JP2019166541A - Method of determining state of iron tip - Google Patents

Abstract

To provide a method of determining a state of an iron tip that is capable of always accurately determining the state of an iron tip.SOLUTION: A soldering device comprises an iron tip having a solder hole to which a solder piece is supplied and heating and melting the solder piece in the solder hole, a gas supply source for supplying gas, and a gas supply unit which connects between the gas supply source and the solder hole in communication and supplies the gas from the gas supply source to the solder hole, where the solder hole is provided with a melting area where the solder piece is melt, and the iron tip is formed with a release hole connecting between the solder hole and the outside in communication upstream of the melting area of the solder hole. A flow rate of the gas flowing within the solder hole is constant, and a pressure of the gas flowing within the solder hole is measured, and a state of the iron tip is determined by comparing the measured pressure and a pre-defined reference value or a table.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a tip state determination method for determining a tip state provided in a soldering apparatus for soldering components.

  In recent years, many electronic devices are equipped with electronic circuits on which electronic components are mounted. In the electronic circuit, a terminal or wire of the electronic component is inserted into a through hole (through hole) formed in the wiring board, and a tip portion thereof is soldered to a wiring pattern (land) formed around the through hole. Thus, mounting and fixing of electronic components and wires to the wiring board are performed (see Patent Document 1).

  For example, in the invention of Patent Document 1, air is blown onto a solder joint portion, the pressure of the air is measured, and the joining state of the solder joint portion is confirmed based on the measured value. Further, in the invention of Patent Document 2, it is determined whether or not the soldering is completed based on whether or not air passes through the through hole after soldering.

Japanese Patent Laid-Open No. 10-62408 JP 2004-95989 A

  However, in the inventions of Patent Documents 1 and 2, a soldering failure can be detected, but the state of solder during the soldering process cannot be detected.

  Accordingly, an object of the present invention is to provide a tip state determination method and a soldering apparatus that can always accurately determine the state of the tip.

  To achieve the above object, the present invention has a solder hole to which a solder piece is supplied and a tip for heating and melting the solder piece in the solder hole, a gas supply source for supplying gas, and the gas supply source, A gas supply unit that communicates with the solder hole and supplies gas from the gas supply source to the solder hole, and the solder hole is provided with a melting region in which the solder piece is melted; A tip state determination method for determining a tip state of a soldering apparatus in which a release hole that communicates the solder hole and the outside is formed on the tip side upstream of the melting region of the solder hole. The flow rate of the gas flowing through the solder hole is constant, the pressure of the gas flowing through the solder hole is measured, and the tip of the tip is compared with the measured pressure and a reference value or table provided in advance. The state is determined.

  The state of each process of soldering is determined by measuring the gas flow rate with such a configuration.

  In the above configuration, the pressure of the gas in the solder hole is measured via a pressure measurement hole formed on the upstream side of the solder hole at the upstream side of the melting region of the solder hole and communicating the solder hole with the outside. In addition, a gas having a pressure higher than the pressure in the solder hole may be supplied to the pressure measurement hole.

  In the above configuration, the table can include at least one of the physical quantity itself or a table indicating a time-series change of the physical quantity.

  In the above configuration, based on an increase in the pressure of the gas flowing through the solder hole, contact of the tip with the object to be soldered, insertion of the solder piece into the solder hole, and the solder hole of the solder piece It may also be determined that at least one of the melting at is performed.

  In the above configuration, when a gas release portion that communicates the solder hole with the outside is provided downstream of the melting region of the solder hole, and when it is detected that the pressure of the gas flowing through the solder hole has decreased after increasing The outflow of the solder piece melted into the solder hole may be determined.

  In the above configuration, each time the soldering is performed a predetermined number of times, the physical amount of the tip may be stored, and the state of the tip may be determined by comparing with the current physical amount.

  In the above configuration, the state determination unit may determine at least one of a shape and a size of the solder piece based on the physical quantity after the solder piece is put into the solder hole.

  To achieve the above object, the present invention has a solder hole to which a solder piece is supplied and a tip for heating and melting the solder piece in the solder hole, a gas supply source for supplying gas, and the gas supply source, Measured by the measurement unit, a gas supply unit that communicates with the solder hole and supplies gas from the gas supply source to the solder hole, a measurement unit that measures the pressure of the gas flowing in the solder hole, A state determination unit for determining a state of the tip based on the pressure of the gas, a melting region in which the solder piece is melted is provided in the solder hole, and the solder tip includes the solder A soldering device in which a release hole that communicates the solder hole and the outside is formed on the upstream side of the melting region of the hole, wherein the state determination unit is the method according to any one of the above, The state is determined.

  According to the tip state determination method and the soldering apparatus according to the present invention, the state of the tip is determined based on the pressure of the gas in the solder hole when performing soldering, and the tip of the tip is immediately processed during the soldering process. The state can be determined. Further, it is possible to always accurately determine the state inside the solder hole which cannot be observed from the outside.

It is a perspective view of an example of the soldering apparatus concerning the present invention. It is sectional drawing cut | disconnected by the II-II line | wire of the soldering apparatus shown in FIG. FIG. 2 is an exploded perspective view of a part of a drive mechanism provided in the soldering apparatus shown in FIG. 1. It is a figure which shows the tip in a reference | standard state. It is a figure which shows the tip in a tip contact state. It is a figure which shows the tip in a solder piece insertion state. It is a figure which shows the tip in a solder piece molten state. It is a figure which shows the tip in the solder piece outflow state. It is a figure which shows the heel in a heel tip separation state. It is a figure which shows the change of the pressure of piping when a soldering apparatus performs soldering once. It is a figure which shows the other example of the soldering apparatus which concerns on this invention. It is a state figure in the case of determining the soldering state of the land Ld of the wiring board Bd and the terminal Nd of the electronic component Ep. It is sectional drawing which shows an example of the tip used for the modification of the soldering apparatus which concerns on this embodiment. It is a figure which shows the other example of the soldering apparatus which concerns on this invention. It is a figure which shows the flow of the tip and nitrogen gas in a tip contact state. It is a figure which shows the flow of the tip and nitrogen gas in a solder piece insertion state. It is a figure which shows the tip and the flow of nitrogen gas in a solder piece molten state. It is a figure which shows the flow of the tip and nitrogen gas in the solder piece outflow state. It is a figure which shows the change of the pressure of piping when a soldering apparatus performs soldering once. It is a figure which shows the other example of the soldering apparatus which concerns on this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view of an example of a soldering apparatus according to the present invention. 2 is a cross-sectional view taken along the line II-II of the soldering apparatus shown in FIG. FIG. 3 is an exploded perspective view of a part of the drive mechanism provided in the soldering apparatus shown in FIG. In FIG. 1, a part of the housing and the support unit 1 is cut to display the inside of the soldering apparatus.

  As shown in FIG. 1, the soldering apparatus A supplies the wire solder W from above, and uses the rivet 5 provided at the lower part to provide a wiring board Bd disposed below the rivet 5 and an electronic component. This is a device for soldering Ep. As shown in FIGS. 1 and 2, the soldering apparatus A includes a support unit 1, a cutter unit 2, a drive mechanism 3, a heater unit 4, a tip 5, a solder feed mechanism 6, and a gas supply unit 7a.

  The support portion 1 includes a flat plate-like wall body 11 that is erected. In the following description, for the sake of convenience, as shown in FIG. 1, the horizontal direction along the wall body 11 is the X direction, the horizontal direction perpendicular to the wall body 11 is the Y direction, and the vertical direction along the wall body 11 is the Z direction. To do. For example, as shown in FIG. 1, the wall 11 has a ZX plane.

  The soldering apparatus A supplies and fixes the molten solder to the wiring board Bd attached to the jig Gj and the terminal Nd of the electronic component Ep arranged on the wiring board Bd. When soldering, the jig Gj is moved in the X direction and the Y direction to position the wiring board Bd with the land Ld. Further, the soldering apparatus A is movable in the Z direction, and the tip of the hook 5 can be brought into contact with the land Ld by moving in the Z direction after positioning.

  The support part 1 includes a wall body 11, a holding part 12, a sliding guide 13, and a heater unit fixing part 14. The wall body 11 is a flat wall body erected in the vertical direction. The wall body 11 serves as a support member for the soldering apparatus A. The holding portion 12 is fixed at a position shifted upward from the lower end portion in the Z direction of the wall body 11. The holding unit 12 holds an air cylinder 31 described later of the drive mechanism 3. The heater unit fixing portion 14 is a member that fixes the heater unit 4, and is provided at an end portion (lower end portion) of the wall body 11 in the Z direction.

  The sliding guide 13 is fixed near the lower end of the wall 11 in the Z direction. The sliding guide 13 is fixed to the wall 11 together with a cutter lower blade 22 described later of the cutter unit 2, and guides a cutter upper blade 21 described later of the cutter unit 2 so as to be slidable in the X direction.

  The sliding guide 13 is a member that makes a pair in the Y direction. The sliding guide 13 has a pair of wall portions 131 and a retaining portion 132. The wall 131 is a flat plate member extending in the X direction. One wall portion 131 is arranged in contact with the wall body 11, and the surface on the side opposite to the wall body 11 is in contact with the cutter lower end 22. Further, the other wall 131 is in contact with the side surface of the cutter lower blade 22. That is, the pair of wall portions 131 sandwich the cutter lower blade 22 from both sides in the Y direction. And a pair of wall part 131 and the cutter lower blade 22 are fastened together with the wall body 11 with fasteners, such as a screw, and are fixed.

  The retaining portion 132 is provided on each of the pair of wall portions 131. The pair of wall portions 131 extends in the Z direction from the upper surface of the cutter lower blade 22 in the Z direction, and extends from the upper end portions in the Z direction of the pair of wall portions 131 toward the other. That is, the sliding guide 13 includes a pair of retaining portions 132. And the front-end | tip of the Y direction of each of a pair of retaining part 132 does not contact, in other words, the sliding guide 13 has an opening in the upper part. The cutter upper blade 21 is at least partially disposed between the upper surface of the cutter lower blade 22 and the retaining portion 132. Thereby, the cutter upper blade 21 is guided in the X direction and is prevented from coming off in the Z direction.

  The cutter unit 2 is a cutting tool that cuts the thread solder W fed by the solder feeding mechanism 6 into solder pieces Wh having a predetermined length. The cutter unit 2 includes a cutter upper blade 21, a cutter lower blade 22, and a pusher pin 23.

  As described above, the cutter lower blade 22 is fixed to the wall body 11 together with the sliding guide 13. As shown in FIG. 2, the cutter lower blade 22 includes a lower blade hole 221 and a gas inflow hole 222. The lower blade hole 221 is a through-hole penetrating the cutter lower blade 22 in the Z direction, and thread solder W penetrating an upper blade hole 211 described later of the cutter upper blade 21 is inserted therein. The edge part of the upper end of the lower blade hole 221 is formed in a cutting blade shape. Using the upper blade hole 211 and the lower blade hole 221, the thread solder W is cut into solder pieces Wh having a predetermined length. The cut solder piece Wh is pushed down by its own weight or by the pusher pin 23 and falls down in the lower blade hole 221. The lower blade hole 221 communicates with a solder hole 51 (described later) of the flange 5 via a solder supply hole 422 (described later) of the heater unit 4. The solder piece Wh dropped inside the lower blade hole 221 reaches the solder supply hole 422 and then falls into the solder hole 51.

  The gas inflow hole 222 is a hole that communicates the outer surface of the cutter lower blade 22 and the lower blade hole 221. Further, a gas supply unit 7 a for supplying gas is connected to the outside of the gas inflow hole 222. That is, the gas supplied from the gas supply unit 7 a flows into the gas inflow hole 222. Then, the gas passes through the lower blade hole 221 and the solder supply hole 422 and reaches the solder hole 51. The gas is used to suppress solder oxidation when the solder is heated and melted. That is, it is a gas for suppressing contact between molten solder and oxygen. Examples of the gas include nitrogen gas, argon gas, helium gas, carbon dioxide, and the like. In the soldering apparatus A of this embodiment, it demonstrates as what supplies nitrogen gas.

  As described above, the cutter upper blade 21 is disposed on the upper surface of the cutter lower blade 22 in the Z direction. The cutter upper blade 21 is guided by the sliding guide 13 so that the sliding direction becomes the X direction when sliding, and is prevented from coming off in the Z direction. That is, the cutter upper blade 21 slides in the X direction on the upper surface of the cutter lower blade 22 in the Z direction. The cutter upper blade 21 is slid by the drive mechanism 3.

  The cutter upper blade 21 includes an upper blade hole 211 and a pin hole 212. The upper blade hole 211 is a through-hole penetrating the cutter upper blade 21 in the Z direction, and the thread solder W sent from the solder feeding mechanism 6 is inserted into the upper blade hole 211. The lower edge of the upper blade hole 211 is formed in a cutting edge shape. The pin hole 212 is a through hole that penetrates the cutter upper blade 21 in the Z direction. A rod portion 231 described later of the pusher pin 23 is slidably inserted into the pin hole 212.

  The pusher pin 23 includes a rod portion 231, a head portion 232, and a spring 233. The rod portion 231 is a columnar member and is slidably inserted into the pin hole 212. Further, the pusher pin 23 moves downward in the Z direction, so that the tip of the rod portion 23 protrudes from the pin hole 212. The head part 232 is connected to the upper end of the rod part 231 in the axial direction. The head portion 232 has a disk shape having an outer diameter larger than the inner diameter of the pin hole 212. The head portion 232 is not inserted into the pin hole 212. That is, the head portion 232 serves as a so-called stopper that restricts the movement of the rod portion 231 into the pin hole 212.

  The spring 233 is a compression coil spring that surrounds the radially outer side of the rod portion 231. The spring 233 has a lower end in the Z direction in contact with the upper surface of the cutter upper blade 21 and an upper end in the Z direction in contact with the lower surface of the head portion 232. That is, the spring 233 receives a reaction force from the upper surface of the cutter upper blade 21 and pushes the head portion 232 in the Z direction. Accordingly, the rod portion 231 connected to the head portion 232 is lifted upward in the Z direction, and the lower end of the rod portion 231 is maintained so as not to protrude from the lower end of the pin hole 212. Note that a stopper (not shown) that prevents the pin hole 212 from coming off is provided at the lower end of the rod portion 231 in the Z direction.

  The pusher pin 23 pushes the solder piece Wh cut by the cutter upper blade 21 and the cutter lower blade 22 and remaining in the lower blade hole 221 downward. The pusher pin 23 is always pushed upward by the elastic force of the spring 233, that is, on the side opposite to the cutter lower blade 22. That is, the rod portion 231 protrudes downward from the lower end portion in the Z direction of the pin hole 212 when the head portion 232 is pushed. Then, the head portion 232 is pushed by a cam member 33 described later of the drive mechanism 3.

  In the cutter upper blade 21, the upper blade hole 211 and the pin hole 212 are provided side by side in the X direction. The cutter upper blade 21 slides in the X direction to move to a position where the upper blade hole 211 and the lower blade hole 221 overlap vertically or a position where the pin hole 212 and the lower blade hole 221 overlap vertically. . When the cutter upper blade 21 slides to one sliding end, the upper blade hole 211 and the lower blade hole 221 overlap, and when the cutter upper blade 21 slides to the other sliding end, You may slide so that the blade hole 221 may overlap.

  When the thread solder W is sent from the solder feeding mechanism 6 in a state where the upper blade hole 211 and the lower blade hole 221 overlap with each other in the Z direction, the thread solder W that has passed through the upper blade hole 211 is transferred to the lower blade hole. 221 is inserted. As described above, the lower edge portion of the upper blade hole 211 is formed in a cutting edge shape, and the upper edge portion of the lower blade hole 221 is also formed in a cutting blade shape. The lower surface of the cutter upper blade 21 is in contact with the upper surface of the cutter lower blade 22. Therefore, when the thread solder W is inserted into the lower blade hole 221, the cutter upper blade 21 slides in the X direction, so that the thread solder W is cut by the upper blade hole 211 and the lower blade hole 221. Disconnected.

  The cutter upper blade 21 is slid in the X direction by the cam member 33. Therefore, the cutter upper blade 21 and the pusher pin 23 are synchronized with the cam member 33. The cam member 33 pushes the head portion 232 when the pin hole 212 overlaps the lower blade hole 221 in the Z direction. Therefore, when the cutter upper blade 21 slides in the X direction, the tip of the rod portion 231 of the pusher pin 23 is accommodated in the pin hole 212. Therefore, when the cutter upper blade 21 slides in the X direction, contact between the tip of the rod portion 231 and the upper surface of the cutter lower blade 22 is suppressed, and the tip of the rod portion 231 and / or the cutter lower blade 22 is suppressed. Deformation, breakage, etc. are suppressed.

  As the cutter upper blade 21 slides in the X direction, the lower blade hole 211 and the pin hole 212 overlap in the Z direction. The head portion 232 is pushed by the cam member 33 in a state where the pin hole 212 overlaps the lower blade hole 211. As a result, the pusher pin 23 moves downward in the Z direction. When the pusher pin 23 protrudes downward in the Z direction from the pin hole 212, a part of the pusher pin 23 is inserted into the lower blade hole 211. When a solder piece (described later) obtained by cutting the thread solder remains at the entrance of the lower blade hole 211, the tip of the pusher pin 23 pushes the solder piece, and the solder piece falls.

  As shown in FIGS. 1 and 2, the drive mechanism 3 includes an air cylinder 31, a piston rod 32, a cam member 33, a slider portion 34, and a guide shaft 35. The air cylinder 31 is held by the holding unit 12. The air cylinder 31 has a bottomed cylindrical shape. A piston rod 32 is housed inside the air cylinder 31 and is slidably driven (expanded / contracted) by the pressure of air supplied from the outside. The air cylinder 31 and the piston rod 32 constitute an actuator of the drive mechanism 3. The piston rod 32 is disposed inside the air cylinder 31, and a part of the piston rod 32 always protrudes from one end of the air cylinder 31 in the axial direction (here, the lower end in the Z direction). The air cylinder 31 is held by the holding unit 12 so that the surface from which the piston rod 32 protrudes faces the cutter unit 2, that is, faces downward in the Z direction.

  The piston rod 32 passes through a through hole (not shown) provided in the holding unit 12. The piston rod 32 is provided in parallel with the guide shaft 35 and reciprocates linearly along the guide shaft 35. The distal end portion of the piston rod 32 is fixed to the cam member 33, and the cam member 33 slides in the Z direction by the expansion and contraction of the piston rod 32. The sliding of the cam member 33 is guided by the guide shaft 35.

  As shown in FIG. 2, the guide shaft 35 has a lower end fitted in a recessed hole provided in the cutter lower blade 22, and is fixed to the cutter lower blade 22 with a screw 351. Further, the upper portion of the guide shaft 35 passes through a hole provided in the holding portion 12, and movement is restricted by the pin 352. In other words, the guide shaft 35 is fixed to the cutter lower blade 22 by the screw 351 and the holding portion 12 by the pin 352.

  In this embodiment, the guide shaft 35 is fixed by the screw 351 and the pin 352. However, the guide shaft 35 is not limited to this, and is fixed by a fixing method such as press fitting or welding. Also good. In the present embodiment, the guide shaft 35 is a cylindrical member, but is not limited thereto, and a polygonal cross section, an ellipse, or the like may be used.

  As shown in FIGS. 2 and 3, the cam member 33 is a rectangular member, and is connected to the recess 330 having a part of the long side cut out in a rectangular shape and the cam member 33, and the guide shaft 35 passes therethrough. And a cylindrical support portion 331 having a through-hole. The slider part 34 is slidably disposed in the recess 330 (in the X direction and the Z direction). Further, the support portion 331 has a shape extending in parallel with the guide shaft 35 and is provided in order to suppress rattling of the cam member 33. That is, when the cam member 33 has a certain thickness and is unlikely to generate rattling, the cylindrical portion may be omitted, and the support portion 331 may be configured only by the through hole.

  The cam member 33 is provided at an intermediate portion of the recess 330 and has a cylindrical pin 332 whose central axis is orthogonal to the guide shaft 35, a pin pressing portion 333 that presses the pusher pin 23 adjacent to the recess 330, and a support And a bearing 334 disposed inside the portion 331. The pin 332 is inserted into a cam groove 340 described later provided in the slider portion 34. Further, the bearing 334 is a member that is fitted on the guide shaft 35 and is slid smoothly so that the cam member 33 does not rattle.

  As shown in FIGS. 2 and 3, the slider portion 34 is a rectangular plate-like member, and is formed integrally with the cutter upper blade 21. The slider portion 34 includes a cam groove 340 that penetrates in the plate thickness direction and extends in the longitudinal direction. The cam groove 340 has a first groove part 341 extending in parallel with the guide shaft 35 on the upper side and a second groove part 342 extending in parallel with the guide shaft 35 on the lower side. The first groove portion 341 and the second groove portion 342 are provided so as to be shifted in the X direction, and the cam groove 340 includes a connection groove portion 343 that connects the first groove portion 341 and the second groove portion 342.

  A pin 332 of the cam member 33 is inserted into the cam groove 340, and the pin 332 slides on the inner surface of the cam groove 340 as the cam member 33 moves along the guide shaft 35. When the pin 332 is positioned in the connection groove 343 of the cam groove 340, the inner surface of the connection groove 343 is pushed. Thus, the slider part 34 and the cutter upper blade 21 formed integrally with the slider part 34 move in the direction (X direction) intersecting the sliding direction (Z direction) of the cam member 33 (with respect to the cutter lower blade 22). Slide).

  In the present embodiment, the cam member 33 is described with a pin 332 and the slide portion 34 is provided with a cam groove 340. In practice, however, the cam member is provided with a cam groove and the slide portion is provided with a pin. It may be a configuration.

  In the present embodiment, air pressure is used as the actuator of the drive mechanism 3, but the present invention is not limited to this and may be one (hydraulic pressure) using a fluid (for example, hydraulic oil) other than air. Moreover, it is not limited to what uses a fluid, You may use electric power, such as a motor and a solenoid. In the present embodiment, the cutter upper blade 21 is slid and the pusher pin 23 is pressed using one actuator, a cam, and a cam groove. However, the present invention is not limited to this. For example, a plurality (two) of actuators may be provided so that the cutter upper blade 21 slides and the pusher pin 23 is pressed.

  As shown in FIGS. 1 and 2, the solder feeding mechanism 6 supplies the thread solder W. The solder feed mechanism 6 includes a pair of feed rollers 61 and a guide tube 62. The pair of feed rollers 61 are rotatably attached to the support wall 11. The pair of feed rollers 61 feeds the thread solder downward by rotating across the side surface of the thread solder W. The pair of feed rollers 61 are biased toward each other, and the thread solder W is sandwiched by the biasing force. The length of the thread solder W fed out is measured (determined) by the rotation angle (number of rotations) of the feed roller 61.

  The guide tube 62 is a tube body that can be elastically deformed, and its upper end is disposed in the vicinity of a portion of the feed roller 61 where the thread solder W is fed out. The lower end of the guide tube 62 is provided so as to communicate with the upper blade hole 211 of the cutter upper blade 21. The lower end of the guide tube 62 moves following the sliding of the cutter upper blade 21, and the guide tube 62 has a length that is not excessively pulled or stretched within the range in which the cutter upper blade 21 slides. And has a shape.

  The heater unit 4 is a heating device for heating and melting the solder piece Wh, and is fixed to the heater unit fixing portion 14 provided at the lower end portion of the wall 22 as shown in FIG. The heater unit 4 includes a heater 41 and a heater block 42. The heater 41 generates heat when energized. Here, the heater 41 has a heating wire wound around the outer peripheral surface of a cylindrical heater block 42.

  The heater block 42 has a cylindrical shape, and has a concave section 421 having a circular cross section for attaching the hook 5a to an end in the axial direction, and a solder supply hole 422 penetrating from the center of the bottom of the concave section 421 to the opposite side. And. The heater block 42 is provided in contact with the cutter lower blade 22 so that the solder supply hole 422 and the lower blade hole 221 communicate with each other. By providing the heater block 42 in this manner, the solder piece Wh moves from the lower blade hole 221 to the solder supply hole 422.

  The tip 5a is a cylindrical member, and includes a solder hole 51 extending in the axial direction at the center. The hook 5a is inserted into the recess 421 of the heater block 42, and is prevented from coming off by a member not shown. Further, the solder hole 51 of the tip 5 communicates with the solder supply hole 421 of the heater block 42, and the solder piece Wh is sent from the solder supply hole 421.

  The tip 5a receives heat from the heater 41 and melts the solder piece Wh with the heat. Therefore, the tip 5a is formed of a material having a high thermal conductivity, for example, a ceramic such as silicon carbide or aluminum nitride, or a metal such as tungsten. In the soldering apparatus A, the tip 5a has a cylindrical shape, but is not limited thereto, and a cylindrical shape having a polygonal cross section or an elliptical shape may be used. Different shapes may be prepared according to the shape of the wiring board Bd to be soldered and / or the terminal Nd of the electronic component Ep.

  The tip 5a has a release hole 53 that connects the solder hole 51 and the outer peripheral surface above the melting region 510 where the solder piece Wh into which the solder hole 51 has been introduced melts, that is, upstream in the direction in which the nitrogen gas flows. I have. When the soldering apparatus A is operated as will be described later, the release hole 53 may be clogged with the lower end opening of the solder hole 51 with molten solder. In such a case, the release hole 53 is supplied from the gas supply unit 7a. It plays the role of releasing nitrogen gas, vaporized flux, etc. out of the tip 5a. Note that the inner diameter of the release hole 53 is smaller than the inner diameter of the solder hole 51. That is, the release hole 53 has a larger flow path resistance than the solder hole 51.

  In addition, the tip 5 a includes a pressure measurement hole 54 that connects the solder hole 51 and the outer peripheral surface upstream of the melting region 510 in the nitrogen gas flow direction. The pressure measurement hole 54 is a hole for measuring the pressure in the solder hole 51, and the inner diameter of the pressure measurement hole 54 is smaller than the inner diameter of the solder hole 51, similar to the release hole 53. That is, the pressure measurement hole 54 has a larger flow path resistance than the solder hole 51. The position in the axial direction of the pressure measurement hole 54 in the tip 5a may be the same position as the release hole 53 or may be a different position. As described above, contamination of the pressure measurement hole 54 due to vaporized flux can be reduced.

  The gas supply unit 7a supplies a gas supplied from a gas supply source GS1 provided outside the soldering apparatus A to the soldering apparatus A. By using the inert gas described above as the gas, it is possible to prevent the solder from being oxidized. As shown in FIG. 2, the gas supply unit 7 a includes a pipe 70 a, a first adjustment unit 71, and a first measurement unit 72. The pipe 70a is a pipe through which nitrogen gas from the gas supply source GS1 flows into the gas inflow hole 222. In FIG. 2, for convenience, the piping 70 a is shown as a diagram, but in actuality, it is a tube body (for example, a resin tube) that does not leak nitrogen gas.

  The 1st adjustment part 71 is the structure containing a flow control valve, and is adjusting the flow volume of the nitrogen gas which flows through the piping 70a. The 1st measurement part 72 measures the flow volume of the nitrogen gas which flows through the piping 70a. That is, the first measuring unit 72 measures the flow rate of nitrogen gas discharged from the first adjusting unit 71. And the 1st measurement part 72 is transmitting the control signal which controls the 1st adjustment part 71 with respect to the 1st adjustment part 71 so that the flow volume of the measured nitrogen gas may turn into a predetermined flow volume. . That is, the gas supply unit 7a performs feedback control using the first adjustment unit 71 and the first measurement unit 72, and controls the flow rate of nitrogen gas supplied from the gas supply source GS1 to the solder hole 51 to be constant. is doing. Note that the operator may manually operate the first adjustment unit 71 based on the measurement result of the first measurement unit 72 to adjust the flow rate of the nitrogen gas. Further, when the flow rate measured due to some abnormality is different from a predetermined reference value or deviates from a preset range, the control unit Cont gives an alarm that an abnormality has occurred and / or the operation of the soldering apparatus. May be stopped.

  One end of the pressure measurement pipe 8 is connected to the outer opening of the pressure measurement hole 54 formed in the tip 5a. A pressure measurement unit 75 is connected to the other end of the pressure measurement pipe 8. The pressure measurement unit 75 measures the pressure inside the solder hole 51 and transmits the measurement result to the control unit Cont. And the control part Cont determines the state of the tip based on the pressure inside the solder hole 51 and / or the pressure change. That is, the control unit Cont serves as a state determination unit that determines the state of the tip. Moreover, the control part Cont may control the soldering apparatus A based on the determined state of the tip. The control of the soldering apparatus A includes, for example, the approach and separation of the soldering apparatus A from the substrate Bd, the cutting of the thread solder W, the heating of the tip 5 and the like.

  Next, a determination method for determining the state of the tip based on the pressure in the solder hole 51 of the tip 5a will be described. In the gas supply unit 7 a, all the nitrogen gas that has flowed into the gas inflow hole 222 flows into the solder hole 51 of the tip 5. For example, the gas inflow hole 222 communicates with the lower blade hole 221, and the lower blade hole 221 penetrates the cutter lower blade 22 vertically in the Z direction. In a state where nitrogen gas is supplied, the nitrogen gas is sealed so as not to escape from the upper end of the lower blade plan 221 in the Z direction.

  The flow rate of the nitrogen gas flowing in the solder hole 51 of the tip 5a is adjusted by adjusting the gas from the gas supply source GS1 with the first adjusting unit 71. The flow rate control valve provided in the first adjustment unit 71 keeps flowing nitrogen gas at a set flow rate regardless of the pressure inside the pipe. That is, the gas supply unit 7a performs flow rate control with a constant flow rate.

  In the soldering apparatus A, for example, when the solder piece Wh is supplied to the solder hole 51, the solder piece Wh occupies a part of the cross section orthogonal to the axis of the solder hole 51. For this reason, the flow path area of the portion of the solder hole 51 where the nitrogen gas flows becomes small, and the nitrogen gas hardly flows, that is, the flow path resistance increases. When the flow path resistance of the solder hole 51 increases, the pressure P1 in the solder hole 51 increases. That is, the pressure P <b> 1 in the solder hole 51 varies as the tip state changes. The controller Cont determines the state of the tip based on the pressure P1 or the change in the pressure P1. For example, the control unit Cont stores in advance information that associates the change in the pressure P1 with the cause of the change. The controller Cont determines the cause, that is, the state of the tip based on the calculated change in the pressure P1.

  Hereinafter, the pressure P1 in the solder hole 51 in each state of the tip will be described with reference to the drawings. 4 to 9 are views showing the operation of the soldering apparatus or the state of the tip. FIG. 10 is a diagram illustrating a change in the pressure P1 in the solder hole 51 when the soldering operation is performed once by the soldering apparatus. In the present embodiment, it is assumed that the substrate Bd is a through-hole substrate and the terminal Nd inserted into the through-hole Th is soldered.

  In the present embodiment, as the tip state, (a) a reference state, (b) a tip contact state, (c) a solder piece inserted state, (d) a solder piece melted state, (e) a solder piece outflow state, ( f) A description will be given of six states in which the tip is separated. In the soldering apparatus A, each state changes in order from (a) to (f) at the time of one soldering.

(A) Reference State FIG. 4 is a view showing the tip of the soldering apparatus in the reference state. As shown in FIG. 4, in the soldering apparatus A, in the previous stage of soldering (for example, preheating the tip 5a, changing the substrate Bd to be soldered, etc.), the tip 5a is removed from the substrate Bd. Separated. In the present embodiment, the state where the tip 5a is separated from the substrate Bd is set as a reference state. That is, the solder hole 51 is open to the atmosphere at the lower end in the Z direction. In the present embodiment, when the soldering apparatus A is in the reference state, the heater unit 4 is driven to heat the tip 5a. When the supply of nitrogen gas from the gas supply source GS1 is started in the reference state, nitrogen gas is supplied to the gas supply unit 7a. As described above, in the gas supply unit 7a, the first adjusting unit 71 adjusts the nitrogen gas to the flow rate Q1.

  As shown in FIG. 4, when the soldering apparatus A is in the reference state, the lower end of the solder hole 51 of the tip 5a is open to the atmosphere at the lower end in the Z direction. Therefore, even if nitrogen gas is supplied to the solder hole 51 from the gas supply part 7a, the pressure P1 in the solder hole 51 is constant. (A) The pressure P1 in the solder hole 51 in the reference state is defined as a pressure P1a. (A) In the reference state, the tip 5c has a small amount of nitrogen gas flowing from the release hole 53 to the outside because the lower end of the solder hole 51 is open to the atmosphere.

(B) Tip Contact State FIG. 5 is a diagram showing the tip of the soldering apparatus in the tip contact state. In the soldering apparatus A, the tip 5a is brought into contact with the land Ld of the substrate Bd in order to perform soldering after the reference state. In the soldering apparatus A, the tip 5a is brought into contact with the land Ld to raise the temperature of the land Ld to a temperature suitable for soldering (preheating).

  Then, by bringing the tip 5a into contact with the land Ld, the solder hole 51 of the tip 5a is closed by the land Ld. The substrate Bd is for soldering the terminal Nd penetrating the through hole Th, and the upper end portion in the Z direction of the terminal Nd of the electronic component is inserted into the solder hole 51 as shown in FIG. Further, the nitrogen gas that has passed through the solder hole 51 flows out from the through hole Th in which the terminal Nd is inserted.

  The portion of the through hole Th into which the terminal Nd is inserted through which the nitrogen gas escapes is the flow path of the nitrogen gas, and the flow path area is smaller than the cross-sectional area cut along the plane perpendicular to the axis of the solder hole 51. In the state of contact with the tip, a flow path resistance is formed on the tip end side of the solder hole 51, that is, the flow path resistance in the solder hole 51 becomes larger than the reference state. Thereby, the pressure P1b of the nitrogen gas in the solder hole 51 in the tip contact state becomes higher than the pressure P1a in the reference state.

(C) Solder piece insertion state FIG. 6 is a diagram showing the tip of the soldering apparatus in the solder piece insertion state. In the soldering apparatus A, the tip 5a is brought into contact with the land Ld, preheating is performed, and the temperature of the land Ld is raised to an appropriate temperature, and then the solder piece Wh is put into the solder hole 51. The preheating of the land Ld may be controlled by directly detecting the temperature of the land Ld with a temperature sensor and controlling the temperature by the temperature, or by the contact time of the heel 5a and the land Ld.

  Then, the solder piece Wh is put into the solder hole 51 at the timing when the preheating is completed. The solder piece Wh is formed by cutting the thread solder W with the cutter upper blade 21 and the cutter lower blade 22. When pressed by its own weight or the pusher pin 23, the solder piece Wh falls, passes through the lower blade hole 221 and the solder supply hole 422, and is put into the solder hole 51. The solder piece Wh contacts the terminal Nd inserted into the solder hole 51 and stops inside the solder hole 51. As described above, when the solder piece Wh stops in the middle of the solder hole 51, the flow passage area through which the nitrogen gas in the solder hole 51 passes becomes smaller. Thereby, the flow resistance in the solder hole 51 becomes larger when the solder piece is in the charged state than when the tip is in contact. And the pressure P1c in the solder hole 51 at the time of a solder piece insertion state becomes higher than the pressure P1b at the tip contact state.

(D) Solder piece melted state FIG. 7 is a diagram showing the tip of the soldering apparatus in the solder piece melted state. In the soldering apparatus A, the tip 5a is heated by the heater unit 4, and the solder piece Wh put in the solder hole 51 is heated and melted by the tip 5a. The molten solder piece Wh is a highly viscous liquid. Then, the solder hole 51 is closed by the molten solder piece. As a result, the nitrogen gas does not leak to the outside from the lower end opening of the solder hole 51 or becomes difficult to leak, and most of the nitrogen gas is released to the outside from the release hole 53 having a smaller inner diameter than the solder hole 51 and a large flow resistance. become.

  As a result, when the solder piece Wh is melted, the pressure P1d of the nitrogen gas in the solder hole 51 becomes higher than the pressure P1c in the solder piece insertion state.

(E) Solder Piece Outflow State FIG. 8 is a diagram showing the tip of the soldering apparatus in the solder piece outflow state. When the molten solder piece Wh flows out, the lower end portion in the Z direction of the solder hole 51 is blocked by the molten solder blocking the land Ld and the through hole Th. Thereby, nitrogen gas does not leak to the outside from the lower end opening of the solder hole 51 or is difficult to leak. Then, most of the nitrogen gas is released to the outside through the release hole 53 having a smaller inner diameter than the solder hole 51 and a larger flow path resistance.

  As a result, the pressure P1e of the nitrogen gas in the solder hole 51 is equal to or substantially equal to the pressure P1d in the solder piece molten state. Since the tip 5a is always heated by the heater unit 4, all the melted solder pieces Wh flow out of the tip 5a, that is, to the land Ld and the terminal Nd of the electronic component Ep.

(F) Tip Tip Separation State FIG. 9 is a diagram showing the tip of the soldering device in the tip tip separation state. In the soldering apparatus A, when the soldering between the land Ld and the terminal Nd of the electronic component Ep is finished, the tip 5a is separated from the land Ld. In the solder piece outflow state, the molten solder piece Wh flows out to the outside of the solder hole 51 in the whole amount or almost the whole amount. Therefore, the solder hole 51 returns to the state before soldering, that is, the same state as the reference state. Thereby, the pressure P1f of the nitrogen gas in the solder hole 51 is substantially the same as the pressure P1a that is the same as that in the reference state.

  As described above, the pressures P1a to P1d (P1e) in the solder hole 51 have different values depending on each state. The control unit Cont stores in advance a reference value of the pressures P1a to P1d (P1e) as a database, and compares it with the data of the pressure P1 in the solder hole 51 acquired from the pressure measurement unit 75, so that the current The state of the tip can be determined.

  Further, (d) the pressure P1d in the solder hole 51 in the melted state of the solder piece and (e) the pressure P1e in the solder hole 51 in the outflow state of the solder piece are substantially the same. It may be difficult to determine this. Therefore, the control unit Cont may detect the tip state in consideration of the temporal change of the pressure P1 in the solder hole 51. For example, when a predetermined time has elapsed after the second measuring unit 75 detects the pressure P1d in the solder hole 51, the control unit Cont determines that the tip 5a has changed from the solder piece molten state to the solder piece outflow state. May be.

  In the soldering apparatus A, the tip state is (a) the reference state, (b) the tip contact state, (c) the solder piece inserted state, (d) the solder piece melted state, (e) the solder piece outflow state, ( f) It changes in the order of the tip separation state. The pressure P1 in the solder hole 51 in each state is as shown in the graph shown in FIG. FIG. 10 shows a change in the pressure P1 in the solder hole 51 when the soldering apparatus A performs soldering once. In FIG. 10, the vertical axis represents pressure P1, and the horizontal axis represents time. Note that the pressure values P1a, P1b, P1c, P1d, P1e, and P1f shown in FIG. 10 are reference values.

  As shown in FIG. 10, the first region Ar1 is when the tip is in the (a) reference state, and the pressure in the solder hole 51 is the pressure P1a in the first region Ar1. In the second region Ar2, when the tip is in the (b) tip contact state and the tip changes from the (a) reference state to the (b) tip contact state, the pressure P1a is caused by the contact of the tip 5 with the land Ld. Suddenly changes to pressure P1b. That is, the change from the first region Ar1 to the second region Ar2 is steep.

  Further, in FIG. 10, the third region Ar <b> 3 indicates that the tip is (c) a solder piece insertion state, and by inserting the solder piece Wh into the solder hole 51, a part of the flow path of the solder hole 51 is blocked. Since the flow path resistance suddenly increases, the pressure P1b changes rapidly to the pressure P1c. That is, in FIG. 10, the change from the second region Ar2 to the third region Ar3 is steep.

  In FIG. 10, the fourth region Ar <b> 4 indicates that the tip is (d) the solder piece melted state, and the solder hole 51 is blocked by the melting of the solder piece Wh, so that the flow path resistance increases. In the melting of the solder piece, first, the flux is melted relatively slowly, and then the solder is melted rapidly. The pressure P1c increases to the pressure P1d slowly at first, and then increases rapidly after a certain change. That is, in FIG. 10, the change from the third region Ar3 to the fourth region Ar4 is initially slow and then rapidly increases.

  Further, as described above, (d) the pressure P1d in the molten state of the solder piece and (e) the pressure P1e in the outflow state of the solder piece are the same or substantially the same, and the change from the pressure P1d is small for a certain time.

  As described above, the pressure P1 in the solder hole 51 is characterized not only by its value but also by the rate of change of the pressure P1 when the state changes (changes rapidly or changes slowly).

  Determination of whether the soldering process is normally performed is performed as follows. First, a reference value range of the pressure P1 in the solder hole 51 in each soldering state is set in advance. Then, the determination is performed by comparing the range of the reference value in each soldering state with the measured pressure P1 in the solder hole 51. For example, (c) Determination in a solder piece insertion state will be described. First, (c) the upper limit value Px1 and the lower limit value Py1 of the reference value are set in the time zone of Ar3 in which the solder piece is put in. The upper limit value Px1 and the lower limit value Py1 are values represented by Px1 = P1c + x1 and Py1 = P1c−y1 (x1, y1 are positive numbers), respectively. When the pressure P1 in the solder hole 51 measured in the Ar3 time zone in the soldering process deviates from the range between the upper limit value Px1 and the lower limit value Py1, the controller Cont has an abnormality in the soldering process. For example, an alarm or operation stop may be performed. One of x1 and y1 may be 0.

  Further, the second upper limit value Px2 = P1c + x2 and the second lower limit value Py2 = P1c−y2 are set using x2 and y2 which are smaller than the above-described x1 and y1, and measured in the time zone of Ar3. When the pressure P1 in the solder hole 51 deviates from the second upper limit value Px2 to the outside of the second lower limit value Py2, the control unit Cont can also notify the operator of attention. One of x2 and y2 may be 0. In the above description, the first upper limit value and the first lower limit value are used to warn or stop the operation, or the second upper limit value and the second lower limit value are further used for warning and the reference value is used for warning. Or although the thing of the 2 steps | paragraphs which stop driving | operation is mentioned, these are an example, You may perform a warning or an alarm in 2 steps | paragraphs or more using many reference values. In addition, (c) a reference value range is also provided in a state other than the solder piece input state, and the soldering process is performed by comparing the reference value range with the measured branch flow rate. Determine if it is normal.

  Also, regardless of the time and pressure, if the solder melts or flows out, the pressure P1 in the solder hole 51 increases to the maximum value. The controller Cont can also determine that the solder has been melted when a value near the peak value of the pressure P1 in the solder hole 51 (here, the pressure P1d) is detected.

  Further, the control unit Cont stores in advance a reference value of the pressures P1a to P1d (P1e) as a database, and compares it with the data of the pressure P1 in the solder hole 51 obtained from the pressure measurement unit 75. The contamination state of the solder hole 51 can be determined. Alternatively, the control unit Cont is in a state where the tip 5 and the substrate Bd are not in contact with each other, the contact between the tip 5 and the substrate Bd, the introduction of the solder piece Wh to the tip 5, heat melting, and melting from the tip 5. A time-dependent change that is a reference for the pressure of the nitrogen gas in the solder hole 51 in a series of soldering processes such as the outflow of solder and the separation of the tip 5 from the substrate Bd is stored as a database and acquired from the pressure measurement unit 75. It is also possible to determine the contamination state of the solder hole 51 by comparing with the time-dependent change of the pressure P1 in the solder hole 51.

  The case where the contamination state of the solder hole 51 is determined in the third region Ar3, that is, the step of putting the solder piece Wh into the solder hole 51 will be described as an example. FIG. 11 shows a state diagram in which the solder piece Wh is put into the solder hole 51. In the initial state where the solder hole 51 is not dirty as shown in FIG. 6, the pressure in the solder hole 51 is P1c. On the other hand, in the state where deposits such as dross are attached to the inner peripheral walls of the solder hole 51 and the release hole 53 as shown in FIG. 11, the flow passage area through which the nitrogen gas in the solder hole 51 passes is small. However, since the flow path area is further reduced by introducing the solder piece Wh, the pressure in the solder hole 51 becomes a pressure P1c ′ higher than the pressure P1c in the initial state (the chain line in FIG. 10). The controller Cont stores the pressure P1c in the initial state in advance, and can determine the contamination state of the solder hole by comparing the measured pressure in the solder hole 51 with the pressure P1c.

  Furthermore, in addition to the change in the state of the tip 5a as described above, it is also possible to determine the soldering state between the land Ld of the wiring board Bd and the terminal Nd of the electronic component Ep. For example, as shown in FIG. 12A, when the land Ld and the terminal Nd are normally soldered, the solder has a conical shape. On the other hand, when the preheating is insufficient, the solder rises as shown in FIG.

  Therefore, after the controller Cont determines that the solder has been melted, the tip 5a is separated from the land Ld by a distance G from the initial position where the contact between the tip 5a and the land Ld is detected. The soldering state is determined by the change in the pressure P1. That is, the tip 5a is separated from the land Ld by a distance G and held for a predetermined time, and the pressure P1 in the solder hole 51 is measured. When soldering is normally performed as shown in FIG. 12 (a), the tip 5a is separated from the land Ld by a distance G, whereby the conical solder and the inner peripheral surface of the solder hole 51 of the tip 5 are separated. Since a gap is generated between them, and the nitrogen gas in the solder hole 51 flows out from the gap, the pressure P1 in the solder hole 51 is rapidly reduced to be the same as or substantially the same as the pressure P1a.

  On the other hand, when potato solder is formed as shown in FIG. 12B, even if the tip 5a is separated from the land Ld by the distance G, the solder that rises in a dome shape and the solder hole 51 of the tip 5a. The pressure P1 in the solder hole 51 does not decrease or is small even if it is decreased because it is still in contact with the inner peripheral surface or is small even if there is a gap. Therefore, it is possible to determine the soldering state by measuring the change in the pressure P1 in the solder hole 51.

  The distance G between the tip 5a and the land Ld is such that when soldering is normal, the solder and the inner peripheral surface of the solder hole 51 are not in contact with each other. The distance between the inner peripheral surface of the hole 51 and the inner peripheral surface of the hole 51 may be appropriately determined based on the volume of the supplied solder piece Wh, the shape of the solder hole 51, and the like, and based on preliminary experiments. The separation distance G is usually in the range of 0.2 mm to 2 mm. Further, there is no particular limitation on the separation speed of the tip 5a when the tip 5a and the land Ld are separated to the distance G. However, from the viewpoint of the measurement accuracy of the pressure P1, etc., it is 0.1 mm / sec to 10 mm / sec. A range is preferred. More preferably, it is the range of 0.2 mm / sec-2 mm / sec. The time for holding the heel 5a at the separation distance G is preferably in the range of 0.1 sec to 2 sec.

  In order to perform such abnormality determination as well, the control unit Cont stores in advance a table showing the time variation of the branch flow rate in one soldering as shown in FIG. The branch flow rate data is arranged in time series and the behavior and values are compared to determine the tip state. By using such a determination method, the state of the tip can be determined more accurately.

(First modification)
In the above-described embodiment, the case where the thickness and the length of the solder piece Wh are constant is described. However, the feeding of the thread solder W may vary. Further, the shape and size of the solder piece Wh may be intentionally changed due to a large soldering area or the like. In such a case, the control part Cont: (b) The shape and size of the inserted solder piece Wh based on the magnitude of fluctuation and the behavior of fluctuation when the pressure P1 varies from the pressure P1b in the tip contact state. You may determine etc. When there is a possibility of introducing solder pieces having different sizes and shapes, the control unit Cont sets the reference value of the pressure P1 in the solder hole 51 in each state for each size and shape of the solder pieces Wh. (Or) It is preferable that a table showing the time change is provided as a database.

(Second modification)
A modification of the soldering apparatus according to this embodiment will be described with reference to the drawings. FIG. 13 is a cross-sectional view showing an example of a rivet used in a modification of the soldering apparatus according to the present embodiment. As shown in FIG. 13, the tip 5b used in the soldering device of the second modified example has a solder piece for stopping the solder piece Wh in the solder hole 51b before the solder piece Wh contacts the terminal Nd. A stop 511 is provided.

  As shown in FIG. 13, the solder piece stop portion 511 has a tapered shape in which the inner diameter decreases downward in the Z direction. When the solder piece Wh reaches the solder piece stopping portion 511, the gap between the solder holes 51b is reduced by the solder piece 511. As a result, (c) the resistance of the flow path in the solder hole 51b when the solder piece is loaded is increased. As a result, in the second modification, (c) the pressure P1 when the solder piece is put in increases. And since the difference of the pressure P1 at each time of (b) tip contact state and (c) solder piece insertion state becomes large, the control part Cont, (b) tip contact state, (c) solder It becomes easy to discriminate from the single-loading state. Further, the solder piece Wh may stop inside the solder hole 51b before reaching the solder piece stop portion 511. In this case, the flow path resistance due to the solder piece is smaller than when the solder piece Wh reaches the solder piece stop 511. By utilizing this, the control unit Cont can determine that the solder piece Wh has reached the solder piece stop unit 511, that is, that the solder piece Wh has been reliably inserted.

  In this embodiment, possible states when the soldering apparatus A performs soldering include (a) a reference state, (b) a tip contact state, (c) a solder piece insertion state, (d) a solder piece molten state, Although six states (e) solder piece outflow state and (f) heel tip separation state are listed, other states may be determined.

(Third Modification)
In the above-described embodiment, the case where the tip 5a is in a high temperature state where the solder can be melted is described. However, the tip 5a may be out of the normal temperature range set for melting the solder due to a failure of the heater 41 or the like. Since the nitrogen gas passing through the tip 5a expands and has a different viscosity depending on the temperature of the tip 5a, the flow resistance also increases and decreases, and as a result, the pressure of the nitrogen gas also changes. For example, when the temperature of the tip 5a decreases, the volume of nitrogen gas decreases and the viscosity decreases, so the pressure of nitrogen gas in the solder hole 51 decreases. Using this, the control unit Cont stores and stores the pressure P1a when the solder hole 51 is open to the atmosphere, that is, when the tip 5a is in the (a) reference state. Based on the pressure P1a and the measured pressure P1, it is possible to determine the temperature of the tip 5a.

  Further, when the type of gas to be supplied changes as in a mixed gas of nitrogen and air or oxygen, the flow path resistance changes, so that a difference occurs in the pressure P1 in the solder hole 51. Using this, the control unit Cont stores and stores the pressure P1a when the solder hole 51 is open to the atmosphere, that is, when the tip 5a is in the (a) reference state. Based on the pressure P1a and the measured pressure P1, it can be determined whether or not the supplied gas is nitrogen gas (gas to be supplied). Thereby, the control part Cont can detect an error in the gas pipe connection, for example.

  The operations of the first modification, the second modification, and the third modification can be performed, for example, at regular intervals. With a fixed period, you may manage by time, for example, and may manage by the frequency | count of soldering. Alternatively, it may be performed immediately after power-on of the soldering apparatus A and at the end of the process. Further, it may be performed at random timing.

(Second Embodiment)
Another example of the soldering apparatus according to this embodiment will be described with reference to the drawings. FIG. 14 is a view showing another example of the soldering apparatus according to the present invention. Note that the soldering apparatus C shown in FIG. 14 includes a gas release portion 52 that penetrates the solder hole 51 and the outer peripheral surface downstream of the melting region 510 of the tip 5c. Other than that, it has the same configuration as the soldering apparatus A of the first embodiment. Therefore, in the tip 5c, substantially the same part as the tip 5a of the soldering apparatus A is denoted by the same reference numeral, and detailed description of the same portion is omitted.

  The gas release portion 52 is a portion that communicates the solder hole 51 and the outside downstream of the melting region 510 of the solder hole 51. In this embodiment, the gas release portion 52 is connected to the outer peripheral surface of the tip 5c and the solder. Although it has a through-hole shape communicating with the hole 51, it is not limited to this. For example, a slit shape or a notch shape formed so as to communicate the solder hole 51 and the outer peripheral surface of the tip 5c between the downstream side of the melting region 510 of the solder hole 51 and the lower end in the Z direction of the tip 5c. It may be. In addition to the above-described through holes, slits, and cutouts, the nitrogen gas in the solder hole 51 is moved to the outside of the tip 5c as the gas release portion 52 when (b) the tip contact state and (e) the solder piece outflow state. A shape that can flow out can be widely adopted.

  The determination of the state of the tip by the control unit Cont when such a soldering apparatus C is used will be described with reference to the drawings. FIG. 15 is a diagram showing the tip and the flow of nitrogen gas in the tip contact state. FIG. 16 is a diagram showing the tip and the flow of nitrogen gas when the solder piece is inserted. FIG. 17 is a diagram showing the tip and the flow of nitrogen gas in a molten solder piece state. FIG. 18 is a diagram showing the tip and the flow of nitrogen gas in the solder piece outflow state.

  In the soldering apparatus C, the state that the tip can take in one soldering is the same as in the first embodiment, that is, (a) the reference state, (b) the tip contact state, and (c) the solder piece insertion state. (D) Solder piece melted state, (e) Solder piece outflow state, and (f) Tip tip separated state. Then, (a) the reference state and (f) the tip separation state are substantially the same as those of the soldering apparatus A of the first embodiment. Further, the tip 5c is provided with a gas release portion 52, and when the gas can flow out from the gas release portion 52, that is, (b) a tip contact state, (c) a solder piece inserted state, (e ) In each state of the solder piece outflow state, the pressure of the nitrogen gas flowing in the solder hole 51 becomes smaller than that in the first embodiment. Therefore, the pressure in the solder hole 51 will be described as the pressure P11. For example, in the (b) reference state, the pressure in the solder hole 51 is set to the pressure P11b. Similarly, in other states, the pressures are set to P11c and P11e.

  When (b) the tip contact state shown in FIG. 15, the nitrogen gas in the solder hole 51 flows out from the through hole Th and also flows out from the release hole 53 and the gas release portion 52. Therefore, the pressure P11 in the solder hole 51 is lower than when there is no gas release portion 52 (first embodiment). That is, the pressure P11b (<P1b) in the solder hole 51 is obtained. Similarly, in the case of (c) solder piece insertion state shown in FIG. 16, the flow path resistance is increased by the solder piece Wh. On the other hand, since nitrogen gas flows out from the gas release part 52, the pressure P11 in the solder hole 51 becomes lower than when there is no gas release part 52 (1st Embodiment). That is, the pressure P11c (<P1c) in the solder hole 51 is obtained. Then, (c) the pressure P11c in the solder hole 51 in the solder piece insertion state is higher than the pressure P11b in the solder hole 51 in the (b) tip contact state.

  When (d) the solder piece is melted as shown in FIG. 17, the melted region 510 of the solder hole 51 is closed with the melted solder piece Wh. Therefore, the nitrogen gas does not flow out from the gas release portion 52 that is downstream of the melting region 510 in the flow direction of the nitrogen gas. Therefore, (d) the pressure P11d in the solder hole 51 when the solder piece is melted is substantially equal to that in the first embodiment (P1d).

  When (e) the solder piece flows out as shown in FIG. 18, the lower end in the Z direction of the solder hole 51 is blocked by the land Ld. Further, since the molten solder piece Wh blocks the through hole Th of the land Ld, the nitrogen gas does not flow out from the through hole Th. On the other hand, since the solder piece Wh is melted and flows out from the melted region 510 to the circuit board Bd side, the nitrogen gas in the solder hole 51 can flow out from the gas release portion 52 to the outside. That is, since the nitrogen gas flows out from the gas release part 52, the pressure P11 in the solder hole 51 is lower than when there is no gas release part 52 (first embodiment). That is, (e) the pressure in the solder hole 51 in the solder piece outflow state is the pressure P11e (<P1e). In addition, when (e) the solder piece flows out, the nitrogen gas in the solder hole 51 flows out from the gas release part 52, so the pressure P11e is lower than the pressure P11d when (d) the solder piece is melted. .

  As described above, by providing the gas release portion 52 on the tip 5c, (b) the pressure P11b in the solder hole 51 in the tip contact state, and (c) the solder hole 51 in the solder piece insertion state. The pressure P11c of (1) and the pressure P11e in the solder hole 51 in the solder piece outflow state can be set to values different from those of the soldering apparatus A of the first embodiment.

  The pressure P11 in each state is as shown in the graph shown in FIG. FIG. 19 shows a change in piping pressure when the soldering apparatus C performs soldering once. In FIG. 19, the vertical axis represents the pressure P11 in the solder hole 51, and the horizontal axis represents time. Note that in the following description, only portions that exhibit behaviors different from those in FIG. 10 will be described.

  As shown in FIG. 19, by using the tip 5c provided with the gas release portion 52, (d) the solder hole 51 after the fourth region Ar4 (pressure P11d in the solder hole 51) indicating the molten state of the solder piece. The fifth region Ar5 showing the (e) solder piece outflow state of the inner pressure P11e appears.

  Thus, by providing the gas release portion 52 at the tip 5d, (d) the pressure P11d in the solder hole 51 in the solder piece molten state, and (e) the pressure P11e in the solder hole 51 in the solder piece outflow state Can be different values. Thereby, the control part Cont can more accurately detect (e) the solder piece outflow state, that is, the completion of the soldering of the terminal Nd and the land Ld of the electronic component Ep.

  Also in this embodiment, the control unit Cont stores the pressure of the pipe in each state as a database and compares the pressure state in the solder hole 51 from the pressure measurement unit 75 with the state of the tip. You may judge. Further, by storing a table showing the time variation of the pressure in the solder hole 51 as shown in FIG. 19, by arranging the pressure data from the pressure measuring unit 75 in time series, and comparing the behavior and the value. The tip state may be determined.

  It is also possible to store each measurement value of the relationship between time and pressure (FIG. 10 or FIG. 19), create a quality control database, and calculate correlations such as changes over time and ambient temperature by statistical processing. it can.

  In addition, when there are multiple soldering locations, the change value of the fluid in each state may differ depending on the soldering location, so the above database is created for each soldering location and varies depending on the soldering location. It is also possible to make a determination using the determined threshold.

(Third embodiment)
FIG. 20 shows another embodiment of the soldering apparatus according to the present invention. In the soldering apparatuses A and C shown in the first embodiment and the second embodiment, the solder hole 51 is closed by the molten solder in the melting region 510 at least in the molten state of the solder piece. At this time, nitrogen gas or vaporized flux in the solder hole 51 is discharged out of the release hole 53, but part of the gas may enter the pressure measurement hole 54. When gas containing vaporized flux or the like enters the pressure measurement hole 54, dirt such as dross adheres to the inner peripheral surfaces of the pressure measurement hole 54 and the pressure measurement pipe 8, and the measurement accuracy of the pressure measurement unit 75 is improved. May decrease.

  Therefore, in the soldering apparatus D shown in FIG. 20, an inert gas is supplied to the pressure measurement pipe 8 so that gas containing flux or the like vaporized into the pressure measurement hole 54 and the pressure measurement pipe 8 does not enter. did.

  Specifically, the inert gas is supplied from the gas supply source GS2 to the gas supply hole 81 formed in the pressure measurement pipe 8 through the gas supply unit 7b. Here, the formation position of the gas supply hole 81 is the end where the pressure measurement part 75 of the pressure measurement pipe 8 is attached from the viewpoint of preventing the retention part of the inert gas from being formed in the pressure measurement pipe 8. It is desirable to be on the side. The gas supply unit 7 b includes a pipe 70 b, a second adjustment unit 73, and a second measurement unit 74. The pipe 70b is a pipe through which an inert gas from the gas supply source GS2 flows into the gas supply hole 81. In FIG. 20, for convenience, the pipe 70b is shown by a diagram, but in actuality, it is a tube body (for example, a resin pipe) that does not leak gas. The inert gas from the gas supply source GS2 is here the same nitrogen gas as the gas supplied from the gas supply source GS1.

  The flow rate of the nitrogen gas supplied from the gas supply source GS2 is adjusted by the second adjusting unit 73. Then, the second measuring unit 74 measures the flow rate of nitrogen gas discharged from the second adjusting unit 73, and the second measuring unit 74 sets the second flow rate to the second adjusting unit 73 so that the measured nitrogen gas flow rate becomes a predetermined flow rate. 2 A control signal for controlling the adjustment unit 73 is transmitted. Note that the flow rate Q2 of nitrogen gas supplied from the gas supply source GS2 to the pressure measurement pipe 8 only needs to prevent vaporized flux or the like from entering the pressure measurement pipe 8, and thus flows in the solder hole 51. The flow rate is set to be much smaller than the flow rate Q1 of nitrogen gas. Further, the pressure of the nitrogen gas in the pressure measuring pipe 8 is set higher than the pressure of the nitrogen gas in the solder hole 51.

  According to such a configuration, the gas containing vaporized flux or the like is effectively suppressed from entering the pressure measurement hole 54, and the pressure measurement hole 54 and the pressure measurement pipe 8 are connected to the inner peripheral surfaces. Dirt adhesion such as dross can be suppressed. Thereby, the measurement accuracy of the pressure measurement unit 75 can be maintained in a high state over a long period of time.

(Modification)
In the soldering apparatus D of FIG. 20, the nitrogen gas that flows in the pressure measurement pipe 8 is supplied from the gas supply source GS2. However, the nitrogen gas is supplied from the gas supply source GS1 to the pressure measurement pipe 8. May be. That is, nitrogen gas may be supplied from the gas supply source GS1 into the solder hole 51 and the pressure measurement pipe 8. With such a configuration, one gas supply source can be provided. Also in this case, a gas supply unit 7b is provided between the gas supply source GS1 and the pressure measurement pipe 8, and the flow rate of the nitrogen gas is measured by the second measurement unit 74 while the flow rate is adjusted by the second adjustment unit 73. The flow rate of the nitrogen gas supplied into the pressure measurement pipe 8 is controlled to be a predetermined flow rate. Further, the pressure of the nitrogen gas in the pressure measurement pipe 8 is controlled to be higher than the pressure of the nitrogen gas in the solder hole 51.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to this content. The embodiments of the present invention can be variously modified without departing from the spirit of the invention.

A, C, D Soldering device 1 Support member 11 Wall body 12 Holding portion 13 Sliding guide 14 Heater unit fixing portion 15 Actuator holding portion 16 Spring holding portion 2 Cutter unit 21 Cutter upper blade 211 Upper blade hole 212 Pin hole 22 Cutter Lower blade 221 Lower blade hole 222 Gas inflow hole 23 Pusher pin 231 Rod portion 232 Head portion 233 Spring 3 Drive mechanism 31 Air cylinder 32 Piston rod 33 Cam member 330 Recess 331 Support portion 332 Pin 333 Pin push portion 334 Bearing 34 Slider portion 340 Cam groove 341 First groove 342 Second groove 343 Connection groove 35 Guide shaft 4 Heater unit 41 Heater 42 Heater block 421 Recess 422 Solder supply hole 5 Tip 51 Solder hole 510 Melting region 52 Gas release part 53 Release hole 54 Pressure measurement Hole 6 Solder feed mechanism 61 Feed roller 62 Guide tube 7 Gas supply unit 70a, 70b Pipe 71 First adjustment unit 72 First measurement unit 73 Second adjustment unit 74 Second measurement unit 75 Pressure measurement unit 8 Pressure measurement tube 81 Gas Supply hole W Solder Wh Solder piece Bd Wiring board Ep Electronic component Ld Land Th Through hole Nd Terminal

Claims (8)

A tip having a solder hole to which the solder piece is supplied and heating and melting the solder piece in the solder hole;
A gas supply source for supplying the gas;
A gas supply unit that communicates the gas supply source and the solder hole, and supplies a gas from the gas supply source to the solder hole;
Have
The solder hole is provided with a melting region where the solder piece is melted,
A tip state determination method for determining a tip state of a soldering apparatus in which a release hole that communicates the solder hole and the outside is formed on the tip side upstream of the melting region of the solder hole. Because
The flow rate of gas flowing through the solder hole is constant,
A method for determining the state of the tip of the tip while measuring the pressure of the gas flowing through the solder hole and comparing the measured pressure with a reference value or table provided in advance. The pressure of the gas in the solder hole is measured via a pressure measuring hole formed on the upstream side of the melting point of the solder hole and communicating with the solder hole and the outside.
The tip state determination method according to claim 1, wherein a gas having a pressure higher than a pressure in the solder hole is supplied to the pressure measurement hole.   The tip state determination method according to claim 1 or 2, wherein the table includes at least one of the pressure or a time series change in pressure.   Based on the increase in pressure of the gas flowing through the solder hole, contact of the tip with the object to be soldered, insertion of the solder piece into the solder hole, and melting of the solder piece in the solder hole The tip state determination method according to any one of claims 1 to 3, wherein at least one of them is determined to be performed. The tip includes a gas release portion that communicates the solder hole and the outside downstream of the melting region of the solder hole,
5. The tip according to claim 1, wherein when the pressure of the gas flowing through the solder hole is detected to decrease after being increased, the outflow of the molten solder piece from the solder hole is determined. State judgment method.   Each time soldering is performed a predetermined number of times, the physical quantity of the tip is stored, and the state of the tip is determined by comparing with the current physical quantity. Previous state determination method.   The said state determination part determines at least one of the shape and magnitude | size of the said solder piece based on the said pressure after throwing the said solder piece into the said solder hole. How to determine the tip of the tip. A tip having a solder hole to which the solder piece is supplied and heating and melting the solder piece in the solder hole;
A gas supply source for supplying the gas;
A gas supply unit that communicates the gas supply source and the solder hole, and supplies a gas from the gas supply source to the solder hole;
A measurement unit for measuring the pressure of the gas flowing in the solder hole;
A state determination unit that determines the state of the tip based on the pressure of the gas measured by the measurement unit;
The solder hole is provided with a melting region where the solder piece is melted,
In the soldering tip, a soldering device in which a release hole communicating the solder hole and the outside is formed on the upstream side of the melting region of the solder hole,
The soldering apparatus according to claim 1, wherein the state determination unit determines the state of the tip using the method according to claim 1.