JP2019136849A - Processing method of workpiece - Google Patents

Abstract

To process a workpiece without adhering an adhesive to the workpiece.SOLUTION: A processing method of a workpiece (W) includes: a step of annularly coating an outer peripheral part of an insulating sheet (10) with a tacky sealing agent (11); a step of placing the workpiece through a sheet on an electrostatic chuck table (25) in a state that the sealing agent of the sheet is positioned on an outer peripheral part of the workpiece; a step of integrating by applying a voltage on positive and negative electrodes (27, 28) of the electrostatic chuck table and generating polarization on the sheet and the workpiece; a step of separating the workpiece with the sheet integrally from the electrostatic chuck table; a step of fixing the workpiece through the sheet to a chuck table (30) of a machining device, and grinding and polishing a rear surface side of the workpiece while supplying cooling water.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a workpiece processing method for grinding or polishing an workpiece.

  When grinding or polishing a workpiece such as a semiconductor wafer, an adhesive tape (grinding tape) is stuck on the device side of the workpiece to prevent the device from touching the table directly. (For example, refer to Patent Document 1). In a state where the device side of the workpiece is held on the chuck table of the grinding apparatus or the polishing apparatus via the adhesive tape, the side opposite to the device side of the workpiece is processed by the grinding wheel or the polishing pad. At this time, since the device of the workpiece is protected by the adhesive tape, the device is prevented from being damaged or damaged during grinding or polishing.

JP 09-027543 A

  However, in the processing method described in Patent Document 1, since the adhesive of the adhesive tape is directly attached to the device of the workpiece, the adhesive is removed when the adhesive tape is removed from the workpiece due to the surface state on the device side. It was left on the device. Even if the adhesive tape is an ultraviolet curable tape, it was difficult to completely remove the adhesive attached to the device.

  The present invention has been made in view of the above points, and provides a processing method for a workpiece that can protect the workpiece without causing an adhesive to adhere to the workpiece and can process the workpiece satisfactorily. One of the purposes is to provide it.

  A processing method of a workpiece according to one aspect of the present invention is a processing method of a workpiece, and a portion corresponding to an outer peripheral portion of the workpiece on the upper surface of a sheet made of an insulator having the same outer shape as the workpiece. A sheet forming step in which a sealing agent having tackiness is annularly applied to an electrostatic chuck table on which positive and negative electrodes are spaced apart in the surface direction, and the outer peripheral portion of the workpiece is annularly sealed A placement step of placing the sheet through the sheet in a state of being positioned on the agent, and after performing the placement step, a voltage is applied to the positive and negative electrodes of the electrostatic chuck table, and the sheet and the workpiece A voltage applying step for causing each of the objects to be polarized and being integrated while adsorbing, and a peeling step for peeling the workpiece with the sheet integrated from the electrostatic chuck table after performing the voltage applying step And the sea A process step of fixing a workpiece to be attached to a chuck table of a processing device via the sheet and grinding or polishing a back surface side of the workpiece while supplying cooling water. Even if it peels from a table, the adhesion | attachment of this sheet | seat and this to-be-processed object is maintained by polarization.

  According to this configuration, the workpiece is integrated with the sheet with the sealant on the electrostatic chuck table by the polarization action, and can be fixed to the chuck table of the processing apparatus while the sheet and the workpiece are in close contact with each other. it can. Since the sheet functions as a protective tape for the workpiece during grinding or polishing, the back surface of the workpiece can be ground or polished without damaging the surface of the workpiece. Since the sealing agent prevents the cooling water from entering the interface between the sheet and the workpiece, electrostatic holding between the workpiece and the sheet is not released during grinding or polishing. Therefore, it is possible to protect the workpiece with the sheet without attaching an adhesive to the workpiece, and to satisfactorily grind or polish the back surface of the workpiece.

  Another processing method of the workpiece of one embodiment of the present invention is a processing method of a workpiece, and a film sticking step of sticking an adhesive film made of an insulator on the surface of the workpiece; After performing the film adhering step, the positive and negative electrodes are placed on the electrostatic chuck table installed at intervals in the surface direction, a voltage is applied to the positive and negative electrodes of the electrostatic chuck table, A voltage application step for generating and adhering polarization to each of the adhesive film and the workpiece, and integrating the workpiece with the adhesive film integrated after the voltage application step is performed. A peeling step for peeling from the electrostatic chuck table, and the work piece with the adhesive film is fixed to the chuck table of the processing apparatus via the adhesive film, and the back surface of the work piece is supplied while supplying cooling water. And a processing step of performing grinding or polishing, and even peeled from the electrostatic chuck table, wherein the adhesion of said seal adhesive film and the workpiece is maintained by the polarization.

  According to this configuration, the workpiece is integrated with the adhesive film on the electrostatic chuck table by the polarization action, and can be fixed to the chuck table of the processing apparatus while the adhesive film and the workpiece are in close contact with each other. it can. Since the adhesive film functions as a protective tape for the workpiece during grinding or polishing, the back surface of the workpiece can be ground or polished without damaging the surface of the workpiece. Since entry of cooling water into the interface between the adhesive film and the workpiece is suppressed, electrostatic holding between the workpiece and the adhesive film is not released during grinding or polishing. Therefore, the work piece can be protected with the adhesive film without causing the adhesive to adhere to the work piece, and the back surface of the work piece can be satisfactorily ground or polished.

  According to the present invention, a workpiece can be protected without attaching a pressure-sensitive adhesive to the workpiece by adhering the workpiece to the sheet or adhesive film with the sealant by a polarization action. The back surface of the workpiece can be ground or polished satisfactorily.

It is a perspective view of the to-be-processed object of this Embodiment. It is a figure which shows an example of the processing method of the to-be-processed object of a comparative example. It is explanatory drawing of the processing method of the to-be-processed object of 1st Embodiment. It is explanatory drawing of the processing method of the to-be-processed object of 1st Embodiment. It is explanatory drawing of the processing method of the to-be-processed object of 2nd Embodiment. It is explanatory drawing of the processing method of the to-be-processed object of 2nd Embodiment.

  Hereinafter, a processing method of a workpiece according to the present embodiment will be described with reference to the accompanying drawings. First, a workpiece to be processed will be described. FIG. 1 is a perspective view of a workpiece according to the present embodiment. FIG. 2 is a diagram illustrating an example of a method for processing a workpiece according to a comparative example.

  As shown in FIG. 1, the surface of the workpiece W is partitioned into a plurality of regions by a grid-like division planned line L, and a device D is formed in each region partitioned by the planned division line L. . When grinding or polishing such a workpiece W, a protective tape T is attached to the surface of the workpiece W, and the back surface of the workpiece W is protected with the protective tape T protecting the device D. It is ground or polished. Normally, an adhesive tape formed by laminating an adhesive layer on a tape base material is used as the protective tape T. The adhesive tape is expensive, and there is a problem that the adhesive remains in the device D even if the adhesive tape is peeled off from the workpiece W.

  For this reason, as shown in FIG. 2A, the use of an inexpensive electrostatic holding tape 15 that does not use an adhesive as the protective tape T has been studied. The electrostatic holding tape 15 is formed in a sheet shape with an insulating material, and the cost can be reduced as compared with a general adhesive tape. Further, the workpiece W is placed on the electrostatic chuck table (not shown) via the electrostatic holding tape 15, and the electrostatic holding tape 15 and the workpiece W are caused to polarize, thereby causing adhesion. The electrostatic holding tape 15 and the workpiece W can be integrated without using an agent. For this reason, even if the electrostatic holding tape 15 is peeled from the workpiece W, no adhesive remains on the device D.

  However, as shown in FIG. 2B, the surface of the electrostatic holding tape 15 has fine irregularities, and the adhesion between the electrostatic holding tape 15 and the workpiece W is not sufficient. For this reason, during grinding by the grinding means 31, the cooling water may enter through a minute gap between the electrostatic holding tape 15 and the workpiece W, and the workpiece W may be detached from the electrostatic holding tape 15. . Therefore, in the processing method of the workpiece W according to the first embodiment, the sheet 10 with the sealant 11 is used as the protective tape T, the sheet 10 and the workpiece W are brought into close contact with each other by the polarization action, and the sealant 11 This prevents the release of electrostatic holding due to the ingress of cooling water (see FIG. 4).

  Hereinafter, the processing method of the to-be-processed object of 1st Embodiment is demonstrated. 3 and 4 are explanatory views of the processing method of the workpiece according to the first embodiment. 3A shows an example of a sheet forming step, FIG. 3B shows a placement step, FIG. 3C shows an example of a voltage application step, FIG. 4A shows a peeling step, and FIGS. 4B and 4C show processing examples.

  As shown in FIG. 3A, a sheet forming step is first performed. In the sheet forming step, the circular sheet 10 is placed on the rotary table 20, and the dispenser 21 is positioned above the outer periphery of the sheet 10. The sheet 10 is made of an insulator having the same outer shape as the workpiece W (see FIG. 3B), and is used as a protective tape for protecting the device D of the workpiece W. The dispenser 21 is filled with a sealing agent 11 having tackiness when dried and cured. When the dispenser 21 is positioned on the outer periphery of the sheet 10, the sealant 11 is supplied from the dispenser 21 to the upper surface of the sheet 10 while the rotary table 20 is rotated.

  Thereby, the sealing agent 11 is cyclically applied to the portion corresponding to the outer peripheral portion of the workpiece W on the upper surface of the sheet 10, and the sealing agent 11 is dried and cured, whereby the sheet 10 with the sealing agent 11 is formed. For the sheet 10, for example, a resin material such as a polyethylene film, a nylon sheet, a wrap film, or a silicone sheet is used. Moreover, the sealing agent 11 should just be a soft resin and has tackiness, for example, may be comprised with silicone resin (silicone rubber). Here, tackiness means the property of adhering to a solid surface due to rubber characteristics without using an adhesive or an adhesive, so-called self-adhesiveness. The tacky material adheres to the solid surface without any gap, so that it does not peel off to the extent that the solid surface is tilted.

  As shown in FIG. 3B, the placing step is performed after the sheet forming step. In the placing step, the workpiece W is placed on the electrostatic chuck table 25 via the sheet 10. At this time, the outer peripheral portion of the workpiece W is positioned on the annular sealing agent 11 provided on the outer peripheral portion of the sheet 10, and the sealing agent 11 is placed on the outer peripheral portion of the workpiece W due to the tackiness of the sealing agent 11. It is in close contact. The electrostatic chuck table 25 employs a gradient-type electrostatic chuck that generates an electrostatic force (gradient force) with a mounted object, and is formed by forming positive and negative electrodes 27 and 28 on a resin sheet 26. Has been. The positive and negative electrodes 27 and 28 are alternately arranged at intervals in the surface direction of the resin sheet 26.

  The resin sheet 26 is formed in a circular shape with an insulating material such as PET (Poly Ethylene Terephthalate). The positive and negative electrodes 27 and 28 are formed of a transparent electrode such as indium tin oxide, and are electrically insulated by separating the adjacent positive and negative electrodes 27 and 28 from each other. A positive terminal of the power source 29 is connected to the positive electrode 27 via a power supply terminal, and a negative terminal of the power source 29 is connected to the negative electrode 28 via a power supply terminal. In addition, the resin sheet 26 and the positive and negative electrodes 27 and 28 of the electrostatic chuck table 25 are flexible, and the electrostatic chuck table 25 can be bent. Although not described in detail, the electrostatic chuck table 25 may include a base made of silicon, glass, quartz, ceramics or the like that supports the resin sheet 26 from below.

  As shown in FIG. 3C, the voltage application step is performed after the placement step is performed. In the voltage application step, a voltage is applied to the positive and negative electrodes 27 and 28 of the electrostatic chuck table 25, and polarization is generated and attracted to the sheet 10 and the workpiece W, respectively. In this case, a positive voltage is applied to the positive electrode 27, a negative voltage is applied to the negative electrode 28, and a positive charge and a negative charge are alternately generated in the sheet 10 and the workpiece W. Integrated. Moreover, the sheet | seat 10 and the workpiece W are pulled near, and the sealing agent 11 of the outer peripheral part of the sheet | seat 10 is slightly crushed, and the workpiece W and the sealing agent 11 contact without gap.

  Specifically, when a positive voltage is applied to the positive electrode 27 and a negative voltage is applied to the negative electrode 28 over a predetermined time, dielectric polarization occurs in the sheet 10 and the workpiece W, and each other Electrostatic force is generated by attracting positive and negative charges. Here, by setting the thickness of the sheet 10 and the sealing agent 11 to 100 μm or less, even when the sheet 10 is interposed, dielectric polarization can be favorably generated in the workpiece W. Further, by using the insulating sheet 10, the polarization state is easily maintained, and even when the workpiece W with the sheet 10 is peeled off from the electrostatic chuck table 25, the adhesion between the sheet 10 and the workpiece W is predetermined. Maintained for a period of time (eg 1-2 weeks). In addition, it is possible to maintain a good contact state by adjusting the shapes, sizes, and intervals of the positive and negative electrodes 27 and 28.

  As shown in FIG. 4A, the peeling step is performed after the voltage application step is performed. In the peeling step, the workpiece W with the sheet 10 integrated with the electrostatic chuck table 25 is peeled off. In this case, the outer peripheral edge of the electrostatic chuck table 25 is grasped and peeled off from the sheet 10 while the electrostatic chuck table 25 is bent. Even after the electrostatic chuck table 25 is peeled from the sheet 10, the adhesion between the sheet 10 and the workpiece W is maintained by polarization. In the peeling step, the electrostatic chuck table 25 may be peeled off by a peeling device (not shown), or the electrostatic chuck table 25 may be manually peeled off by an operator.

  As shown in FIG. 4B, the processing step is performed after the peeling step is performed. In the processing step, the workpiece W with the sheet 10 is transported to the chuck table 30 of a processing apparatus (not shown), and the chuck side of the workpiece W is placed through the sheet 10 with the back side of the workpiece W facing upward. 30 is fixed. The grinding means 31 is positioned above the chuck table 30, and the grinding wheel 32 of the grinding means 31 is brought close to the workpiece W on the chuck table 30. Then, the back side of the workpiece W is ground by the grinding wheel 32 while the cooling water is supplied.

  As shown in FIG. 4C, since the sealing agent 11 having tackiness is in close contact with the workpiece W during grinding, the sealing agent 11 suppresses the entry of cooling water to the interface between the sheet 10 and the workpiece W. It has been. Therefore, the electrostatic holding of the sheet 10 and the workpiece W is not hindered by the cooling water, and the workpiece W is prevented from being detached from the sheet 10 during grinding. Thus, even in processing using cooling water, since the adhesion between the sheet 10 and the workpiece W is maintained by polarization, the sheet 10 without an adhesive can be used as a protective tape during grinding. . Therefore, even if the sheet 10 with the sealing agent 11 is peeled from the workpiece W, the adhesive does not remain on the device D.

  As described above, according to the processing method for the workpiece W according to the first embodiment, the workpiece W is integrated with the sheet 10 with the sealant 11 on the electrostatic chuck table 25 by the polarization action. The sheet 10 and the workpiece W can be fixed to the chuck table 30 of the processing apparatus while being in close contact with each other. Since the sheet 10 functions as a protective tape for the workpiece W during grinding, the back surface of the workpiece W can be ground without damaging the device D of the workpiece W. Since the sealing agent 11 prevents the cooling water from entering the interface between the sheet 10 and the workpiece W, electrostatic holding between the workpiece W and the sheet 10 is not released during grinding. Therefore, the device D can be protected by the sheet 10 without attaching an adhesive to the workpiece W, and the back surface of the workpiece W can be ground well.

  Then, the processing method of the to-be-processed object of 2nd Embodiment is demonstrated. The second embodiment is different from the first embodiment in that an adhesive film is used instead of a sheet with a sealant. 5 and 6 are explanatory diagrams of the processing method of the workpiece according to the second embodiment. FIG. 5A shows an example of a film sticking step, FIG. 5B and FIG. 5C show an example of a voltage application step, FIG. 6A shows a peeling step, and FIG. 6B and FIG.

  As shown to FIG. 5A, a film sticking step is first implemented. In the film sticking step, the adhesive film 13 made of an insulator is stuck on the surface of the workpiece W. The adhesive film 13 is a stretch film having self-adhesive properties, and is formed of, for example, polyvinylidene chloride resin (PVDC), polyvinyl chloride resin (PVC), polyolefin (PO) resin, or a multilayer film thereof. . In particular, the adhesive film 13 is preferably a stretch film made of vinylidene chloride such as Saran Wrap (registered trademark) or NEW Kurewrap (registered trademark) used for food packaging films. The adhesive film 13 is formed with a thickness of 100 μm or less so that dielectric polarization occurs in the workpiece W via the adhesive film 13.

  In the second embodiment, since the adhesive film 13 is used, unlike the first embodiment, the application work and the drying work of the sealing agent 11 (see FIG. 3A) are not required. Therefore, it is possible to shorten the work time by the amount that the work man-hour is reduced. In the film sticking step, the adhesive film 13 may be stuck on the surface of the workpiece W by a sticking device (not shown), or the adhesive film is manually attached to the surface of the workpiece W by an operator. 13 may be affixed. The self-adhesiveness of the adhesive film 13 means a property that the film adheres by itself without using an adhesive.

  As shown in FIG. 5B, the voltage application step is performed after the film sticking step is performed. In the voltage application step, the workpiece W is placed on the electrostatic chuck table 25 via the adhesive film 13. At this time, the adhesive film 13 is stuck to the surface of the workpiece W by self-adhesion, and the device D of the workpiece W is protected by the adhesive film 13. The electrostatic chuck table 25 has the same configuration as that of the first embodiment, and positive and negative electrodes 27 and 28 are alternately arranged on the surface of the resin sheet 26 at intervals in the surface direction. It is formed in a table shape having

  As shown in FIG. 5C, when the adhesive film 13 and the workpiece W are placed on the electrostatic chuck table 25, a voltage is applied to the positive and negative electrodes 27 and 28 of the electrostatic chuck table 25, and the adhesiveness is increased. Polarization is generated and adsorbed on each of the film 13 and the workpiece W. In this case, a positive voltage is applied to the positive electrode 27, a negative voltage is applied to the negative electrode 28, and a positive charge and a negative charge are alternately applied to the adhesive film 13 and the workpiece W. To be integrated. Thereby, in addition to the self-adhesiveness of the adhesive film 13, the adhesive film 13 is closely adhered to the surface of the workpiece W by electrostatic holding without any gap.

  As shown in FIG. 6A, the peeling step is performed after the voltage application step is performed. In the peeling step, the workpiece W with the adhesive film 13 integrated from the electrostatic chuck table 25 is peeled off. In this case, the outer peripheral edge of the electrostatic chuck table 25 is grasped and peeled off from the adhesive film 13 while the electrostatic chuck table 25 is bent. Even after the electrostatic chuck table 25 is peeled from the adhesive film 13, the adhesion between the adhesive film 13 and the workpiece W is maintained by polarization. In the peeling step, the electrostatic chuck table 25 may be peeled off by a peeling device (not shown), or the electrostatic chuck table 25 may be manually peeled off by an operator.

  As shown in FIG. 6B, the processing step is performed after the peeling step is performed. In the processing step, the workpiece W with the adhesive film 13 is transported to the chuck table 30 of a processing apparatus (not shown), and the front surface side of the workpiece W faces the adhesive film 13 with the back side facing upward. Through the chuck table 30. The grinding means 31 is positioned above the chuck table 30, and the grinding wheel 32 of the grinding means 31 is brought close to the workpiece W on the chuck table 30. Then, the back side of the workpiece W is ground by the grinding wheel 32 while the cooling water is supplied.

  As shown in FIG. 6C, since the adhesive film 13 is in close contact with the workpiece W at the time of grinding, intrusion of cooling water to the interface between the adhesive film 13 and the workpiece W is suppressed. Therefore, the electrostatic holding of the adhesive film 13 and the workpiece W is not hindered by the cooling water, and the workpiece W is prevented from being detached from the adhesive film 13 during grinding. Thus, even when processing using cooling water, the adhesion between the adhesive film 13 and the workpiece W is maintained by polarization, so the adhesive film 13 without an adhesive is used as a protective tape during grinding. can do. Therefore, even if the sheet 10 with the adhesive film 13 is peeled from the workpiece W, the adhesive does not remain on the device D.

  As described above, according to the processing method of the workpiece W according to the second embodiment, the workpiece W is integrated with the adhesive film 13 on the electrostatic chuck table 25 by the polarization action, and the adhesiveness is improved. The film 13 and the workpiece W can be fixed to the chuck table 30 of the processing apparatus while being in close contact with each other. Since the adhesive film 13 functions as a protective tape for the workpiece W during grinding, the back surface of the workpiece W can be ground without damaging the device D of the workpiece W. Since the penetration of the cooling water into the interface between the adhesive film 13 and the workpiece W is suppressed, the electrostatic holding of the workpiece W and the adhesive film 13 is not released during grinding. Therefore, the device D of the adhesive film 13 can be protected without attaching an adhesive to the workpiece W, and the back surface of the workpiece W can be ground well.

  In the first embodiment, the sealing agent is dried and cured in the sheet forming step. However, the sealing agent may be cured by applying heat, or the sealing agent is cured by irradiation with ultraviolet rays. Also good.

  In the first and second embodiments, the back surface of the workpiece is ground as the processing step. However, the present invention is not limited to this configuration. You may make it the structure which grind | polishes the back surface of a workpiece as a process step.

  In the first and second embodiments, positive and negative electrodes are alternately installed on the electrostatic chuck table. However, the present invention is not limited to this configuration. It is only necessary that positive and negative electrodes be installed on the electrostatic chuck table with an interval therebetween, and the number of electrodes and the arrangement of the electrodes are not particularly limited.

  Various workpieces such as a semiconductor substrate, an inorganic material substrate, and a package substrate may be used as the workpiece depending on the type of processing. As the semiconductor substrate, various substrates such as silicon, gallium arsenide, gallium nitride, and silicon carbide may be used. Various substrates such as sapphire, ceramics, and glass may be used as the inorganic material substrate. A device may be formed on the semiconductor substrate and the inorganic material substrate, or the device may not be formed. As the package substrate, various substrates for CSP (Chip Size Package), WLCSP (Wafer Level Chip Size Package), SIP (System In Package), and FOWLP (Fan Out Wafer Level Package) may be used. A shield against EMI (Electro Magnetic Interference) may be formed on the package substrate. Further, lithium tantalate, lithium niobate, green ceramics, or piezoelectric material after device formation or before device formation may be used as the workpiece.

  Moreover, although this Embodiment and the modified example were demonstrated, what combined the said embodiment and modified example entirely or partially as another embodiment of this invention may be sufficient.

  The embodiments and modifications of the present invention are not limited to the above-described embodiments, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

  In the present embodiment, the configuration in which the present invention is applied to the workpiece grinding method and polishing method has been described. However, the present invention is applied to other processing methods for processing a workpiece while protecting the device with a protective tape. It is also possible.

  As described above, the present invention can protect the workpiece without attaching an adhesive to the workpiece, and has an effect that the workpiece can be processed satisfactorily. It is effective for a processing method of a workpiece for grinding or polishing the workpiece.

DESCRIPTION OF SYMBOLS 10 Sheet | seat 11 Sealing agent 13 Adhesive film 25 Electrostatic chuck table 26 Resin sheet 27 Positive electrode 28 Negative electrode 30 Chuck table 31 Grinding means W Workpiece

Claims (2)

A processing method for a workpiece,
A sheet forming step of annularly applying a sealing agent having tackiness to a portion corresponding to the outer peripheral portion of the workpiece on the upper surface of the sheet made of an insulator having the same outer shape as the workpiece;
A placing step for placing the outer peripheral portion of the workpiece on the electrostatic chuck table in which positive and negative electrodes are spaced apart in the plane direction with the outer peripheral portion of the workpiece positioned on the annular sealant via the sheet. When,
A voltage applying step of applying a voltage to the positive and negative electrodes of the electrostatic chuck table after performing the placing step, and generating a polarization to each of the sheet and the work piece while adsorbing them;
A peeling step of peeling the workpiece with the sheet integrated from the electrostatic chuck table after performing the voltage application step;
The workpiece with the sheet is fixed to a chuck table of a processing apparatus via the sheet, and a processing step of grinding or polishing the back side of the workpiece while supplying cooling water is provided.
A method of processing a workpiece, wherein even if the electrostatic chuck table is peeled off, the adhesion between the sheet and the workpiece is maintained by polarization. A processing method for a workpiece,
A film sticking step for sticking an adhesive film made of an insulator to the surface of the workpiece;
After performing the film adhering step, the positive and negative electrodes are placed on the electrostatic chuck table installed at intervals in the surface direction, a voltage is applied to the positive and negative electrodes of the electrostatic chuck table, A voltage application step for integrating the adhesion film and the work piece while generating and adsorbing polarization, and
After performing the voltage application step, a peeling step of peeling the workpiece with the adhesive film integrated from the electrostatic chuck table;
A processing step of fixing the workpiece with the adhesive film to the chuck table of the processing apparatus via the adhesive film and grinding or polishing the back side of the workpiece while supplying cooling water. Prepared,
A method of processing a workpiece, wherein the adhesion between the adhesive film and the workpiece is maintained by polarization even after peeling from the electrostatic chuck table.

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