JP2019183072A5 - - Google Patents
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- JP2019183072A5 JP2019183072A5 JP2018078679A JP2018078679A JP2019183072A5 JP 2019183072 A5 JP2019183072 A5 JP 2019183072A5 JP 2018078679 A JP2018078679 A JP 2018078679A JP 2018078679 A JP2018078679 A JP 2018078679A JP 2019183072 A5 JP2019183072 A5 JP 2019183072A5
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- JP
- Japan
- Prior art keywords
- polyamide resin
- resin composition
- composition according
- surface modifier
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004952 Polyamide Substances 0.000 claims description 36
- 229920002647 polyamide Polymers 0.000 claims description 36
- 239000011528 polyamide (building material) Substances 0.000 claims description 36
- 239000011342 resin composition Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000003607 modifier Substances 0.000 claims description 14
- NKNDPYCGAZPOFS-UHFFFAOYSA-M Copper(I) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- OXBLHERUFWYNTN-UHFFFAOYSA-M Copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 4
- QTMDXZNDVAMKGV-UHFFFAOYSA-L Copper(II) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 claims description 4
- 229940045803 cuprous chloride Drugs 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 3
- 229920001225 Polyester resin Polymers 0.000 claims description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- RFKZUAOAYVHBOY-UHFFFAOYSA-M copper(1+);acetate Chemical compound [Cu+].CC([O-])=O RFKZUAOAYVHBOY-UHFFFAOYSA-M 0.000 claims description 2
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 2
- 150000001261 hydroxy acids Chemical class 0.000 claims description 2
- 239000010687 lubricating oil Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 229920002866 paraformaldehyde Polymers 0.000 claims description 2
- 229920000069 poly(p-phenylene sulfide) Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920005672 polyolefin resin Polymers 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000001993 wax Substances 0.000 claims description 2
- 229920003043 Cellulose fiber Polymers 0.000 claims 2
- 239000000835 fiber Substances 0.000 claims 2
- 241000894007 species Species 0.000 claims 1
- 229920002678 cellulose Polymers 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 1
Description
すなわち、本発明は以下の態様を包含する。
［１］ （Ａ）ポリアミド樹脂１００質量部と、（Ｂ）セルロースと、（Ｃ）表面改質剤０．０１〜５質量部とを含む、ポリアミド樹脂組成物。
［２］ ポリアミド樹脂溶解性溶媒に前記ポリアミド樹脂組成物を溶解させたときの、不溶分中の（Ｃ）表面改質剤含有量をＷ’、溶液中の（Ｃ）表面改質剤含有量をＷ”、Ｗ’とＷ”との合計をＷとしたときに、下記関係式（１）：
１≧１０×Ｗ’／Ｗ・・・（１）
を満たす、上記態様１に記載のポリアミド樹脂組成物。
［３］ （Ｃ）表面改質剤を０．０１〜２質量部含む、上記態様１又は２に記載のポリアミド樹脂組成物。
［４］ （Ｃ）表面改質剤の数平均分子量が１００〜２０００である、上記態様１〜３のいずれかに記載のポリアミド樹脂組成物。
［５］ （Ｃ）表面改質剤がポリオレフィン系樹脂、ポリアミド系樹脂、ポリエステル系樹脂、ポリアセタール系樹脂、ポリアクリル系樹脂、ポリフェニレンエーテル系樹脂、ポリフェニレンスルフィド系樹脂及びこれらの変性物からなる群から選ばれる１種以上のオリゴマーである、上記態様１〜４のいずれかに記載のポリアミド樹脂組成物。
［６］ （Ｄ）金属イオン成分を含む、上記態様１〜５のいずれかに記載のポリアミド樹脂組成物。
［７］ （Ｄ）金属イオン成分がヨウ化銅（ＣｕＩ）、臭化第一銅（ＣｕＢｒ）、臭化第二銅（ＣｕＢｒ2）、塩化第一銅（ＣｕＣｌ）、及び酢酸銅からなる群から選ばれる１種以上である、上記態様６に記載のポリアミド樹脂組成物。
［８］ （Ｅ）摺動剤成分を含む、上記態様１〜７のいずれかに記載のポリアミド樹脂組成物。
［９］ （Ｅ）摺動剤成分が、アルコール、アミン、カルボン酸、ヒドロキシ酸、アミド、エステル、ポリオキシアルキレングリコール、シリコーンオイル、ワックス、及び潤滑油からなる群から選ばれる１種以上である、上記態様８に記載のポリアミド樹脂組成物。
［１０］ （Ｅ）摺動剤成分の融点が４０〜１５０℃である、上記態様８又は９に記載のポリアミド樹脂組成物。
［１１］ （Ａ）ポリアミド樹脂の原料モノマーと、（Ｂ）セルロースの水分散液とを混合し、重合反応を行うことにより得られたものである、上記態様１〜１０のいずれかに記載のポリアミド樹脂組成物。
［１２］ 上記態様１〜１１のいずれかに記載のポリアミド樹脂組成物を含む、成形体。
That is, the present invention includes the following aspects.
[1] A polyamide resin composition containing (A) 100 parts by mass of a polyamide resin, (B) cellulose, and (C) 0.01 to 5 parts by mass of a surface modifier.
[2] When the polyamide resin composition is dissolved in a polyamide resin-soluble solvent, the content of the (C) surface modifier in the insoluble component is W', and the content of the (C) surface modifier in the solution is W'. Is W ", and when the sum of W'and W" is W, the following relational expression (1):
1 ≧ 10 × W'/ W ・ ・ ・ (1)
The polyamide resin composition according to the above aspect 1, which satisfies the above conditions.
[3] The polyamide resin composition according to the above aspect 1 or 2, which contains (C) 0.01 to 2 parts by mass of a surface modifier.
[4] The polyamide resin composition according to any one of the above aspects 1 to 3, wherein the surface modifier has a number average molecular weight of 100 to 2000.
[5] (C) The surface modifier consists of a group consisting of a polyolefin resin, a polyamide resin, a polyester resin, a polyacetal resin, a polyacrylic resin, a polyphenylene ether resin, a polyphenylene sulfide resin, and modified products thereof. The polyamide resin composition according to any one of the above aspects 1 to 4, which is one or more selected oligomers.
[6] The polyamide resin composition according to any one of the above aspects 1 to 5, which contains (D) a metal ion component.
[7] (D) A group in which the metal ion component comprises copper iodide (CuI), cuprous bromide (CuBr), cupric bromide (CuBr 2 ), cuprous chloride (CuCl), and copper acetate. The polyamide resin composition according to the above aspect 6, which is one or more selected from the above.
[8] The polyamide resin composition according to any one of the above aspects 1 to 7, which contains (E) a sliding agent component.
[9] (E) The sliding agent component is at least one selected from the group consisting of alcohol, amine, carboxylic acid, hydroxy acid, amide, ester, polyoxyalkylene glycol, silicone oil, wax, and lubricating oil. , The polyamide resin composition according to the above aspect 8.
[10] The polyamide resin composition according to the above aspect 8 or 9, wherein the sliding agent component has a melting point of 40 to 150 ° C.
[11] and a raw material monomer of the polyamide resin (A), is obtained by performing the mixing and polymerization reaction of an aqueous dispersion of (B) cellulose scan, according to any of the above aspects 1 to 10 Polyamide resin composition.
[12] A molded product containing the polyamide resin composition according to any one of the above aspects 1 to 11.
別の好ましい態様において、（Ａ）ポリアミド樹脂の原料モノマーと、（Ｂ）セルロースの水分散液とを混合し、該原料モノマーの重合反応を行う方法で、ポリアミド樹脂組成物を製造してもよい。この態様において、（Ｃ）表面改質剤は、（Ａ）ポリアミド樹脂の原料モノマーの重合時に生じる低分子量成分（すなわちオリゴマー）であってよく、これに代えて又はこれに加えて、重合前、重合中又は重合後に、別途の（Ｃ）表面改質剤を系中に添加してもよい。 In another preferred embodiment, the raw material monomer of the polyamide resin (A), mixing the aqueous dispersion of (B) cellulose scan, in a method of performing a polymerization reaction of the raw material monomer, be prepared polyamide resin composition Good. In this embodiment, the (C) surface modifier may be a low molecular weight component (ie, an oligomer) produced during the polymerization of the raw material monomer of the (A) polyamide resin, and instead of or in addition to this, before the polymerization, A separate (C) surface modifier may be added to the system during or after the polymerization.
Claims (11)
（Ｂ）数平均繊維径が１０００ｎｍ以下のセルロースファイバーと、
（Ｃ）表面改質剤０．０１〜５質量部と、
（Ｄ）金属イオン成分と、
を含む、ポリアミド樹脂組成物。 (A) 100 parts by mass of polyamide resin and
(B) Cellulose fibers having a number average fiber diameter of 1000 nm or less and
(C) 0.01 to 5 parts by mass of surface modifier ,
(D) Metal ion component and
A polyamide resin composition comprising.
１≧１０×Ｗ’／Ｗ・・・（１）
を満たす、請求項１に記載のポリアミド樹脂組成物。 When the polyamide resin composition is dissolved in a polyamide resin-soluble solvent, the (C) surface modifier content in the insoluble component is W', and the (C) surface modifier content in the solution is W'. , W'and W'are W, the following relational expression (1):
1 ≧ 10 × W'/ W ・ ・ ・ (1)
The polyamide resin composition according to claim 1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018078679A JP6889681B2 (en) | 2018-04-16 | 2018-04-16 | Polyamide resin composition |
| JP2021086277A JP7152558B2 (en) | 2018-04-16 | 2021-05-21 | Polyamide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018078679A JP6889681B2 (en) | 2018-04-16 | 2018-04-16 | Polyamide resin composition |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021086277A Division JP7152558B2 (en) | 2018-04-16 | 2021-05-21 | Polyamide resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019183072A JP2019183072A (en) | 2019-10-24 |
| JP2019183072A5 true JP2019183072A5 (en) | 2020-10-22 |
| JP6889681B2 JP6889681B2 (en) | 2021-06-18 |
Family
ID=68339802
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018078679A Active JP6889681B2 (en) | 2018-04-16 | 2018-04-16 | Polyamide resin composition |
| JP2021086277A Active JP7152558B2 (en) | 2018-04-16 | 2021-05-21 | Polyamide resin composition |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021086277A Active JP7152558B2 (en) | 2018-04-16 | 2021-05-21 | Polyamide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP6889681B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021079908A1 (en) * | 2019-10-21 | 2021-04-29 | 旭化成株式会社 | Cellulose resin composition |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH051223A (en) * | 1991-06-27 | 1993-01-08 | Showa Denko Kk | Polyamide resin composition of excellent light resistance |
| JP3399475B2 (en) * | 1993-06-29 | 2003-04-21 | 旭化成株式会社 | Polyamide resin composition |
| JP3585558B2 (en) * | 1995-01-19 | 2004-11-04 | 旭化成ケミカルズ株式会社 | Polyamide resin composition and method for producing the same |
| JP4128801B2 (en) * | 2002-05-22 | 2008-07-30 | オイレス工業株式会社 | Resin composition for sliding member and sliding member |
| EP2358795A1 (en) * | 2008-11-17 | 2011-08-24 | DSM IP Assets B.V. | Surface modification of polymers via surface active and reactive end groups |
| CA2795068C (en) * | 2010-04-06 | 2018-08-21 | Unitika Ltd. | Polyamide resin composition and method for producing polyamide resin composition |
| JP6120590B2 (en) * | 2013-02-01 | 2017-04-26 | 国立大学法人京都大学 | Modified nanocellulose and resin composition containing modified nanocellulose |
| JP6194687B2 (en) * | 2013-08-06 | 2017-09-13 | 宇部興産株式会社 | Composition comprising polyamide resin, copper compound and potassium halide, and molded article comprising the same |
| JP5883469B2 (en) * | 2014-04-28 | 2016-03-15 | 住友電工ファインポリマー株式会社 | Manufacturing method of slidable resin molded product |
| DE102014210214A1 (en) * | 2014-05-28 | 2015-12-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Use of oxyimide-containing copolymers or polymers as flame retardants, stabilizers, rheology modifiers for plastics, initiators for polymerization and grafting processes, crosslinking or coupling agents, and also plastic molding compositions containing such copolymers or polymers |
-
2018
- 2018-04-16 JP JP2018078679A patent/JP6889681B2/en active Active
-
2021
- 2021-05-21 JP JP2021086277A patent/JP7152558B2/en active Active
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