JP2019160582A - Light projection device and manufacturing method for light projection device - Google Patents

Abstract

To provide a light projection device that can improve the accuracy of alignment of respective members.SOLUTION: A light projection device 101 comprises a semiconductor light emitting element 11 for emitting laser light, a first light condensing member (a first light condensing lens 20) for condensing the laser light (emitted light 12) emitted from the semiconductor light emitting element 11, a phosphor optical element 30 to which the emitted light 12 from the first light condensing lens 20 is applied, a reflecting member 150 for changing the angle of fluorescence 93 generated by converting the wavelength of the emitted light 12 by the phosphor optical element 30, and a base (a holding member) 40 for holding the phosphor optical element 30 and the reflecting member 150. Through holes (a first reference hole 52 and a second reference hole 53) are formed in the base 40, and the reflecting member 150 is attached to the first reference hole 52 and the second reference hole 53.SELECTED DRAWING: Figure 7

Description

  The present disclosure relates to a light projecting device, and in particular, a display field such as a projection display device, vehicle illumination, or medical illumination that uses light emitted by irradiating a wavelength conversion element with light emitted from a semiconductor light emitting device. The present invention relates to a light projecting device using a light source device used in the illumination field.

  In a light source device using a semiconductor light emitting device composed of a semiconductor light emitting element such as a semiconductor laser, in order to emit a high luminous flux, the light emitted from the semiconductor light emitting device is condensed on the wavelength conversion element to convert the wavelength. Radiated to the outside from the element (see, for example, Patent Document 1). Hereinafter, a conventional light projecting device using the light source device disclosed in Patent Document 1 will be described with reference to FIG.

  A conventional projector 1001 is used as, for example, a vehicle headlamp, and is disposed on an optical axis AX that extends in the vehicle front-rear direction. The phosphor 1030 disposed on the axis AX, the first reflecting surface 1040 that reflects the light from the phosphor 1030 so as to be condensed near the optical axis AX, and the upper end edge is located in the vicinity of the rear focal point of the projection lens 1020 The shade 1050 disposed between the projection lens 1020 and the phosphor 1030 is positioned between the projection lens 1020 and the rear focal point of the projection lens 1020 and below the optical axis AX so that the irradiation direction is substantially vertically upward. The semiconductor light emitting element 1060 disposed at the second vertical position above the semiconductor light emitting element 1060 and at a position that does not block the reflected light from the first reflecting surface 1040. And a surface 1070.

  The phosphor 1030 is a phosphor that emits light when excited by the light Ray 1 from the semiconductor light emitting element 1060.

  Projection lens 1020 is held by a lens holder (not shown) and fixed to metal member 1080. The phosphor 1030 is attached to the upper surface of the metal member 1080.

  In addition, the metal member 1080 is provided with heat radiation fins 1081.

JP 2012-59608 A

  However, in the conventional light projecting device (for example, Patent Document 1), the positional relationship between the spot position of the light Ray1 on the phosphor 1030 and the first reflecting surface 1040 can be adjusted and fixed with high accuracy. First, if the relative position between the spot position of the light Ray1 on the phosphor 1030 and the first reflecting surface 1040 is shifted, the intensity of the irradiation light emitted from the light projecting device at a distance away from the conventional light projecting device. There is a problem in that the center position of the lens shifts from a desired position.

  As described above, in the light projecting device, it is desired that each member included in the light projecting device or the alignment between the light projecting member and the member to which the light projecting member is attached can be accurately performed.

  The present disclosure has been made to solve such a problem, and an object of the present disclosure is to provide a light projecting device and the like that can accurately align each member.

  In order to solve the above problems, a light projecting device according to the present disclosure includes a semiconductor light emitting element that emits laser light, a first light collecting member that condenses the laser light emitted from the semiconductor light emitting element, A phosphor optical element that is irradiated with the laser light from the first light collecting member; a reflecting member that changes an angle of fluorescence in which the laser light is wavelength-converted by the phosphor optical element; and the phosphor optical element. And a holding member for holding the reflection member, the holding member is formed with a through hole, and the reflection member is attached to the through hole.

  With this configuration, the spot position of the laser light on the phosphor optical element is a position based on the through hole to which the reflecting member is attached. Therefore, the positional accuracy between the spot position on the phosphor optical element and the reflecting member is improved. That is, according to the light projecting device according to the present disclosure, it is possible to accurately position each member. In particular, it is possible to suppress a deviation from a desired light distribution characteristic when irradiating far away with the light projecting device.

  Further, in one aspect of the light projecting device according to the present disclosure, the through hole is formed of a circular hole and a long hole, and the long hole is elongated in the arrangement direction of the circular hole and the long hole. Good.

  With this configuration, the reflection member can be attached to the holding member with high positional accuracy.

  Further, in one aspect of the light projecting device according to the present disclosure, the light projecting device may further include a base that holds the semiconductor light emitting element and the first light collecting member.

  For example, the holding member may be the base.

  With this configuration, since the semiconductor light emitting element, the first light collecting member, the phosphor optical element, and the reflecting member are all attached to one holding member (that is, the base), these elements, and There is no need for a new additional member to attach the member. Therefore, according to such a configuration, the light projecting device can be manufactured at low cost. In addition, since the semiconductor light emitting element, the first light collecting member, the phosphor optical element, and the reflecting member are all attached to one holding member (that is, the base), these elements and members The relative displacement is further suppressed.

  For example, in one aspect of the light projecting device according to the present disclosure, the holding member may be disposed on the base. That is, the base may be a separate member from the holding member.

  With this configuration, since the base that holds the semiconductor light emitting element and the first light collecting member is a separate member from the holding member that holds the phosphor optical element, the position of the base and the holding member can be adjusted. Thus, the spot position of the laser light from the semiconductor light emitting element can be adjusted on the phosphor optical element. In addition, after adjusting the position of the base and the holding member, the holding member can be firmly fastened to the base with screws or the like, so that the spot position of the laser light on the phosphor optical element due to a change in the external environment The deviation from the desired position can be further suppressed.

  In addition, for example, a second light collector disposed between the first light collecting member and the phosphor optical element and emitting light collected by the first light collecting member to the phosphor optical element. An optical member may be further provided, and the second light collecting member may be attached to the base so as to be movable in a direction perpendicular to the optical axis of the light collected by the first light collecting member.

  With this configuration, the spot position of the laser light on the phosphor optical element can be further accurately adjusted by the second light collecting member.

  Further, in one aspect of the light projecting device according to the present disclosure, an attachment member different from the reflection member may be attached to an opening of the through hole opposite to the side on which the reflection member is attached. .

  With this configuration, the through-hole is used not only for the reflection member but also for the light projection device. For example, the through-hole is used for attachment of the attachment member provided in the vehicle. Therefore, the reflection member and the attachment member are accurately held at desired positions. Can be installed on.

  In addition, the light projecting device according to the present disclosure includes a semiconductor light emitting element that emits laser light, a condensing member that condenses the laser light emitted from the semiconductor light emitting element, and laser light emitted from the condensing member. A phosphor optical element, a reflecting member that changes the angle of the light wavelength-converted by the phosphor optical element, and a holding member that holds the reflecting member, and a through hole is formed in the holding member The reflective member is attached to the opening on one side of the through hole, and another member different from the reflective member is attached to the opening on the other side of the through hole.

  With this configuration, since the through hole is used as a common positioning, the relative position between the reflecting member and the mounting member different from the reflecting member can be adjusted with high accuracy. That is, according to the light projecting device according to the present disclosure, it is possible to accurately position each member.

  Moreover, in one aspect of the light projecting device according to the present disclosure, the attachment member may be a heat dissipation member.

  With this configuration, heat can be radiated by the heat radiating member from the side opposite to the reflecting member through the holding member. In particular, when the base is provided with a base for holding the semiconductor light emitting element and the light collecting member, and the base is a holding member, the semiconductor light emitting element is attached to the holding member, so that the heat dissipation path from the semiconductor light emitting element to the heat dissipation member Can be shortened. Thereby, the heat from the semiconductor light emitting element is efficiently radiated from the heat radiating member through the holding member.

  In addition, the method for manufacturing the light projecting device according to the present disclosure adjusts the position of the light condensing member that condenses the laser light emitted from the semiconductor light emitting element with reference to the position of the through hole formed in the holding member. Thus, after adjusting the spot position of the laser beam on the phosphor optical element and adjusting the spot position, the laser beam and the fluorescence emitted from the phosphor optical element by being excited by the laser beam are reflected. The reflective member is attached to the holding member by fitting a boss provided on the reflective member into the through hole.

  According to such a manufacturing method, the spot position of the laser light on the phosphor optical element is based on the through hole to which the reflecting member is attached. Therefore, the positional accuracy between the spot position on the phosphor optical element and the reflecting member is improved. That is, according to the method for manufacturing the light projecting device according to the present disclosure, it is possible to accurately position each member. In particular, it is possible to suppress a deviation from a desired light distribution characteristic when irradiating far away with the light projecting device.

  According to the light projecting device and the like according to the present disclosure, it is possible to accurately position each member.

FIG. 1 is a perspective view illustrating the configuration of the light projecting device according to the first embodiment of the present disclosure. FIG. 2 is an exploded perspective view illustrating the configuration of the light projecting device according to the first embodiment of the present disclosure. FIG. 3 is a cross-sectional view illustrating a configuration of the light projecting device according to the first embodiment of the present disclosure. FIG. 4 is a perspective view illustrating a configuration of a heat dissipation member attached to the light projecting device according to the first embodiment of the present disclosure. FIG. 5 is a first perspective view illustrating the configuration of the spot position adjustment facility of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 6 is a second perspective view illustrating the configuration of the spot position adjustment facility of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 7 is a front view illustrating a method for adjusting the spot position of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 8 is a partially enlarged perspective view illustrating a method for adjusting the spot position of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 9 is a cross-sectional view illustrating a method for adjusting the spot position of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 10A is a partially enlarged perspective view illustrating a first example of spot position adjustment of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 10B is a partially enlarged perspective view illustrating a second example of spot position adjustment of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 11 is a perspective view illustrating a third example of spot position adjustment of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 12 is a perspective view illustrating a fourth example of spot position adjustment of the light source device included in the light projecting device according to Embodiment 1 of the present disclosure. FIG. 13 is a perspective view of the configuration of the light projecting device according to the first embodiment of the present disclosure as viewed from the back side. FIG. 14 is a perspective view illustrating a state in which the reflecting member is attached to the light source device in the light projecting device according to the first embodiment of the present disclosure. FIG. 15 is a perspective view illustrating a state in which the light projecting device according to the first embodiment of the present disclosure is attached to the heat radiating member. FIG. 16 is a perspective view illustrating the configuration of the light projecting device according to the second embodiment of the present disclosure. FIG. 17 is a cross-sectional view illustrating the configuration of the light projecting device according to the second embodiment of the present disclosure. FIG. 18 is an exploded perspective view illustrating the configuration of the light projecting device according to the second embodiment of the present disclosure. FIG. 19 is a front view illustrating spot position adjustment of the light source device included in the light projecting device according to Embodiment 2 of the present disclosure. FIG. 20 is a perspective view illustrating the configuration of the light source device included in the light projecting device according to the second embodiment of the present disclosure. FIG. 21A is a perspective view of a configuration of a phosphor element holding member included in the light projecting device according to Embodiment 2 of the present disclosure when viewed from the front side. FIG. 21B is a perspective view of the phosphor element holding member provided in the light projecting device according to Embodiment 2 of the present disclosure as viewed from the back side, explaining the configuration of the phosphor element holding member. FIG. 22 is a diagram illustrating a configuration of a conventional light projecting device.

  Embodiments of the present disclosure will be described below with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present disclosure. Therefore, the numerical values, components, arrangement positions and connection forms of components, steps (steps), and the order of the steps, etc. shown in the following embodiments are merely examples, and are not intended to limit the present disclosure. . Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept of the present disclosure are described as arbitrary constituent elements.

  Each figure is a mimetic diagram and is not necessarily illustrated strictly. Accordingly, the scales and the like do not necessarily match in each drawing. In each figure, substantially the same components are denoted by the same reference numerals, and redundant descriptions are omitted or simplified.

  In the following embodiments, expressions using “abbreviations” such as substantially coincidence are used. For example, approximately matching not only means that they are completely matched, but also means that they are substantially matched, that is, include a difference of, for example, several percent.

(Embodiment 1)
Hereinafter, the light projecting device according to the first embodiment of the present disclosure will be described with reference to the drawings.

  FIG. 1 is a perspective view illustrating a configuration of a light projecting device 101 according to the first embodiment of the present disclosure. FIG. 2 is an exploded perspective view illustrating the configuration of the light projecting device 101 according to the first embodiment of the present disclosure. FIG. 3 is a cross-sectional view illustrating the configuration of the light projecting device 101 according to the first embodiment of the present disclosure. 3 is a cross-sectional view taken along line III-III in FIG. Further, in FIG. 1 and FIG. 2, the illustration of the power cable 70 is omitted.

  As shown in FIGS. 1 to 3, the light projecting device 101 according to the first embodiment includes the light source device 1 and a reflecting member 150 that reflects the radiated light 91 emitted from the light source device 1 in a predetermined direction. Prepare. Specifically, the light projecting device 101 includes a semiconductor light emitting element 11 that emits emitted light 12 that is laser light, and a first condenser lens 20 that condenses the emitted light 12 emitted from the semiconductor light emitting element 11. The phosphor optical element 30 irradiated with the emitted light 12 from the first condenser lens, the reflecting member 150 that changes the angle of the fluorescence 93 wavelength-converted by the phosphor optical element 30, and the phosphor optical element 30 And a base (holding member) 40 that holds the reflecting member 150. For example, the light projecting device 101 is disposed in a vehicle and is used for a headlamp of the vehicle.

[Light source device]
As shown in FIGS. 1 to 3, the light source device 1 included in the light projecting device 101 according to the first embodiment of the present disclosure is on the side from which the semiconductor light emitting device 10 and the laser light emitted from the semiconductor light emitting device 10 are emitted. The first condensing lens (first condensing member) 20 disposed and a first condensing lens holder 21 that holds the first condensing lens 20 are provided. Further, the light source device 1 has a second condensing lens (second condensing member) on the side where the emitted light 12 which is laser light emitted from the semiconductor light emitting device 10 is further emitted from the first condensing lens 20. ) 23. Specifically, the second condenser lens 23 is located on the optical path of the emitted light 12 and between the first condenser lens 20 and the phosphor optical element 30. The semiconductor light emitting device 10, the first condenser lens 20, the first condenser lens holder 21, and the second condenser lens 23 are fixed to the base 40.

  Further, the light source device 1 further includes a phosphor optical element 30 that is irradiated with emitted light 12 that is laser light emitted from the semiconductor light emitting device 10. The phosphor optical element 30 is fixed to the base 40.

  The base 40 is a holding member that holds the phosphor optical element 30 and the reflecting member 150. Although the material employ | adopted as the base 40 is not specifically limited, For example, it is a metal material. In the first embodiment, the base 40 further holds the semiconductor light emitting element 11 (specifically, the semiconductor light emitting device 10), the first condenser lens 20, and the second condenser lens 23.

  On the base 40, the reflection member 150 for projecting by changing the radiation angle of the radiated light 91 from the light source device 1 can be mounted. Specifically, the base 40 is formed with a through hole to which the reflecting member 150 is attached. More specifically, the base member 40 is fitted with the first reference boss 151 and the second reference boss 152 which are convex portions of the reflection member 150, so that the reflection member 150 is attached to the base 40. A first reference hole 52 and a second reference hole 53 which are two through holes to be attached are formed. The first reference hole 52 and the second reference hole 53 are through-holes, and pass through the base 40 from the surface side where the reflecting member 150 is attached to the surface opposite to the surface. It has become.

  The first reference hole 52 and the second reference hole 53 are the same as the number of bosses (specifically, the first reference boss 151 and the second reference boss 152) formed in the reflecting member 150. It only has to be formed. In the present embodiment, the light projecting device 101 has two each of the first reference hole 52 and the second reference hole 53 and the boss of the reflecting member 150, but may have three or more each. Good.

  The semiconductor light emitting device 10 includes a semiconductor light emitting element 11 in which an optical waveguide is formed, and a package for mounting the semiconductor light emitting element 11. The internal space of the package included in the semiconductor light emitting device 10 is a sealed space, where the semiconductor light emitting element 11 is disposed, and high airtightness is maintained so that the semiconductor light emitting element 11 is shielded from the atmosphere outside the package. ing.

  The semiconductor light emitting element 11 is, for example, a semiconductor laser element (for example, a laser chip) made of a nitride semiconductor, and emits blue laser light having a peak wavelength between 380 nm and 490 nm. Radiates as 12.

  The semiconductor light emitting device 10 is disposed on the base 40. Examples of means for mounting the semiconductor light emitting device 10 on the base 40 include means for fixing by bonding or soldering. In the present embodiment, it is fixed in a pressed state to an arbitrary surface of the base 40 by a ring screw 18 having a cylindrical shape and a threaded outer peripheral portion.

  Thereby, the semiconductor light emitting device 10 is thermally and physically connected to the base 40.

  The first condenser lens 20 is a finite lens, and is fixed to the first condenser lens holder 21 by bonding or the like. The first condenser lens unit 22 composed of the first condenser lens 20 and the first condenser lens holder 21 has a size of the emitted light 12 (laser light emitted from the semiconductor light emitting element 11 ( Specifically, it is configured to be movable in the optical axis direction of the emitted light 12 so as to change the spot diameter. In the present embodiment, the first condenser lens unit 22 (specifically, the first condenser lens holder 21) has a structure that is pressed against the base 40 by the first pressing spring 24. ing.

  Like the first condenser lens 20, the second condenser lens 23 is a finite lens. In the present embodiment, the second condenser lens 23 is provided with a second pressing spring 25 (see FIG. 8) described later. 1 is pressed against one condenser lens holder 21. The second condenser lens 23 is configured to be movable in the X1 axis and the Y1 axis (see FIG. 9), which are directions orthogonal to the emission axis direction of the emitted light 12. That is, the second condenser lens 23 is attached to the base 40 so as to be movable in a direction orthogonal to the optical axis of the light collected by the first condenser lens 20. By moving the second condenser lens 23 to the X1 axis and the Y1 axis shown in FIG. 9, the spot position of the emitted light 12 on the phosphor optical element 30 is moved, and the phosphor optical element 30 of the emitted light 12 is moved. The position of the spot on the top can be adjusted.

  According to such a configuration, the spot position of the emitted light 12 on the phosphor optical element 30 can be further accurately adjusted by the second condenser lens 23.

  Adjustment of the size and position of the spot of the emitted light 12 on the phosphor optical element 30 will be described later with reference to FIGS. 11 and 12.

  In the first embodiment, the size and position of the spot are adjusted using the two condenser lenses of the first condenser lens 20 and the second condenser lens 23. The adjustment may be performed by moving in the three-axis direction with the optical lens. That is, the light projecting device 101 may include only the first condenser lens 20 without including the second condenser lens 23, for example.

  A power supply FPC (Flexible Printed Circuits) 36 is a flexible substrate on which a wiring pattern that is a metal wiring for supplying power to the semiconductor light emitting device 10 is formed. The main surface of the power supply FPC 36 is joined to the lead pins of the semiconductor light emitting device 10 by solder or the like, and the back surface opposite to the main surface of the power supply FPC 36 has conductivity formed on the substrate 37. Bonded to the wiring pattern with solder or the like.

  On the substrate 37, a connector 38 for supplying power from the outside is disposed. The substrate 37 is fixed to the base 40 by a first screw 39.

  The phosphor optical element 30 is fixed on the base 40 by adhesion or soldering. The phosphor optical element 30 is an example of a wavelength conversion element that emits fluorescence 93 by converting the wavelength of incident outgoing light 12.

The phosphor optical element 30 emits fluorescence using the incident outgoing light 12 as excitation light. The phosphor optical element 30 is made of, for example, a cerium-activated yttrium aluminum garnet (YAG: Ce ³⁺ ) -based phosphor material (phosphor particles). As the phosphor optical element 30, for example, phosphor particles such as YAG: Ce ³⁺ mixed and dispersed in a transparent resin (binder) such as glass or silicone may be used. A ceramic phosphor plate formed by mixing and sintering phosphor particles such as YAG: Ce ³⁺ and alumina (Al ₂ O ₃ ) or the like may be used. Note that the phosphor material constituting the phosphor optical element 30 is not limited to the YAG system.

  The phosphor optical element 30 diffuses and emits fluorescence 93 obtained by converting a part of the incident outgoing light 12 into a wavelength band different from the blue wavelength band. The outgoing light 12 that has not been wavelength-converted by the phosphor optical element 30 is diffused by the phosphor optical element 30 to become scattered light 92. The light 93 having the two wavelengths of the diffused fluorescence 93 and the scattered light 92 is combined (that is, mixed) to generate a radiated light 91 having a predetermined color. Light of each wavelength (that is, scattered light and fluorescence 93) is taken into the reflecting member 150 for projecting forward while changing the radiation angle, and is projected onto the target area as radiation light 91.

  The light source device 1 further includes a translucent cover 33 arranged above the phosphor optical element 30. In the present specification, the side on which the semiconductor light emitting device 10, the phosphor optical element 30, the reflecting member 150, etc. are arranged may be described as the upper side and the opposite side as the lower side when viewed from the base 40.

  The translucent cover 33 is fixed to the translucent cover holding member 34 by means such as adhesion. The semiconductor light emitting device 10 and the phosphor optical element 30 may be disposed in a closed space surrounded by the base 40, the translucent cover holding member 34, and the translucent cover 33.

  With this configuration, it is possible to suppress the dust from collecting dust and dust from the outside due to the optical tweezer effect by the emitted light having a high light density, thereby reducing the efficiency of the optical member.

[Light projector]
Subsequently, the light projecting device 101 using the light source device 1 according to the first embodiment of the present disclosure will be described with reference to FIGS. The light projecting device 101 is, for example, a lamp for a vehicle headlamp (that is, a headlamp).

  As shown in FIG. 3, the light projecting device 101 includes a heat radiating member (attachment member) 60, a light source device 1 attached to the heat radiating member 60, and light emitted from the light source device 1 (specifically, scattered light 92. And a reflecting member 150 that reflects the fluorescent light 93). That is, the light source device 1 is used as a light source of the light projecting device 101.

  In addition, as shown in FIG. 2, the first reference boss 151 and the second reference boss 152 which are two reference bosses formed on the reflecting member 150 are connected to the second reference hole of the base 40. By being inserted into the first reference hole 52 and the second reference hole 53, they are fixed with high precision.

  The reflection member 150 is an optical member that changes the directions of scattered light 92 and fluorescence 93 that are light emitted from the light source device 1. The reflecting member 150 is formed on the base 40 with the first reference boss 151 fitted into the first reference hole 52 and the second reference boss 152 fitted into the second reference hole 53. Further, the base plate 40 is fixed by being fastened by two third screws 51 screwed into the two first mounting holes 54.

  The heat dissipation member 60 is an example of an attachment member to which the light projecting device 101 is attached, and is, for example, a heat sink. The heat radiating member 60 includes a base plate 61 for transferring heat generated in the light source device 1 to the heat radiating fins 62 and a heat radiating fin 62 for radiating heat generated in the light source device 1 to the outside air.

  As shown in FIG. 2, the light source device 1 is attached to the attachment portion 61 a of the base plate 61. The attachment surface of the attachment part 61a is a flat surface, for example. For example, the light source device 1 is fixed to the mounting portion 61 a by the second screw 41. As shown in FIG. 3, a power cable 70 that supplies power to the light source device 1 to turn on the light projecting device 101 is connected to the connector 38 of the light source device 1.

  FIG. 4 is a perspective view illustrating the configuration of the heat radiating member 60 attached to the light projecting device 101 according to the first embodiment of the present disclosure. Specifically, FIG. 4 is a perspective view illustrating a configuration of a heat dissipation member 60 that is an example of an attachment member to which the light source device 1 is attached.

  As shown in FIG. 4, the mounting portion 61 a of the heat radiating member 60 has four screw portions 65 that engage with the second screw 41 that fixes the light source device 1. In addition, a first reference pin 63 and a second reference pin 64 are formed on the attachment portion 61 a of the heat dissipation member 60 in order to accurately install the light source device 1 at a desired position of the heat dissipation member 60. Yes. Specifically, when the first reference pin 63 and the second reference pin 64 are fitted into the first reference hole 52 and the second reference hole 53 shown in FIG. It is installed with high precision at 60 desired positions. That is, an attachment member (this embodiment) different from the reflection member 150 is provided in the opening on the opposite side of the first reference hole 52 and the second reference hole 53 that are through holes to the side on which the reflection member 150 is attached. Then, a heat radiating member 60) is attached.

  According to this configuration, the reflecting member 150 and the heat radiating member can be attached to the base (holding member) 40 at a desired position with high accuracy.

  In the first embodiment, the base 40 holds the phosphor optical element 30 and the reflecting member 150, and further holds the semiconductor light emitting element 11 and the first condenser lens 20.

  According to this configuration, the semiconductor light emitting element 11, the first condenser lens 20, the phosphor optical element 30, and the reflecting member 150 are all attached to one holding member (that is, the base 40). There is no need for these elements and new additional members to attach the members. Therefore, according to such a configuration, the light projecting device 101 can be manufactured at low cost. In addition, since the semiconductor light emitting element 11, the first condenser lens 20, the phosphor optical element 30, and the reflecting member 150 are all attached to one holding member (that is, the base 40), these elements. , And relative displacement of the member is further suppressed.

[Spot position adjustment]
Then, the adjustment method of the spot position of the emitted light 12 on the fluorescent substance optical element 30 with which the light projector 101 which concerns on this Embodiment is provided is demonstrated using FIGS.

  Factors that cause a spot 31 (for example, see FIG. 7) on the phosphor optical element 30 to deviate from a desired position include variations in the position of the semiconductor light emitting element 11 and variations in the position and / or inclination of the first condenser lens 20. There are variations in the position and / or inclination of the second condenser lens 23, variations in the position of the phosphor optical element 30, and variations in the shape of parts due to casting or processing of the base 40.

  When all the members included in the light projecting device 101 have no variation in the shape of the members and no variation in the attachment, the spot of the emitted light 12 on the phosphor optical element 30 comes to a position as designed.

  However, due to the above-described variation, the spot position of the emitted light 12 on the phosphor optical element 30 may be shifted by about 1 mm from the designed position. Therefore, if the position of the spot of the emitted light 12 on the phosphor optical element 30 is shifted, the positions of the scattered light 92 and the fluorescence 93 reflected by the reflecting member 150 are shifted from the desired positions. There is a problem that the position of the maximum light intensity of the radiated light 91 of the radiated light 91 far away from the light projecting device 101 greatly deviates from the desired position.

  Therefore, the position adjustment of the spot of the emitted light 12 on the phosphor optical element 30 is an essential adjustment.

  FIG. 5 is a first perspective view illustrating the configuration of the spot position adjustment facility of the light source device 1 included in the light projecting device 101 according to the first embodiment of the present disclosure. In other words, FIG. 5 is a conceptual configuration diagram of spot position adjusting equipment for adjusting the position of the spot of the emitted light 12 on the phosphor optical element 30.

  The base 80 is a work mounting base of a spot position adjusting facility for adjusting the spot position of the emitted light 12 on the phosphor optical element 30, and the work of the facility (in this embodiment, the base of the light source device 1) 40) A mounting base 80 for mounting is provided with a third reference pin 82 and a fourth reference pin 83 in order to mount the workpiece with high accuracy.

  In addition, an observation lens 81 is installed in the spot position adjusting equipment in order to observe the position and the size of the spot of the emitted light 12 on the phosphor optical element 30. The position of the observation lens 81 is set with high accuracy so that the relative positional relationship with the third reference pin 82 and the fourth reference pin 83, which are the reference for setting the base 40, does not change.

  By inserting the first reference hole 52 and the second reference hole 53 formed in the base 40 into the third reference pin 82 and the fourth reference pin 83 formed in the base 80, the base 40 Is installed on the base 80.

  FIG. 6 is a second perspective view illustrating the configuration of the spot position adjustment facility of the light source device 1 included in the light projecting device 101 according to the first embodiment of the present disclosure. Specifically, FIG. 6 is a diagram illustrating a state where the base 40 is installed on the base 80.

  The base 40 is fixed to the installation surface 80 a of the base 80 that can be observed with the observation lens 81 so as not to move from the base 80 by being pressed by a pressing member (not shown).

  Then, the adjustment method of the spot position of the emitted light 12 on the fluorescent substance optical element 30 is demonstrated using FIGS.

  FIG. 7 is a front view (top view) illustrating a method for adjusting the spot position of the light source device 1 included in the light projecting device 101 according to the first embodiment of the present disclosure. FIG. 7 is a front view showing a state in which the base 40 is installed on the base 80 of the spot position adjusting facility of the light source device 1.

  Of the two through holes formed in the base 40, the first reference hole 52 is a circular hole in a top view. Of the two reference holes formed in the base 40, the second reference hole 53 is in the shape of a long hole that is long in the direction of alignment with the first reference hole 52. The two reference holes are accurately formed in the base 40 by casting or processing. In this way, the through hole formed in the base 40 includes the first reference hole 52 that is a circular hole and the second reference hole 53 that is a long hole, and the second reference hole 53 that is a long hole. Is elongated in the direction in which the first reference hole 52 and the second reference hole 53 are arranged. With this configuration, it is possible to attach the reflecting member 150 to the base 40 with high positional accuracy.

  A virtual line connecting the center of the first reference hole 52 in the top view and the center of the second reference hole 53 in the top view is the first reference axis 84. That is, the first reference hole 52 and the second reference hole 53 are arranged side by side in a direction parallel to the first reference axis 84. Further, the second reference hole 53 is a long hole having a long top view shape in a direction parallel to the first reference axis 84.

  A virtual line passing through the center of the first reference hole 52 in a top view and orthogonal to the first reference axis 84 is the second reference axis 85.

  In the position adjustment of the spot 31 of the emitted light 12 on the phosphor optical element 30 according to the first embodiment of the present disclosure, the second condensing lens 23 is moved to two axes of the first reference axis 84 and the second reference axis 85. , The spot 31 on the phosphor optical element 30 is moved from the first reference axis 84 to the direction perpendicular to the first reference axis 84 shown in FIG. The distance X0 and the second reference axis 85 are adjusted to Y0 which is a distance in a direction orthogonal to the second reference axis 85.

  FIG. 8 is a partially enlarged perspective view illustrating a method for adjusting the spot position of the light source device 1 included in the light projecting device 101 according to the first embodiment of the present disclosure. Specifically, FIG. 8 is a conceptual diagram of equipment for explaining a mechanism for moving the first condenser lens unit 22 and the second condenser lens 23. FIG. 9 is a cross-sectional view illustrating a method for adjusting the position of the spot 31 of the light source device 1 included in the light projecting device 101 according to Embodiment 1 of the present disclosure. FIG. 9 illustrates definitions of the Z1 axis, the X1 axis, and the Y1 axis. Specifically, the X1 axis, the Y1 axis, and the Z1 axis are 3-axis orthogonal systems, and the Z1 axis is a direction parallel to the optical axis of the light emitted from the first condenser lens 20, The X1 axis and the Y1 axis are directions orthogonal to the Z1 axis. Further, the X1 axis and the Y1 axis are directions orthogonal to each other.

  As shown in FIG. 8, the first condenser lens holder 21 holding the first condenser lens 20 is pressed against the base 40 by the first pressing spring 24, and the direction of the emitted light 12. It is configured to be movable. The direction in which the first condenser lens holder 21 is movable is the Z1 axis direction shown in FIG. The two first adjustment pins 86 arranged on the base 80 are inserted into the recesses 27 of the first condenser lens holder 21 formed in the first condenser lens holder 21 and move in the Z1 axis direction. It is a member for. In other words, the first condenser lens holder 21 is attached to the base 40 so as to be movable in the Z1 axis direction by the two first adjustment pins 86.

  FIG. 10A is a partially enlarged perspective view illustrating a first example of position adjustment of the spot 31 of the light source device 1 included in the light projecting device 101 according to Embodiment 1 of the present disclosure. FIG. 10B is a partially enlarged perspective view illustrating a second example of position adjustment of the spot 31 of the light source device 1 included in the light projecting device 101 according to Embodiment 1 of the present disclosure. FIG. 10A is an example of a state in which the size adjustment of the spot 31 is completed, and the size of the spot 31 shown in FIG. 10B is reduced. 10B is a diagram illustrating the state of the spot 31 when the first condenser lens 20 is moved in the negative Z1 axis direction illustrated in FIG. 9 from the state illustrated in FIG. 10A.

  As shown in FIG. 9, FIG. 10A, and FIG. 10B, the spot 31 on the phosphor element is sized by moving the first condenser lens holder 21, that is, the first condenser lens 20, in the Z1 axis direction. Changes.

  In the adjustment of the size of the spot 31 on the phosphor optical element 30, the adjustment is performed so that the size of the spot 31 is less than or equal to some extent. By doing so, the light source device 1 can ensure light intensity, that is, luminance.

  Further, as shown in FIG. 8, the second condenser lens 23 is pressed against the first condenser lens holder 21 by the second pressing spring 25 fixed to the base 40 with the fourth screw 26. Has been. The two second adjustment pins 87 arranged on the base 80 are provided with a mechanism for grasping (in other words, pinching) the second condenser lens 23, and the second condenser lens 23 is shown in FIG. It is possible to move in the X1 axis direction and the Y1 axis direction shown in FIG.

  FIG. 11 is a perspective view illustrating a third example of position adjustment of the spot 31 of the light source device 1 included in the light projecting device 101 according to Embodiment 1 of the present disclosure. FIG. 12 is a perspective view illustrating a fourth example of the position adjustment of the spot 31 of the light source device 1 included in the light projecting device 101 according to the first embodiment of the present disclosure.

  As shown in FIG. 11A, when the second condenser lens 23 moves in the negative X1-axis direction, as shown in FIG. 11B, the spot 31 on the phosphor optical element 30 is 2 to the condenser lens 23 side. Further, when the second condenser lens 23 moves in the positive direction of the X1 axis, the spot 31 on the phosphor optical element 30 moves away from the second condenser lens 23.

  Also, as shown in FIG. 12A, when the second condenser lens 23 moves in the Y1-axis positive direction, the spot 31 on the phosphor optical element 30 is changed as shown in FIG. , Move in Y1 axis positive direction. When the second condenser lens 23 moves in the Y1 axis negative direction, the spot 31 on the phosphor optical element 30 moves in the Y1 axis negative direction.

  As described above, in the first embodiment of the present disclosure, the position of the spot 31 on the phosphor optical element 30 is adjusted by moving the second condenser lens 23 in the X1 axis direction and / or the Y1 axis direction. Is going.

  In the first embodiment of the present disclosure, the size of the spot 31 is adjusted by adjusting the first condenser lens 20, and the spot position is adjusted by adjusting the second condenser lens 23. The size of the spot 31 and the position adjustment of the spot 31 may be adjusted by moving one condenser lens in the Z1 axis direction, the X1 axis direction, and / or the Y1 axis direction.

  FIG. 13 is a perspective view of the configuration of the light projecting device 101 according to the first embodiment of the present disclosure as viewed from the back side. FIG. 14 is a perspective view illustrating a state in which the reflecting member 150 is attached to the light source device 1 in the light projecting device 101 according to the first embodiment of the present disclosure.

  As shown in FIG. 13, in the spot 31 position adjustment method shown in FIGS. 10A to 12, the spot 31 on the phosphor optical element 30 is connected to the first reference hole 52 formed in the base 40. The position is accurately adjusted with respect to the second reference hole 53.

  Further, by making the two first reference holes 52 and the second reference hole 53 into through holes, the first reference hole 52 and the second reference hole 53 which are the two through holes are provided above. The side is used for positioning the reflecting member 150.

  Further, as shown in FIG. 14, the first reference boss 151 and the second reference boss 152 which are two reference bosses formed on the reflecting member 150 are respectively connected to the two reference holes of the base 40. The reflective member 150 is fixed to the base 40 with high positional accuracy by being inserted into a certain first reference hole 52 and second reference hole 53.

  As described above, the method for manufacturing the light projecting device 101 according to the present disclosure is based on the positions of the first reference hole 52 and the second reference hole 53 that are the through holes formed in the base 40 that is the holding member. As described above, the position of the first condensing lens 20 and the second condensing lens 23 that condenses the emitted light 12 that is the laser light emitted from the semiconductor light emitting element 11 is adjusted, thereby adjusting the position on the phosphor optical element 30. The position of the spot 31 of the emitted light 12 is adjusted. Further, after adjusting the position of the spot 31, the first reference boss 151 provided on the reflecting member 150 that reflects the emitted light 12 and the fluorescence 93 that is excited by the emitted light 12 and emitted from the phosphor optical element 30, and The reflective member 150 is attached to the base 40 by fitting the second reference boss 152 into the first reference hole 52 and the second reference hole 53.

  According to such a manufacturing method, the position of the spot 31 on the phosphor optical element 30 of the emitted light 12 is set to the first reference hole 52 and the second reference hole 53 which are through holes to which the reflecting member 150 is attached. Is the standard. Therefore, the position accuracy of the spot 31 on the phosphor optical element 30 and the reflecting member 150 is improved. That is, according to the manufacturing method of the light projecting device 101 according to the present disclosure, the alignment of each member can be made with high accuracy. In particular, deviation from a desired light distribution characteristic can be suppressed when a long distance is irradiated by the light projecting device 101.

  That is, since the position of the spot 31 on the phosphor optical element 30 and the reflecting member 150 are based on the same location (the first reference hole 52 and the second reference hole 53) formed in the base 40, This leads to improvement in the accuracy of the installation position of the spot 31 on the phosphor optical element 30 of the light source device 1 and the reflecting member 150. In particular, when the light projecting device 101 irradiates far away, it is possible to suppress the deviation of the light distribution characteristics due to the manufacture of the light projecting device 101.

  Further, in order to enable the above-described manufacturing method, the light projecting device 101 is formed with a first reference hole 52 and a second reference hole 53 in which the reflecting member 150 is attached to the base 40.

  According to such a configuration, the light projecting device 101 can accurately position each member (specifically, an optical member) included in the light projecting device 101. In particular, it is possible to suppress a deviation from a desired light distribution characteristic when irradiating far away with the light projecting device.

  After the position of the spot 31 is adjusted, the first condenser lens 20 (specifically, the first condenser lens unit 22), the second condenser lens 23, and the reflecting member 150 are It may be fixed to the base 40 with an adhesive or the like.

  In the future, in order to further improve the brightness of the light projecting device 101, it is expected that the spot shape of the light emitted from the light projecting device 101 needs to be reduced. Therefore, it is strongly required to adjust the positional relationship between the position of the spot 31 and the reflecting member 150 with high accuracy. If the positional relationship between the position of the spot 31 and the reflecting member 150 is not accurately adjusted, the light characteristics of the light projecting device 101 such as light distribution will be deteriorated. In the future, it is considered that the demand for downsizing of the light projecting device 101 will increase. Therefore, it is necessary to reduce the focal length of the reflecting member 150, and the positional relationship between the position of the spot 31 and the reflecting member 150 particularly affects the light distribution characteristics when the light projecting device 101 irradiates far away.

  FIG. 15 is a perspective view illustrating a state in which the light projecting device 101 according to the first embodiment of the present disclosure is attached to the heat dissipation member 60.

  As described above, the position reference when assembling each member of the light projecting device 101 is the first reference hole 52 and the second reference hole 53 formed in the base 40.

  Here, as shown in FIG. 15, when the light projecting device 101 is installed on the heat radiating member 60, which is an example of a mounting member different from the other reflecting members 150, the first reference pin formed on the heat radiating member 60. 63 and the second reference pin 64 are inserted and installed in the first reference hole 52 and the second reference hole 53 formed in the base 40. As described above, the opening of the first reference hole 52 and the second reference hole 53 that are the through holes on the side opposite to the side where the reflecting member 150 is attached is a heat dissipation that is an attachment member different from the reflecting member 150. A member is attached.

  Thus, even when the light source device 1 is attached to the heat dissipation member 60, desired light distribution characteristics can be obtained.

  Further, according to such a configuration, when the light projecting device 101 is used as, for example, an in-vehicle headlight, the reference position for installing the light projecting device 101 in the vehicle becomes clear. It is not necessary to adjust the direction of the optical axis.

  Further, for example, by using a heat radiating member as an attachment member to which the light source device 1 is attached, a heat path from the semiconductor light emitting element 11 to the heat radiating fins 62 can be reliably secured as shown in FIG. The temperature rise of the element 11 is further suppressed.

(Embodiment 2)
Hereinafter, the light projecting device according to the second embodiment of the present disclosure will be described with reference to the drawings. In the second embodiment, only the parts different from the first embodiment will be mainly described, and the components substantially the same as those in the first embodiment will be denoted by the same reference numerals, and the overlapping description will be partially omitted. Or it may be simplified.

[Constitution]
Hereinafter, the light projecting device according to the second embodiment of the present disclosure will be described with reference to FIGS. 16 to 21B.

  The light projecting device according to the second embodiment is different from the light projecting device according to the first embodiment, and the member to which the phosphor optical element 30 is attached is not the base 40 but the second base different from the base 40. That is, there is a phosphor element holding member arranged on the base.

  FIG. 16 is a perspective view for explaining the configuration of the light projecting device 101a according to the second embodiment of the present disclosure. FIG. 17 is a cross-sectional view for explaining the configuration of the light projecting device 101a according to the second embodiment of the present disclosure. Specifically, FIG. 17 is a cross-sectional view showing a cross section of the light projecting device 101a along the line XVII-XVII in FIG. FIG. 18 is an exploded perspective view for explaining the configuration of the light projecting device 101a according to the second embodiment of the present disclosure.

  As shown in FIGS. 16 to 18, the light source device 1 a includes a semiconductor light emitting device 10, a first condenser lens 20 disposed on the side from which the laser light emitted from the semiconductor light emitting device 10 is emitted, And a first condenser lens holder 21 that holds the condenser lens 20. The light source device 1 a further includes a second condenser lens 23 on the side from which the emitted light 12, which is laser light emitted from the semiconductor light emitting device 10, is emitted from the first condenser lens 20. The semiconductor light emitting device 10, the first condenser lens 20, the first condenser lens holder 21, and the second condenser lens 23 are fixed to a second base (base) 42.

  Further, as shown in FIG. 17, the light source device 1a includes a phosphor optical element 30 to which the laser light emitted from the semiconductor light emitting device 10 is irradiated. The phosphor optical element 30 is fixed to the phosphor holding member 55 by soldering or adhesion, and is disposed on the second base 42. The phosphor holding member 55 is fixed to the second base 42 after adjusting the spot 31 (see FIG. 19) on the phosphor optical element 30.

  The second base 42 is a holding member that holds the semiconductor light emitting element 11, the first condenser lens 20, and the second condenser lens 23. Although the material employ | adopted for the 2nd base 42 is not specifically limited, For example, it is a metal material. In the second embodiment, the second base 42 further holds a phosphor holding member (holding member) 55.

  The phosphor holding member 55 is a holding member that holds the phosphor optical element 30 and is attached to the second base 42.

  Further, the phosphor holding member 55 has a structure in which a reflecting member 150 for projecting by changing the radiation angle of the radiated light 91 from the light source device 1 can be mounted. Specifically, the phosphor holding member 55 is formed with a through hole to which the reflecting member 150 is attached. More specifically, the phosphor holding member 55 is fitted with the first reference boss 151 and the second reference boss 152, which are convex portions of the reflecting member 150, so that the reflecting member 150 becomes the phosphor. A third reference hole 57 and a fourth reference hole 58, which are two through holes, are attached to the holding member 55. The third reference hole 57 and the fourth reference hole 58 are through holes, and penetrate from the surface side where the reflecting member 150 is attached in the phosphor holding member 55 to the surface opposite to the surface. It is a through hole. That is, on the phosphor holding member 55, the reflecting member 150 for projecting by changing the radiation angles of the scattered light 92 and the fluorescence 93 from the light source device 1a can be mounted.

  As described above, in the second embodiment, the holding member (specifically, the second base 42) that holds the semiconductor light emitting element 11 and the first condenser lens 20, the phosphor optical element 30, and the reflection member. The holding member that holds the member 150 (specifically, the phosphor holding member 55) is formed as a separate body.

  The material employed for the phosphor holding member 55 is not particularly limited, and for example, the same material as that of the second base 42 is employed.

  Hereinafter, a method for adjusting the spot 31 on the phosphor optical element 30 will be described with reference to FIGS. 19 and 20.

  FIG. 19 is a front view for explaining the position adjustment of the spot 31 of the light source device 1a according to the second embodiment of the present disclosure. FIG. 20 is a perspective view for explaining the position adjustment of the spot 31 of the light source device 1a according to the second embodiment of the present disclosure.

  As shown in FIGS. 19 and 20, two through holes are formed in the phosphor holding member 55, and the third reference hole 57 that is one of the two through holes is circular in a top view. It is a round hole. The fourth reference hole 58, which is the other of the two through holes, has a shape of a long hole that is long in the direction of alignment with the first reference hole 52. These two through holes are accurately formed in the phosphor holding member 55 by casting or processing.

  The fourth reference hole 58 that is a long hole is elongated in the direction in which the third reference hole 57 and the fourth reference hole 58 are aligned. With this configuration, it is possible to attach the reflecting member 150 to the phosphor holding member 55 with high positional accuracy.

  A virtual line connecting the center of the circle of the third reference hole 57 in the top view and the center of the oval in the top view of the fourth reference hole 58 is the first reference axis 84a.

  A virtual line passing through the center of the circle of the third reference hole 57 in a top view and perpendicular to the first reference axis 84a is the second reference axis 85a.

  In the position adjustment of the spot 31 on the phosphor optical element 30 according to the second embodiment of the present disclosure, the phosphor holding member 55 holding the phosphor optical element 30 is moved in the X-axis direction and / or Y shown in FIG. It is carried out by moving it in the axial direction. Note that the X-axis direction and the Y-axis direction shown in FIG. 19 are directions orthogonal to each other, and the X-axis direction is a direction parallel to the optical axis of the emitted light 12 in a top view.

  By moving the phosphor holding member 55 in two directions, the X-axis direction and the Y-axis direction, the spot 31 moves the spot 31 on the phosphor optical element 30 from the position of the design value, that is, from the first reference axis 84a. X0 which is the distance in the direction orthogonal to the first reference axis 84a, and Y0 which is the distance in the direction orthogonal to the second reference axis 85a from the second reference axis 85a.

  After the spot 31 is adjusted to a desired position by adjusting the position of the phosphor holding member 55, the phosphor holding member 55 is attached to the second base 42 by the fifth screw 56 as shown in FIG. It is concluded.

  Note that the first condenser lens 20 executed by adjusting the size of the spot 31 on the phosphor optical element 30 is the same as that of the first embodiment, and thus the description thereof is omitted.

  The spot 31 on the phosphor optical element 30 is adjusted by moving the second condenser lens 23 in the first embodiment, but in the second embodiment, the phosphor holding the phosphor optical element 30. Adjustment is made by moving the holding member 55.

  In the adjustment method of the spot 31 in the first embodiment, the sensitivity of the position of the spot 31 changing when the second condenser lens 23 is moved is very high due to the design of the optical configuration of the light projecting device 101. Adjustment is required by moving the second condenser lens 23 on the order of μm.

  On the other hand, in the method for adjusting the spot 31 in the second embodiment, the sensitivity with which the position of the spot 31 changes when the phosphor holding member 55 is moved is not high as compared with the first embodiment. Therefore, the second base 42 that holds the semiconductor light emitting element 11 and the first condenser lens 20 and the phosphor holding member 55 that holds the phosphor optical element 30 and the reflecting member 150 are detachable separately. As a result, the position adjustment of the spot 31 on the phosphor optical element 30 becomes easier.

  Further, in the first embodiment, the spot 31 on the phosphor optical element 30 is adjusted by moving a relatively small optical member in the light projection device 101 called the second condenser lens 23, whereas In the second embodiment, the spot 31 on the phosphor optical element 30 is adjusted by moving a large member called the phosphor holding member 55. Therefore, it is possible to perform stable adjustment more easily and with less difference in positional deviation of the spot 31 when a plurality of the light projecting devices 101 are manufactured.

  Further, since the phosphor holding member 55 can be fastened to the second base 42 with screws, the phosphor holding member 55 can be fixed to the second base 42 easily and firmly. In this way, it is easier and more accurate to fix the phosphor holding member 55 to the second base 42 than to fix the second condenser lens 23 to the second base 42. Regarding the displacement of the position of the spot 31 due to a change in the external environment, it is possible to provide a highly reliable light projecting device 101a with little variation in the amount of displacement.

  Hereinafter, the configuration of the phosphor holding member 55 will be described with reference to FIGS. 21A and 21B.

  FIG. 21A is a perspective view of the configuration of the phosphor holding member 55 provided in the light projecting device 101a according to Embodiment 2 of the present disclosure as viewed from the front side. FIG. 21B is a perspective view when viewed from the back side for explaining the configuration of the phosphor holding member 55 provided in the light projecting device 101a according to Embodiment 2 of the present disclosure.

  The phosphor optical element 30 shown in FIG. 21A is fixed to the phosphor holding member 55 by means such as soldering or adhesion.

  The phosphor holding member 55 is formed with two through holes serving as a reference for the position of the spot 31 on the phosphor optical element 30. Specifically, in the phosphor holding member 55, as two through holes, a third reference hole 57 having a circular hole shape and a fourth reference hole 58 having a long hole shape are cast or It is formed by processing.

  Further, as shown in FIG. 21A, two second mounting holes 59 are formed in the phosphor holding member 55 in order to mount the reflecting member 150.

  As described in the adjustment of the spot 31 above, the position of the spot 31 on the phosphor optical element 30 is relative to the third reference hole 57 and the fourth reference hole 58 formed in the phosphor holding member 55. Thus, the position is adjusted with high accuracy.

  On the other hand, the reflecting member 150 can be attached to the upper side of the third reference hole 57 and the fourth reference hole 58 by using the third reference hole 57 and the fourth reference hole 58 as through holes.

  Specifically, as shown in FIG. 18, the first reference boss 151 and the second reference boss 152, which are two reference bosses formed on the reflecting member 150, are connected to the phosphor holding member 55. The reflective member 150 is attached to the phosphor holding member 55 with high accuracy by being inserted into the third reference hole 57 and the fourth reference hole 58, respectively.

  That is, the position of the spot 31 on the phosphor optical element 30 and the attachment position of the reflecting member 150 are based on the same location formed on the phosphor holding member 55, and thus on the phosphor optical element 30 of the light source device 1a. This improves the position accuracy of the spot 31 and the reflecting member 150. Therefore, especially when the light projecting device 101 irradiates far away, it is possible to suppress the deviation of the light distribution characteristics due to the manufacture of the light projecting device 101.

  The position reference when assembling each member of the light projecting device 101 is the third reference hole 57 and the fourth reference hole 58 formed in the phosphor holding member 55.

  When the light projecting device 101a is installed on the heat dissipation member 60, which is an example of an attachment member that is a member different from the reflection member 150, the first reference pin 63 and the second reference pin 64 formed on the heat dissipation member 60 Are inserted into the third reference hole 57 and the fourth reference hole 58 formed in the phosphor holding member 55, which is the reference of the position of the spot 31, and installed. Thus, even when the light projecting device 101a is attached to the heat dissipation member 60, desired light distribution characteristics can be obtained.

(Other)
As described above, the light projecting device and the method for manufacturing the light projecting device according to the present disclosure have been described based on the embodiments. However, the present disclosure is not limited to the above embodiments.

  For example, in the above-described embodiment, a through hole in which the reflecting member is attached is formed in the holding member that holds the phosphor optical element. However, the holding member in which the phosphor optical element is arranged and the holding member in which the through hole to which the reflecting member is attached are formed separately. If the positional relationship between these two holding members is fixed, the first condensing lens, the phosphor optical element, and the reflecting member can be aligned with high accuracy.

  In addition, for example, it is realized by arbitrarily combining the components and functions in each embodiment without departing from the scope of the present disclosure, or forms obtained by subjecting each embodiment to various modifications conceived by those skilled in the art Forms to be made are also included in the present disclosure.

  The present disclosure can be widely used as a light projecting device using a light source device having a semiconductor light emitting element and a phosphor element, for example, as various optical devices such as a headlight for a vehicle.

DESCRIPTION OF SYMBOLS 1, 1a Light source device 10 Semiconductor light-emitting device 11 Semiconductor light-emitting device 12 Output light 18 Ring screw 20 1st condensing lens (1st condensing member)
21 1st condensing lens holder 22 1st condensing lens unit 23 2nd condensing lens (2nd condensing member)
24 First pressing spring 25 Second pressing spring 26 Fourth screw 27 Recessed portion 30 Phosphor optical element 31 Spot 33 Translucent cover 34 Translucent cover holding member 36 FPC for power supply
37 Substrate 38 Connector 39 First screw 40 Base 41 Second screw 42 Second base (base)
51 Third screw 52 First reference hole 53 Second reference hole 54 First mounting hole (through hole)
55 Phosphor holding member (holding member)
56 5th screw 57 3rd reference hole 58 4th reference hole 59 2nd attachment hole 60 Heat dissipation member (attachment member)
61 Base plate 61a Mounting portion 62 Radiation fin 63 First reference pin 64 Second reference pin 65 Screw portion 70 Power cable 80 Base 80a Installation surface 81 Observation lens 82 Third reference pin 83 Fourth reference pin 84, 84a First reference axis 85, 85a Second reference axis 86 First adjustment pin 87 Second adjustment pin 91 Radiation light 92 Scattered light 93 Fluorescence 101, 101a Projection device 150 Reflective member 151 First reference boss 152 First 2 reference bosses

Claims (10)

A semiconductor light emitting device that emits laser light;
A first condensing member that condenses the laser light emitted from the semiconductor light emitting element;
A phosphor optical element irradiated with the laser light from the first light collecting member;
A reflecting member that changes the angle of fluorescence in which the laser light is wavelength-converted by the phosphor optical element;
A holding member for holding the phosphor optical element and the reflecting member,
A through hole is formed in the holding member,
The reflective member is attached to the through hole.
Floodlight device. The through hole is composed of a circular hole and a long hole,
The elongated hole is elongated in the direction in which the circular hole and the elongated hole are aligned.
The light projecting device according to claim 1. A base for holding the semiconductor light emitting element and the first light collecting member;
The light projecting device according to claim 1. The light projecting device according to claim 3, wherein the holding member is the base. The light projecting device according to claim 3, wherein the holding member is disposed on the base. A second condensing member that is disposed between the first condensing member and the phosphor optical element and that emits the light collected by the first condensing member to the phosphor optical element; Prepared,
The light projecting device according to claim 4, wherein the second light collecting member is attached to the base so as to be movable in a direction orthogonal to an optical axis of light condensed by the first light collecting member. apparatus. An attachment member different from the reflection member is attached to the opening of the through hole opposite to the side on which the reflection member is attached.
The light projection device according to any one of claims 1 to 6. A semiconductor light emitting device that emits laser light;
A condensing member that condenses the laser light emitted from the semiconductor light emitting element;
A phosphor optical element irradiated with the laser light from the light collecting member;
A reflecting member that changes the angle of the light whose wavelength is converted by the phosphor optical element;
A holding member for holding the reflecting member,
A through hole is formed in the holding member,
The reflective member is attached to the opening on one side of the through hole,
An attachment member different from the reflection member is attached to the opening on the other side of the through hole,
Floodlight device. The attachment member is a heat dissipation member.
The light projection device according to claim 7 or 8. The spot of the laser light on the phosphor optical element is adjusted by adjusting the position of the condensing member that condenses the laser light emitted from the semiconductor light emitting element with reference to the position of the through hole formed in the holding member. Adjust the position,
After adjusting the spot position, a boss provided on a reflection member that reflects the fluorescence emitted from the phosphor optical element by being excited by the laser light and the laser light is fitted into the through hole. A method of manufacturing a light projecting device, wherein the reflecting member is attached to the holding member.

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