JP2019179809A - Printed circuit board and method of manufacturing printed circuit board - Google Patents

Abstract

To provide a printed circuit board which is improved in quality even if manufacturing cost is reduced.SOLUTION: Disclosed is a printed circuit board which includes: a wire jumper 3; a surface mount electronic component 4; and a copper-clad surface of only one side having a circuit pattern 12. A solder joint with the printed circuit board 1 having solder past 2 formed thereon in order to join the electronic component to the copper-clad surface is configured by using only a reflow soldering method in which joining is performed by melting the solder past 2 put in a reflow soldering furnace and heated. Thereby, the printed circuit board, on which the wire jumper 3 and the surface mount electric component 4 are mixedly mounted, can be improved in quality by reducing manufacturing cost with a cheap material and without soldering correction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printed circuit board in which axial electronic components and surface mount components are mixed, and a method for manufacturing the same.

  Conventionally, as a printed board of this type, a configuration of a method of soldering an electronic component and a board has been proposed in order to improve the efficiency of component mounting work and improve the quality (see, for example, Patent Document 1). ).

  FIG. 5 is a cross-sectional view showing a jumper wire insertion state of a conventional printed circuit board described in Patent Document 1, and FIG. 6 is a cross-sectional view showing a solder joint state of the jumper wire of the same printed circuit board.

  5 and 6, the upper surface of the printed circuit board 54 is a circuit element mounting surface 58, on which various circuit elements (not shown) are mounted.

  The lower surface of the printed circuit board 54 is a pattern surface 59 on which a circuit pattern 55 is printed. Of the circuit pattern 55, the circuit patterns 55a and 55b on both sides need to be electrically connected, and the circuit pattern 55c provided in the middle of the circuit patterns 55 has a relationship of being an independent circuit from the above two patterns.

  Therefore, in order to use the jumper wire 51 as a means for conducting the patterns 55a and 55b on both sides, a pair of mounting holes 54a for mounting the jumper wire 51 are provided. A ball-like solder 53 is fixed in advance at the center of the jumper wire 51.

  The circuit element mounting surface 58 has a pattern 56 to be connected to GND or the like at an intermediate position on a straight line connecting the mounting holes 54a and 54a. A solder resist (not shown) is formed around the pattern 56.

  When the jumper wire 51 is mounted on the printed circuit board 54, the jumper wire 51 taken out from the mounter of the dedicated equipment is bent into a U shape. Next, a pair of leg portions 51a bent in a U-shape are inserted into the mounting holes 54a, and the portions of the leg portions 51a that protrude from the pattern surface 59 are bent inward so that they cannot escape. At this time, the solder 53 comes into contact with the pattern 56 formed on the mounting surface 58.

  When the jumper wire 51 attached to the printed circuit board 54 is heated together with the printed circuit board 54 by an appropriate reflow furnace such as an external wire type, the solder 53 is melted. The central portion of the jumper wire 51 is fixed to a predetermined position on the printed board 54 by the melted solder 63.

  Next, circuit elements (not shown) such as IC chips and capacitors are attached to the mounting surface 58 of the printed circuit board 54, and the opposite pattern surface 59 is passed through a dip tank containing molten solder. Then, as shown in FIG. 6, a portion to be soldered is soldered, such as between the pair of leg portions 51a where the jumper wire 51 is bent and the circuit patterns 55a and 55b.

Japanese Utility Model Publication No. 07-018360

  However, the conventional configuration requires both a reflow solder joining method for joining by heating in a reflow furnace and a flow dip solder joining method for joining through a dip tank containing molten solder. Since soldering correction is always required after joining, there has been a problem that man-hours are increased and manufacturing costs are increased.

  The present invention solves the above-described conventional problems by reducing the manufacturing cost of a circuit in which axial electronic components and surface mount components are mixed by applying a special shape solder printing on a single-sided copper-clad printed circuit board material. The object is to provide a printed circuit board with improved quality.

  In order to solve the conventional problems, a printed circuit board according to the present invention is a printed circuit board having a copper-clad surface on only one side, the axial electronic component and the surface-mounted electronic component disposed on the copper-clad surface, and the axial A pair of leg mounting holes for inserting the legs of the electronic component and a solder portion provided on the copper-clad surface, the solder portion being heated in a reflow soldering furnace, the axial electronic component and the surface mounting The electronic component is configured to be joined to the printed board.

  Accordingly, a printed circuit board on which axial electronic components and surface mount components are mixedly mounted can be provided at a low manufacturing cost and with high quality.

  The printed circuit board of the present invention can reduce the manufacturing cost and improve the quality.

(A)-(d) Schematic process drawing of component mounting of printed circuit board in the embodiment of the present invention Enlarged view of the solder printing shape around the leg insertion part of the axial electronic component of the printed circuit board Top view showing solder printing on the printed circuit board Plan view with components of the printed circuit board mounted Sectional drawing which shows the insertion state of the jumper wire of the conventional printed circuit board Sectional drawing which shows the solder joint state of the jumper wire of the printed circuit board

  1st invention is a printed circuit board which has a copper-clad surface only on one side, and has a copper-clad surface only on one side, Comprising: The axial electronic component and surface mount electronic component which were arrange | positioned on the said copper-clad surface, and said axial electron A pair of leg mounting holes through which the legs of the component are inserted; and a solder part provided on the copper-clad surface, the solder part being heated in a reflow soldering furnace, and the axial electronic component and the surface mount electronic By configuring the parts and the printed circuit board to be joined, the printed circuit board with a mixture of axial electronic components and surface mount parts is made of inexpensive materials, without soldering correction, and reduced in manufacturing costs and quality. Can also be improved.

  According to a second aspect of the invention, in particular, in the first aspect of the invention, the solder portion is formed in a substantially semicircular shape, and the substantially straight portion is provided so as to face the leg attachment hole. As a result, the manufacturing quality can be improved.

A third invention is a component mounting method for mounting an axial electronic component and a surface mount electronic component on a printed circuit board having a copper-clad surface on only one side, and a cream solder printer that prints a substantially semicircular solder portion. Using the first step of applying the solder part to the copper-clad surface, and using a mounting machine that automatically installs the electronic component on a printed circuit board, the legs of the axial electronic component are attached to the copper-clad surface. A second step of inserting into the mounting hole, a third step of installing the surface-mounted electronic component on the copper-clad surface using the mounting machine, and a soldering of the solder portion using a reflow soldering furnace. By a method of manufacturing a printed circuit board, comprising a fourth step of heating and joining the axial electronic component and the surface mount electronic component to the printed circuit board, Do it with no modification, to reduce the manufacturing cost can also be improved quality.

  Hereinafter, embodiments of the invention will be described with reference to the drawings. Further, the present invention is not limited by this embodiment.

(Embodiment 1)
FIGS. 1A to 1D are schematic process diagrams of component mounting of a printed circuit board in the embodiment of the present invention.

  In FIG. 1, the printed circuit board 1 is covered with a copper film only on one side and is single-sided copper-clad. A circuit pattern 12 is formed on the copper-clad surface.

  In the step (a), a solder paste 2 for joining electronic components is printed on the surface of the copper-clad surface.

  In the step (b), the pair of leg portions 10 of the wire jumper 3 which is an axial electronic component is inserted into the leg mounting hole 11 of the printed circuit board 1 from the copper-clad surface side of the surface, and protrudes to the back side of the leg portion 10. Bend each part inward to make it impossible to escape. At this time, both ends of the back surface of the straight portion on the front surface side of the wire jumper 3 are in contact with the solder paste 2.

  In the step (c), a surface mount electronic component 4 such as a resistor or a capacitor is mounted on the solder paste 2 on the surface side of the printed board 1 by a chip mounter.

  Then, in the step (d), the printed board 1 on which the components are mounted is placed in an appropriate reflow soldering furnace such as an infrared type and heated, whereby the printed solder paste 2 becomes the molten solder paste 5. An electronic component such as a wire jumper 3 or a surface mount electronic component 4 which is an axial electronic component and the printed circuit board 1 are joined.

  FIG. 2 is an enlarged view of a solder printing shape around the leg insertion portion of the wire jumper of the printed circuit board in the embodiment of the present invention, FIG. 3 is a plan view showing solder printing of the printed circuit board, and FIG. It is the top view which mounted the component of the board | substrate. In FIG. 3, a circuit pattern 12 to be described later is omitted for easy understanding of the solder printing state.

  2, 3, and 4, the solder paste 2 is printed in a substantially semicircular shape on the inside of the leg 10 around the leg mounting hole 11 through which the leg 10 is inserted, and the leg solder This is part 6.

  Thereby, when it puts in a reflow soldering furnace and it heats, both ends of the linear part of the wire jumper 3 are reliably solder-joined with the printed circuit board 1 with the molten solder paste 5, and a circuit connection will be carried out.

When solder printing is performed around the leg mounting hole 11, a circle is formed so as to surround the leg mounting hole 11.
Alternatively, when solder printing is performed in an elliptical shape, when the leg portion 10 is inserted into the leg mounting hole 11 by the automatic component mounting equipment, the equipment comes into contact with the solder printing portion surrounding the leg mounting hole 11, resulting in a defective shape. There is a fear. By solder printing the substantially semicircular leg solder portion 6 on the inner side of the leg portion 10, the fear is eliminated.

  As described above, in the present embodiment, the wire jumper 3 and the surface-mounted electronic component 4 and the copper-clad surface of only one surface on which the circuit pattern 12 is formed are provided, and the electronic component is bonded to the copper-clad surface. The wire jumper 3 is constructed by performing the solder joint with the printed circuit board 1 on which the solder paste 2 is printed only by the reflow solder joining method in which the solder paste 2 is melted and joined by heating in a reflow soldering furnace. The printed circuit board on which the surface mount electronic component 4 is mixedly mounted can be made of an inexpensive material without soldering correction, and the manufacturing cost can be reduced and the quality can be improved.

  In FIGS. 2 and 3 of the present embodiment, the leg solder portion 6 is shown in a semicircular shape, but it may be a sector shape having a central angle larger than 180 degrees or a crescent shape ( The crescent moon here may be the crescent moon in a broad sense, not the month of the third lunar calendar). When the leg solder portion 6 has a fan shape or a crescent shape, solder printing is performed so that the non-circular portion faces the leg portion mounting hole 11.

  In addition, the solder paste 2 printed on the copper-clad surface has a pair of leg portion mounting holes 11 formed with a substantially semicircular leg portion solder portion 6 and soldered the leg portion 10 of the wire jumper 3 and the printed board 1. Manufacturing quality can be improved by setting it as the structure to perform.

  The printed circuit board according to the present invention uses a single-sided copper-clad printed circuit board material for a circuit in which axial electronic components and surface-mounted components are mixed, and is mounted by using only the reflow soldering method. In addition, since the manufacturing cost can be reduced and the quality can be improved, it can be applied to various appliances.

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Solder paste 3 Wire jumper 4 Surface mount electronic component 5 Molten solder paste 6 Leg solder part (solder part)
10 Leg 11 Leg mounting hole 12 Circuit pattern

Claims (3)

A printed circuit board having a copper-clad surface only on one side, the axial electronic component and the surface-mounted electronic component arranged on the copper-clad surface, and a pair of leg part attachment holes that pass through the leg part of the axial electronic component, A solder portion provided on the copper-clad surface, and the solder portion is heated in a reflow soldering furnace, and is configured to join the axial electronic component and the surface-mounted electronic component to the printed circuit board. Printed board. The printed circuit board according to claim 1, wherein the solder portion is formed in a substantially semicircular shape, and is provided so that a substantially straight portion faces the leg mounting hole. A component mounting method for mounting an axial electronic component and a surface-mounted electronic component on a printed circuit board having a copper-clad surface on only one side, and using the cream solder printer that prints a substantially semicircular solder portion, the solder portion The first step of coating the copper-clad surface and a mounting machine that automatically installs the electronic component on the printed circuit board are used to insert the legs of the axial electronic component into the mounting holes of the copper-clad surface. A second step of using the mounting machine, a third step of installing the surface-mounted electronic component on the copper-clad surface, and heating the solder part using a reflow soldering furnace, And a fourth step of joining the surface mount electronic component to the printed circuit board.

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