JP2019186295A - Electronic component and manufacture method of electronic component - Google Patents

Abstract

To provide a technique for suppressing the generation of lacking and cracking while suppressing the number of edges.SOLUTION: An element assembly (11) comprises: a trunk part (110) extended to external electrodes (12a and 12b) while having a rectangular cross-sectional contour shape in four surfaces; and a pair of projection end parts (111a and 111b) projected from the trunk part (110) so as to reduce a cross-sectional area in both end parts of the trunk part (110). The projection end part (111a) includes: two inclination surfaces (112A and 112B) which extend from two opposite surfaces of the four surfaces so as to be close to each other, and are overlapped; and two side surfaces (113A and 113B) in which the other two opposite surfaces of the four surfaces extend on both sides of the two inclination surfaces (112A and 112B), and are formed. An angle formed by the two surfaces of the trunk part (110) and the projection end part (111a) and an angle formed by the two inclination surfaces (112A and 112B) are obtuse angles, and the external electrodes (12a and 12b) are formed along the pair of projection end parts (111a and 111b).SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component and a method for manufacturing the electronic component.

In recent years, with the progress of computerization in automobiles, industrial equipment, and the like, highly reliable electronic components that can be mounted on them have been demanded.
An example of such an electronic component is a multilayer ceramic capacitor.
In the manufacturing process of a multilayer ceramic capacitor, a multilayer sheet in which dielectric layers and electrode layers are alternately stacked is cut into chips, and the electrode layers are exposed from the ends of the rectangular parallelepiped element body obtained by cutting. The external electrode is formed on the surface where the electrode layer is exposed.

FIG. 9 is an external perspective view showing the shape of a conventional multilayer ceramic capacitor 30.
A multilayer ceramic capacitor 30 shown in FIG. 9 includes a rectangular parallelepiped element body 31 and an external electrode 32 formed at an end of the element body 31.
In the multilayer ceramic capacitor 30 having such a shape, the chipping or cracking may occur before or after mounting.

  Patent Document 1 as an example of the prior art discloses a circuit component including a component main body portion in which a portion provided with an external electrode is thinner than other portions, and more specifically, an end surface for drawing out an electrode. The end surfaces that lead out the electrodes by tapering the corners are made into five surfaces, and the reliability is increased by suppressing the generation of a gap between the component main body portion and the mounting member.

JP 2004-56112 A

By the way, in the conventional configuration shown in FIG. 9, stress concentration at the time of contact with other parts or handling is likely to occur at the ridge where each surface is in contact, and a defect or a crack may occur.
Further, according to the technique disclosed in Patent Document 1, the number of ridges is remarkably increased, and there is a problem that contact with other parts is likely to occur.

  This invention is made | formed in view of the above, Comprising: It aims at providing the technique which suppresses generation | occurrence | production of a defect | deletion and a crack, suppressing the number of edges.

  The present invention that achieves the object by solving the above-mentioned problems includes a dielectric layer and an internal electrode layer, and the internal electrode layer is drawn out in a direction perpendicular to the stacking direction of the dielectric layer and the internal electrode layer. An electronic component comprising an element body and a pair of external electrodes connected to the internal electrode layer of the element body, wherein the element body has a rectangular cross-sectional contour shape on four sides of the pair of external electrodes. And a pair of projecting end portions projecting from the body portion so as to reduce a cross-sectional area at both ends of the body portion, Two inclined surfaces that extend so as to approach each other from two opposite surfaces of the four surfaces, and the other two opposite surfaces of the four surfaces extend on both sides of the two inclined surfaces. Two opposite sides of the body part, and the protruding end part. Angle and the angle of the two inclined surfaces of are obtuse, which is an electronic component in which the pair of external electrodes along the pair of projecting end portions are formed.

  Alternatively, the present invention includes a dielectric layer and an internal electrode layer, wherein the internal electrode layer is drawn out in a direction perpendicular to the stacking direction of the dielectric layer and the internal electrode layer, and the element body An electronic component comprising a pair of external electrodes connected to an internal electrode layer, wherein the element body has a barrel portion having six faces extending in the direction of the pair of external electrodes with a hexagonal cross-sectional profile. And a pair of projecting end portions projecting from the body portion so as to reduce a cross-sectional area at both ends of the body portion, and each of the pair of projecting end portions is opposed to the two of the six surfaces. The two surfaces have two inclined surfaces which are extended and joined so as to approach each other while gradually expanding the width, and two side surfaces respectively positioned on the sides of the two opposing surfaces are extended on the same plane. The edge part of the ridge line intersects the ridge line part that combines the two inclined surfaces, and the body part is opposed to the ridge line part. An electronic component in which an angle formed by two surfaces and the pair of projecting end portions and an angle formed by the two inclined surfaces are obtuse angles, and the pair of external electrodes are formed along the pair of projecting end portions. is there.

  In the electronic component of the present invention having the above-described configuration, it is preferable that the end of the two inclined surfaces in the stacking direction is denser than the center of the two inclined surfaces in the stacking direction.

  In the electronic component of the present invention having the above-described configuration, it is preferable that the end in the stacking direction of the two inclined surfaces has less gap than the center in the stacking direction of the two inclined surfaces.

  In the electronic component of the present invention configured as described above, it is preferable that an angle formed by the two inclined surfaces is not less than 130 ° and not more than 170 °.

  In the electronic component of the present invention configured as described above, it is preferable that an angle formed by the two inclined surfaces is not less than 130 ° and not more than 140 °.

  Alternatively, in the present invention, a laminated sheet in which dielectric layers and internal electrode layers are alternately laminated is cut from both main surfaces of the laminated sheet by a blade having a blade angle of 10 ° to 50 °. An electronic component manufacturing method includes forming two inclined surfaces inclined and forming a pair of external electrodes covering each of the two inclined surfaces.

  In the method for manufacturing an electronic component of the present invention having the above-described configuration, it is preferable that the cutting is performed by pressing the blade into the laminated sheet from both main surfaces of the laminated sheet.

  In the method for manufacturing an electronic component of the present invention having the above-described configuration, the cutting is performed by pushing the blade from one main surface of the laminated sheet to a thickness of 55% or more and 75% or less of the laminated sheet. It is preferable that the blade is pushed from a surface facing the surface to a thickness of 55% or more and 75% or less of the laminated sheet.

  According to the present invention, it is possible to suppress the occurrence of defects and cracks while suppressing the number of edges.

1 is a perspective view showing an electronic component according to Embodiment 1. FIG. It is the arrow line view which looked at the electronic component shown in FIG. 1 from A direction. It is the arrow line view which looked at the electronic component shown in FIG. 1 from the B direction. It is the arrow line view which looked at the electronic component shown in FIG. 1 from the C direction. In Embodiment 1, it is a figure which shows the 1st process at the time of cut | disconnecting a lamination sheet with a push cutting blade. In Embodiment 1, it is a figure which shows the 2nd process at the time of cut | disconnecting a lamination sheet with a push cutting blade. In Embodiment 1, it is an expansion schematic diagram of the ceramic sheet cut | disconnected using the press cutting blade. It is a figure which shows the side surface of the electronic component which concerns on the 1st modification of Embodiment 1. FIG. It is a figure which shows the side surface of the electronic component which concerns on the 2nd modification of Embodiment 1. FIG. FIG. 6 is a perspective view showing an electronic component according to a second embodiment. It is the arrow line view which looked at the electronic component shown in FIG. 6 from the A direction. It is the arrow line view which looked at the electronic component shown in FIG. 6 from the B direction. It is the arrow line view which looked at the electronic component shown in FIG. 6 from the C direction. 6 is a plan view of a part of a laminated sheet as viewed from the top in Embodiment 2. FIG. It is an external appearance perspective view which shows the shape of the conventional multilayer ceramic capacitor.

Embodiments of the present invention will be described below with reference to the drawings.
However, this invention is not limitedly interpreted by description of the following embodiment.

<Embodiment 1>
FIG. 1 is a perspective view showing an electronic component 10 according to the present embodiment.
The electronic component 10 shown in FIG. 1 includes a hexagonal columnar element body 11 that includes a dielectric layer and an internal electrode layer, an external electrode 12a provided on one end side of the element body 11, and an external electrode 12a. And an external electrode 12b provided at the end on the opposite side.
The element body 11 is obtained by cutting a laminated sheet formed by alternately laminating dielectric layers and internal electrode layers in the laminating direction.
The internal electrode layer of the element body 11 is drawn out in a direction orthogonal to the stacking direction and connected to the external electrode 12a or the external electrode 12b.

In FIG. 1, the right-handed xyz axis is defined so that the bottom surface serving as the reference surface and the mounting surface of the electronic component 10 is disposed on the xy plane, and the stacking direction of the element body 11 is the z axis.
FIG. 1 also shows an arrow A that is orthogonal to the xz plane, an arrow B that is orthogonal to the yz plane, and an arrow C that is orthogonal to the xy plane.

2A is an arrow view of the electronic component 10 shown in FIG. 1 as viewed from the A direction.
2B is an arrow view of the electronic component 10 shown in FIG. 1 viewed from the B direction.
2C is an arrow view of the electronic component 10 shown in FIG. 1 viewed from the C direction.
In addition, in the electronic component 10, since the opposing surface is the same shape, these illustrations are abbreviate | omitted.

In FIGS. 2A, 2B, and 2C, the outline of the element body 11 in the portion covered with the external electrodes 12a and 12b is indicated by a dotted line.
As shown in FIGS. 2A, 2B, and 2C, the external electrodes 12a and 12b are formed to have substantially the same thickness.

The element body 11 has a rectangular section in the form of a rectangular cross section and extends in the direction of the external electrodes 12a and 12b, and protrudes from both ends of the trunk section 110 so as to reduce the cross-sectional area from the trunk section 110. A pair of protruding end portions 111a and 111b.
Here, the four surfaces are a top surface, a bottom surface, and two side surfaces.

The protruding end 111a has two inclined surfaces 112A and 112B and two side surfaces 113A and 113B.
The same applies to the protruding end 111b.
Here, the two inclined surfaces 112 </ b> A and 112 </ b> B are formed by extending and joining each other so as to approach each other from the top surface and the bottom surface, which are two opposing surfaces of the four surfaces of the body portion 110.
In addition, the two side surfaces 113A and 113B are on both sides of the two inclined surfaces 112A and 112B, and the side surfaces of the body portion 110 which is the other two surfaces facing each other among the four surfaces of the body portion 110 are on the same plane. It is formed to extend.
Further, as will be described later, the top and bottom surfaces of the body 110 form an obtuse angle with each of the pair of protruding end portions 111a and 111b, and the two inclined surfaces 112A and 112B also form an obtuse angle. .

  In other words, the element body 11 has a horizontally long hexagonal column shape rotated by 90 ° about the y axis as a rotation axis, a rectangular top and bottom surface, a pair of hexagonal side surfaces, and two rectangular surfaces. And a pair of end faces formed to be inclined outward.

The external electrode 12a and the external electrode 12b cover at least the inclined surface of the electronic component 10 and are respectively connected to the internal electrode layer drawn from the element body 11.
However, as shown in FIGS. 1, 2 </ b> B, and 2 </ b> C, the external electrodes 12 a and 12 b may be formed so as to cover the end portions of the four surfaces of the body portion of the element body 11.
The external electrode 12a and the external electrode 12b are provided apart from each other and are not connected.

As shown in FIG. 2B, the angle A1 formed by the two rectangular surfaces inclined outward is an obtuse angle, preferably 130 ° to 170 °, more preferably 130 ° to 140 °, and the angle A2 Is preferably 95 ° to 115 °, more preferably 105 ° to 115 °.
Further, when comparing the density of the dielectric layer forming material in P1, P2, and P3 shown in FIG. 2B, the density of the element forming material in P2 is the highest, and the density of the element forming material in P3 Is the lowest.
That is, the forming material is denser at P2 which is the end of the inclined surface in the stacking direction than P1 at the center of the inclined surface in the stacking direction.
In addition, the forming material is denser in P1 at the center of the inclined surface in the stacking direction than P3 near the center of the bottom surface.
In addition, in P2, which is the end of the bottom surface, the forming material is denser than P3, which is closer to the center of the bottom surface than P2.
Thus, if the forming material in the vicinity of the ridge where the end surface, the bottom surface, and the top surface are in contact with each other is made dense, the frequency of occurrence of defects or cracks can be reduced.
As described later, the element body 11 can be realized by using a press cutting blade having a predetermined blade angle when cutting the laminated sheet.

<Method for Manufacturing Electronic Component 10>
Next, a method for manufacturing the electronic component 10 will be described.
First, an unfired internal electrode is formed by printing a conductive paste on the main surface of the unfired ceramic sheet.

The unfired ceramic sheet is called a green sheet, and is formed into a sheet shape using a roll coater or a doctor blade.
The conductive paste is a paste containing a metal material such as nickel, copper, palladium, platinum, silver, gold, or an alloy thereof.
In addition, a screen printing method, a gravure printing method, or the like can be used for printing the conductive paste.

Next, a laminated sheet is formed by laminating ceramic sheets on which unfired internal electrodes are formed.
The laminated sheet is cut as described below, whereby an unfired element body that becomes the element body 11 is formed.

FIG. 3A is a diagram illustrating a first step when cutting a laminated sheet with a press cutting blade in the present embodiment.
As shown in FIG. 3A, the blade 101 that is a push cutting blade is pushed in the direction of the arrow from one main surface to approximately half of the thickness direction of the laminated sheet 100, specifically, from 55% to 70% in the thickness direction. .
The laminated sheet 100 is cut along the blade angle of the blade 101 so as to be spread in the left-right direction in FIG.

FIG. 3B is a diagram illustrating a second step when the laminated sheet is cut by the press cutting blade in the present embodiment.
As shown in FIG. 3B, the thickness of the laminated sheet 100 from another main surface in which the blade 101 as a push blade is opposed to the main surface of FIG. When pushed in the direction of the arrow to approximately half in the vertical direction, specifically 55% to 70% in the thickness direction, the sheet is cut into unfired cut laminated sheets 100A and 100B.
In the cut laminated sheets 100A and 100B, the forming material becomes denser as the amount pushed by the blade 101 is larger, and the forming material becomes denser as it is closer to the cut surface in the pushed portion.
Further, as the blade 101 is pushed beyond the center in the thickness direction of the laminated sheet 100, the forming material can be made dense even near the center in the thickness direction, as will be described later.
In FIG. 3B, the blade 101 is disposed on the side opposite to that in FIG. 3A. However, in actual production equipment, the blade 101 is movable only in the vertical direction and is laminated to approximately half the thickness direction. It is preferable to push and cut from the direction of the arrow shown in FIG.

Further, when the cutting edge of the blade 101 is 10 ° to 50 °, the angle A1 shown in FIG. 2B is 130 ° to 170 ° and the angle A2 is 95 ° to 115 °.
Furthermore, it is preferable to set the blade edge of the blade 101 to 40 ° to 50 ° because the angle A1 shown in FIG. 2B is 130 ° to 140 ° and the angle A2 is 105 ° to 115 °.

FIG. 4 is an enlarged schematic view of a laminated sheet 100B cut using a press cutting blade in the present embodiment.
FIG. 4 shows a laminated sheet 100 </ b> B in which the push blade is pushed from the bottom to the top after the push blade is pushed from the top to the bottom.
As shown in FIG. 4, in the portions 100Ba, 100Bb, and 100Bc into which the press cutting blade is pressed, the density of the forming material is higher than the density of the other portions.
Here, P1 shown in FIG. 2B is included in the portion 100Bb shown in FIG. 4, and P2 shown in FIG. 2B is included in the portions 100Ba and 100Bc shown in FIG.
Therefore, the formation material of P2 which is the stacking direction end of the inclined surface in FIG. 2B and the stacking direction center P1 of the inclined surface is denser than P3 which is the other part, and further, the stacking direction of the inclined surface in FIG. The end P2 is denser than the center P1 of the inclined surface in the stacking direction.
When the blade 101 is pushed beyond the center in the thickness direction of the laminated sheet 100, the portion 100Bb has a dense material even in the vicinity of the center in the thickness direction.

Further, since the voids in the dielectric layer are reduced when the forming material is dense, the voids in P2 are smaller than those in P1.
The voids in the dielectric layer of the element body 11 can be observed with an optical microscope.
First, the element body 11 is shaved to the vicinity of the center in the X direction to determine an observation location.
Here, the observation location is, for example, P1 shown in FIG. 2B.
Next, an arbitrary 3 fields of view of the observation location are magnified 5000 times with an optical microscope and photographed.
At this time, the area to be photographed in each field of view is made equal.
Next, the gap is specified from the photographed image, and the total area of the gap is calculated by image processing software.
If the total area of the voids is large according to the average value of the three fields of view, the voids are many and the forming material is sparse.

In the present embodiment, as described above, it is preferable that the portion that becomes the inclined surface of the element body 11 is cut by being pressed by the pressing blade.
When the portion that becomes the inclined surface is cut and cut in this way, the forming material of the laminated sheet is spread by the cutting blade, and the particles of the pressed forming material flow, so the density of the forming material on the end surface increases, and the end surface Strength can be improved.
However, the present invention is not limited to this, and dicer cutting that rotates the dicer in one direction may be performed.

  The laminated sheet 100 is cut into pieces by being cut in two orthogonal directions. A piece-like electronic component can be obtained in the same manner as the element body 11 by dicing cutting the laminated sheet cut in one direction as described above in a direction perpendicular to the cut direction. However, the present invention is not limited to this, and after performing dicer cutting in one direction out of two orthogonal directions, it is possible to perform push-cut cutting in the other direction, or cut two orthogonal directions with the same cutting method. May be.

Next, in this unfired element body, nickel paste is attached by dipping so as to cover each of the two opposing ends.
Here, the nickel paste is a surface where the internal electrode is exposed on the cut surface, and is attached to the inclined surface of the element body 11.

Next, the element body 11 is sintered by firing the unfired element body to which the nickel paste is adhered.
Here, the firing is performed, for example, at a firing temperature of 1090 ° C. and a firing time of 30 minutes, and the fired body is held in a nitrogen atmosphere at 900 ° C. for 6 hours.
According to such a firing step, the dielectric layer and the nickel paste can be sintered at the same time, and the adhered portion of the nickel paste becomes the base electrode layer of the external electrode.
However, the firing conditions in the present invention are not limited to this.
The firing temperature can be determined based on the sintering temperature of the ceramic material. For example, when a ceramic material mainly composed of barium titanate (BaTiO ₃ ) is used, the firing temperature is about 1000 ° C. to 1300 ° C. It can be.
The firing can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

  Next, the base electrode layer of the external electrode of the element body 11 is plated with a metal material such as nickel, copper, palladium, platinum, silver, gold, tin, or an alloy thereof, so that the external electrodes 12a, 12b Is formed. Here, although the external electrode formed by plating is, for example, two layers of nickel and tin, the present invention is not limited to this, and may be three or more layers.

The tip portions of the external electrodes 12a and 12b of the electronic component 10 manufactured in this way are arranged at the approximate center in the thickness direction.
However, the shape of the electronic component according to the present invention is not limited to this.

FIG. 5A is a diagram illustrating a side surface of an electronic component according to a first modification of the present embodiment.
Here, illustration of the bottom surface and the inclined surface is omitted.
An electronic component 10A shown in FIG. 5A includes a hexagonal columnar element body 11A, an external electrode 12Aa provided on one end side of the element body 11A, and an external electrode 12Ab provided on the end opposite to the external electrode 12Aa. With.
The external electrode 12Aa and the external electrode 12Ab are provided apart from each other and are not connected.
The element body 11 </ b> A is obtained by cutting a laminated body formed by alternately laminating dielectric layers and internal electrode layers in the laminating direction, like the element body 11.

As shown in FIG. 5A, the tips of the external electrodes 12Aa and 12Ab are arranged above the center in the thickness direction, that is, on the top surface side.
The shape shown in FIG. 5A is such that the indentation depth of the blade in the first step of cutting the laminated sheet is less than half of the thickness direction of the laminated sheet, and from the opposite side until the laminated sheet is cut in the second step. It can be formed by pushing the blade.
Further, the positions of the tips of the external electrodes 12Aa and 12Ab can be specifically shifted up and down from the center in the stacking direction to a range of 1/3 or less of the thickness of the element body 11A.
According to the shape shown in FIG. 5A, it is possible to regulate the vertical direction of the chip at the time of mounting. Further, when mounting is performed so that the lower side of FIG. It is possible to reduce the area required for mounting by keeping the fillet forming region within a certain range by suppressing the position to the position of the tip.

FIG. 5B is a diagram illustrating a side surface of the electronic component according to the second modification example of the present embodiment.
Here, illustration of the bottom surface and the inclined surface is omitted.
An electronic component 10B shown in FIG. 5B includes a hexagonal columnar element body 11B, an external electrode 12Ba provided on one end side of the element body 11B, and an external electrode 12Bb provided on the end opposite to the external electrode 12Ba. With.
The external electrode 12Ba and the external electrode 12Bb are provided apart from each other and are not connected.
The element body 11 </ b> B is obtained by cutting a laminated body formed by alternately laminating dielectric layers and internal electrode layers in the laminating direction, like the element body 11.

As shown in FIG. 5B, the tip of the external electrode 12Ba is disposed above the center in the thickness direction, that is, on the top surface side, and the tip of the external electrode 12Bb is below the center in the thickness direction, that is, on the bottom surface side. Is arranged.
The shape shown in FIG. 5B is that the pushing of the blade in the first step of cutting the laminated sheet on the external electrode 12Ba side is less than half of the thickness direction, and the pushing of the blade in the second step is the opposite side of the first step. Until the laminated sheet is cut in half or more in the thickness direction, and the pushing of the blade in the first step of cutting the laminated sheet on the external electrode 12Bb side is made up to more than half in the thickness direction, and the second The blade in the process can be formed by carrying out until less than half of the thickness direction and the laminated sheet is cut.
In the electronic component formed in this way, as shown in FIG. 5B, the positions of the tip portions of the end faces of the two external electrodes 12Ba and 12Bb are formed to be different in the thickness direction. In the electronic component having the shape shown in FIG. 5B, when stress is applied so as to be pushed in from the left and right directions in FIG. 5B, the stress can be converted into a rotational moment force, so that stress concentration during transportation or transportation can be reduced.

As described above, according to this embodiment, it is possible to suppress the occurrence of defects and cracks while suppressing the number of edges.
Therefore, mounting defects can be suppressed and the mounting rate can be improved.
In addition, it is possible to improve product quality by suppressing product defects in the manufacturing process.

<Embodiment 2>
In the first embodiment, the electronic component has a shape having a pair of inclined surfaces, but the present invention is not limited to this.
This embodiment demonstrates the form which made the electronic component the shape which has two pairs of inclined surfaces.
In addition, about the same structure as Embodiment 1, the description of Embodiment 1 is used.

FIG. 6 is a perspective view showing the electronic component 20 according to the present embodiment.
An electronic component 20 shown in FIG. 6 includes a decahedron element body 21 including a dielectric layer and an internal electrode layer, an external electrode 22a provided on one end side of the element body 21, and an opposite side of the external electrode 22a. And an external electrode 22b provided at the end.
The element body 21 is obtained by cutting a laminated sheet formed by alternately laminating dielectric layers and internal electrode layers in the laminating direction.

In FIG. 6, the xyz axis of the right-handed system is defined so that the bottom surface that is the reference surface and the mounting surface of the electronic component 20 is arranged on the xy plane, and the stacking direction of the element body 21 is the z axis.
Further, FIG. 6 shows an arrow A orthogonal to the xz plane, an arrow B orthogonal to the yz plane, and an arrow C orthogonal to the xy plane.

FIG. 7A is an arrow view of the electronic component 20 shown in FIG. 6 viewed from the A direction.
7B is an arrow view of the electronic component 20 shown in FIG. 6 viewed from the B direction.
FIG. 7C is an arrow view of the electronic component 20 shown in FIG. 6 viewed from the C direction.
In addition, in the electronic component 20, since the opposing surface is the same shape, these illustrations are abbreviate | omitted.

7A, 7B, and 7C, the outer shape of the element body 21 in the portion covered with the external electrodes 22a and 22b is indicated by a dotted line.
As shown in FIGS. 7A, 7B, and 7C, the external electrodes 22a and 22b are formed to have substantially the same thickness.

  The element body 21 has a hexagonal sectional contour shape with six faces extending in the direction of the external electrodes 22a and 22b, and the cross-sectional area from the trunk portion 210 is reduced at both ends of the trunk portion 210. A pair of protruding end portions 211a and 211b are provided.

The protruding end portion 211a has two inclined surfaces 212A and 212B that extend so that two opposing surfaces of the six surfaces of the body portion 210 approach each other while gradually increasing the width.
The same applies to the protruding end 211b.
Moreover, the edge part which extended the two side surfaces located in the side of the two opposing surfaces on the same plane crosses the edge part which united the two inclined surfaces 212A and 212B.

  Furthermore, as will be described later, the top and bottom surfaces of the body 210 form an obtuse angle with each of the pair of protruding end portions 211a and 211b, and the two inclined surfaces 212A and 212B also form an obtuse angle. .

In other words, the element body 21 is a decahedron, a top and bottom surfaces that are rectangular, a pair of side surfaces in which two trapezoidal surfaces are inclined outward, and two trapezoidal surfaces are inclined outward. A pair of end faces.
Alternatively, it can be said that the element body 21 has a shape in which the bottom surfaces of two square pyramids having the same shape are bonded together.
Alternatively, it can be said that the element body 21 has a shape obtained by cutting off a quadrangular pyramid having the same head vertex from two regular head vertices.

  As shown in FIGS. 7A and 7B, the side surface of the element body 21 has a shape in which two trapezoidal surfaces are inclined outward.

The external electrode 22 a and the external electrode 22 b cover at least the inclined surface of the electronic component 20 and are connected to the internal electrode layer drawn from the element body 21.
However, as shown in FIGS. 6, 7 </ b> B, and 7 </ b> C, the external electrodes 22 a and 22 b may be formed to cover the end portions of the six surfaces of the body portion of the element body 21.
The external electrode 22a and the external electrode 22b are provided apart from each other and are not connected.

Also in the present embodiment, as in the first embodiment, the angle A1 formed by the two trapezoidal surfaces inclined outward on the inclined surface is an obtuse angle, preferably 130 ° or more and 170 ° or less, more preferably 130. The angle A2 is preferably 95 ° to 115 °, and more preferably 105 ° to 115 °.
Furthermore, as in the first embodiment, the forming material is denser at the end of the inclined surface in the stacking direction than at the center of the inclined surface in the stacking direction.
As described above, when the strength near the ridge where the end surface, the bottom surface, and the top surface are in contact with each other is increased, the frequency of occurrence of defects or cracks can be decreased.

<Method for Manufacturing Electronic Component 20>
Since the electronic component 20 shown in FIG. 6 is the same as the electronic component 10 shown in FIG. 1 in Embodiment 1 except for the process of cutting the laminated sheet, the description of Embodiment 1 is cited.
Here, only the process of cutting the laminated sheet will be described.

FIG. 8 is a plan view of a part of the laminated sheet as viewed from above in the present embodiment.
The blade in the X direction pushes and cuts the regions 217 and 220, pushes and cuts the regions 218 and 221, and pushes and cuts the regions 219 and 222.
The blade in the Y direction pushes and cuts the regions 211 and 214, pushes and cuts the regions 212 and 215, and then pushes and cuts the regions 213 and 216.
In this way, the laminated sheet is singulated.

Also in the present embodiment, as in the first embodiment, it is preferable that the portion that becomes the inclined surface of the element body 21 is cut by pressing the cutting blade from both directions.
When the portion to be the inclined surface of the element body 21 is cut and cut in this way, the forming material of the laminated sheet is spread by the pressing blade, and the particles of the pressed forming material flow, so the density of the forming material on the end face is high. Thus, the strength of the end face can be improved.
However, the present invention is not limited to this, and dicer cutting that rotates the dicer in one direction may be performed.

  In Embodiment 1, the shape shown in FIG. 1 and the like is obtained by performing push-cut cutting in one of two orthogonal directions, but in this embodiment, the two orthogonal directions are, for example, as in Embodiment 1, a laminated sheet. By performing push-cut with a blade having a blade angle of 10 to 50 ° from both sides in the thickness direction, the shape shown in FIG.

As described above, according to this embodiment, it is possible to suppress the occurrence of defects and cracks while suppressing the number of edges.
Therefore, mounting defects can be suppressed and the mounting rate can be improved.
In addition, it is possible to improve product quality by suppressing product defects in the manufacturing process.

In the first and second embodiments, the multilayer ceramic capacitor is exemplified as the electronic component. However, the present invention may be applied to a chip inductor and a chip resistor instead of the multilayer ceramic capacitor.
However, the present invention is not limited to these, and may be applied to other electronic components formed in a chip shape.

10, 20, 30 Electronic parts 11, 11A, 11B, 21, 21a, 21b, 21c, 21d, 31 Element body 110, 210 Body portions 111a, 111b, 211a, 211b Protruding end portions 112A, 112B, 212A, 212B Inclined surface 113A, 113B Side surface 12a, 12b, 12Aa, 12Ab, 12Ba, 12Bb, 22a, 22b, 32a, 32b External electrode 100 Laminated sheet 100A, 100B Cut laminated sheet 100Ba, 100Bb, 100Bc Part 101 Blade 211, 212, 213 214, 215, 216, 217, 218, 219, 220, 221, 222

Claims (9)

A dielectric layer and an internal electrode layer, wherein the internal electrode layer is drawn out in a direction perpendicular to the stacking direction of the dielectric layer and the internal electrode layer, and connected to the internal electrode layer of the element body An electronic component comprising a pair of external electrodes,
The prime field is
A body having four cross-sectional contours extending in the direction of the pair of external electrodes;
A pair of projecting end portions projecting so as to reduce the cross-sectional area from the body portion at both ends of the body portion;
Each of the pair of protruding ends is
Two inclined surfaces that extend so as to approach each other from two opposing surfaces of the four surfaces;
Two side surfaces formed by extending the other two opposite surfaces of the four surfaces on both sides of the two inclined surfaces;
The angle formed by the two opposing surfaces of the body portion and the protruding end portion and the angle formed by the two inclined surfaces are obtuse angles,
An electronic component in which the pair of external electrodes are formed along the pair of protruding end portions. A dielectric layer and an internal electrode layer, wherein the internal electrode layer is connected to the internal electrode layer of the element body and the element body drawn in a direction orthogonal to the stacking direction of the dielectric layer and the internal electrode layer; An electronic component comprising a pair of external electrodes,
The prime field is
A body having six surfaces with hexagonal cross-sectional contours and extending in the direction of the pair of external electrodes;
A pair of projecting end portions projecting so as to reduce the cross-sectional area from the body portion at both ends of the body portion;
Each of the pair of protruding ends is
Two side surfaces of the six surfaces having two inclined surfaces that are extended and combined so as to approach each other while gradually increasing the width, and located on the sides of the two opposing surfaces. Each of which is extended on the same plane and intersects with the ridge line portion combining the two inclined surfaces,
The angle formed by the two opposing surfaces of the body portion and the pair of projecting end portions and the angle formed by the two inclined surfaces are obtuse angles,
An electronic component in which the pair of external electrodes are formed along the pair of protruding end portions.   The electronic component according to claim 1, wherein a forming material of the two inclined surfaces in the stacking direction is denser than a center of the two inclined surfaces in the stacking direction.   3. The electronic component according to claim 1, wherein an end of the two inclined surfaces in the stacking direction has fewer gaps than a center in the stacking direction of the two inclined surfaces.   5. The electronic component according to claim 1, wherein an angle formed by the two inclined surfaces is not less than 130 ° and not more than 170 °.   The electronic component according to any one of claims 1 to 4, wherein an angle formed by the two inclined surfaces is not less than 130 ° and not more than 140 °. Two inclined surfaces inclined outward by cutting a laminated sheet in which dielectric layers and internal electrode layers are alternately laminated by cutting from both main surfaces of the laminated sheet with a blade having a blade angle of 10 ° to 50 °. Forming,
An electronic component manufacturing method including forming a pair of external electrodes covering each of the two inclined surfaces.   The method of manufacturing an electronic component according to claim 7, wherein the cutting is performed by pushing the blade into the laminated sheet from both main surfaces of the laminated sheet. The cutting is
Pushing the blade from one main surface of the laminated sheet to a thickness of 55% to 75% of the laminated sheet;
The method of manufacturing an electronic component according to claim 7 or 8, comprising pressing the blade from a surface facing one main surface of the laminated sheet to a thickness of 55% to 75% of the laminated sheet.

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