JP2019134183A - Light-emitting device - Google Patents

Abstract

To provide a light-emitting device with a small emission diameter and high luminous flux.SOLUTION: A light-emitting device includes a substrate, a conductive member formed on the surface of the substrate, a white resist layer that covers the side surface of the conductive member and is formed on the surface of the substrate, and a plurality of light-emitting elements connected to the conductive member, and the conductive member has a plurality of lands corresponding to the plurality of light emitting elements.SELECTED DRAWING: Figure 5

Description

  The present disclosure relates to a light emitting device.

Conventionally, a light emitting device configured to emit white light using a light emitting element that emits blue light and a fluorescent material that is excited by absorbing a part of blue light and emits light having a longer wavelength is known. ing. In such a light emitting device, there is known a light emitting device in which a plurality of light emitting elements are mounted on a substrate, the elements are connected with wires, and the top is covered with a sealing resin containing a phosphor (for example, a patent) Reference 1).

JP 2012-79855 A

However, according to the conventional light emitting device (Patent Document 1), since the light emission diameter is large, it is difficult to apply to illumination for narrow-angle light distribution applications such as a projector. When the emission diameter is reduced, the number of light emitting elements is reduced, and there is a problem that the required luminous intensity and luminous flux are not satisfied.

The present disclosure has been made in view of such circumstances, and is characterized by providing a light emitting device having a small emission diameter and a high luminous flux.

The light-emitting device of the present disclosure includes a substrate, a conductive member formed on the surface of the substrate, and a first light-emitting element and a second light-emitting element connected to the conductive member, and the conductive member includes the first light-emitting element. A first land and a second land corresponding to the pair of electrodes of the one light emitting element; a third land and a fourth land corresponding to the pair of electrodes of the second light emitting element; the second land and the third land; The first land and the third land, the second land and the fourth land are adjacent to each other, and the outer edge of the first land is the first land Located on the inner side of the intersection of the side located on the second land side and the side located on the third land side,
The outer edge of the land is located on the inner side of the point where the side located on the second land side and the side located on the third land side intersect.
In addition, the substrate of the present disclosure is a substrate for a light emitting device including a conductive member for connecting a plurality of light emitting elements on the surface, and the conductive member corresponds to a pair of electrodes of the first light emitting element. A first land and a second land, a third land and a fourth land corresponding to a pair of electrodes of the second light emitting element, and a connecting portion for connecting the second land and the third land, The first land and the third land, the second land and the fourth land are arranged adjacent to each other, and an outer edge of the first land is a side located on the second land side, and the third land The outer edge of the fourth land is located on the inner side of the point where the side located on the second land side and the side located on the third land side intersect. It is a board | substrate characterized by being located in.

According to the present disclosure, by having the above characteristics, it is possible to realize a light emitting device and a substrate for the light emitting device that have a small emission diameter and a high luminous flux.

Schematic structure diagram showing an example of a light emitting device of the present disclosure The figure which expanded some light emitting devices of this indication Schematic structure diagram showing an example of a light emitting device of the present disclosure Schematic structure diagram and cross-sectional view showing an example of a light-emitting device of the present disclosure Sectional drawing which expanded a part of light-emitting device of this indication

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present disclosure, and the present disclosure is not limited to the following unless otherwise specified. The contents described in one embodiment and example are applicable to other embodiments and examples.
The size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. In the figure, the “x” direction is also referred to as “horizontal” direction, the “y” direction is also referred to as “vertical” direction, and the “z” direction is also referred to as “vertical” direction or “height (thickness)” direction.

FIG. 1 is a schematic structural diagram illustrating an example of a light emitting device according to the present embodiment. FIG. 2 is a diagram illustrating a configuration in which a frame body 130, a sealing member 132, and a light emitting element are removed from the light emitting device of FIG. It is a display.
As shown in FIGS. 1 and 2, the light-emitting device 100 of this embodiment includes a substrate 102, a substrate 1, and a substrate 1.
Conductive member 104 formed on the surface of 02, and the first light emitting element 1 connected to the conductive member 104
20 and a second light emitting element 122.

FIG. 3 is an enlarged view of the vicinity of the first light emitting element 120 and the second light emitting element 122.
As shown in FIG. 3, the conductive member 104 includes a first land 11 and a second land 12 corresponding to the pair of electrodes of the first light emitting element 120, and a third corresponding to the pair of electrodes of the second light emitting element 122.
A land 13 and a fourth land 14 are provided. In FIG. 2, the first light emitting element 12
The 0 and second light emitting elements 122 are shown only on the outer edges for ease of explanation,
The land shape can be seen through the light emitting element.

In order to electrically connect the first light emitting element 120 and the second light emitting element 122, the conductive member 104 is used.
Further includes a connecting portion 15 that connects the second land 12 and the third land 13.
Further, the first land 11 and the third land 13, the second land 12 and the fourth land 14 are arranged adjacent to each other, and the first land 11 and the fourth land 14, and the second land 12 and the third land are arranged. 13 are arranged so as to face each other with the connecting portion 15 interposed therebetween.

As shown in FIG. 3, the outer edges of the first land 11, the second land 12, the third land 13 and the fourth land 14 have straight lines extending in the x direction and the y direction.
Moreover, the connection part 15 has the side E and the side F which become diagonal with respect to the x direction and the y direction at the outer edge. The side E and the side F are substantially parallel to each other, and the second land 1 has a certain width.
2 and the corner of the third land 13 are connected.

Furthermore, all of the outer edges of the first land 11 are located inside the point C where the side A located on the second land 12 side and the side B located on the third land 13 side intersect. In the present embodiment, side A and side B are straight lines. From another point of view, the first land 11 has an outer edge formed of a plurality of straight lines, and has a shape in which a corner of a portion close to the connecting portion 15 is chamfered. The side D that can be chamfered in this way is formed obliquely with respect to the side A and the side B, and the side D is substantially parallel to the side E and the side F of the connecting portion adjacent to the side D. Are arranged as follows.

Similarly, all of the outer edges of the fourth land 14 have sides located on the inner side of the point I where the side located on the second land 12 side and the side located on the third land 13 side intersect. .

In order to reduce the emission diameter and keep the luminous flux high, it is necessary to mount the required number of light emitting elements at a high density in order to obtain a desired luminous flux. Further, in order to obtain a high luminous flux, it is necessary to have a structure capable of flowing a larger amount of current. Therefore, it is preferable to use flip chip mounting that has high heat dissipation and can be mounted at a narrow pitch.

In the present embodiment, the pair of positive and negative electrodes of the first light emitting element 120, the first land 11 and the second land
The land 12 is electrically connected by flip-chip mounting via a joining member. Here, it is preferable that the planar shape of the pair of electrodes of the first light emitting element 120 substantially matches the planar shape of the first land 11 and the second land 12. FIG. 4 illustrates a light-emitting element that can be used in this embodiment. As shown in FIG. 4, the shape of the pair of electrodes of the light emitting element is substantially the same as the shape of the land. Accordingly, when the light emitting element is reflow-mounted using solder or the like, the land and the electrode can be easily aligned using the self-alignment effect. Since the alignment accuracy can be improved, high-density mounting is possible.

On the other hand, in the case of flip-chip mounting, since no wire is used for electrical connection between the light emitting elements, it is necessary to establish electrical connection between the light emitting elements with a conductive member on the substrate side. In the present embodiment, FIG.
As shown in FIG. 3, the second land 12 and the third land 13 are connected by a connecting portion 15. In the present embodiment, the outer edge of the first land 11 is located on the inner side of the point D where the side A located on the second land 12 side and the side B located on the third land 13 side intersect. Therefore, the lands of the first light emitting element and the second light emitting element can be arranged at a narrow pitch without reducing the width of the connecting portion 15. The same applies to the fourth land 14.

If the width of the connecting portion 15 becomes narrow, there is a risk that fusing or excessive heating of the wiring may occur when driving at a high current. Therefore, it is necessary to ensure the width | variety according to the electric current value which the connection part 15 wants to flow through.
Although measures can be taken to prevent fusing by increasing the thickness of the connecting portion 15 (the length in the z direction), it is more preferable to increase the width than to increase the plating thickness. In addition, although a metal member can be embedded inside the substrate, it is not preferable because the number of steps for creating the substrate increases and the structure becomes complicated. In the present embodiment, since a single-layer substrate using a flat insulating member can be used as the substrate 102, the cost of the substrate can be suppressed.

For example, in order to reduce the emission diameter and increase the luminous flux, the interval between adjacent light emitting elements is 0. 0.
It is preferable that it is 1 micrometer-0.3 micrometer. Moreover, it is preferable that the space | interval of the adjacent 1st land and 3rd land shall be 400 micrometers or less.

Moreover, from the viewpoint of measures against fusing, for example, the width of the connecting portion 15 is preferably set to 1/5 or more of the length of one side of the mounted light emitting element.

  Hereinafter, the preferable form of the light-emitting device 100 which concerns on this Embodiment is demonstrated.

(Substrate 102)
The substrate 102 is a member that serves as a base on which the first light emitting element 120 and the second light emitting element 122 are placed. From the viewpoint of cost reduction, it is preferably a flat plate made of an insulating member, but may have a recess in a portion where the light emitting element is placed.

The material of the substrate 102 is preferably an inorganic member that is a material with little deterioration,
Ceramics are particularly preferable. Examples of the ceramic material include alumina, mullite, forsterite, aluminum nitride (AlN), silicon carbide (SiC), and low-temperature co-fired ceramics (LTCC). Especially, it is preferable to use aluminum nitride from a viewpoint of improving heat dissipation, and it is preferable to use the member whose heat conductivity is 160 W / m * K or more.

Further, when it is desired to increase the reflectance of the substrate itself, the substrate 102 is made of alumina, yttria,
Particles of inorganic materials such as zirconia, titania, diamond, calcium oxide, and barium sulfate may be formed into a porous body having a large number of voids by being partially integrated with each other. Thereby, a reflectance can be improved by the refractive index difference between air and these materials. For example, the reflectance at a wavelength of 450 nm is preferably 80% or more, and more preferably 85% or more.

In addition to ceramics, a resin can be used as a material applicable to the present embodiment. Examples of such resin materials include aliphatic polyamide resins, semi-aromatic polyamide resins, polyethylene terephthalate, polycyclohexane terephthalate, liquid crystal polymers,
Polycarbonate resin, syndiotactic polystyrene, polyphenylene ether, polyphenylene sulfide, polyether sulfone resin, polyether ketone resin, polyarylate resin and other thermoplastic resins, polybismaleimide triazine resin, epoxy resin, silicone resin, silicone modified resin, epoxy You may form from thermosetting resins, such as modified resin, a polyimide resin, a polyurethane resin, and a phenol resin.

In the present embodiment, an example in which the substrate 102 has a rectangular outer shape in plan view has been described. However, the present invention is not limited to this and may be a square or a polygon. As an example, the outer shape is 24 mm × 19 mm,
The thickness is 1 mm.

(Conductive member 104)
A conductive member 104 is formed on the surface of the substrate 102. The conductive member 104 is a conductive member for supplying power to the light emitting element.
As shown in FIG. 2, the conductive member 104 includes a first land 11, a second land 12, a third land 13, a fourth land 14 that are directly bonded to the electrode of the light emitting element via a bonding member, and a connecting portion 15.
Have In addition, a pad portion 110 for applying an external power source to the end portion of the substrate is provided.
A connector may be connected to the pad portion 110 to supply external power via the connector. Furthermore, it has the wiring part 112 which connects the pad part 110 and each land.

Since the conductive member 104 generates light absorption, it is preferable that the conductive member 104 be formed as small as possible while ensuring a necessary size. Therefore, it is preferable that the portion of the wiring portion 112 that has a small current capacity is formed narrower than the other portions. Specifically, as shown in FIG. 2, the wiring portion 112 is formed to have a wide portion 106 and a narrow portion 108 that is narrower than the wide portion. Thereby, the light absorption in a wiring part can be suppressed. In addition,
The wide portion 106 is disposed closer to the pad portion 110 than the narrow portion 108.

When using ceramics as the substrate 102, the conductive member 104 is formed as a metal layer. For example, it may be formed by forming a metallized layer made of a refractory metal on the surface of the substrate 102 and firing the whole by a cofire method, or by applying various pastes on the sintered substrate 102, You may form by the postfire method which laminates | stacks a metal film by sputtering. Further, after the metal layer is formed on the surface of the substrate, the pattern may be formed by dry film resist or etching.

The material of the conductive member formed on the ceramic is W, Mo, Ti, Ni, Au, Cu
, Ag, Pd, Rh, Pt, Sn, etc. are formed by disposing a metal or alloy layer whose main component is a substrate on the substrate. Specifically, it can be formed by vapor deposition, sputtering, printing, etc., and further by plating or the like. There is little deterioration, and from the viewpoint of adhesion with the joining member,
A metal containing Au as a main component is preferably used for the outermost surface of the conductive member 104.

Furthermore, in order to improve heat dissipation, Cu having high thermal conductivity may be formed thicker than other metals. For example, it is preferable to form a layer containing Cu of 25 μm or more.

In the case where a resin is used as the material of the substrate 102, a conductive member is obtained by attaching a metal plate to a semi-cured prepreg and thermally curing the resin, and then patterning the metal plate into a desired shape using a photolithography method or the like. Can be formed. In this case, the surface may be further plated.

In addition, when forming the conductive member, a positioning mark, a mark indicating polarity,
A pattern for temperature measurement may be formed simultaneously. In the present embodiment, as shown in FIG. 1, an anode mark AM, a temperature measurement pattern TP, and a positioning mark 134 are formed.

(Light emitting element)
The light emitting elements (the first light emitting element 120 and the second light emitting element 122) are disposed on the substrate 102. The light emitting element is bonded to the substrate 102 through a bonding member and is electrically connected to the conductive member 104. As the light emitting element, for example, a semiconductor light emitting element such as an LED element can be used. A light-emitting element usually includes a light-transmitting substrate, a semiconductor layer stacked on the light-transmitting substrate, and a pair of positive and negative electrodes provided on the semiconductor layer.

The pair of positive and negative electrodes are formed on the same side of the semiconductor stacked body (on the opposite side when a light-transmitting substrate is present). Thereby, flip-chip mounting can be performed in which the positive and negative lands of the substrate 102 and the positive and negative electrodes of the light emitting element are opposed to each other. In the present embodiment, as shown in FIG. 4, a pair of positive and negative electrodes 140 having substantially the same shape are provided on the same surface of the light emitting element 120. The shape of the electrode 140 substantially matches the shape of the first land 11 and the second land 12.

The positive and negative electrodes of the light emitting element are, for example, Au, Pt, Pd, Rh, Ni, W, Mo, Cr,
It can be formed of a single layer film or a laminated film of Ti or the like or an alloy thereof. Specifically, Ti / Rh / Au, W / Pt / Au, Rh / Pt / Au, W / Pt / A from the semiconductor layer side.
Examples thereof include a laminated film laminated such as u, Ni / Pt / Au, Ti / Rh. The film thickness is
Any of the film thicknesses used in the field may be used.

In the light emitting element, a reinforcing layer may be arranged on the side of the arrangement surface of the positive and negative electrodes of the nitride semiconductor multilayer body. Here, the reinforcing layer may be formed of any material of an insulator, a semiconductor, and a conductor as long as the strength of the nitride semiconductor multilayer body can be reinforced. The reinforcement layer
As a whole, any of a single layer or a laminated layer, a single layer or a laminated layer disposed in a plurality of places, and the like may be used.
In addition, the reinforcing layer may be a layer that partially secures insulation and conductivity that are essential for the function of the light emitting element. In particular, part of a film used for forming the light-emitting element may be thickened. Specifically, the conductive layer functioning as an electrode or the like may be thickened by a known method such as plating or sputtering. An interlayer insulating film, a surface protective film, or the like disposed between them may be thickened. Thereby, it is possible to prevent an increase in the size of the light-emitting device without arranging an additional layer while securing an appropriate strength.

The light emitting element may emit ultraviolet light or visible light. When used in a light-emitting device that generates white light, the light-emitting element preferably has an emission wavelength of 400 nm or more and 530 n.
It is preferable that the blue light emitting element has a length of m or less, more preferably 420 nm or more and 490 nm or less. A white light emitting device can be obtained by using a blue light emitting element in combination with a yellow phosphor as a wavelength conversion member described later. As a blue light emitting element, a nitride semiconductor (In _x Al _y Ga _1-xy N, 0 ≦ x, 0 ≦ y, x + y) that can excite phosphor efficiently.
A light emitting device of ≦ 1) is particularly preferable. The light emitting elements mounted on one light emitting device 100 are 2
It is more than one. Note that a protective element or the like may be provided in addition to the light-emitting element. The protective element may be connected by a wire or may be flip-chip mounted.

(Joining member)
The bonding member is a member that fixes the light emitting element to the conductive member 104 of the substrate 102.
In this case, usually, a pair of positive and negative electrodes of the light emitting element are bonded to the above-described land by a bonding member. As such a joining member, any material known in the art can be used, and examples thereof include a conductive joining member. Specifically, for example, tin-bismuth, tin-copper,
Tin-silver or gold-tin solder (specifically, an alloy mainly composed of Ag, Cu and Sn, C
alloys containing u and Sn as main components, alloys containing Bi and Sn as main components, and eutectic alloys (Au
Alloys mainly composed of Sn and Sn, alloys composed mainly of Au and Si, alloys composed mainly of Au and Ge, etc.) Conductive paste such as silver, gold, palladium, bump, anisotropic conductive Examples thereof include a brazing material such as a metal and a low melting point metal. In particular, by using solder, the self-alignment effect with high accuracy can be exhibited in combination with the shape of the land described above. Therefore, it becomes easy to mount the light emitting element in place, the mass productivity can be improved, and a smaller light emitting device can be manufactured.

(White resist)
When the substrate 102 is a member that absorbs or transmits light, the surface of the substrate is preferably covered with a white resist.
FIG. 5 is a view showing a cross section of the substrate 102 on which the light emitting element shown in FIG. 1 is mounted. In the present embodiment, a white resist is formed on the surface of the substrate 10 so as to cover the side surface of the conductive member 104a. Such a white resist is, for example, the substrate 1 on which the conductive member 104a is arranged.
After forming a white resist layer on 02 to cover the conductive member 104a, the conductive member 10
The white resist 142 is polished until the surface of 4a is exposed. As a result, the white resist 1
Thus, it is possible to obtain a substrate in which the upper surface of 42 and the upper surface of the conductive member 104 coincide and the gap between the conductive member and the conductive member is filled with the white resist 142. Further, the upper surface of the conductive member can be made higher than the surface of the white resist 142 by plating the surface of the conductive member 104a. By making the upper surface of the land higher than the white resist 142, mounting of the light emitting element is facilitated. The thickness of the plating layer 104b may be, for example, about 0.2 μm to 10 μm, and preferably 1 μm to 5 μm.

As a material for the white resist, for example, reflective particles such as TiO ₂ and organic or inorganic binders are kneaded. The so-called white resist, white ink, ceramic ink, and the like are applicable.
As the organic binder, it is particularly preferable to use a silicone resin excellent in heat resistance and light resistance. Thereby, light can be reflected on the surface of the substrate, and a light emitting device with high light extraction efficiency can be obtained.

The reflective particles contained in the white resist are difficult to absorb light from the light-emitting element and have a large refractive index difference with respect to the base resin (for example, TiO ₂ , SiO ₂ , Al ₂ O ₃
, ZrO ₂ , K ₄ O ₄ Ti, Al (OH) ₃ , MgO and other powders) can be dispersed to efficiently reflect light.

The thickness of the white resist is, for example, 20 μm to 60 μm, preferably 30 μm to 40 μm.
μm. The white resist may be formed by stacking two or more layers.

The white resist can be formed on the substrate as follows, for example. First, A
After a seed layer made of Ti, Ni or the like is formed on the surface of a substrate such as lN by sputtering, a resist is attached, and unnecessary portions are covered with photolithography to obtain a desired shape. A metal layer (for example, Cu) made of a material with high heat dissipation is formed on the layer by electroplating to a thickness of about 30 to 40 μm, and then the resist is peeled off to etch the unnecessary seed layer, and white so as to cover these metal layers. Print the resist.
Thereafter, the surface of the white resist is polished to expose the metal layer on the surface. Thereafter, Ni / Pd / Au is formed by electroless plating. Thereby, the upper surface of the land can be made higher than the white resist. The conductive portion (seed layer, metal layer, plating layer) formed in this way is used as the conductive member 104.
When outgas such as siloxane is generated from the white resist by heating, it is preferable to perform baking after the surface polishing so that the outgas is hardly generated in a later step.

(Frame)
As shown in FIG. 1, the frame body 130 is formed in a frame shape on the substrate 102 so as to surround a plurality of light emitting elements. The region surrounded by the frame is filled with a sealing member to be described later, so that the light emitting element is covered with the sealing member.
The frame preferably has light reflectivity. As the frame, for example, an insulating resin containing a light reflecting member is preferably used. Moreover, in order to ensure a certain amount of strength, for example, a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, an epoxy resin, a BT resin, PPA, a silicone resin, etc. are mentioned. When a non-light emitting device such as a protective element is mounted on a substrate, it causes light absorption, so that it is preferably embedded in a frame having light reflectivity. Such a frame can be formed by a method of drawing while discharging resin with a dispenser, a resin printing method, transfer molding, compression molding, or the like.

When the light reflectance of the frame is higher than the light reflectance of the wiring part, it is preferable to form the frame so as to cover the wiring part.

(Sealing member 132)
The sealing member 132 is preferably a material that has electrical insulation, is capable of transmitting light emitted from the light emitting element, and has fluidity before solidification. The light transmittance of the sealing member is preferably 70% or more. Examples of the light transmissive resin include silicone resin, silicone modified resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TP
X resin, polynorbornene resin, or hybrid resin containing one or more of these resins can be used. Among these, silicone resins are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after solidification.

(Wavelength conversion member)
The sealing member 132 may include a wavelength conversion member that emits light having a wavelength different from the emission wavelength of the light emitting element when excited by at least part of the light emitted from the light emitting element.
Typical wavelength conversion members include phosphors and quantum dots.

(Phosphor)
As the phosphor used as the wavelength conversion member, one type of phosphor may be used, or two or more types of phosphor may be used. Any of the known phosphors may be used as the phosphor for LED. For example, two types of phosphors, a first phosphor and a second phosphor, having different particle sizes and emission colors may be used. In this way, by using a plurality of types of phosphors having different emission colors, color reproducibility and color rendering can be improved.

As the phosphor, for example, as a yellow to green phosphor, for example, an yttrium / aluminum / garnet phosphor (YAG phosphor) and a lutetium / aluminum / garnet phosphor (LAG phosphor) can be used. . As the green phosphor, for example, a chlorosilicate phosphor and a β sialon phosphor can be used. Examples of red phosphors include SCASN phosphors such as (Sr, Ca) AlSiN ₃ : Eu, CaAlSi
N ₃ : CASN phosphor such as Eu, SrAlSiN ₃ : Eu phosphor, and K ₂ SiF ₆
: KSF phosphor such as Mn can be used, but is not limited thereto.

Although it does not specifically limit as a particle size of fluorescent substance, About 2 micrometers-about 50 micrometers are preferable, More preferably, they are 5 micrometers-20 micrometers. Note that the light extraction efficiency of the light emitting device tends to increase as the particle size of the phosphor increases, but the color unevenness tends to increase.

The sealing member 132 may further include additives such as a filler and a diffusing material in addition to the above-described wavelength conversion member. For example, SiO ₂ , TiO ₂ or the like may be used as the diffusion material.

The light-emitting device of the present invention includes a backlight source of a liquid crystal display, various lighting devices, a large display, various displays such as advertisements, destination guidance, and an image reading device in a digital video camera, a facsimile, a copier, a scanner, etc. It can be used for projector devices.

DESCRIPTION OF SYMBOLS 100 Light-emitting device 102 Board | substrate 104,104a Conductive member 104b Plating layer 11 1st land 12 2nd land 13 3rd land 14 4th land 15 Connection part 106 Wide part 108 Narrow part 110 Pad part 112 Wiring part 120 1st light emitting element 122 Second light emitting element 130 Frame 132 Sealing member 134 Positioning mark 140 Electrode 142 White resist AM Anode mark TP Temperature measurement pattern

Claims (7)

A substrate,
A conductive member formed on the surface of the substrate;
A white resist layer that covers a side surface of the conductive member and is formed on the surface of the substrate;
A plurality of light emitting elements connected to the conductive member,
The conductive member has a plurality of lands corresponding to the plurality of light emitting elements.   The light emitting device according to claim 1, wherein an upper surface of the white resist layer and an upper surface of the conductive member are coincident with each other.   The light emitting device according to claim 2, wherein the conductive member has a polishing mark.   The light emitting device according to claim 1, wherein an upper surface of the conductive member is higher than the white resist layer.   The light emitting device according to claim 4, further comprising: a shield layer, a metal layer, or a plating layer on an upper surface of the conductive member.   6. The light emitting device according to claim 1, further comprising a frame formed in a frame shape surrounding a plurality of light emitting elements on the substrate. The conductive member includes a first land and a second land corresponding to a pair of electrodes of the light emitting element, a third land and a fourth land corresponding to a pair of electrodes of another light emitting element, and the second land. A connecting portion for connecting the third land,
The first land and the third land, the second land and the fourth land are arranged adjacent to each other,
The outer edge of the first land is located inside the first land from the point where the side located on the second land side and the side located on the third land side intersect,
The outer edge of the fourth land is located on the inner side of the fourth land from the point where the side located on the second land side and the side located on the third land side intersect. The light-emitting device as described in any one.

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