JP2019153701A - Control system, substrate manufacturing system, control method, and program - Google Patents

Abstract

To reduce the possibility of mounting a component at a position deviated from a bonding material.SOLUTION: There is provided a control system that controls an application unit. The application unit applies a conductive bonding material A1 from a head to a substrate side electrode 61 provided on the a substrate 6 such that the head faces the substrate side electrode 61. The control system determines the application position of the bonding material A1 on the basis of substrate side position information and component side position information. The substrate side position information is information representing the position of the substrate side electrode 61 in a first coordinate system C1. The component side position information is information representing the position of a component side electrode 71 included in a component 7 mounted on the board side electrode 61 in a second coordinate system C2.SELECTED DRAWING: Figure 1

Description

  The present disclosure generally relates to a control system, a board manufacturing system, a control method, and a program. More specifically, the present disclosure relates to a control system that controls an application unit that applies a conductive bonding material to a substrate, a substrate manufacturing system using the same, a control method, and a program.

  Patent Document 1 discloses an electronic component mounting system for mounting electronic components on a substrate. This electronic component mounting system includes a solder application device that discharges solder from a dispenser. The solder application device has the function of inspecting the printed state of the solder printed on each electrode of the board, and additionally applies the solder to the electrode where the printed amount of solder does not meet the predetermined reference amount To do.

JP 2014-103192 A

  However, in the electronic component mounting system (substrate manufacturing system) described in Patent Document 1, the solder coating apparatus (coating portion) has an electrode (board side) corresponding to the solder portion that has been determined that the amount of solder is insufficient. Solder (joining material) is applied to the center position of the electrode. Therefore, in this electronic component mounting system, even if the electronic component mounting device (mounting unit) corrects the position where the component is mounted after applying solder, the component may still be mounted at a position deviated from the solder. was there.

  The present disclosure has been made in view of the above points, and provides a control system, a board manufacturing system, a control method, and a program capable of reducing the possibility of mounting a component at a position shifted from a bonding material. Objective.

  The control system which concerns on 1 aspect of this indication is a control system which controls an application part. The application unit applies a conductive bonding material from the head with the head facing a substrate-side electrode provided on the substrate. The control system determines the application position of the bonding material based on the substrate side position information and the component side position information. The substrate side position information is information representing the position of the substrate side electrode on the substrate in the first coordinate system. The component side position information is information representing the position in the second coordinate system of the component side electrode of the component mounted on the board side electrode.

  The board | substrate manufacturing system which concerns on 1 aspect of this indication is equipped with said control system and the said application part. The application unit applies the bonding material from the head with the head opposed to the application position determined by the control system.

  The control method which concerns on 1 aspect of this indication is a control method which controls an application part. The application unit applies a conductive bonding material from the head with the head facing a substrate-side electrode provided on the substrate. The control method determines an application position of the bonding material based on the substrate side position information and the component side position information. The substrate side position information is information representing the position of the substrate side electrode on the substrate in the first coordinate system. The component side position information is information representing the position in the second coordinate system of the component side electrode of the component mounted on the board side electrode.

  A program according to an aspect of the present disclosure is a program for controlling an application unit. The application unit applies a conductive bonding material from the head with the head facing a substrate-side electrode provided on the substrate. The program is a program for causing a computer system to execute a determination process. The determination process is a process of determining the application position of the bonding material based on the substrate side position information and the component side position information. The substrate side position information is information representing the position of the substrate side electrode on the substrate in the first coordinate system. The component side position information is information representing the position in the second coordinate system of the component side electrode of the component mounted on the board side electrode.

  The present disclosure has an advantage that the possibility of mounting the component at a position shifted from the bonding material can be reduced.

FIG. 1 is an explanatory diagram of a bonding material application position determination process by a control system according to an embodiment of the present disclosure. FIG. 2 is a block diagram showing a schematic configuration of a substrate manufacturing system using the above control system. FIG. 3 is an external perspective view of a coating portion in the above-described substrate manufacturing system. FIG. 4 is a flowchart for explaining the operation of the above-described substrate manufacturing system. FIG. 5 is a flowchart for explaining the operation of the control system. FIG. 6A and FIG. 6B are conceptual diagrams showing examples of component mounting when the application position of the bonding material is determined by the control system of the comparative example. FIG. 7A and FIG. 7B are conceptual diagrams illustrating an example of component mounting when the application position of the bonding material is determined by the control system according to an embodiment of the present disclosure. FIG. 8 is a conceptual diagram illustrating the bonding material application position when the bonding material application position is determined by the control system according to the modification of the embodiment of the present disclosure. 9A and 9B are block diagrams each illustrating a schematic configuration of a substrate manufacturing system according to a modification of the embodiment of the present disclosure.

(1) Overview The control system 1 according to the present embodiment is used in a substrate manufacturing system 100 as shown in FIG. The substrate manufacturing system 100 is used in a manufacturing line for manufacturing the substrate 6. In the present embodiment, the substrate 6 is, for example, a rectangular printed wiring board. “Manufacture of a substrate” in the present disclosure refers to bonding a component-side electrode 71 of a corresponding component 7 to a plurality of substrate-side electrodes 61 provided on the substrate 6 with a bonding material A1, as shown in FIG. This means that the board 6 on which the component 7 is mounted is manufactured by mounting. The “component” in the present disclosure is a surface-mount type electronic component such as a capacitor, a resistor, an inductor, a transformer, an IC (Integrated Circuit), a connector, or a switch. The component 7 is not limited to the electronic component described above, and may include other components as long as the component 7 has the component-side electrode 71 and can be mounted on the substrate-side electrode 61 of the substrate 6.

  The control system 1 is a control system that controls the application unit 3. As shown in FIG. 3, the application unit 3 applies the conductive bonding material A <b> 1 from the head 31 with the head 31 facing the substrate-side electrode 61 provided on the substrate 6. The bonding material A1 is, for example, solder such as cream solder, and conductive paste. In the present disclosure, “controlling the application unit” means not only directly controlling the application unit 3 but also indirectly controlling the application unit 3 by outputting control data to the application unit 3. To include.

  That is, the coating unit 3 is different from the configuration in which the bonding material A1 is collectively printed on the plurality of substrate-side electrodes 61 provided on the substrate 6, and the bonding material A1 is sequentially applied to each of the plurality of substrate-side electrodes 61. It is the structure to apply | coat.

  The control system 1 executes a determination process for determining the application position of the bonding material A1 based on the substrate side position information and the component side position information. In the present embodiment, the determination process is executed for each of the plurality of substrate-side electrodes 61 provided on the substrate 6. That is, the application position of the bonding material A1 is determined for each of the plurality of substrate-side electrodes 61. In the present embodiment, the determination process is a feedforward process that is executed using an inspection result of an inspection unit 2 (described later) located on the upstream side of the application unit 3.

  The substrate side position information is information representing the position of the substrate side electrode 61 in the first coordinate system C1. As shown in FIG. 1, the “first coordinate system” in the present disclosure is orthogonal with the longitudinal direction of the substrate 6 as the X direction, the lateral direction of the substrate 6 as the Y direction, and the thickness direction of the substrate 6 as the Z direction. Coordinate system. That is, in the present embodiment, the first coordinate system C1 is an orthogonal coordinate system in which one surface of the substrate 6 (here, the one surface on which the substrate-side electrode 61 is provided) is an XY plane. Note that the origin of the first coordinate system C1 may be set to, for example, an arbitrary point on the one surface of the substrate 6 (for example, any vertex on the one surface of the substrate 6).

  The component side position information is information representing the position of the component side electrode 71 included in the component 7 mounted on the board side electrode 61 in the second coordinate system C2. The “second coordinate system” in the present disclosure is an orthogonal coordinate system in which the longitudinal direction of the component 7 is the x direction, the short direction of the component 7 is the y direction, and the thickness direction of the component 7 is the z direction. That is, the second coordinate system C2 is an orthogonal coordinate system in which one surface of the component 7 (here, the one surface on which the component-side electrode 71 is provided) is an xy plane. Note that the origin of the second coordinate system C2 may be set, for example, at an arbitrary point on the one surface of the component 7 (for example, any vertex on the one surface of the component 7). The first coordinate system C1 and the second coordinate system C2 are different coordinate systems.

  In addition, the arrow etc. which represent the 1st coordinate system C1 in FIG. 1 and other drawings are only described for description, and do not accompany an entity. Similarly, in FIG. 1, the arrow or the like representing the second coordinate system C <b> 2 is merely shown for explanation, and is not accompanied by an entity. Further, in each of FIG. 1 and FIGS. 6A to 8 to be described later, “61” indicates a substrate-side electrode 61 after the substrate 6 expands / contracts, that is, a substrate-side electrode when a positional shift occurs. Further, in each of FIG. 1 and FIGS. 6A to 8 to be described later, “63” indicates a virtual substrate side electrode when the substrate 6 does not expand and contract, that is, when there is no positional deviation. The expansion and contraction of the substrate 6 will be described in detail in “(3.3) Comparison” described later.

  As described above, the control system 1 of the present embodiment determines the application position of the bonding material A1 based on the substrate side position information and the component side position information. That is, the control system 1 refers to the position of the component-side electrode 71 in the component 7, so that when the component 7 is mounted on the substrate 6, a portion of the substrate-side electrode 61 that overlaps the component-side electrode 71 is identified as the bonding material A1. It becomes possible to make it easy to determine the application position. Therefore, in the control system 1 of the present embodiment, when the component 7 is mounted, the component-side electrode 71 can be easily placed on the bonding material A1 applied to the board-side electrode 61, and the component 7 is shifted from the bonding material A1. There is an advantage that the possibility of mounting can be reduced.

(2) Basic Configuration Hereinafter, the basic configuration of the control system 1 and the substrate manufacturing system 100 according to the present embodiment will be described. As shown in FIG. 2, the board manufacturing system 100 includes a control system 1, an inspection unit 2, a coating unit 3, a mounting unit 4, and a reflow unit 5. In the present embodiment, these are each constituted by a unique device. In the present embodiment, the substrate manufacturing system 100 is configured by connecting the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5 in series from the upstream side. And the board | substrate 6 with which the several board | substrate side electrode 61 was provided in the one surface is supplied to the test | inspection part 2 by conveyance mechanisms, such as a belt conveyor, for example. The substrate 6 is transported in the order of the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5 by the transport mechanism.

  The inspection unit 2, the application unit 3, the mounting unit 4, and the reflow unit 5 are connected to the control system 1 via the communication network N1. The control system 1 transmits signals to and from other functional units (here, the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5) that configure the substrate manufacturing system 100 via the communication network N1. Give and receive. The communication network N1 may be a wired communication network or a wireless communication network. Furthermore, the communication network N1 may be a network that combines a wired communication system network and a wireless communication system network.

  The control system 1 is composed of, for example, a single computer, and includes a control unit 11, a storage unit 12, and a communication unit 13.

  The control unit 11 mainly includes a computer system having a processor and a memory. The function of the control unit 11 is realized by executing the program recorded in the memory of the computer system by the processor of the computer system. The program may be recorded in a memory, may be provided through an electric communication line such as the Internet, or may be provided by being recorded in a non-temporary recording medium such as a memory card.

  The storage unit 12 stores, for example, information referred to for control by the control unit 11. In the present embodiment, the storage unit 12 stores component data. The component data is information regarding the component 7 to be mounted on the substrate 6, and is referred to directly or indirectly by the coating unit 3 and the mounting unit 4. In addition, the part data includes data for each part 7. For example, even if the parts 7 are of the same type, if the dimensions of the parts 7 are different depending on the manufacturer, the parts data includes the data of the parts 7 for each manufacturer.

  The component data includes component side position information such as the outer shape and size of the component 7, the number of the component side electrodes 71, the position of the component side electrode 71, and the dimensions of the component side electrode 71. In the present embodiment, the component-side position information is defined by coordinates centered on the component-side reference point 72 (see FIG. 1) of the component 7 in the second coordinate system C2, the distance from the component-side reference point 72, and the like. Yes. That is, in the present embodiment, the position of the component side electrode 71 in the second coordinate system C2 is set with the component side reference point 72 as a reference. The component data includes mounting operation information that defines conditions for mounting operation of the component 7 by the mounting unit 4. The mounting operation information includes, for example, the type of suction nozzle used corresponding to the type of component 7, the suction speed of the suction nozzle, and the mounting speed of the suction nozzle. The suction speed is a speed at which the component 7 is sucked and taken out from a component supply unit (for example, a tape feeder) by the suction nozzle. The mounting speed is a speed at which the sucked component 7 is placed on the substrate 6 by the suction nozzle. In addition, the component data includes information indicating the mounting position of the component 7 on the board 6 to be manufactured. The mounting position of the component 7 is expressed by coordinates in the first coordinate system C1, for example.

  The communication unit 13 is a communication interface that communicates with the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5 via the communication network N <b> 1 using a wired communication method.

  In the present embodiment, the control system 1 functions as a management computer that manages these functional units by exchanging signals with each of the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5. To do. For example, the control system 1 acquires the inspection result in the inspection unit 2. Then, the control system 1 outputs the acquired inspection result or data calculated based on the acquired inspection result to the coating unit 3, the mounting unit 4, or the reflow unit 5. Thereby, the coating unit 3, the mounting unit 4, or the reflow unit 5 performs control based on the data acquired from the control system 1. That is, the control system 1 performs feedforward control of the downstream apparatus directly or indirectly based on the data acquired from the upstream apparatus. Further, the control system 1 performs feedback control of the upstream device directly or indirectly based on the data acquired from the downstream device. Below, the function in which the control system 1 controls the application part 3 is mainly demonstrated.

  In the present embodiment, the control system 1 controls the application unit 3 by outputting data representing the application position of the bonding material A1 determined by the determination process to the application unit 3 via the communication network N1. The determination process will be described in detail in “(3.2) Operation of control system” described later.

  The inspection unit 2 detects the position of the substrate-side electrode 61 provided on the substrate 6 and outputs an inspection result representing the position of the substrate-side electrode 61 on the substrate 6 to the control system 1 via the communication network N1. In other words, the inspection unit 2 inspects the position of the substrate side electrode 61 in the first coordinate system C1. The inspection unit 2 includes a positioning unit that positions the substrate 6 conveyed by the conveyance mechanism at a predetermined position, and a camera that images the substrate 6 positioned by the positioning unit. The inspection unit 2 detects the position of the substrate-side electrode 61 on the substrate 6 by performing image processing on the imaging result of the camera. In the present embodiment, the position of the substrate-side electrode 61 on the substrate 6 is detected based on the recognition mark previously attached to the substrate 6. The recognition mark is provided at a corner on the mounting surface of the substrate 6, for example. In addition, the recognition mark is provided, for example, in the vicinity of the substrate side electrode 61 on which a component requiring mounting accuracy is mounted among the plurality of substrate side electrodes 61. In this case, for example, a pair of recognition marks is provided so as to sandwich the substrate-side electrode 61. The inspection unit 2 outputs the inspection result to the control system 1 as substrate side position information.

  As shown in FIG. 3, the application unit 3 includes a head 31 and a drive mechanism 32. The head 31 includes a camera that images the substrate 6 and a discharge mechanism that discharges a bonding material A1 (here, solder) such as a jet dispenser. The drive mechanism 32 is configured to slide the head 31 in each of the X direction, the Y direction, and the Z direction by using a motor provided. The application unit 3 applies the bonding material A1 from the head 31 with the head 31 facing the application position determined by the control system 1. In the present embodiment, the application unit 3 applies the bonding material A1 to the coordinates (X coordinate, Y coordinate) in the first coordinate system C1 of the substrate 6 determined by the control system 1.

  The coating unit 3 recognizes the position of the substrate 6 by imaging the substrate 6 with a camera in a state where the substrate 6 to be coated is positioned by the positioning unit. Then, the head 31 is moved to a position facing the substrate electrode 61 to be applied by the drive mechanism 32. At this time, the head 31 moves in the X direction and the Y direction in the first coordinate system C1, that is, on the XY plane (virtual plane). At this time, the head 31 is the substrate-side electrode 61 to be applied, and moves to above the application position determined by the control system 1. Then, the head 31 is lowered toward the substrate side electrode 61 by the drive mechanism 32, and the bonding material A1 is applied to the application position of the substrate side electrode 61 to be applied by discharging the bonding material A1 in the lowered state. To do. At this time, the head 31 moves in the Z direction in the first coordinate system C1. Thereafter, the head 31 is raised by the drive mechanism 32 in a direction away from the substrate-side electrode 61. Thereafter, the head 31 repeats the above operation until the bonding material A1 is applied to all the substrate-side electrodes 61 to be applied.

  The mounting unit 4 includes a positioning unit that positions the substrate 6 transported by the transport mechanism, a head, and a drive mechanism. The head has a camera that images the substrate 6 and a suction nozzle that sucks the component 7. The drive mechanism is configured to slide the head in each of the X direction, the Y direction, and the Z direction by a motor provided. The mounting unit 4 mounts the component 7 on the substrate 6 so that the component-side electrode 71 of the component 7 overlaps the corresponding substrate-side electrode 61.

  The mounting unit 4 recognizes the position of the substrate 6 by imaging the substrate 6 with a camera in a state where the substrate 6 to be mounted is positioned by the positioning unit. Then, the head moves to the component supply unit by the drive mechanism, and sucks the component 7 to be mounted by the suction nozzle. Thereafter, the head moves to a position facing the board-side electrode 61 to be mounted. Then, the head is lowered toward the substrate side electrode 61 by the drive mechanism, and the component 7 is placed on the substrate side electrode 61 (the bonding material A1 applied to the substrate side electrode 61) in the lowered state. Thereafter, the head is lifted away from the substrate-side electrode 61 by the drive mechanism. Thereafter, the head repeats the above operation until the components 7 are mounted on all the board-side electrodes 61 to be mounted.

  In the present embodiment, the mounting unit 4 acquires the inspection result in the inspection unit 2, that is, the board-side position information from the control system 1 before mounting the component 7 on the substrate 6. In other words, the control system 1 further has a mounting control function for outputting information for performing control based on the board side position information to the mounting unit 4 that mounts the component 7 on the board 6. In the present embodiment, the mounting control function is realized by outputting the substrate side position information used by the control system 1 to determine the application position to the mounting unit 4. That is, in the present embodiment, “information for performing control based on the substrate side position information” is the substrate side position information itself.

  For this reason, the mounting unit 4 grasps the position of the board-side electrode 61 on the board 6 on which the component 7 is mounted by referring to the board-side position information. Therefore, the mounting unit 4 can mount the component 7 on the substrate 6 so that the component-side electrode 71 of the component 7 corresponding to the substrate-side electrode 61 overlaps. For example, the mounting unit 4 corrects the mounting position of the component 7 with reference to the board side position information, and mounts the component 7 at the corrected mounting position. For example, when mounting the component 7 corresponding to the two board-side electrodes 61, the mounting position is corrected by obtaining the center position shift between the two board-side electrodes 61 by referring to the board-side position information. .

  The reflow unit 5 joins the component 7 to the substrate 6 by heating the substrate 6 on which the component 7 is mounted by the mounting unit 4. Specifically, the reflow unit 5 heats the bonding material A1 by passing the substrate 6 transported by the transport mechanism through a heating chamber having one or more heating zones each heated at a predetermined temperature condition. Melt. The molten bonding material A1 wets the substrate-side electrode 61 and the component-side electrode 71, and then cools and solidifies. Thereby, the component side electrode 71 is joined to the board side electrode 61 via the joining material A1. In addition, the reflow part 5 may perform the process which cools bonding material A1 with a cooler after the process which heats bonding material A1 in a heating chamber.

(3) Operation Hereinafter, operations of the control system 1 and the substrate manufacturing system 100 of the present embodiment will be described.

(3.1) Operation of Substrate Manufacturing System First, the basic operation of the substrate manufacturing system 100 will be described with reference to FIG. First, the inspection unit 2 performs inspection of the substrate 6 transported by the transport mechanism (S1). Thereby, the position of the substrate side electrode 61 on the substrate 6 is detected. The inspection result in the inspection unit 2 is output to the control system 1 as substrate side position information (S2). Then, the substrate 6 inspected by the inspection unit 2 is transported to the coating unit 3 by the transport mechanism.

  The control system 1 acquires information (component side position information) of the component 7 to be mounted on the substrate 6 transported to the application unit 3 from the storage unit 12. Then, the control system 1 executes a determination process described later for each of all the substrate-side electrodes 61 of the substrate 6 based on the component-side position information and the substrate-side position information acquired from the inspection unit 2. . The application position information related to the application position determined by the determination process is output from the control system 1 to the application unit 3.

  The application unit 3 applies the bonding material A1 to the application position based on the application position information acquired from the control system 1 for each of all the substrate-side electrodes 61 of the substrate 6 conveyed by the conveyance mechanism (S3). The substrate 6 on which the bonding material A1 is applied by the application unit 3 is conveyed to the mounting unit 4 by the conveyance mechanism.

  The mounting unit 4 mounts the component 7 so that the component-side electrode 71 of the corresponding component 7 overlaps each of all the substrate-side electrodes 61 of the substrate 6 transferred by the transfer mechanism (S4). The substrate 6 on which the component 7 is mounted by the mounting unit 4 is transported to the reflow unit 5 by the transport mechanism.

  And the reflow part 5 performs the reflow process by heating the board | substrate 6 conveyed by the conveyance mechanism (S5). As a result, the bonding material A1 applied to each of the substrate-side electrodes 61 is melted, and the component-side electrode 71 is bonded to the substrate-side electrode 61 by the molten bonding material A1. Thereby, the mounting of the component 7 on the board 6 is completed.

(3.2) Operation of Control System Next, the operation of the control system 1 will be described with reference to FIG. The control system 1 executes the following determination process until the substrate 6 is transported to the coating unit 3 by the transport mechanism. The determination process is executed for each of all the substrate-side electrodes 61 of the substrate 6. In executing the determination process, the control system 1 acquires the substrate-side position information used in the determination process (S11). In the present embodiment, the control system 1 acquires the inspection result in the inspection unit 2 as the substrate side position information via the communication network N1. In the present embodiment, the substrate-side reference point 62 shown in FIG. 1 is used as the substrate-side position information. The board-side reference point 62 is obtained from the positions in the first coordinate system C1 of the plurality of board-side electrodes 61 on which the component 7 is mounted. Specifically, when there are two component-side electrodes 71 of the component 7, there are also two substrate-side electrodes 61 on which the component 7 is mounted. The midpoint of the line segment connecting the center points of the two substrate-side electrodes 61 becomes the substrate-side reference point 62.

  Next, the control system 1 acquires component side position information (S12). In the present embodiment, the control system 1 reads the component side position information from the storage unit 12 to acquire the component side position information of the component 7 to be mounted. Note that step S11 and step S12 described above may be reversed. In the present embodiment, the component side reference point 72 shown in FIG. 1 is used as the component side position information. The component side reference point 72 is obtained from the positions of the plurality of component side electrodes 71 of the component 7 in the second coordinate system C2. Specifically, when the component 7 has two component-side electrodes 71, the midpoint of the line segment connecting the center points of the two component-side electrodes 71 becomes the component-side reference point 72.

  Then, the control system 1 determines the application position of the bonding material A1 based on the substrate side position information and the component side position information (S13). In the present embodiment, the application position is determined so as to match the position of the substrate side reference point 62 and the position of the component side reference point 72 in the substrate side position information. That is, in the present embodiment, the control system 1 converts the position of the component-side reference point 72 in the second coordinate system C2 into a position in the first coordinate system C1 by calculation. The control system 1 responds at the substrate-side electrode 61 when the position of the substrate-side reference point 62 in the first coordinate system C1 matches the position of the component-side reference point 72 in the first coordinate system C1. The position where the component side electrode 71 to be overlapped is determined as the application position of the bonding material A1. Thereafter, the control system 1 indirectly controls the application unit 3 by outputting application position information including the determined application position to the application unit 3 via the communication network N1 (S14).

(3.3) Comparison Hereinafter, advantages of the control system 1 of the present embodiment will be described with reference to FIGS. The control system of the comparative example is different from the control system 1 of the present embodiment in that the application position of the bonding material A1 is determined without using the component side position information. The control system of the comparative example may cause a mounting failure of the component 7 when the position shift of the substrate side electrode 61 on the substrate 6 occurs. The positional deviation of the substrate side electrode 61 can be caused by the expansion and contraction of the substrate 6 due to a temperature change, a warp of the substrate 6 or the like. In addition, due to the miniaturization of the component 7, a flexible substrate such as a film substrate may be required as the substrate 6. If the substrate 6 is a flexible substrate such as a flexible substrate, the substrate 6 is easily expanded and contracted, and as a result, the positional deviation of the substrate side electrode 61 is more likely to occur.

  In the control system of the comparative example, in the determination process, the application position of the bonding material A1 is determined using only the substrate side position information. That is, in the control system of the comparative example, for example, the center of the substrate side electrode 61 is determined as the application position based on the substrate side position information (that is, the position of the substrate side electrode 61 in the substrate 6). At this time, the control system of the comparative example does not refer to the information regarding the component 7. Therefore, the control system of the comparative example is not limited to the predetermined position of the substrate side electrode 61 (in this case, the center of the substrate side electrode 61, even if the substrate side electrode 61 is displaced due to the expansion and contraction of the substrate 6). ) Is determined as the application position.

  Here, in the substrate manufacturing system including the control system of the comparative example instead of the control system 1 of the present embodiment, for example, two component-side electrodes 71 are provided for any two substrate-side electrodes 61 of the substrate 6. Assume that component 7 is mounted. Further, it is assumed that the distance between the two substrate-side electrodes 61 is longer than the normal distance because the substrate 6 extends in the X direction. Here, “distance during normal operation” refers to a distance between two virtual substrate-side electrodes 63 when the substrate 6 does not expand and contract. In this case, the control system of the comparative example determines the center of each of the two substrate-side electrodes 61 as the application position of the bonding material A1 by referring only to the substrate-side position information in the determination process. Then, as shown in FIG. 6A, the application unit 3 applies the bonding material A1 to each of the two substrate-side electrodes 61 at the application position determined by the control system of the comparative example (that is, the center of the substrate-side electrode 61). Apply. Here, the distance between the centers of the two bonding materials A1 is longer than the distance between the centers of the two component-side electrodes 71. Therefore, as shown in FIG. 6B, even if the mounting portion 4 places one component-side electrode 71 of the two component-side electrodes 71 on one bonding material A1 of the two bonding materials A1, The component side electrode 71 cannot be placed on the other bonding material A1. Even if the other component-side electrode 71 can be placed on the other bonding material A1, the component 7 is placed on the bonding material A1 in an unstable state. Even if the substrate 6 is heated in the reflow part 5 in such a state, the mounting of the component 7 is completed without sufficient electrical connection between the substrate-side electrode 61 and the component-side electrode 71. 7 may cause a mounting failure.

  Next, it is assumed that the component 7 having the two component-side electrodes 71 is mounted on the two substrate-side electrodes 61 in the substrate manufacturing system 100 including the control system 1 of the present embodiment under the same conditions as described above. To do. In this case, the control system 1 refers to not only the board side position information but also the component side position information in the determination process. As a result, as shown in FIG. 7A, when the board-side reference point 62 and the part-side reference point 72 coincide with each other, the control system 1 The overlapping part is determined as the application position of the bonding material A1. Here, the control system 1 determines the position closer to the other substrate side electrode 61 than the center in each of the two substrate side electrodes 61 as the application position. Since the application position is determined in this way, the distance between the centers of the two bonding materials A1 substantially matches the distance between the centers of the two component-side electrodes 71. Therefore, as shown in FIG. 7B, the mounting portion 4 can place the corresponding component-side electrode 71 in a stable state on the application position of the bonding material A1 on each of the two substrate-side electrodes 61. If the substrate 6 is heated in the reflow part 5 in this state, the mounting of the component 7 can be completed in a state where the electrical connection between the substrate side electrode 61 and the component side electrode 71 is sufficiently made. It becomes difficult to invite mounting defects.

  As described above, in the control system 1 of this embodiment, when the component 7 is mounted, the component-side electrode 71 can be easily placed on the bonding material A1 applied to the board-side electrode 61, and the component 7 is displaced from the bonding material A1. There is an advantage that the possibility of mounting at a different position can be reduced.

(4) Modifications The above-described embodiment is merely one of various embodiments of the present disclosure. The above-described embodiment can be variously changed according to the design or the like as long as the object of the present disclosure can be achieved. Moreover, the function similar to the control system 1 may be embodied by a control method, a computer program, or a non-transitory recording medium recording the computer program.

  The control method according to one aspect is a control method for controlling the application unit 3. The application unit 3 applies the conductive bonding material A <b> 1 from the head 31 with the head 31 facing the substrate-side electrode 61 provided on the substrate 6. The control method determines the application position of the bonding material A1 based on the substrate side position information and the component side position information. The substrate side position information is information representing the position of the substrate side electrode 61 on the substrate 6 in the first coordinate system C1. The component side position information is information representing the position of the component side electrode 71 included in the component 7 mounted on the board side electrode 61 in the second coordinate system C2.

  The program according to one aspect is a program for controlling the application unit 3. The application unit 3 applies the conductive bonding material A <b> 1 from the head 31 with the head 31 facing the substrate-side electrode 61 provided on the substrate 6. The program is a program for causing a computer system to execute determination processing. The determination process is a process of determining the application position of the bonding material A1 based on the substrate side position information and the component side position information. The substrate side position information is information representing the position of the substrate side electrode 61 on the substrate 6 in the first coordinate system C1. The component side position information is information representing the position of the component side electrode 71 included in the component 7 mounted on the board side electrode 61 in the second coordinate system C2.

  Hereinafter, modifications of the above-described embodiment will be listed. The modifications described below can be applied in appropriate combinations.

  The substrate manufacturing system 100 in the present disclosure includes a computer system in the control system 1 or the like, for example. The computer system mainly includes a processor and a memory as hardware. The function as the control system 1 in the present disclosure is realized by the processor executing the program recorded in the memory of the computer system. The program may be recorded in advance in a memory of a computer system, may be provided through a telecommunication line, or recorded in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. May be provided. A processor of a computer system includes one or more electronic circuits including a semiconductor integrated circuit (IC) or a large scale integrated circuit (LSI). The plurality of electronic circuits may be integrated on one chip, or may be distributed on the plurality of chips. The plurality of chips may be integrated into one device, or may be distributed and provided in a plurality of devices.

  In addition, it is not essential for the control system 1 that a plurality of functions in the control system 1 are integrated in one case, and the components of the control system 1 are provided in a plurality of cases. It may be. Furthermore, at least a part of the functions of the control system 1 may be realized by, for example, cloud (cloud computing).

  In the above-described embodiment, at least a part of the functions of the substrate manufacturing system 100 distributed in a plurality of apparatuses may be integrated in one housing. For example, in the above-described embodiment, the inspection unit 2, the application unit 3, the mounting unit 4, and the reflow unit 5 are each realized by a unique device, but all these functions are integrated into one device. Alternatively, it may be distributed to two or more devices.

  Moreover, in the above-mentioned embodiment, although the control system 1 is implement | achieved by one computer, it is not the meaning limited to this. For example, the control system 1 may be realized by a computer system included in any one of a plurality of devices that respectively configure the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5.

  In the embodiment described above, the substrate 6 to be manufactured by the substrate manufacturing system 100 is a single substrate, but the present invention is not limited to this. For example, the substrate 6 to be manufactured by the substrate manufacturing system 100 may be a plurality of substrates. In this case, the plurality of substrates are sequentially transported to the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5 by the transport mechanism in a state where the substrates are attached to the table with double-sided tape, for example. In this case, the plurality of substrates are handled as the substrate 6. That is, the component 7 is mounted on each of the plurality of substrates by executing the process by the substrate manufacturing system 100 for each of the plurality of substrates. Further, the substrate 6 is not limited to a rectangular shape, but may be another shape such as a circular shape. Furthermore, the board | substrate 6 may be a deformed board | substrate which combined the various shapes used for electronic devices, such as a smart phone, for example.

  In the above-described embodiment, the substrate-side reference point 62 is a midpoint of a line segment that connects the center points of the plurality (here, two) of the substrate-side electrodes 61, but is not limited to this. In other words, the substrate-side reference point 62 may be a reference point for defining the position of the substrate-side electrode 61 on the substrate 6.

  In the above-described embodiment, the component-side reference point 72 is the center of a line segment that connects the centers of a plurality of (here, two) component-side electrodes 71, but is not limited to this. For example, the component-side reference point 72 may be the center of the outer shape of the component 7 or the center that is virtually set in the component 7. That is, the component-side reference point 72 may be a point that serves as a reference for defining the position of the component-side electrode 71 in the component 7.

  In the above-described embodiment, the control system 1 uses the substrate-side reference point 62 obtained from the position of the substrate-side electrode 61 in the first coordinate system C1 as the substrate-side position information. However, the present invention is not limited to this. . For example, the control system 1 may use the recognition mark provided on the substrate 6 as the substrate side position information. For example, if the substrate 6 is a substrate that expands and contracts uniformly in the X direction or the Y direction, the control system 1 uses the recognition mark as the substrate side position information, so that the position of the substrate side electrode 61 is detected from the displacement of the recognition mark. It is possible to estimate the deviation. On the other hand, if the substrate 6 is, for example, the above-described deformed substrate, the degree of expansion / contraction varies depending on the position of the substrate 6. The obtained substrate side reference point 62 is preferably used as the substrate side position information. In addition, the control system 1 may use a combination of the recognition mark and the substrate side reference point 62 as the substrate side position information.

  In the above-described embodiment, the control system 1 determines the application position of the bonding material A1 so as to match the substrate-side reference point 62 and the component-side reference point 72. However, the present invention is not limited to this. . For example, the control system 1 determines the application position of the bonding material A1 so as to match the substrate side reference region obtained from the position of the substrate side electrode 61 with the component side reference region obtained from the position of the component side electrode 71. Also good. The substrate-side reference region is a circular region including the substrate-side reference point 62, for example. The component-side reference region is a circular region including the component-side reference point 72, for example. Of course, both the board-side reference region and the component-side reference region may be regions having a shape other than a circular shape.

  In the above-described embodiment, the control system 1 may further have an adjustment function. The adjustment function is a function of adjusting the application position based on the angle θ formed by the reference line L1 of the substrate 6 and the straight line L2 connecting the substrate side electrode 61 and the other substrate side electrode 61 in the first coordinate system C1. (See FIG. 8). For example, when the substrate 6 expands and contracts unevenly, the substrate-side electrode 61 is not only displaced in the X direction and the Y direction, but also along both the X direction and the Y direction. Misalignment may occur. In this case, it is possible that the bonding material A1 cannot be applied to the substrate-side electrode 61 only by adjusting the application position assuming only the positional deviation of the substrate-side electrode 61 in any one of the X direction and the Y direction. There is sex. Therefore, the control system 1 can solve the above problem by adjusting the application position using the adjustment function.

  Hereinafter, an example of adjustment of the application position by the adjustment function will be described with reference to FIG. In FIG. 8, the position of the substrate-side electrode 61 of one of the two substrate-side electrodes 61 (the left side in the figure) is shifted in both the X direction and the Y direction due to the non-uniform expansion and contraction of the substrate 6. Assume that In this case, the control system 1 adjusts the application position of the bonding material A1 on the one substrate side electrode 61 based on the angle θ formed by the reference line L1 and the straight line L2. Here, the reference line L1 is the center of one substrate side electrode 61 (that is, a virtual substrate side electrode indicated by “63” in FIG. 8) when the substrate 6 does not expand and contract, and the other substrate side electrode 61. A straight line connecting the center. This configuration has an advantage that the possibility of mounting the bonding material A1 at a position shifted from the substrate-side electrode 61 can be reduced.

  In the above-described embodiment, the board manufacturing system 100 may further include the printing unit 8 as shown in FIG. 9A. The printing unit 8 is disposed, for example, on the upstream side of the inspection unit 2. The printing unit 8 performs screen printing using a mask plate, thereby applying the bonding material A1 (for example, cream solder) to two or more substrate-side electrodes 61 to be printed among the plurality of substrate-side electrodes 61 of the substrate 6. Print all at once. In this case, the application unit 3 may apply the bonding material A <b> 1 to the substrate side electrode 61 excluding the substrate side electrode 61 that is the printing target of the printing unit 8 among the plurality of substrate side electrodes 61.

  For example, when components 7 having different sizes are mixed in the components 7 mounted on the substrate 6, for example, the bonding material A <b> 1 used for the components 7 having a relatively small size is applied at the application unit 3, and the remaining components 7 are applied. The bonding material A1 to be used may be printed by the printing unit 8. In this case, the step of applying the bonding material A1 by the applying unit 3 and the step of printing the bonding material A1 by the printing unit 8 may be reversed. That is, in FIG. 9A, the printing unit 8 may be disposed on the downstream side of the application unit 3.

  Further, the printing unit 8 may collectively print the bonding material A <b> 1 on all the substrate-side electrodes 61 of the substrate 6. In this case, for example, the application unit 3 has a defect in the printing result of the printing unit 8 among the plurality of substrate-side electrodes 61 (for example, the bonding material A1 is not applied or the application amount of the bonding material A1 is insufficient). The bonding material A1 may be applied to the substrate-side electrode 61. Further, in this case, it is preferable to provide a coating inspection unit 9 to be described later between the printing unit 8 and the coating unit 3 so that the substrate-side electrode 61 having a defect in the printing result in the printing unit 8 can be identified.

  In the above-described embodiment, the substrate manufacturing system 100 may further include the coating inspection unit 9 as shown in FIG. 9B. The application inspection unit 9 is a device that performs a process of inspecting the substrate 6 coated with the bonding material A1 by the application unit 3, that is, a so-called SPI (Solder Paste Inspection) process. For example, the application inspection unit 9 is in a state where the bonding material A1 is applied. A camera for imaging the substrate 6 is provided. The application inspection unit 9 is disposed on the downstream side of the application unit 3. And the application | coating test | inspection part 9 image | photographs the board | substrate 6 conveyed from the application | coating part 3 with a camera from several directions, for example, The position, area, and height of joining material A1 are settled in the tolerance | permissible range. Inspect. Then, the application inspection unit 9 outputs the inspection result to the mounting unit 4 via the communication network N1. The mounting unit 4 mounts the component 7 on the substrate 6 based on the inspection result of the coating inspection unit 9 so that the component-side electrode 71 is placed on the portion of the substrate-side electrode 61 where the bonding material A1 is applied. In this configuration, the component 7 can be mounted based on the application position of the bonding material A1 instead of the position of the substrate-side electrode 61. Therefore, the mounting accuracy of the component 7 on the substrate 6 can be improved. There is an advantage.

  In the above-described embodiment, “information for performing control based on the board-side position information” in the mounting control function of the control system 1 is the board-side position information itself, but is not limited to this. For example, “information for performing control based on substrate-side position information” may be information generated based on substrate-side position information. For example, the control system 1 generates correction data representing a difference between the position of the substrate side electrode 61 when not expanding and contracting and the current position of the substrate side electrode 61 based on the substrate side position information, and the generated correction data May be output to the mounting unit 4 via the communication network N1. In this case, the mounting unit 4 that has acquired the correction data corrects the mounting position of the component 7 using the correction data, and then mounts the component 7 on the board 6.

  In addition, the control system 1 may output data regarding the application position determined by the determination process to the mounting unit 4 via the communication network N1. In this case, the mounting unit 4 that acquired this data can mount the component 7 based on the application position of the bonding material A1 by correcting the mounting position of the component 7 using this data.

  In the above-described embodiment, the control system 1 uses the two-dimensional information (XY coordinates) of the first coordinate system C1 as the board-side position information, and the two-dimensional information (xy coordinates) of the second coordinate system C2 as the part-side position information. However, the present invention is not limited to this. For example, the control system 1 may use the three-dimensional information (XYZ coordinates) of the first coordinate system C1 as the board side position information and the three-dimensional information (xyz coordinates) of the second coordinate system C2 as the part side position information. Good.

  In the above-described embodiment, the control system 1 performs the determination process with reference to the component side position information included in the component data stored in the storage unit 12. In other words, in the above-described embodiment, the component side position information is stored in the storage unit 12 that stores information used in the mounting unit 4 that mounts the component 7 on the substrate 6. In the embodiment described above, the control system 1 determines the application position using the component side position information stored in the storage unit 12. That is, in the above-described embodiment, the control system 1 determines the application position of the bonding material A1 by sharing the component data with the mounting unit 4, but the present invention is not limited to this. For example, the control system 1 may have component side position information as data different from the component data used in the mounting unit 4, and may determine the application position of the bonding material A1 using the component side position information. .

  In the above-described embodiment, the component data (component-side position information) is stored in the storage unit 12 of the control system 1, but the present invention is not limited to this. For example, the component data may be stored in a storage device connected to the control system 1 via the communication network N1, which is a device different from the control system 1. In this case, the control system 1 refers to the component-side position information by reading the component-side position information from the storage device via the communication network N1 in the determination process.

  The above-described substrate manufacturing system 100 includes the control system 1, the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5. However, the present invention is not limited to this. For example, the substrate manufacturing system 100 includes the control system 1 and the coating unit 3 and may not include other functional units. Moreover, the board | substrate manufacturing system 100 is provided with the control system 1, the test | inspection part 2, and the application | coating part 3, and does not need to be provided with another functional part. The substrate manufacturing system 100 includes the control system 1, the coating unit 3, and the mounting unit 4, and may not include other functional units. That is, the substrate manufacturing system 100 only needs to include at least the control system 1 and the coating unit 3, and whether or not to include the inspection unit 2, the mounting unit 4, and the reflow unit 5 is arbitrary.

(Summary)
As described above, the control system (1) according to the first aspect is a control system that controls the application unit (3). The application unit (3) applies the conductive bonding material (A1) from the head (31) with the head (31) facing the substrate side electrode (61) provided on the substrate (6). The control system (1) determines the application position of the bonding material (A1) based on the substrate side position information and the component side position information. The substrate side position information is information representing the position of the substrate side electrode (61) in the first coordinate system (C1). The component side position information is information representing the position in the second coordinate system (C2) of the component side electrode (71) of the component (7) mounted on the board side electrode (61).

  According to this aspect, there is an advantage that the possibility of mounting the component (7) at a position shifted from the bonding material (A1) can be reduced.

  In the control system (1) according to the second aspect, in the first aspect, the position of the component side electrode (71) in the second coordinate system (C2) is set with reference to the component side reference point (72). ing. The application position is determined so that the position of the substrate side reference point (62) in the substrate side position information matches the position of the component side reference point (72).

  According to this aspect, the position of the substrate side electrode (61) overlapping the component side electrode (71) can be determined as the application position, and the mounting accuracy of the component (7) with respect to the bonding material (A1) can be easily improved. There is an advantage that.

  In the control system (1) according to the third aspect, in the second aspect, the component side position information is a storage unit that stores information used by the mounting unit (4) for mounting the component (7) on the substrate (6). (12) is stored. The control system (1) determines the application position using the component side position information stored in the storage unit (12).

  According to this aspect, since information used in the mounting unit (4) can be shared, there is an advantage that it is not necessary to separately prepare component side position information.

  The control system (1) according to the fourth aspect is the substrate-side reference point (62) determined from the position of the substrate-side electrode (61) in the first coordinate system (C1) in any of the first to third aspects. ) Is used as substrate side position information.

  According to this aspect, it is easy to accurately grasp the position of the board-side electrode (61) on the board (6), and as a result, it is easy to improve the mounting accuracy of the component (7) with respect to the bonding material (A1). There is.

  The control system (1) according to the fifth aspect further has an adjustment function in any one of the first to fourth aspects. In the first coordinate system (C1), the adjustment function is formed by a reference line (L1) of the substrate (6) and a straight line (L2) connecting the substrate side electrode (61) and the other substrate side electrode (61). This is a function for adjusting the application position based on the angle (θ).

  According to this aspect, when the position of the substrate side electrode (61) is shifted in both the X direction and the Y direction of the first coordinate system (C1) due to the distortion of the substrate (6) or the like, the bonding material (A1) There is an advantage that the possibility of mounting at a position shifted from the substrate-side electrode (61) can be reduced.

  The control system (1) according to the sixth aspect further includes a mounting control function in any one of the first to fifth aspects. The mounting control function is a function for outputting information for performing control based on the board side position information to the mounting part (4) that mounts the component (7) on the board (6).

  According to this aspect, there is an advantage that the mounting portion (4) can easily correct the mounting position of the component (7) with respect to the bonding material (A1) based on the board side position information.

  In the control system (1) according to the seventh aspect, in the sixth aspect, the mounting control function is realized by outputting the substrate side position information used for determining the application position to the mounting part (4).

  According to this aspect, since the board side position information can be shared by the mounting part (4), there is an advantage that the mounting part (4) does not need to newly acquire the board side position information.

  The board | substrate manufacturing system (100) which concerns on an 8th aspect is provided with the control system (1) of any one of the 1st-7th aspect, and the application part (3). The application unit (3) applies the bonding material (A1) from the head (31) with the head (31) facing the application position determined by the control system (1).

  According to this aspect, there is an advantage that the possibility of mounting the component (7) at a position shifted from the bonding material (A1) can be reduced.

  The board | substrate manufacturing system (100) which concerns on a 9th aspect is further equipped with the test | inspection part (2) in an 8th aspect. The inspection unit (2) inspects the position of the substrate side electrode (61) in the first coordinate system (C1). The control system (1) acquires the inspection result in the inspection unit (2) as the substrate side position information.

  According to this aspect, there is an advantage that the possibility of mounting the component (7) at a position shifted from the bonding material (A1) can be reduced.

  The board | substrate manufacturing system (100) which concerns on a 10th aspect is further equipped with the mounting part (4) in the 8th or 9th aspect. The mounting part (4) mounts the component (7) on the substrate (6).

  According to this aspect, there is an advantage that the possibility of mounting the component (7) at a position shifted from the bonding material (A1) can be reduced.

  The control method according to the eleventh aspect is a control method for controlling the application part (3). The application unit (3) applies the conductive bonding material (A1) from the head (31) with the head (31) facing the substrate side electrode (61) provided on the substrate (6). The control method determines the application position of the bonding material (A1) based on the substrate side position information and the component side position information. The substrate side position information is information representing the position of the substrate side electrode (61) in the first coordinate system (C1). The component side position information is information representing the position in the second coordinate system (C2) of the component side electrode (71) of the component (7) mounted on the board side electrode (61).

  According to this aspect, there is an advantage that the possibility of mounting the component (7) at a position shifted from the bonding material (A1) can be reduced.

  The program according to the twelfth aspect is a program for controlling the application unit (3). The application unit (3) applies the conductive bonding material (A1) from the head (31) with the head (31) facing the substrate side electrode (61) provided on the substrate (6). The program is a program for causing a computer system to execute determination processing. The determination process is a process of determining the application position of the bonding material (A1) based on the substrate side position information and the component side position information. The substrate side position information is information representing the position of the substrate side electrode (61) in the first coordinate system (C1). The component side position information is information representing the position in the second coordinate system (C2) of the component side electrode (71) of the component (7) mounted on the board side electrode (61).

  According to this aspect, there is an advantage that the possibility of mounting the component (7) at a position shifted from the bonding material (A1) can be reduced.

  The configurations according to the second to seventh aspects are not essential to the control system (1) and can be omitted as appropriate. Further, the configuration according to the ninth or tenth aspect is not a configuration essential to the substrate manufacturing system (100) and can be omitted as appropriate.

DESCRIPTION OF SYMBOLS 1 Control system 12 Memory | storage part 2 Inspection | inspection part 3 Application | coating part 31 Head 4 Mounting part 6 Substrate 61 Substrate side electrode 62 Substrate side reference point 7 Component 71 Component side electrode 72 Component side reference point 8 Printing unit 100 Substrate manufacturing system A1 Bonding material C1 1st coordinate system C2 2nd coordinate system L1 Reference line L2 Straight line θ Angle

Claims (12)

A control system that controls a coating unit that coats a conductive bonding material from the head with a head facing a substrate-side electrode provided on the substrate,
Board-side position information representing the position of the board-side electrode in the first coordinate system, and component-side position information representing the position in the second coordinate system of the component-side electrode of the component mounted on the board-side electrode; To determine the application position of the bonding material,
Control system. The position of the component side electrode in the second coordinate system is set with reference to the component side reference point,
The application position is determined so as to match the position of the substrate side reference point in the substrate side position information with the position of the component side reference point.
The control system according to claim 1. The component side position information is stored in a storage unit that stores information used in a mounting unit that mounts the component on the substrate.
Using the component side position information stored in the storage unit, determine the application position,
The control system according to claim 2. A substrate side reference point obtained from a position of the substrate side electrode in the first coordinate system is used as the substrate side position information.
The control system according to any one of claims 1 to 3. The first coordinate system further has an adjustment function of adjusting the application position based on an angle formed by a reference line of the substrate and a straight line connecting the substrate-side electrode and another substrate-side electrode.
The control system of any one of Claims 1-4. A mounting control function for outputting information for performing control based on the board-side position information for a mounting unit that mounts the component on the board;
The control system of any one of Claims 1-5. The mounting control function is realized by outputting the substrate side position information used to determine the application position to the mounting unit.
The control system according to claim 6. The control system according to any one of claims 1 to 7,
The application unit that applies the bonding material from the head with the head facing the application position determined by the control system,
Board manufacturing system. An inspection unit for inspecting the position of the substrate-side electrode in the first coordinate system;
The control system acquires the inspection result in the inspection unit as the substrate side position information.
The substrate manufacturing system according to claim 8. A mounting part for mounting the component on the substrate;
The board | substrate manufacturing system of Claim 8 or 9. A control method for controlling a coating unit that applies a conductive bonding material from the head with a head facing a substrate-side electrode provided on the substrate,
Board-side position information representing the position of the board-side electrode in the first coordinate system, and component-side position information representing the position in the second coordinate system of the component-side electrode of the component mounted on the board-side electrode; To determine the application position of the bonding material,
Control method. A program for controlling a coating unit that applies a conductive bonding material from the head with the head facing a substrate-side electrode provided on the substrate,
Computer system,
Board-side position information representing the position of the board-side electrode in the first coordinate system, and component-side position information representing the position in the second coordinate system of the component-side electrode of the component mounted on the board-side electrode; A program for executing determination processing for determining the application position of the bonding material based on the above.

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