JP2019129027A - Light-emitting device - Google Patents

Abstract

To provide a light-emitting device capable of suppressing generation of uneven non-light emission and uneven luminance of a light-emitting pixel.SOLUTION: A light-emitting device comprises: a first substrate 2; an organic EL element 5 in which a lower electrode 11, an organic EL layer 12, and an upper electrode 13 are arranged on the first substrate 2 in this order from the first substrate 2 side; a driving circuit 7 arranged on the first substrate 2 and driving the organic EL element 5; a planarization layer 8 formed of an organic material and filling irregularities of the driving circuit 7 by covering the driving circuit 7; and an organic insulation layer 6 formed of the organic material and defining a light-emitting pixel A by covering a corner of the lower electrode 11. The driving circuit 7 is provided corresponding to each light-emitting pixel A. In a plan view, the planarization layer 8 is arranged in a position separated from the organic EL element 5.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a light emitting device using an active drive type organic EL element.

  Generally, in a light emitting device using an active drive type organic EL element, an organic EL element constituting a light emitting pixel and a drive circuit (thin film transistor) for driving the organic EL element are associated one by one. ing. In such a light emitting device, the unevenness of the drive circuit disposed on the substrate is filled with the planarizing layer, and the organic EL element is disposed on the planarizing layer. And a drive circuit and the organic EL element are electrically connected through the through-hole formed in the planarization layer (for example, refer patent document 1).

JP, 2009-087951, A

  Usually, the planarizing layer is formed of an organic material in order to fill the unevenness of the driving circuit and flatten the surface. However, the planarization layer formed of an organic material is easy to carry moisture. For this reason, when the organic EL element is disposed on the planarization layer, moisture enters the organic EL element from the water-containing planarization layer, and non-light emission unevenness and luminance unevenness of the light emitting pixels are likely to occur.

  In view of this, an object of one aspect of the present invention is to provide a light-emitting device that can suppress the occurrence of non-light-emitting unevenness and luminance unevenness of a light-emitting pixel.

  A light-emitting device according to one aspect of the present invention includes a first substrate, an organic EL element that is disposed on the first substrate in order of the lower electrode, the organic EL layer, and the upper electrode from the first substrate side, and the first substrate. A drive circuit for driving the organic EL element disposed on the top, a planarizing layer formed of the organic material to cover the drive circuit and filling the irregularities of the drive circuit, and an organic material formed of the lower electrode And an organic insulating layer which covers and defines a light emitting pixel, the drive circuit is provided corresponding to each light emitting pixel, and the planarizing layer is arranged at a position distant from the organic EL element in plan view.

  In this light emitting device, since the planarizing layer is disposed at a position distant from the organic EL element in plan view, even if the planarizing layer is hydrated, it is assumed that moisture infiltrates into the planarizing layer. In addition, it is possible to suppress moisture from entering the organic EL element from the planarization layer. As a result, it is possible to suppress the occurrence of non-emission unevenness and luminance unevenness of the light-emitting pixel. Furthermore, since the planarization layer is formed of an organic material, compared with the case where the planarization layer is formed of an inorganic material, the insulation performance is high because the coverage performance is good, and the film can be easily thickened. , High relief performance. In addition, strain due to stress can be reduced, and film peeling can also be suppressed. In addition, since the organic insulating layer formed of an organic material covers the corners of the lower electrode to define the light emitting pixels, the organic EL layer and the upper electrode can be formed gently. Thereby, the electric field concentration between the upper electrode and the lower electrode can be suppressed, so that the short failure of the organic EL element can be suppressed.

  The lower electrode further includes an inorganic insulating layer disposed at a position excluding the light emitting pixel, the upper electrode is formed of an inorganic material, and the upper electrode and the inorganic insulating layer are a planarizing layer and an organic EL element It may be in close contact with each other. In this light emitting device, since the upper electrode made of an inorganic material is in close contact with the inorganic insulating layer between the planarizing layer and the organic EL element, the propagation of moisture from the planarizing layer to the organic EL element It can be suppressed.

  The upper electrode may cover the organic EL layer in the light emitting pixel. In this light emitting device, since the upper electrode covers the organic EL layer in the light emitting pixel, the upper electrode can also function as a sealing film which prevents moisture from entering the organic EL layer.

  The organic insulating layer includes a first organic insulating layer portion that defines a light emitting pixel, and a second organic insulating layer portion that covers an end portion of the planarization layer, and the first organic insulating layer portion and the second organic insulating layer The part may be divided between the light emitting pixel and the planarization layer. In this light emitting device, since the first organic insulating layer portion and the second organic insulating layer portion are separated between the light emitting pixel and the planarizing layer, moisture enters the second organic insulating layer portion from the planarizing layer. Even if this is the case, this moisture propagation is blocked by the dividing portion between the first organic insulating layer portion and the second organic insulating layer portion. For this reason, generation | occurrence | production of the non-light emission nonuniformity and brightness | luminance nonuniformity of a light emission pixel can further be suppressed.

  The organic EL element and the drive circuit may be in contact with the first substrate. In this light-emitting device, since the organic EL element and the drive circuit are in contact with the first substrate, space saving can be achieved in the thickness direction of the first substrate. Further, for example, when the light emitting device is a bottom emission type in which light is emitted to the first substrate side, excellent optical characteristics can be obtained.

  An adhesive for forming a sealing space for bonding the first substrate and the second substrate and bonding the first substrate and the second substrate to seal the organic EL element between the first substrate and the second substrate; , And may be further provided. In this light emitting device, since the organic EL element is sealed with the first substrate, the second substrate, and the adhesive, the lifetime can be extended.

  According to the present invention, it is possible to suppress the occurrence of non-emission unevenness and luminance unevenness of the light-emitting pixel.

It is a schematic plan view which shows the light-emitting device of embodiment. It is a schematic cross section which shows the light-emitting device of 1st embodiment. It is a schematic cross section in the III-III line shown in FIG. It is a schematic cross section in the IV-IV line shown in FIG. It is a schematic cross section which shows the light-emitting device of 2nd embodiment. It is a schematic cross section in the VI-VI line shown in FIG. It is a schematic cross section in the VII-VII line shown in FIG. It is a schematic cross section which shows the light-emitting device of a modification. It is a schematic cross section which shows the light-emitting device of a modification.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. The same or corresponding elements in the drawings will be denoted by the same reference symbols, without redundant description. Moreover, the numerical range shown using "-" in this specification shows the range which includes the numerical value described before and after "-" as the minimum value and the maximum value, respectively.

(First embodiment)
The light emitting device of the present embodiment is an active drive type light emitting device. Examples of the light emitting device include an optical print head that emits light for exposing a photosensitive medium, an illumination device that emits light for illumination, and a display device that displays a signage display and a segment pattern. The shape of the light emitting device is not particularly limited, and may be elongated linear, curved, spiral or the like. In the present embodiment, as an example, the light emitting device is described as being formed in a rectangular shape in plan view.

  As shown in FIG. 1, the light emitting device 1 of the present embodiment is formed in a rectangular shape in plan view. In this plan view, the direction in which the long side 1a of the light emitting device 1 extends (the opposing direction of the pair of short sides 1b, 1b) is referred to as the long side direction D1, and the direction in which the short side 1b of the light emitting device 1 extends (the pair of long sides The opposing direction 1a, 1a) is referred to as the short side direction D2.

  As shown in FIGS. 1 to 4, the light emitting device 1 of the present embodiment includes a first substrate 2, a second substrate 3, an adhesive 4, an organic EL element 5, an organic insulating layer 6, and a drive circuit. 7, a planarizing layer 8, and a desiccant 9. FIG. 2 is a cross-sectional view taken along the line II-II shown in FIGS.

The first substrate 2 is an element substrate on which the organic EL element 5 and the like are provided. The first substrate 2 is, for example, a glass substrate, a ceramic substrate, a metal substrate, or a flexible substrate (for example, a plastic substrate or the like). The first substrate 2 has translucency, for example. The first substrate 2 is formed in a rectangular plate shape, for example. The first substrate 2 is preferably formed of a material that does not transmit water vapor. Here, not transmitting water vapor does not only mean that water vapor is not completely transmitted, but also means that water vapor is not substantially transmitted. Specifically, it means that the water vapor permeability is not more than 10 ⁻⁵ [g / m ² · day].

  The second substrate 3 is a sealing substrate that seals the organic EL element 5 and the like, and is provided to face the first substrate 2. The first substrate 2 and the second substrate 3 are stacked on each other. Hereinafter, the direction in which the first substrate 2 and the second substrate 3 are stacked will be described simply as the “stacking direction”. The stacking direction corresponds to the thickness direction of the first substrate 2 and the second substrate 3. In the present embodiment, viewing from the stacking direction is referred to as a plan view. The second substrate 3 is, for example, a glass substrate, a ceramic substrate, a metal substrate, or a flexible substrate (for example, a plastic substrate). The second substrate 3 has, for example, a light transmitting property. The second substrate 3 is formed in a rectangular plate shape, for example. The second substrate 3 is preferably formed of a material that does not transmit water vapor.

  The adhesive 4 is an adhesive that directly or indirectly bonds (bonds) the first substrate 2 and the second substrate 3 to form a sealed space S between the first substrate 2 and the second substrate 3. It is an agent. The adhesive 4 is formed in a frame shape (annular shape) in order to form a sealing space S between the first substrate 2 and the second substrate 3. The adhesive 4 is formed in, for example, a rectangular frame with rounded corners. As a material for forming the adhesive 4, for example, an ultraviolet curable epoxy resin can be used.

  The organic EL element 5 is an element that generates light when supplied with a current. The organic EL element 5 is disposed on the first substrate 2. The organic EL element 5 includes a light emitting pixel A that is driven by a drive circuit 7 to emit light. The organic EL element 5 is preferably in contact with the first substrate 2. In the organic EL element 5, the lower electrode 11, the organic EL layer 12, and the upper electrode 13 are disposed in this order from the first substrate 2 side.

  A plurality of organic EL elements 5 are provided on the first substrate 2. The plurality of organic EL elements 5 are arranged in one row or two rows. The plurality of organic EL elements 5 in each row are linearly arranged in the long side direction D1. When a plurality of organic EL elements 5 are arranged in two rows, each row is arranged in parallel in the short side direction D2, and each organic EL device 5 in each row is alternately arranged in the long side direction D1. ing.

  The lower electrode 11 is a conductive layer that functions as either an anode or a cathode. In the present embodiment, the lower electrode 11 is described as a transparent conductive layer that functions as an anode. As a material for forming the lower electrode 11, for example, ITO (indium tin oxide), IZO (indium zinc oxide), etc. having translucency, aluminum, silver, alkaline earth metals etc. not having translucency Used. The lower electrode 11 is formed, for example, by patterning a transparent conductive film formed on the first substrate 2 by a PVD method (physical vapor deposition method) such as a vacuum evaporation method or a sputtering method. In addition, the inorganic insulating layer 16 is disposed at a position excluding the light emitting pixel A on the lower electrode 11.

  The organic EL layer 12 includes at least an organic light emitting layer containing a light emitting material. The organic EL layer 12 may have a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, and the like in addition to the organic light emitting layer. The organic EL layer 12 is formed by, for example, a PVD method or a solution coating method.

  The upper electrode 13 is a conductive layer that functions as either the anode or the cathode. In the present embodiment, the upper electrode 13 is described as a conductive layer that functions as a cathode. The upper electrode 13 is formed of an inorganic material. As a material for forming the upper electrode 13, for example, a metal such as aluminum or silver, ITO, IZO, an alkaline earth metal or the like is used. The upper electrode 13 is formed by, for example, an electron beam evaporation method or a PVD method.

  The upper electrode 13 covers the organic EL layer 12 in the light emitting pixel A. Specifically, the upper electrode 13 covers the organic EL layer 12 in the light emitting pixel A, and is in close contact with the inorganic insulating layer 16 between the planarization layer 8 and the organic EL element 5. The organic EL layer 12 is sealed by the upper electrode 13, the inorganic insulating layer 16, and the lower electrode 11. The upper electrode 13 only needs to cover the organic EL layer 12 at least in the light emitting pixel A, and is not necessarily connected to the inorganic insulating layer 16.

  The organic insulating layer 6 is disposed in the sealed space S. The organic insulating layer 6 is formed of an organic material. As an organic material for forming the organic insulating layer 6, for example, an epoxy resin or a novolac resin can be used. The organic insulating layer 6 covers the corner of the lower electrode 11 to define a light emitting pixel A. In the organic insulating layer 6, an opening 14 for defining a light emitting pixel A is formed. For this reason, the position and shape of the light emitting pixel A are defined by the opening 14 of the organic insulating layer 6. The organic insulating layer 6 is formed, for example, by coating with a wet method such as spin coating and patterning into an arbitrary shape by photolithography.

  As viewed from the stacking direction (in plan view), both ends in the long side direction D1 of the organic insulating layer 6 extend to the planarization layer 8 and cover the ends of the planarization layer 8. On the other hand, both end portions in the short side direction D2 of the organic insulating layer 6 do not extend to the planarizing layer 8 and do not cover the planarizing layer 8 at all.

  The drive circuit 7 is a switching element for driving the organic EL element 5 and is provided corresponding to each light emitting pixel A. The drive circuit 7 is incorporated in an electric circuit (not shown) that drives the organic EL element 5, and is connected to the upper electrode 13 of the organic EL element 5 by a wiring 15. As the drive circuit 7, for example, a semiconductor circuit composed of a low temperature polycrystalline silicon thin film transistor (LTPS-TFT) and a capacitor can be used.

  The drive circuit 7 is disposed on the first substrate 2. The drive circuit 7 is preferably in contact with the first substrate 2. The drive circuit 7 is disposed at a position away from the organic EL element 5 in plan view. That is, the drive circuit 7 is not disposed under the organic EL element 5. More specifically, the drive circuit 7 is positioned between the organic EL element 5 and the long side 1a so that the organic EL element 5 and the drive circuit 7 corresponding to each other are aligned in the short side direction D2 in plan view. Are arranged in a linear region. Here, when the organic EL elements 5 are arranged in one row, the drive circuit 7 may be arranged on one long side 1a side with respect to the row of the organic EL elements 5, and the other long side. It may be disposed on the side 1a. However, from the viewpoint of space saving, it is preferable that all the drive circuits 7 be disposed on the same side with respect to the row of the organic EL elements 5. On the other hand, when the organic EL elements 5 are arranged in two lines, the drive circuit 7 is on the long side 1 a side opposite to the line of the other organic EL elements 5 with respect to the line of one organic EL element 5 Placed in. Further, the drive circuit 7 is disposed outside the upper electrode 13 in a plan view.

  The planarization layer 8 is a layer which is formed of an organic material and covers the drive circuit 7 and fills the unevenness of the drive circuit 7. The planarization layer 8 needs to be formed thicker than the unevenness in order to reduce the unevenness due to the drive circuit 7 and the like. For this reason, the planarization layer 8 is generally formed of an organic material that can be coated from a liquid phase and is easier to thicken and planarize than an inorganic material. By thickening the film, insulation between the structure on the planarization layer 8 and the structure just below the planarization layer 8 can be secured. In addition, the structure can be stably formed on the planarization layer 8 by the planarization.

  As a method for forming the flattening layer 8, generally, a method of forming a coating film of an organic material such as polyimide resin or acrylic resin by a wet method is suitable. As a wet method, for example, there is a method in which an organic material is coated by spin coating and patterned by photolithography. Such a method for forming the planarizing layer 8 has high insulation performance because it has good coverage performance as compared with the case where the planarizing layer is formed of an inorganic material, it is easy to form a thick film, and the unevenness reducing performance Is expensive. In addition, strain due to stress can be reduced, and film peeling can also be suppressed.

  The planarization layer 8 is disposed on the first substrate 2. The planarizing layer 8 is disposed at a distance from the organic EL element 5 in a plan view. That is, the planarization layer 8 is not disposed below the organic EL element 5. More specifically, the planarizing layer 8 is disposed in a frame-like region located between the organic EL element 5 and the long side 1 a and the short side 1 b so as to surround the organic EL element 5 in plan view. ing. Thereby, the planarization layer 8 covers the drive circuit 7 and fills the unevenness of the drive circuit 7 without being disposed between the organic EL element 5 and the first substrate 2.

  The planarization layer 8 is covered with an inorganic insulating layer 17. The adhesive 4 is bonded to the inorganic insulating layer 17. For this reason, even if moisture intrudes into the adhesive 4, the moisture can be prevented from reaching the planarization layer 8. The inorganic insulating layer 17 is preferably in contact with the planarizing layer 8. Between the planarizing layer 8 and the inorganic insulating layer 17, wiring (not shown) such as a lead wiring connected to an external circuit is arranged. As a material for forming the inorganic insulating layer 17, for example, an oxide such as SiO 2 or SiN can be used. The planarization layer 8 is formed, for example, by a method of coating by a wet method such as spin coating.

  The desiccant 9 is contained in the sealed space S to dry the sealed space. The desiccant 9 is filled in the sealed space S without a gap. As a material for forming the desiccant 9, for example, an alkaline earth metal oxide such as CaO or an organic metal complex compound can be used.

  As described above, in the light emitting device 1 according to the present embodiment, since the planarizing layer 8 is disposed at a distance from the organic EL element 5 in plan view, even if the planarizing layer 8 is hydrated, In addition, even if moisture enters the planarizing layer 8, it is possible to suppress moisture from entering the organic EL element 5 from the planarizing layer 8. Thereby, non-light emission unevenness and luminance unevenness of the light emitting pixel A can be suppressed. Furthermore, since the planarization layer 8 is formed of an organic material, compared with the case where the planarization layer 8 is formed of an inorganic material, the coverage performance is good, so that the insulating property is high and the thickness can be easily increased. And, the relief performance of unevenness is high. In addition, strain due to stress can be reduced, and film peeling can also be suppressed. Moreover, since the organic insulating layer 6 formed of an organic material covers the corners of the lower electrode 11 to define the light emitting pixel A, the organic EL layer 12 and the upper electrode 13 can be formed gently. Thereby, since electric field concentration between the upper electrode 13 and the lower electrode 11 can be suppressed, a short circuit failure of the organic EL element 5 can be suppressed.

  Further, since the upper electrode 13 formed of an inorganic material is in close contact with the inorganic insulating layer 16 between the planarization layer 8 and the organic EL element 5, the moisture from the planarization layer 8 to the organic EL element 5 is Propagation can be suppressed.

  Further, since the upper electrode 13 covers the organic EL layer 12 in the light emitting pixel A, the upper electrode 13 can also function as a sealing film that prevents moisture from entering the organic EL layer 12.

  In addition, since the organic EL element 5 and the drive circuit 7 are in contact with the first substrate 2, space saving can be achieved in the thickness direction of the first substrate 2. Further, for example, when the light emitting device 1 is a bottom emission type that emits light toward the first substrate 2, excellent optical characteristics can be obtained.

  Moreover, since the organic EL element 5 is sealed with the first substrate 2, the second substrate 3, and the adhesive 4, the life can be extended.

Second Embodiment
The second embodiment is basically the same as the first embodiment, and only the configuration of the organic insulating layer is different from the first embodiment. For this reason, below, only the matter which is different from the first embodiment will be described, and the explanation of the same matter as the first embodiment will be omitted.

  As shown in FIGS. 5 to 7, the light emitting device 1 </ b> A of the present embodiment includes a first substrate 2, a second substrate 3, an adhesive 4, an organic EL element 5, an organic insulating layer 6 </ b> A, and a drive circuit. 7, the planarization layer 8, and the desiccant 9. 5 is a cross-sectional view taken along the line V-V shown in FIG. 6 and FIG.

  The organic insulating layer 6A is a layer corresponding to the organic insulating layer 6 of the first embodiment. The function and material of the organic insulating layer 6A are the same as those of the organic insulating layer 6 of the first embodiment. Similar to the organic insulating layer 6 of the first embodiment, the organic insulating layer 6A is disposed in the sealing space S and forms an opening 14 for forming the light emitting pixel A. Both end portions in the long side direction D1 of the organic insulating layer 6A cover end portions of the planarizing layer 8, and both end portions in the short side direction D2 of the organic insulating layer 6A do not cover the planarizing layer 8 at all.

  The organic insulating layer 6A has a first organic insulating layer portion 6A1 that defines the light emitting pixel A, and a second organic insulating layer portion 6A2 that covers the end of the planarization layer 8. The first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are divided between the light emitting pixel A and the planarizing layer 8. The fact that the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are divided means that the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are separated without contacting with each other. Say.

  The organic insulating layer 6A has one first organic insulating layer portion 6A1, and this one first organic insulating layer portion 6A1 defines all the light emitting pixels A. That is, all the openings 14 that define the light emitting pixels A are formed in one first organic insulating layer portion 6A1. On the other hand, the organic insulating layer 6A has a pair of second organic insulating layer portions 6A2, and the first organic insulating layer 6A2 covers the end of the planarizing layer 8, respectively. It arrange | positions at the both sides in the long side direction D1 of part 6A1.

  A portion where the organic insulating layer 6A is not formed between the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 is referred to as a dividing portion 6A3. That is, the dividing portion 6A3 is a portion where the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are divided. The dividing portion 6A3 is a portion that divides the organic insulating layer which may be a water propagation path, and in the present embodiment, the organic EL layer 12 is provided in the dividing portion 6A3. That is, by separating the organic insulating layers (the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2) that may become a moisture propagation path by the dividing portion 6A3, moisture that has entered from the end of the light emitting device 1A is obtained. The light emitting pixel A is prevented from reaching. The dividing portion 6A3 may be provided at any position as long as it is between the light emitting pixel A and the planarization layer 8. Further, the dividing portion 6A3 may have any width and shape as long as it can divide the water propagation path.

  As described above, in the light emitting device 1A according to the present embodiment, the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2 are separated between the light emitting pixel A and the planarizing layer 8, and thus flat. Even if moisture enters the second organic insulating layer portion 6A2 from the conversion layer 8, this moisture propagation is blocked by the dividing portion 6A3 between the first organic insulating layer portion 6A1 and the second organic insulating layer portion 6A2. The For this reason, generation | occurrence | production of the non-light emission nonuniformity and brightness | luminance nonuniformity of a light emission pixel can further be suppressed.

  As mentioned above, although the suitable embodiment of the present invention was described, the present invention is not limited to the above-mentioned embodiment. For example, in the above embodiment, the desiccant has been described as being filled without gaps in the sealed space, but the desiccant may be anything as long as the sealed space can be dried. For example, as in the light emitting device 1B shown in FIGS. 8 and 9, the desiccant 9B formed in a sheet type may be attached to the second substrate 3 from the sealing space S side. 8 is a schematic cross-sectional view corresponding to the line III-III shown in FIG. 2, and FIG. 9 is a schematic cross-sectional view corresponding to the line IV-IV shown in FIG.

  1, 1A, 1B: light emitting device, 1a: long side, 1b: short side, 2: first substrate, 3: second substrate, 4: adhesive, 5: organic EL element, 6, 6A: organic insulating layer, 6A1 ... first organic insulating layer part, 6A2 ... second organic insulating layer part, 6A3 ... dividing part, 7 ... driving circuit, 8 ... flattening layer, 9, 9B ... desiccant, 11 ... lower electrode, 12 ... organic EL Layer 13 Upper electrode 14 Opening 15 Wiring 16 Inorganic insulating layer 17 Inorganic insulating layer A light emitting pixel S sealing space.

Claims (6)

A first substrate,
An organic EL element in which a lower electrode, an organic EL layer, and an upper electrode are disposed in this order from the first substrate side on the first substrate;
A drive circuit disposed on the first substrate for driving the organic EL element;
A planarizing layer formed of an organic material to cover the drive circuit and fill the irregularities of the drive circuit;
And an organic insulating layer formed of an organic material and covering the corner of the lower electrode to define a light emitting pixel.
The drive circuit is provided corresponding to each of the light emitting pixels,
The planarization layer is disposed at a position away from the organic EL element in plan view.
Light emitting device. Further comprising an inorganic insulating layer disposed on the lower electrode excluding the light emitting pixels,
The upper electrode is made of an inorganic material,
The upper electrode and the inorganic insulating layer are in close contact with each other between the planarizing layer and the organic EL element.
The light emitting device according to claim 1. The upper electrode covers the organic EL layer in the light emitting pixel.
A light emitting device according to claim 1 or 2. The organic insulating layer is
A first organic insulating layer defining the light emitting pixels;
A second organic insulating layer portion covering an end portion of the planarizing layer,
The first organic insulating layer portion and the second organic insulating layer portion are divided between the light emitting pixel and the planarizing layer.
The light emitting device according to claim 3. The organic EL element and the drive circuit are in contact with the first substrate,
The light-emitting device as described in any one of Claims 1-4. A second substrate facing the first substrate;
An adhesive that bonds the first substrate and the second substrate to form a sealing space for sealing the organic EL element between the first substrate and the second substrate;
The light emitting device according to any one of claims 1 to 5.