JP2019174134A - Temperature sensor - Google Patents

Abstract

To provide a temperature sensor capable of further improving responsiveness by enhancing a heat collection effect from a measurement object.SOLUTION: A temperature sensor includes: a heat sensitive element part 2; and a crimping terminal 3 having a screw mounting part capable of being fixed to a measurement object S on the tip side and also having an element mounting part, on which the heat sensitive element part is mounted, on the rear end side. The heat sensitive element part includes: an insulating film 5 adhered onto the crimping terminal with an adhesive 4; a thermistor element 6 provided on the surface of the insulating film; and a pair of onboard wiring lines which are formed on the surface of the insulating film and whose one ends are connected to the thermistor element and other ends are connected to a pair of external wiring lines. On the rear surface of the insulating film, a heat collection part 9 is provided, which is formed by a material having higher thermal conductivity than the insulating film.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a temperature sensor that can be easily attached to a measurement object.

Conventionally, as a temperature sensor, a lead wire is attached to a chip-like or flake-like thermistor element, the thermistor element is resin-molded together with the lead wire connecting portion, and this portion is attached to a crimp terminal by crimping or bonding. (For example, see Patent Documents 1 and 2).
In this temperature sensor, an annular part that can be screwed to the crimp terminal is provided, so that the screw can be screwed into this part and screwed into the female thread part of the object to be measured. The sensor can be easily screwed to the measurement object.

In the temperature sensor described in Patent Document 1, the periphery of the thermistor element sealed with glass is further covered with a sealing resin. In the structure in which the glass-sealed thermistor element is sealed with a resin, the position of the element is not stable in manufacturing, and there is a disadvantage that the responsiveness varies.
On the other hand, in the temperature sensor described in Patent Document 2, the heat-sensitive element portion is connected to the insulating film attached to the crimp terminal, the thin film thermistor portion formed on the insulating film, and the thin film thermistor portion. And a pattern electrode formed on the film. That is, this temperature sensor can receive higher heat responsiveness stably by directly receiving the heat from the crimp terminal with the insulating film without passing through the glass or the sealing resin.

JP 2012-141164 A Japanese Patent Application Laid-Open No. 2006-161434

The following problems remain in the conventional technology.
That is, in the conventional structure in which the thermistor element is provided on the insulating film and mounted on the crimp terminal, there has been a demand for more efficiently collecting heat from the measurement object and improving the response.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a temperature sensor that can enhance the heat collection effect from the measurement object and further improve the responsiveness.

  The present invention employs the following configuration in order to solve the above problems. That is, the temperature sensor according to the first aspect of the present invention has a heat sensitive element part and an element attaching part to which the heat sensitive element part can be attached to the rear end side and a screw attaching part that can be fixed to the measurement object. An insulating film in which the thermosensitive element portion is bonded to the element mounting portion with an adhesive, a thermistor element provided on the surface of the insulating film, and a surface of the insulating film. One end of which is connected to the thermistor element and the other end of which is connected to a pair of external wirings, and the back surface of the insulating film is more thermally conductive than the insulating film. A heat collecting portion formed of a material having a high rate is provided.

  In this temperature sensor, a heat collecting part formed of a material having a higher thermal conductivity than that of the insulating film is provided on the back surface of the insulating film, so that a high heat conductivity is collected from the crimp terminal to the insulating film. Responsiveness can be improved because heat is quickly transmitted through the heat section.

The temperature sensor according to a second aspect of the present invention is characterized in that, in the first aspect, the heat collecting part is provided on substantially the entire back surface of the insulating film.
That is, in this temperature sensor, since the heat collecting part is provided on substantially the entire back surface of the insulating film, heat can be collected on almost the entire back surface of the insulating film, and the overall response is higher. Obtainable.

A temperature sensor according to a third invention is the heat collection film according to the first or second invention, wherein the heat collection part is formed on the inner side with a gap from the outer peripheral edge of the back surface of the insulating film. A stepped portion is formed between the outer peripheral edge of the heat collecting portion and the back surface of the insulating film, and the thickness of the adhesive between the crimp terminal and the insulating film in the stepped portion is the heat collecting portion. It is characterized by being thicker than the adhesive immediately below.
That is, in this temperature sensor, since the thickness of the adhesive between the crimp terminal and the insulating film in the step portion is thicker than the adhesive immediately below the heat collecting portion, the adhesive immediately below the heat collecting portion is a thin adhesive. As a result, the thermal conductivity is improved, and high adhesiveness can be ensured by the thick adhesive at the step portion of the outer peripheral portion of the insulating film. Therefore, it is possible to achieve both a high heat collecting effect and adhesiveness.

The present invention has the following effects.
That is, according to the temperature sensor according to the present invention, since the heat collecting part formed of a material having a higher thermal conductivity than the insulating film is provided on the back surface of the insulating film, the insulating film is insulated from the crimp terminal. Responsiveness can be improved by quickly transferring heat to the film through the heat collecting portion having high thermal conductivity.
Therefore, the temperature sensor of the present invention can have high responsiveness in an apparatus or the like that needs to be attached to a measurement object.

It is an expanded sectional view of the important section showing one embodiment of the temperature sensor concerning the present invention. In this embodiment, it is a top view which shows a temperature sensor. It is the sectional view on the AA line of FIG. In this embodiment, it is the top view (a) and back view (b) which show an insulating film. FIG. 3 is a sectional view taken along line B-B in FIG. 2.

  Hereinafter, an embodiment of a temperature sensor according to the present invention will be described with reference to FIGS. In each drawing used for the following description, the scale is appropriately changed in order to make each member recognizable or easily recognizable.

As shown in FIGS. 1 to 3, the temperature sensor 1 of the present embodiment has a thermal element portion 2 and a screw attachment portion 3 </ b> A that can be fixed to the measurement object S on the front end side and a thermal element portion on the rear end side. And a crimp terminal 3 having an element attachment portion 3B to which 2 is attached.
The heat-sensitive element portion 2 is formed on the surface of the insulating film 5, the insulating film 5 bonded to the element mounting portion 3 </ b> B with the adhesive 4, the thermistor element 6 provided on the surface of the insulating film 5, and the insulating film 5. And a pair of on-substrate wirings 8 having one end connected to the thermistor element 6 and the other end connected to a pair of external wirings 7.

On the back surface of the insulating film 5, a heat collecting portion 9 formed of a material having a higher thermal conductivity than the insulating film 5 is provided.
The heat collecting portion 9 is provided on substantially the entire back surface of the insulating film 5. That is, the heat collecting portion 9 is patterned in a rectangular shape slightly smaller than the back surface of the rectangular insulating film 5.

As shown in FIG. 4, the heat collecting portion 9 is a heat collecting film formed inside with a gap from the outer peripheral edge of the back surface of the insulating film 5, and as shown in FIG. A step portion 9 a is formed by the outer peripheral edge of 9 and the back surface of the insulating film 5.
The thickness D2 of the adhesive 4 between the crimp terminal 3 and the insulating film 5 in the stepped portion 9a is thicker than the thickness D1 of the adhesive 4 immediately below the heat collecting portion 9.

Further, the temperature sensor 1 of the present embodiment includes a sealing resin portion 10 that covers the connecting portion of the external wiring 7 together with the thermistor element 6 on the insulating film 5.
The element mounting portion 3B includes a bottom surface portion 3c to which the insulating film 5 is bonded, a pair of wall surface portions 3d erected on both sides of the bottom surface portion 3c, and a bottom surface portion 3c on the tip side of the pair of wall surface portions 3d. And a front surface portion 3e.
That is, a U-shaped region in plan view formed by the pair of wall surface portions 3d and the front surface portion 3e on the bottom surface portion 3c is an installation region for the heat sensitive element portion 2 that surrounds the heat sensitive element portion 2 from three directions.

The sealing resin portion 10 is made of, for example, epoxy resin, and the tip of the thermistor element 6, the insulating film 5, and the external wiring 7 is formed in a portion surrounded by the pair of wall surfaces 3 d and the front surface portion 3 e on the bottom surface portion 3 c. It covers and fills the part.
The insulating film 5 is bonded onto the bottom surface portion 3c with an adhesive 4 containing a metal filler, for example.
The insulating film 5 is formed of, for example, a polyimide resin sheet having a thickness of 7.5 to 125 μm.

A pair of element mounting portions 8b are formed at the tips of the pair of substrate wirings 8, and both end electrode portions of the thermistor element 6 are connected to the pair of element mounting portions 8b.
The pair of on-substrate wirings 8 and the heat collecting portion 9 are patterned with a metal film such as a Cu film, for example.
As the thermistor element 6, for example, a chip-like or flake-like thermistor element can be employed.

The pair of external wirings 7 are joined and connected to a pad portion 8 a at the other end of the pair of substrate wirings 8 by a solder material or the like. In addition, you may join the external wiring 7 and the board | substrate wiring 8 with welding or a conductive adhesive. A lead frame may be adopted as the external wiring 7.
The screw attachment portion 3A has a screw attachment hole 3a on the tip side. In the drawing, no screw is attached to the screw attachment portion 3A.

  Thus, in the temperature sensor 1 of this embodiment, since the heat collecting part 9 formed of a material having a higher thermal conductivity than the insulating film 5 is provided on the back surface of the insulating film 5, the crimp terminal 3. Responsiveness can be improved because heat is quickly transmitted from the heat collecting portion 9 having high thermal conductivity to the insulating film 5.

Moreover, since the heat collection part 9 is provided in the substantially whole surface of the back surface of the insulating film 5, it can heat-collect on the substantially whole surface of the back surface of the insulating film 5, and obtain a higher response as a whole. Can do.
Further, since the thickness D2 of the adhesive 4 between the crimp terminal 3 and the insulating film 5 in the stepped portion 9a is thicker than the thickness D1 of the adhesive immediately below the heat collecting portion 9, the heat collecting portion 9 The thin adhesive 4 immediately below improves the thermal conductivity, and the thick adhesive 4 can ensure high adhesion at the step portion 9a in the outer peripheral portion of the insulating film 5. Therefore, it is possible to achieve both a high heat collecting effect and adhesiveness.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, a so-called round terminal crimp terminal is employed, but a screw mounting portion having another shape such as a Y terminal may be used as long as the screw mounting portion can be screwed.
Moreover, although the thermistor element employs a chip-like or flake-like thermistor element, a thin film thermistor or the like may be adopted as the thermistor element.

  DESCRIPTION OF SYMBOLS 1 ... Temperature sensor, 2 ... Thermal sensitive element part, 3 ... Crimp terminal, 3A ... Screw attachment part, 3B ... Element attachment part, 4 ... Adhesive, 5 ... Insulating film, 6 ... Thermistor element, 7 ... External wiring, 8 ... Wiring on substrate, 9 ... Heat collecting part, 9a ... Step part, S ... Measurement object

Claims (3)

A thermal element part;
A crimping terminal having an element attachment part to which the thermosensitive element part is attached to the rear end side and a screw attachment part that can be fixed to the measurement object;
The heat-sensitive element part is formed on the surface of the insulating film, the insulating film adhered on the element mounting part with an adhesive, the thermistor element provided on the surface of the insulating film, and one end of the heat-sensitive element part A pair of on-substrate wirings connected to the thermistor element and the other end connected to a pair of external wirings;
A temperature sensor, wherein a heat collecting part formed of a material having a higher thermal conductivity than the insulating film is provided on the back surface of the insulating film. The temperature sensor according to claim 1,
The temperature sensor, wherein the heat collecting part is provided on substantially the entire back surface of the insulating film. The temperature sensor according to claim 1 or 2,
The heat collecting part is a heat collecting film formed on the inner side with a gap from the outer peripheral edge of the back surface of the insulating film;
A step portion is formed between the outer peripheral edge of the heat collecting portion and the back surface of the insulating film,
The temperature sensor, wherein a thickness of the adhesive between the crimp terminal and the insulating film in the stepped portion is thicker than the adhesive immediately below the heat collecting portion.

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