JP2019184193A - Heat pump system - Google Patents

Abstract

To inhibit deterioration of the ability of heating a heated fluid in a radiator when an integrated heat exchanger, in which an economizer is integrated with the radiator, is formed in a heat pump system including a refrigerant circuit having the economizer.SOLUTION: A heat pump system (1) has a refrigerant circuit (10) formed by connecting a compressor (11), a radiator (12), an expansion mechanism (13), an evaporator (14), and an economizer (22). The economizer (22) forms an integrated heat exchanger (20) integrated with the radiator (12). Further, the integrated heat exchanger (20) has a heat insulation part (44) between the economizer (22) and the radiator (12).SELECTED DRAWING: Figure 2

Description

  Heat pump system with refrigerant circuit with economizer

  Conventionally, there is a heat pump system including a refrigerant circuit having an economizer. The refrigerant circuit includes a compressor that compresses the refrigerant, a radiator that cools the refrigerant compressed in the compressor by the fluid to be heated, an expansion mechanism that decompresses the refrigerant cooled in the radiator, and a pressure that is reduced by the expansion mechanism. And an evaporator for evaporating the refrigerant. The refrigerant circuit is provided with an economizer that further cools the refrigerant cooled in the radiator by the refrigerant flowing through the refrigerant circuit. In this heat pump system, as shown in Patent Document 1 (European Patent Application Publication No. 2952832), there is one that constitutes an integrated heat exchanger in which an economizer is integrated with a radiator.

  However, in the above-described conventional integrated heat exchanger, the refrigerant flowing through the radiator is cooled by the refrigerant flowing through the economizer due to heat conduction through the junction between the economizer and the radiator, whereby the heated fluid in the radiator There is a possibility that the ability to heat the glass will decrease.

  A heat pump system according to a first aspect includes a compressor that compresses a refrigerant, a radiator that cools the refrigerant compressed in the compressor by a fluid to be heated, an expansion mechanism that depressurizes the refrigerant cooled in the radiator, It has a refrigerant circuit configured by connecting an evaporator for evaporating the decompressed refrigerant in the expansion mechanism. The refrigerant circuit is provided with an economizer that further cools the refrigerant cooled in the radiator by the refrigerant flowing through the refrigerant circuit. Here, the economizer constitutes an integrated heat exchanger integrated with the radiator. In addition, here, the integrated heat exchanger has a heat insulating portion between the economizer and the radiator.

  Here, the heat conduction between the economizer and the radiator can be suppressed by the heat insulating portion. Thereby, here, it becomes difficult for the refrigerant flowing through the radiator to be cooled by the refrigerant flowing through the economizer, and a decrease in the ability to heat the heated fluid in the radiator can be suppressed.

  A heat pump system according to a second aspect is the heat pump system according to the first aspect, wherein the heat insulating part has a lower thermal conductivity than the material constituting the part through which the refrigerant and the fluid to be heated flow in the integrated heat exchanger. It is constituted by.

  Here, for example, it is possible to easily configure the heat insulating portion with a resin, rubber, or ceramic material having a lower thermal conductivity than the material (metal material) that constitutes the portion through which the refrigerant and the fluid to be heated flow. it can.

  In the heat pump system according to the third aspect, in the heat pump system according to the first aspect, the heat insulating part is configured by a gap provided between the radiator and the economizer and not flowing the fluid to be heated.

  Here, a heat insulation part can be easily comprised with a clearance gap.

  In the heat pump system according to the fourth aspect, the gap is in a vacuum state in the heat pump system according to the third aspect.

  Here, the heat insulation performance of the heat insulation part comprised by the clearance gap can be improved.

  A heat pump system according to a fifth aspect is the heat pump system according to the fourth aspect, wherein the integrated heat exchanger is formed by vacuum brazing or diffusion bonding.

  Here, for example, when forming an integrated heat exchanger by stacking plate materials and bonding them by vacuum brazing or diffusion bonding, the refrigerant and the heated material are disposed between the plate materials arranged between the radiator and the economizer. By forming a gap that does not allow fluid to flow, the gap between the plate members can be easily evacuated.

  A heat pump system according to a sixth aspect is the heat pump system according to any one of the first to fifth aspects, wherein the integrated heat exchanger is a microchannel heat exchanger.

  Here, the integrated heat exchanger can be made compact.

  A heat pump system according to a seventh aspect is the heat pump system according to any one of the first to sixth aspects, wherein a utilization side device that heats a room by a heated fluid heated by heat exchange with a refrigerant in a radiator. In addition.

  Here, since the fall of the capability to heat the to-be-heated fluid is suppressed in the radiator, the fall of the heating capability in a utilization side apparatus can be suppressed.

It is a schematic structure figure of a heat pump system concerning one embodiment of this indication. It is a perspective view which shows the external appearance of the integrated heat exchanger with which the heat radiator and the economizer were integrated. It is the figure which looked at the 1st channel of a radiator from the front. It is the figure which looked at the 2nd flow path of the radiator from the front. It is the figure which looked at the 1st flow path of the economizer from the front. It is the figure which looked at the 2nd flow path of the economizer from the front. It is the figure which looked at the inside of a heat insulation part from the front. It is a disassembled perspective view which shows the inside of an integrated heat exchanger. It is a figure which shows the integrated heat exchanger in the modification A, Comprising: It is a figure corresponding to FIG. It is a figure which shows the integrated heat exchanger in the modification A, Comprising: It is a figure corresponding to FIG. It is a figure which shows the integrated heat exchanger in the modification A, Comprising: It is a figure corresponding to FIG. It is a figure which shows the integrated heat exchanger in the modification A, Comprising: It is a figure corresponding to FIG. It is a figure which shows the integrated heat exchanger in the modification A, Comprising: It is the figure which looked at the communicating part from the front. It is a figure which shows the integrated heat exchanger in the modification A, Comprising: It is a figure corresponding to FIG. It is a schematic block diagram of the heat pump system in the modification B. It is a figure which shows the integrated heat exchanger in the modification B, Comprising: It is a figure corresponding to FIG. It is a figure which shows the integrated heat exchanger in the modification B, Comprising: It is a figure corresponding to FIG. It is a figure which shows the integrated heat exchanger in the modification C, Comprising: It is a figure corresponding to FIG. It is a figure which shows the integrated heat exchanger in the modification C, Comprising: It is a figure corresponding to FIG. It is a perspective view which shows the external appearance of the integrated heat exchanger in the modification D. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is a figure which shows the integrated heat exchanger in the modification E, Comprising: It is a figure corresponding to FIG. It is BB sectional drawing of FIG. It is a figure which shows the integrated heat exchanger in the modification F, Comprising: It is a figure corresponding to FIG. It is BB sectional drawing of FIG. It is a figure which shows the integrated heat exchanger in the modification G, Comprising: It is a figure corresponding to FIG. It is a figure which shows the integrated heat exchanger in the modification G, Comprising: It is a figure corresponding to FIG.

  Hereinafter, the heat pump system will be described with reference to the drawings.

(1) Heat pump system <Configuration>
FIG. 1 is a schematic configuration diagram of a heat pump system 1 according to an embodiment of the present disclosure. The heat pump system 1 mainly includes a refrigerant circuit 10 in which a refrigerant as a heat exchange medium circulates and a water circuit 30 in which water as a fluid to be heated circulates, and a refrigerant compression heat pump in the refrigerant circuit 10. It is a device that heats water using a cycle and heats the room with the heated water.

  The refrigerant circuit 10 mainly includes a compressor 11, a radiator 12, an expansion mechanism 13, an evaporator 14, an injection pipe 21, and an economizer 22. The refrigerant circuit 10 contains HFC refrigerant, HFO refrigerant, and natural refrigerant as refrigerant.

  The compressor 11 is a device that compresses a refrigerant. The compressor 11 is, for example, a compressor that drives a refrigerant compression element such as a rotary type or a scroll type by a drive mechanism such as a motor.

  The radiator 12 is a device that cools the refrigerant compressed in the compressor 11 by water circulating in the water circuit 30. The details of the radiator 12 will be described later. Further, the discharge port 11 b of the compressor 11 and the refrigerant side inlet (second inlet 12 a) of the radiator 12 are connected by a discharge refrigerant pipe 16.

  The expansion mechanism 13 is a device that decompresses the refrigerant cooled in the radiator 12 (here, the refrigerant further cooled in the economizer 22). The expansion mechanism 13 is, for example, an expansion valve or a capillary tube. The refrigerant-side outlet (second outlet 12 b) of the radiator 12 and the expansion mechanism 13 are connected by a high-temperature refrigerant pipe 17.

  The evaporator 14 is a device that evaporates the refrigerant decompressed by the expansion mechanism 13. The evaporator 14 is, for example, a fin-and-tube heat exchanger that heats the refrigerant with air. And here, the ventilation fan 15 is provided in order to obtain the flow of the air used as the heating source of a refrigerant | coolant. The blower fan 15 is a fan that drives a propeller type blower element by a drive mechanism such as a motor. The expansion mechanism 13 and the refrigerant inlet 14 a of the evaporator 14 are connected by a low-temperature refrigerant pipe 18. The refrigerant outlet 14 b of the evaporator 14 and the suction port 11 a of the compressor 11 are connected to the suction refrigerant pipe 19. Connected by.

  The injection pipe 21 is a refrigerant pipe that branches a part of the refrigerant flowing through the high-temperature refrigerant pipe 17 and returns it to the compressor 11. One end of the injection pipe 21 is connected to the high-temperature refrigerant pipe 17, and the other end of the injection pipe 21 is connected to a midway part 11 c of the compressor 11. The other end of the injection pipe 21 may be connected to the suction port 11a of the compressor 11 or the suction refrigerant pipe 19 instead of the midway portion 11c of the compressor 11. The injection tube 21 is provided with an injection expansion mechanism 23. The injection expansion mechanism 23 is, for example, an expansion valve.

  The economizer 22 is a device that further cools the refrigerant cooled in the radiator 12 by the refrigerant flowing in the refrigerant circuit 10. Here, the economizer 22, the refrigerant flowing in the high-temperature refrigerant pipe 17 cooled in the radiator 12, It cools with the refrigerant | coolant which flows through the injection pipe | tube 21 as a refrigerant | coolant which flows through the refrigerant circuit 10 (specifically, the refrigerant | coolant decompressed by the injection expansion mechanism 23). For this reason, the economizer 22 is provided in the high temperature refrigerant pipe 17 and the injection pipe 21. The inlet of the economizer 22 on the high temperature refrigerant pipe 17 side (fourth inlet 22a) is connected to the high temperature refrigerant pipe 17a, and the outlet of the economizer 22 on the high temperature refrigerant pipe 17 side (fourth outlet 22b) is connected to the high temperature refrigerant pipe 17. Is connected to a portion 17b near the expansion mechanism 13. The inlet (third inlet 22c) on the injection pipe 21 side of the economizer 22 is connected to the second portion 21b of the injection pipe 21, and the outlet (third inlet 22d) on the injection pipe 21 side of the economizer 22 is the injection pipe. 21 is connected to the third portion 21c. Here, the injection pipe 21 includes a first portion 21 a that connects the portion 17 a of the high-temperature refrigerant pipe 17 near the radiator 12 and the injection expansion mechanism 23, a third inlet 22 c of the injection expansion mechanism 23 and the economizer 22. And a third portion 21c for connecting the third outlet 22d of the economizer 22 and the compressor 11 to each other. Details of the economizer 22 will be described later.

  The water circuit 30 mainly includes the radiator 12, the pump 31, and the use side device 32. Water is sealed in the water circuit 30.

  The radiator 12 is a device that cools the refrigerant compressed in the compressor 11 by the water circulating in the water circuit 30 as described above. In other words, the radiator 12 is a device that heats water using the refrigerant circulating in the refrigerant circuit 10. The details of the radiator 12 will be described later.

  The pump 31 is a device that boosts water. The pump 31 is, for example, a pump that drives a centrifugal or positive displacement pump element by a drive mechanism such as a motor. Here, the water-side outlet (first outlet 12 d) of the radiator 12 and the suction port 31 a of the pump 31 are connected by an outlet water pipe 33.

  The use side device 32 is a device that heats the room with water heated by the radiator 12. The use side device 32 is, for example, a radiator or a floor heater. Further, the discharge port 31b of the pump 31 and the water inlet 32a of the usage-side device 32 are connected by a discharge water pipe 34, and the water outlet 32b of the usage-side device 32 and the water-side inlet of the radiator 12 (first 1 inlet 12c) is connected by an inlet water pipe 35.

  The components of the heat pump system 1 are controlled by the control device 2. The control device 2 includes a control board on which a microcomputer, a memory, and the like are mounted.

<Operation>
Next, operation | movement of the heat pump system 1 is demonstrated using FIG. As described above, the heat pump system 1 can heat water using the refrigerant compression heat pump cycle in the refrigerant circuit 10 and heat the room with the heated water (heating operation). The heating operation is performed by the control device 2.

  In the refrigerant circuit 10, the refrigerant compressed and discharged by the compressor 11 is sent to the radiator 12. The refrigerant (high-temperature refrigerant) sent to the radiator 12 is cooled and condensed by exchanging heat with the water circulating in the water circuit 30. The refrigerant that has dissipated heat in the radiator 12 is sent to the economizer 22. The refrigerant (high temperature refrigerant) sent to the economizer 22 is further cooled by exchanging heat with the refrigerant (low temperature refrigerant) branched from the high temperature refrigerant pipe 17 to the injection pipe 21. At this time, the refrigerant flowing through the injection pipe 21 is heated by the economizer 22 and returned to the compressor 11. The refrigerant cooled in the economizer 22 is decompressed by the expansion mechanism 13 and then sent to the evaporator 14. The refrigerant sent to the evaporator 14 evaporates by being heated by heat exchange with the air passing through the evaporator 14 by the blower fan 15. The refrigerant evaporated in the evaporator 14 is sucked into the compressor 11 and is compressed and discharged again in the compressor 11.

  On the other hand, in the water circuit 30, water is heated by the heat radiation of the refrigerant in the radiator 12. The water heated in the radiator 12 is pressurized by the pump 31 and discharged. The water discharged from the pump 31 is sent to the use side device 32. The water sent to the use side device 32 is cooled by heating the room. The water cooled in the use side device 32 is sent to the radiator 12 and heated again in the radiator 12.

(2) Details of radiator and economizer Next, details of the radiator 12 and the economizer 22 will be described with reference to FIGS. Here, FIG. 2 is a perspective view showing an appearance of the integrated heat exchanger 20 in which the radiator 12 and the economizer 22 are integrated. FIG. 3 is a view of the first flow path 51 of the radiator 12 as viewed from the front. FIG. 4 is a view of the second flow path 61 of the radiator 12 as viewed from the front. FIG. 5 is a view of the first flow path 71 of the economizer 22 as viewed from the front. FIG. 6 is a view of the second flow path 81 of the economizer 22 as viewed from the front. FIG. 7 is a view of the inside of the heat insulating portion 44 as viewed from the front. FIG. 8 is an exploded perspective view showing the inside of the integrated heat exchanger 20. In addition, in the following description, expressions such as “up”, “down”, “left”, “right”, “front”, and “rear” may be used to describe the direction and positional relationship. Unless otherwise specified, the direction indicated by the expression follows the direction of the arrow shown in the drawings.

  Here, an integrated heat exchanger 20 in which the radiator 12 and the economizer 22 are integrated is configured. That is, the integrated heat exchanger 20 includes the radiator 12 and the economizer 22.

  The integrated heat exchanger 20 mainly includes a radiator-side heat exchange unit 41 that constitutes the radiator 12, an economizer-side heat exchange unit 42 that constitutes the economizer 22, a radiator-side heat exchange unit 41, and an economizer-side heat exchange. And a casing 43 in which the portion 42 is provided. The radiator-side heat exchanging portion 41 is a portion that cools the refrigerant (high-temperature refrigerant) compressed in the compressor 11 by the heated fluid (water). The economizer side heat exchanging unit 42 is a part that further cools the refrigerant cooled in the radiator 12 (radiator side heat exchanging unit 41) by the refrigerant (low temperature refrigerant) flowing through the refrigerant circuit 10. In addition, although the economizer side heat exchange part 42 is arrange | positioned here in the back direction side of the heat radiator side heat exchange part 41, the arrangement | positioning with reverse order may be sufficient as it.

  In addition, here, the integrated heat exchanger 22 has a heat insulating portion between the economizer 22 (economizer side heat exchanging portion 42) and the radiator 12 (radiator side heat exchanging portion 41) (here, in the front-rear direction). 44. That is, the heat insulating part 44 is provided in the casing 43 in a state of being disposed between the radiator side heat exchanging part 41 and the economizer side heat exchanging part 42. Here, the heat insulation part 44 is a part that suppresses heat conduction between the economizer 22 (economizer side heat exchange part 42) and the radiator 12 (heat radiator side heat exchange part 41).

  The radiator-side heat exchanging portion 41 (heat radiator 12) includes a first layer 50 in which a plurality of first flow paths 51 through which water flows are formed, and a second layer 61 in which a plurality of second flow paths 61 through which high-temperature refrigerant flows are formed. The two layers 60 are laminated. Here, the direction in which the first layer 50 and the second layer 60 are stacked (here, the front-rear direction in FIGS. 2 and 8) is the stacking direction. The direction in which the first flow paths 51 are arranged (here, the left-right direction) is the arrangement direction of the first flow paths 51, and the direction in which the second flow paths 61 are arranged (here, the vertical direction) is the direction of the second flow paths 61. The array direction. The first and second flow paths 51 and 61 are micro flow paths (flow paths having an equivalent diameter of 1.5 mm or less) having a very small cross-sectional area. That is, the radiator 12 is called a microchannel heat exchanger. And when the 1st flow path 51 sees the 1st layer 50 along the lamination direction (front-back direction) of the 1st and 2nd layers 50 and 60, the arrangement direction (left-right direction) of the 1st flow path 51 Extends from the vicinity of the lower end portion of the first layer 50 to the vicinity of the upper end portion in a direction intersecting with (in this case, the vertical direction). In addition, here, the first flow path 51 has a shape meandering in the arrangement direction (left-right direction) of the first flow paths 51 when the first layer 50 is viewed along the stacking direction (front-rear direction). In this way, heat transfer is promoted. The second flow path 61 is arranged in the arrangement direction (vertical direction) of the second flow path 61 when the second layer 60 is viewed along the stacking direction (front-rear direction) of the first and second layers 50, 60. Extends from the vicinity of the left end of the second layer 60 to the vicinity of the right end along the direction intersecting with (here, the left-right direction). In addition, here, the second flow path 61 is divided into a plurality of (in this case, four) flow path groups arranged in the vertical direction, and the flow path positioned at the upper left end from the flow path group positioned at the lower left end. It extends so as to be folded in the left-right direction toward the road group. Thus, here, the first flow path 51 and the second flow path 61 are arranged so as to form an orthogonal counter flow.

  And here, the radiator side heat exchanging part 41 having the laminated structure of the first layer 50 and the second layer 60 includes the first plate member 52 in which the groove forming the first flow path 51 is formed on one side, It is configured by alternately laminating the second plate material 62 in which the grooves forming the flow path 61 are formed on one side. The first and second plate members 52 and 62 are made of a metal material. The grooves forming the first flow path 51 and the second flow path 61 are formed, for example, by subjecting the first and second plate members 52 and 62 to machining or etching. Then, after a predetermined number of first and second plate members 52 and 62 having been subjected to such groove processing are stacked, the first and second plate members 52 and 62 are bonded by vacuum brazing or diffusion bonding. Thus, the radiator-side heat exchanging portion 41 having a laminated structure of the first layer 50 and the second layer 60 is obtained. In addition, here, although the groove | channel which makes the flow paths 51 and 61 is formed in the single side | surface of both the 1st and 2nd board | plate materials 52 and 62, it is not limited to this, The 1st and 2nd board | plate material 52 is not limited to this. , 62 may be formed with grooves forming the flow paths 51, 61 on both surfaces, and grooves forming the flow paths 51, 61 are formed on both surfaces of the first and second plate members 52, 62. May be.

  Further, here, notches 53 and 54 are formed at the lower end and the upper end of the first plate member 52, and the notches 53 and 54 are respectively provided at the lower end (water inlet) of the first flow path 51. Part) and upper end part (outlet part of water). Notch portions 63 and 64 are also formed on the lower end portion and the upper end portion of the second plate member 62 so as to overlap the notch portions 53 and 54. Then, the first and second plate members 52 and 62 are joined to form the first inlet header 13c, which is a space in which the cutout portions 53 and 63 communicate with the lower end portion of the first flow path 51. The notch portions 54 and 64 form a first outlet header 13 d that is a space communicating with the upper end portion of the first flow path 51. In addition, cutout portions 65 and 66 are formed in the upper left end portion and the lower left end portion of the second plate member 62, respectively. The cutout portions 65 and 66 are respectively left upper end portions of the second flow path 61 (high temperature refrigerant inlets). Part) and the lower left end (outlet part of the high-temperature refrigerant). Cutout portions 55 and 56 are also formed on the upper left end portion and the lower left end portion of the first plate member 52 so as to overlap the cutout portions 65 and 66. And by joining between the 1st and 2nd board members 52 and 62, the 2nd entrance header 13a which is the space where notch parts 55 and 65 communicate with the upper left end part of the 2nd channel 61 is formed, The notches 56 and 66 form a second outlet header 13 b that is a space communicating with the lower left end of the second flow path 61.

  The economizer side heat exchanging unit 42 (economizer 22) includes a third layer 70 in which a plurality of third flow paths 71 through which low-temperature refrigerant flows are formed, and a fourth layer in which a plurality of fourth flow paths 81 through which high-temperature refrigerant flows are formed. The layer 80 is laminated. Here, the direction in which the third layer 70 and the fourth layer 80 are stacked (here, the front-rear direction in FIGS. 2 and 8) is the stacking direction. The direction in which the third flow paths 71 are arranged (here, the left-right direction) is the arrangement direction of the third flow paths 71, and the direction in which the fourth flow paths 81 are arranged (here, the vertical direction) is the direction of the fourth flow paths 81. The array direction. The third and fourth channels 71 and 81 are micro channels (channels with an equivalent diameter of 1.5 mm or less) having a very small channel cross-sectional area. That is, the economizer 22 is called a micro flow channel heat exchanger. And when the 3rd flow path 71 sees the 3rd layer 70 along the lamination direction (front-back direction) of the 3rd and 4th layers 70 and 80, the arrangement direction (left-right direction) of the 3rd flow path 71 Extends from the vicinity of the lower end portion of the third layer 70 to the vicinity of the upper end portion in a direction intersecting with (in this case, the vertical direction). In addition, here, the third flow path 71 has a shape meandering in the arrangement direction (left-right direction) of the third flow paths 71 when the third layer 70 is viewed along the stacking direction (front-rear direction). In this way, heat transfer is promoted. The fourth channel 81 is arranged in the arrangement direction (vertical direction) of the fourth channel 81 when the fourth layer 80 is viewed along the stacking direction (front-rear direction) of the third and fourth layers 70, 80. Extends from the vicinity of the left end of the fourth layer 80 to the vicinity of the right end along a direction intersecting with (here, the left-right direction). In addition, here, the fourth flow path 81 is divided into a plurality of (in this case, four) flow path groups arranged in the vertical direction, and the flow path positioned at the upper left end from the flow path group positioned at the lower left end. It extends so as to be folded in the left-right direction toward the road group. Thus, here, the third flow path 71 and the fourth flow path 81 are arranged so as to form an orthogonal counter flow.

  And here, the economizer side heat exchanging part 42 having the laminated structure of the third layer 70 and the fourth layer 80 includes the third plate member 72 in which the groove forming the third flow path 71 is formed on one side, and the fourth flow. It is configured by alternately laminating the fourth plate member 82 in which the grooves forming the path 81 are formed on one side. The third and fourth plate members 72 and 82 are made of a metal material. The grooves forming the third flow path 71 and the fourth flow path 81 are formed, for example, by subjecting the third and fourth plate members 72 and 82 to machining or etching. Then, after a predetermined number of the third and fourth plate members 72 and 82 having been subjected to such groove processing are laminated, the third and fourth plate members 72 and 82 are bonded by vacuum brazing or diffusion bonding bonding processing. Thus, the economizer side heat exchanging portion 42 having a laminated structure of the third layer 70 and the fourth layer 80 is obtained. Here, the grooves forming the flow paths 71, 81 are formed on one side of both the third and fourth plate members 72, 82, but the present invention is not limited to this, and the third and fourth plate members 72 are not limited thereto. , 82 may be formed with grooves 71, 81 on both surfaces, or grooves 71, 81 may be formed on both surfaces of the third and fourth plates 72, 82. May be.

  Further, here, notches 73 and 74 are formed at the lower end and the upper end of the third plate member 72, respectively, and the notches 73 and 74 are respectively provided at the lower end of the third flow path 71 (low-temperature refrigerant). It communicates with the inlet portion) and the upper end portion (the outlet portion of the low-temperature refrigerant). Cutout portions 83 and 84 are also formed on the lower end portion and the upper end portion of the fourth plate member 82 so as to overlap the cutout portions 73 and 74. Then, the third and fourth plate members 72 and 82 are joined together to form the third inlet header 23c, which is a space where the cutout portions 73 and 83 communicate with the lower end portion of the third flow path 71. The notch portions 74 and 84 form a third outlet header 23 d that is a space communicating with the upper end portion of the third flow path 71. In addition, cutout portions 85 and 86 are formed in the upper left end portion and the lower left end portion of the fourth plate member 82, respectively. The cutout portions 85 and 86 are respectively formed in the upper left end portion of the fourth flow path 81 (inlet of high-temperature refrigerant). Part) and the lower left end (outlet part of the high-temperature refrigerant). Cutout portions 75 and 76 are also formed on the upper left end portion and the lower left end portion of the third plate member 72 so as to overlap the cutout portions 85 and 86. And by joining between the 3rd and 4th board materials 72 and 82, the 4th entrance header 23a which is the space which the notch parts 75 and 85 communicate with the left upper end part of the 4th channel 81 is formed, The notches 76 and 86 form a fourth outlet header 23 b that is a space communicating with the lower left end of the fourth flow path 81.

  The heat insulating part 44 forms a gap 90 between which the refrigerant and the water do not flow between the radiator side heat exchanging part 41 (heat radiator 12) and the economizer side heat exchanging part 42 (economizer 22). Here, the heat insulating portion 44 is disposed between the fifth plate material 91 on the radiator side heat exchange portion 41 side, the sixth plate material 92 on the economizer side heat exchange portion 42 side, and the fifth and sixth plate materials 91 and 92. And a seventh plate member 93. The fifth to seventh plate members 91 to 93 are made of a metal material. The seventh plate member 93 has an opening 94 for forming the gap 90. And after arrange | positioning the 7th board | plate material 93 between the 5th and 6th board | plate materials 91 and 92, ie, laminating | stacking the 5th board | plate material 91, the 7th board | plate material 93, and the 6th board | plate material 92 in order from the front direction of FIG.2 and FIG.8. By joining the plate members 91, 93, 92 by vacuum brazing or diffusion bonding, a heat insulating portion 44 having a gap 90 formed therein is obtained. In the vacuum brazing or diffusion bonding, the plate members 91, 93, 92 are bonded in a vacuum atmosphere, and the gap 90 obtained thereby is also in a vacuum state.

  The casing 43 is a member provided with a radiator-side heat exchanging portion 41, an economizer-side heat exchanging portion 42, and a heat insulating portion 44. Here, the casing 43 has a substantially rectangular parallelepiped shape. A first inlet 12c serving as an inlet for water is formed at a front portion of the lower surface of the casing 43, and communicates with the first inlet header 13c. An inlet water pipe 35 is connected to the first inlet 12c. A first outlet 12d serving as a water outlet is formed in a front portion of the upper surface of the casing 43, and communicates with the first outlet header 13d. An outlet water pipe 33 is connected to the first outlet 12d. A second inlet 12a serving as an inlet for the high-temperature refrigerant is formed in the upper front portion of the left side surface portion of the casing 43, and communicates with the second inlet header 13a. A discharge refrigerant pipe 16 is connected to the second inlet 12a. A second outlet 12b serving as an outlet for the high-temperature refrigerant is formed at the front lower portion of the left side surface portion of the casing 43 and communicates with the second outlet header 13b. A high temperature refrigerant pipe 17a is connected to the second outlet 12b. In addition, a third inlet 22c serving as an inlet for the low-temperature refrigerant is formed in the rear portion of the lower surface portion of the casing 43, and communicates with the third inlet header 23c. An injection pipe 21b is connected to the third inlet 22c. A rear outlet portion of the upper surface of the casing 43 is formed with a third outlet 22d serving as an outlet for the low-temperature refrigerant, and communicates with the third outlet header 23d. An injection pipe 21b is connected to the third outlet 22d. A fourth inlet 22a serving as an inlet for the high-temperature refrigerant is formed at the rear upper part of the left side surface portion of the casing 43, and communicates with the fourth inlet header 23a. A high temperature refrigerant pipe 17a is connected to the fourth inlet 22a. A fourth outlet 22b serving as an outlet for the high-temperature refrigerant is formed at the rear lower portion of the left side surface portion of the casing 43, and communicates with the fourth outlet header 23b. A high temperature refrigerant pipe 17b is connected to the fourth outlet 22b. Here, each surface portion of the casing 43 is formed of a metal plate-like member.

  And each surface part of the casing 43 is arrange | positioned so that the radiator side heat exchange part 41, the economizer side heat exchange part 42, and the heat insulation part 44 may be covered here, and the radiator side heat exchange part 41, the economizer side heat exchange The part 42 and the heat insulating part 44 are joined. Here, the first to seventh plate members 52, 62, 72, 82, 91, 92, 93 are predetermined for joining the radiator side heat exchange unit 41, the economizer side heat exchange unit 42, the heat insulation unit 44 and the casing 43. After covering the surface portions of the casing 43 with a predetermined number of layers laminated in order, the heat-radiating-side heat exchanging portion 41, the economizer-side heat exchanging portion 42, and the heat insulating portion 44 are performed by performing vacuum brazing or diffusion bonding. It is done with the formation of. However, the radiator side heat exchanging part 41, the economizer side heat exchanging part 42, the heat insulating part 44 and the casing 43 do not have to be joined at the same time, and the radiator side heat exchanging part 41, the economizer side heat exchanging part 42 and the heat insulating part are not required. Only 44 may be joined by vacuum brazing or diffusion joining, and then the radiator side heat exchanging part 41, the economizer side heat exchanging part 42, and the heat insulating part 44 may be joined to the casing 43.

  In the integrated heat exchanger 20 having such a configuration, during the operation of the heat pump system 1, in the radiator 12, water flows from the first inlet 12c to the first inlet header 13c, and from the first inlet header 13c to the second one. Branched to the inlet portion of the first flow path 51, flows in the first flow path 51 from the bottom to the top, and is heated by heat exchange with the high-temperature refrigerant, and from the outlet portion of the first flow path 51 to the first outlet header 13d. And flow out from the first outlet 12d. In the radiator 12, the high-temperature refrigerant flows from the second inlet 12 a into the second inlet header 13 a, branches from the second inlet header 13 a to the inlet portion of the second flow path 61, and passes through the second flow path 61. It flows from the top to the bottom while turning back left and right, dissipates heat by heat exchange with water, merges from the outlet portion of the second flow path 61 at the second outlet header 13b, and flows out from the second outlet 12b. Further, in the economizer 22, the low-temperature refrigerant flows from the third inlet 22c into the third inlet header 23c, branches off from the third inlet header 23c to the inlet portion of the third flow path 71, and passes through the third flow path 71. From the outlet portion of the third flow path 71 to the third outlet header 23d, and flows out from the third outlet 32d. In the economizer 22, the high-temperature refrigerant flows into the fourth inlet header 23a from the fourth inlet 22a, branches off from the fourth inlet header 23a to the inlet portion of the fourth flow path 81, and moves left and right in the fourth flow path 81. Then, it flows from the top to the bottom while being folded back, dissipates heat by heat exchange with the low-temperature refrigerant, joins at the fourth outlet header 23b from the outlet portion of the fourth flow path 81, and flows out from the fourth outlet 22b.

(3) Features Next, features of the heat pump system 1 will be described.

<A>
Here, as described above, in the heat pump system 1 including the refrigerant circuit 10 having the economizer 22, the economizer 22 is integrated with the radiator 12 to constitute the integrated heat exchanger 20.

  In a conventional integrated heat exchanger, the refrigerant flowing through the radiator is cooled by the refrigerant flowing through the economizer due to heat conduction through the junction between the economizer and the radiator, and this causes the fluid to be heated in the radiator. There was a possibility that the ability to heat may fall.

  On the other hand, here, the integrated heat exchanger 20 has a heat insulating portion 44 between the economizer 22 and the radiator 12.

  For this reason, here, heat conduction between the economizer 22 and the radiator 12 can be suppressed by the heat insulating portion 44. Thereby, here, the refrigerant (high-temperature refrigerant) flowing through the radiator 12 is less likely to be cooled by the refrigerant (particularly low-temperature refrigerant) flowing through the economizer 22, and heats the fluid to be heated (here, water) in the radiator 12. A decrease in ability can be suppressed. In addition, by suppressing the decrease in the heating capacity, the radiator 12 can be made compact, and even if the heat insulating portion 44 is combined, the merit of the compactness by integrating the radiator 12 and the economizer 22 is increased.

<B>
Further, here, as described above, the heat insulating portion 44 is configured by the gap 90 provided between the radiator 12 and the economizer 22 so as not to flow the refrigerant and the fluid to be heated.

  Thereby, the heat insulation part 44 can be easily comprised by the clearance gap 90 here.

<C>
Here, as described above, the gap 90 is in a vacuum state.

  Thereby, the heat insulation performance of the heat insulation part 44 comprised by the clearance gap 90 can be improved here.

<D>
Here, as described above, the integrated heat exchanger 20 is formed by vacuum brazing or diffusion bonding.

  Here, as described above, when the integrated heat exchanger 20 is formed by laminating the plate members 52, 62, 72, 82, 91 to 93 and bonding them by vacuum brazing or diffusion bonding, the radiator 12 By forming a gap 90 between the plate members 91 to 93 disposed between the plate member 91 and the economizer 22 so that the refrigerant and the fluid to be heated do not flow, the gap between the plate members 91 to 93 can be easily brought into a vacuum state. Can do.

<E>
Here, as described above, the integrated heat exchanger 20 is a micro-channel heat exchanger.

  Here, the integrated heat exchanger 20 can be made compact.

<F>
In addition, here, as described above, it further includes the use-side device 32 that heats the room with the heated fluid (water) heated by the heat exchange with the refrigerant in the radiator 12.

  Thereby, since the fall of the capability to heat a to-be-heated fluid (water) in the radiator 12 is suppressed here, the fall of the heating capability in the utilization side apparatus 32 can be suppressed.

(4) Modification <A>
In the said embodiment, although the heat radiator 12 and the economizer 22 are integrated and the integrated heat exchanger 20 is comprised (refer FIGS. 2-8), not only these but both heat exchangers 12 and 22 are comprised. A part of the refrigerant pipe to be connected may also be incorporated into the integrated heat exchanger 20.

  Specifically, here, as shown in FIGS. 9, 3, 10, 5, and 11 to 14, the high-temperature refrigerant pipe 17 a that sends the high-temperature refrigerant radiated in the radiator 12 to the economizer 22 is an injection pipe. It is made to incorporate in the integrated heat exchanger 20 with the branch part to 21a.

  The integrated heat exchanger 20 mainly includes a radiator-side heat exchange part 41 (heat radiator 12), an economizer-side heat exchange part 42 (economizer 22), a casing 43, and a heat insulating part 44. . In addition, here, the integrated heat exchanger 20 further includes a communication portion 45 between the heat insulating portion 44 and the economizer 22 (economizer side heat exchanging portion 42) (here, in the front-rear direction).

  As in the above embodiment, the radiator-side heat exchange unit 41 (heat radiator 12) includes a first layer 50 in which a plurality of first flow paths 51 through which water flows is formed, and a second flow path 61 through which high-temperature refrigerant flows. And the second layer 60 formed in a plurality of rows are stacked. Here, since the configuration of the radiator-side heat exchange unit 41 is the same as that of the above-described embodiment, the description thereof is omitted here.

  The economizer side heat exchanging unit 42 (economizer 22) includes a third layer 70 in which a plurality of third flow paths 71 through which low-temperature refrigerant flows are formed, and a fourth layer in which a plurality of fourth flow paths 81 through which high-temperature refrigerant flows are formed. The layer 80 is laminated. Here, since the structure of the economizer side heat exchange part 42 is the same as that of the said embodiment, description is abbreviate | omitted here.

  The heat insulating part 44 forms a gap 90 between which the refrigerant and water do not flow between the radiator side heat exchanging part 41 (heat radiator 12) and the economizer side heat exchanging part 42 (economizer 22), as in the above embodiment. ing. However, here, unlike the above-described embodiment, notch portions 91a to 93a are provided at the lower left ends of the fifth to seventh plate members 91 to 93 constituting the heat insulating portion 44 so as to overlap the notch portions 56 and 66. These notches 91a to 93a are also part of the second outlet header 13b. Therefore, an opening 94 for forming the gap 90 is formed in the seventh plate member 93 so as to avoid the notch portion 93a.

  The communication part 45 forms a flow path 96 that allows the second outlet header 13b of the radiator-side heat exchange part 41 (heat radiator 12) to communicate with the fourth inlet header 23a of the economizer-side heat exchange part 42 (economizer 22). Part. Here, the communication part 45 has the 8th board | plate material 95 by the side of the heat insulation part 44, and the 9th board | plate material 97 by the side of the economizer side heat exchange part 42. The eighth and ninth plate members 95 and 97 are made of a metal material. The eighth plate member 95 has notches 95a and 95b and a flow path 96. The notch 95a is formed at the lower left end of the eighth plate member 95 so as to overlap the notches 56, 66, 91a to 93a, and constitutes a part of the second outlet header 13b. The notch 95b is formed at the upper left end of the eighth plate member 95 so as to overlap with the notches 75 and 85, and constitutes a part of the fourth inlet header 23a. The flow path 96 is a flow path that allows the cutout portion 95a (second outlet header 13b) and the cutout portion 95b (fourth inlet header 23a) to communicate with each other in the vertical direction. A flow path having the same shape as the fourth flow path 81 is employed. However, the shape of the channel 96 is not limited to this, and may be any other shape as long as the cutout portion 95a and the cutout portion 95b communicate with each other in the vertical direction. A cutout portion 97a is formed at the upper left end portion of the ninth plate member 97 so as to overlap with the cutout portions 75, 85, 95b, and constitutes a part of the fourth inlet header 23a.

  The casing 43 is a member in which the communication part 45 is provided together with the radiator side heat exchange part 41, the economizer side heat exchange part 42, and the heat insulation part 44. A first inlet 12c serving as an inlet for water is formed at a front portion of the lower surface of the casing 43, and communicates with the first inlet header 13c. An inlet water pipe 35 is connected to the first inlet 12c. A first outlet 12d serving as a water outlet is formed in a front portion of the upper surface of the casing 43, and communicates with the first outlet header 13d. An outlet water pipe 33 is connected to the first outlet 12d. A second inlet 12a serving as an inlet for the high-temperature refrigerant is formed in the upper front portion of the left side surface portion of the casing 43, and communicates with the second inlet header 13a. A discharge refrigerant pipe 16 is connected to the second inlet 12a. A second outlet 12b serving as an outlet for the high-temperature refrigerant is formed at the front lower portion of the left side surface portion of the casing 43 and communicates with the second outlet header 13b. However, unlike the above embodiment, the second outlet 12b is connected to the injection pipe 21a instead of the high-temperature refrigerant pipe 17a. In addition, a third inlet 22c serving as an inlet for the low-temperature refrigerant is formed in the rear portion of the lower surface portion of the casing 43, and communicates with the third inlet header 23c. An injection pipe 21b is connected to the third inlet 22c. A rear outlet portion of the upper surface of the casing 43 is formed with a third outlet 22d serving as an outlet for the low-temperature refrigerant, and communicates with the third outlet header 23d. An injection pipe 21b is connected to the third outlet 22d. The fourth inlet 22a formed in the above embodiment is not formed in the rear upper portion of the left side surface portion of the casing 43.

  And each surface part of the casing 43 is arrange | positioned so that the radiator side heat exchange part 41, the economizer side heat exchange part 42, the heat insulation part 44, and the communication part 45 may be covered here, and the radiator side heat exchange part 41, The economizer side heat exchanging part 42, the heat insulating part 44 and the communicating part 45 are joined. Here, the first to seventh plate members 52, 62, 72, 82, 91, 92, 93, 95 are joined to the radiator 43 side heat exchange unit 41, economizer side heat exchange unit 42, and heat insulation unit 44 and the casing 43. , 97 are stacked in a predetermined order and covered with each surface portion of the casing 43, and then subjected to a joining process such as vacuum brazing or diffusion bonding, whereby the radiator-side heat exchange unit 41, the economizer-side heat exchange unit 42 The heat insulation part 44 and the communication part 45 are formed.

  In the integrated heat exchanger 20 having such a configuration, during the operation of the heat pump system 1, in the radiator 12, water flows from the first inlet 12c to the first inlet header 13c, and from the first inlet header 13c to the second one. Branched to the inlet portion of the first flow path 51, flows in the first flow path 51 from the bottom to the top, and is heated by heat exchange with the high-temperature refrigerant, and from the outlet portion of the first flow path 51 to the first outlet header 13d. And flow out from the first outlet 12d. In the radiator 12, the high-temperature refrigerant flows from the second inlet 12 a into the second inlet header 13 a, branches from the second inlet header 13 a to the inlet portion of the second flow path 61, and passes through the second flow path 61. It flows from the top to the bottom while turning back left and right, dissipates heat by heat exchange with water, and merges at the second outlet header 13b from the outlet portion of the second flow path 61. A part of this high-temperature refrigerant flows out from the second outlet 12b and is sent to the injection pipe 21a, and the remaining high-temperature refrigerant is a notch 91a of the heat insulating part 44 that forms part of the second outlet header 13b. To 93a through the notch 95a of the communication part 45. The high-temperature refrigerant sent to the communication part 45 flows from the bottom to the top in the flow path 96 and enters the economizer 22 through the notches 95b and 97b of the communication part 45 forming a part of the fourth inlet header 23a. Sent. In the economizer 22, the low-temperature refrigerant flows from the third inlet 22c into the third inlet header 23c, branches from the third inlet header 23c to the inlet portion of the third flow path 71, and passes through the third flow path 71. It flows from the bottom to the top, is heated by heat exchange with the high-temperature refrigerant, merges from the outlet portion of the third flow path 71 at the third outlet header 23d, and flows out from the third outlet 32d. Further, in the economizer 22, the high-temperature refrigerant flows into the fourth inlet header 23a through the notches 95b and 97b of the communication portion 45, and is branched from the fourth inlet header 23a to the inlet portion of the fourth flow path 81. While flowing back and forth in the flow path 81, it flows from the top to the bottom, dissipates heat by heat exchange with the low-temperature refrigerant, and merges from the outlet portion of the fourth flow path 81 at the fourth outlet header 23b and from the fourth outlet 22b. leak.

<B>
In the said embodiment, what cools a high temperature refrigerant | coolant with the low temperature refrigerant | coolant which flows through the injection pipe 21 is employ | adopted as the economizer 22 which further cools the high temperature refrigerant | coolant cooled in the heat radiator 12 with the refrigerant | coolant which flows through the refrigerant circuit 10 (FIG. 1). However, the economizer 22 is not limited to this. For example, an economizer that cools the high-temperature refrigerant with the low-temperature refrigerant evaporated in the evaporator 14 may be employed.

  Specifically, as shown in FIG. 15, in the refrigerant circuit 10 of the above embodiment, the injection pipe 21 is omitted, and the refrigerant flowing through the high-temperature refrigerant pipe 17 cooled in the radiator 12 is used as the economizer 22 as the refrigerant. What is cooled by the refrigerant flowing through the suction refrigerant pipe 19 as the refrigerant flowing through the circuit 10 is employed. That is, the economizer 22 is provided in the high-temperature refrigerant pipe 17 and the suction refrigerant pipe 19. The inlet of the economizer 22 on the high temperature refrigerant pipe 17 side (fourth inlet 22a) is connected to the high temperature refrigerant pipe 17a, and the outlet of the economizer 22 on the high temperature refrigerant pipe 17 side (fourth outlet 22b) is connected to the high temperature refrigerant pipe 17. Is connected to a portion 17b near the expansion mechanism 13. The inlet (third inlet 22c) of the economizer 22 on the suction refrigerant pipe 19 side is connected to a portion 19a of the suction refrigerant pipe 19 near the evaporator 14, and the outlet (third inlet) of the economizer 22 on the side of the suction refrigerant pipe 19 is connected. 22d) is connected to a portion 19b of the suction refrigerant pipe 19 near the compressor 11.

  Even in this case, the integrated heat exchanger 20 in which the radiator 12 and the economizer 22 are integrated can be configured in the same manner as the integrated heat exchanger (see FIGS. 2 to 8) of the above embodiment.

  Specifically, as shown in FIGS. 16, 3, 4, 17, and 6 to 8, the integrated heat exchanger 20 mainly includes a radiator-side heat exchange unit 41 (the radiator 12). The economizer side heat exchanging portion 42 (economizer 22), the casing 43, and the heat insulating portion 44 are provided.

  As in the above embodiment, the radiator-side heat exchange unit 41 (heat radiator 12) includes a first layer 50 in which a plurality of first flow paths 51 through which water flows is formed, and a second flow path 61 through which high-temperature refrigerant flows. And the second layer 60 formed in a plurality of rows are stacked. Here, since the configuration of the radiator-side heat exchange unit 41 is the same as that of the above-described embodiment, the description thereof is omitted here.

  The economizer side heat exchanging unit 42 (economizer 22) includes a third layer 70 in which a plurality of third flow paths 71 through which low-temperature refrigerant flows are formed, and a fourth layer in which a plurality of fourth flow paths 81 through which high-temperature refrigerant flows are formed. The layer 80 is laminated. Here, since the structure of the economizer side heat exchange part 42 is the same as that of the said embodiment, description is abbreviate | omitted here.

  The heat insulating part 44 forms a gap 90 between which the refrigerant and water do not flow between the radiator side heat exchanging part 41 (heat radiator 12) and the economizer side heat exchanging part 42 (economizer 22), as in the above embodiment. ing. Here, since the structure of the heat insulation part 44 is the same as that of the said embodiment, description is abbreviate | omitted here.

  The casing 43 is a member provided with a radiator-side heat exchanging portion 41, an economizer-side heat exchanging portion 42, and a heat insulating portion 44, as in the above embodiment. However, here, as shown in FIGS. 16 and 17, the third inlet 22c communicating with the third inlet header 23c formed in the rear portion of the lower surface portion of the casing 43 is not the injection pipe 21a. An intake refrigerant pipe 19a is connected. In addition, not the injection pipe 21b but the suction refrigerant pipe 19b is connected to the third outlet 22d communicating with the third outlet header 23d formed in the rear portion of the upper surface of the casing 43.

  In the integrated heat exchanger 20 having such a configuration, when the heat pump system 1 is operated, in the radiator 12, water is heated by heat exchange with the high-temperature refrigerant and the high-temperature refrigerant dissipates heat in the radiator 12. In the economizer 22, the low-temperature refrigerant is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant radiates heat. However, the point that the low-temperature refrigerant is not the refrigerant that flows through the injection pipe 21 but the refrigerant that flows through the suction refrigerant pipe 19 is different from the above embodiment.

<C>
Also in the integrated heat exchanger 20 of the modified example B (the economizer 22 that cools the high-temperature refrigerant by the low-temperature refrigerant flowing through the suction refrigerant pipe 19 is integrated with the radiator 12), A part of the refrigerant pipe connecting the heat exchangers 12 and 22 may also be incorporated into the integrated heat exchanger 20.

  Specifically, here, as shown in FIGS. 18, 3, 19, 17, and 11 to 14, a high-temperature refrigerant pipe 17 a that sends the high-temperature refrigerant radiated in the radiator 12 to the economizer 22 is integrated. The heat exchanger 20 is incorporated.

  As in the modification A, the integrated heat exchanger 20 mainly includes a radiator-side heat exchanging portion 41 (radiator 12), an economizer-side heat exchanging portion 42 (economizer 22), a casing 43, and a heat insulating portion. 44 and a communication part 45.

  As in the modification A, the radiator-side heat exchange unit 41 (the radiator 12) includes a first layer 50 in which a plurality of first flow paths 51 through which water flows is formed, and a second flow path through which high-temperature refrigerant flows. The second layer 60 in which 61 is formed in a plurality of rows is laminated. Here, the configuration of the radiator-side heat exchanging portion 41 is the same as that of the modification A, and therefore, the description thereof is omitted here.

  The economizer side heat exchanging unit 42 (economizer 22) includes a third layer 70 in which a plurality of third flow paths 71 through which low-temperature refrigerant flows are formed, and a fourth layer in which a plurality of fourth flow paths 81 through which high-temperature refrigerant flows are formed. The layer 80 is laminated. Here, since the structure of the economizer side heat exchange part 42 is the same as that of the said modification A, description is abbreviate | omitted here.

  The heat insulating part 44 forms a gap 90 between the heat radiator side heat exchanging part 41 (heat radiator 12) and the economizer side heat exchanging part 42 (economizer 22) so as not to flow refrigerant and water in the same manner as in the modified example A. is doing. Here, since the structure of the heat insulation part 44 is the same as that of the said modification A, description is abbreviate | omitted here.

  In the same manner as in Modification A, the communication unit 45 connects the second outlet header 13b of the radiator-side heat exchange unit 41 (heat radiator 12) and the fourth inlet header 23a of the economizer-side heat exchange unit 42 (economizer 22). A flow path 96 for communication is formed. Here, since the structure of the communication part 45 is the same as that of the said modification A, description is abbreviate | omitted here.

  The casing 43 is a member in which the communication part 45 is provided together with the radiator side heat exchange part 41, the economizer side heat exchange part 42, and the heat insulation part 44. A first inlet 12c serving as an inlet for water is formed at a front portion of the lower surface of the casing 43, and communicates with the first inlet header 13c. An inlet water pipe 35 is connected to the first inlet 12c. A first outlet 12d serving as a water outlet is formed in a front portion of the upper surface of the casing 43, and communicates with the first outlet header 13d. An outlet water pipe 33 is connected to the first outlet 12d. A second inlet 12a serving as an inlet for the high-temperature refrigerant is formed in the upper front portion of the left side surface portion of the casing 43, and communicates with the second inlet header 13a. A discharge refrigerant pipe 16 is connected to the second inlet 12a. The second outlet 12b formed in the modification A is not formed in the front lower portion of the left side surface portion of the casing 43. In addition, a third inlet 22c serving as an inlet for the low-temperature refrigerant is formed in the rear portion of the lower surface portion of the casing 43, and communicates with the third inlet header 23c. A suction refrigerant pipe 19a is connected to the third inlet 22c. A rear outlet portion of the upper surface of the casing 43 is formed with a third outlet 22d serving as an outlet for the low-temperature refrigerant, and communicates with the third outlet header 23d. A suction refrigerant pipe 19b is connected to the third outlet 22d. Similar to the modified example A, the fourth inlet 22 a is not formed in the rear upper part of the left side surface portion of the casing 43.

  In the integrated heat exchanger 20 having such a configuration, during the operation of the heat pump system 1, in the radiator 12, water flows from the first inlet 12c to the first inlet header 13c, and from the first inlet header 13c to the second one. Branched to the inlet portion of the first flow path 51, flows in the first flow path 51 from the bottom to the top, and is heated by heat exchange with the high-temperature refrigerant, and from the outlet portion of the first flow path 51 to the first outlet header 13d. And flow out from the first outlet 12d. In the radiator 12, the high-temperature refrigerant flows from the second inlet 12 a into the second inlet header 13 a, branches from the second inlet header 13 a to the inlet portion of the second flow path 61, and passes through the second flow path 61. It flows from the top to the bottom while turning back left and right, dissipates heat by heat exchange with water, and merges at the second outlet header 13b from the outlet portion of the second flow path 61. And all of this high temperature refrigerant | coolant is sent to the notch part 95a of the communication part 45 through the notch parts 91a-93a of the heat insulation part 44 which forms a part of 2nd exit header 13b. The high-temperature refrigerant sent to the communication part 45 flows from the bottom to the top in the flow path 96 and enters the economizer 22 through the notches 95b and 97b of the communication part 45 forming a part of the fourth inlet header 23a. Sent. In the economizer 22, the low-temperature refrigerant flows from the third inlet 22c into the third inlet header 23c, branches from the third inlet header 23c to the inlet portion of the third flow path 71, and passes through the third flow path 71. It flows from the bottom to the top, is heated by heat exchange with the high-temperature refrigerant, merges from the outlet portion of the third flow path 71 at the third outlet header 23d, and flows out from the third outlet 32d. Further, in the economizer 22, the high-temperature refrigerant flows into the fourth inlet header 23a through the notches 95b and 97b of the communication portion 45, and is branched from the fourth inlet header 23a to the inlet portion of the fourth flow path 81. While flowing back and forth in the flow path 81, it flows from the top to the bottom, dissipates heat by heat exchange with the low-temperature refrigerant, and merges from the outlet portion of the fourth flow path 81 at the fourth outlet header 23b and from the fourth outlet 22b. leak.

<D>
In the said embodiment and modification, the case where a microchannel heat exchanger is employ | adopted as an integrated heat exchanger 20 which integrated the heat radiator 12 and the economizer 22 is mentioned as an example, and is demonstrated (FIGS. 2-FIG. 14 and FIGS. 16 to 18). However, the integrated heat exchanger 20 in which the radiator 12 and the economizer 22 are integrated is not limited to the micro-channel heat exchanger. For example, the integrated heat exchanger in which the radiator 12 and the economizer 22 are integrated. A plate heat exchanger may be adopted as the vessel 20.

  Specifically, as shown in FIGS. 20 to 22, the integrated heat exchanger 20 has a plate heat exchanger configuration corresponding to the configurations of the above-described embodiment and Modification B (microchannel heat exchanger). Can be adopted. Here, the integrated heat exchanger 20 mainly includes a plurality of first plate members 110 constituting the radiator 12, a plurality of second plate members 120 constituting the economizer 22, and a plurality of third plate members constituting the casing 43. 130. In addition, here, the integrated heat exchanger 22 further includes a heat insulating portion 44 between the economizer 22 and the radiator 12 (here, in the front-rear direction). The heat insulating portion 44 is configured by a plurality of fourth plate members 140.

  The first plate member 110 is stacked in the front-rear direction so that the first flow path 51 through which water flows and the second flow path 61 through which high-temperature refrigerant flows are alternately formed. The first plate 110 is made of a metal material. The first plate 110 is formed with an uneven shape that becomes the first flow path 51 and the second flow path 61 by press working or the like. In addition, openings 110 c and 110 d are formed in the lower left and upper left of the first plate member 110. The openings 110 c and 110 d communicate with the lower part (water inlet part) and the upper part (water outlet part) of the first flow path 51, respectively, and are spaces communicating with the lower part of the first flow path 51. A first outlet header 13d, which is a space communicating with the upper part of the first inlet header 13c and the first flow path 51, is formed. In addition, openings 110 a and 110 b are formed in the upper right portion and the lower right portion of the first plate member 110. The openings 110 a and 110 b communicate with the upper part (high temperature refrigerant inlet part) and the lower part (high temperature refrigerant outlet part) of the second flow path 61, respectively, and are spaces communicating with the upper part of the second flow path 61. A second outlet header 13b which is a space communicating with the lower part of the two inlet header 13a and the second flow path 61 is formed. And here, after laminating | stacking the 1st board | plate material 110, the heat radiator 12 is obtained by joining between the 1st board | plate materials 110 by the joining process of vacuum brazing, welding, and bolt fastening.

  The second plate member 120 is laminated in the front-rear direction so that the third flow path 71 through which the low-temperature refrigerant flows and the fourth flow path 81 through which the high-temperature refrigerant flows are alternately formed. The 2nd board | plate material 120 is formed with the metal raw material. The second plate 120 is formed with an uneven shape that becomes the third flow path 71 and the fourth flow path 81 by press working or the like. In addition, openings 120 c and 120 d are formed in the lower left and upper left of the second plate member 120. The openings 120c and 120d communicate with the lower part (low temperature refrigerant inlet part) and the upper part (low temperature refrigerant outlet part) of the third flow path 71, respectively, and are spaces communicating with the lower part of the third flow path 71. A third outlet header 23d which is a space communicating with a certain third inlet header 23c and the upper part of the third flow path 71 is formed. In addition, openings 120 a and 120 b are formed in the upper right portion and the lower right portion of the second plate member 120. Each of the openings 120a and 120b communicates with the upper part (high temperature refrigerant inlet part) and the lower part (high temperature refrigerant outlet part) of the fourth flow path 81, and is a space communicating with the upper part of the fourth flow path 81. A fourth outlet header 23b which is a space communicating with the lower part of the fourth inlet header 23a and the fourth flow path 81 is formed. Here, the economizer 22 is obtained by laminating the second plate members 120 and then joining the second plate members 120 by joining processes such as vacuum brazing, welding, and bolt fastening.

  The fourth plate member 140 is laminated in the front-rear direction so as to form a gap 90 between which the refrigerant and water do not flow between the radiator 12 and the economizer 22. The fourth plate member 140 is made of a metal material. And here, after laminating the 4th plate material 140, the heat insulation part 44 is obtained by joining between the 4th plate materials 140 by joining processing of vacuum brazing, welding, and bolt fastening. In addition, since vacuum brazing joins the 4th board | plate material 140 in a vacuum atmosphere, the clearance gap 90 obtained by this is also a vacuum state.

  A first inlet 12c serving as an inlet for water is formed in the lower left part of the third plate member 130 on the radiator 12 side (here, the front side), and communicates with the first inlet header 13c. An inlet water pipe 35 is connected to the first inlet 12c. A first outlet 12d serving as a water outlet is formed in the upper left portion of the third plate member 130 on the radiator 12 side, and communicates with the first outlet header 13d. An outlet water pipe 33 is connected to the first outlet 12d. A second inlet 12a serving as an inlet for high-temperature refrigerant is formed in the upper right portion of the third plate member 130 on the radiator 12 side, and communicates with the second inlet header 13a. A discharge refrigerant pipe 16 is connected to the second inlet 12a. A second outlet 12b serving as an outlet for the high-temperature refrigerant is formed in the lower right portion of the third plate member 130 on the radiator 12 side, and communicates with the second outlet header 13b. A high temperature refrigerant pipe 17a is connected to the second outlet 12b. In addition, a third inlet 22c serving as an inlet for the low-temperature refrigerant is formed in the lower left portion of the third plate member 130 on the economizer 22 side (here, the rear side), and communicates with the third inlet header 23c. . An injection pipe 21b or a suction refrigerant pipe 19a is connected to the third inlet 22c. A third outlet 22d serving as a low-temperature refrigerant outlet is formed in the upper left portion of the third plate member 130 on the economizer 22 side, and communicates with the third outlet header 23d. An injection pipe 21b or a suction refrigerant pipe 19b is connected to the third outlet 22d. A fourth inlet 22a serving as an inlet for the high-temperature refrigerant is formed in the upper right portion of the third plate member 130 on the economizer 22 side, and communicates with the fourth inlet header 23a. A high temperature refrigerant pipe 17a is connected to the fourth inlet 22a. A fourth outlet 22b serving as an outlet for the high-temperature refrigerant is formed in the lower right portion of the third plate member 130 on the economizer 22 side, and communicates with the fourth outlet header 23b. A high temperature refrigerant pipe 17b is connected to the fourth outlet 22b. Here, the 3rd board | plate material 130 which comprises the casing 43 is formed with the metal raw material.

  And here, the 3rd board | plate material 130 of the casing 43 is arrange | positioned so that the heat radiator 12, the economizer 22, and the heat insulation part 44 may be pinched | interposed in the front-back direction, and is joined with the heat radiator 12, the economizer 22, and the heat insulation part 44. . For example, the radiator 12, the economizer 22, the heat insulating portion 44, and the casing 43 are joined by stacking a predetermined number of first to fourth plate members 110 to 140 in a predetermined order, and then joining by vacuum brazing, welding, or bolt fastening. This is performed together with the formation of the radiator 12, the economizer 22, and the heat insulating portion 44.

  Also in the integrated heat exchanger 20 having such a configuration, similarly to the embodiment and the modification B, in the radiator 12, water is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant radiates heat, In the economizer 22, the low-temperature refrigerant is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant radiates heat.

<E>
Also in the above modification D (when the economizer 22 that cools the high-temperature refrigerant by the low-temperature refrigerant flowing through the injection pipe 21 is employed), the modification A (see FIGS. 9, 3, 10, 5, and 11-14) 23, 21 and 24, as shown in FIGS. 23, 21 and 24, the high-temperature refrigerant pipe 17a for sending the high-temperature refrigerant radiated in the radiator 12 to the economizer 22 is integrated with the branch portion to the injection pipe 21a. 20 may be incorporated.

  Here, the fourth flow path 81 a adjacent to the rear side of the heat insulating portion 44 in the fourth flow path 81 constituting the economizer 22 is caused to function as the communication portion 45. Specifically, in order to prevent the space at the lower right of the second plate member 120 forming the fourth flow path 81a from communicating with the fourth outlet header 23b, the opening 120b is not formed, and the heat insulating portion 44 is formed. (Here, the fourth plate member 140) is formed with an opening 141 penetrating in the front-rear direction without communicating with the gap 90, and the fourth flow path 81a adjacent to the rear side of the heat insulating portion 44 is connected to the second outlet header 13b. To communicate with. Thereby, the 4th flow path 81a adjacent to the back side of the heat insulation part 44 among the 4th flow paths 81 which comprise the economizer 22 is the 2nd exit header 13b of the heat radiator 12, and the 4th entrance header 23a of the economizer 22. Is formed (corresponding to the flow path 96 of the modified example A). Accordingly, the fourth inlet 22a formed in Modification D is not formed in the upper right portion of the third plate member 130 on the economizer 22 side (here, the rear side).

  Also in the integrated heat exchanger 20 having such a configuration, as in the modification A, in the radiator 12, water is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant releases heat, and an economizer In 22, the low temperature refrigerant is heated by heat exchange with the high temperature refrigerant and the high temperature refrigerant dissipates heat.

<F>
Also in the above-described modification D (when the economizer 22 that cools the high-temperature refrigerant by the low-temperature refrigerant flowing through the suction refrigerant pipe 19 is employed), modification C (FIGS. 18, 3, 19, 17, and 11 to 14). 25, 21 and 26, the high-temperature refrigerant pipe 17a that sends the high-temperature refrigerant radiated in the radiator 12 to the economizer 22 is integrated with the branch portion to the injection pipe 21a, as shown in FIGS. It may be incorporated in the container 20.

  Here, the fourth flow path 81 a adjacent to the rear side of the heat insulating portion 44 in the fourth flow path 81 constituting the economizer 22 is caused to function as the communication portion 45. Specifically, in order to prevent the space at the lower right of the second plate member 120 forming the fourth flow path 81a from communicating with the fourth outlet header 23b, the opening 120b is not formed, and the heat insulating portion 44 is formed. (Here, the fourth plate member 140) is formed with an opening 141 penetrating in the front-rear direction without communicating with the gap 90, and the fourth flow path 81a adjacent to the rear side of the heat insulating portion 44 is connected to the second outlet header 13b. To communicate with. Thereby, the 4th flow path 81a adjacent to the back side of the heat insulation part 44 among the 4th flow paths 81 which comprise the economizer 22 is the 2nd exit header 13b of the heat radiator 12, and the 4th entrance header 23a of the economizer 22. Is formed (corresponding to the flow path 96 of the modified example A). Accordingly, the second outlet 12b formed in Modification D is not formed in the lower right portion of the third plate member 130 on the radiator 12 side (here, the forward direction side), and the economizer 22 side (here) Then, the 4th entrance 22a formed in the said modification D is not formed in the upper right part of the 3rd board | plate material 130 of a back direction).

  Also in the integrated heat exchanger 20 having such a configuration, similarly to the modification C, in the radiator 12, water is heated by heat exchange with the high-temperature refrigerant, and the high-temperature refrigerant dissipates, and the economizer In 22, the low temperature refrigerant is heated by heat exchange with the high temperature refrigerant and the high temperature refrigerant dissipates heat.

<G>
In the said embodiment and modification, although the heat insulation part 44 is formed of the clearance gap 90 which does not flow a refrigerant | coolant or water, it is not limited to this.

  For example, as shown in FIG. 27, in the configuration of Modification D, a material (here, a metal material) that constitutes a portion (here, the plate materials 110 and 120) through which the refrigerant and the fluid to be heated flow in the gap 90. Alternatively, a ceramic material 90a having a lower thermal conductivity may be provided.

  In addition, as shown in FIG. 28, a ceramic material 90 a may be provided directly between the economizer 22 and the radiator 12 without providing the gap 90 between the economizer 22 and the radiator 12.

  Note that a resin or rubber material may be used as the material 90a having a lower thermal conductivity than the material constituting the portion through which the refrigerant and the fluid to be heated flow. Moreover, the structure which has the heat insulation part 44 with such a raw material with low heat conductivity is not limited only to the structure of the modification D, You may employ | adopt also in other embodiment and modifications.

<H>
In the said embodiment and modification, although water is used as a to-be-heated fluid heated with a refrigerant | coolant in the radiator 12, it is not limited to this, Other fluids, such as a brine, may be used as a to-be-heated fluid. .

<I>
In the said embodiment and modification AC, although the 3rd flow path 71 of the 1st flow path 51 of the heat radiator 12 and the 1st flow path 51 economizer 22 of the heat radiator 12 has a meandering shape, The shape is not limited to the above and may be another shape such as a straight shape.

<J>
In the said embodiment and modification AC, although the 2nd flow path 61 of the heat radiator 12 and the 4th flow path 81 of the economizer 22 have a shape folded in three places right and left, it is not limited to this. Alternatively, there may be two or four folding points, or a shape without any folding points. Further, the second flow path 61 and the fourth flow path 81 may have a meandering shape like the first flow path.

<K>
Arrangement of the entrances 12a to 12d and 22a to 22d of the radiator 12 and the economizer 22 is not limited to the above-described embodiment and the modified example, and is appropriately arranged according to the flow path configuration and the like.

  Although the embodiments of the present disclosure have been described above, it will be understood that various changes in form and details can be made without departing from the spirit and scope of the present disclosure described in the claims. .

  The present disclosure is widely applicable to a heat pump system including a refrigerant circuit having an economizer.

DESCRIPTION OF SYMBOLS 1 Heat pump system 10 Refrigerant circuit 11 Compressor 12 Radiator 13 Expansion mechanism 14 Evaporator 20 Integrated heat exchanger 22 Economizer 32 User side equipment 44 Heat insulation part 90 Crevice

European Patent Application Publication No. 2952832

Claims (7)

A compressor (11) that compresses the refrigerant; a radiator (12) that cools the refrigerant compressed in the compressor by a fluid to be heated; and an expansion mechanism (13) that depressurizes the refrigerant cooled in the radiator. ) And an evaporator (14) for evaporating the refrigerant decompressed in the expansion mechanism, and a refrigerant circuit (10) configured to be connected to each other,
An economizer (22) that is provided in the refrigerant circuit and further cools the refrigerant cooled in the radiator by the refrigerant flowing through the refrigerant circuit;
With
The economizer constitutes an integrated heat exchanger (20) integrated with the radiator.
The integrated heat exchanger has a heat insulating part (44) between the economizer and the radiator.
Heat pump system (1). The heat insulating part is made of a material having a lower thermal conductivity than a material constituting a part through which the refrigerant and the fluid to be heated flow in the integrated heat exchanger.
The heat pump system according to claim 1. The heat insulating portion is configured by a gap (90) that does not flow the refrigerant and the fluid to be heated provided between the radiator and the economizer.
The heat pump system according to claim 1. The gap is in a vacuum state,
The heat pump system according to claim 3. The integrated heat exchanger is formed by vacuum brazing or diffusion bonding,
The heat pump system according to claim 4. The integrated heat exchanger is a microchannel heat exchanger,
The heat pump system according to any one of claims 1 to 5. The heat radiator further includes a use side device (32) for heating the room by the heated fluid heated by heat exchange with the refrigerant.
The heat pump system according to any one of claims 1 to 6.

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