JP2019133831A - Manufacturing method of enamel wire, and manufacturing device of enamel wire - Google Patents

Manufacturing method of enamel wire, and manufacturing device of enamel wire Download PDF

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JP2019133831A
JP2019133831A JP2018014871A JP2018014871A JP2019133831A JP 2019133831 A JP2019133831 A JP 2019133831A JP 2018014871 A JP2018014871 A JP 2018014871A JP 2018014871 A JP2018014871 A JP 2018014871A JP 2019133831 A JP2019133831 A JP 2019133831A
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conductor
water
cooling
insulating coating
enameled wire
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研 大森
Ken Omori
研 大森
泰弘 船山
Yasuhiro Funayama
泰弘 船山
智行 藤田
Satoyuki Fujita
藤田  智行
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Proterial Ltd
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Hitachi Metals Ltd
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Abstract

To provide a manufacturing method of an enamel wire capable of manufacturing even an enamel wire having a conductor with large wire diameter by using a horizontal type galling furnace at high speed and low cost, a manufacturing method of the enamel wire providing a manufacturing device of the enamel wire, and the manufacturing device of the enamel wire.SOLUTION: There is provided a manufacturing method of an enamel wire including a process for applying a thermosetting resin to a conductor having a prescribed cross section shape, galling the thermosetting resin to the conductor by using a horizontal type galling furnace to form a conductor with an insulation coated film, then gradually cooling the conductor with the insulation coated film before applying the thermosetting resin with overlapping on the conductor with the insulation coated film, a process for cooling the conductor with the insulation coated film by a cooling device with water after the process for gradually cooling, and a process for removing water adhered to the conductor with the insulation coated film after the process for cooling.SELECTED DRAWING: Figure 1

Description

本発明は、エナメル線の製造方法及びエナメル線の製造装置に関する。   The present invention relates to an enameled wire manufacturing method and an enameled wire manufacturing apparatus.

自動車等のモータに使用されるエナメル線を製造する方法としては、堅型焼付炉を用いる場合と横型焼付炉を用いる場合の2種類の方法がある。横型焼付炉を用いたエナメル線の製造方法として、例えば、特許文献1に記載されている方法がある。   There are two types of methods for producing enameled wires used in motors such as automobiles, using a solid baking furnace and using a horizontal baking furnace. As a method for producing enameled wire using a horizontal baking furnace, for example, there is a method described in Patent Document 1.

特許文献1に記載のエナメル線の製造方法は、サプライ装置より供給された、例えば、外径1.00mmの軟銅線を、80℃〜200℃の温度、例えば、150℃に予熱し、当該軟銅線の外周面上にポリエステルイミド系ワニスを10〜15μmの厚さに塗布し、当該軟銅線を横型焼付炉(以下、単に「焼付炉」ということがある)に導入して塗布されたワニスを乾燥・焼付する工程を有している。   In the enameled wire manufacturing method described in Patent Document 1, an annealed copper wire having an outer diameter of 1.00 mm, for example, supplied from a supply device is preheated to a temperature of 80 ° C. to 200 ° C., for example, 150 ° C. A polyesterimide varnish is applied to the outer peripheral surface of the wire in a thickness of 10 to 15 μm, and the varnish applied by introducing the annealed copper wire into a horizontal baking furnace (hereinafter sometimes simply referred to as “baking furnace”) is applied. It has a process of drying and baking.

このようにして、ワニスを乾燥・焼付することにより絶縁被膜が形成された軟銅線は、焼付炉の出口から導出される。当該軟銅線は、200℃〜350℃に加熱されており、導出直後にブロワを有した風冷装置によって150℃程度に冷却される。   Thus, the annealed copper wire in which the insulating film is formed by drying and baking the varnish is led out from the outlet of the baking furnace. The annealed copper wire is heated to 200 ° C. to 350 ° C., and is cooled to about 150 ° C. by an air-cooling device having a blower immediately after being led out.

そして、特許文献1に記載のエナメル線の製造方法では、上記した予熱、ワニス塗布、乾燥・焼付、及び冷却の各工程の組み合わせが塗布焼付工程として1つの単位を構成しており、この塗布焼付工程を所定の回数繰り返すことによって軟銅線からなる導体上に所定の厚さの絶縁被膜を有したエナメル線が提供される。   In the enameled wire manufacturing method described in Patent Document 1, a combination of the above preheating, varnish coating, drying / baking, and cooling steps constitutes one unit as the coating baking process, and this coating baking By repeating the process a predetermined number of times, an enameled wire having an insulating coating with a predetermined thickness on a conductor made of annealed copper wire is provided.

特公昭61−18287号公報Japanese Patent Publication No. 61-18287

しかし、特許文献1に記載されたエナメル線の製造方法のように、外径が0.8mm以上の、例えば、1.00mmの軟銅線よりなる線径の太い導体上に塗布されたワニスを横型焼付炉で乾燥・焼付する場合では、導体上に塗布されたワニスが硬化するまでの間に重力等でワニスが導体の下側に垂れ下がりやすいため、導体の周囲に形成された絶縁被膜の厚さが不均一になることがある。   However, as in the enameled wire manufacturing method described in Patent Document 1, a varnish coated on a thick conductor having a wire diameter of 0.8 mm or more, for example, a 1.00 mm annealed copper wire is used as a horizontal type. When drying and baking in a baking oven, the thickness of the insulation coating formed around the conductor because the varnish tends to sag under the conductor due to gravity before the varnish applied on the conductor is cured. May become non-uniform.

これに対して、エナメル線の製造速度を高速度化することにより、ワニスの垂れ下がりによって絶縁被膜の厚さが不均一になることを抑制することが考えられる。しかし、製造速度を高速度化したエナメル線の製造方法では、線径の太い導体(例えば、外径が0.8mm以上の導体)を所定の温度にまで冷却するときに、導体の温度が下がりにくくなるため、冷却距離を長く取る必要がある。   On the other hand, it can be considered that by increasing the production speed of the enameled wire, the thickness of the insulating coating is prevented from becoming uneven due to the varnish sagging. However, in an enameled wire manufacturing method with an increased manufacturing speed, when the conductor having a large wire diameter (for example, a conductor having an outer diameter of 0.8 mm or more) is cooled to a predetermined temperature, the temperature of the conductor decreases. Since it becomes difficult, it is necessary to take a long cooling distance.

一方、エナメル線を低コストで製造するためには、横型焼付炉を含むエナメル線の製造装置を小型化することが不可欠である。そのため、横型焼付炉を含む製造装置を用いて製造速度を高速度化したエナメル線の製造方法では、冷却距離を長くせずに導体を所定の温度まで冷却することが望ましい。   On the other hand, in order to manufacture the enameled wire at a low cost, it is indispensable to downsize the enameled wire manufacturing apparatus including the horizontal baking furnace. For this reason, in a method for manufacturing an enameled wire in which the manufacturing speed is increased using a manufacturing apparatus including a horizontal baking furnace, it is desirable to cool the conductor to a predetermined temperature without increasing the cooling distance.

よって、本発明の目的は、線径の太い導体を備えるエナメル線であっても横型焼付炉を用いて高速度で低コストに製造可能なエナメル線の製造方法及びエナメル線の製造装置を提供することにある。   Therefore, an object of the present invention is to provide an enameled wire manufacturing method and an enameled wire manufacturing apparatus that can manufacture an enameled wire having a thick wire diameter at a high speed and a low cost using a horizontal baking furnace. There is.

本発明は、上記した目的を実現するために、下記の[1]〜[7]のエナメル線の製造方法、及び[8]〜[13]のエナメル線の製造装置を提供する。   In order to achieve the above-described object, the present invention provides the following enameled wire manufacturing method [1] to [7] and [8] to [13] enameled wire manufacturing apparatus.

[1]所定の断面形状を有する導体に熱硬化性樹脂を塗布し、横型焼付炉を用いて前記導体に前記熱硬化性樹脂を焼付けて絶縁被膜付き導体を形成後、該絶縁被膜付き導体上に重ねて前記熱硬化性樹脂を塗布する前に、前記絶縁被膜付き導体を徐冷する工程と、前記徐冷する工程の後、前記縁被膜付き導体を水による冷却装置を用いて冷却する工程と、前記冷却する工程の後、前記縁被膜付き導体に付着した水を水切りする工程と、を含むエナメル線の製造方法。
[2]前記徐冷する工程は、前記絶縁被膜付き導体を冷風で徐冷する、前記[1]に記載のエナメル線の製造方法。
[3]前記導体は、20以上200以下のVD値(=前記導体の走行速度(m/分)×前記導体の外径(mm))を有する、前記[1]又は前記[2]に記載のエナメル線の製造方法。
[4]前記水は、純水又は陽イオン交換水である前記[1]〜[3]のいずれか1つに記載のエナメル線の製造方法。
[5]前記冷却する工程は、前記水を前記絶縁被膜付き導体に吹きかける及び/又は前記絶縁被膜付き導体を前記水に浸漬する工程である前記[1]〜[4]のいずれか1つに記載のエナメル線の製造方法。
[6]前記水切りする工程は、前記絶縁被膜付き導体に付着した水を吸引することにより水切りする工程である前記[1]〜[5]のいずれか1つに記載のエナメル線の製造方法。
[7]前記冷却する工程は、ターンプーリにより前記絶縁被膜付き導体の方向転換が行われる前に行われる前記[1]〜[6]のいずれか1つに記載のエナメル線の製造方法。
[8]導体に塗布された熱硬化性樹脂を焼付けて前記導体上に絶縁被膜を形成するための横型焼付炉と、前記絶縁被膜が形成された絶縁被膜付き導体を徐冷するための徐冷装置と、徐冷された前記絶縁被膜付き導体を水により冷却するための冷却装置と、前記水により冷却された前記絶縁被膜付き導体に付着した水を水切りするための水切り装置とを備えたエナメル線の製造装置。
[9]前記徐冷装置は、ラジエータ冷却送風部と、冷却ダクトとを備えた、前記[8]に記載のエナメル線の製造装置。
[10]前記ラジエータ冷却送風部は、水冷式からなる前記[9]に記載のエナメル線の製造装置。
[11]前記冷却装置は、前記絶縁被膜付き導体を走行させる貫通路が形成された壁面を有する水接触部を備えた前記[8]〜[10]のいずれか1つに記載のエナメル線の製造装置。
[12]前記水切り装置は、前記絶縁被膜付き導体を走行させる複数の導体通過孔と、前記複数の導体通過孔を前記絶縁被膜付き導体が走行している際に前記絶縁被膜付き導体に付着している水を吸引するための吸引ポンプとを備えた前記[8]〜[11]のいずれか1つに記載のエナメル線の製造装置。
[13]前記冷却装置は、前記横型焼付炉と、前記絶縁被膜付き導体の方向を転換するターンプーリとの間に設置されている前記[8]〜[12]のいずれか1つに記載のエナメル線の製造装置。
[1] After applying a thermosetting resin to a conductor having a predetermined cross-sectional shape and baking the thermosetting resin on the conductor using a horizontal baking furnace to form a conductor with an insulating film, on the conductor with an insulating film Steps of cooling the conductor with an insulating film before the thermosetting resin is applied to the layer, and cooling the conductor with an edge film with a water cooling device after the step of slow cooling And a step of draining water adhering to the edge-coated conductor after the cooling step.
[2] The method for producing an enameled wire according to [1], wherein the step of gradually cooling is performed by slowly cooling the conductor with an insulating film with cold air.
[3] The conductor according to [1] or [2], wherein the conductor has a VD value of 20 or more and 200 or less (= traveling speed of the conductor (m / min) × outer diameter of the conductor (mm)). Enameled wire manufacturing method.
[4] The method for producing an enameled wire according to any one of [1] to [3], wherein the water is pure water or cation exchange water.
[5] The cooling step is any one of the above [1] to [4], which is a step of spraying the water on the conductor with an insulating coating and / or immersing the conductor with an insulating coating in the water. The manufacturing method of enameled wire as described.
[6] The method for producing an enameled wire according to any one of [1] to [5], wherein the draining step is a step of draining water by sucking water adhering to the conductor with the insulating coating.
[7] The method for manufacturing an enameled wire according to any one of [1] to [6], wherein the cooling step is performed before the direction change of the conductor with the insulating coating is performed by a turn pulley.
[8] A horizontal baking furnace for baking the thermosetting resin applied to the conductor to form an insulating film on the conductor, and a slow cooling for gradually cooling the conductor with the insulating film on which the insulating film is formed. An enamel comprising: a device; a cooling device for cooling the slowly cooled conductor with an insulating coating with water; and a draining device for draining water attached to the conductor with an insulating coating cooled with water Wire manufacturing equipment.
[9] The enameled wire manufacturing apparatus according to [8], wherein the slow cooling device includes a radiator cooling air blowing unit and a cooling duct.
[10] The enameled wire manufacturing apparatus according to [9], wherein the radiator cooling air blowing unit is of a water cooling type.
[11] The enameled wire according to any one of [8] to [10], wherein the cooling device includes a water contact portion having a wall surface on which a through path for running the conductor with an insulating coating is formed. manufacturing device.
[12] The draining device adheres to the conductor with insulating coating when the conductor with insulating coating travels through the plurality of conductor passage holes through which the conductor with insulating coating travels, and the conductor passing holes. The apparatus for producing an enameled wire according to any one of [8] to [11], further comprising a suction pump for sucking water.
[13] The enamel according to any one of [8] to [12], wherein the cooling device is installed between the horizontal baking furnace and a turn pulley that changes a direction of the conductor with the insulating coating. Wire manufacturing equipment.

本発明によれば、線径の太い導体を備えるエナメル線であっても横型焼付炉を用いて高速度で低コストに製造可能なエナメル線の製造方法及びエナメル線の製造装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, even if it is an enameled wire provided with a conductor with a thick wire diameter, the manufacturing method of an enameled wire and the manufacturing apparatus of an enameled wire which can be manufactured at a high speed and low cost using a horizontal baking furnace are provided. it can.

本発明の実施の形態に係るエナメル線の製造装置の一例を示す概略図である。It is the schematic which shows an example of the manufacturing apparatus of the enamel wire which concerns on embodiment of this invention. 図1における徐冷装置の一例を示す概略図である。It is the schematic which shows an example of the slow cooling apparatus in FIG. 図1における冷却装置の一例を示す概略図である。It is the schematic which shows an example of the cooling device in FIG. 図1における水切り装置の一例を示す概略図であり、(a)は導体進行方向に垂直な断面図であり、(b)は斜視図である。It is the schematic which shows an example of the draining apparatus in FIG. 1, (a) is sectional drawing perpendicular | vertical to a conductor advancing direction, (b) is a perspective view.

〔エナメル線の製造方法〕
図1は、本発明の実施の形態に係るエナメル線の製造方法及び製造装置を示し、その概容を説明すると以下の通りである。すなわち、ボビン等から供給された導体1に塗布部14で熱硬化性樹脂を塗布し、横型焼付炉10を用いて焼付けて導体1上に絶縁被膜を形成後、当該絶縁被膜上に重ねて前記熱硬化性樹脂を塗布する前に、当該絶縁被膜を有する導体1を徐冷し、徐冷された当該導体1を冷却装置を用いて水による冷却を行い、この冷却の後、導体1に付着した水を水切りし、当該絶縁被膜上に重ねて熱硬化性樹脂を塗布する。なお、本実施の形態において、導体1とは、1回目の絶縁塗料の塗布・焼付前は、導体1のみを指し、1回目の絶縁塗料の塗布・焼付後は、絶縁被膜が外周に形成された絶縁被膜付き導体1aを指す。また、以下の説明において、所望の被膜厚さの絶縁被膜が形成されたものをエナメル線2という。
[Method for producing enameled wire]
FIG. 1 shows an enameled wire manufacturing method and manufacturing apparatus according to an embodiment of the present invention, and its outline will be described as follows. That is, a thermosetting resin is applied to the conductor 1 supplied from a bobbin or the like by the application unit 14 and baked using a horizontal baking furnace 10 to form an insulating film on the conductor 1, and then superimposed on the insulating film. Before applying the thermosetting resin, the conductor 1 having the insulating film is slowly cooled, and the slowly cooled conductor 1 is cooled with water using a cooling device, and after this cooling, the conductor 1 is attached to the conductor 1. The water thus drained is drained, and the thermosetting resin is applied over the insulating coating. In the present embodiment, the conductor 1 refers only to the conductor 1 before the first application / baking of the insulating paint, and after the first application / baking of the insulating paint, an insulating film is formed on the outer periphery. It refers to the conductor 1a with insulating coating. In the following description, an enameled wire 2 is formed with an insulating film having a desired film thickness.

図1は、本発明の実施の形態に係るエナメル線2の製造方法及び製造装置の一例を示す概略図であり、図2は、図1における徐冷装置の一例を示す概略図である。図3は、図1における冷却装置の一例を示す概略図である。また、図4は、図1における水切り装置の一例を示す概略図であり、(a)は導体進行方向に垂直な断面図であり、(b)は斜視図である。   FIG. 1 is a schematic diagram illustrating an example of a method and an apparatus for manufacturing an enameled wire 2 according to an embodiment of the present invention, and FIG. 2 is a schematic diagram illustrating an example of a slow cooling apparatus in FIG. FIG. 3 is a schematic diagram illustrating an example of the cooling device in FIG. 1. 4 is a schematic view showing an example of the draining device in FIG. 1, (a) is a cross-sectional view perpendicular to the conductor traveling direction, and (b) is a perspective view.

本発明の実施の形態に係るエナメル線2の製造方法を図1に基づいて詳細に説明すると、ボビン等から供給される導体1は、塗布部14へ案内され、導体1の外周に絶縁塗料が塗布される。導体1は、例えば、焼鈍炉(不図示)に供給され、焼き鈍しが行われたものである。なお、焼き鈍しは、必要がなければ省略可能である。   The manufacturing method of the enameled wire 2 according to the embodiment of the present invention will be described in detail with reference to FIG. 1. The conductor 1 supplied from a bobbin or the like is guided to the coating unit 14, and an insulating paint is applied to the outer periphery of the conductor 1. Applied. The conductor 1 is, for example, supplied to an annealing furnace (not shown) and annealed. The annealing can be omitted if not necessary.

絶縁塗料が塗布された絶縁被膜付き導体1aは、焼付炉10を走行し、絶縁塗料中の溶剤の蒸発(すなわち絶縁塗料の乾燥)及び絶縁塗料中の樹脂の硬化(すなわち皮膜の焼付)、つまり、乾燥・焼付が行われる。焼付炉10は、別体の蒸発炉及び硬化炉の組み合わせから構成されていてもよい。   The conductor 1a with an insulating coating to which the insulating coating is applied travels in the baking furnace 10 to evaporate the solvent in the insulating coating (that is, dry the insulating coating) and cure the resin in the insulating coating (that is, baking the coating). Drying and baking are performed. The baking furnace 10 may be composed of a combination of a separate evaporation furnace and a curing furnace.

焼付炉10における絶縁塗料中の溶剤の蒸発及び絶縁塗料中の樹脂の硬化の方法は、特に限定されるものではなく、熱風等により加熱することで行なうことができる。   The method for evaporating the solvent in the insulating paint and curing the resin in the insulating paint in the baking furnace 10 is not particularly limited, and can be performed by heating with hot air or the like.

図1に示されるように、焼付炉10の出口(図1の焼付炉10の右端)から出てきた絶縁被膜付き導体1aは、徐冷装置18により徐冷されて、次いで、冷却装置15により冷却され、水切り装置16により水切りされた後、下流側のターンプーリ13bを介して上流側のターンプーリ13aに戻り、焼付炉10、徐冷装置18、冷却装置15、水切り装置16により、絶縁塗料の塗布、絶縁線塗料中の溶剤の蒸発、絶縁塗料中の樹脂の硬化、徐冷、冷却、及び水切りが所望の被膜厚さとなるまで繰り返し行われる。   As shown in FIG. 1, the conductor 1 a with an insulating coating that has come out from the outlet of the baking furnace 10 (the right end of the baking furnace 10 in FIG. 1) is gradually cooled by the slow cooling device 18, and then cooled by the cooling device 15. After being cooled and drained by the draining device 16, it returns to the upstream turn pulley 13 a via the downstream turn pulley 13 b and the insulating paint is applied by the baking furnace 10, the slow cooling device 18, the cooling device 15, and the draining device 16. Then, evaporation of the solvent in the insulating wire paint, curing of the resin in the insulating paint, slow cooling, cooling, and draining are repeated until a desired film thickness is obtained.

図2は、徐冷装置18を示す。徐冷装置18による徐冷は、例えば、空冷によって行われる。例えば、焼付炉10から導出された絶縁被膜付き導体1aを、ラジエータ冷却送風部18aから冷風が送り込まれた冷却ダクト18d内に挿通させることによって行われる。徐冷は、焼付炉10から導出された絶縁被膜付き導体1aの温度が当該徐冷によって50度〜100℃程度下がるように行われることが好ましい。   FIG. 2 shows the slow cooling device 18. The slow cooling by the slow cooling device 18 is performed by air cooling, for example. For example, it is performed by inserting the conductor 1a with an insulating coating derived from the baking furnace 10 into the cooling duct 18d into which the cold air is sent from the radiator cooling air blowing section 18a. The slow cooling is preferably performed so that the temperature of the conductor 1a with the insulating coating derived from the baking furnace 10 is lowered by about 50 to 100 ° C. by the slow cooling.

徐冷装置18は、焼付炉10から導出された絶縁被膜付き導体1aが挿通する冷却ダクト18dと、冷却ダクト18dに冷風を送り込むラジエータ冷却送風部18aと、冷風をガイド部18cに供給する送風ダクト18bとを備える。   The slow cooling device 18 includes a cooling duct 18d through which the conductor 1a with an insulating film led out from the baking furnace 10 is inserted, a radiator cooling blower 18a that sends cold air to the cooling duct 18d, and a blower duct that supplies the cold air to the guide 18c. 18b.

ラジエータ冷却送風部18aは、絶縁被膜付き導体1aを効率よく徐冷するために、水冷式であることが好ましい。例えば、ラジエータ冷却送風部18aは、空気の吸込口に不図示のラジエータが配置されており、当該ラジエータには不図示の冷却水循環装置(チラー)によって水(例えば、10℃以下の水)が循環されている。   The radiator cooling air blower 18a is preferably a water-cooled type in order to efficiently and slowly cool the conductor 1a with an insulating coating. For example, in the radiator cooling air blower 18a, a radiator (not shown) is disposed at an air inlet, and water (for example, water of 10 ° C. or lower) is circulated through the radiator by a cooling water circulation device (chiller) (not shown). Has been.

後述する冷却装置15による冷却を行う前に、このような徐冷を行うことにより、焼付炉10から導出された高温の絶縁被膜付き導体1aが急冷によってヒートショックを受けることを防止することができる。   By performing such slow cooling before cooling by the cooling device 15 described later, it is possible to prevent the conductor 1a with a high-temperature insulating coating derived from the baking furnace 10 from receiving a heat shock due to rapid cooling. .

図3に示す冷却装置15による冷却は、水を用いて行われ、例えば、絶縁被膜付き導体1aに水を吹きかける及び/又は絶縁被膜付き導体1aを水に浸漬することで行われる。冷却装置15では、絶縁被膜を構成する熱硬化性樹脂(例えばポリエステルイミド樹脂、ポリアミドイミド樹脂、ポリイミド樹脂など)のガラス転移点(Tg)以下となるまで冷却することが好ましい。   Cooling by the cooling device 15 shown in FIG. 3 is performed using water, for example, by spraying water on the conductor 1a with an insulating coating and / or immersing the conductor 1a with an insulating coating in water. In the cooling device 15, it is preferable to cool until it becomes below the glass transition point (Tg) of the thermosetting resin (for example, polyesterimide resin, polyamideimide resin, polyimide resin etc.) which comprises an insulating film.

冷却装置15では、水が貯留されている槽で構成される水接触部15Aを備え、水接触部15Aの絶縁被膜付き導体1aが走行する方向に沿って離間して配置された向かい合う一対の壁面15Cのそれぞれに水排出孔15a(導体貫通路)が設けられており、絶縁被膜付き導体1aが水排出孔15aを通って水接触部15A中を通過する際に、水接触部15Aの上部に配置された2本の水噴射ホース15C,15Cにより水を絶縁被膜付き導体1aに吹きかけるとともに、水接触部15A中に貯留されている水に絶縁被膜付き導体1aを浸漬している。 The cooling device 15 includes a water contact portion 15A configured of a tank in which water is stored, and a pair of opposing wall surfaces disposed separately from each other along the direction in which the conductor 1a with an insulating coating of the water contact portion 15A travels. A water discharge hole 15a (conductor through path) is provided in each of 15C, and when the conductor 1a with an insulating coating passes through the water contact hole 15A through the water discharge hole 15a, the water discharge hole 15a is formed above the water contact part 15A. Water is sprayed onto the conductor 1a with an insulating coating by the two water jet hoses 15C 1 and 15C 2 arranged, and the conductor 1a with an insulating coating is immersed in the water stored in the water contact portion 15A.

水排出孔15aから水が流出するため、常時、水噴射ホース15C,15Cより水を絶縁被膜付き導体1aに吹きかけながら水接触部15Aに貯留する水を補充して水面が水接触部15Aを走行する絶縁被膜付き導体1aよりも低くならないようにする。本実施の形態においては、水噴射ホース15Cは、走行する絶縁被膜付き導体1aの進行方向の上流側の斜め上方より水を噴射し、水噴射ホース15Cは、走行する絶縁被膜付き導体1aの進行方向の下流側の斜め上方より水を噴射しているが、これに限られず、1箇所から噴射してもよいし、3箇所以上から噴射してもよい。また、噴射方向も絶縁被膜付き導体1aの真上から(垂直方向)噴射する等、種々の方向からの噴射が可能である。水の吹きかけと水への浸漬は、いずれか一方のみが実施される形態としてもよいが、短時間で冷却するためには両者が併用して実施される形態とすることが好ましい。 Since water flows out from the water discharge hole 15a, the water surface is always replenished with water stored in the water contact portion 15A while spraying water from the water injection hoses 15C 1 and 15C 2 onto the conductor 1a with an insulating coating, so that the water surface becomes the water contact portion 15A It is made not to become lower than the conductor 1a with an insulating film that runs on the road. In the present embodiment, the water injection hose 15C 1 injects water from an obliquely upward upstream side of the traveling direction of the traveling conductor 1a with insulation coating, and the water injection hose 15C 2 has the insulating coating conductor 1a traveling. However, the present invention is not limited to this, and the water may be injected from one place or from three or more places. In addition, it is possible to inject from various directions such as the injection direction (vertical direction) from directly above the conductor 1a with an insulating coating. Only one of the spraying of water and the immersion in water may be implemented. However, in order to cool in a short time, it is preferable that both are implemented in combination.

水は、純水(例えば、RO水)又は陽イオン交換水であることが好ましい。また、水温は、例えば、5℃以上100℃以下が好ましく、10℃以上60℃以下がより好ましく、15℃以上40℃以下が更に好ましい。   The water is preferably pure water (for example, RO water) or cation exchange water. The water temperature is, for example, preferably 5 ° C. or more and 100 ° C. or less, more preferably 10 ° C. or more and 60 ° C. or less, and further preferably 15 ° C. or more and 40 ° C. or less.

本実施の形態では、冷却装置15において、120℃〜140℃の温度低下を生じさせることができる。   In the present embodiment, the cooling device 15 can cause a temperature drop of 120 ° C. to 140 ° C.

水接触部15Aの壁面に設けられた水排出孔15aから流れ出た水は、水接触部15Aの下方に設置され、水接触部15Aを支持する支柱15Dが固定された水受け部15Bに流入し、水受け部15Bの底壁に設けられた水排出路15bから排出される。水排出路15bから排出された水は、冷却水としてリサイクルしてもよい。リサイクルする際には、排出された水をフィルターや陽イオン交換樹脂等により水質を向上させる。   The water that flows out from the water discharge hole 15a provided on the wall surface of the water contact portion 15A flows into the water receiving portion 15B that is installed below the water contact portion 15A and to which the support column 15D that supports the water contact portion 15A is fixed. The water is discharged from a water discharge path 15b provided on the bottom wall of the water receiving portion 15B. The water discharged from the water discharge path 15b may be recycled as cooling water. When recycling, the water quality is improved by using a filter or cation exchange resin.

絶縁被膜付き導体1aを冷却する工程は、ターンプーリ13bにより走行する絶縁被膜付き導体1aの方向転換が行われる前に行われることが好ましい。すなわち、焼付炉10と焼付炉10の下流に配置された方向転換のためのターンプーリ13bとの間に徐冷装置18及び冷却装置15が設置されていることが好ましい。焼付炉10の出口から0.5〜2m離れた位置に徐冷装置18及び冷却装置15が配置されていることが好適である。上記構成にすることにより、ターンプーリ13bを絶縁被膜付き導体1aが通過したときにターンプーリ13bと接触した絶縁被膜付き導体1aの表面に傷が生じてしまうことを低減できる。   The step of cooling the conductor with insulation film 1a is preferably performed before the direction change of the conductor with insulation film 1a traveling by the turn pulley 13b is performed. That is, it is preferable that the slow cooling device 18 and the cooling device 15 are installed between the baking furnace 10 and the turn pulley 13b for changing the direction arranged downstream of the baking furnace 10. It is preferable that the slow cooling device 18 and the cooling device 15 are disposed at a position 0.5 to 2 m away from the exit of the baking furnace 10. By setting it as the said structure, when the conductor 1a with an insulating film passes through the turn pulley 13b, it can reduce that the surface of the conductor 1a with an insulating film which contacted the turn pulley 13b will produce a damage | wound.

図4(a),(b)に示す水切り装置16による絶縁被膜付き導体1aに付着した水の水切りは、例えば、走行する絶縁被膜付き導体1aを減圧された管内に通線して吸引することで行われる。   The draining of water adhering to the conductor 1a with an insulating coating by the draining device 16 shown in FIGS. 4 (a) and 4 (b) is, for example, by sucking the traveling conductor 1a with an insulating coating through the reduced pressure pipe. Done in

図4(a),(b)は水切り装置16を示す。水切り装置16は、断面が半円状の本体上部16Aと、断面が半円状の本体下部16Bとを合わせて形成される断面円形状の管(絶縁被膜付き導体1aが並列される方向に沿って延伸する円筒状の管)であって、管内には絶縁被膜付き導体1aが走行する方向に沿って離間して配置された絶縁被膜付き導体1aを走行させるための複数の導体通過孔16Cが管の長手方向(絶縁被膜付き導体1aが並列される方向)に沿って平行に複数形成されている。各導体通過孔16Cは、吸引ポンプ20に接続した管内の通路にて繋がっているため、吸引ポンプ20を作動させることにより、各導体通過孔16Cを絶縁被膜付き導体1aが走行(通過)している際に絶縁被膜付き導体1aに付着している水が吸引される。   4A and 4B show the drainer 16. The draining device 16 is a tube having a circular cross section (along the direction in which the conductors 1a with insulating coatings are arranged in parallel) formed by combining a main body upper portion 16A having a semicircular cross section and a main body lower portion 16B having a semicircular cross section. A plurality of conductor passage holes 16C for running the conductor 1a with the insulating coating disposed in the pipe so as to be separated along the direction in which the conductor 1a with the insulating coating runs. A plurality of pipes are formed in parallel along the longitudinal direction of the pipe (the direction in which the conductors 1a with insulating coating are arranged in parallel). Since each conductor passage hole 16C is connected by a passage in a pipe connected to the suction pump 20, the conductor 1a with an insulating coating travels (passes) through each conductor passage hole 16C by operating the suction pump 20. While adhering, the water adhering to the conductor 1a with an insulating film is sucked.

水切り装置16は、図4(a),(b)に示す形状に限られるものではなく、例えば、断面が矩形状の本体上部と断面が矩形状の本体下部とを合わせて形成される断面矩形状の管であってもよい。   The draining device 16 is not limited to the shape shown in FIGS. 4 (a) and 4 (b). For example, the drainage device 16 has a rectangular cross section formed by combining a rectangular main body upper section and a rectangular main body lower section. It may be a shaped tube.

また、水切り装置16は、1つの管に複数の導体通過孔16Cが管の長手方向に沿って形成されているものに限られるものではなく、例えば、複数の水切り装置16を配置して並列に配置される絶縁被膜付き導体1aの各々を水切りすることでもよい。さらに、水切り装置16の管内を走行する絶縁被膜付き導体1aに付着した水の吸引量を各導体通過孔16Cで変更してもよい。   The draining device 16 is not limited to one in which a plurality of conductor passage holes 16C are formed in one tube along the longitudinal direction of the tube. For example, the plurality of draining devices 16 are arranged in parallel. It is also possible to drain each of the conductors with insulating coating 1a to be disposed. Furthermore, the suction amount of the water adhering to the conductor 1a with the insulating coating that runs in the pipe of the draining device 16 may be changed at each conductor passage hole 16C.

絶縁被膜付き導体1aに付着した水の水切りは、上記吸引による方法・装置に限られるものではなく、気体(例えば、圧縮空気)が噴射される管内に絶縁被膜付き導体1aを通して水を吹き飛ばす方法・装置や、ノズルから気体(例えば、圧縮空気)を絶縁被膜付き導体1aに吹きかけて水を切る方法・装置や、熱風等により水を蒸発させて乾燥させる方法・装置等により行うことができる。これらの方法・装置を併用してもよい。   The draining of the water adhering to the conductor 1a with the insulating coating is not limited to the above-described suction method / apparatus, but the method of blowing water through the conductor 1a with the insulating coating into a pipe in which gas (for example, compressed air) is jetted. It can be carried out by an apparatus, a method / apparatus that blows gas (for example, compressed air) from the nozzle onto the conductor 1a with an insulating coating and drains water, or a method / apparatus that evaporates water with hot air or the like to dry. You may use these methods and apparatuses together.

なお、走行中の自然乾燥のみによる水切りでは、線径の太い導体の場合に特に走行距離を長く確保する必要があるので、高速度な製造に支障が出るだけでなく、敷地コストや設備コストの増大を招く。ゆえに、本発明の実施の形態における水切り工程・装置とは、自然乾燥のみによる水切りよりも短時間で水切りが可能な工程及びそのための装置をいう。   In addition, when draining only by natural drying during traveling, it is necessary to ensure a long traveling distance especially in the case of a conductor with a large wire diameter, which not only hinders high-speed manufacturing but also reduces site costs and equipment costs. Incurs an increase. Therefore, the draining process / apparatus in the embodiment of the present invention refers to a process capable of draining in a shorter time than draining only by natural drying and an apparatus therefor.

絶縁被膜付き導体1aに付着した水の水切りは、冷却する工程の後、焼付済みの絶縁被膜上に重ねて熱硬化性樹脂を塗布する前に行われることが好ましく、例えば、図1に示すように、冷却装置15と方向転換のためのターンプーリ13bとの間に水切り装置16を設置することが好ましい。   The drainage of the water adhering to the conductor 1a with the insulating coating is preferably performed after the cooling step and before the thermosetting resin is applied on the insulating coating that has been baked, as shown in FIG. In addition, it is preferable to install a draining device 16 between the cooling device 15 and the turn pulley 13b for changing the direction.

所望の厚さ(例えば、0.020mm以上0.180mm以下の厚さ)の絶縁被膜の焼付が終了した絶縁被膜付き導体1aは、エナメル線2として巻取機(不図示)に巻き取られる。   The insulating film-coated conductor 1a having been baked with an insulating film having a desired thickness (for example, a thickness of 0.020 mm or more and 0.180 mm or less) is wound as an enamel wire 2 on a winder (not shown).

本実施の形態において使用される導体1の素材は、銅、銅合金等、特に限定されることなく使用できる。また、導体1の形状としては、丸線、平角線、異形状の線等が挙げられる。   The material of the conductor 1 used in the present embodiment can be used without any particular limitation, such as copper or copper alloy. Examples of the shape of the conductor 1 include a round wire, a flat wire, and an irregularly shaped wire.

本実施の形態において使用される絶縁塗料としては、エナメル線2に使用可能なものであれば特に限定されることなく用いることができる。例えば、絶縁塗料中の溶剤としては、N−メチル−2−ピロリドン(NMP)、クレゾール、N,N−ジメチルアセトアミド(DMAc)、シクロヘキサノン等が挙げられる。また、絶縁塗料中の熱硬化性樹脂としては、ポリアミドイミド、ポリイミド、ポリエステルイミド等が挙げられる。   The insulating paint used in the present embodiment can be used without particular limitation as long as it can be used for the enameled wire 2. Examples of the solvent in the insulating coating include N-methyl-2-pyrrolidone (NMP), cresol, N, N-dimethylacetamide (DMAc), cyclohexanone and the like. Examples of the thermosetting resin in the insulating coating include polyamideimide, polyimide, and polyesterimide.

本発明の実施の形態に係るエナメル線の製造方法によれば、線径の太い導体1(例えば、外径0.8mm以上の丸線からなる導体、厚さが1.5mm以上で幅が2.0mm以上の平角線からなる導体)を備えるエナメル線2であっても、横型焼付炉10を用いて高速度で製造することができる。   According to the enameled wire manufacturing method according to the embodiment of the present invention, a conductor 1 having a large wire diameter (for example, a conductor composed of a round wire having an outer diameter of 0.8 mm or more, a thickness of 1.5 mm or more and a width of 2). Even an enameled wire 2 provided with a conductor made of a flat wire of 0.0 mm or more can be manufactured at a high speed using the horizontal baking furnace 10.

例えば、VD値(=導体1の走行速度(m/分)×導体1の外径(mm))が20以上200以下の範囲内となるように導体1の走行速度と導体外径を設定することが好ましい。より好ましくは、VD値が35以上140以下の範囲内となるように設定し、更に好ましくは、VD値が40以上120以下の範囲内になるように設定する。VD値の算出に際し、平角線の場合は、丸線に換算した値(平角線の断面積に相当する丸線の直径)を外径の値として用いる。また、異形状の線の場合も同様に、丸線に換算した値(異形状の線の断面積に相当する丸線の直径)を外径の値として用いる。   For example, the traveling speed and the outer diameter of the conductor 1 are set so that the VD value (= the traveling speed (m / min) of the conductor 1 × the outer diameter (mm) of the conductor 1) is in the range of 20 to 200. It is preferable. More preferably, the VD value is set to be in the range of 35 to 140, and more preferably, the VD value is set to be in the range of 40 to 120. When calculating the VD value, in the case of a flat wire, a value converted into a round wire (the diameter of the round wire corresponding to the cross-sectional area of the flat wire) is used as the value of the outer diameter. Similarly, in the case of an irregularly shaped line, a value converted into a round line (the diameter of the round line corresponding to the cross-sectional area of the irregularly shaped line) is used as the value of the outer diameter.

〔エナメル線の製造装置〕
本発明の実施の形態に係るエナメル線の製造装置は、導体1に塗布された熱硬化性樹脂を焼付けて絶縁被膜を形成するための横型焼付炉10と、絶縁被膜が形成された導体1aを徐冷するための徐冷装置18と、徐冷された導体1aを水により冷却するための冷却装置15と、水により冷却された導体1aに付着した水を水切りする水切り装置16とを備えたことにより所望の効果を奏する。
[Enamel wire manufacturing equipment]
An enameled wire manufacturing apparatus according to an embodiment of the present invention includes a horizontal baking furnace 10 for baking a thermosetting resin applied to a conductor 1 to form an insulating film, and a conductor 1a on which an insulating film is formed. A slow cooling device 18 for slow cooling, a cooling device 15 for cooling the slowly cooled conductor 1a with water, and a draining device 16 for draining water adhering to the conductor 1a cooled with water are provided. As a result, a desired effect is obtained.

エナメル線の製造装置の具体的な構成は、図1〜図4に示す通りであり、前述した横型焼付炉10、徐冷装置18、冷却装置15、水切り装置16、及び巻取機17を含む。   The specific configuration of the enameled wire manufacturing apparatus is as shown in FIGS. 1 to 4, and includes the horizontal baking furnace 10, the slow cooling apparatus 18, the cooling apparatus 15, the draining apparatus 16, and the winder 17. .

〔本発明の実施の形態の効果〕
本発明の実施の形態によれば、絶縁被膜上に重ねて熱硬化性樹脂を塗布する前に絶縁被膜付き導体を水による冷却装置を用いて冷却する工程を有するため、線径の太い導体を備えるエナメル線であっても横型焼付炉を用いて高速度で製造可能なエナメル線の製造方法及び製造装置を提供することができる。
[Effect of the embodiment of the present invention]
According to the embodiment of the present invention, since there is a step of cooling the conductor with an insulating film using a cooling device with water before applying the thermosetting resin on the insulating film, the conductor with a large wire diameter is An enameled wire manufacturing method and a manufacturing apparatus that can be manufactured at a high speed using a horizontal baking furnace can be provided even if the enameled wire is provided.

また、本発明の実施の形態によれば、絶縁被膜付き導体を水によって冷却する前に空冷によって徐冷することにより、冷却距離を長くせずに絶縁被膜付きの導体を所定の温度まで冷却することができる。そのため、横型焼付炉を含むエナメル線の製造装置の小型化を実現することができ、エナメル線を低コストで製造することができる。更に、エナメル線の製造速度を高速化し、絶縁塗料を重ねて塗布した後に絶縁塗料が垂れにくくできるので、均一な厚さの絶縁被膜を有するエナメル線が得られる。   Further, according to the embodiment of the present invention, the conductor with an insulating coating is cooled to a predetermined temperature without increasing the cooling distance by slowly cooling the conductor with an insulating coating with water before cooling with a water. be able to. Therefore, the downsizing of the enameled wire manufacturing apparatus including the horizontal baking furnace can be realized, and the enameled wire can be manufactured at low cost. Furthermore, since the production speed of the enameled wire is increased and the insulating coating can be made difficult to drip after the insulating coating is applied repeatedly, an enameled wire having an insulating coating with a uniform thickness can be obtained.

更に、本発明の実施の形態に係る製造方法によれば、夏季と冬季などの季節の違いによる作業温度への影響を低減でき絶縁被膜付き導体の冷却温度を一定化しやすいため、品質にバラツキが生じることを低減できる。   Furthermore, according to the manufacturing method according to the embodiment of the present invention, the influence on the working temperature due to the difference in season such as summer and winter can be reduced, and the cooling temperature of the conductor with the insulating coating can be easily made constant, so that the quality varies. The occurrence can be reduced.

なお、本発明は、上記実施の形態に限定されず種々に変形実施が可能である。例えば、水冷による冷却装置の後に従来よりも短距離の風冷による冷却装置を更に設けてもよい。   In addition, this invention is not limited to the said embodiment, A various deformation | transformation implementation is possible. For example, after the cooling device by water cooling, a cooling device by air cooling of a shorter distance than conventional may be further provided.

1:導体、1a:絶縁被膜付き導体、2:エナメル線、10:横型焼付炉(焼付炉)、13(13a,13b):ターンプーリ、14:塗布部、15:冷却装置、15A:水接触部、15B:水受け部、15C:壁面、15C,15C:水噴射ホース、15D:支柱、15a:水排出孔、15b:水排出路、16:水切り装置、16A,16B:本体上部、16C:導体通過孔、18 徐冷装置、18a:ラジエータ冷却送風部、18b:送風ダクト、18c:ガイド部、18d:冷却ダクト、20:吸引ポンプ 1: conductor, 1a: conductor with insulating coating, 2: enameled wire, 10: horizontal baking furnace (baking furnace), 13 (13a, 13b): turn pulley, 14: coating section, 15: cooling device, 15A: water contact section , 15B: water receiving portion, 15C: walls, 15C 1, 15C 2: water discharge hose, 15D: posts, 15a: water discharge hole, 15b: water discharge path, 16: draining device, 16A, 16B: upper body, 16C : Conductor passage hole, 18 Gradual cooling device, 18a: Radiator cooling air blowing part, 18b: Air blowing duct, 18c: Guide part, 18d: Cooling duct, 20: Suction pump

Claims (13)

所定の断面形状を有する導体に熱硬化性樹脂を塗布し、横型焼付炉を用いて前記導体に前記熱硬化性樹脂を焼付けて絶縁被膜付き導体を形成後、該絶縁被膜付き導体上に重ねて前記熱硬化性樹脂を塗布する前に、前記絶縁被膜付き導体を徐冷する工程と、
前記徐冷する工程の後、前記縁被膜付き導体を水による冷却装置を用いて冷却する工程と、
前記冷却する工程の後、前記縁被膜付き導体に付着した水を水切りする工程と、を含むエナメル線の製造方法。
A thermosetting resin is applied to a conductor having a predetermined cross-sectional shape, and the thermosetting resin is baked onto the conductor using a horizontal baking furnace to form a conductor with an insulating film, and then superimposed on the conductor with an insulating film. Before applying the thermosetting resin, slowly cooling the conductor with an insulating coating;
After the step of slowly cooling, the step of cooling the edge-coated conductor using a cooling device with water,
A method for producing an enameled wire, comprising: after the cooling step, draining off water adhering to the conductor with the edge coating.
前記徐冷する工程は、前記絶縁被膜付き導体を冷風で徐冷する、
請求項1に記載のエナメル線の製造方法。
The step of slowly cooling is performed by slowly cooling the conductor with an insulating film with cold air.
The method for producing an enameled wire according to claim 1.
前記導体は、20以上200以下のVD値(=前記導体の走行速度(m/分)×前記導体の外径(mm))を有する、
請求項1又は請求項2に記載のエナメル線の製造方法。
The conductor has a VD value of 20 or more and 200 or less (= running speed of the conductor (m / min) × outer diameter of the conductor (mm)).
The method for producing an enameled wire according to claim 1 or 2.
前記水は、純水又は陽イオン交換水である、
請求項1〜3のいずれか1つに記載のエナメル線の製造方法。
The water is pure water or cation exchange water.
The manufacturing method of the enameled wire as described in any one of Claims 1-3.
前記冷却する工程は、前記水を前記絶縁被膜付き導体に吹きかける及び/又は前記絶縁被膜付き導体を前記水に浸漬する工程である、
請求項1〜4のいずれか1つに記載のエナメル線の製造方法。
The step of cooling is a step of spraying the water on the conductor with an insulating coating and / or immersing the conductor with an insulating coating in the water.
The manufacturing method of the enameled wire as described in any one of Claims 1-4.
前記水切りする工程は、前記絶縁被膜付き導体に付着した水を吸引することにより水切りする工程である、
請求項1〜5のいずれか1つに記載のエナメル線の製造方法。
The step of draining is a step of draining by sucking water adhering to the conductor with an insulating coating,
The manufacturing method of the enameled wire as described in any one of Claims 1-5.
前記冷却する工程は、ターンプーリにより前記絶縁被膜付き導体の方向転換が行われる前に行われる、
請求項1〜6のいずれか1つに記載のエナメル線の製造方法。
The step of cooling is performed before the direction change of the conductor with the insulating coating is performed by a turn pulley.
The manufacturing method of the enameled wire as described in any one of Claims 1-6.
導体に塗布された熱硬化性樹脂を焼付けて前記導体上に絶縁被膜を形成するための横型焼付炉と、
前記絶縁被膜が形成された絶縁被膜付き導体を徐冷するための徐冷装置と、
徐冷された前記絶縁被膜付き導体を水により冷却するための冷却装置と、
前記水により冷却された前記絶縁被膜付き導体に付着した水を水切りするための水切り装置とを備えたエナメル線の製造装置。
A horizontal baking furnace for baking the thermosetting resin applied to the conductor to form an insulating film on the conductor;
A slow cooling device for slow cooling the conductor with an insulating coating on which the insulating coating is formed;
A cooling device for cooling the annealed conductor with an insulating coating with water;
An enameled wire manufacturing apparatus comprising: a draining device for draining water attached to the conductor with an insulating coating cooled by the water.
前記徐冷装置は、ラジエータ冷却送風部と、冷却ダクトとを備えた、
請求項8に記載のエナメル線の製造装置。
The slow cooling device includes a radiator cooling air blowing unit and a cooling duct.
The enameled wire manufacturing apparatus according to claim 8.
前記ラジエータ冷却送風部は、水冷式からなる、
請求項9に記載のエナメル線の製造装置。
The radiator cooling air blower is a water-cooled type.
The enameled wire manufacturing apparatus according to claim 9.
前記冷却装置は、前記絶縁被膜付き導体を走行させる貫通路が形成された壁面を有する水接触部を備えた、
請求項8〜10のいずれか1つに記載のエナメル線の製造装置。
The cooling device includes a water contact portion having a wall surface on which a through path for running the conductor with an insulating coating is formed.
The manufacturing apparatus of the enameled wire as described in any one of Claims 8-10.
前記水切り装置は、前記絶縁被膜付き導体を走行させる複数の導体通過孔と、前記複数の導体通過孔を前記絶縁被膜付き導体が走行している際に前記絶縁被膜付き導体に付着している水を吸引するための吸引ポンプとを備えた、
請求項8〜11のいずれか1つに記載のエナメル線の製造装置。
The draining device includes a plurality of conductor passage holes for running the conductor with an insulating coating, and water attached to the conductor with an insulating coating when the conductor with the insulating coating is running through the plurality of conductor passage holes. With a suction pump for aspirating,
The manufacturing apparatus of the enameled wire as described in any one of Claims 8-11.
前記冷却装置は、前記横型焼付炉と、前記絶縁被膜付き導体の方向を転換するターンプーリとの間に設置されている、
請求項8〜12のいずれか1つに記載のエナメル線の製造装置。
The cooling device is installed between the horizontal baking furnace and a turn pulley that changes the direction of the conductor with the insulating coating,
The enameled wire manufacturing apparatus according to any one of claims 8 to 12.
JP2018014871A 2018-01-31 2018-01-31 Manufacturing method of enamel wire, and manufacturing device of enamel wire Pending JP2019133831A (en)

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CN110931163A (en) * 2019-10-17 2020-03-27 湖州双龙线缆有限公司 Cooling device for enameled wire production and use method thereof
CN117672623A (en) * 2023-12-06 2024-03-08 江苏锡洲新材料科技有限公司 Cooling device for enameled wire

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