JP2009087951A - Organic el display device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely carry out connection of an extraction electrode from an organic EL element with a connection target, and secure superior display performance of respective organic EL elements. <P>SOLUTION: In the organic EL display device having an undercoat layer 2 which includes a layer composed of an organic material, an organic EL element region 3 on the undercoat layer 2, and a connecting part 5 in which the connection target 4 is connected to the extraction electrode 30 from the organic EL element 3A of the upper peripheral part of a substrate 1, the undercoat layer 2 has a planarization layer 20 to fill unevenness of each organic EL element 3A, a passivation layer 21 and the organic EL elements 3A are sequentially formed on the planarization layer 20, all of the connecting parts 5 are covered with the passivation layer 21, the extraction electrode 30 formed thereon is formed from the organic EL element region 3 to the connecting parts 5 on the passivation layer 21, and is connected by thermocompression bonding with an anisotropic conductive film 6 made interposed between the extraction electrode 30 and the connection target 4, the planarization layer 20 is removed corresponding to the thermocompression bonding parts, and an undercoat layer removing face 20A facing the connecting part 5 has an upward taper face tilted in a range of 45°±30° with respect to the substrate 1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an organic EL display device and a manufacturing method thereof.

  In an organic EL display device, an anode made of a transparent electrode such as ITO is formed on a substrate made of transparent glass or the like, an organic layer including a light emitting layer made of an organic compound is formed thereon, and a metal such as Al is formed thereon. An organic EL element formed by forming a cathode composed of an electrode has a basic configuration, and an image is displayed by arranging the organic EL element as a unit surface light emitting element on a flat substrate.

  In such an organic EL display device, a functional element such as a thin film transistor (Thin Film Transistor; hereinafter referred to as TFT) necessary for performing active matrix driving or a color filter necessary for performing multicolor display. In order to fill the irregularities formed by such functional elements, a base layer is formed on the entire surface of the substrate on which the functional elements are formed, and individual functional elements are formed thereon. An organic EL element is formed corresponding to the position of the above.

  As a specific conventional example of such an organic EL display device, for example, in the device described in Patent Document 1, an organic EL element formed in a dot matrix form on a substrate is independently driven. A TFT is formed as the above-described functional element, and a planarizing layer made of a resin material or the like is formed in order to fill the unevenness caused by the TFT and a wiring layer connected to the TFT. In addition, since gas components such as water vapor emitted from the planarization layer may deteriorate the organic EL element, a passivation layer having a gas barrier property is formed on the planarization layer, and the organic EL element is disposed on the passivation layer. Forming.

  As another conventional example, as described in Patent Document 2, for example, a color filter or a color conversion filter for performing multicolor display is formed on a substrate as the above-described functional element, and this color filter or color conversion is performed. In order to fill the unevenness caused by the filter, a multi-layered flattening layer made of a resin material layer or the like is formed. Further, a passivation layer is formed on the flattening layer, and an organic EL element is formed thereon.

JP 2001-356711 A Japanese Patent Laid-Open No. 11-121164

  In such an organic EL display device, generally, a base layer made of a planarization layer or a passivation layer is formed on the entire surface of the substrate. However, for example, in the case of a display device of simple matrix drive, a connection region for connecting an extraction electrode from each organic EL element and a peripheral circuit, a drive IC, etc. is formed in the vicinity of the periphery on the substrate. Then, a connection such as COF (Chip On FPC (Flexible Printed Circuit)) is made to the extraction electrode drawn out on the above-mentioned underlayer.

  COF is a flexible printed circuit (FPC) with a driving IC chip mounted. Generally, TCP (Tape Carrier Package) with IC chip mounted by TAB (Tape Automated Bonding) is used. Has been. The connection between the TCP and the extraction electrode described above is performed by thermocompression bonding with an anisotropic conductive film (ACF) sandwiched between the two electrodes. As described above, the extraction electrode is made of a resin material or the like. It has been confirmed that this connection is likely to have a problem when it is formed on a base layer made of an organic material. This is because the base layer that becomes the base of the extraction electrode at the time of thermocompression is subjected to thermal deterioration at the same time and does not function as a base, and sufficient thermocompression bonding cannot be performed on the anisotropic conductive film between both electrodes. This is thought to be caused by this. Here, in order to fill the unevenness on the substrate, it is necessary to form at least one layer of the base layer with an organic material. However, the heat resistant limit temperature of the organic material and the above-described thermocompression bonding temperature are approximately the same. (180 ° C. to 200 ° C.) When connecting the extraction electrode formed on the underlayer by thermocompression bonding, there is a problem that the underlayer is inevitably thermally deteriorated and reliable connection cannot be made. It was.

  This is not only a problem when the above-described COF is a connection target, but the same problem occurs in COG (Chip On Glass) in which an IC chip is mounted on the extraction electrode on the substrate. That is, in the COG, an anisotropic conductive film is interposed between the bumps of the electrodes formed on the IC chip and the extraction electrodes, and thermocompression bonding is performed, and this is performed on the extraction formed on the base layer. If it is performed on the electrode, there is a problem that the base layer is thermally deteriorated and reliable connection cannot be performed.

  This invention makes it an example of a subject to cope with such a situation. That is, an object of the present invention is to provide an organic EL display device in which an organic EL element is formed on a base layer formed on a substrate and a method for manufacturing the same, and an electrical connection between an extraction electrode extracted from the organic EL element and a connection target. It is to ensure a good connection performance, or to ensure a good display performance of the organic EL element after making this connection securely.

  In order to achieve such an object, the organic EL display device and the manufacturing method thereof according to the present invention include at least the configurations according to the following independent claims.

  First, a base layer including at least one layer made of an organic material is formed on a substrate, an organic EL element region for forming an organic EL element on the base layer, and a peripheral portion on the substrate, In the organic EL display device having a connection portion that electrically connects a connection target to the extraction electrode from the organic EL element, the base layer is provided for each of the organic EL elements formed on the substrate. A thin film transistor, a color conversion filter, or a flattening layer that fills the unevenness of the color filter is formed, and a gas barrier passivation layer is formed on the uppermost layer, the organic EL element is formed on the passivation layer, and the connection portion is Are covered with the passivation layer, and the extraction electrode is formed on the passivation layer. The extraction electrode is connected to a pixel electrode, and is connected from the organic EL element region to the connection portion. Formed on the passivation layer, an anisotropic conductive film is interposed between the extraction electrode and the connection target, and connected by thermocompression bonding, and the connection portion is aligned with the thermocompression bonding location at the time of connection, At least one layer made of an organic material is removed from the planarizing layer, and the base layer removal surface facing the connection portion is an upward tapered surface inclined with respect to the substrate within a range of 45 ° ± 30 °. It is characterized by.

  Second, in the method of manufacturing an organic EL display device, a step of forming a base layer including at least one layer made of an organic material on a substrate, and the base layer is formed on the substrate. A step of forming a connection portion by partially removing at least one layer made of an organic material of the flattening layer, having a flattening layer that fills the unevenness of the thin film transistor, color conversion filter, or color filter provided for each element And a step of forming a passivation layer on the upper surface of the planarizing layer and the connecting portion, and forming an organic EL element on the passivation layer in the organic EL element region on the substrate and a peripheral portion on the substrate Forming an extraction electrode at the connection portion, and in the connection portion, an anisotropic conductive film is interposed between the extraction electrode and the electrode to be connected, and these are thermocompression bonded. The extraction electrode is connected to the pixel electrode, is formed on the passivation layer from the organic EL element region to the connection portion, and the underlayer removal surface facing the connection portion is formed on the substrate. It is an upward taper surface inclined within a range of 45 ° ± 30 °.

It is an external view which shows the whole structure of the organic electroluminescence display which concerns on one Embodiment of this invention. It is explanatory drawing which shows the principal part of the organic electroluminescence display which concerns on one Embodiment of this invention, and the manufacturing method of the organic electroluminescence display which concerns on one Embodiment of this invention. In the Example of this invention, it is explanatory drawing which shows the example of the organic electroluminescent display apparatus driven by an active matrix. In the Example of this invention, it is explanatory drawing which shows the example of the organic electroluminescent display apparatus driven by passive matrix. It is explanatory drawing explaining the manufacturing method of the organic electroluminescence display which concerns on an Example. It is explanatory drawing explaining the manufacturing method (mainly connection part formation process) of the organic electroluminescence display which concerns on an Example.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an external view showing an overall configuration of an organic EL display device according to an embodiment of the present invention, and FIG. 2 is a main part of the organic EL display device according to an embodiment of the present invention and an embodiment of the present invention. It is explanatory drawing which shows the manufacturing method of the organic electroluminescence display which concerns on.

  In these drawings, in the embodiment of the present invention, a base layer 2 including at least one layer made of an organic material is formed on a substrate 1 such as a transparent glass substrate, and an organic EL element 3A (organic) is formed on the base layer 2. It is assumed that the organic EL display device in which the connection target 4 is electrically connected to the extraction electrode 30 from the organic EL element 3A on the substrate 1 is formed.

  Here, each organic EL element 3A forming the organic EL element region 3 includes one electrode 30A (for example, a transparent electrode such as ITO) connected to the extraction electrode 30 and the other electrode 31A (for example, a metal electrode such as Al). ), An organic light emitting functional layer 32A including a light emitting layer is formed. The connection target 4 is the above-described TCP (TAB) using COF (Chip On FPC), an IC chip using COG (Chip On Glass), or a non-flexible circuit board using COB (Chip On Board). It is not limited.

  And as 1st Embodiment, according to the thermocompression bonding location at the time of the connection of the extraction electrode 30 and the connection object 4, forming the connection part 5 which removed the layer which consists of at least organic material of the base layer 2 is formed. Features. In addition, as a manufacturing method, a connection portion is formed by partially removing a layer made of at least one organic material on the substrate 1 and a step of forming the base layer 2 including at least one layer made of an organic material on the substrate 1. 5, the step of forming the organic EL element 3 </ b> A on the base layer 5 and forming the extraction electrode 30 on the connection portion 5, and the connection portion 5, the extraction electrode 30 and the electrode 40 ( And an anisotropic conductive film 6 interposed between them and a thermocompression bonding member 7 (a heater tool or the like).

  According to such a feature, in the base layer 2 formed on the substrate 1, a layer made of an organic material is partially removed at a position corresponding to a thermocompression bonding position at the time of connection, and thereby a connection portion 5 is formed. The And the extraction electrode 30 drawn out from the organic EL element 3A is formed in this connection part 5, Here, the anisotropic conductive film 6 is interposed between the extraction electrode 30 and the electrode 40 of the connection object 4, Thermocompression bonding by the thermocompression bonding member 7 is performed. According to this, since there is no organic material layer hindering thermocompression bonding below the thermocompression bonding portion, the anisotropic conductive film 6 is sufficiently sandwiched between the extraction electrode 30 and the electrode 40 of the connection object 4. As a result, the electrical connection between the extraction electrode 30 and the electrode 40 can be ensured.

  Second, in the organic EL display device having the above-described characteristics or the manufacturing method thereof, the underlayer removal surface 20A facing the connection portion 5 is within an angle θ = 45 ° ± 30 ° with respect to the substrate 1. It is an inclined upward tapered surface.

  According to this, in addition to the above-described features, the underlayer removal surface 20A forms an upward taper surface, so that a layer can also be formed thereon by film formation. Therefore, another base layer (passivation layer 21) or extraction electrode 30 formed by film formation on the base layer removal surface 20A can be formed without being divided here.

  Explaining the range of the inclination angle θ = 45 ° ± 30 ° of the underlayer removal surface 20A, the maximum value of 75 ° ensures that the layer formed thereon is not divided and the function of each layer is secured. This is an inclination angle at which a sufficient thickness can be obtained. It goes without saying that the extraction electrode 30 has a high resistance when the layer thickness is thin even if it is not divided, and affects the light emission of the organic EL element. The minimum value of 15 ° is the limit inclination angle at which taper formation is practically possible.

  Thirdly, in the organic EL display device having the above-described characteristics or the manufacturing method thereof, the underlayer 2 is characterized in that a gas barrier passivation layer 21 is formed as the uppermost layer.

  According to this, by forming the gas barrier passivation layer 21 on the uppermost layer of the underlayer 2 including the organic material layer, it is possible to contain gas components such as water vapor emitted from the organic material. Deterioration of the organic light emitting functional layer or the like in the electrode 30 or the organic EL element 3A can be prevented. In particular, by forming the base layer removal surface 20A to have the tapered surface having the angle described above, it is possible to avoid the division of the passivation layer 21 formed thereon. As a result, even in the case where the base layer 2 is partially removed to form the connection portion 5, the base layer 2 containing the organic material is completely covered with the passivation layer 21 on the entire surface of the substrate 1. It is possible to ensure good display performance of the EL element 3A. Although not shown, the connection layer 5 from which the organic material layer is removed may have a configuration in which the passivation layer 21 is deleted as long as the organic material layer is not exposed.

  Fourth, the underlayer 2 includes at least a planarizing layer 20 that fills the unevenness of the functional element 33 formed on the substrate 1. Fifth, the functional element 33 includes individual functional elements 33A, 33A,... Provided for each organic EL element 3A, and the functional element 33A is a thin film transistor. Sixth, the functional element 33A is a color conversion filter or a color filter.

  According to these characteristics, in addition to the above-described characteristics, the unevenness due to the functional element 33 formed on the substrate can be filled with the planarization layer 20, so that the planarization layer 20 temporarily flattens regardless of the unevenness. In addition, an organic EL element can be formed. Therefore, it is possible to form a high-quality element based on high film thickness control. Each feature described above can be obtained in the same way even when the functional element 33 is a thin film transistor, or a color conversion filter or a color filter. It is possible to provide an organic EL display device and a method for manufacturing the same that can ensure stable crimping quality with respect to thermocompression bonding of the extraction electrode connecting portion regardless of driving, monochrome display or multicolor display.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 3 is an explanatory view showing an example of an organic EL display device driven by active matrix in the embodiment of the present invention. In this organic EL display device, a TFT 8 is formed for each organic EL element 3B constituting a pixel on a substrate 1 made of a transparent glass substrate or the like, and each TFT 8 has a wiring (gate wiring) formed on the substrate 1. , Drain wiring; not shown) are connected. A planarization layer 20 having an underlayer removal surface 20A facing the connection portion 5 is formed on the substrate 1, and a passivation layer 21 covering the planarization layer 20 is formed thereon.

  The planarizing layer 20 is a layer made of, for example, an acrylic or polyimide resin material or an organic material such as organic silica and formed by a coating method such as spin coating, dip coating, or slot coating. By forming the flattening layer 20, the flat surface for forming the organic EL element 3B is formed in a state in which the unevenness due to the TFT 8 or the wiring on the substrate 1 is filled. Further, the passivation layer 21 is made of an insulating material having a gas barrier property that can block the release of gas (such as water vapor) from the planarization layer 20, for example, an inorganic material such as silicon oxide, silicon nitride, and amorphous silicon. The film is formed by ion plating, sputtering, low temperature sputtering, vapor deposition, EB, or the like.

  An organic EL element 3 </ b> B is formed on the passivation layer 21 formed as the uppermost layer on the foundation layer 2 including the planarizing layer 20 and the passivation layer 21. In this embodiment, the organic EL element 3B is configured to extract light to the substrate 1 side, and a pixel electrode 30B made of a transparent electrode such as ITO is formed on the base layer 2 to form an anode. Further, for example, an organic light emitting functional layer 32B composed of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer is formed, and further, a metal common electrode 31B forming a cathode thereon. Is forming. An insulating layer 81 is formed between the adjacent pixel electrode 30B and the organic light emitting functional layer 32B. Here, an example in which light is extracted to the substrate 1 side is shown, but a configuration in which light is extracted from above by reversing the materials of the upper and lower electrodes and the organic light emitting functional layer is also possible.

  Further, the connection portion 5 is formed in the peripheral portion on the substrate 1, and the planarizing layer 20 made of an organic material is partially removed in order to form the connection portion 5. Then, when removing the planarizing layer 20, an underlayer removal surface 20 </ b> A composed of an upward tapered surface facing the connection portion 5 is formed. The connection portion 5 is entirely covered with the passivation layer 21 including the underlayer removal surface 20A, and the extraction electrode 30 connected to the pixel electrode 30B described above is formed thereon. Therefore, in the connection part 5, the crimping | compression-bonding area | region where the planarization layer 20 which consists of organic materials does not exist on the board | substrate 1 is formed, In this crimping | compression-bonding area | region, the extraction electrode 30 and the connection object 4 (for example, TCP (TAB) And the electrode 40 are connected by thermocompression bonding with the anisotropic conductive film 6 interposed therebetween.

  FIG. 4 is an explanatory diagram showing an example of an organic EL display device driven by passive matrix according to another embodiment of the present invention. In the following, the same reference numerals are assigned to portions common to the above-described embodiments, and a part of the overlapping description is omitted. In this organic EL display device, a color conversion filter or color filters 9A, 9B, 9C,... For performing multicolor display are formed on a substrate 1 made of a transparent glass substrate or the like for each organic EL element 3C constituting a pixel. Has been. A planarization layer 20 having an underlayer removal surface 20A facing the connection portion 5 is formed on the substrate 1, and a passivation layer 21 covering the planarization layer 20 is formed thereon.

  An organic EL element 3 </ b> C is formed on the base layer 2 composed of the planarizing layer 20 and the passivation layer 21. In this embodiment, the organic EL element 3C is configured to extract light to the substrate 1, and the lower electrode 30C for forming an anode made of a transparent electrode such as ITO is formed on the base layer 2 in a stripe shape. An organic light emitting functional layer 32C composed of, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer is formed thereon, and the lower electrode 30C is further formed thereon. A strip-like upper electrode 31C (a metal electrode such as Al) orthogonal to is formed. Here, an example in which light is extracted to the substrate 1 side is shown, but a configuration in which light is extracted from above by reversing the materials of the upper and lower electrodes and the organic light emitting functional layer is also possible.

  Similarly to the above-described embodiment, the connection portion 5 is formed in the peripheral portion on the substrate 1, and the planarizing layer 20 made of an organic material is partially removed to form the connection portion 5. ing. Then, when removing the planarizing layer 20, an underlayer removal surface 20 </ b> A composed of an upward tapered surface facing the connection portion 5 is formed. The connection portion 5 is entirely covered with the passivation layer 21 including the underlayer removal surface 20A, and the extraction electrode 31 connected to the above-described upper electrode 31C is formed thereon. Also in this embodiment, in the pressure-bonding region where the planarizing layer 20 does not exist, the heat in which the anisotropic conductive film 6 is interposed between the extraction electrode 31 and the electrode 40 of the connection object 4 (for example, TCP (TAB)). Connection by crimping is performed.

  A manufacturing method of such an organic EL display device will be described along the flow of FIG. First, elements such as TFTs 8, color conversion filters, or color filters 9A, 9B, 9C, which are functional elements for active driving or multicolor display, are formed on the substrate 1 (S1).

  The above-described planarization layer 20 is formed on the entire surface of the substrate 1 on which these elements are formed by a coating method such as spin coating. And the area | region which connects the connection object 4 by thermocompression bonding is defined, the connection part 5 which removed the planarization layer 20 according to this thermocompression bonding location is formed (S3), the upper surface and connection part of this planarization layer 20 The passivation layer 21 is formed on the substrate 5 (S4).

  The connecting portion forming step (S3) and the passivation layer forming step (S4) will be described in more detail with reference to FIG. First, as shown in FIG. 4A, the planarization layer 20 is formed on the substrate 1 by the above-described application, and then, as shown in FIG. A resist layer 100 in which an opening 100A is formed at the position is formed on the planarizing layer 20.

  Then, the planarizing layer 20 exposed in the opening 100A is subjected to a development process to remove the planarizing layer in the opening 100A. At this time, as shown in FIG. 5C, the developer enters the inside of the resist layer 100 in the vicinity of the resist layer 100, and a tapered underlayer removal surface 20A is formed. Therefore, it is possible to adjust the inclination angle θ of the tapered surface by controlling the development processing time and the like.

  The setting of the inclination angle θ of the taper surface (underlayer removal surface 20A) is an important factor for obtaining good display performance of the organic EL element. In this embodiment, it is confirmed that the inclination angle θ = 45 ° ± 30 °, that is, the range of 15 ° to 75 ° is effective. This is because when the angle is smaller than 15 °, it is difficult to form the tapered surface itself, and a wide tapered surface is formed around the connection portion and the substrate cannot be effectively used. In this case, the passivation layer and the extraction electrode layer formed on the tapered surface are likely to be divided, and there is a problem that an effective thickness cannot be ensured as the passivation layer and the extraction electrode. Therefore, by setting this inclination angle in the range of θ = 45 ° ± 30 °, there is no problem of the disconnection of the extraction electrode and the deterioration of the display performance of the organic EL element due to the passivation layer division, and a good organic EL display Performance can be secured.

  Thereafter, as shown in FIG. 6D, a passivation layer 21 is formed on the planarization layer 20 and the substrate 1 in the connection portion 5. Further, an organic EL element (3A, 3B or 3C) is formed on the base layer 2 composed of the planarizing layer 20 and the passivation layer 21, and an extraction electrode (30, 31) is formed at the connection portion 5 (S5). ). And in the connection part 5 from which the planarization layer 20 was removed, the thermocompression bonding for connecting the connection object 4 is performed (S6).

  According to the organic EL display device of this embodiment and the manufacturing method thereof, the underlying layer 2 formed on the substrate 1 has a flattened layer 20 made of an organic material at a position corresponding to the thermocompression bonding portion at the time of connection. The connection portion 5 is formed by being removed. The lead electrodes (30, 31) drawn from the organic EL elements (3A, 3B, 3C) are different between the lead electrodes (30, 31) and the electrodes 40 of the connection object 4 at the connection portion 5. Thermocompression bonding with the isotropic conductive film 6 interposed is performed. Therefore, since there is no organic material layer hindering thermocompression bonding in the lower layer of the thermocompression bonding portion, the anisotropic conductive film 6 is sandwiched between the extraction electrode (30, 31) and the electrode 40 of the connection object 4. The pressure is sufficiently applied, and the electrical connection between the extraction electrodes (30, 31) and the electrode 40 can be reliably performed.

  Further, since the underlayer removal surface 20A forms an upward tapered surface, it is possible to form a layer by film formation thereon. Then, by setting the inclination angle of the taper surface in the range of θ = 45 ° ± 30 °, the passivation layer 21 or the extraction electrode 30 formed on the planarizing layer 20 is formed without being divided by this taper surface. The display performance of the favorable organic EL elements (3A, 3B, 3C) can be ensured.

  In addition, in each Example mentioned above, although the example which formed the passivation layer 21 on the connection part 5 is shown, in the connection part 5, the passivation layer 21 is removed in the range which does not expose the planarization layer 20, The surface of the substrate 1 may be exposed.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Underlayer 20 Flattening layer 20A Underlayer removal surface 21 Passivation layer 3 Organic EL element region 3A, 3B, 3C Organic EL element 30A, 31A Electrode 32A, 32B, 32C Organic light emitting functional layer 33, 33A Functional element 30, 31 Extraction electrode 4 Connection object 40 Electrode 5 Connection part 6 Anisotropic conductive film 7 Thermocompression bonding member 8 Thin film transistor (TFT)
9A, 9B, 9C Color conversion filter or color filter 100 Resist layer 100A Opening

Claims (2)

A base layer including at least one layer made of an organic material is formed on a substrate, an organic EL element region for forming an organic EL element on the base layer, and a peripheral portion on the substrate, from the organic EL element In an organic EL display device having a connection portion for electrically connecting a connection target to the extraction electrode of
The underlayer has a flattening layer that fills the unevenness of the thin film transistor, color conversion filter, or color filter provided for each organic EL element formed on the substrate, and a gas barrier passivation layer is formed as the uppermost layer. The organic EL element is formed on the passivation layer,
The connection parts are all covered with the passivation layer, and the extraction electrode is formed thereon,
The extraction electrode is connected to the pixel electrode, and is formed on the passivation layer from the organic EL element region to the connection portion, and an anisotropic conductive film is interposed between the extraction electrode and the connection target by thermocompression bonding. Connected,
The connecting portion removes at least one layer made of an organic material of the flattening layer in accordance with the thermocompression bonding portion at the time of the connection,
2. The organic EL display device according to claim 1, wherein the underlayer removal surface facing the connection portion is an upward tapered surface inclined with respect to the substrate within a range of 45 ° ± 30 °. Forming a base layer including at least one layer made of an organic material on a substrate;
The underlayer has a flattening layer that fills unevenness of a thin film transistor, a color conversion filter, or a color filter provided for each organic EL element formed on a substrate, and is one layer made of at least an organic material of the flattening layer Forming a connecting portion by partially removing
Forming a passivation layer on the upper surface of the planarization layer and the connection part;
Forming an organic EL element on the passivation layer in the organic EL element region on the substrate and forming an extraction electrode on the connection portion in the peripheral portion on the substrate;
In the connecting portion, there is a step of thermocompression bonding these by interposing an anisotropic conductive film between the extraction electrode and the electrode to be connected,
The extraction electrode is connected to the pixel electrode, and is formed on the passivation layer from the organic EL element region to the connection portion,
The method for manufacturing an organic EL display device, wherein the underlayer removal surface facing the connection portion is an upward tapered surface inclined within a range of 45 ° ± 30 ° with respect to the substrate.

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