JP2019109139A - Encoder, driving device, stage device, and robotic device - Google Patents

Abstract

To provide an encoder capable of cooling.SOLUTION: Provided is an encoder comprising: a position detection section for detecting positional information of a moving body; and a thermal dissipation section which includes a vaporized area for changing fluid in a liquid phase to fluid in a vapor phase by external heat, and a condensed area for changing it to the fluid in the liquid phase by discharging the heat of the fluid in the vapor phase to the outside.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an encoder device, a drive device, a stage device, and a robot device.

  The encoder apparatus is used to detect movement information of a moving body, etc. (see, for example, Patent Document 1 below). The encoder device is heated, for example, by heat transmitted from the side of the device on which the encoder device is mounted, or heat generated by the operation of the own device. The encoder device is desired to be coolable, for example to operate stably.

Japanese Patent Laid-Open No. 9-304112

  According to the first aspect of the present invention, the position detection unit for detecting the position information of the moving body, the evaporation region for changing the liquid phase fluid to the gas phase fluid by the external heat, and the heat of the gas phase fluid And a heat dissipating portion including a condensation region for dissipating the heat to the outside to convert it into a liquid phase fluid.

  According to a second aspect of the present invention, there is provided a drive device comprising the encoder device of the first aspect and a drive unit for supplying a drive force to a moving body.

  According to a third aspect of the present invention, there is provided a stage device comprising the drive device of the second aspect and a stage moved by the drive device.

  According to a fourth aspect of the present invention, there is provided a robot apparatus comprising the drive device of the second aspect and an arm moved by the drive device.

It is a figure showing the encoder device concerning a 1st embodiment. It is a figure showing the encoder device concerning a 1st embodiment. It is a figure showing the encoder device concerning a 1st embodiment. It is a figure which shows the encoder apparatus which concerns on 2nd Embodiment. It is a figure which shows the encoder apparatus which concerns on 2nd Embodiment. It is a figure which shows the encoder apparatus which concerns on 2nd Embodiment. It is a figure which shows the encoder apparatus which concerns on 3rd Embodiment. It is a figure which shows the encoder apparatus which concerns on 3rd Embodiment. It is a figure which shows the encoder apparatus which concerns on 3rd Embodiment. It is a figure which shows the encoder apparatus which concerns on 4th Embodiment. It is a figure which shows the encoder apparatus which concerns on 4th Embodiment. It is a figure which shows the encoder apparatus which concerns on 4th Embodiment. It is a figure which shows the encoder apparatus which concerns on 5th Embodiment. It is a figure which shows the encoder apparatus which concerns on 5th Embodiment. It is a figure which shows the encoder apparatus which concerns on 5th Embodiment. It is a figure which shows the encoder apparatus which concerns on 6th Embodiment. It is a figure which shows the encoder apparatus which concerns on 7th Embodiment. It is a figure showing a drive concerning an embodiment. It is a figure showing the stage device concerning an embodiment. It is a figure showing a robot apparatus concerning an embodiment. FIG.

First Embodiment
The first embodiment will be described. 1 to 3 each show an encoder device EC according to the first embodiment. FIG. 1 is a view showing an encoder EC as viewed from the axial direction of a moving object to be detected. 2 is a cross-sectional view taken along line A1-A1 of FIG. FIG. 3 is a cross-sectional view taken along line A2-A2 of FIG. In the cross-sectional views referred to in the following description, hatching may be omitted in order to make the drawing easy to see.

  The encoder device EC according to the embodiment detects position information (movement information) of a moving body (moving member). The encoder device EC includes a rotary encoder or a linear encoder. In the present embodiment, the encoder device EC will be described as a rotary encoder. When the encoder device EC is a rotary encoder, the moving body includes a rotating body SF (a rotating member, a rotating shaft), and the position information includes a rotating position (rotational position information).

  The above rotational position includes one or both of multi-rotation (multi-rotation information) and angular position (angular position information). The multi-rotation includes information representing the number of rotations (eg, 1 rotation, 2 rotations, multi-rotation). The angular position includes information representing an angular position (rotation angle) of less than one rotation. The encoder device EC is, for example, a multi-rotation absolute encoder. In this case, the above-mentioned rotational position includes multi-rotation and angular position. The encoder device EC may detect only one of the multiple rotation and the angular position. For example, the encoder device EC may include an incremental encoder.

  The rotating body SF is, for example, a part of the drive device MTR (see FIG. 2). For example, the drive MTR includes an electric motor, and the rotating body SF includes an output shaft of the drive MTR. The drive device MTR includes a drive unit MD that rotates the rotating body SF. The drive unit MD (main body, motor main body) has a configuration in which a mover and a stator are provided in a body (housing, housing). The mover includes, for example, an armature of an electric motor, and is rotatably supported with respect to the body. The stator includes, for example, a magnet (e.g., a permanent magnet) of an electric motor and is fixed to the body. The mover and the stator move relative to each other. The rotating body SF is the same member as the mover or a member connected to the mover. The rotating body SF rotates relative to the body (stator) by the rotation of the mover.

  In the following description, an XYZ orthogonal coordinate system shown in FIG. In this XYZ orthogonal coordinate system, the Z direction is a direction parallel to the rotation axis AX (rotation center axis) of the rotating body SF. The X direction and the Y direction are directions perpendicular to each other, and each is a direction perpendicular to the Z direction. In each of the X direction, the Y direction, and the Z direction, the side indicated by the arrow is appropriately referred to as the + side (eg, + Z side), and the opposite side is referred to as the − side (eg, -Z side). Further, a direction (rotational axis direction) coaxial with the rotation axis AX is appropriately referred to as an axial direction. In addition, a direction passing through the rotation axis AX and perpendicular to the rotation axis AX is appropriately referred to as a radial direction.

  The encoder device EC in FIG. 2 includes a position detection unit 1 and a heat dissipation unit 2. The position detection unit 1 detects the rotational position (moving position) of the rotating body SF. The position detection unit 1 may increase the temperature, for example, by at least a part of heat transmitted from the outside (e.g., the driving device MTR) and heat generated by its own operation (self-heating). The heat dissipation unit 2 constitutes a heat transfer path (for example, a flow passage) for transferring the heat of the position detection unit 1 to the outside of the encoder device EC.

  The heat dissipation unit 2 can automatically transfer heat from, for example, the high temperature unit (evaporation region) to the low temperature unit (condensing region). The heat dissipation part 2 can perform, for example, the transfer of heat from the high temperature part (evaporation area) to the low temperature part (condensing area) continuously or intermittently (intermittently). The heat dissipation unit 2 is, for example, maintenance free.

  The heat dissipation unit 2 includes, for example, a heat pipe (for example, a thin heat pipe thin in the thickness direction), and the heat conductivity is relatively high among the members connected to the position detection unit 1. The heat dissipation unit 2 includes, for example, a closed-loop heat transfer member utilizing heat generated when the fluid undergoes a phase change in the liquid phase and the gas phase. The heat dissipation unit 2 suppresses, for example, the temperature detection by the position detection unit 1 exceeding a predetermined temperature (for example, the upper limit of the operating temperature range of the position detection unit 1). The connection relationship with each part of the heat dissipation part 2 and other members will be described later.

  The position detection unit 1 includes, for example, an optical encoder, and optically detects the rotational position of the rotating body SF. The position detection unit 1 includes a scale S, a detection unit 3, and a processing unit 4. The scale S is fixed to the rotating body SF and rotates based on the rotation of the rotating body SF. The scale S moves relative to the detection unit 3 by the rotation of the rotating body SF. The detection unit 3 moves relative to the scale S by the rotation of the rotating body SF. The scale S is, for example, a disk-shaped member. The scale S is disposed such that the rotation axis AX passes through the center thereof. The circumferential direction of the scale S corresponds to the rotation direction of the rotating body SF. The scale S has a pattern P, and the pattern P changes in characteristics in the rotation direction of the rotating body SF.

  The detection unit 3 (detection head) optically detects the pattern P of the scale S. The pattern P includes an optical pattern (eg, an incremental pattern, an absolute pattern). The detection unit 3 includes the irradiation unit 5 and the sensor 6. The irradiation unit 5 (light emitting unit, light source unit) irradiates light on the pattern P of the scale S. The irradiation unit 5 includes, for example, a light emitting element (e.g., a solid light source) such as an LED (light emitting diode). The sensor 6 (sensor unit, light receiving unit) detects the light emitted from the irradiation unit 5 and having passed through the pattern P. The sensor 6 includes, for example, a light receiving element (for example, a photoelectric conversion element) such as a photodiode or an imaging element.

  The sensor 6 supplies a signal (detection signal) indicating the detection result of the pattern P to the processing unit 4. Then, the processing unit 4 uses the detection result of the sensor 6 to detect the angular position of the rotating body SF. For example, the processing unit 4 detects the angular position of the first resolution using the result of detecting the light from the absolute pattern. Further, the processing unit detects an angular position of a second resolution higher than the first resolution by performing an interpolation operation on the angular position of the first resolution using a result of detection of light from the incremental pattern.

  The position detection unit 1 detects the rotational position of the rotating body SF, for example, by reading the patterning information of the scale S with the sensor 6. The patterning information of the scale S detected by the position detection unit 1 is, for example, a light and dark pattern based on a transmission pattern (for example, a slit) or a reflection pattern (for example, a reflection film) on the scale S. In the present embodiment, the detection unit 3 is a reflection type detection unit. In this case, the sensor 6 (see FIG. 3) detects the light reflected by the reflective scale S. The detection unit 3 may be a transmission type detection unit. In this case, the sensor 6 detects the light transmitted through the scale S.

  Next, the connection relationship of each part of the encoder device EC according to the present embodiment will be described. In the embodiment, in a state in which the first member is connected to the second member, a state in which the first member is in contact with the second member and is continuous, and the first member and the second member are other than gas And a continuous state through the object of. In embodiments, contact and continuity of two members with one another is referred to as direct contact, as appropriate. Further, in the embodiment, that two members continue through an object other than gas is appropriately referred to as contact indirectly. The state of indirect contact includes, for example, the state in which the first member and the second member are adjacent via the filler.

  In the embodiment, the state in which the first member and the second member are in contact may be a state in which the first member and the second member are in direct contact, or the first member and the second member may be in contact indirectly It may be in the state of Moreover, the connection which can transmit heat between a plurality of members is appropriately referred to as a thermal connection. The thermal connection includes, for example, a connection via a heat transfer path having a relatively high thermal conductivity in the encoder device EC (for example, a connection not via a heat insulating material).

  When the first member and the second member are in direct contact with each other, the object disposed between the first member and the second member may be a member different from either of the first member and the second member. Further, the object disposed between the first member and the second member may be a filler. The filler reduces the air gap between the first and second members. The filler increases the substantial contact area between the first member and the second member. The filler includes, for example, a gel-like object (eg, heat-dissipating gel, resin material) that deforms along the unevenness of the surface of the contact destination. The filler may also include an object (e.g., a cured adhesive) obtained by curing or solidifying a gel-like object. The filler includes, for example, an object having one or both of flexibility and flowability, or an object obtained by curing the object.

  The encoder device EC of FIG. 2 includes a fixing member 11, a seal portion 12, a support member 13, a substrate 14, and a cover portion 15. The fixing member 11 (base member, base plate) is fixed to the drive unit MD of the drive device MTR. The fixing member 11 is thermally connected to the drive unit MD. The fixing member 11 is in direct contact with the drive unit MD. The fixing member 11 is fixed to the drive unit MD by, for example, a screw. The fixing member 11 may contact the drive unit MD indirectly via an object such as an adhesive or grease, for example. The fixing member 11 supports the support member 13.

  The support member 13 is thermally connected to the fixing member 11. The support member 13 contacts the fixing member 11 directly or indirectly. The support member 13 is fixed to the fixing member 11. The support member 13 is provided to surround the scale S. The support member 13 supports the substrate 14. The support member 13 is thermally connected to the substrate 14. The support member 13 is, for example, a mold portion, a spacer portion, or the like. The support member 13 may be made of, for example, a resin, or may be made of an insulating metal at least on the surface (for example, made of anodized aluminum).

  The support member 13 of FIG. 2 includes side portions 13 a arranged in the radial direction with respect to the scale S, and a top plate portion 13 b opposed to the scale S. For example, a cross section perpendicular to the Z direction has a frame shape (for example, an annular shape, a rectangular frame shape) in the side portion 13a. The top plate portion 13 b is provided to close the opening on the + Z side of the side portion 13 a. The top plate 13b has an opening 13c, and the detection unit 3 detects the scale S through the opening 13c. In the top plate portion 13b, the opening 13c may be an air gap, or a transparent member may be disposed in the opening 13c.

  When the top plate portion 13 b is provided, the space around the rotating body SF and the space around the detection unit 3 are partitioned by the top plate portion 13 b. In this case, for example, when foreign matter flows in from the periphery of the rotating body SF, the foreign matter is prevented from reaching the detection unit 3 and adhesion of the foreign matter to the detection unit 3 is suppressed. The support member 13 may not have the shape shown in FIG. 2 and may not have the top plate 13b, for example.

  The substrate 14 includes, for example, a processing substrate such as a printed circuit board. The processing unit 4 is disposed on the substrate 14. For example, at least a portion of a processing circuit (eg, an ASIC, an FPGA), a wire, and a terminal are formed on the substrate 14. An electronic component (for example, an IC chip) including a processing circuit may be mounted on one or both of the support member 13 and the substrate 14. The above processing circuit includes at least a part of the processing unit 4.

  The cover portion 15 is fixed to the fixing member 11. The cover portion 15 forms a space SP (an internal space, a storage space) partitioned from the outside of the encoder device EC. The cover portion 15 of FIG. 2 includes a side portion 15a disposed in the radial direction with respect to the rotating body SF, and a top plate portion 15b disposed in the axial direction with respect to the rotating body SF. The side portion 15a has, for example, a frame shape, and is disposed so as to surround the rotating body SF when viewed from the Z direction. The top plate portion 15 b is disposed to close the opening on the + Z side of the side portion 15 a. The cover 15 may have a shape different from that of FIG. Further, the encoder device EC may not include the cover portion 15.

  The space SP is a space surrounded by the cover portion 15 and the fixing member 11. At least a part of the position detection unit 1 is disposed (e.g., accommodated) in the space SP. In FIG. 2, the position detection unit 1 (irradiation unit 5, sensor 6, processing unit 4) is disposed in the space SP. The support member 13 and the substrate 14 are disposed in the space SP.

  The seal portion 12 includes, for example, a contact seal such as a lip seal or a V-ring. The seal portion 12 contacts the fixed member 11 and the rotating body SF. The seal unit 12 suppresses, for example, the inflow of foreign matter from the drive unit MD to the space SP. Foreign substances include, for example, one or both of an oil such as grease (eg, oil droplets, oil mist) and water (eg, water droplets, water vapor). Also, the foreign matter includes, for example, one or both of a liquid (eg, a droplet) and a gas (eg, a vapor in which the droplet has evaporated).

  The seal portion 12 (see FIG. 1) is provided to annularly surround the rotating body SF. The seal portion 12 is fixed to and supported by the fixing member 11. The seal portion 12 is provided so that the rotary body SF can slide and rotate relative to the seal portion 12 while in contact with the rotary body SF. The seal portion 12 is thermally connected to each of the fixed member 11 and the rotating body SF.

  The heat dissipation unit 2 includes, for example, a heat pipe. The heat radiation part 2 is a structure which enclosed the fluid F1 in the tubular member which has the flow path F (refer FIG. 3) inside. The fluid F1 comprises a substance whose boiling point is in the operating temperature range of the encoder device EC. The fluid F <b> 1 undergoes phase change in the liquid phase and the gas phase inside the flow path F of the heat dissipation unit 2. In the following description, the fluid F1 in the liquid phase is represented by the symbol F1a, and the fluid F1 in the gas phase is represented by the symbol F1b, as appropriate.

  As shown in FIG. 2, the heat dissipation unit 2 stores the fluid F1a (for example, hydraulic fluid, water) in the liquid phase in the flow path F. The heat radiating portion 2 includes an evaporation area 10a and a condensation area 10b. The evaporation region 10a changes the fluid F1a in the liquid phase to the fluid F1b in the gas phase by heat received from the outside. The condensation region 10b releases the heat of the gas phase fluid F1b to the outside to change the gas phase fluid F1b into a liquid phase fluid F1a. The heat radiating portion 2 absorbs heat from the outside in the evaporation area 10a (heat absorption area), and radiates the heat to the outside in the condensation area 10b (heat release area).

  In the heat dissipating part 2, in the heat dissipating part 2 in a region where the temperature is relatively high (e.g., the evaporation region 10a), the fluid F1a in the liquid is changed to the fluid F1b in the gas phase (vaporized) by heat received from the outside . The heat dissipation unit 2 absorbs heat from the outside by latent heat (heat of vaporization, heat of vaporization) when the fluid F1a in the liquid phase changes into a gas phase fluid F1b. The fluid F1b that has been changed to the gas phase flows (flows) in the flow path F, and heat is released to the outside of the heat dissipation unit 2 in a region (for example, the condensation region 10b) in the heat dissipation unit 2 where the temperature is relatively low. It releases (diffuses) and changes (condenses) to liquid phase fluid F1a.

  In FIG. 2, the cover unit 15 is provided to cover the heat radiating unit 2. The heat dissipation unit 2 is accommodated in the space SP. The heat dissipation unit 2 is U-shaped when viewed from the + Y side. The heat dissipation unit 2 of FIG. 2 includes a first end (end on the −Z side) and a second end (end on the + Z side).

  A portion on the first end side (−Z side) in the heat radiating portion 2 includes an evaporation area 10 a. The heat radiating portion 2 is in contact with the fixing member 11 and extends in the X direction, and the end portion on the −X side is bent and extends in the Z direction. The fixing member 11 is connected to the evaporation area 10 a in direct or indirect contact with the heat dissipation unit 2. The evaporation area 10 a includes an area of the heat radiating portion 2 in contact with the fixing member 11. The fixing member 11 is thermally connected to the evaporation area 10a.

  The fixing member 11 is connected to the drive unit MD, and the evaporation region 10 a is connected to the drive unit MD via the fixing member 11. The evaporation region 10a is thermally connected to the drive unit MD. Further, the fixing member 11 is connected to the seal portion 12, and the evaporation region 10 a is thermally connected to the seal portion 12 via the fixing member 11. The fixing member 11 is connected to the substrate 14 via the support member 13, and the evaporation region 10 a is thermally connected to the substrate 14 via the fixing member 11 and the support member 13.

  A portion on the second end side (+ Z side) in the heat radiating portion 2 includes a condensation area 10 b. The heat radiating portion 2 is bent at the end on the + Z side of the portion extending in the Z direction and extends in the X direction. The cover portion 15 is connected to the condensation area 10 b in direct or indirect contact with the heat dissipation portion 2. The condensation area 10 b includes an area of the heat radiating portion 2 in contact with the cover portion 15. The cover 15 is thermally connected to the evaporation area 10a.

  In FIG. 3, in the heat radiating portion 2, the cross-sectional shape of the flow path F is a track shape (elliptical shape), and the flat portion is in contact with the cover portion 15. The cross-sectional shape of the flow path F is circular shape, elliptical shape, polygonal shape, rounded shape of polygonal corner, ring shape (eg, annular shape), frame shape (eg, frame shape), and these shapes Any of two or more may be combined. The heat radiating portion 2 is a pipe type in which the cross sectional shape of the flow path F is circular, the sheet type in which the cross sectional shape of the flow path F is long in one direction (flat type), and the ring type in which the cross sectional shape of the flow path F is ring shaped The cross-sectional shape of the flow path F may be any of polygonal shapes.

  In addition, the heat radiating part 2 does not need to be a shape shown to FIGS. 1-3, for example, may be L-shape, and another shape may be sufficient. Moreover, although the number of the thermal radiation parts 2 is two in FIG. 1 and FIG. 3, one may be sufficient and 3 or more may be sufficient.

  The cover unit 15 of FIG. 2 includes a heat sink 16 (heat radiation block) for releasing the heat received from the heat radiation unit 2 to the outside. The heat sink 16 includes a plurality of fins 17 that form asperities on the surface thereof. The cover 15 may be entirely the heat sink 16 or a part thereof may be the heat sink. For example, the heat sink 16 may include one or both of the side portion 15 a and the top plate portion 15 b of the cover portion 15.

  The plurality of fins 17 in FIG. 2 respectively project from the side portion 15a to the + Z side. The plurality of fins 17 are arranged along the XY plane (see FIG. 1). Each of the plurality of fins 17 has a plate shape in FIG. 2, but may have a rod shape or another shape. The surface area of the heat sink 16 is larger than, for example, the surface area of the heat dissipation unit 2. The above surface area is, for example, an area of a surface (heat radiating surface) in contact with the outside air (for example, atmosphere gas). The plurality of fins 17 are disposed, for example, so as to fit inside the outer shape of the drive unit MD in a rotational axis view (see FIG. 1) viewed from the Z direction. The condensation area 10 b of the heat dissipation portion 2 contacts the side portion 15 a of the heat sink 16 where the fins 17 are disposed.

  As shown in FIG. 1 and FIG. 3, the heat radiating portion 2 is disposed at a position away from the rotating body SF in a direction (eg, Y direction) perpendicular to the rotating body SF so as not to interfere with the rotating body SF. In FIG. 1 and FIG. 3, a plurality of heat dissipation units 2 are provided, and the first side (eg, + Y side) and the second side opposite thereto with respect to the plane (eg, XZ plane) including the rotation axis AX of the rotating body SF. (Eg, on the -Y side). The plurality of heat dissipation units 2 are, for example, disposed symmetrically with respect to the XY plane.

  Next, with reference to FIG. 2, a heat transfer path through which heat in the encoder device EC is transmitted will be described. The drive unit MD emits heat by the power consumed when driving the rotating body SF, for example. When the temperature of the drive unit MD is higher than the temperature of the fixing member 11, the heat of the drive unit MD is transmitted to the fixing member 11. Moreover, the seal part 12 emits heat by friction with the rotating body SF. When the temperature of the seal portion 12 is higher than the temperature of the fixing member 11, the heat of the seal portion 12 is transmitted to the fixing member 11.

  Further, the position detection unit 1 (for example, the detection unit 3 and the processing unit 4) generates heat by the power consumed when detecting the rotational position, for example. When the temperature of the position detection unit 1 is higher than the temperature of the substrate 14, the heat of the position detection unit 1 is transferred to the substrate 14. When the temperature of the substrate 14 is higher than the temperature of the support member 13, the heat of the substrate 14 is transferred to the support member 13. Further, when the temperature of the support member 13 is higher than the temperature of the fixing member 11, the heat of the support member 13 is transmitted to the fixing member 11. Thus, the heat of the position detection unit 1 is transmitted to the fixing member 11 via the substrate 14 and the support member 13.

  Further, when the temperature of the fixing member 11 is higher than the temperature of the evaporation area 10 a of the heat radiation portion 2, the heat of the fixing member 11 is transmitted to the evaporation area 10 a. In the evaporation region 10 a of the heat radiation portion 2, the fluid F 1 a in the liquid phase is phase-changed to a fluid F 1 b in the gas phase by the heat transmitted from the fixing member 11. The heat radiating portion 2 absorbs heat from the fixing member 11 in the evaporation area 10a due to the phase change of the fluid in the evaporation area 10a. The gas phase fluid F1b flows through the flow path F of the heat dissipation part 2, and at least a part of the fluid F1b reaches the condensation region 10b. The gas phase fluid F1b undergoes a phase change to the liquid phase fluid F1a in the condensation region 10b. The heat dissipation unit 2 dissipates heat from the condensation region 10b to the cover portion 15 due to the phase change of the fluid in the condensation region 10b. The cover 15 (for example, the heat sink 16) dissipates heat to, for example, the ambient gas around it.

  In the encoder device, for example, the temperature may increase due to heat transmitted from the outside (e.g., a drive device) or heat generated by the own device (e.g., a position detection unit). The encoder device may, for example, include electronic components such as processing circuitry, and may become unstable when the temperature rises above a predetermined operating temperature range.

  The encoder device EC according to the embodiment includes the heat dissipation unit 2 including the evaporation region 10a and the condensation region 10b, and thus can dissipate heat through the heat dissipation unit 2. The encoder device EC can stably operate, for example, by being cooled to the upper limit or less of the predetermined operating temperature range by the heat dissipation unit 2. Further, the encoder device EC can operate, for example, even when the heat dissipation unit 2 does not have power (eg, power), and can be cooled with a simple configuration.

  For example, when the heat dissipation unit 2 is thermally connected to the drive unit MD, the encoder device EC can dissipate heat transferred from the drive unit MD to the encoder device EC to the outside through the heat dissipation unit 2. The heat generation of the drive unit MD may increase due to an increase in load such as an increase in angular velocity of the rotating body SF. The encoder device EC can reduce the influence on the operation of the encoder device EC due to the operating state of the drive unit MD, for example, by radiating the heat transmitted from the drive unit MD by the heat dissipation unit 2. Therefore, the encoder device EC is applicable to, for example, a high-power drive device. In the encoder device EC, the heat dissipation unit 2 and the drive unit MD do not have to be thermally connected, and also in this case, it is possible to suppress, for example, a temperature rise due to the operation of the own device.

  When the encoder device EC includes the seal unit 12, the foreign matter can be suppressed from flowing from the external drive unit MD into the space SP in which the position detection unit 1 is disposed. In this case, the encoder device EC can suppress the foreign matter from adhering to the position detection unit 1 and can detect the rotational position with high accuracy. When the seal portion 12 contacts the rotating body SF, the air gap around the rotating body SF can be reduced.

  In the case of a contact seal, the seal portion 12 can effectively suppress the inflow of foreign matter into the space SP, but generates heat due to the friction with the rotating body SF. When the seal portion 12 is thermally connected to the heat dissipation portion 2, the heat of the seal portion 12 is effectively dissipated to the outside of the encoder device EC. Note that the encoder device EC may not include the seal portion 12 and, in this case as well, for example, it is possible to suppress a temperature rise due to a portion other than the seal portion 12.

  In the present embodiment, in the encoder device EC, for example, a plurality of parts (for example, the drive unit MD, the position detection unit 1, the seal unit 12) serving as a heat source are thermally connected to the fixing member 11, and the fixing member 11 dissipates heat It is thermally connected to the part 2. In this case, the encoder device EC can collect heat from a plurality of parts, for example, in the fixing member 11 and transfer it to the heat dissipation unit 2, and can be cooled with a simple configuration. The encoder device EC may not include the fixing member 11, and may be cooled, for example, via a heat transfer path not including the fixing member 11.

Second Embodiment
Next, a second embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are given the same reference numerals as appropriate, and the description thereof will be omitted or simplified. 4 to 6 each show an encoder device EC according to the second embodiment. FIG. 4 shows the encoder device EC as viewed from the axial direction. FIG. 5 is a cross-sectional view taken along line A1-A1 of FIG. 6 is a cross-sectional view taken along line A2-A2 of FIG.

  As shown in FIG. 5, the encoder device EC according to the present embodiment differs from that of FIG. 2 in the form of the cover portion 15 and the heat radiating portion 2. The heat radiating portion 2 is U-shaped when viewed from the Y direction. The heat dissipation unit 2 includes a first end (end on the -X side), a second end (end on the + X side), and a central portion between the first end and the second end. The central portion of the heat radiating portion 2 extends in the X direction and is in contact with the fixing member 11. The central portion of the heat radiating portion 2 includes an evaporation region 10a.

  The heat dissipation unit 2 is curved in the center of the heat dissipation unit 2 and extends in the Z direction. A portion on the first end side (−X side) of the heat dissipation portion 2 is in contact with the side portion 15 a of the cover portion 15 and includes an evaporation area 10 a. The portion on the second end side (+ X side) of the heat radiating portion 2 is curved from the central portion of the heat radiating portion 2 and extends in the Z direction. A portion on the second end side (+ X side) of the heat dissipation portion 2 is in contact with the side portion 15 a of the cover portion 15 and includes a condensation area 10 b. The heat dissipation unit 2 (see FIGS. 4 and 6) is provided, for example, on the + Y side and the −Y side with respect to the rotating body SF.

  In the present embodiment, the cover portion 15 (heat sink 16) has a plurality of fins 17, and the plurality of fins 17 are arranged in the radial direction with respect to the rotating body SF. The plurality of fins 17 are disposed on the side portion 15 a of the heat sink 16. The plurality of fins 17 are arranged in the Z direction, and each project in the radial direction with respect to the rotating body SF. For example, the plurality of fins 17 are formed to protrude in the radial direction orthogonal to the axial direction of the rotary body SF on the side surface side of the cover portion 15.

  The evaporation area 10a and the condensation area 10b of the heat dissipation portion 2 are thermally connected to, for example, the side portion 13a in which the plurality of fins 17 are provided in the cover portion 15 (heat sink 16). The plurality of fins 17 are provided, for example, so as not to project radially outward beyond the drive portion MD of the drive device MTR. The plurality of fins 17 (see FIG. 4) are provided, for example, on the + X side, the −X side, the + Y side, and the −Y side with respect to the rotating body SF.

  The encoder device EC according to the present embodiment includes a heat insulating material 21. The cover portion 15 is supported by the drive portion MD of the drive device MTR via the heat insulating material 21. The heat insulating material 21 has a thermal conductivity lower than that of the fixing member 11, for example. The heat insulating material 21 suppresses the transfer of the heat transferred from the heat dissipation unit 2 to the cover unit 15 (heat sink 16) to the drive unit MD.

Third Embodiment
Next, a third embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are given the same reference numerals as appropriate, and the description thereof will be omitted or simplified. FIGS. 7 to 9 each show an encoder device EC according to the third embodiment. FIG. 7 shows the encoder device EC as viewed from the axial direction. FIG. 8 is a cross-sectional view taken along line A1-A1 of FIG. FIG. 9 is a cross-sectional view taken along line A2-A2 of FIG.

  In the present embodiment, the encoder device EC includes a filler 22. As shown in FIG. 8, the heat dissipation unit 2 is disposed adjacent to the substrate 14 via the filler 22. For example, the filler 22 directly contacts the substrate 14 and the processing unit 4 on the -Z side. In addition, the filler 22 directly contacts the heat dissipation portion 2 on the + Z side. The evaporation area 10 a of the heat radiation portion 2 includes an area in contact with the filler 22. The substrate 14 and the processing unit 4 are each thermally connected to the evaporation region 10 a of the heat dissipation unit 2 via the filler 22. The detection unit 3 is thermally connected to the evaporation region 10 a of the heat dissipation unit 2 via the substrate 14 and the filler 22.

  In addition, the support member 13 is thermally connected to the evaporation area 10 a of the heat dissipation unit 2 via the substrate 14 and the filler 22. Further, the fixing member 11 is thermally connected to the heat dissipation unit 2 via the support member 13, the substrate 14, and the filler 22. The seal portion 12 is thermally connected to the heat dissipation portion 2 via the fixing member 11, the support member 13, the substrate 14, and the filler 22. The drive unit MD of the drive device MTR is thermally connected to the heat dissipation unit 2 via the fixing member 11, the support member 13, the substrate 14, and the filling material 22.

  The heat radiation part 2 of FIG. 8 is U-shaped. The heat radiating part 2 is in contact with the filler 22 on the −Z side at the central part (evaporation area 10 a) in the X direction. Further, the end on the + X side and the end on the −X side of the heat radiation portion 2 are respectively bent and extended from the central portion to the −Z side. The end on the + X side and the end on the −X side of the heat dissipation portion 2 are in contact with the side portion 15 a of the heat sink 16 on which the plurality of fins 17 are provided. Each of the end on the + X side and the end on the −X side of the heat radiation portion 2 includes a condensation region 10 b.

  Next, the heat transfer path according to the present embodiment will be described. The heat of the drive portion MD of the drive device MTR and the heat of the seal portion 12 are transmitted to the fixing member 11, respectively. The heat of the fixing member 11 is transferred to the support member 13 and transferred to the substrate 14 via the support member 13. The heat of the processing unit 4 and the heat of the detection unit 3 are transmitted to the substrate 14 respectively. The heat of the substrate 14 is transmitted to the evaporation region 10 a of the heat dissipation unit 2 via the filler 22. The heat of the evaporation area 10 a is transferred to the condensation area 10 b of the heat dissipation part 2 by the phase change and flow of the fluid in the flow path F of the heat dissipation part 2. The heat of the condensation area 10 b is transmitted to the heat sink 16 and is released from the plurality of fins 17 to the outside.

  At least a part of the heat of the processing unit 4 may be transferred to the evaporation region 10 a of the heat dissipation unit 2 through the filler 22. At least a part of the heat of the substrate 14 may be transferred to the evaporation region 10 a of the heat dissipation unit 2 via the processing unit 4 and the filler 22. At least a part of the heat of the detection unit 3 may be transmitted to the evaporation region 10 a of the heat dissipation unit 2 through the substrate 14, the processing unit 4, and the filling material 22. At least a part of the heat of the heat radiating portion 2 may be transmitted to the cover portion 15 from the central portion in the X direction. In this case, the central portion of the heat dissipation portion 2 may include a condensation region on the + Z side portion (region in contact with the cover portion 15).

  In the present embodiment, the position detection unit 1 (for example, the processing unit 4 and the detection unit 3) is disposed closer to the heat dissipation unit 2 than the fixing member 11 in the heat transfer path of the encoder device EC. For example, the encoder device EC can radiate the heat of the position detection unit 1 more preferentially than the fixing member 11, and can suppress the occurrence of an operation failure (e.g., thermal runaway) due to the temperature rise of the position detection unit 1.

Fourth Embodiment
Next, a fourth embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are given the same reference numerals as appropriate, and the description thereof will be omitted or simplified. FIGS. 10 to 12 respectively show an encoder apparatus EC according to the fourth embodiment. FIG. 10 shows the encoder device EC as viewed from the axial direction. 11 is a cross-sectional view taken along line A1-A1 of FIG. 12 is a cross-sectional view taken along line A2-A2 of FIG.

  The heat radiation part 2 which concerns on this embodiment is helical. The number of heat dissipation parts 2 provided in the encoder device EC is, for example, one. As shown in FIG. 11, the heat dissipation unit 2 includes an evaporation area 10 a, a condensation area 10 b, and a connection area 10 c. The connection area 10c (see FIG. 12) bends from the evaporation area 10a to the + Z side and is continuous with the condensation area 10b.

  The evaporation area 10 a is in contact with the fixing member 11. The evaporation region 10a (see FIG. 10) has a shape corresponding to a part of the ring in the circumferential direction when viewed from the Z direction. For example, even when the number of the heat radiating portions 2 is small (for example, one), the heat radiating portion 2 has a surface area (for example, a fixing member) of the evaporation region 10a (for example, a region in contact with the fixing member 11) It is easy to set a large contact area with 11).

  The condensation area 10 b is in contact with the fixing member 11. The condensation area 10b (see FIG. 10) has a shape corresponding to a part of the ring in the circumferential direction when viewed from the Z direction. For example, even if the number of the heat dissipation parts 2 is small (for example, one), such a heat dissipation part 2 has a surface area (for example, a cover part) of the condensation region 10b (for example, a region contacting the cover 15) It is easy to set a large contact area with 15). The connection area 10 c connects the evaporation area 10 a and the condensation area 10 b.

  In the encoder device EC according to the present embodiment, for example, it is easy to set the surface area of the evaporation region 10a large, and efficiently transfer heat from the outside of the heat dissipation unit 2 (eg, the fixing member 11) to the heat dissipation unit 2 Can. Further, in the encoder device EC according to the present embodiment, for example, the surface area of the condensation region 10b can be easily set large, and heat can be efficiently conducted from the heat dissipation unit 2 to the outside (for example, a cover member) .

  In the encoder device EC according to the present embodiment, for example, heat absorption and heat dissipation by the heat dissipation unit 2 can be efficiently performed, and the number of heat dissipation units 2 can be set small. In the encoder device EC, for example, the number of the heat dissipation units 2 can be set small, and it is easy to reduce the number of parts. The number of heat dissipation units 2 provided in the encoder device EC may be two or more.

Fifth Embodiment
Next, a fifth embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are given the same reference numerals as appropriate, and the description thereof will be omitted or simplified. FIGS. 13 to 15 are diagrams showing an encoder device EC according to the fifth embodiment. FIG. 13 shows the encoder device EC as viewed from the axial direction. FIG. 14 is a cross-sectional view taken along line A1-A1 of FIG. FIG. 15 is a cross-sectional view taken along line A2-A2 of FIG.

  As shown in FIG. 14, the heat sink 16 according to the present embodiment is disposed in contact with the fixing member 11. The heat sink 16 includes a plurality of fins 17a, a plurality of fins 17b, and a side portion 17c. The side portion 17 c contacts the fixing member 11 and is thermally connected to the fixing member 11. The plurality of fins 17a are disposed on the side (−X side) opposite to the fixing member 11 with respect to the side portion 17c. The plurality of fins 17 b are disposed on the side (+ X side) opposite to the fixing member 11 with respect to the side portion 17 c. The heat sink 16 is, for example, a member separate from the cover portion 15, but may be the same member as the cover portion 15.

  As shown in FIG. 13, the heat dissipation unit 2 according to the present embodiment includes a heat dissipation unit 2 a and a heat dissipation unit 2 b. Each of the heat radiating part 2a and the heat radiating part 2b is, for example, L-shaped. The heat radiating portion 2a is thermally connected to the fins 17a. The heat radiating portion 2b is thermally connected to the fin 17b. As shown in FIG. 14, the heat radiating portion 2 a and the heat radiating portion 2 b are in contact with the fixing member 11 respectively.

  Next, the heat transfer path according to the present embodiment will be described. The heat of the drive portion MD of the drive device MTR and the heat of the seal portion 12 are transmitted to the fixing member 11, respectively. The heat of the processing unit 4 and the heat of the detection unit 3 are transmitted to the substrate 14 respectively. The heat of the substrate 14 is transmitted to the fixing member 11 via the support member 13. Then, the heat of the fixing member 11 is transmitted to the heat radiating portion 2 or the heat sink 16 and is released from the heat sink 16 to the outside.

  The fixing member 11 according to the present embodiment is disposed closer to the heat releasing unit 2 or the heat sink 16 in the heat transfer path in the encoder device EC than the position detecting unit 1 (for example, the processing unit 4 and the detecting unit 3). In the encoder device EC, for example, transfer of heat of the fixing member 11 to the position detection unit 1 is suppressed, and the occurrence of operation failure (e.g., thermal runaway) due to temperature rise of the position detection unit 1 can be suppressed.

Sixth Embodiment
Next, a sixth embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are given the same reference numerals as appropriate, and the description thereof will be omitted or simplified. FIG. 16 is a view showing an encoder device EC according to the sixth embodiment. The encoder device EC according to the present embodiment includes, for example, a double encoder. The encoder device EC detects the rotational position of the first rotating body SF1 and the rotational position of the second rotating body SF2.

  The drive device MTR includes, for example, a transmission unit 30 such as a reduction gear. The second rotating body SF2 is connected to the first rotating body SF1 via the transmission unit 30 (transmission). For example, the first rotating body SF1 includes an input shaft for inputting torque to the transmission unit 30, and the second rotating body SF2 includes an output shaft for outputting torque from the transmission unit 30. The second rotating body SF2 rotates based on the rotation of the first rotating body SF1. The rotation axis of the second rotation body SF2 is, for example, coaxial with the rotation axis AX of the first rotation body SF1. The first rotating body SF1 includes, for example, a hollow member (for example, a cylindrical member), and the second rotating body SF2 is inserted inside the first rotating body SF1. The drive device MTR may not include the transmission unit 30. Further, the first rotating body SF1 and the second rotating body SF2 may be connected at a gear ratio of 1: 1.

  The encoder device EC includes a first encoder 31, a first substrate 32, a first support member 33, a second encoder 34, a second substrate 35, a second support member 36, a third substrate 43, and a third. The support member 44 is provided. The first encoder 31 (first position detection unit) detects the rotational position of the first rotating body SF1. The second encoder 34 (second position detection unit) detects the rotational position of the second rotating body SF2. In the present embodiment, each of the first encoder 31 and the second encoder 34 includes an optical encoder. One or both of the first encoder 31 and the second encoder 34 may include a magnetic encoder or an encoder of another measurement type (e.g., a capacitive encoder).

  The first encoder 31 includes a first scale S1 and a first detection unit 41. The first detection unit 41 (first detection head) rotates relative to the first scale S1 by the rotation of the first rotating body SF1. For example, the first scale S1 is fixed to the first rotating body SF1, and the first detection unit 41 is fixed to the fixing member 11 via the first substrate 32. The first substrate 32 (for example, the encoder substrate) contacts the first detection unit 41 and supports the first detection unit 41. The first support member 33 is fixed to the drive unit MD of the drive device MTR. The first detection unit 41 detects a first pattern P1 provided on the first scale S1. The first detection unit 41 outputs a first detection signal to the processing unit 4 as the detection result.

  When the first encoder 31 is an optical encoder, the first pattern P1 includes an optical pattern, and the first detection unit 41 includes a light receiving sensor that detects light from the first pattern P1. When the first encoder 31 is a magnetic encoder, the first pattern P1 includes a magnetic pattern (eg, a magnet having a plurality of magnetic poles), and the first detection unit 41 detects the magnetic field formed by the first pattern P1. Includes a sensor.

  The second encoder 34 includes a second scale S2 and a second detection unit 42. The second detection unit 42 (second detection head) rotates relative to the second scale S2 by the rotation of the second rotating body SF2. For example, the second scale S2 is fixed to the second rotating body SF2, and the second detection unit 42 is fixed to the fixing member 11 via the second substrate 35. The second substrate 35 (eg, an encoder substrate) contacts the second detection unit 42 and supports the second detection unit 42. The second support member 36 is fixed to the drive unit MD of the drive device MTR. The second detection unit 42 detects a second pattern P2 provided on the second scale S2. The second detection unit 42 outputs a second detection signal to the processing unit 4 as the detection result.

  When the second encoder 34 is an optical encoder, the second pattern P2 includes an optical pattern, and the second detection unit 42 includes a light receiving sensor that detects light from the second pattern P2. When the second encoder 34 is a magnetic encoder, the second pattern P2 includes a magnetic pattern (eg, a magnet having a plurality of magnetic poles), and the second detection unit 42 detects the magnetic field formed by the second pattern P2 Includes a sensor.

  The processing unit 4 processes the detection result of the first detection unit 41 and the detection result of the second detection unit 42. The processing unit 4 includes a first processing unit 4a, a second processing unit 4b, and a third processing unit 4c. The first processing unit 4a detects (calculates) the rotational position of the first rotating body SF1 based on the detection result (first detection signal) of the first detection unit 41 (performs calculation processing of rotational position) To do). The first processing unit 4 a is provided, for example, on the first substrate 32. In the following description, the rotational position calculated based on the first detection signal is appropriately referred to as a first rotational position.

  The second processing unit 4b detects (calculates) the rotational position of the second rotating body SF2 based on the detection result (second detection signal) of the second detection unit 42 (performs calculation processing of the rotational position) To do). The second processing unit 4 b is provided, for example, on the second substrate 35. In the following description, the rotational position calculated based on the second detection signal is appropriately referred to as a second rotational position.

  The third processing unit 4c (comparison unit, combining unit) compares the information obtained from the detection result of the first detection unit 41 with the information obtained from the detection result of the second detection unit 42. Run. The third processing unit 4c is provided, for example, on a third substrate 43 (for example, a driver substrate). For example, the third support member 44 is fixed to the second substrate 35. The third support member 44 supports the third substrate 43. The third substrate 43 may be supported by the second support member 36 (described later with reference to FIG. 17).

  The third processing unit 4 c detects (e.g., calculates) multiple rotations of the first rotating body SF <b> 1 by the above comparison processing, for example. Here, it is assumed that the first processing unit 4a calculates the angular position of the first rotating body SF1 as the first rotational position based on the first detection signal. In addition, the second processing unit 4b calculates the angular position of the second rotating body SF2 as the second rotational position based on the second detection signal.

  When the third processing unit 4c calculates multiple rotations of the first rotating body SF1, the third processing unit 4c is obtained from the transmission ratio of the first rotating body SF1 and the second rotating body SF2, and from the second detection unit 42. The angular position of the first rotary body SF1 is estimated based on the angular position of the second rotary body SF2. In the following description, “a transmission ratio of the first rotating body SF1 to the second rotating body SF2” will be referred to as “a transmission ratio” as appropriate. The third processing unit 4c calculates an angular position (e.g., an estimated value) of the first rotary body SF1 calculated based on the transmission gear ratio and the angular position of the second rotary body SF2, and the first detection unit 41. The multi-rotation of the first rotating body SF1 is calculated by comparing with the angular position (for example, measured value) of the first rotating body SF1 obtained from the above.

  For example, it is assumed that the transmission gear ratio (for example, the reduction gear ratio) is 1000, and the angular position (for example, the rotation angle) of the second rotating body SF2 is 1 °. In this case, the angular position of the first rotary body SF1 calculated from the transmission gear ratio and the angular position of the second rotary body SF2 is 1000 °. When the angular position of the first rotating body SF1 obtained from the first detection unit 41 is 279 °, (1000−279) / 360 = 721/360 is approximately 2. The multiple rotations of the first rotating body SF1 are calculated as two rotations by rounding the value of 721/360 or the like. The third processing unit 4c calculates the multi-rotation (for example, 2 rotations) of the first rotating body SF1 and the angular position (for example, 279 °) of the first rotating body SF1 obtained from the first detection unit 41. And the rotation position (for example, 2 rotations, 279 °, 999 °) of the first rotation body SF1 is detected (for example, calculated, generated).

  Note that the third processing unit 4c does not have to calculate multiple rotations of the first rotating body SF1. For example, the third processing unit 4c may execute an error detection process of detecting an error in the detection process by the first encoder 31 or the detection process by the second encoder 34 by the above-described comparison process. In this case, for example, the first processing unit 4a calculates the first rotational position including the angular position and the multiple rotation of the first rotating body SF1. Further, the second processing unit 4b calculates a second rotational position including the angular position and the multiple rotation of the second rotating body SF2.

  In the error detection process described above, the third processing unit 4c calculates the rotational position (multi-rotation and angular position) of the first rotating body SF1 based on the second rotational position and the transmission ratio. The third processing unit 4c calculates an estimated value of the rotational position of the first rotating body SF1 (estimates the rotational position) based on the second rotational position and the gear ratio. The third processing unit 4 c is configured to calculate the calculated rotational position of the first rotary body SF 1 (the rotational position of the first rotary body SF 1 obtained from the second rotational position) and the first rotational position obtained from the first detection unit 41. And the rotational position (for example, the first rotational position) of the rotating body SF1.

  For example, the third processing unit 4c generates an error when the difference between the first rotational position and the rotational position of the first rotating body SF1 calculated from the second rotational position is equal to or greater than a preset threshold. It is determined that The third processing unit 4c may output the processing result of the error detection processing to an external device (for example, a control unit of the subsequent driving device MTR) of the encoder device EC. If the third processing unit 4c determines that an error is detected, the third processing unit 4c may output notification information (eg, a notification signal, an error signal, an alarm signal) for giving notification of the occurrence of an error. The control unit of the drive device MTR (see FIG. 1) may control the drive unit (motor main unit) based on the notification information output from the third processing unit 4c.

  The first processing unit 4 a may be provided on the second substrate 35 or the third substrate 43. For example, the first processing unit 4a may be provided in the same electronic component (for example, an IC chip) as the second processing unit 4b, and this electronic component may be mounted on the second substrate 35. In addition, the first processing unit 4 a may be provided in the same electronic component (for example, an IC chip) as the third processing unit 4 c and the electronic component may be mounted on the third substrate 43.

  The second processing unit 4 b may be provided on the first substrate 32 or the third substrate 43. For example, the second processing unit 4 b may be provided on the same electronic component (for example, an IC chip) as the first processing unit 4 a, and this electronic component may be mounted on the first substrate 32. In addition, the second processing unit 4 a may be provided in the same electronic component (for example, an IC chip) as the third processing unit 4 c and the electronic component may be mounted on the third substrate 43.

  The third processing unit 4 c may be provided on the first substrate 32 or the second substrate 35. For example, the third processing unit 4c may be provided in the same electronic component (for example, an IC chip) as the first processing unit 4a, and this electronic component may be mounted on the first substrate 32. In addition, the third processing unit 4 c may be provided on the same electronic component (for example, an IC chip) as the second processing unit 4 b, and this electronic component may be mounted on the second substrate 35. When the third processing unit 4c is provided on the first substrate 32 or the second substrate 35, the third substrate 43 and the third support unit 44 may not be provided. In addition, the first processing unit 4a, the second processing unit 4b, and the third processing unit 4c are provided in the same electronic component (for example, an IC chip), and the electronic component corresponds to the first substrate 32, the The second substrate 35 or the third substrate 43 may be disposed.

  The heat dissipation unit 2 according to the present embodiment includes a heat dissipation unit 2a and a heat dissipation unit 2b. The heat radiating portion 2 a is in contact with the first substrate 32 and in contact with the cover portion 15 (heat sink 16). The heat radiating portion 2 a thermally connects the first substrate 32 and the heat sink 16. The first detection unit 41 is thermally connected to the heat sink 16 via the first substrate 32 and the heat dissipation unit 2a. The drive unit MD of the drive device MTR is thermally connected to the heat sink 16 via the first support member 33 and the first substrate 32.

  The heat radiating portion 2b is in contact with the second substrate 35 and in contact with the cover portion 15 (heat sink 16). The heat radiating portion 2 b thermally connects the second substrate 35 and the heat sink 16. The second detection unit 42 and the processing unit 4 are thermally connected to the heat sink 16 via the second substrate 35 and the heat dissipation unit 2b, respectively. The drive portion MD of the drive device MTR is thermally connected to the heat sink 16 via the second support member 36 and the second substrate 35.

  Next, the heat transfer path according to the present embodiment will be described. The heat of the first detection unit 41 is transmitted to the heat sink 16 via the first substrate 32 and the heat dissipation unit 2a, and is released from the heat sink 16 to the outside. The heat of the second detection unit 42 and the heat of the processing unit 4 are transmitted to the heat sink 16 through the second substrate 35 and the heat dissipation unit 2 b, respectively, and released from the heat sink 16 to the outside. The heat of the drive unit MD is transmitted to the heat sink 16 through the first support member 33, the first substrate 32, and the heat dissipation unit 2a, and is released from the heat sink 16 to the outside. Further, the heat of the drive unit MD is transmitted to the heat sink 16 through the second support member 36, the second substrate 35, and the heat dissipation unit 2b, and is released from the heat sink 16 to the outside.

  The filler 22 shown in FIG. 8 may be provided between the first substrate 32 and the second substrate 35. For example, at least a portion of the heat of the first substrate 32 is transmitted to the second substrate 35 via the filler 22 and is released from the second substrate 35 to the outside via the heat dissipation portion 2 b and the heat sink 16. It is also good. In this case, the heat dissipation unit 2a may not be provided. In addition, the first substrate 32 may be supported by the second support member 36 in contact with the second support member 36. For example, at least a portion of the heat of the first substrate 32 is transmitted to the second substrate 35 via the second support member 36, and the heat is transmitted from the second substrate 35 to the outside through the heat dissipation portion 2 b and the heat sink 16. It may be released. In this case, the first support member 33 may not be provided.

  Also, the filler 22 shown in FIG. 8 may be provided between the second substrate 35 and the heat sink 16. For example, the heat of the second substrate 35 may be at least partially transferred to the heat sink 16 via the filler 22 and released to the outside via the heat sink 16. In this case, the heat dissipation unit 2b may not be provided. Further, one or both of the first support member 33 and the second support member 36 may be fixed to the drive unit MD via the fixing member 11 shown in FIG. The fixing member 11 may be provided with the seal portion 12 shown in FIG. Further, the processing unit 4 may be disposed on the first substrate 32. Further, a part of the processing unit 4 may be disposed on the first substrate 32, and a part of the processing unit 4 may be disposed on the second substrate 35.

Seventh Embodiment
Next, a seventh embodiment will be described. In the present embodiment, the same components as those in the above-described embodiment are given the same reference numerals as appropriate, and the description thereof will be omitted or simplified. FIG. 17 is a view showing an encoder device EC according to a seventh embodiment. In the present embodiment, the fixing member 11 includes a heat sink 16. The heat sink 16 may be a part of the fixing member 11 or all of the fixing member 11. The heat sink 16 contacts the drive unit MD of the drive device MTR and is fixed to the drive unit MD.

  In FIG. 17, the first support member 33 and the second support member 36 are respectively fixed to the heat sink 16. The second support member 36 penetrates the second substrate 35. The second support member 36 extends more to the + Z side than the second substrate 35. The third substrate 43 is fixed to the second support member 36 on the + Z side of the second substrate 35. The third substrate 43 may be supported by a member (eg, a third support member 44) different from the second support member 36, as shown in FIG.

  The heat radiating portion 2 a is in contact with the surface on the −Z side of the first substrate 32. The heat dissipation unit 2 a extends from the first substrate 32 to the −Z side and contacts the heat sink 16. The first support member 33 contacts the heat sink 16 and is fixed to the heat sink 16. The heat radiating portion 2 b is in contact with the −Z side surface of the second substrate 35. The heat radiating portion 2 b extends from the second substrate 35 to the −Z side and contacts the heat sink 16. The second support member 36 contacts the heat sink 16 and is fixed to the heat sink 16.

  The heat sink 16 may be provided separately from the fixing member 11. For example, the fixing member 11 may be provided between the heat sink 16 and the drive unit MD. In addition, the fixing member 11 may be provided in contact with the heat sink 16 on the opposite side of the heat sink 16 to the drive unit MD. In this case, one or both of the first support member 33 and the second support member 36 may be fixed to the fixing member 11. Moreover, although the encoder apparatus EC of FIG. 17 is not provided with the cover part 15 (refer FIG. 2), you may be provided with the cover part 15 demonstrated by the above-mentioned embodiment.

[Drive]
Next, the drive device according to the embodiment will be described. FIG. 18 is a diagram showing a drive device MTR according to the embodiment. In the following description, the same or equivalent components as or to those of the embodiment described above are designated by the same reference numerals and their description will be omitted or simplified. Drive device MTR is a motor device including an electric motor. The driving device MTR includes a moving body (for example, the rotating body SF), a driving unit MD for driving (for example, rotational driving) the moving body, a control unit MC for controlling the driving unit MD, and movement information for the moving body (for example , Encoder (EC) for detecting position information (rotational position).

  The rotating body SF has a load side end SFa and a non-load side end SFb. The load end SFa is connected to another power transmission mechanism such as a reduction gear. The scale S is fixed to the non-load side end portion SFb. The encoder device EC detects the rotational position of the rotating body SF, and outputs the detection result to the control unit MC. The control unit MC controls the drive unit MD based on the rotational position output from the encoder device EC. For example, the control unit MC controls the drive unit MD such that the rotational position of the rotating body SF approaches a target value. The encoder device EC according to the embodiment can be cooled, for example, to operate stably, and the drive device MTR provided with the encoder device EC can be operated, for example, stably.

  The drive device MTR is not limited to the motor device, and may be another drive device having a shaft portion that rotates using oil pressure or air pressure. Also, the drive device MTR may include a linear motor. The encoder device EC may include a linear encoder.

[Stage device]
Next, a stage apparatus according to the embodiment will be described. FIG. 19 is a view showing a stage apparatus according to the embodiment. In the following description, the same or equivalent components as or to those of the embodiment described above are designated by the same reference numerals and their description will be omitted or simplified.

  The stage apparatus STG has a configuration in which a stage ST (moving body, rotating body, rotating table) is attached to the load side end SFa of the rotating body SF of the driving device MTR shown in FIG. The stage device STG drives the drive device MTR to rotate the rotating body SF. This rotation is transmitted to the stage ST, and at this time, the encoder device EC detects the angular position or the like of the rotating body SF. The angular position of the stage ST can be detected by using the output from the encoder device EC.

  The encoder device EC according to the embodiment can be cooled, for example, to operate stably, and the stage device STG provided with the encoder device EC (drive device MTR) can be operated, for example, stably. A speed reducer or the like may be disposed between the load side end portion SFa of the drive device MTR and the stage ST.

  The stage apparatus STG can be applied to, for example, an X stage, an XY stage, or an XYZ stage. For example, the driving device MTR may be a linear motor, and the stage device STG may be a device that moves the stage linearly. The stage device STG may be a device that linearly moves the stage in one direction by a one-dimensional linear motor. In addition, the stage device STG may be a device that moves the stage in two directions by a plurality of one-dimensional linear motors or two-dimensional linear motors (for example, planar motors). In addition, the driving device MTR may be a rotary motor, and the stage device STG may be a device that converts the rotational motion of the driving device MTR into linear motion and moves the stage linearly. Further, the stage device STG can be applied to, for example, a rotary table or the like provided in a machine tool such as a lathe.

[Robot equipment]
Next, a robot apparatus according to the embodiment will be described. FIG. 20 is a view showing a robot apparatus according to the embodiment. Note that FIG. 20 schematically shows a part (joint part) of the robot apparatus RBT. In the following description, the same or equivalent components as or to those of the embodiment described above are designated by the same reference numerals and their description will be omitted or simplified. The robot apparatus RBT has a first arm AR1, a second arm AR2, and a joint JT. The first arm AR1 is connected to the second arm AR2 through the joint JT.

  The first arm AR1 includes an arm portion 101, a bearing 101a, and a bearing 101b. The second arm AR2 has an arm portion 102 and a connection portion 102a. The connection portion 102 a is disposed between the bearing 101 a and the bearing 101 b at the joint portion JT. The connection portion 102 a is provided integrally with the rotating body SF. The rotating body SF is inserted into both the bearing 101a and the bearing 101b at the joint JT. The end of the rotating body SF on the side inserted into the bearing 101 b penetrates the bearing 101 b and is connected to the reduction gear RG.

  The reduction gear RG is connected to the drive device MTR, decelerates the rotation of the drive device MTR by, for example, 1/100 and transmits it to the rotating body SF. The load side end portion SFa of the rotating body SF of the drive device MTR is connected to the reduction gear RG. The scale S of the encoder device EC is attached to the non-load side end portion SFb of the rotating body SF of the drive device MTR.

  When the robot apparatus RBT drives the drive device MTR to rotate the rotating body SF, this rotation is transmitted to the rotating body SF via the reduction gear RG. The connection portion 102a is integrally rotated by the rotation of the rotary body SF, whereby the second arm AR2 is rotated with respect to the first arm AR1. At this time, the encoder device EC detects an angular position or the like of the rotating body SF. Therefore, the angular position of the second arm AR2 can be detected by using the output from the encoder device EC. The encoder device EC according to the embodiment can be cooled, for example, to operate stably, and the robot device RBT provided with the encoder device EC (drive device MTR) can operate stably. The robot apparatus RBT is not limited to the above configuration, and the drive apparatus MTR can be applied to various robot apparatuses provided with joints.

  The technical scope of the present invention is not limited to the aspect described in the above-described embodiment and the like. One or more of the requirements described in the above embodiments and the like may be omitted. Further, the requirements described in the above-described embodiment and the like can be combined as appropriate. In addition, the disclosures of all the documents cited in the above-described embodiments and the like are incorporated as part of the description of the text as far as the laws and regulations permit.

DESCRIPTION OF SYMBOLS 1 ... position detection part, 2, 2a, 2b ... thermal radiation part, 4 ... processing part, 10a ... evaporation area, 10b ... condensation area, 11 ... fixing member, 12 ... · Seal portion, 13 · · · Support member, 14 · · · Substrate · · · 15 cover portion, · · · · · · · · · · · · · · · · · · · · · · · · · · filling material, 31 · · · the first encoder (the first position detection Part), 32 ... first substrate, 33 ... first support member, 34 ... second encoder (second position detection unit) 35 ... second substrate 36 Second support member 43 Third substrate 44 Third support member AX Rotational axis EC Encoder device F Flow path F1・ Fluid, F1a: liquid phase fluid, F1b: gas phase fluid, L: light, MTR: driving device, RBT, robot device, S · · Scale, S1 · · · first scale, S2 · · · second scale, SF · · · rotating body, SF1 · · · first rotating body, SF2 · · · second rotating body, ST ... Stage, STG ... Stage device

Claims (16)

A position detection unit that detects position information of the moving object;
An evaporation region that converts liquid phase fluid to gas phase fluid by external heat, and a condensation region that discharges the heat of the gas phase fluid to the outside to convert the gas phase liquid to a liquid phase fluid; A heat dissipation unit including
An encoder device comprising: The heat dissipation unit has a sealed flow path,
The fluid in the liquid phase is contained in the flow path,
The encoder device according to claim 1. A cover portion covering the heat dissipation portion;
The cover portion is connected to a condensation area of the heat dissipation portion.
The encoder apparatus of Claim 1 or Claim 2. The cover portion includes a heat sink for releasing the heat received from the heat dissipation portion to the outside.
The encoder device according to claim 3. The encoder device according to claim 3, wherein the cover portion is disposed in contact with the heat dissipation portion or adjacent to the heat dissipation portion via a filler. The position detection unit includes a sensor that detects the moving body, and a processing unit that processes a detection result of the sensor.
A substrate on which the processing unit is disposed;
And a support member for supporting the substrate.
The encoder device according to any one of claims 1 to 5. And a fixing member connected to the evaporation region of the heat dissipation unit and supporting the support member.
The encoder device according to claim 6. The heat dissipation unit is connected to a drive unit that drives the movable body via the fixing member.
The encoder device according to claim 7. And a seal unit in contact with the fixed member and the movable body.
An encoder device according to claim 7 or 8. The heat dissipating portion is disposed in contact with the fixing member or adjacent to the fixing member via a filler.
The encoder device according to any one of claims 7 to 9. The evaporation region of the heat dissipation unit is connected to the substrate,
The encoder device according to claim 6. The heat dissipating unit is disposed in contact with the substrate or adjacent to the substrate via a filler.
The encoder device according to claim 11. The filler deforms along the irregularities on the surface of the contact,
The encoder apparatus according to claim 5, claim 10, or claim 12. An encoder device according to any one of claims 1 to 13;
A driving unit for supplying a driving force to the moving body. A driving device according to claim 14;
A stage which is moved by the driving device. A driving device according to claim 14;
A robot which is moved by the driving device.

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