された金属磁性体層１１Ｅの上には、導体パターン１２Ｅを保護するための金属磁性体層１１Ｆが形成される。
この様にして導体パターン１２Ａ〜１２Ｅによって積層体内にコイルパターンが形成され、積層体の両端面に形成された外部端子２３、２４間に接続される。 Hereinafter, a multilayer electronic component and a manufacturing method thereof according to the present invention will be described with reference to FIGS.
FIG. 1 is an exploded perspective view of an embodiment of the multilayer electronic component of the present invention, and FIG. 2 is a perspective view of the embodiment of the multilayer electronic component of the present invention.
In FIG. 1, 11A to 11F are metal magnetic layers, and 12A to 12E are conductor patterns.
The metal magnetic layers 11A to 11F are composed mainly of metal magnetic particles such as iron, stainless steel, permalloy, amorphous, and metal magnetic materials containing Cr, and contain glass such as borosilicate glass and water glass, terpineol, It is formed using a metal magnetic paste made into a paste by mixing a solvent such as butyl carbitol, 2-2-4 trimethylpentanediol monoinbutyrate (MIBE) and a binder. Conductive patterns 12A to 12E are made of terpineol, butyl carbitol, 2-2-4 trimethylpentanediol monoinbutyric acid ester (MIBE) on a metal material such as silver, silver, gold, gold, copper, and copper. It is formed using a conductive paste made by mixing a solvent such as a binder with a binder.
A conductor pattern 12A is formed on the surface of the metal magnetic layer 11A. The conductor pattern 12A is formed for less than one turn, and one end is drawn out to the end face of the metal magnetic layer 11A.
A conductor pattern 12B is formed on the surface of the metal magnetic layer 11B. This conductor pattern 12B is formed for 3/4 turns. One end of the conductor pattern 12B is connected to the other end of the conductor pattern 12A through a conductor in the through hole of the metal magnetic layer 11B.
A conductor pattern 12C is formed on the surface of the metal magnetic layer 11C. The conductor pattern 12C is formed for 3/4 turns, and one end thereof is connected to the other end of the conductor pattern 12B through a conductor in the through hole of the metal magnetic layer 11C.
A conductor pattern 12D for 3/4 turns is formed on the surface of the metal magnetic layer 11D. One end of the conductor pattern 12D is connected to the other end of the conductor pattern 12C through a conductor in the through hole of the metal magnetic layer 11D.
A conductor pattern 12E having less than one turn is formed on the surface of the metal magnetic layer 11E, and one end is connected to the other end of the conductor pattern 12C via a conductor in the through hole of the metal magnetic layer 11E. The other end of the conductor pattern 12E is drawn to the end surface of the metal magnetic layer 11E.
A metal magnetic layer 11F for protecting the conductor pattern 12E is formed on the metal magnetic layer 11E on which the conductor pattern 12E is formed.
In this way, a coil pattern is formed in the multilayer body by the conductor patterns 12A to 12E, and is connected between the external terminals 23 and 24 formed on both end faces of the multilayer body.

この様な積層型電子部品は以下の様にして製造される。この積層型電子部品をシート積層法によって形成する場合には、金属磁性体粒子として例えばＦｅ−Ｃｒ−Ｓｉ合金を、ガラスとして例えば硼珪酸ガラスを、溶剤として例えばブチルカルビトールを、バインダーとしてセルロース系のものをそれぞれ用い、Ｆｅ−Ｃｒ−Ｓｉ合金粉末が７９〜９０ｗｔ％、硼珪酸ガラス粉末が０．５〜１０ｗｔ％、ブチルカルビトールが１８ｗｔ％以下、エチルセルロースが１〜２．５ｗｔ％、分散剤が０．５ｗｔ％になる様に配合され、ペースト状にされた金属磁性体ペーストを用いて形成された金属磁性体シートの表面に、化学還元銀粉末が８７ｗｔ％、エチルセルロースが２ｗｔ％、分散剤が０．５ｗｔ％、ブチルカルビトールが１０．５ｗｔ％になる様に配合され、ペースト状にされた導体ペーストやアトマイズ銀粉末が９０ｗｔ％、エチルセルロースが１ｗｔ％、分散剤が０．５ｗｔ％、ＭＩＢＥが８．５ｗｔ％になる様に配合され、ペースト状にされた導体ペーストを印刷して導体パターンを形成し、この導体パターンが形成された金属磁性体シートを所定の順序で所定の枚数を積層して積層体を形成し、所定の形状に切断後、９００℃の高温で焼成される。焼成された積層体の端面には外部端子が形成される。また、この積層型電子部品を印刷積層法によって形成する場合には、金属磁性体粒子として例えばＦｅ−Ｃｒ−Ｓｉ合金を、ガラスとして例えば硼珪酸ガラスを、溶剤として例えばブチルカルビトールを、バインダーとしてセルロース系のものをそれぞれ用い、Ｆｅ−Ｃｒ−Ｓｉ合金粉末が７９〜９０ｗｔ％、硼珪酸ガラス粉末が０．５〜１０ｗｔ％、ブチルカルビトールが１８ｗｔ％以下、エチルセルロースが１〜２．５ｗｔ％、分散剤が０．５ｗｔ％になる様に配合され、ペースト状にされた金属磁性体ペーストを用いて形成された金属磁性体層の表面に、化学還元銀粉末が８７ｗｔ％、エチルセルロースが２ｗｔ％、分散剤が０．５ｗｔ％、ブチルカルビトールが１０．５ｗｔ％に配合され、ペースト状にされた導体ペーストやアトマイズ銀粉末が９０ｗｔ％、エチルセルロースが１ｗｔ％、分散剤が０．５ｗｔ％、ＭＩＢＥが８．５ｗｔ％になる様に配合され、ペースト状にされた導体ペーストを印刷する導体パターンの形成と、この導体パターンが形成された金属磁性体層上への金属磁性体層の形成を所定回数繰り返して積層体を形成し、所定の形状に切断後、９００℃の高温で焼成される。焼成された積層体の端面には外部端子が形成される。   Such a multilayer electronic component is manufactured as follows. When this laminated electronic component is formed by the sheet lamination method, for example, Fe—Cr—Si alloy as the metal magnetic particles, borosilicate glass as the glass, butyl carbitol as the solvent, and cellulose as the binder 1 to 2.5 wt% Fe-Cr-Si alloy powder, borosilicate glass powder 0.5 to 10 wt%, butyl carbitol 18 wt% or less, ethyl cellulose 1 to 2.5 wt%, dispersant On the surface of a metal magnetic material sheet formed using a paste-like metal magnetic material paste that is blended so as to be 0.5 wt%, chemically reduced silver powder is 87 wt%, ethyl cellulose is 2 wt%, and a dispersant. Paste containing 0.5 wt% and butyl carbitol 10.5 wt% in a paste form Atomized silver powder is 90 wt%, ethylcellulose is 1 wt%, dispersant is 0.5 wt%, MIBE is 8.5 wt%, and the conductive paste is formed into a paste pattern to form a conductor pattern, A predetermined number of metal magnetic sheets on which the conductor pattern is formed are stacked in a predetermined order to form a stacked body, cut into a predetermined shape, and then fired at a high temperature of 900 ° C. External terminals are formed on the end face of the fired laminate. Further, when the multilayer electronic component is formed by the printing lamination method, for example, Fe—Cr—Si alloy as the metal magnetic particles, borosilicate glass as the glass, butyl carbitol as the solvent, and the binder as the binder Cellulosic materials are used, Fe-Cr-Si alloy powder is 79 to 90 wt%, borosilicate glass powder is 0.5 to 10 wt%, butyl carbitol is 18 wt% or less, ethylcellulose is 1 to 2.5 wt%, On the surface of the metal magnetic layer formed by using a metal magnetic paste that is blended so that the dispersant is 0.5 wt% and made into a paste, chemically reduced silver powder is 87 wt%, ethyl cellulose is 2 wt%, Conductor paste or atomizer that is made into paste by mixing 0.5wt% dispersant and 10.5wt% butyl carbitol The formation of a conductor pattern for printing a paste of conductor paste, which was mixed so that the silver powder was 90 wt%, ethyl cellulose was 1 wt%, the dispersant was 0.5 wt%, and MIBE was 8.5 wt%. Formation of the metal magnetic layer on the metal magnetic layer on which the conductor pattern is formed is repeated a predetermined number of times to form a laminate, cut into a predetermined shape, and then fired at a high temperature of 900 ° C. External terminals are formed on the end face of the fired laminate.

Ｆｅ−Ｃｒ−Ｓｉ合金粉末が７９ｗｔ％、硼珪酸ガラス粉末が５ｗｔ％、ブチルカルビトールが１８ｗｔ％、エチルセルロースが２．５ｗｔ％、分散剤が０．５ｗｔ％になる様に配合され、ペースト状にされた金属磁性体ペーストを用いて形成された金属磁性体層と、アトマイズ銀粉末が９０ｗｔ％、エチルセルロースが１ｗｔ％、分散剤が０．５ｗｔ％、ＭＩＢＥが８．５ｗｔ％になる様に配合され、ペースト状にされた導体ペーストを用いて形成された導体パターンが印刷積層法によって積層された積層体を４００℃で脱脂した後、９００℃の窒素雰囲気中で焼成したところ、積層体の透磁率は図３の様になった。図３は焼成温度と透磁率の変化率の関係を示すグラフであり、横軸が焼成温度、縦軸が透磁率の変化率を示している。図３に３１で示す様に、窒素雰囲気中で焼成した場合、大気中で焼成した場合の透磁率の変化３２に比較して、高温で焼成した時の透磁率の変化を小さくでき、これにより小型で高インダクタンス値が得られる積層型電子部品を製造できた。   Fe-Cr-Si alloy powder is mixed to 79 wt%, borosilicate glass powder is 5 wt%, butyl carbitol is 18 wt%, ethylcellulose is 2.5 wt%, and the dispersant is 0.5 wt%. A metal magnetic layer formed by using the prepared metal magnetic paste and 90 wt% of atomized silver powder, 1 wt% of ethyl cellulose, 0.5 wt% of a dispersant, and 8.5 wt% of MIBE are blended. After degreasing the laminated body in which the conductor pattern formed using the paste-like conductor paste was laminated by the printing lamination method at 400 ° C. and firing in a nitrogen atmosphere at 900 ° C., the magnetic permeability of the laminated body Is as shown in FIG. FIG. 3 is a graph showing the relationship between the firing temperature and the permeability change rate, where the horizontal axis shows the firing temperature and the vertical axis shows the permeability change rate. As shown by 31 in FIG. 3, when baked in a nitrogen atmosphere, the change in permeability when baked at a high temperature can be reduced compared to the change 32 in permeability when baked in the air. A small-sized multilayer electronic component capable of obtaining a high inductance value could be manufactured.

また、金属磁性体層を、Ｆｅ−Ｃｒ−Ｓｉ合金粉末が７８ｗｔ％、硼珪酸ガラス粉末が１ｗｔ％、ブチルカルビトールが１８ｗｔ％、エチルセルロースが２．５ｗｔ％、分散剤が０．５ｗｔ％になる様に配合され、ペースト状にされた金属磁性体ペーストを用いて形成し、金属磁性体層を形成するごとに上下から０．４ｔｏｎ／ｃｍ２で加圧し、積層体を形成後この積層体を金型に入れて上下から５ｔｏｎ／ｃｍ２で加圧して積層型電子部品を製造したところ、積層体中の金属磁性体粒子の体積率は、加圧する前が５８ｖｏｌ％だったのに比較して、加圧後は７１ｖｏｌ％に増加した。また、積層体の透磁率も１０から２０に増加し、インダクタンス値も約２倍に増加した。積層体に加える圧力、回数等について実験したところ、積層体を２００ｋｇ／ｃｍ２以上で１回以上加圧することにより、絶縁抵抗を劣化させることなく、金属磁性体粒子の高密度化を図ることができた。 Further, the metal magnetic layer is composed of 78 wt% Fe-Cr-Si alloy powder, 1 wt% borosilicate glass powder, 18 wt% butyl carbitol, 2.5 wt% ethyl cellulose, and 0.5 wt% dispersant. Each time a metal magnetic layer is formed, it is pressed from above and below at 0.4 ton / cm 2 to form a laminate, and this laminate is When a laminated electronic component was manufactured by putting it in a mold and pressing from 5 ton / cm 2 from above and below, the volume ratio of the metal magnetic particles in the laminated body was 58 vol% before pressing. After pressurization, it increased to 71 vol%. Further, the magnetic permeability of the laminate increased from 10 to 20, and the inductance value also increased about twice. Experiments were conducted on the pressure applied to the laminated body, the number of times, and the like. By pressurizing the laminated body at 200 kg / cm 2 or more once, it is possible to increase the density of the metal magnetic particles without deteriorating the insulation resistance. did it.

また、これらの金属磁性体層に含まれるガラスとして硼珪酸ガラスや、硼珪酸ガラスにＢｉ、Ｐｂ、Ｖ、Ｂａ、Ｃａ、Ｓｒのうちの少なくとも１種類以上添加したものを用いたり、これらの金属磁性体層を構成する金属磁性体粒子の表面を前述の様なガラスで被覆したりして、ガラスの金属磁性体に対する体積比を調整したところ、０．５〜１０％にすることにより、積層体を焼成する際に金属磁性体粒子同士の絶縁を保ったままこれらの粒子同士を接着することができ、積層体の絶縁抵抗と強度と密閉性を改善することができた。
さらに、焼成された積層体中の空隙に熱硬化型樹脂（例えば、エポキシ樹脂）を真空含浸したところ、積層型電子部品の強度を改善することができた。 Further, as the glass contained in these metal magnetic layers, borosilicate glass or borosilicate glass added with at least one of Bi, Pb, V, Ba, Ca, and Sr is used, or these metals are used. The surface of the metal magnetic particles constituting the magnetic layer is coated with the glass as described above, and the volume ratio of the glass to the metal magnetic material is adjusted. When the body was fired, these particles could be bonded together while maintaining the insulation between the metal magnetic particles, and the insulation resistance, strength, and sealability of the laminate could be improved.
Furthermore, when the voids in the fired laminate were vacuum impregnated with a thermosetting resin (for example, epoxy resin), the strength of the multilayer electronic component could be improved.

またさらに、金属磁性体層に、アトマイズ銀粉末を含有し、銀の体積率が９０ｖｏｌ％の導体ペーストを印刷して導体パターンを形成したところ、乾燥後の導体パターンの銀の体積率を６８ｖｏｌ％以上にすることができた。これにより、積層体を脱脂し、９００℃で焼成したところ、従来の還元銀の線収縮率が２０％程度であったに対して、線収縮率を１３％以内に抑えることができ、積層型電子部品の導体パターンの有効断面積を大きくして導体抵抗を３１％低減することができた。また、アトマイズ銀粉末を含有する導体ペーストを印刷して導体パターンを形成した場合と、還元銀粉末を含有する導体ペーストを印刷して導体パターンを形成した場合とで焼成後の導体パターンの特性を比較したところ図４に示す様になった。なお、いずれの導体パターンも厚みが約２０μｍ、幅が約２２０μｍになるように印刷して比較した。   Furthermore, when the conductor pattern was formed by printing a conductive paste containing atomized silver powder and having a silver volume fraction of 90 vol% in the metal magnetic layer, the volume ratio of silver in the conductor pattern after drying was 68 vol%. I was able to do more. As a result, when the laminate was degreased and fired at 900 ° C., the linear shrinkage rate of conventional reduced silver was about 20%, whereas the linear shrinkage rate could be suppressed to within 13%. It was possible to reduce the conductor resistance by 31% by increasing the effective sectional area of the conductor pattern of the electronic component. In addition, the characteristics of the conductor pattern after firing are shown in the case where the conductor pattern containing the atomized silver powder is printed to form the conductor pattern and the case where the conductor pattern containing the reduced silver powder is printed to form the conductor pattern. As a result of comparison, it was as shown in FIG. Each conductor pattern was printed and compared so that the thickness was about 20 μm and the width was about 220 μm.

本発明の積層型電子部品の実施例の分解斜視図である。It is a disassembled perspective view of the Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の実施例の斜視図である。It is a perspective view of the Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の特性を示すグラフである。It is a graph which shows the characteristic of the multilayer electronic component of this invention. 本発明の積層型電子部品の特性を示す表である。It is a table | surface which shows the characteristic of the multilayer electronic component of this invention.

符号の説明Explanation of symbols

１１Ａ〜１１Ｆ 金属磁性体層
１２Ａ〜１２Ｅ 導体パターン 11A to 11F Metal magnetic layer 12A to 12E Conductor pattern

Claims (7)

金属磁性体層と導体パターンを積層し、積層体内にコイルが形成されたことを特徴とする積層型電子部品。   A multilayer electronic component, wherein a metal magnetic layer and a conductor pattern are laminated, and a coil is formed in the laminate. 前記金属磁性体がガラスを含有する金属磁性材料によって構成された請求項１に記載の積層型電子部品。   The multilayer electronic component according to claim 1, wherein the metal magnetic body is made of a metal magnetic material containing glass. 金属磁性体粒子を主成分とする金属磁性体と導体パターンを積層して積層体内にコイルが形成された後、該積層体が４００℃以上の温度で焼成されることを特徴とする積層型電子部品の製造方法。   A laminated electronic device comprising: a metallic magnetic material mainly composed of metallic magnetic particles and a conductor pattern laminated to form a coil in the laminated body; and the laminated body is fired at a temperature of 400 ° C. or higher. Manufacturing method of parts. 前記積層体を焼成する際の焼成雰囲気が、真空又は、無酸素あるいは低酸素分圧の非酸化雰囲気である請求項３に記載の積層型電子部品の製造方法。   The method for manufacturing a multilayer electronic component according to claim 3, wherein a firing atmosphere when firing the laminated body is a vacuum or a non-oxidizing atmosphere of oxygen-free or low oxygen partial pressure. 前記金属磁性体と導体パターンが積層された積層体は１回以上加圧される請求項３に記載の積層型電子部品の製造方法。   The method of manufacturing a multilayer electronic component according to claim 3, wherein the multilayer body in which the metal magnetic body and the conductor pattern are laminated is pressed once or more. 前記積層体が焼成された後、該積層体の空隙に熱硬化性樹脂を含浸した請求項３に記載の積層型電子部品の製造方法。   The method for manufacturing a multilayer electronic component according to claim 3, wherein after the multilayer body is fired, a void in the multilayer body is impregnated with a thermosetting resin. 前記導体パターンは、乾燥した金属磁性体層間において導体体積率が６５％以上有するように金属磁性体層表面に導体ペーストを印刷する請求項３に記載の積層型電子部品の製造方法。   4. The method of manufacturing a multilayer electronic component according to claim 3, wherein the conductor pattern is printed on the surface of the metal magnetic layer so that the conductor volume ratio is 65% or more between the dried metal magnetic layers.
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