JP2019186241A - Electronic device having external input and output connector - Google Patents

Abstract

To secure positional accuracy of a connector and improve durability with a simple component configuration and arrangement method.SOLUTION: The electronic device includes: an external connector 25, having a plurality of terminal leads 251, compatible with surface mounting for connecting cables or accessories; an external interface member 24 having an opening 2411 for fitting with the external connector 25; and a mounting unit 242 coupled or formed to the external interface member 24. The mounting unit 242 has a plurality of lands 51 for mounting the external connector 25. The land 51 has a fixed portion 511 having a width substantially same as a width in a direction perpendicular to a fitting direction of the terminal leads 251 and an extension part 512 having a width narrower than that.SELECTED DRAWING: Figure 11

Description

  The present invention relates to an electronic device, and more particularly to an electronic device having an external input / output connector.

  2. Description of the Related Art Conventionally, there is an electronic device having an external input / output connector (hereinafter referred to as a connector) such as a pin connector in order to connect two or more different electronic devices and enable signal input / output. The connectors mounted on these electronic devices are usually physically and electrically connected to the printed circuit board by reflow mounting or the like, and the printed circuit board is attached to the electronic device body. At the time of attachment to the electronic device main body, a connector is fitted into an opening provided so as to penetrate outside the electronic device main body, and is exposed to the external appearance of the electronic device. In addition, this fitting is to prevent the connector from being damaged or peeled off from the printed circuit board when an external force such as a twist is applied with a cable plug inserted into the connector. There is also the purpose of improving durability. Therefore, matching the positional relationship between the opening of the electronic device body and the connector with high accuracy is essential for improving the durability of the connector.

  On the other hand, the connector has many factors that affect the positional deviation, such as the tolerance of the connector itself, the mounting accuracy on the printed circuit board, the tolerance of the electronic device body, and the tolerance due to assembly. As a result, it is difficult to accurately align the connector with the opening provided in the electronic device body. In order to improve the position accuracy of the electronic device main body and the connector, for example, in Patent Document 1, when attaching the holding member of the interface connector, which is an external input / output connector, to the housing, the holding member is bent. Thus, a method for ensuring positional accuracy is disclosed.

  Also, in Patent Document 2, mounting in an in-plane due to a self-alignment effect is achieved by mounting an alignment lead that is narrower than the other leads on an IC to be mounted on an alignment land that is arranged on the substrate to be mounted. A method for eliminating the tilt is disclosed.

JP 2012-243875 A Patent 5703500

  However, in the technique disclosed in Patent Document 1 described above, in order to ensure the positional accuracy of the connector, a holding member is separately required, and it is necessary to separately provide the connector mounting portion and the housing main body mounting portion. There are complicated parts configuration. Further, in the technique disclosed in Patent Document 2, it is necessary to separately provide alignment leads having large dimensions in order to ensure positional accuracy, and it is necessary to increase the size of components to be mounted.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to achieve securing of positional accuracy of a connector and improvement of durability with a simple component configuration and without increasing the size of a mounted component.

  In order to achieve the above object, an electronic device of the present invention has a plurality of terminal leads, an external connector for surface mounting for connecting a cable or an accessory, and an external interface having an opening for fitting with the external connector. And a mounting portion coupled to or formed on the external interface member. The mounting portion has a plurality of lands for mounting the external connector. The lands are perpendicular to the fitting direction of the terminal leads. It is characterized in that it has a fixed part having a substantially uniform width and an extension part having a narrower width.

  According to the present invention, the position accuracy of the opening of the external member and the external connector is increased, and the external member and the external connector are in a fitting relationship, so that the durability of the external connector with respect to the external force can be increased.

It is a front perspective view of the electronic device of the embodiment of the present invention. It is a back perspective view of the electronic device of the embodiment of the present invention. It is a block diagram which shows the structure of the electronic device of embodiment of this invention. It is the front view and back perspective view of the external interface member of the electronic device of embodiment of this invention. It is the upper side figure and front view of the external connector of the electronic device of Example 1 of this invention. It is a figure which shows arrangement | positioning of the land of the electronic device of Example 1 of this invention. It is a figure which shows the detail of the land of the electronic device of Example 1 of this invention. It is a figure which shows the application state of the cream solder of the electronic device of Example 1 of this invention. It is a figure which shows the state immediately after arrangement | positioning of the external connector of the electronic device of Example 1 of this invention. It is a figure which shows the state after the reflow of the electronic device of Example 1 of this invention. It is a figure which shows the effect | action of the land of the electronic device of Example 1 of this invention. It is a figure which shows the relationship between the fitting amount of the external connector of the electronic device of Example 1 of this invention, and the length of a land. It is a figure which shows arrangement | positioning of the land of the electronic device of Example 2 of this invention. It is a figure which shows the application state of the cream solder of the electronic device of Example 2 of this invention. It is a figure which shows the flow condition of the solder of the electronic device of Example 2 of this invention. It is a figure which shows the effect | action of the land of the electronic device of Example 2 of this invention.

  In the present embodiment, an imaging apparatus that is an electrophotographic single-lens reflex camera is given as an example of an electronic apparatus. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view illustrating an external appearance of an imaging apparatus 1 that is an electronic apparatus according to an embodiment of the present invention as viewed from the front side. FIG. 1 shows a state where the interchangeable lens unit 314 (see FIG. 3 described later) is removed.

  In FIG. 1, the imaging apparatus 1 is provided with a grip portion 11 that protrudes forward so that a photographer can easily grasp the imaging apparatus 1 stably during imaging. On the upper part of the grip part 11, a release switch 12 is arranged as an imaging start switch. The mount unit 13 fixes the detachable interchangeable lens unit 314 to the imaging device 1. The mirror box 14 is disposed in the housing of the imaging apparatus 1, and the imaging light flux that has passed through the interchangeable lens unit 314 is guided here. A quick return mirror 15 is disposed inside the mirror box 14.

  The quick return mirror 15 includes a main mirror 15a and a sub mirror 15b. Part of the main mirror 15a is a half mirror, and part of the light is transmitted. The transmitted light is reflected by the sub mirror 15b and enters the distance measuring unit 307 (see FIG. 3 described later). Further, when the release switch 12 is pressed during imaging, the quick return mirror 15 rotates around an unillustrated shaft provided at the end thereof. Subsequently, the reflecting surface is retracted to a position substantially parallel to the optical axis 316, and the imaging light flux is guided to the imaging element 304 (see FIG. 3 described later).

  The built-in strobe 16 is located above the image pickup apparatus 1, and when the operation button 23 (see FIG. 2 described later) is operated by the user, the built-in strobe 16 is lifted to a predetermined position as shown by a broken line in FIG. The strobe light emitting unit 17 faces the subject and is ready to emit light. The built-in strobe light emitting unit 17 is a known electronic flash, and emits auxiliary light at the time of image pickup by power supply from the built-in strobe capacitor 310 when an imaging instruction is issued by the user in the raised state as shown in FIG. (See FIG. 3 described later).

  The accessory shoe 18 is provided above the imaging device 1 and can be attached with an imaging accessory such as an external strobe. The accessory shoe 18 has an electrical contact for transmitting an instruction from the CPU 302 to the accessory (described later). 3). The main switch 19 can instruct the start and end of power supply from the power supply 309 to each part of the camera by a user operation (see FIG. 3 described later).

  FIG. 2 is a perspective view showing an external appearance of the imaging device 1 according to the embodiment of the present invention as viewed from the back side. In FIG. 2, a finder eyepiece window 21 is provided above the back surface of the imaging apparatus 1, and an image display unit 22 is further provided near the center of the back surface. An operation button 23 is arranged beside the image display unit 22, and various settings of the imaging apparatus 1 can be changed by the user operating the operation button 23, and the setting is displayed on the image display unit 22. The status is displayed.

  An external interface member 24 is disposed on the side surface of the imaging device 1, and openings 2411, 2412, and 2413 for exposing a part of the external connectors 25, 26, and 27 to the outside of the imaging device 1 are provided. The external connectors 25, 26, and 27 are provided for connection with accessories such as a remote controller and for transmitting and receiving image data to an external device such as a PC, and a cable plug or the like for connecting with the accessory or PC is inserted. Is done.

  FIG. 3 is a block diagram showing a main configuration of the imaging apparatus 1 according to the embodiment of the present invention. In addition, the part which is common in the above-mentioned drawing is shown with the same symbol. A CPU (Central Processing Unit) 302 is mounted on the system control board 301. The CPU 302 controls the operation of the entire imaging apparatus 1 and executes various processes and instructions for each element.

  A release switch 12, a built-in flash 16, an accessory shoe 18, an image display unit 22, a main switch 19, and an operation button 23 are connected to the system control board 301. Further, a memory 303, an image sensor 304, a mirror driving unit 305, a shutter driving unit 306, a distance measuring unit 307, and a photometric unit 308 are also connected. Further, the external interface member 24 is connected through the power source 309, the built-in strobe capacitor 310, the external memory slot substrate 311, the accessory detection switch 317, and the connector 41.

  The memory 303 stores information related to the imaging operation of the imaging device 1. The power source 309 supplies power to the CPU 302 and each part of the circuit in the camera, and when the user operates the main switch 19, the power supply to each part is started and ended. The power source 309 may be applied in any form as long as it can supply power to the imaging apparatus 1 such as a lithium ion rechargeable battery, a dry battery, or an AC adapter. An external memory slot 312 is mounted on the external memory slot substrate 311. An external memory 313 can be attached to and detached from the external memory slot 312, and a captured image can be written to and read from the external memory 313.

  The built-in strobe capacitor 310 accumulates charges by feeding power from the power supply 309 when the image pickup apparatus 1 is in a power-on state and the built-in strobe 16 is in a light emission ready state. Prepare to fire. When an imaging instruction is issued by the user, the charge is discharged and the built-in strobe light emitting unit 17 emits light.

  The interchangeable lens unit 314 is an optical system that forms subject image light on the imaging surface of the imaging element 304. A plurality of lens groups including a focus lens (not shown) for adjusting the focal position of the optical system and a movable diaphragm are provided. The lens driving unit 315 in the interchangeable lens unit 314 drives the focus lens and the movable diaphragm. The lens driving unit 315 is configured by a driving system using a DC motor, a stepping motor, an ultrasonic motor, or the like as a power source. Here, the optical axis 316 indicates the center of the photographing optical system.

  The accessory detection switch 317 is turned on when an external strobe (not shown) or other imaging accessory is attached to the accessory shoe 18 and notifies the CPU 302 that the accessory is attached to the accessory shoe 318. This notification is for preventing the built-in strobe 16 from being lifted when the accessory is attached, because it collides with the accessory.

  The distance measuring unit 307 divides the light reflected by the sub mirror 15 b into two to generate two images with parallax, performs known phase difference distance measurement, and outputs distance measurement information to the CPU 302. The pentaprism 318 is an optical member that converts and reflects the imaging light beam reflected by the main mirror 15a into an erect image. The user can observe the subject image from the viewfinder eyepiece window 21. The pentaprism 318 also guides part of the imaging light flux to the photometry unit 308. The photometric unit 308 converts part of the obtained imaging light flux into a luminance signal of each area on the observation surface and outputs the luminance signal to the CPU 302. The CPU 302 calculates an exposure value from the obtained luminance signal.

  The imaging element 304 is provided at a position where light along the optical axis 316 reaches when the main mirror 15a is retracted, and a CMOS that is an imaging device that converts an image formed by the interchangeable lens unit 314 into an electrical signal is used. It is done. There are various types of imaging devices such as a CCD type, a CMOS type, and a CID (charge injection element) type, and any type of imaging device may be adopted. A shutter 319 for controlling the exposure time is provided between the quick return mirror 15 and the image sensor 304. The shutter 319 is a known focal plane shutter.

  The release switch 12 is a switch that can be pressed in two steps. The switch S1 is turned on by the first stroke (half-press), and the switch S2 is turned on by the second stroke (full-press). When the release switch 12 is pressed halfway and S1 is turned on, the CPU 302 drives the distance measurement unit 307 and the photometry unit 308 to perform distance measurement and photometry operation, and the obtained distance measurement information and photometry information are output to the CPU 302. Is done. The CPU 302 sends the obtained distance measurement information and photometry information to the imaging lens drive unit 315, and the lens drive unit 315 is based on the obtained distance measurement information and photometry information, and a focus lens (not shown) in the interchangeable lens unit 314 is obtained. And the movable diaphragm is driven.

  When the release switch 12 is fully pressed and S2 is turned on, the mirror driving unit 305 moves the quick return mirror 15 to the retracted position, and the shutter driving unit 306 starts the opening / closing operation of the shutter 319, and the image sensor 304 is moved. Drive to perform imaging operation. The mirror drive unit 305 and the shutter drive unit 306 are configured by a drive system using a DC motor, a stepping motor, an ultrasonic motor, or the like as a power source.

  When the imaging operation is started, the imaging device 304 converts the incident light into an electrical signal by photoelectric conversion, and then outputs the electrical signal to the CPU 302. The electrical signal output to the CPU 302 undergoes image conversion processing such as JPEG and is recorded as image data in the external memory 313 inserted in the external memory slot 312. Note that the image data in the present embodiment conforms to a known Exif (Exchangeable Image File Format) file format. The image data in the present embodiment is data in which image information such as exposure time and aperture value is combined with image information.

  The main body frame 320 reinforces the imaging device 1 from the inside and holds each component constituting the imaging device 1. The exterior 321 constitutes the external appearance of the imaging device 1 and protects each component constituting the imaging device 1. The connector 41 electrically connects the system control board 301 and the external interface member 24 by connecting an unillustrated FPC, cable, or the like.

  FIG. 4 is a front view and a rear perspective view of the external interface member 24 of the electronic apparatus according to the embodiment of the present invention. The external interface member 24 includes an external portion 241 having openings 2411, 2412, and 2413 for exposing the external connectors 25, 26, and 27 to the external appearance, and a mounting portion 242 on which the external connectors 25, 26, and 27 are mounted. Yes. In order to mount the external connectors 25, 26, and 27, the mounting portion 242 is configured by a three-dimensional housing wiring member such as MOLDED INTERCONNECT DEVICE (hereinafter referred to as MID). (Not shown) is formed.

  Conventionally, an external connector is mounted separately using a printed board or the like, the board is attached to the main body, and an external interface member is attached to the external connector. As described above, in the conventional configuration, there are many parts related to the positional relationship between the opening of the external interface member and the external connector, which causes a positional shift between the opening and the connector. Therefore, in the present invention, by directly wiring and forming lands on the external interface member 24, the external connectors 25, 26, and 27 are mounted, so that the number of parts is kept to the minimum necessary, and the positions of the openings and the connectors. We are trying to reduce the number of parts related to misalignment.

  In the present embodiment, the external connectors 25, 26, and 27 are disposed so as to be fitted to the appearance portion 241 through the openings 2411, 2412, and 2413 of the external interface member 24. The purpose is that the external connectors 25, 26, 27 and the openings 2411, 2412, 2413 are in contact with each other when an external force such as a twist is applied with the cable plug inserted into the external connectors 25, 26, 27. This is to increase power. In addition to the external connectors 25, 26, 27, the connector 41 is mounted on the mounting portion 242, and the system control board 301 and the external interface member 24 are electrically connected by an FPC, a cable, etc. (not shown).

Example 1
A method for mounting an external connector of an electronic apparatus according to an embodiment of the present invention will be described with reference to FIGS. Since the mounting method is the same for any of the external connectors 25, 26, and 27, the external connector 25 will be described as a representative example. In addition, the mounting method of the external connector 25 in this embodiment is performed by so-called reflow mounting.

  FIG. 5 is a top view and a front view of the external connector 25. The external connector 25 is a known so-called surface mount connector. The external connector 25 includes four terminal leads 251, a main body 252, and a plug insertion port 253. By connecting the plug insertion port 253 with a cable plug or a connector plug connected to an external device different from the imaging device 1, electrical communication between the imaging device 1 and the external device is enabled.

  FIG. 6 is a view showing the arrangement of the lands 51 before the external connector 25 is mounted on the external interface member 24. The land 51 is formed on the mounting portion 242 of the external interface member 24 by three-dimensional housing wiring such as MID.

  FIG. 7 is a diagram showing details of the land 51. The land 51 has a fixed portion 511 and an extension portion having different conductor widths in a direction perpendicular to the fitting direction of the external connector 25 and the opening 2411 (hereinafter referred to as the fitting direction). It is composed of two parts 512. The vertical conductor width D1 of the fixed portion 511 is wider than the vertical conductor width D2 of the extension portion 512. This will be described later with reference to FIG.

  The length L of the land 51 in the fitting direction of the external connector 25 determines a moving amount T of the external connector 25 due to solder flow and a fitting amount E with the external interface member 24 as will be described later with reference to FIG. The Since the fixing portion 511 fixes the position after movement of the external connector 25 by solder flow, the length L1 in the fitting direction and the width D1 in the vertical direction are the length in the fitting direction of the terminal lead 251 and the width in the vertical direction. It is made to be substantially the same.

  FIG. 8 is a view showing a state in which cream solder 81 is applied to the external interface member 24. As shown in the enlarged view of the land 51, the cream solder 81 is applied so as to cover only the extension portion 512. The purpose is to move the external connector 25 in the fitting direction by the flow when the cream solder 81 melts and spreads uniformly on the conductors of the lands 51 as will be described later with reference to FIG. Because.

  FIG. 9 is a view showing a state immediately after the external connector 25 is arranged on the external interface member 24 after the cream solder 81 is applied. In the state immediately after the placement, the external connector 25 is not in a state of being fitted to the opening 2411. In order to fit the external connector 25 into the opening 2411, it is necessary to move the external connector 25 horizontally toward the opening 2411 after arranging the external connector 25 vertically from above with respect to the mounting portion 242. This is because the lead terminal 251 scrapes the cream solder 81 during the horizontal movement, and the solder 81 is not properly attached to the lead terminal 251 after the reflow is completed.

  FIG. 10 is a diagram illustrating a state in which reflow mounting is completed after heating is performed after the external connector 25 is disposed on the external interface member 24. When the cream solder 81 is melted by heating, the movement starts on the land 51 which is a conductor having better wettability. Since the cream solder 81 is applied only to the extension portion 512 in the land 51, when the solder 81 is melted by heating, the solder 81 flows in the fitting direction. Due to the force of the solder 81 flowing, the external connector 25 moves in the fitting direction and forms a fitting state with the opening 2411. That is, in the electronic apparatus of the present embodiment, the fitting state of the external connector 25 opening 2411 is realized by the self-alignment effect at the time of reflow mounting.

  FIG. 11 is a diagram illustrating an operation of the land 51 when the external connector 25 according to the first embodiment moves due to the self-alignment effect. As described above, the solder 81 flows on the land 51 in the fitting direction, and the external connector 25 also moves in the fitting direction by the solder flow force. On the other hand, while the solder 81 is melted, the terminal lead 251 can freely move on the land 51. Therefore, the external connector 25 can move not only in the fitting direction with the opening 2411 but also in the direction opposite to the fitting direction, and when the reflow mounting is completed, the external connector 25 is sufficiently fitted into the opening 2411. There is a possibility that it will not be in a state.

  Therefore, in this embodiment, in order to prevent the movement in the direction opposite to the fitting direction of the external connector 25 during melting of the solder 81, the conductor width D1 in the vertical direction of the fixing portion 511 and the conductor width D2 of the extension portion 512 are set. It is different. By increasing the conductor width D1 of the fixing portion 511 and reducing the conductor width D2 of the extension portion 512, more solder 81 stays on the fixing portion 511 side having a larger area due to surface tension, and the lead terminal 251 is also affected by the action. It stays at the fixing portion 511. Further, as described above with reference to FIG. 7, L1 and D1 of the fixing portion 511 are substantially the same as the length in the fitting direction and the width in the vertical direction of the lead terminal 251, so that the lead terminal 251 is connected to the fixing portion 511. If you move, you can't move any more freely. As described above, in order to retain more solder 81 on the fixing portion 511 and to prevent the lead terminal 251 from freely moving, it is opposite to the unnecessary movement of the external connector 25, particularly the fitting direction. Movement in the direction can be suppressed.

  As described above, the land 51 of the present embodiment includes the extension portion 512 that is the movement source in the fitting direction of the external connector 25 and the fixing portion 511 that determines the position of the external connector 25 when the reflow mounting is completed due to the self-alignment effect. Combined. As a result, the external connector 25 can be moved and fixed to a desired position, so that a fitting state having an appropriate fitting amount with the opening 2411 can be formed.

FIG. 12 is a diagram showing the relationship between the land 51 and the external connector 25 fitting amount. The fitting amount between the external connector 25 and the opening 2411 is E, and the length in the fitting direction of the land 51 for moving the external connector 25 is L. As described above with reference to FIG. 7, the external connector 25 is not fitted into the opening 2411 immediately after being placed on the mounting portion 242. Furthermore, due to the accuracy of the mounter for disposing the external connector 25, it cannot be disposed unless it is separated from the appearance portion 241 with a predetermined interval S1. The amount of movement T necessary for fitting with the amount of fitting E between the external connector 25 and the opening 2411 is:
T = E + S1
Can be defined. That is, it is necessary to move the external connector by a distance obtained by adding the interval S1 between the external connector 25 and the appearance portion 241 immediately after the arrangement and the fitting amount E.

The fixing part 511 sets the fitting direction length of L1 in order to fix the terminal lead 251. Further, the extension portion 512 is also more likely to exert a solder flow force on the entire terminal lead 25 when it is wetted with the terminal lead 251 by the length in the fitting direction via the molten solder 81. As a result, since the external connector 25 can be easily moved, it is desirable that the length of the extension portion 512 in the fitting direction is substantially L1 in the fitting direction of the terminal lead 25. Therefore, in order to optimize the movement and fixing of the terminal lead 251, the length L of the land 51 in the fitting direction is preferably set as follows.
L = 2L1

On the other hand, since the movement amount T of the external connector 25 cannot move more than the length L in the fitting direction of the land 51,
L ≧ T
Substituting and organizing the contents related to L and T above,
L1 ≧ 1/2 (E + S1)
That is, in this embodiment, the fitting portion length L1 of the fixing portion 51 needs to be at least half the fitting amount E between the external connector 25 and the opening 2411.

(Example 2)
In the second embodiment, a method of fitting the external connector 25 to the opening 2411 with higher accuracy by controlling the flow direction of the solder will be described. In addition, about the same structure as Example 1, the same code | symbol is used. Also in the second embodiment, the configuration in which the land arranged in the three-dimensional housing is arranged on the external interface member 24 and the external connector 25 mounted on the land is fitted into the opening 2411 is the same as that of the first embodiment. . Similarly, the external connector 25 is moved by the self-alignment effect and fitted into the opening 2411.

  In the present embodiment, the unnecessary movement direction of the external connector 25 is not limited to the direction opposite to the fitting direction of the first embodiment, but is also directed to the direction perpendicular to the opening 2411, and a method for suppressing the same will be described. .

  A second embodiment of the present invention will be described with reference to FIGS. FIG. 13 is a diagram illustrating a state of the land 52 and the land 53 arranged on the external interface member 24 in the second embodiment of the present invention. Similarly to the first embodiment, the land 52 and the land 53 are configured by the fixing portions 521 and 531 and the extension portions 522 and 532, but the shapes are different. On the other hand, the land 52, the land 53, and the center axis 1301 of the opening 2411 are symmetrical and arranged. The length in the fitting direction and the width in the vertical direction of the fixing portions 521 and 531 are substantially the same as the terminal lead 251 as in the first embodiment.

  Further, the vertical widths of the extension portions 522 and 523 are also narrower than the vertical widths of the fixing portions 521 and 522 as in the first embodiment. The structures of the lands 52 and 53 are set for the purpose of moving the external connector 25 by the extension portions 522 and 532 and restricting the position of the external connector 25 by the fixing portions 521 and 531 when the solder flows as in the first embodiment. Has been. Further, the extension portions 522 and 532 are arranged at positions away from the central axis 1301. The purpose is to cause the forces generated in the lands 52 and 53 to flow toward the central axis 1301 when the solder flows, as will be described later with reference to FIG.

  FIG. 14 is a diagram illustrating an application state of the cream solder 81 in the second embodiment. As in the first embodiment, cream solder 81 is applied so as to cover only the extension portions 522 and 532 in order to move the external connector 25 in the fitting direction. The cream solder 81 is applied to the extended portions 522 and 532 so as to have a line-symmetric shape. These purposes are described later with reference to FIG. 15, in order to make the resultant force generated by the solder flow in a straight line toward the opening 2411 by balancing the forces toward the central axis 1301, the cream solder 81 as described above is arranged. Application method.

  15A and 15B are diagrams illustrating the solder flow state of the electronic device according to the second embodiment of the present invention. FIG. 15A illustrates the solder flow state of the land 52, and FIG. 15B illustrates the solder flow state of the land 53. Yes. In the drawing, an arrow indicated by a broken line represents the flow direction of the solder 81, and an arrow indicated by a solid line represents a resultant force generated by the flow of the solder 81. Both the lands 52 and 53 melt when the solder paste 81 applied to the extension portions 522 and 523 is heated. Since the solder paste 81 is applied so as to have a line-symmetric shape with respect to the extended portions 522 and 523, the molten solder 81 flows toward the center in the vertical direction of the extended portions 522 and 523. As a result, in order to cancel the forces generated in the vertical direction, only the force component toward the fitting direction remains in the extensions 522 and 523.

  Subsequently, the solder 81 that flows through the extension portions 522 and 523 and reaches the fixing portions 521 and 531 tends to spread evenly on the fixing portions 521 and 531. As described above, since the extension portions 522 and 523 are arranged at positions away from the central axis 1301, the flow of the solder 81 at the fixing portions 521 and 531 is a component from the side far from the central axis 1301 toward the central axis. There is a component toward the mating direction. As a result, the resultant force generated by the solder flow in the fixing portions 521 and 531 is a combination of a component toward the central axis 1301 and a component toward the fitting direction. Therefore, the force generated by the solder flow in the lands 52 and 53 in the second embodiment is directed only in the fitting direction at the extension portions 522 and 532 as shown by the solid lines in FIG. This is the resultant force of the component toward the shaft 1301 and the fitting direction.

  FIG. 16 is a diagram illustrating the operation of the lands 52 and 53 when the external connector 25 is moved by the self-alignment effect in the second embodiment. As described above, the extension portions 522 and 532 generate only a force in the fitting direction, and the fixing portions 521 and 531 generate a force in the fitting direction with the central shaft 1301. The lead terminal 251 moves by the action of the force, but the lands 52 and 53 have a line-symmetric arrangement and shape, so that the force generated toward the central axis 1301 generated in the fixing portions 521 and 531 is cancelled. The Therefore, the resultant force acting on the entire external connector 25 remains only in the component in the fitting direction, and when the external connector 25 moves, the movement in the direction perpendicular to the opening 2411 is suppressed and the pure force is applied in the fitting direction. It can be moved.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

1: Imaging device 1
24: External interface member 241: Appearance part 242: Mounting part 2411: Opening 25: External connector 251: Terminal lead 51: Land 511: Fixing part 512: Extension part

Claims (2)

An external connector having a plurality of terminal leads and adapted for surface mounting for connecting a cable or an accessory, an external interface member having an opening for fitting with the external connector, and a mounting portion coupled to or formed on the external interface member Have
The mounting portion has a plurality of lands for mounting the external connector, and the lands have a width substantially perpendicular to the fitting direction of the terminal leads, and the width is narrower than that of the fixed portion. It has an extension part. A surface mountable external connector having a plurality of terminal leads for connecting a cable or an accessory, an external interface member having an opening for fitting with the external connector 25, and a mounting portion coupled to or formed on the external interface member And having
The mounting portion has a plurality of first lands and second lands for mounting the external connector, and the first lands have substantially the same width in the direction perpendicular to the terminal lead fitting direction. The second land has a width that is substantially the same as the width of the fixed portion that is perpendicular to the fitting direction of the terminal leads. Has a narrow extension, and the shape and arrangement of the first land and the second land are line symmetric.