JP2019102605A - Liquid processing device and liquid processing method - Google Patents

Abstract

To suppress the number of components provided in piping with supply of a process liquid and further to suppress deterioration in quality of the process liquid and dispersion of the process liquid to the surroundings when performing liquid processing by supplying the process liquid from a nozzle to a substrate.SOLUTION: A resist liquid in a resist liquid storage part 4 is directly sucked by a resist liquid nozzle 6 and then supplied to a wafer. Therefore, the number of components for supplying the resist liquid from an intermediate tank to the resist liquid nozzle 6 and discharging the resist liquid from the resist liquid nozzle 6 is reduced. An opening 42 which is opened/closed by rotating a main body part 40 around a vertical axis is provided in the resist liquid storage part 4, and a bellows 61 is provided to enclose a distal end of a nozzle part 60 in the resist liquid nozzle 6. Thus, a distal end of the bellows is locked to a lid part 41, the distal end of the resist liquid nozzle 6 and a hole part are separated from outside air of the bellows 61, and the opening 42 is opened/closed.SELECTED DRAWING: Figure 18

Description

  The present invention relates to a liquid processing apparatus and a liquid processing method for supplying a processing liquid to a substrate.

  In the semiconductor manufacturing process, there is a process of supplying a processing liquid to a substrate from a nozzle and performing liquid processing, for example, coating a resist liquid or a processing liquid for forming an antireflective film in a resist pattern forming system, or an insulating film Application | coating of the process liquid for formation, etc. are mentioned. In forming such a coating film, spin coating is used in which a treatment liquid is discharged from a nozzle onto a substrate and the coating film is formed by rotation of the substrate. In such a liquid processing apparatus, the processing liquid supply path is routed to the nozzle at the tip of the nozzle arm, and the processing liquid stored in the processing liquid supply source is supplied to the nozzle through the processing liquid supply path. The processing liquid is supplied and disconnected by a pump and a valve provided in the processing liquid supply path.

  On the other hand, as design rules are becoming finer, the allowable size of particles adhering to the substrate becomes strict, and reduction of particles generated in the processing liquid supply path has become an important issue. The main dust source of the processing liquid supply path is a valve or a pump, and in particular, there is a problem of many dust generation of a discharge valve, which is called a dispensing valve, for stopping supply of the processing liquid. There is also a problem that the structure becomes complicated because the number of parts near the nozzle arm increases.

  With respect to such a problem, Patent Documents 1 and 2 describe an apparatus for suctioning a resist solution stored in a resist solution storage unit by a syringe-type nozzle and supplying the suctioned solution to a substrate. However, since it is necessary to allow the resist solution to enter the resist solution storage section, the upper side of the resist solution storage section is opened, and problems such as mist scattering in the liquid processing apparatus and deterioration of the quality of the stored resist solution occur. is there.

Patent No. 4227171 Patent No. 4328658

  The present invention has been made under the circumstances described above, and an object thereof is to suppress the number of parts provided in piping along with the supply of the processing liquid when the processing liquid is supplied from the nozzle to the substrate to perform the liquid processing. Another object of the present invention is to provide a technology for suppressing the deterioration of the quality of the processing solution and the scattering to the surroundings.

A liquid processing apparatus according to the present invention is an apparatus for performing liquid processing on a substrate with a processing liquid,
A processing solution tank for storing the processing solution and provided with a processing solution outlet on the top surface,
A nozzle having a function of suction and discharge of treatment liquid;
A nozzle moving mechanism for moving the nozzle between a position inserted into the outlet and a position discharged onto the substrate;
An opening and closing mechanism for opening and closing the outlet;
And a blocking mechanism for blocking the inside of the processing liquid tank from the open air when the nozzle is inserted into the takeout port.

The liquid processing method according to the present invention is provided between a replenishment storage unit in which the treatment liquid to be replenished in the treatment liquid tank is stored, and between the replenishment storage unit and the treatment liquid tank, and a pump unit is interposed. A suction step of inserting the nozzle into the outlet and using the nozzle to suction the treatment liquid in the treatment liquid tank, using the above-described liquid treatment apparatus including the treatment liquid supply path including the circulation path;
Then, a discharge step of supplying a processing liquid to the substrate from the nozzle;
A replenishing step of replenishing the treatment liquid tank stored in the replenishment storage unit to the treatment liquid tank via the flow path;
And D. a circulating step of circulating the processing solution in a circulation path by the pump unit,
The circulating process may be performed to overlap at least one of the suction process, the discharging process, and the refilling process.

According to the present invention, the nozzle sucks the processing liquid directly from the processing liquid tank and discharges it onto the substrate. Therefore, the piping system connected to the nozzle can be kept short and the number of parts provided in the piping can be reduced. An opening for opening and closing the processing liquid is provided on the upper surface of the processing liquid tank, and a blocking mechanism for shielding the inside of the processing liquid tank from the open air when the nozzle is inserted into the opening is provided. Therefore, deterioration of the quality of the treatment liquid and scattering to the surroundings can be suppressed.
Further, according to the present invention, there is further provided a replenishment storage unit in which a treatment liquid to be replenished in the treatment liquid tank is stored, a circulation provided between the replenishment storage unit and the treatment liquid tank, and a pump unit interposed therebetween. By providing a treatment liquid supply passage including a passage, precipitation of components in the treatment liquid can be suppressed by performing a circulation step of circulating the treatment liquid. Furthermore, the suction and discharge process of suctioning the treatment liquid to the nozzle and discharging the treatment liquid from the nozzle, and the replenishment process of increasing the pressure of the replenishment storage unit and replenishing the treatment liquid from the replenishment storage unit to the treatment liquid tank It can be performed simultaneously with the operation of circulating the fluid. Therefore, the precipitation of the components in the treatment liquid can be suppressed more reliably.

FIG. 2 is a perspective view of a substrate processing system including a coating, a developing device and an exposure device provided with a liquid processing apparatus. FIG. 1 is a plan view of a substrate processing system including a coating, developing apparatus and exposure apparatus provided with a liquid processing apparatus. It is a perspective view which shows the said liquid processing apparatus. It is a perspective view which shows the nozzle unit provided in the said liquid processing apparatus. It is a longitudinal cross-sectional view which shows the resist solution nozzle provided in the said nozzle unit. It is a longitudinal cross-sectional view which shows the said resist solution nozzle. It is a disassembled perspective view of the resist liquid storage part provided in the said liquid processing apparatus. It is a longitudinal cross-sectional view of the resist liquid storage part provided in the said liquid processing apparatus. It is explanatory drawing explaining opening and closing of the opening part of the said resist liquid storage part. It is explanatory drawing explaining opening and closing of the opening part of the said resist liquid storage part. It is explanatory drawing which shows the resist solution supply system containing the said resist solution storage part. It is a perspective view which shows the rotation mechanism which rotates the main-body part of the said resist solution storage part. It is a longitudinal cross-sectional view which shows the rotation mechanism which rotates the main-body part of the said resist solution storage part. It is a top view which shows the rotation mechanism which rotates the main-body part of the said resist solution storage part. It is a longitudinal cross-sectional view which shows a washing | cleaning-liquid storage part and a drying tank. It is explanatory drawing which shows the approach operation | movement of the resist solution nozzle to a resist solution storage part. It is explanatory drawing which shows the approach operation | movement of the resist solution nozzle to a resist solution storage part. It is explanatory drawing which shows the approach operation | movement of the resist solution nozzle to a resist solution storage part. It is explanatory drawing which shows the approach operation | movement of the resist solution nozzle to a resist solution storage part. It is explanatory drawing which shows the approach operation | movement of the resist solution nozzle to a resist solution storage part. It is explanatory drawing which shows the approach operation | movement of the resist solution nozzle to a resist solution storage part. It is explanatory drawing which shows the approach operation | movement of the resist solution nozzle to a resist solution storage part. It is explanatory drawing which shows the approach operation | movement of the resist solution nozzle to a resist solution storage part. It is explanatory drawing which shows the other example of the nozzle holding part holding a resist solution nozzle. It is explanatory drawing which shows the further another example of the nozzle holding part holding a resist solution nozzle. It is explanatory drawing which shows the process liquid supply system provided in a coating and a developing device. It is a perspective view which shows the other example of the heating part which heats a main-body part. It is explanatory drawing which shows the other example of an opening-and-closing mechanism. It is explanatory drawing which shows the other example of an opening-and-closing mechanism. It is explanatory drawing which shows the other example of an opening-and-closing mechanism. It is explanatory drawing which shows the other example of an opening-and-closing mechanism. It is explanatory drawing which shows the other example of a nozzle unit.

A substrate processing system including a coating, developing apparatus and exposure apparatus including a liquid processing apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. This system is configured by linearly connecting a carrier block S1, a processing block S2, and an interface block S3. An exposure station S4 is further connected to the interface block S3.
The carrier block S1 has a role of carrying a carrier C including a plurality of semiconductor wafers (hereinafter referred to as "wafers") W which are circular substrates of the same lot into and out of the apparatus. An opening / closing unit 12 and a transfer mechanism 13 for transferring the wafer W from the carrier C via the opening / closing unit 12 are provided.

  The processing block S2 is formed by stacking first to sixth unit blocks B1 to B6 for performing liquid processing on the wafer W in order from the bottom, and the unit blocks B1 to B6 have substantially the same configuration. In FIG. 1, alphabetic characters attached to the unit blocks B1 to B6 indicate the process type, COT indicates a resist film formation process, and DEV indicates a development process. In this example, four layers of resist film formation processing COT are stacked, and two layers of development processing DEV are stacked.

  FIG. 2 is a plan view showing the third unit block B3 as a representative. The unit block B3 includes a main arm A3 moving a linear transfer area R3 from the carrier block S1 to the interface block S3, a resist coating module 10 which is a liquid processing apparatus, and heat for heating and cooling the wafer W. And shelf units U1 to U6 in which system modules are stacked.

On the carrier block S1 side of the transport area R3, a shelf unit U7 configured of a plurality of modules stacked one on another is provided. Delivery of the wafer W between the transport mechanism 13 and the main arm A3 is performed via the module of the shelf unit U7 and the delivery arm 30.
The interface block S3 is for transferring the wafer W between the processing block S2 and the exposure station S4, and includes shelf units U8, U9, U10 in which a plurality of modules are stacked on one another. In FIG. 2, 3A and 3B denote transfer arms for transferring the wafer W between the shelf units U8, U9 and U10, and 3C denotes a wafer W between the interface block S3 and the exposure station S4. It is a transfer arm that performs delivery.

  In this substrate processing system, the wafer W transported by the carrier C is transported by the delivery arm 30 to the processing block S2, transported to the unit block B1 (B2 to B4) where the resist film forming process COT is performed, and the interface block S3 is The wafer W is conveyed to the exposure station S4 to perform an exposure process. Wafer W after exposure is transported to unit block B5 (B6) which performs development processing DEV via interface block S3 to be subjected to development processing, and carrier C of carrier block S1 via shelf unit U7 and delivery arm 30. It is returned to.

  The resist coating module 10 will be described with reference to FIG. The resist coating module 10, which is a liquid processing apparatus for supplying a resist liquid, which is a processing liquid, to the wafer W is common to, for example, a plurality of cup modules 1 and a plurality of cup modules 1 arranged side by side as shown in FIG. The nozzle unit 5 is provided with a nozzle provided movably in the direction in which the cup modules 1 are arranged.

  As shown in FIG. 3, the cup module 1 includes a spin chuck 11 that sucks the central portion of the back surface of the wafer W, holds it horizontally, and rotates it around a vertical axis. A cup body (specifically, a cup assembly) 22 having an opening on the upper side is provided around the spin chuck 21 so as to surround the wafer W on the spin chuck 21. The cup body 22 receives and discharges the solvent shaken off from the wafer W, and is evacuated from the lower exhaust passage so that the mist does not scatter in the processing atmosphere.

The nozzle unit 5 can be moved up and down by a moving mechanism including an arm 55 configured to be movable forward and backward in a horizontal direction as shown in FIG. 3, a moving body 53, a lifting mechanism 56, and a guide rail 54 provided on the base 100. , Is configured to be movable.
As shown in FIG. 4, the nozzle unit 5 includes a thinner nozzle 57 and a resist solution nozzle 6. The thinner nozzle 57 is provided on the lower surface of the tip end portion of the nozzle unit 5 and configured to discharge thinner downward. The base end side of the thinner nozzle 57 is connected to one end of a thinner supply path 58 formed in the nozzle unit 5, and the other end side of the thinner supply path 58 is connected via, for example, a flow rate adjusting unit M58 and a valve V58. , Thinner supply source 59 is connected.

  Further, the resist solution nozzle 6 is detachably provided via a nozzle holding portion 7 provided on the lower surface of the tip end portion of the nozzle unit 5. The resist solution nozzle 6 is also arranged on the front end side of the nozzle unit 5 along with the thinner nozzle 57. As shown in FIGS. 4 and 5, the resist solution nozzle 6 includes a cylindrical nozzle portion 60 and a bellows (bellows body) 61 provided so as to surround the periphery of the nozzle portion 60. The nozzle portion 6 has a discharge suction port 62 on the lower side (tip end side) and a holding end 63 to be held by the nozzle holding portion 7 on the upper end side (base end side). The bellows 61 is configured to expand and contract in the vertical direction, the inner surface of the upper end portion is fixed to the lower side of the holding end 63 of the nozzle portion 60, and the lower end portion opens wider than the cross section of the nozzle portion 60 It is a free end located below the tip of the portion 60. Therefore, as shown in FIG. 6, when the bellows 61 is contracted, the lower end of the bellows 61 is configured to rise along the nozzle portion 60 without contacting the nozzle portion 60. The lower end of the bellows 61 is a ring-shaped projection 64, and the projection 64 is around the hole 46 of the lid 41 of the resist solution storage 4, the cleaning liquid reservoir 90, and the drying tank 91, which will be described later. It is comprised so that it may be latched by the step part 48 formed in this.

  Subsequently, the nozzle holding unit 7 will be described. The nozzle holding portion 7 is configured to be capable of reducing and enlarging the aperture diameter by, for example, a known aperture mechanism, and the resist solution inserted by inserting the holding end 63 of the nozzle portion 60 inside and narrowing the aperture diameter by the aperture mechanism. The holding end 63 of the nozzle 6 is held. Thus, the central axis of the nozzle holding portion 7 and the central axis of the resist solution nozzle 6 are fixed so as to be aligned. Further, the resist solution nozzle 6 is removed from the nozzle unit 5 by widening the opening diameter by the throttling mechanism.

  Referring back to FIG. 4, the gas passage 65 is formed in the nozzle unit 5, and one end of the gas passage 86 is connected to the base end of the resist solution nozzle 6 held by the nozzle holding unit 7. It is configured. The other end side of the gas flow path 65 is branched into two, and a suction part 66 for drawing gas from one end is connected, and for example, nitrogen gas is injected into the other end. A gas supply unit 67 is connected. V66 and V67 in FIG. 4 are valves. Then, the resist solution nozzle 6 is held by the nozzle unit 5, and the tip of the nozzle portion 60 in the resist solution nozzle 6 is immersed in the resist solution and suctioned by the suction unit 66. The resist solution is aspirated. Further, the suction unit 66 is provided with a flow rate adjustment unit that adjusts the suction flow rate, and is configured to be able to adjust the amount of the resist solution sucked into the resist solution nozzle 6. Further, after suctioning the resist solution, the gas supply unit 67 supplies a gas, whereby the resist and the solution are discharged from the tip of the resist solution nozzle 6.

  Further, as shown in FIG. 3, a nozzle holder 8 on which a resist solution nozzle 6 is mounted is provided on the base 100. The nozzle holder 8 is formed in a box shape, and a plurality of holes 81 corresponding to the respective resist solution nozzles 6 are formed in a line on the upper surface. The resist solution nozzle 6 is, for example, a plurality of types of resist solution nozzles 6 having different capacities, materials, and the like depending on the type of processing. The resist solution nozzles 6 are held in a state of being inserted into the holes 81 with the discharge suction ports 62 at the front end directed downward. In the nozzle holder 8, the holding end 63 of the resist solution nozzle 6 placed on the nozzle holder 8 is held by the nozzle holder 7 of the nozzle unit 5, and the nozzle unit 5 is raised to place the nozzle unit 8 on the nozzle holder 8. Among the resist solution nozzles 6 thus obtained, the resist solution nozzle 6 held by the nozzle unit 5 is pulled out.

  Further, as shown in FIG. 3, a resist solution reservoir 4 (resist solution tank) is provided on the base 100. The resist solution reservoir 4 includes a main body 40 and a lid 41 as shown in FIGS. 7 and 8. The main body portion 40 is formed of a cylindrical member, and a circular opening 42 which is a first opening portion is formed at a position deviated from the central portion of the top plate portion. Further, the bottom surface of the main body portion 40 is formed in a mortar shape, and the drainage pipe 43 is connected to the central portion of the bottom surface portion. The drainage pipe 43 is connected via a connector 44 configured to allow the main body 40 to rotate independently of the drainage pipe 43 around the vertical axis when the main body 40 is rotated. Further, a ribbon heater 49 which is, for example, a heating unit is provided around the main body 40, and the main body 40 is configured to be heated to a predetermined temperature.

  Furthermore, a downstream end of a resist solution supply pipe 401 described later is connected to the main body 40 so as to penetrate the top plate. Further, in the top plate portion, the cleaning liquid supply pipe 23 for supplying the cleaning liquid into the main body 40, for example, dry air is introduced into the main body 40, the pressure in the main body 40 is increased, and the cleaning liquid is drained from the drainage pipe 43. A gas supply pipe 24 for fluidizing and drying the inside of the main body 40 is connected to penetrate the top plate. Further, in order to suppress evaporation of the solvent contained in the resist solution stored in the main body 40, a solvent atmosphere supply pipe 25 for supplying a solvent atmosphere into the main body 40 is connected so as to penetrate the top plate. The resist solution supply pipe 401, the cleaning liquid supply pipe 23, the gas supply pipe 24, and the solvent atmosphere supply pipe 25 are arranged side by side on the same circumference centering on the central axis C of the main body 40.

  A lid 41 is provided on the top of the main body 40. The lid portion 41 is formed in a flat cylindrical shape whose lower surface is opened, covers the upper portion of the main body portion 40, and is disposed with a very small gap so as not to prevent the rotation of the main body portion 40. As shown in FIG. 9, the cover 41 has a circular opening 46 which is a second opening at a position corresponding to the opening 42 of the main body 40, and rotates the main body 40 around the vertical axis. By setting the positions of the opening 42 of the main body 40 and the hole 46 of the lid 41 so as not to overlap with each other, the upper side of the opening 42 is closed. Further, as shown in FIG. 10, by aligning the positions of the opening 42 of the main body 40 and the hole 46 of the lid 41 and rotating them so as to overlap each other, the opening 42 of the main body 40 and the lid In communication with the hole 46 of 41, the outlet of the resist solution reservoir 4 is opened.

  In addition, when the main body 40 is rotated to switch between the position where the opening 42 of the main body 40 is opened and the position where the opening 42 of the main body 40 is closed, the lid 41 is a resist The liquid supply pipe 401, the cleaning liquid supply pipe 23, the gas supply pipe 24, and the solvent atmosphere supply pipe 25 are formed along moving paths, and an arc-shaped groove 47 is formed so as not to prevent the rotation of the main body 40. There is. A ring-shaped step 48 is provided around the hole 46 in the lid 41. Then, the projection 64 of the tip of the bellows 61 provided in the resist solution nozzle 6 described above is engaged with the step 48 to prevent the displacement of the bellows 61 and to suppress the formation of the gap on the lower side of the bellows 61. In addition, the descent of the bellows 61 is regulated. The elevating mechanism for lowering the bellows 61 and the bellows 61, and the step portion 48 formed on the lid 41 and to which the projection 64 of the bellows 61 is engaged constitute a blocking mechanism.

  Subsequently, a resist supply system for supplying the resist solution to the resist solution reservoir 4 will be described. As shown in FIG. 11, the resist supply system 400A includes a resist solution supply pipe 401 which constitutes a part of a processing solution supply path for supplying a resist solution to the resist solution storage unit 4 from the main tank 410 which is a replenishment storage unit. In the resist solution supply pipe 401, a filter 402 and a tube valve 403 for filtering the resist solution to remove foreign matter are provided in this order from the upstream side.

Further, a return pipe 404 which is a return flow path is branched from a portion on the primary side of the tube valve 403 on the secondary side of the filter 402, and the return pipe 404 is connected to the primary side of the filter 402. A pump 405 such as, for example, a bearingless pump is interposed in the middle of the return conduit 404. Above the main tank 410, a gas supply line 407 connected to a supply source of an inert gas such as nitrogen (N ₂ ) gas not shown is provided. V401, V404, and V405 in FIG. 11 are valves. Further, V 407 is a valve for supplying and disconnecting the N ₂ gas supplied to the main tank 410.

Subsequently, a rotation mechanism for opening and closing the opening 42 by rotating the main body 40 will be described with reference to FIGS. 12 to 14. Horizontal protrusions 31 extending in the horizontal direction are provided at positions opposite to each other on the side surface of the main body 40 via the main body 40, and below the horizontal protrusions 31 along the shape of the side surface of the main body 40. A curved support portion 32 is connected. The lower part of the support part 32 is fixed to the base part 33, and the base part 33 is formed on the surface of the base 100 and arranged on the circumference of the resist solution storage part 4 around the central axis C. It is configured to be movable along the annular guide rail 34.
On an outer peripheral surface of one of the support portions 32, a gear portion 35 in which gears are arranged in line along the circumferential direction of the main body portion 40 is provided. Further, a drive gear portion 36 is provided to correspond to the gear of the gear portion 35, and the drive gear portion 36 is connected to a rotation mechanism 38 provided on the upper surface of the base 100 via a rotation shaft 37.

Further, on the side surface of the lid portion 41, a projection portion 29 which is formed of two plate-like members which extend in parallel in the horizontal direction and which are arranged side by side are opposed to each other through the center of the lid portion 41. Each is provided. A column 27 extending upward from the base 100 is disposed at a position corresponding to each projection 29. The two plate-like members of the projection 29 are held between the column 27 and the position of the column 27 near the upper side By arranging so as to be locked to the beam portion 28 provided on the upper surface of the cover 41, the height position of the cover 41 is fixed and the rotation of the cover 41 around the vertical axis is restricted.
With such a configuration, by rotating the drive gear portion 36, the gear portion 35 moves in the circumferential direction of the main body portion 40, and the support portion 32 rotates along the guide rail 34. As a result, a force rotating about the central axis C is applied to the main body 40. At this time, the rotation of the lid portion 41 is restricted by the columns 27, so that the main body portion 40 rotates around the vertical axis with the lid portion 41 fixed.

  Further, as shown in FIG. 3, the liquid processing apparatus of the present invention includes a cleaning liquid storage unit (cleaning liquid tank) 90 and a drying tank 91. As shown in FIG. 14, the cleaning liquid reservoir 90 includes a main body 40 and a lid 41 configured substantially the same as the resist liquid reservoir 4 except that the cleaning liquid is supplied to the inside. The parts of the cleaning liquid storage unit 90 and the drying tank 91 that have substantially the same structure as the resist liquid storage unit 4 are given the same reference numerals as the resist liquid storage unit 4. A drainage pipe 43 for draining the cleaning liquid stored in the main body 40 is connected to the bottom surface of the main body 40 in the cleaning liquid storage 90, and a cleaning liquid is supplied to the ceiling surface of the main body 40 to supply the cleaning liquid. The pipe 92 is connected. A cleaning solution supply source 93 is connected to the cleaning solution supply pipe 92. The cleaning liquid supply pipe 92 may be provided to pierce the side surface of the main body 40 and discharge the resist liquid toward the resist liquid nozzle 6 which has entered the main body.

  The drying tank 91 also has a main body 40 and a lid 41 which are configured substantially the same as the resist solution reservoir 4. The main body 40 of the drying tank 91 is provided with a drying gas nozzle 94 for blowing dry air, for example, toward the tip of the resist solution nozzle 6 when the resist solution nozzle 6 is inserted into the drying tank 91. A drain pipe 43 for draining the cleaning liquid that has fallen into the drying tank 91 is connected to the bottom plate of the main body. The dry gas nozzle 94 is connected to a dry gas supply source 96 via, for example, a gas supply pipe 95.

  A rotating mechanism (not shown) for rotating the main body 40 around the vertical axis is also provided in the cleaning liquid storage 90 and the drying tank 91, and the main body 40 is rotated to open the hole 46 of the lid 41 and the opening of the main body 40. By aligning with the part 42, the opening 42 of the main body 40 is configured to be opened. The rotation mechanism of the cleaning solution storage unit 90 and the drying tank 91 may be configured in the same manner as the rotation mechanism of the resist solution storage unit.

  Further, as shown in FIG. 3, the liquid processing apparatus of the present invention includes a control unit 101. A program stored in a storage medium such as, for example, a flexible disk, a compact disk, a hard disk, an MO (magneto-optical disk), and a memory card is installed in the control unit 101. The installed program incorporates a group of instructions (steps) to transmit control signals to each part of the resist application module 10 to control the operation thereof.

The operation of the embodiment of the present invention will be described. First, before starting processing of the wafer W, the resist solution is stored in the resist solution storage unit 4. For example, valve V 407 first supplies N ₂ gas to the main tank 410, and the pressure in the main tank 410 is increased. Further, with the tube valve 403 closed, the valves V401, V404, and V405 are opened. Thereby, the resist solution stored in the main tank 410 passes through the filter 402 via the resist solution supply pipe 401 and flows into the return pipe 404. Then, the valve V401 is closed, the pump 405 is driven, the resist solution is allowed to flow through the circulation path, and the filter 402 is repeatedly passed to increase the cleanliness.

  Thereafter, the valves V404 and V405 are closed and the valve V401 and the tube valve 403 are opened. As a result, the resist solution having a high degree of cleanliness is supplied to the resist solution reservoir 4. This operation is repeated to clean the resist solution and sequentially store it in the resist solution storage unit 4. At this time, in the resist solution storage unit 4, the opening 42 of the main body 40 is closed by the lid 41, and the solvent atmosphere is supplied from the solvent atmosphere supply pipe 25 into the main body 40. I am waiting in the state. In addition, when the resist solution is stored in the resist solution storage unit 4 and kept on standby, the resist in the resist solution supply system 400A is operated by driving the pump 405 with the tube valve 403 and V401 closed and V404 and V405 opened. Make a liquid flow in the liquid. This suppresses the generation of particles due to the precipitation of components in the resist solution.

  Subsequently, a resist supply process to the wafer W will be described. For example, when the wafer W, which is a substrate to be processed, is delivered to the spin chuck 21, the nozzle unit 5 then moves above the nozzle holder 8. The nozzle unit 5 is further lowered, and the nozzle holding unit 7 holds and raises the resist solution nozzle 6 for performing the liquid process on the wafer W. Subsequently, the resist solution nozzle 6 cleans the resist solution nozzle 6 in the cleaning solution reservoir 90 and dries the resist solution nozzle 6 in the drying tank 91. Thereafter, the resist solution nozzle 6 sucks the resist solution stored in the resist solution storage unit 4. In each of the cleaning solution storage unit 90, the drying tank 91, and the resist solution storage unit 4, since the operation when advancing and retracting the nozzle unit 60 in the main body unit 40 is the same, the resist solution in the resist solution storage unit 4 is here An example of advancing and retracting the nozzle 6 will be described.

For example, in the resist solution reservoir 4, as shown in FIG. 16, the resist solution nozzle 6 stands by above the resist solution reservoir 4, and as shown in FIG. The positions of the holes 46 are not aligned, and the angle θ between the opening 42 of the main body 40 and the hole 46 of the lid 41 is separated.
Next, as shown in FIG. 18, the resist solution nozzle 6 is lowered, and the projection 64 at the tip of the bellows 61 is engaged with the step 48. As a result, the upper portion of the hole 46 and the tip of the nozzle portion 60 are sealed by the bellows 61. At this time, as shown in FIG. 19, the positions of the opening 42 of the main body 40 and the hole 46 of the lid 41 are not aligned.

Subsequently, as shown in FIGS. 20 and 21, the main body 40 is rotated counterclockwise around the vertical axis by an angle θ as viewed from above. Thereby, as shown in FIG. 21, the positions of the hole 46 of the lid 41 and the opening 42 of the main body 40 are aligned. Thus, the opening 42 of the main body 40 is located below the nozzle 60 of the resist solution nozzle 6.
When the nozzle unit 5 is lowered with the hole 46 of the lid 41 aligned with the position of the opening 42 of the main body 40 as shown in FIGS. Since 64 is engaged with the step 48 around the hole 46, the descent is restricted and contracted, and only the nozzle 60 enters the resist solution reservoir 4. Then, for example, the nozzle unit 60 is made negative pressure by the suction unit 66 to suction the resist solution. Thereafter, when the resist solution nozzle 6 is withdrawn to the outside of the resist solution reservoir 4, the resist solution nozzle 6 is operated in the reverse order to that when the resist solution nozzle 6 is advanced to the resist solution reservoir 4. Then, the opening 42 is closed, and the resist solution nozzle 6 is retracted to the outside of the resist solution reservoir 4.

  Therefore, in the above-described embodiment, the resist solution nozzle 6 first moves above the cleaning liquid reservoir 90 and enters the cleaning liquid reservoir 90. Then, the cleaning solution is sucked into the resist solution nozzle 6 in the cleaning solution storage unit 90, and the suctioned cleaning solution is discharged into the cleaning solution storage unit 90. The suction of the cleaning liquid and the discharge of the cleaning liquid are alternately repeated a plurality of times. As a result, particles and the like adhering to the nozzle unit 60 are washed away and removed.

  Next, the resist solution nozzle 6 is moved to the upper side of the drying tank 91, and the same operation as when the nozzle unit 60 is inserted into the cleaning liquid storage unit 90 as described above is performed to bring the nozzle unit 60 into the drying tank 91. Let in. Then, air is blown to the nozzle unit 60 to dry it. Furthermore, the nozzle portion 60 is pulled out of the drying tank 91 in the same manner as when the nozzle portion 60 is pulled out of the cleaning liquid storage portion 90, and the projection 64 of the bellows 61 is pulled away from the step 48.

Subsequently, the resist solution nozzle 6 is moved to the upper side of the resist solution storage unit 4, the nozzle unit 60 is made to enter the resist solution storage unit 4 as described above, and the tip of the nozzle unit 60 is immersed in the resist solution. Further, a negative pressure is applied to the inside of the resist solution nozzle 6 by the suction unit 66, whereby a predetermined amount of resist solution is sucked into the resist solution nozzle 6.
Thereafter, as described above, the nozzle unit 5 is raised, the nozzle unit 60 is pulled out from the resist solution storage unit 4, and the nozzle unit 5 is further raised to separate the projection 64 of the bellows 61 from the step 48. Then, the wafer W is moved above the wafer W held by the spin chuck 21 and, for example, all the resist liquid in the resist liquid nozzle 6 is discharged toward the rotating wafer W to perform liquid processing.

  Further, after the resist solution is discharged, the resist solution nozzle 6 is moved to the upper side of the resist solution storage unit 4, and similarly, the nozzle unit 60 is inserted into the resist solution storage unit 4 to suck the resist solution. Then, in the cup module 1, the processed wafer W is unloaded, and the subsequent wafer W is delivered to the cup module 1. Subsequently, the resist solution nozzle is moved to the upper side of the cup module 1 to supply the resist solution to the wafer W.

  When the processing of the wafer W is performed as described above, for example, processing of the wafer W of the lot is completed, the nozzle unit 5 is moved above the nozzle holder 8 and the resist solution nozzle 6 mounted on the nozzle unit 5 is held. At the hole 81, the resist solution nozzle 6 is removed. Thereafter, the nozzle unit 5 holds the resist solution nozzle 6 used for the subsequent lot and performs the same process.

  According to the above-described embodiment, the resist solution in the resist solution reservoir 4 is directly suctioned by the resist solution nozzle 6 and then supplied to the wafer W. Therefore, it is unnecessary to supply the resist solution to the resist solution nozzle 6 from the intermediate tank and dispense the dispense valve etc., which is a device for discharging the resist solution from the resist solution nozzle 6, and the number of parts provided in the piping can be reduced. . Accordingly, the generation of particles in the resist solution can be suppressed, and the aggregation of the polymer starting from the particles, which is taken into the film and becomes a defect, can be suppressed. In addition, since there is no pipe for supplying the resist liquid to the resist liquid nozzle 6 from the resist liquid reservoir 4 which is an intermediate tank for storing the resist liquid, the components in the resist liquid due to the retention of the resist liquid in the pipe Risk of precipitation of

  The resist solution reservoir 4 is provided with an opening 42 which is opened and closed by rotating the main body 40 around a vertical axis, and the resist solution nozzle 6 is provided with a bellows 61 so as to surround the tip of the nozzle 60. ing. As a result, the tip of the bellows is locked to the lid 41, and the tip of the resist solution nozzle 6 and the hole 46 are partitioned from the outside air of the bellows 61, and the opening 42 can be opened and closed. Therefore, the inside of the resist solution reservoir 4 can be prevented from being exposed to the atmosphere outside the resist solution reservoir 4 and the bellows 61 without releasing the mist to the outside air and preventing the deterioration of the resist solution stored in the resist solution reservoir 4. . Further, since it is possible to prevent the mist from scattering, there is an effect that it can be provided in a place where the downflow is not effective.

Further, for example, the valve V43 of the resist solution reservoir 4 is opened. Furthermore, N ₂ gas is supplied into the resist solution storage unit 4 to increase the pressure in the resist solution storage unit 4 and the resist solution is flushed away. Furthermore, the cleaning liquid can be supplied into the resist solution reservoir 4 to clean the inside of the resist solution reservoir 4.
Further, according to the present invention, the number of members in contact with the resist solution decreases until the resist solution stored in the resist solution storage unit 4 is supplied to the wafer W. Therefore, it is possible to suppress the elution of the component contained in the member in contact with the resist solution into the resist solution, and it is possible to shorten the time for cleaning the parts.

  Further, when the resist solution is passed through the filter 402 for cleaning, in order to efficiently remove the impurities by the filter 402, it is necessary to slow the flow rate of the resist solution when passing the filter 402. Therefore, in the case of the processing liquid supply system in which the resist liquid nozzle 6 and the filter 402 are integrally configured, the filter 402 efficiently generates impurities when the resist liquid is caused to flow so as to achieve the discharge speed of the resist liquid. Can not be removed. In the above-described embodiment, the resist solution nozzle 6 and the system for passing the resist solution to perform filtering are independent of each other. Therefore, the removal efficiency of impurities by the filter 402 is not limited by the discharge speed of the resist solution.

  Further, in the case of a configuration in which a nozzle for supplying a common processing liquid to a plurality of liquid processing units is provided, if a processing liquid supply pipe is connected to the resist liquid nozzle 6 to supply a resist liquid, the resist Depending on the position of the cup module 1 at which the liquid nozzle 6 moves, the amount of liquid at the tip of the resist liquid nozzle 6 may fluctuate due to the deflection of the processing liquid supply pipe or the movement of the resist liquid in the processing liquid supply pipe. According to the embodiment of the present invention, the resist solution is sucked from the tip of the resist solution nozzle 6 to supply the resist solution to the resist solution nozzle 6. Therefore, it becomes difficult to produce the difference of the quantity of the process liquid discharged from a nozzle regardless of the position of the moved cup module 1 between the cup modules 1. As shown in FIG. This reduces the limitations of the device layout.

  Further, only the amount of resist solution to be discharged to the resist solution nozzle 6 can be sucked into the resist solution nozzle, and all amounts of resist solution sucked to the resist solution nozzle 6 can be supplied to the wafer W. Therefore, there is an effect that the difference in the discharge amount of the resist solution nozzle 6 due to the deflection in the pipe for sending the resist solution to the resist solution nozzle 6 and the difference in the liquid shortage when closing the valve hardly occurs. In the present invention, the resist solution sucked into the resist solution nozzle 6 may be imaged by, for example, a camera, and may be discharged onto the wafer W after confirming whether the suction amount is a predetermined amount. Furthermore, since there is no need to provide piping or the like for performing dummy dispensing, space can be reduced.

  Further, according to the present invention, the resist solution nozzle 6 is configured to be removable from the nozzle unit 5 and, in addition to the nozzle holder 8, plural types of nozzles having different discharge volumes and different materials are disposed. Therefore, the resist solution nozzle 6 can be easily replaced for each recipe of the wafer W. Also, when the resist solution nozzle 6 becomes dirty, it can be replaced quickly.

  In the liquid processing apparatus according to the embodiment of the present invention, a liquid flow may be formed in the resist liquid stored in the resist liquid storage unit 4 to form a liquid flow forming mechanism that suppresses the deposition of particles. For example, a peristaltic mechanism is provided below the resist solution storage unit 4 to oscillate the main body 40 laterally to form a liquid flow. With this configuration, the resist solution stored in the resist solution storage portion 4 can be shaken to form a liquid flow, and therefore, the deposition of particles can be suppressed. Moreover, it may replace with a peristaltic mechanism and may provide the stirrer which rotates a magnetic stirring element thrown in in the main-body part 40 by magnetic force, and forms a liquid flow.

  Moreover, the other example of the nozzle holding part 7 is demonstrated. As shown in FIG. 24, in the nozzle holding portion 7, drive guide portions 71 that move along the guides 70 extending forward and backward of the nozzle unit 5 are provided side by side in the front-rear direction. Then, the base end of the resist solution nozzle 6 may be configured to be sandwiched and fixed from the front and the back.

  Further, as shown in FIG. 25, the lower surface of the nozzle unit 5 is provided with a tubular projection 72 communicating with the gas flow passage 65, and the tubular projection 72 is inserted from the proximal end side of the nozzle 60. The resist solution nozzle 6 may be configured to be held by the nozzle unit 5 by the frictional force between the outer periphery and the inner peripheral surface of the nozzle unit 60. Furthermore, in the case of such a configuration, the resist solution nozzle 6 inserted in the tubular projection 72 is pushed downward to project around the periphery of the tubular projection 72, and the nozzle unit 5 protrudes for removal. It's possible to sink it. The same effect is obtained when configured in this way. Further, a tubular projection 72 as shown in FIG. 25 is inserted into the resist solution nozzle 6, and the resist solution nozzle 6 is fixed by the drive guide 71 as shown in FIG. 24 or the throttling mechanism shown in the embodiment. You may do it.

  In the present invention, the resist solution stored in the resist solution storage unit 4 may be returned to the resist solution supply pipe 401 to increase the degree of cleanliness. For example, a pipe for returning the liquid to the secondary side of the pump 405 in the return pipe 404 may be provided together with the drainage pipe 43. The resist solution stored in the resist solution reservoir 4 is suctioned by the resist solution nozzle 6, for example, and the resist solution stored in the resist solution reservoir 4 is processed while the wafer W is processed. It returns to the return line 404. After that, the pump 405 may be driven to circulate the resist solution, and the filter solution may be repeatedly passed, and the resist solution supply pipe 401 may be returned to the resist solution reservoir 4. Further, regardless of whether or not the filter 402 is provided, the resist solution is continuously circulated through the resist solution supply pipe 401 and the return pipe 404, thereby suppressing the deposition of the resist solution component due to the retention.

Further, in the above-described embodiment, the piping system constituting the suction and discharge mechanism for sucking and discharging the resist solution into the resist solution nozzle 6 and the piping system for circulating the resist solution are independent of each other. ing. Therefore, the resist solution is filled in the resist solution nozzle 6, and the operation of discharging the resist solution from the resist solution nozzle 6 and the operation of circulating the resist solution do not interfere with each other and are performed simultaneously. be able to. In addition, when replenishing the resist solution to the resist solution storage unit 4, the N ₂ gas is supplied to the gas phase of the main tank 410 to increase the pressure in the main tank 410. Can be replenished with the resist solution. Therefore, it is possible to keep circulating the resist solution supply pipe 401 and the return pipe 404 without affecting the resist solution replenishment operation to the resist solution storage part 4. Therefore, the resist solution can be circulated even during the discharge suction operation of the resist solution and the replenishment of the resist solution to the resist solution storage part 4, and the deposition of the component in the resist solution can be further suppressed.

The resist solution supply system 400A may not have a circulation path. Also in this case, the gas can be supplied to the main tank 410 to increase the internal pressure and supply it to the resist solution reservoir 4. There is an effect that the mixing of particles can be suppressed.
Further, in the configuration in which a plurality of cup modules 1 are provided, the cleaning solution storage unit 90 and the drying tank 91 may be provided for each of the cup modules 1 or provided common to all the cup modules 1 Also good

Further, the bellows 61 may be provided around the hole 46 of the lid 41 on the resist liquid storage 4, the cleaning liquid storage 90, and the drying tank 91 side, not on the nozzle 60 side. In this case, the same effect can be obtained by inserting the nozzle portion 60 into the bellows 61 and opening the opening 42 thereafter. Alternatively, the bellows 61 may be provided on both the nozzle portion 60 side and the lid portion 41 side. In this case, both the bellows on the nozzle portion 60 side and the bellows on the lid portion 41 side may be engaged to be airtight.
In addition, with regard to the thinner nozzle 57, the resist solution nozzle 6 may be configured in the same manner, and a thinner storage portion having the same configuration as the resist solution reservoir 4 may be provided in the liquid processing apparatus.

  Further, in the above-described embodiment, as shown in FIG. 26, the resist solution supply system 400A is provided for each of the unit blocks B1 to B4 for performing each resist film formation process COT, and the main tank 410 common to each resist solution supply system 400A. Is provided. Further, a developing solution supply system 400B having substantially the same configuration as that of the resist solution supply system 400A is provided for each of the unit blocks B5 and B6 performing the developing process DEV of two layers, and a main tank 411 of common developing solution is provided. Further, main tanks 410 and 411 may be provided for each layer.

  Further, as shown in FIG. 27, the heating unit for heating the resist solution storage unit 4 is provided with a light absorber 490 around the main unit 40, for example, the light absorber is irradiated with infrared light by an infrared lamp Alternatively, the resist solution reservoir may be heated by generating heat. Further, in addition to the heating mechanism, a cooling pipe may be provided around the main body 40 for passing cooling water cooled by a peltier or the like.

  The opening and closing mechanism for opening and closing the opening 42 of the resist solution reservoir 4 may be configured to rotate the lid 41 around the vertical axis. Alternatively, the opening and closing mechanism may be configured to slide the flat plate, for example, to close the opening 42. Further, the opening may be opened and closed by a diaphragm mechanism. For example, as shown in FIG. 28, except for the cover 41 in the resist solution storage 4 shown in FIG. 7, the aperture mechanism 420 is provided in the opening 42. A step 48 for locking the projection 64 is formed around the opening 42. In such a configuration, for example, before the resist solution is suctioned by the resist solution nozzle 6, the resist solution storage unit 4 stores the resist solution and stands by in a state where the throttling mechanism is closed.

Then, as shown in FIG. 29, the resist solution nozzle 6 is lowered, and the projection 64 is engaged with the step 48 in a state where the throttling mechanism 420 is closed. Next, as shown in FIG. 30, the throttling mechanism 420 is opened while the projection 64 is locked to the step 48. Thereafter, as shown in FIG. 31, the resist solution nozzle 6 may be lowered to allow the nozzle portion 60 to enter the main body portion 40.
Although the same effect can be obtained also in such a configuration, the opening 42 is opened and closed by relatively rotating the lid 41 and the main body 40 around the vertical axis. Since there is no need to arrange a mechanism for driving above the portion 42, an effect of reducing the possibility of particles generated by the driving mechanism in the resist solution storage portion 4 can be obtained.

  Moreover, the nozzle unit 5 which concerns on the other example of embodiment of this invention is demonstrated. As shown in FIG. 32, the nozzle unit 5 includes a resist solution nozzle 206, and one end of a resist solution supply pipe 203 is connected to a position near the tip of the resist solution nozzle 206. The other end of the resist solution supply pipe 203 is connected to the main bottle 401 via a filter 204 and a valve V203 in this order. Further, a piston 202 is provided inside the resist solution nozzle 206 on the base end side of the connection position of the resist solution supply pipe 203 in the resist solution nozzle 206, and the piston is connected with an elevation mechanism 201 for moving the piston 202 up and down. There is. By raising the piston, the inside of the resist solution nozzle 206 becomes negative pressure, and by lowering the piston, the resist solution is discharged from the tip of the resist solution nozzle 206.

  Further, a lid 20 is provided so as to cover the tip of the resist solution nozzle 6, and an opening / closing mechanism 209 is provided on the surface of the lid 208 in the direction in which the resist solution is discharged. The opening / closing mechanism 209 can adopt a configuration using a throttling mechanism. Note that reference numeral 207 in the figure denotes a camera for measuring the amount of liquid sucked into the resist liquid nozzle 206. Further, a valve may be provided on the tip side of the connection position of the resist solution supply pipe 203 in the resist solution nozzle 206.

  In this configuration, the piston 202 is raised to suck the resist solution on the main tank 410 side and supply it to the resist solution nozzle 206. Thereafter, the resist solution nozzle 206 is moved above the wafer W, the opening / closing mechanism 209 is opened, and the nozzle unit 5 is lowered to supply the resist solution to the wafer W. With this configuration, when the resist solution is supplied to the resist solution nozzle 106, the resist solution can be sucked by the piston 202 and the resist solution can be supplied to the resist solution nozzle 206. Therefore, since it is not necessary to provide the resist solution supply pipe 203 with a pump, it is possible to suppress the mixing of particles into the resist solution.

Reference Signs List 1 cup body 4 resist solution reservoir 6 resist solution nozzle 10 resist application unit 40 main body 41 lid 42 opening 48 step 48 step 60 nozzle 61 bellows 64 protrusion 90 cleaning fluid reservoir 91 drying tank 404 return pipeline 410 main tank

Claims (8)

In an apparatus for processing a substrate with a processing liquid,
A processing solution tank for storing the processing solution and provided with a processing solution outlet on the top surface,
A nozzle having a function of suction and discharge of treatment liquid;
A nozzle moving mechanism for moving the nozzle between a position inserted into the outlet and a position discharged onto the substrate;
An opening and closing mechanism for opening and closing the outlet;
And a blocking mechanism for blocking the inside of the processing liquid tank from the open air when the nozzle is inserted into the takeout port. The processing liquid tank is provided on a tank main body having a first opening at a position of an upper surface off the center of the processing liquid tank, and is provided on the upper surface side of the tank main body, and overlaps the first opening. A lid having a first opening and a second opening forming the take-out port when the second opening is formed;
The opening and closing mechanism includes a mechanism for relatively rotating the tank body and the lid between a position where the first opening and the second opening overlap each other and a position where the first opening and the second opening do not overlap each other. The processing liquid supply apparatus according to claim 1, wherein   The processing liquid supply apparatus according to claim 2, wherein the opening and closing mechanism includes a mechanism for fixing the lid and a mechanism for rotating the tank body.   The blocking mechanism is configured to surround at least one of the nozzle and the processing liquid tank such that the upper end thereof is in close contact with the root portion of the nozzle when the nozzle is inserted into the outlet. The processing liquid supply apparatus according to any one of claims 1 to 3, wherein the processing liquid supply apparatus is configured by a bellows body. A replenishment storage unit in which the processing liquid to be replenished to the processing liquid tank is stored;
5. A treatment liquid supply passage including a circulation passage provided between the replenishment storage unit and the treatment liquid tank and including a pump unit interposed therein. The liquid processing apparatus as described in a term.   The liquid processing apparatus according to any one of claims 1 to 5, further comprising a liquid flow forming mechanism that forms a liquid flow in the processing liquid stored in the processing liquid storage unit. It has a cleaning solution tank that stores the cleaning solution and has an entrance on the top side where the nozzle moves back and forth.
The nozzle moving mechanism moves the nozzle between a position inserted into the outlet, a position discharged onto the substrate, and the entrance.
The liquid processing apparatus according to any one of claims 1 to 6, wherein the nozzle is made to enter the cleaning liquid tank through the inlet and the nozzle is cleaned. A suction process in which the nozzle is inserted into the outlet using the liquid processing apparatus according to claim 5, and the processing liquid in the processing liquid tank is sucked by the nozzle.
Subsequently, a discharge step of supplying a processing liquid to the substrate from the nozzle portion
A replenishing step of replenishing the treatment liquid tank stored in the replenishment storage unit to the treatment liquid tank via the flow path;
And D. a circulating step of circulating the processing solution in a circulation path by the pump unit,
The liquid processing method according to claim 1, wherein the circulating step is performed to overlap at least one of the suction step, the discharging step, and the refilling step.

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