JP2019106532A - Electrostatic chuck device, mask attaching device, film-forming apparatus, film-forming method, and method for manufacturing electronic device - Google Patents

Abstract

To provide: an electrostatic chuck device having a structure where power can be supplied to an electrostatic chuck while an effect on uniformity of magnetic force applied by magnetic force applying means is reduced, in a film-forming device having a structure where a substrate is held using the electrostatic chuck and the substrate is brought into close contact with a mask using the magnetic force applying means; a mask attaching device; a film-forming device including them; a film-forming method using them; and a method for manufacturing an electronic device.SOLUTION: An electrostatic chuck device includes: an electrostatic chuck plate part including a first surface facing magnetic force applying means for attaching a mask onto a film forming surface of a substrate by a magnetic force from a magnetic force generating part, and a second surface opposite to the first surface and holding a surface opposite to the film forming surface of the substrate; and a power supply terminal part for supplying power to the electrostatic chuck plate part. The power supply terminal part is installed outside a region where the magnetic force generating part of the magnetic force applying means is disposed.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a film forming apparatus and a film forming method, and more specifically, in the film forming apparatus, a structure of a feed terminal unit for supplying a voltage to an electrostatic chuck plate unit that holds a substrate by electrostatic attraction. It is about

  Recently, an organic EL display device has been in the limelight as a flat panel display device. The organic EL display device is a self-luminous display, and its characteristics such as response speed, viewing angle and thinning are superior to those of liquid crystal panel displays, and existing liquid crystal panel displays such as monitors, televisions and various portable terminals represented by smartphones. Substitute at a high speed. In addition, the field of application is being expanded to displays for automobiles and the like.

  The element of the organic EL display device has a basic structure in which an organic substance layer which emits light is formed between two facing electrodes (a cathode electrode and an anode electrode). The organic layer and the electrode metal layer of the organic EL display device are manufactured by depositing a deposition material on a substrate through a mask on which a pixel pattern is formed in a vacuum chamber.

  In such a deposition process, in order to transfer the pixel pattern on the mask to the substrate with high precision, the relative position between the mask and the substrate is precisely adjusted before deposition on the substrate, and the mask is used as a substrate It must be in close contact with the film formation surface of

  In order to bring the mask into close contact with the film formation surface of the substrate, a magnetic plate is used to apply a magnetic force from the upper portion of the substrate to the metal mask on the lower portion of the substrate. That is, in the prior art, the metal plate is made of metal by the magnet of the magnet plate by bringing the magnet plate into contact with the upper surface of the substrate with the substrate whose relative position is adjusted (aligned) placed on the upper surface of the mask. The substrate and the mask are brought into close contact through the magnetic force applied to the mask.

  Recently, in order to prevent bending of the substrate due to its own weight, a method of holding the upper surface of the substrate by electrostatic attraction of an electrostatic chuck has been considered. The electrostatic chuck is disposed above the upper surface of the substrate in the vertical direction because the upper surface of the substrate is attracted by electrostatic attraction.

  Therefore, in a film forming apparatus having a structure in which a substrate is held using an electrostatic chuck and such a substrate and a mask are in close contact with a magnet plate, the electrostatic chuck holds the substrate below the magnet plate. In the prior art, in order to supply power to the electrostatic chuck disposed in the lower part of the magnet plate, the feed line from the outside of the film forming apparatus penetrates the magnet plate and the electrostatic chuck disposed in the lower part of the magnet plate Installed to reach.

  That is, as shown in FIG. 7, in the region of the magnet plate 724 where the magnets 725 are disposed, the power supply terminals 731 for supplying power to the electrostatic chuck 723 besides the magnets 725 are installed. As a result, in the region of the magnet plate 724 where the magnets 725 are arranged, there is a local region where the feed terminals 731 are arranged together and the magnets 725 are not arranged.

As a result, around the local region where the magnet 725 is not disposed, the magnetic force weakens, the magnetic force to the mask becomes nonuniform over the entire region where the magnet 725 of the magnet plate 724 is disposed, and the adhesion between the substrate and the mask decreases. As a result, the film forming accuracy also decreases.

  According to the present invention, in a film forming apparatus having a structure in which the substrate is held using an electrostatic chuck and the substrate and the mask are closely adhered using a magnetic force application unit, the influence of the magnetic force application unit on the uniformity of the magnetic force is reduced. An electrostatic chuck apparatus having a structure capable of supplying power to an electrostatic chuck, a mask mounting apparatus, a film forming apparatus including these, a film forming method using these, and a method of manufacturing an electronic device Do.

  In the electrostatic chuck device according to the first aspect of the present invention, a first surface facing a magnetic force application means for causing a mask to adhere to a film formation surface of a substrate by a magnetic force from a magnetic force generation unit; An electrostatic chuck plate portion including a second surface opposite to the first surface for holding the surface opposite to the film formation surface of the substrate, and power is supplied to the electrostatic chuck plate portion And a feed terminal portion to be provided, wherein the feed terminal portion is provided outside a region where the magnetic force generating portion of the magnetic force application means is disposed.

  A mask mounting apparatus according to a second aspect of the present invention includes an electrostatic chuck plate portion for holding a surface opposite to a film formation surface of a substrate, and a power supply terminal portion for supplying power to the electrostatic chuck plate portion. And a magnetic force application unit for attaching a mask to the film formation surface of the substrate by the magnetic force from the magnetic force generation unit, and the electrostatic chuck plate unit includes the magnetic force application unit. The feed terminal includes a first surface facing the second surface and a second surface opposite to the first surface for holding the surface opposite to the film formation surface of the substrate. The part is provided outside the area where the magnetic force generation part of the magnetic force application means is disposed.

The film deposition apparatus according to the third aspect of the present invention includes the mask attachment apparatus according to the second aspect of the present invention.
A film forming apparatus according to a fourth aspect of the present invention comprises: a magnetic force applying unit for applying a magnetic force to a mask; an electrostatic chuck plate unit disposed below the magnetic force applying unit; and holding the substrate; And a feed line portion for supplying power to the electric chuck plate portion, wherein the magnetic force application means includes a plurality of magnetic force generation portions for generating a magnetic force, and the feed line portion is a portion of the magnetic force application means. It does not penetrate the area in which the plurality of magnetic force generation units are disposed.

  The film forming method according to the fifth aspect of the present invention comprises the steps of: carrying a mask into the film forming apparatus and placing the mask on the mask table; carrying the substrate into the film forming apparatus; Placing the substrate on the substrate support table by the electrostatic chuck device according to the first aspect of the present invention; placing the substrate held by the electrostatic chuck device on the mask Attaching the mask and the substrate on the mask by means of magnetic force application means including a magnetic force generating part, and depositing the vapor deposition material evaporated from the evaporation source on the substrate through the mask And.

  A method of manufacturing an electronic device according to a sixth aspect of the present invention manufactures an electronic device using the film forming method according to the fifth aspect of the present invention.

According to the present invention, the feed line or the feed terminal for supplying power to the electrostatic chuck plate by providing the feed terminal of the electrostatic chuck device outside the region where the magnetic force generator of the magnetic force application means is disposed. The part does not penetrate the arrangement area of the magnetic force generation part of the magnetic force application means, and the arrangement area of the magnetic force generation part of the magnetic force application means can be avoided. As a result, there is no part where the magnetic force generation part is not locally arranged due to the penetration of the feed line or the feed terminal part in the area where the magnetic force generation part of the magnetic force application means is arranged. Unevenness can be prevented. As a result, the magnetic field that attracts the mask by the magnetic force application unit becomes uniform, and the contact accuracy between the mask and the substrate is improved.

FIG. 1 is a schematic view of a part of a manufacturing line of an organic EL display device. FIG. 2 is a schematic view of a film forming apparatus according to the present embodiment. FIG. 3 is a schematic view showing a mask mounting apparatus including the electrostatic chuck apparatus according to the present embodiment. FIG. 4 is a schematic view showing a mask mounting apparatus including an electrostatic chuck apparatus according to another embodiment of the present invention. FIG. 5 is a schematic view showing the planar structure of the electrostatic chuck device of the present embodiment and the arrangement of the support portion of the substrate support. FIG. 6 is a schematic view showing an example of an electronic device manufactured using the film forming method according to the present embodiment. FIG. 7 is a schematic view showing the structure of a conventional electrostatic chuck and a magnet plate.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. However, the following examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. In the following description, the hardware configuration and software configuration of the device, the process flow, the manufacturing conditions, the dimensions, the materials, the shape, etc. limit the scope of the present invention to only those unless otherwise specified. It is not for the purpose.

  The present invention can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern on a surface of a substrate by vacuum deposition. As a material of the substrate, any material such as glass, film of polymer material, metal and the like can be selected, and as a vapor deposition material, any material such as organic material and metallic material (metal, metal oxide, etc.) The material of the can be selected. Specifically, the technology of the present invention is applicable to manufacturing apparatuses such as organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members and the like. Among them, the manufacturing apparatus of the organic EL display device is desired to further improve the alignment accuracy and the adhesion accuracy of the substrate and the mask by increasing the size of the substrate or increasing the precision of the display panel. It is one of the application examples.

<Electronic Device Production Line>
FIG. 1 is a top view schematically showing a part of a configuration of a manufacturing line of an electronic device. The manufacturing line of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm × about 1500 mm, the substrate is diced to produce a plurality of small size panels.

  Generally, as shown in FIG. 1, a production line of an electronic device has a plurality of film forming chambers 11 and 12 and a transfer chamber 13. In the transfer chamber 13, a transfer robot 14 for holding and transferring the substrate 10 is provided. The transfer robot 14 is, for example, a robot having a structure in which a robot hand holding the substrate 10 is attached to an articulated arm, and carries the substrate 10 into and out of each film forming chamber.

A film forming apparatus (also referred to as a vapor deposition apparatus) is provided in each of the film forming chambers 11 and 12. A series of film forming processes such as delivery of the substrate 10 with the transport robot 14, adjustment (alignment) of the relative position between the substrate 10 and the mask, fixing of the substrate 10 on the mask, film formation (deposition) It is done automatically.

  Hereinafter, the configuration of the film forming apparatus in the film forming chamber will be described.

<Deposition apparatus>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus 2. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. Assuming that the substrate 10 is fixed parallel to the horizontal plane (XY plane) at the time of film formation, a direction parallel to the short side of the substrate 10 is taken as an X direction, and a direction parallel to the long side is taken as a Y direction. Also, the rotation angle around the Z axis is indicated by θ.

  The film forming apparatus 2 includes a vacuum chamber 20 that defines a space in which a film forming process is performed. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

  A substrate support base 21 for supporting a substrate, a mask base 22 for placing a mask, an electrostatic chuck device 23 for holding a substrate by electrostatic attraction, magnetic force on a metal mask in the upper part in a vacuum chamber 20 of the film forming apparatus 2 A magnetic force application means 24 or the like for applying a voltage is provided, and a vapor deposition source 25 or the like in which a vapor deposition material is accommodated is provided at a lower portion in a vacuum chamber 20 of the film forming apparatus.

  In the substrate support 21, the substrate 10 carried into the vacuum chamber 20 by the transfer robot 14 of the transfer chamber 13 is placed. The substrate support 21 may be provided so as to be fixed to the vacuum chamber 20, and may be provided so as to be vertically movable. The substrate support 21 includes supports 211 and 212 for supporting the peripheral portion of the lower surface of the substrate.

  Under the substrate support 21, a frame-like mask table 22 is provided, and a mask 221 having an opening pattern corresponding to a thin film pattern formed on the substrate 10 is provided on the mask table 22. In particular, a mask used to manufacture an organic EL element for a smartphone is a metal mask on which a minute opening pattern is formed, and is also called FMM (Fine Metal Mask).

  An electrostatic chuck device 23 for holding and fixing the substrate 10 by electrostatic attraction is provided above the support portions 211 and 212 of the substrate support 21. The electrostatic chuck device 23 has, for example, a structure in which an electric circuit such as a metal electrode is embedded in a dielectric (for example, ceramic material) matrix. When positive (+) and negative (-) voltages are applied to the metal electrode, polarization charges of the opposite polarity to the metal electrode are induced in the substrate 10 through the dielectric matrix, and between the substrate 10 and the electrostatic chuck device 23 The substrate 10 is held and fixed to the electrostatic chuck device 23 by the electrostatic attraction of the The electrostatic chuck device 23 may be formed of one plate or may be formed to have a plurality of subplates. Further, even in the case of forming by one plate, by including a plurality of electric circuits inside thereof, it is possible to control so that the electrostatic attractive force is different depending on the position of the electric circuit in one plate.

  A magnetic force application unit 24 is provided on the upper portion of the electrostatic chuck device 23 to apply a magnetic force to the metal mask 221 to prevent the mask from bending and to bring the mask 221 and the substrate 10 into close contact with each other. The magnetic force application means 24 includes a plurality of magnetic force generation units 241 such as permanent magnets or electromagnets.

  In this embodiment, the electrostatic chuck device 23 has a feed terminal portion 32 connected to a feed line for supplying power to the electrostatic chuck plate portion 31 as shown in FIG. It is installed outside the arrangement area of the magnetic force generation unit 241. As a result, the feed line or the feed terminal portion 32 of the electrostatic chuck device 23 does not penetrate through the region where the magnetic force generating portion 241 of the magnetic force application means 24 is disposed.

  Although not shown in FIG. 2, a cooling plate for cooling the substrate 10 may be provided between the electrostatic chuck device 23 and the magnetic force application means 24. The cooling plate may be integrally formed with the electrostatic chuck device 23 or the magnetic force applying means 24.

  The deposition source 25 is a crucible (not shown) in which the deposition material to be deposited on the substrate 10 is stored, a heater (not shown) for heating the crucible, the deposition material until the evaporation rate from the deposition source becomes constant. It includes a shutter (not shown) or the like that prevents the substrate from being scattered. The deposition source 25 may have various configurations depending on applications such as a point deposition source, a linear deposition source, and a revolver deposition source.

  Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate.

  A driving mechanism for moving the substrate support 21, the electrostatic chuck device 23, the magnetic force application means 24 and the like in the vertical direction (Z direction) on the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2, and the substrate 10 and the mask A drive mechanism or the like for moving the electrostatic chuck device 23 or the like in parallel with the horizontal plane (in the X direction, the Y direction, and the θ direction) for alignment of the H.221 is provided. In addition, for alignment of the mask 221 and the substrate 10, an alignment camera (not shown) is also provided which captures an alignment mark formed on the substrate 10 and the mask 221 through a window provided on the ceiling of the vacuum chamber 20.

  The film forming apparatus 2 includes a control unit 26. The control unit 26 has functions such as transport and alignment of the substrate 10, control of the vapor deposition source 25, and control of film formation. The control unit 26 can be configured by, for example, a computer having a processor, a memory, a storage, an I / O, and the like. In this case, the function of the control unit 26 is realized by the processor executing a program stored in the memory or the storage. As a computer, a general-purpose personal computer may be used, or an embedded computer or programmable logic controller (PLC) may be used. Alternatively, some or all of the functions of the control unit 26 may be configured by a circuit such as an ASIC or an FPGA. Moreover, the control part 26 may be installed for every film-forming apparatus, and one control part 26 is good also as what controls several film-forming apparatuses.

  Hereinafter, the film forming process performed by the film forming apparatus of this embodiment will be described.

  First, a new mask is carried into the vacuum chamber 20 of the film forming apparatus and placed on the mask table 22.

  The substrate is carried into the vacuum chamber 20 by the transfer robot 14 of the transfer chamber 13 and placed on the substrate support 21. Subsequently, the electrostatic chuck device 23 is lowered to hold the substrate 10 by electrostatic attraction.

  A substrate alignment process is performed to measure and adjust the relative positions of the substrate 10 held by the electrostatic chuck device 23 and the mask 221 placed on the mask table in the horizontal (XYθ) direction.

  When the substrate alignment process is completed, at least one of the electrostatic chuck device 23 and the substrate support 21 is lowered by the drive mechanism, the substrate 10 is placed on the mask 221, and then the magnetic force application means 24 is lowered by the drive mechanism. , And the substrate 10 and the mask 221 are in close contact with each other.

  In this state, the shutter of the deposition source 25 is opened, and the deposition material evaporated from the crucible of the deposition source 25 is deposited on the substrate 10 through the fine pattern opening of the mask 221.

  When the film thickness of the deposition material deposited on the substrate 10 reaches a predetermined thickness, the shutter of the deposition source 25 is closed, and then the transfer robot 14 unloads the substrate 10 from the vacuum chamber 20 to the transfer chamber 13. After repeating the steps from substrate loading to substrate unloading for a predetermined number of substrates, the deposition material is deposited, the used mask is unloaded from the film forming apparatus, and a new mask is loaded into the film forming apparatus. .

<Mask mounting device>
Hereinafter, with reference to FIG.3 and FIG.4, the mask attachment apparatus containing the electrostatic chuck apparatus by a present Example is demonstrated.

  The mask mounting apparatus 30 of the present embodiment is an apparatus for mounting the mask 221 on the film formation surface of the substrate 10, and is an electrostatic chuck apparatus 23 for holding the surface opposite to the film formation surface of the substrate 10. And a magnetic force application means 24 for adhering the mask on the film formation surface side of the substrate 10 to the film formation surface of the substrate by magnetic force.

  The electrostatic chuck device 23 of this embodiment supplies power to the electrostatic chuck plate portion 31 for holding the surface on the opposite side of the film formation surface of the substrate 10 by electrostatic attraction and the electrostatic chuck plate portion 31. And a feed terminal portion 32 connected to the feed line.

  The electrostatic chuck plate portion 31 includes a plurality of electrodes 311 to which positive and negative voltages are applied to generate electrostatic attraction.

  The electrostatic chuck plate portion 31 is disposed such that the upper surface (first surface) faces the magnetic force application means 24, and the substrate 10 is provided on the lower surface (second surface) of the electrostatic chuck plate portion 31 opposite to the upper surface. Is held.

  The feed terminal portion 32 of the electrostatic chuck device 23 is, as shown in FIG. 3, the upper surface (first surface) of the electrostatic chuck plate portion 31 outside the region where the magnetic force generating portion 241 of the magnetic force application means 24 is disposed. Installed so as to be connected to each other (Example 1).

  Thus, by installing the feeding terminal portion 32 of the electrostatic chuck device 23 outside the region where the magnetic force generating portion 241 of the magnetic force application means 24 is disposed, the feeding terminal portion 32 of the electrostatic chuck device 23 or The feed line for supplying power does not penetrate the area where the magnetic force generator 241 is disposed. As a result, there is no region in the magnetic force application means 24 where the magnetic force generation part 241 is missing, and the plurality of magnetic force generation parts 241 are continuously arranged, and the magnetic force or magnetic field generated by the magnetic force application means 24 is uniform. Become.

  Although FIG. 3 illustrates that the feeding terminal portion 32 is disposed on the upper surface (first surface) side of the electrostatic chuck plate portion 31, the present invention is not limited to this, and may have another arrangement structure. it can.

For example, as shown in FIG. 4A, according to the second embodiment of the electrostatic chuck device 23 of the present invention, the feeding terminal portion 32 is a side surface of the electrostatic chuck plate portion 31 (a first surface and a second surface It may be disposed on the intersecting third surface). By arranging the feeding terminal portion 32 on the side surface of the electrostatic chuck plate portion 31, the electrostatic chuck plate portion 31 can be formed to be further shorter in the X direction or the Y direction than in the case of the first embodiment. In addition, the above-mentioned 3rd surface which arrange | positions the electric power feeding terminal part 32 may not be a surface which connects the outer edge parts of 1st surface and 2nd surface as shown to Fig.4 (a),
Any surface can be included as long as the electrostatic chuck plate portion 31 can be formed shorter in the X direction or the Y direction than in the case of the first embodiment.

  Further, as shown in FIG. 4B, according to the third embodiment of the electrostatic chuck device 23 of the present invention, the feeding terminal portion 32 is disposed on the lower surface (second surface) of the electrostatic chuck plate portion 31. It is also good. When the power supply terminal portion 32 is installed on the lower surface of the electrostatic chuck plate portion 31, it is installed so as not to interfere with the substrate 10 held on the lower surface of the electrostatic chuck plate portion 31 in the film forming process.

  Install the feed terminal portion 32 of the electrostatic chuck device 23 from the upper surface of the electrostatic chuck plate portion 31 to the outside of the arrangement region of the magnetic force generation unit 241, that is, do not penetrate the arrangement region of the magnetic force generation unit 241. However, in order to prevent the length of the electrostatic chuck plate portion 31 in the X direction or Y direction from becoming long, as shown in FIG. 4C, the shape of the feeding terminal portion 32 is bent. (Example 4). However, in this case, since the feeding terminal portion 32 is disposed in the region covered by the magnetic force application means 24 on the upper surface of the electrostatic chuck plate portion 31, the magnetic force application means 24 is sufficiently close to the electrostatic chuck plate portion 31. The thickness of the feed terminal portion 32 may be adjusted to reduce the thickness of the feed terminal portion 32 so that a part of the upper surface of the electrostatic chuck plate portion 31 is scraped to prevent an increase in resistance. The feed terminal portion 32 can also be installed on the

  Although the arrangement structure of the feeding terminal portion 32 of the electrostatic chuck device 23 in each embodiment of the present invention has been described with reference to FIGS. 3 and 4, the present invention is not limited thereto. A variety of arrangement structures and shapes can be considered as long as they can be installed outside the arrangement area of the portion 241, that is, so as not to penetrate the arrangement area of the magnetic force generation unit 241. For example, according to the installation position of the feeder which is drawn in from the vacuum chamber 20 outer side of the film-forming apparatus 2, it is possible to make the feeder terminal part 32 into various shapes so that connection with a feeder becomes easier. For example, the free end of the feed terminal 32 shown in FIG. 4A is directed upward to simplify the connection with the feed line drawn in from the upper portion outside the vacuum chamber 20 of the film forming apparatus 2. It may be deformed to have a bent shape.

  Further, as shown in FIG. 4D, the feeding terminal portion 32 of the electrostatic chuck device 23 does not pass through the area where the magnetic force generating portion 241 of the magnetic force applying means 24 is disposed, and the other portion of the magnetic force applying means 24. It may be provided to penetrate the In this case, although the feed terminal portion 32 penetrates the magnetic force application means 24 but avoids the arrangement region of the magnetic force generation portion 241 and penetrates, the arrangement of the magnetic force generation portion 241 is not affected, and a uniform magnetic field is maintained. become able to.

<Structure of electrostatic chuck plate portion and substrate support member>
Hereinafter, the structures of the electrostatic chuck plate portion 31 and the support portion of the substrate support 21 according to the present embodiment will be described with reference to FIG.

  The electrostatic chuck plate unit 31 of the present embodiment includes a plurality of substrate holding units. For example, as shown in FIG. 5A, the electrostatic chuck plate portion 31 of the present embodiment has two substrate holding portions 312 and 313, and in the case shown in FIG. 5B, three substrate holding portions 312. , 313, 314, but the present invention is not limited to this, and it is possible to have more substrate holders for controlling the substrate holding accuracy.

The plurality of substrate holding portions have an elongated shape in the long side direction (Y axis direction) of the substrate and are separated in the short side direction (X axis direction) of the substrate, but the invention is not limited thereto. It can also be separated. The plurality of substrate holders may be configured by physically separating the electric circuit in one plate into a plurality, or may be configured by a plurality of physically separated sub plates. Good. It is sufficient if the voltage for substrate holding is independently applied to each of the plurality of substrate holding units (that is, as long as holding of the substrate to each of the plurality of substrate holding units can be independently controlled) Depending on the configuration, the physical structure and the electrical circuit structure may change.

  The plurality of substrate holding portions 312, 313, 314 of the electrostatic chuck plate portion 31 of the present embodiment are disposed on the side of one long side (first side) with a substrate among the plurality of substrate holding portions. A voltage is applied in order (see the arrow in FIG. 5) from the substrate holding portion 312 to the second substrate holding portion 312 disposed on the other long side (second side) side of the substrate. That is, as shown in FIG. 5A, a voltage is first applied to the first substrate holder 312, and then a voltage is applied to the second substrate holder 313. In the electrostatic chuck plate unit 31 illustrated in FIG. 5B, an attraction voltage is first applied to the first substrate holding unit 312, and then, in order of the third substrate holding unit 314 and the second substrate holding unit 313. A voltage is applied.

  The first substrate holding portion 312 first holds the peripheral portion on the first side of the substrate on the electrostatic chuck plate portion 31 and then the third substrate holding portion 314 holds the central portion of the substrate. The peripheral portion on the second side of the substrate is finally held by the substrate holding portion 313. Thereby, the deflection of the central portion of the substrate can be effectively extended to the peripheral portion on the second side of the substrate. That is, since the substrate is held by the electrostatic chuck plate portion 31 in the order of the peripheral portion on the first side, the central portion, and the peripheral portion on the second side, the bending of the central portion of the substrate is performed on the peripheral portion on the second side. It is possible to extend it and to prevent the formation of wrinkles in the center of the substrate.

  The support portion of the substrate support 21 of the film forming apparatus 2 of the present embodiment includes a plurality of support members 211 and 212 for supporting the substrate 10.

  For example, as shown in FIG. 5A, the support portion of the substrate support 21 is installed so as to support at least the opposing two side edge portions of the substrate. That is, the support portion of the substrate support 21 is at least a plurality of first support members 211 disposed along one side (first side) of two opposing sides of the substrate and the other side (second side) And a plurality of second support members 212 disposed along the

  The plurality of first support members 211 are disposed along the long side direction (Y direction) of the substrate, and the plurality of second support members 212 are opposed to the plurality of first support members 211 in the long side direction (Y Direction) may be arranged along the

  As shown in FIG. 5B, the support portion of the substrate support base 21 of the present embodiment is provided with a plurality of first support members 211 arranged to support the peripheral portion on the first side, which is one end side of the substrate. A second side connecting the first side and the second side, in addition to the plurality of second support members 212 arranged to face the first side and to support the peripheral edge on the second side, which is the other end side of the substrate, A plurality of third support members 213 and a plurality of fourth support members 214 disposed along the second direction (short side direction, X direction) to support the peripheral portions on the three sides and the fourth side are included. Be

  Although FIG. 5 shows a configuration in which the first support member 211 and the second support member 212 are each composed of a plurality of support members, the present invention is not limited to this, and the first support member 211 and the second support member 212 At least one of them may be configured by one support member extending in the first direction.

Each support member includes a substrate support surface portion 215 for supporting the peripheral portion of the lower surface of the substrate and an elastic body portion 216 for elastically supporting the substrate support surface portion. A fluorine-coated pad (not shown) is provided on the substrate support surface 215 to prevent damage to the substrate. The elastic body portion 216 of the support member includes an elastic body such as a coil spring, a plate spring, or silicon rubber, and when the substrate is adsorbed to the electrostatic chuck plate portion 31, the elastic force due to the pressing force from the electrostatic chuck plate portion 31 The displacement prevents the substrate from being broken between the electrostatic chuck plate and the support member.

  The substrate support surface portion 215 of the first support member 211 is installed so as to be higher in height than the substrate support surface portion 215 of the second support member 212 in order to attach the substrate to the electrostatic chuck plate portion 31 flatly as a whole. be able to. Also, the elastic modulus of the elastic body portion 216 of the first support member 211 may be made different (for example, larger) than the elastic modulus of the elastic body portion 216 of the second support member 212, or The supporting force with which the first support member 211 supports the substrate is different from the supporting force with which the second support member 212 supports the substrate (for example, by making the lengths different from each other (for example, longer) Can be made larger).

<Method of Manufacturing Electronic Device>
Next, an example of the manufacturing method of the electronic device using the film-forming apparatus of a present Example is demonstrated. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the electronic device.

  First, an organic EL display device to be manufactured will be described. FIG. 6 (a) is a general view of the organic EL display device 60, and FIG. 6 (b) shows a cross-sectional structure of one pixel.

  As shown in FIG. 6A, in the display region 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The term “pixel” as used herein refers to the minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present example, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element and a white light emitting element It is not limited.

  FIG. 6 (b) is a schematic partial cross-sectional view taken along line A-B of FIG. 6 (a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. , And an organic EL element comprising Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light emitting layers 66R, 66G, 66B are formed in patterns corresponding to light emitting elements (sometimes described as organic EL elements) that emit red, green and blue, respectively. In addition, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrodes 64 and the second electrodes 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

  Although the hole transport layer 65 and the electron transport layer 67 are shown in one layer in FIG. 6B, they are formed of a plurality of layers including the hole block layer and the electron block layer depending on the structure of the organic EL display element. It may be done. In addition, between the first electrode 64 and the hole transport layer 65, there is provided a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 64 into the hole transport layer 65. It can also be formed. Similarly, an electron injection layer can be formed between the second electrode 68 and the electron transport layer 67 as well.

  Next, an example of a method of manufacturing an organic EL display device will be specifically described.

  First, a circuit 63 (not shown) for driving the organic EL display device and the substrate 63 on which the first electrode 64 is formed are prepared.

  An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 64 is formed. Form 69 The opening corresponds to a light emitting region in which the light emitting element actually emits light.

  The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, the substrate holding unit holds the substrate 63, and the hole transport layer 65 is placed on the first electrode 64 in the display area. The film is formed as a common layer. The hole transport layer 65 is deposited by vacuum evaporation. In practice, the hole transport layer 65 is formed to have a size larger than that of the display area 61, so a high definition mask is not necessary.

  Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into the second organic material film forming apparatus and held by the substrate support 21. After the substrate on the substrate support 21 is held by the electrostatic chuck device 23, alignment between the substrate 63 and the mask is performed. Subsequently, the substrate 63 is placed on the mask, and the substrate 63 and the mask are brought into close contact by the magnetic force application means 24. In this state, the light emitting layer 66R emitting red is formed on the portion of the substrate 63 where the element emitting red is disposed.

  According to the present invention, the feeding terminal portion 32 of the electrostatic chuck device 23 is disposed outside the arrangement region of the magnetic force generation unit 241 of the magnetic force application means 24 and does not penetrate the arrangement region of the magnetic force generation unit 241. The magnetic force acting on the mask can be uniformly maintained by the application means 24, and the degree of adhesion between the substrate 63 and the mask can be improved.

  Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third organic material film forming apparatus, and the light emitting layer 66B emitting blue is formed by the fourth organic material film forming apparatus. . After film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

  The substrate 63 formed up to the electron transport layer 67 is moved by a metallic vapor deposition material deposition apparatus to deposit a second electrode 68.

  Thereafter, it moves to a plasma CVD apparatus to form a protective layer 70, and the organic EL display device 60 is completed.

  After the substrate 63 on which the insulating layer 69 is patterned is carried into a film forming apparatus and the film is exposed to an atmosphere containing moisture or oxygen until the film formation of the protective layer 70 is completed, the light emitting layer made of the organic EL material It may be degraded by moisture or oxygen. Therefore, in the present embodiment, the loading and unloading of the substrate between the film forming apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

  The above embodiment shows only an example of the present invention, and the configuration to which the present invention can be applied is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea thereof.

10: Substrate 21: Substrate support 22: Mask base 23: Electrostatic chuck device 24: Magnetic force application means 30: Mask mounting device 31: Electrostatic chuck plate 32: Power supply terminal portion 241: Magnetic force generating portion

The present invention relates to a film forming apparatus and film forming method, specifically, in the film forming apparatus, the feeding terminal portion for supplying power to the electrostatic chuck plate portion for holding the substrate by electrostatic attraction It relates to the structure.

Therefore, in a film forming apparatus having a structure in which a substrate is held using an electrostatic chuck and such a substrate and a mask are in close contact with a magnet plate, the electrostatic chuck holds the substrate below the magnet plate. In the prior art for supplying power to the electrostatic chuck disposed beneath the magnet plate, feed lines from an external of the deposition apparatus through the magnet plate, the electrostatic chuck disposed beneath the magnet plate Set up to reach the

That is, as shown in FIG. 7, in a region where the magnet 725 of the magnet plate 724 is disposed, the feeding terminal 731 for supplying an electrostatic chuck 723 two power other than the magnet 725 is installed. As a result, in the region of the magnet plate 724 where the magnets 725 are arranged, there is a local region where the feed terminals 731 are arranged together and the magnets 725 are not arranged.

According to the present invention, in a film forming apparatus having a structure in which the substrate is held using an electrostatic chuck and the substrate and the mask are closely adhered using a magnetic force application unit, the influence of the magnetic force application unit on the uniformity of the magnetic force is reduced electrostatic chucking device having a structure capable power supply to the electrostatic chuck, mask mounting apparatus, film formation apparatus comprising these, primarily to provide a film formation method and a manufacturing method of an electronic device using these I assume.

In the electrostatic chuck device according to the first aspect of the present invention, a first surface facing a magnetic force application means for causing a mask to adhere to a film formation surface of a substrate by a magnetic force from a magnetic force generation unit; a surface opposite to the first surface, and the electrostatic chuck plate portion and a second surface for holding the opposite side of the film-forming surface of the substrate, the power to the electrostatic chuck plate portion And a feed terminal portion for supplying, wherein the feed terminal portion is provided outside a region where the magnetic force generating portion of the magnetic force application means is disposed.

Mask mounting apparatus according to the second aspect of the present invention, power supply terminal for supplying the electrostatic chuck plate portion for holding the opposite side of the deposition surface of the substrate, the power to the electrostatic chuck plate portion And a magnetic force application unit for attaching a mask to the film formation surface of the substrate by the magnetic force from the magnetic force generation unit, and the electrostatic chuck plate unit includes the magnetic force application unit. A second surface facing the first surface and a second surface opposite to the first surface, the second surface for holding the opposite surface of the film formation surface of the substrate; The terminal portion is provided outside the region where the magnetic force generating portion of the magnetic force application means is disposed.
A mask mounting apparatus according to a third aspect of the present invention includes an electrostatic chuck plate portion for holding a surface opposite to a film formation surface of a substrate, and a feeding terminal for supplying power to the electrostatic chuck plate portion. A magnetic force generation unit, and a magnetic force application unit for applying a magnetic force from the magnetic force generation unit to the mask with the substrate and the electrostatic chuck plate interposed therebetween; The area projected on the plane including the film formation surface of the substrate does not overlap with the area projected on the plane including the film formation surface of the substrate.
A mask mounting apparatus according to a fourth aspect of the present invention includes an electrostatic chuck plate portion for holding a surface opposite to a film formation surface of a substrate, and a feeding terminal for supplying power to the electrostatic chuck plate portion. Part and a magnetic force generating part, and the magnetic force from the magnetic force
And a magnetic force application unit for applying a magnetic force to the mask with the chuck plate portion interposed therebetween, wherein the magnetic force from the magnetic force generation portion is applied to the mask with the substrate and the electrostatic chuck plate portion interposed therebetween in the feeding terminal portion. In the second state, the magnetic force application unit is provided outside the area where the magnetic force generation unit is disposed.

The film deposition apparatus according to the fifth aspect of the present invention includes the mask attachment apparatus according to the second aspect of the present invention.
A film forming apparatus according to a sixth aspect of the present invention comprises: a magnetic force application unit for applying a magnetic force to a mask; an electrostatic chuck plate unit disposed below the magnetic force application unit; and holding the substrate; and a feed line for supplying the power to the electrostatic chuck plate portion, said magnetic force applying means includes a plurality of magnetic force generating unit for generating a magnetic force, the feeder line section, of the magnetic force applying means It does not penetrate the region where the plurality of magnetic force generation units are arranged.
The film forming apparatus according to the seventh aspect of the present invention includes the mask attaching apparatus according to the third or fourth aspect of the present invention.

The film forming method according to the eighth aspect of the present invention comprises the steps of: carrying a mask into the film forming apparatus and placing the mask on the mask table; carrying the substrate into the film forming apparatus; Placing the substrate on the substrate support table by the electrostatic chuck device according to the first aspect of the present invention; placing the substrate held by the electrostatic chuck device on the mask Attaching the mask and the substrate on the mask by means of magnetic force application means including a magnetic force generating part, and depositing the vapor deposition material evaporated from the evaporation source on the substrate through the mask And.
The film forming method according to the ninth aspect of the present invention comprises the steps of: attaching a mask to the film forming surface side of the substrate by the mask attaching apparatus according to the third or fourth aspect of the present invention; Forming a film on the substrate.

The method of manufacturing an electronic device according to the tenth aspect of the present invention manufactures an electronic device using the film forming method according to the eighth or ninth aspect of the present invention.

According to the present invention, by providing the feeding terminal portion of the electrostatic chucking device to a region outside the magnetic force generating part of the magnetic force applying means is arranged, the feed line or power supply for supplying power to the electrostatic chuck plate portion The terminal portion does not penetrate through the arrangement region of the magnetic force generation unit of the magnetic force application unit, and the arrangement region of the magnetic force generation unit of the magnetic force application unit can be avoided. As a result, there is no part where the magnetic force generation part is not locally arranged due to the penetration of the feed line or the feed terminal part in the area where the magnetic force generation part of the magnetic force application means is arranged. Unevenness can be prevented. As a result, the magnetic field that attracts the mask by the magnetic force application unit becomes uniform, and the contact accuracy between the mask and the substrate is improved.

In this embodiment, the electrostatic chuck 23, as FIG. 3 and described below, the feeding terminal portion 32 which feed lines for supplying the electrostatic chuck plate 31 two power is connected is, the magnetic force applying means 24 The magnetic force generator 241 is disposed outside the arrangement area of the magnetic force generator 241. As a result, the feed line or the feed terminal portion 32 of the electrostatic chuck device 23 does not penetrate through the region where the magnetic force generating portion 241 of the magnetic force application means 24 is disposed.

The electrostatic chuck device 23 of this embodiment, supply and the electrostatic chuck plate 31 for holding the opposite side of the film-forming surface of the substrate 10 by electrostatic attraction, an electrostatic chuck plate portion 31 second electrodeposition force And a feed terminal portion 32 to which a feed line for connecting is connected.

Thus, by installing the feeding terminal portion 32 of the electrostatic chuck device 23 outside the region where the magnetic force generating portion 241 of the magnetic force application means 24 is disposed, the feeding terminal portion 32 of the electrostatic chuck device 23 or feed line for supplying the power is, so do not penetrate the area the magnetic force generating unit 241 is disposed. As a result, there is no region in the magnetic force application means 24 where the magnetic force generation part 241 is missing, and the plurality of magnetic force generation parts 241 are continuously arranged, and the magnetic force or magnetic field generated by the magnetic force application means 24 is uniform. Become.

Claims (23)

An electrostatic chuck device for holding a substrate, wherein
The first surface facing the magnetic force application means for causing the mask to adhere to the film formation surface of the substrate by the magnetic force from the magnetic force generation portion, and the surface opposite to the first surface, which is the surface of the substrate An electrostatic chuck plate portion including a second surface for holding a surface opposite to the film formation surface;
A feeding terminal portion for supplying power to the electrostatic chuck plate portion;
Including
The electrostatic chuck device is characterized in that the feeding terminal portion is provided outside a region where the magnetic force generating portion of the magnetic force applying means is disposed.   The electrostatic chuck device according to claim 1, wherein the feeding terminal portion is provided on the first surface of the electrostatic chuck plate portion.   The electrostatic chuck device according to claim 1, wherein the power supply terminal portion is provided on the second surface of the electrostatic chuck plate portion.   The electrostatic chuck device according to claim 1, wherein the power supply terminal portion is provided on a third surface intersecting with the first surface and the second surface of the electrostatic chuck plate portion.   The electrostatic chuck device according to any one of claims 1 to 4, wherein the feeding terminal portion is provided outside the region covered by the magnetic force application unit in the electrostatic chuck plate portion.   The electrostatic chuck plate unit according to any one of claims 1 to 5, wherein the electrostatic chuck plate unit includes a plurality of substrate holding units, and holding power of each of the plurality of substrate holding units can be controlled independently. Chuck device.   7. The electrostatic chuck device according to claim 6, wherein the voltage applied to each of the plurality of substrate holders can be controlled independently. A mask mounting apparatus for mounting a mask on a film formation side of a substrate, the mask mounting apparatus comprising:
An electrostatic chuck plate portion for holding a surface opposite to the film formation surface of the substrate;
A feeding terminal portion for supplying power to the electrostatic chuck plate portion;
A magnetic force application unit that has a magnetic force generation unit and causes the mask to adhere to the film formation surface of the substrate by the magnetic force from the magnetic force generation unit;
Including
The electrostatic chuck plate portion holds a first surface facing the magnetic force application means and a surface opposite to the first surface and opposite to the film formation surface of the substrate. And a second surface to
The said power supply terminal part is provided outside the area | region where the said magnetic force generation part of the said magnetic force application means is arrange | positioned, The mask attachment apparatus characterized by the above-mentioned.   9. The mask mounting apparatus according to claim 8, wherein the power supply terminal portion is provided on the first surface of the electrostatic chuck plate portion.   9. The mask mounting device according to claim 8, wherein the power supply terminal portion is provided on the second surface of the electrostatic chuck plate portion. 9. The mask mounting apparatus according to claim 8, wherein the power supply terminal portion is provided on a third surface intersecting the first surface and the second surface of the electrostatic chuck plate portion.   The said electric power feeding terminal part is provided in the said electrostatic chuck plate part outside the area | region covered by the said magnetic force application means, The mask attachment apparatus of any one of the Claims 8-11 characterized by the above-mentioned.   The mask mounting method according to any one of claims 8 to 12, wherein the electrostatic chuck plate unit includes a plurality of substrate holding units, and holding power of each of the plurality of substrate holding units can be controlled independently. apparatus.   14. The mask mounting apparatus according to claim 13, wherein the voltage applied to each of the plurality of substrate holders can be controlled independently. A film forming apparatus for forming a deposition material on a substrate through a mask, the film forming apparatus comprising:
A film deposition apparatus comprising the mask attachment apparatus according to any one of claims 8 to 14.   A substrate supporting table disposed along a third surface intersecting the first surface and the second surface of the electrostatic chuck plate portion of the mask mounting device, for supporting a peripheral portion of a film forming surface of the substrate The film forming apparatus according to claim 15, further comprising:   The film deposition apparatus of claim 16, wherein the substrate support comprises a plurality of support members disposed along the third surface.   The film forming apparatus according to claim 17, wherein a supporting member of a part of the plurality of supporting members has a supporting force different from that of another supporting member. A film forming apparatus for forming a vapor deposition material on a substrate through a mask, the film forming apparatus comprising:
Magnetic force application means for applying a magnetic force to the mask;
An electrostatic chuck plate portion disposed below the magnetic force application means for holding the substrate;
A feeder line portion for supplying power to the electrostatic chuck plate portion;
Including
The magnetic force application means includes a plurality of magnetic force generation units for generating a magnetic force,
The film forming apparatus according to claim 1, wherein the feed line portion does not penetrate a region where the plurality of magnetic force generation units of the magnetic force application unit is disposed.   The film forming apparatus according to claim 19, wherein the feed line portion does not penetrate the magnetic force application unit. A film forming method for forming a vapor deposition material on a substrate through a mask, the film forming method comprising:
Loading the mask into a deposition apparatus and placing the mask on a mask table;
Loading the substrate into the deposition apparatus and placing the substrate on a substrate support table;
Holding the substrate on the substrate support by the electrostatic chuck device according to any one of claims 1 to 7;
Placing the substrate held by the electrostatic chuck device on a mask;
Bringing the mask and the substrate on the mask into close contact with each other by a magnetic force application unit including a magnetic force generation unit;
Depositing a deposition material evaporated from a deposition source on the substrate through the mask. Holding the substrate on the substrate support by the electrostatic chuck device according to any one of claims 1 to 7;
Placing the substrate held by the electrostatic chuck device on a mask;
22. The film forming method according to claim 21, further comprising an alignment step of adjusting the position of the substrate held by the electrostatic chuck device with respect to the mask. A method of manufacturing an electronic device,
A method of manufacturing an electronic device, comprising: manufacturing an electronic device using the film forming method according to claim 21.