JP2019161114A5 - - Google Patents

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Publication number
JP2019161114A5
JP2019161114A5 JP2018048388A JP2018048388A JP2019161114A5 JP 2019161114 A5 JP2019161114 A5 JP 2019161114A5 JP 2018048388 A JP2018048388 A JP 2018048388A JP 2018048388 A JP2018048388 A JP 2018048388A JP 2019161114 A5 JP2019161114 A5 JP 2019161114A5
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JP
Japan
Prior art keywords
core material
functional member
member according
electronic functional
relaxation layer
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JP2018048388A
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English (en)
Japanese (ja)
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JP2019161114A (ja
JP6960161B2 (ja
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Priority to JP2018048388A priority Critical patent/JP6960161B2/ja
Priority claimed from JP2018048388A external-priority patent/JP6960161B2/ja
Priority to US16/980,496 priority patent/US11291114B2/en
Priority to EP19768243.8A priority patent/EP3768050A4/en
Priority to PCT/JP2019/010292 priority patent/WO2019177030A1/ja
Publication of JP2019161114A publication Critical patent/JP2019161114A/ja
Publication of JP2019161114A5 publication Critical patent/JP2019161114A5/ja
Application granted granted Critical
Publication of JP6960161B2 publication Critical patent/JP6960161B2/ja
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JP2018048388A 2018-03-15 2018-03-15 電子機能部材及び電子部品 Active JP6960161B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018048388A JP6960161B2 (ja) 2018-03-15 2018-03-15 電子機能部材及び電子部品
US16/980,496 US11291114B2 (en) 2018-03-15 2019-03-13 Electronic functional member and electronic component
EP19768243.8A EP3768050A4 (en) 2018-03-15 2019-03-13 ELECTRONIC FUNCTIONAL ELEMENT AND ELECTRONIC COMPONENT
PCT/JP2019/010292 WO2019177030A1 (ja) 2018-03-15 2019-03-13 電子機能部材及び電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018048388A JP6960161B2 (ja) 2018-03-15 2018-03-15 電子機能部材及び電子部品

Publications (3)

Publication Number Publication Date
JP2019161114A JP2019161114A (ja) 2019-09-19
JP2019161114A5 true JP2019161114A5 (https=) 2020-11-12
JP6960161B2 JP6960161B2 (ja) 2021-11-05

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ID=67907220

Family Applications (1)

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JP2018048388A Active JP6960161B2 (ja) 2018-03-15 2018-03-15 電子機能部材及び電子部品

Country Status (4)

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US (1) US11291114B2 (https=)
EP (1) EP3768050A4 (https=)
JP (1) JP6960161B2 (https=)
WO (1) WO2019177030A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020179907A1 (ja) * 2019-03-07 2020-09-10 国立大学法人 東京大学 電子機能部材及びその製造方法、並びに、生体測定センサ
US20240201782A1 (en) * 2022-12-08 2024-06-20 The Board Of Trustees Of The Leland Stanford Junior University Devices and methods with substrate-less nanomesh sensors

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080690A (en) * 1998-04-29 2000-06-27 Motorola, Inc. Textile fabric with integrated sensing device and clothing fabricated thereof
US7326649B2 (en) * 2004-05-14 2008-02-05 University Of Southern California Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same
JP6212814B2 (ja) * 2013-05-21 2017-10-18 国立研究開発法人科学技術振興機構 多点プローブ及びそれを構成する電子接点シート、多点プローブアレイ並びに多点プローブの製造方法
JP6444158B2 (ja) * 2014-12-16 2018-12-26 国立研究開発法人科学技術振興機構 電子機能部材、電子部品及びウェアラブルデバイス
JP6168507B1 (ja) * 2016-08-24 2017-07-26 グンゼ株式会社 導電性生地
EP3416721B1 (en) * 2016-02-16 2022-10-05 Sorin CRM SAS Implantable lead for electrical stimulation and/or for collecting electrical potentials on an organ, incorporating a passive component function
JP2017208492A (ja) * 2016-05-20 2017-11-24 ソニー株式会社 配線構造および電子機器
WO2017203685A1 (ja) * 2016-05-27 2017-11-30 国立研究開発法人科学技術振興機構 電子機能部材、電子部品及びウェアラブルデバイス
JP6790660B2 (ja) 2016-09-23 2020-11-25 日本製鉄株式会社 溶融亜鉛めっき層の合金化方法

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