JP2019093466A - Method for assembling elastic membrane to head body, assembling jig and assembling system - Google Patents

Abstract

To provide a method that can assemble an elastic membrane to a head body while resolving variation in deformation level of the elastic membrane.SOLUTION: A method for assembling an elastically deformable elastic membrane 10 formed with a plurality of pressure chambers 16 for pressing a substrate W, to a head body 2 assembles the elastic membrane 10 to the head body 2 while compressing or decompressing the pressure chambers 16.SELECTED DRAWING: Figure 14

Description

  The present invention relates to a method of assembling an elastic film to a head body, an assembling jig, and an assembling system.

  A polishing apparatus for performing CMP includes a polishing table for supporting a polishing pad, and a substrate holding device called a top ring or a polishing head for holding a wafer. When polishing a wafer using such a polishing apparatus, the wafer is pressed by a predetermined pressure against the polishing surface of the polishing pad while holding the wafer by the substrate holding device. At this time, by moving the polishing table and the substrate holding device relative to each other, the wafer is in sliding contact with the polishing surface, and the surface of the wafer is polished.

  If the relative pressure between the wafer being polished and the polishing surface of the polishing pad is not uniform across the entire surface of the wafer, insufficient or excessive polishing may occur depending on the pressure applied to each portion of the wafer. It will occur. Therefore, in order to equalize the pressing force against the wafer, a pressure chamber formed of a flexible elastic film (membrane) is provided at the lower part of the substrate holding device, and a fluid such as air is supplied to the pressure chamber. The wafer is pressed by fluid pressure through the

Unexamined-Japanese-Patent No. 2017-39176 JP, 2017-164895, A Unexamined-Japanese-Patent No. 2006-128582

  The polishing head comprises a head body for pressing the wafer against the polishing surface, and an elastic film connected to the lower surface of the head body. The polishing head is assembled through a process including an assembly process of the elastic film to the head body. The elastic film is assembled to the head body at atmospheric pressure.

  However, since the elastic film is formed of a flexible material such as silicone rubber, in the natural state (atmospheric pressure state), the elastic film deforms due to its own weight and / or the inherent bending of the elastic film. The condition is uneven. In particular, since the partition wall which is a part of the peripheral wall of the elastic film is thin, when the elastic film is assembled to the head body, the elastic film is likely to be deformed (such as bending).

  When polishing a wafer, a pressurized fluid is supplied to a pressure chamber formed in an elastic film to pressurize the pressure chamber. The elastic film plays a role of transmitting the internal pressure to the wafer, so if there is variation in the deformation of the elastic film, this variation (i.e., non-uniformity of deformation of the elastic film) is determined by the polishing rate of the wafer. May affect the uniformity of the

  In order to control the polishing pressure more precisely, the polishing head needs to be provided with a pressure chamber divided by an elastic film of low hardness and a large number of partitions. However, due to the low hardness of the elastic film, the nonuniformity of deformation of the elastic film at the time of assembly of the elastic film to the head body is increased, and the number of partition walls is increased. Also increases. From these facts, when assembling the elastic film to the head body, it is required to make the deformation of the peripheral wall of the elastic film including the partition wall and the side wall uniform in the circumferential direction.

  The polishing head comprises an elastic film and a plurality of components. For example, the plurality of constituent members are configured of a first member to which the elastic film is connected, and a second member to which the first member is fixed. The first member is fixed to the second member by using a screw or a dedicated fastener. More specifically, the fixing device draws the first member toward the second member by its operation to bring the first member into close contact with the second member. The first member is secured to the second member by the fastener.

  However, due to design constraints, the strength of the first member may need to be reduced. In this case, the first member can not withstand the local pulling force of the fixing tool and may be broken. Not only the first member but also the fixing tool may be damaged.

Therefore, an object of the present invention is to provide a method in which the elastic film can be assembled to the head body while eliminating the variation in the degree of deformation of the elastic film.
An object of the present invention is to provide a method of assembling an elastic film to a head body capable of preventing damage to a first member (coupling ring) and an assembling jig.
An object of the present invention is to provide an assembly system capable of preventing damage to the first member (connection ring) while eliminating variations in the degree of deformation of the elastic film.

  One aspect is a method of assembling an elastically deformable elastic film in which a plurality of pressure chambers for pressing a substrate is formed, to the head body, the elasticity in a state where the plurality of pressure chambers are pressurized or depressurized A membrane is assembled to the head body.

In a preferred aspect, the elastic membrane is provided with a plurality of peripheral walls forming the plurality of pressure chambers, and a plurality of sealing projections formed at the end of the plurality of peripheral walls, and the plurality of sealing projections And a step of respectively fitting in a plurality of seal grooves formed in the head body.
In a preferred aspect, the method further includes the step of preparing the head main body including a plurality of connection rings in which the plurality of seal grooves are respectively formed and a carrier to which the plurality of connection rings can be closely attached; And fitting the plurality of connection rings to the plurality of connection rings, bringing the plurality of connection rings and the carrier into close contact with each other, and fitting the plurality of seal protrusions to the plurality of seal grooves. And the process of respectively pressing.
A preferred embodiment includes the step of connecting a fluid transfer pipe to through holes formed in the head body and communicating with the plurality of pressure chambers, wherein the step of assembling the elastic membrane to the head body is the fluid transfer It is characterized in that the plurality of pressure chambers are pressurized or depressurized by the operation of a compression device or a vacuum device connected to a tube.

  Another aspect is a method of assembling an elastically deformable elastic film in which a plurality of pressure chambers for pressing a substrate are formed to a head main body, and a plurality of connection rings to which the elastic film can be connected; Preparing the head body including a carrier to which the connection ring can be closely attached, a jig base having an accommodation recess having a size capable of accommodating the elastic film and the head body, and the accommodation recess The step of preparing a closable jig plate, the step of connecting the elastic film to the plurality of connection rings, and the plurality of connection rings while forming a gap between the plurality of connection rings and the carrier Fitting the carrier onto the carrier, attaching the carrier having the plurality of coupling rings fitted thereto to the jig plate, the elastic film, the plurality of coupling rings, and In the state where the carrier is housed in the housing recess, the jig plate is used as the jig until the step of closing the housing recess with the jig plate and the plurality of connection rings and the carrier are in close contact with each other. And approaching the base.

In a preferred aspect, a process of preparing the elastic membrane including a plurality of peripheral walls forming the plurality of pressure chambers and a plurality of sealing protrusions formed on an end of the plurality of peripheral walls, and the plurality of connection rings Fitting the plurality of seal projections into the plurality of formed seal grooves, and bringing the jig plate into proximity with the jig base, the plurality of seal projections respectively correspond to the plurality of seal grooves. It is characterized in that it is performed until it is pressed.
In a preferred aspect, the communication hole is formed in the communication hole with the communication hole formed in the jig plate and the through hole formed in the head main body and communicating with each of the plurality of pressure chambers. The method may further include the steps of connecting a transfer pipe, and operating a compressor or a vacuum device connected to the fluid transfer pipe to pressurize or depressurize the plurality of pressure chambers.

  Yet another aspect is a head body comprising a plurality of connection rings to which an elastically deformable elastic film to which a plurality of pressure chambers for pressing a substrate are formed can be connected and a carrier to which the plurality of connection rings can be closely attached. An assembling jig for assembling the elastic film, wherein the assembling jig is a jig base having a housing recess having a size capable of housing the elastic film and the head main body, and the carrier A clearance is formed between a jig plate that can be attached and that can close the housing recess, a fastener that can fasten the carrier and the jig plate, and the plurality of connection rings and the carrier A clamper for bringing the jig plate into proximity to the jig base until the plurality of connection rings accommodated in the accommodation recess and the carrier are in close contact with each other Characterized in that it comprises.

  In a preferred aspect, the assembling jig further includes a buffer member disposed in the accommodation recess and capable of contacting the lower surface of the elastic film.

  Still another aspect is provided with the above-described assembly jig and a fluid transfer device connected to the assembly jig, wherein the jig plate is formed on the head body and is provided for each of the plurality of pressure chambers. A communication hole is formed which can communicate with the through hole, and the fluid transfer device includes a fluid transfer pipe connectable to the communication hole, a compression device for pressurizing the plurality of pressure chambers, or the plurality of pressure chambers A vacuum device for reducing pressure, and the compression device or the vacuum device is connected to the fluid transfer pipe.

  In a preferred aspect, the fluid transfer device further comprises a pressure regulator connected to the fluid transfer pipe.

By attaching the elastic film to the head main body in a state where the plurality of pressure chambers are pressurized or depressurized, it is possible to eliminate the variation in the degree of deformation of the elastic film.
By bringing the jig plate close to the jig base in a state in which the carrier in which the plurality of coupling rings are fitted is fixed to the jig plate, the plurality of coupling rings come into close contact with the carrier without using the fixture. Can. Therefore, breakage of the coupling ring can be prevented.

FIG. 1 is a view showing an embodiment of a polishing apparatus. FIG. 2 is a schematic cross-sectional view of a polishing head (substrate holding device). It is a schematic sectional drawing which shows the state in which the elastic film is connected with the head main body. It is an expanded sectional view which shows a part of elastic membrane shown in FIG. Fig.5 (a) is sectional drawing of a 3rd connection ring, FIG.5 (b) is the A arrow line view of Fig.5 (a). It is an expanded sectional view showing an example by which a pressure projection was formed in an inner skin of a ring inclined part of a connection ring. Fig.7 (a) is a top view of a fixing tool, FIG.7 (b) is the BB sectional drawing of FIG. 7 (a). FIG. 7 is a schematic view showing steps for simultaneously fixing three connection rings to a carrier using the fixtures shown in FIGS. 7A and 7B in order to connect the elastic film shown in FIG. 4 to the head body. It is. FIG. 7 is a schematic view showing steps for simultaneously fixing three connection rings to a carrier using the fixtures shown in FIGS. 7A and 7B in order to connect the elastic film shown in FIG. 4 to the head body. It is. FIG. 7 is a schematic view showing steps for simultaneously fixing three connection rings to a carrier using the fixtures shown in FIGS. 7A and 7B in order to connect the elastic film shown in FIG. 4 to the head body. It is. FIG. 7 is a schematic view showing steps for simultaneously fixing three connection rings to a carrier using the fixtures shown in FIGS. 7A and 7B in order to connect the elastic film shown in FIG. 4 to the head body. It is. 12 (a) to 12 (c) are cross-sectional views showing an elastic film assembled to the head main body in an atmospheric pressure state. FIG. 5 is a schematic perspective view showing an assembly system for assembling an elastic membrane to a head body. FIG. 1 is a partial cross-sectional view of an assembly system. It is a sectional view showing a spacer. It is a figure which shows the process of assembling | attaching an elastic film to a head main body. It is a figure which shows other embodiment of a clamper. It is a figure which shows a buffer member. It is a figure which shows the buffer member provided with the buffer step part. It is a figure which shows the deformation state of the elastic film by pressurization of a pressure chamber. FIG. 6 is a view showing an elastic film assembled to the head main body in a state in which variation in deformation of the elastic film is eliminated. FIG. 7 illustrates another embodiment of a fluid transfer device. It is a figure which shows the deformation | transformation state of an elastic membrane when changing the pressure of a pressurized fluid for every pressure chamber. It is a figure which shows the elastic membrane assembled | attached to the head main body in the state to which the pressure of the pressurized fluid was changed for every pressure chamber. It is a figure which shows a mode that several connection rings are fixed to a carrier by a fixing tool.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings to be described below, the same or corresponding components are denoted by the same reference numerals and redundant description will be omitted.

  First, the details of the polishing apparatus will be described with reference to the drawings. FIG. 1 is a view showing an embodiment of a polishing apparatus. As shown in FIG. 1, the polishing apparatus holds a polishing table 18 supporting the polishing pad 19 and a substrate holding the wafer W as an example of a substrate to be polished and pressing it against the polishing pad 19 on the polishing table 18 The substrate holding device 1 is referred to as a polishing head 1 in the following description that includes the holding device 1.

  The polishing table 18 is connected to a table motor 29 disposed below the table shaft 18a and is rotatable around the table shaft 18a. The polishing pad 19 is attached to the upper surface of the polishing table 18, and the surface 19a of the polishing pad 19 constitutes a polishing surface on which the wafer W is polished. A polishing liquid supply nozzle 25 is installed above the polishing table 18, and the polishing liquid Q is supplied onto the polishing pad 19 on the polishing table 18 by the polishing liquid supply nozzle 25.

  The polishing head 1 includes a head main body 2 that presses the wafer W against the polishing surface 19 a, and a retainer ring 3 that holds the wafer W and prevents the wafer W from jumping out of the polishing head 1. The polishing head 1 is connected to a head shaft 27, and the head shaft 27 is moved up and down with respect to a head arm 64 by an up and down movement mechanism 81. By the vertical movement of the head shaft 27, the entire polishing head 1 is moved up and down and positioned relative to the head arm 64. A rotary joint 82 is attached to the upper end of the head shaft 27.

  Vertical movement mechanism 81 for moving head shaft 27 and polishing head 1 up and down is supported by bridge 84 rotatably supporting head shaft 27 via bearing 83, ball screw 88 attached to bridge 84, and support column 86 And a servomotor 90 provided on the support base 85. A support 85 supporting the servomotor 90 is fixed to the head arm 64 via a support 86.

  The ball screw 88 includes a screw shaft 88 a connected to the servomotor 90 and a nut 88 b with which the screw shaft 88 a is screwed. The head shaft 27 moves up and down integrally with the bridge 84. Therefore, when the servomotor 90 is driven, the bridge 84 moves up and down via the ball screw 88, thereby moving the head shaft 27 and the polishing head 1 up and down.

  The head shaft 27 is connected to the rotary cylinder 66 via a key (not shown). The rotary cylinder 66 is provided with a timing pulley 67 at its outer peripheral portion. A head motor 68 is fixed to the head arm 64, and the timing pulley 67 is connected to a timing pulley 91 provided on the head motor 68 via a timing belt 69. Therefore, by rotationally driving the head motor 68, the rotary cylinder 66 and the head shaft 27 rotate integrally via the timing pulley 91, the timing belt 69, and the timing pulley 67, and the polishing head 1 rotates. The head arm 64 is supported by an arm shaft 80 rotatably supported by a frame (not shown). The polishing apparatus includes a control device 40 that controls each device in the device including the head motor 68 and the servomotor 90.

  The polishing head 1 is configured to be able to hold the wafer W on its lower surface. The head arm 64 is configured to be pivotable about the arm shaft 80, and the polishing head 1 holding the wafer W on the lower surface moves from the receiving position of the wafer W to the upper position of the polishing table 18 by the pivoting of the head arm 64. Be done.

  Polishing of the wafer W is performed as follows. The polishing head 1 and the polishing table 18 are respectively rotated, and the polishing fluid Q is supplied onto the polishing pad 19 from the polishing fluid supply nozzle 25 provided above the polishing table 18. In this state, the polishing head 1 is lowered to a predetermined position (predetermined height), and the wafer W is pressed against the polishing surface 19 a of the polishing pad 19 at this predetermined position. The wafer W is in sliding contact with the polishing surface 19 a of the polishing pad 19, whereby the surface of the wafer W is polished.

  Next, the details of the polishing head 1 will be described with reference to the drawings. FIG. 2 is a schematic cross-sectional view of the polishing head (substrate holding device) 1. As shown in FIG. 2, the polishing head 1 includes a head main body 2 for pressing the wafer W against the polishing surface 19 a, and a retainer ring 3 disposed so as to surround the wafer W. The head body 2 and the retainer ring 3 are configured to rotate integrally as the head shaft 27 rotates. The retainer ring 3 is configured to be vertically movable independently of the head body 2.

  The head body 2 includes a circular flange 41, a spacer 42 attached to the lower surface of the flange 41, and a carrier (base plate) 43 attached to the lower surface of the spacer 42. The flange 41 is connected to the head shaft 27. The carrier 43 is connected to the flange 41 via the spacer 42, and the flange 41, the spacer 42, and the carrier 43 rotate together and move up and down.

  The head body 2 having the flange 41, the spacer 42, and the carrier 43 is formed of a resin such as an engineering plastic (for example, PEEK). The flange 41 may be formed of a metal such as SUS or aluminum.

  An elastic film 10 in contact with the back surface of the wafer W is connected to the lower surface of the head body 2. The method of connecting the elastic film 10 to the head body 2 will be described later. The lower surface of the elastic film 10 constitutes a substrate holding surface 10a. The elastic film 10 has a plurality of (six in FIG. 2) annular peripheral walls 14a, 14b, 14c, 14d, 14e and 14f, and the peripheral walls 14a to 14f are arranged concentrically.

  By these peripheral walls 14a-14f, six pressure chambers between the elastic membrane 10 and the head main body 2, ie, a circular central pressure chamber 16a located at the center, and an annular edge pressure chamber 16f located at the outermost periphery, And, intermediate pressure chambers 16b, 16c, 16d and 16e are formed between the central pressure chamber 16a and the edge pressure chamber 16f.

  The pressure chambers 16a to 16f are connected to the pressure regulator 65 via the rotary joint 82, and fluid (for example, air) passes through fluid lines 73 respectively extending from the pressure regulator 65 to the pressure chambers 16a to 16f. ) Is to be supplied. The pressure regulator 65 is connected to the controller 40 so that the pressures in the six pressure chambers 16a to 16f can be independently regulated.

  Furthermore, the pressure adjusting device 65 can also generate a negative pressure in the pressure chambers 16a to 16f. As described above, in the polishing head 1, the pressure applied to the wafer W is adjusted by adjusting the pressure of the fluid supplied to the pressure chambers 16 a to 16 f formed between the head body 2 and the elastic film 10. Adjustment can be performed for each area of the wafer W.

  The elastic film 10 is formed of a flexible rubber material having excellent strength and durability, such as ethylene propylene rubber (EPDM), polyurethane rubber, silicone rubber and the like. The pressure chambers 16a to 16f are also connected to an atmosphere opening mechanism (not shown), and the pressure chambers 16a to 16f can also be opened to the atmosphere.

  The retainer ring 3 is disposed so as to surround the carrier 43 and the elastic film 10 of the head body 2. The retainer ring 3 has a ring member 3a in contact with the polishing surface 19a of the polishing pad 19 and a drive ring 3b fixed to the upper portion of the ring member 3a. The ring member 3a is coupled to the drive ring 3b by a plurality of bolts (not shown). The ring member 3 a is disposed so as to surround the outer peripheral edge of the wafer W, and holds the wafer W so that the wafer W does not protrude from the polishing head 1 while the wafer W is being polished.

  The upper portion of the retainer ring 3 is connected to an annular retainer ring pressing mechanism 60, and the retainer ring pressing mechanism 60 is uniform over the entire upper surface of the retainer ring 3 (more specifically, the upper surface of the drive ring 3b). The downward load is applied to press the lower surface of the retainer ring 3 (that is, the lower surface of the ring member 3a) against the polishing surface 19a of the polishing pad 19.

  The retainer ring pressing mechanism 60 includes an annular piston 61 fixed to the upper portion of the drive ring 3 b and an annular rolling diaphragm 62 connected to the upper surface of the piston 61. A retainer ring pressure chamber 63 is formed inside the rolling diaphragm 62. The retainer ring pressure chamber 63 is connected to the pressure regulator 65 via the rotary joint 82 and supplied with fluid (for example, air) through a fluid line 73 extending from the pressure regulator 65 to the retainer ring pressure chamber 63. It is supposed to be

  When fluid (e.g., air) is supplied from the pressure adjusting device 65 to the retainer ring pressure chamber 63, the rolling diaphragm 62 pushes the piston 61 downward, and the piston 61 pushes the entire retainer ring 3 downward. Thus, the retainer ring pressing mechanism 60 presses the lower surface of the retainer ring 3 against the polishing surface 19 a of the polishing pad 19. Furthermore, by forming a negative pressure in the retainer ring pressure chamber 63 by the pressure adjusting device 65, the entire retainer ring 3 can be raised. The retainer ring pressure chamber 63 is also connected to an atmosphere opening mechanism (not shown), and the retainer ring pressure chamber 63 can also be opened to the atmosphere.

  The retainer ring 3 is detachably coupled to the retainer ring pressing mechanism 60. More specifically, the piston 61 is formed of a magnetic material such as metal, and a plurality of magnets 99 are disposed above the drive ring 3b. When the magnets 99 attract the piston 61, the retainer ring 3 is fixed to the piston 61 by magnetic force. As a magnetic material of the piston 61, for example, corrosion-resistant magnetic stainless steel is used. The drive ring 3 b may be formed of a magnetic material, and a magnet may be disposed on the piston 61.

  The retainer ring 3 is coupled to the spherical bearing 85 via a coupling member 75. The spherical bearing 85 is disposed radially inward of the retainer ring 3. The connecting member 75 includes a shaft 76 disposed at the center of the head body 2, a hub 77 fixed to the shaft 76, and a plurality of spokes 78 radially extending from the hub 77. The shaft 76 extends in the longitudinal direction in the spherical bearing 85.

  One end of the spoke 78 is fixed to the hub 77, and the other end of the spoke 78 is fixed to the drive ring 3 b of the retainer ring 3. The hub 77, the spokes 78, and the drive ring 3b are integrally formed. A plurality of pairs of drive pins (not shown) are fixed to the carrier 43. The drive pins of each pair are disposed on both sides of each spoke 78, and the rotation of the carrier 43 is transmitted to the retainer ring 3 through the drive pins, whereby the head body 2 and the retainer ring 3 integrally rotate. .

  The shaft 76 of the connecting member 75 is vertically movably supported by a spherical bearing 85 disposed at the central portion of the head body 2. With such a configuration, the connecting member 75 and the retainer ring 3 fixed thereto are movable in the longitudinal direction with respect to the head body 2. Further, the retainer ring 3 is tiltably supported by a spherical bearing 85.

  FIG. 3 is a schematic cross-sectional view showing the elastic film 10 connected to the head main body 2, and FIG. 4 is an enlarged cross-sectional view showing a part of the elastic film 10 shown in FIG. The elastic film 10 has a circular contact portion 11 in contact with the wafer W, and a plurality of (six in FIG. 3) peripheral walls 14a, 14b, 14c, 14d, 14e, 14f connected to the contact portion 11. doing.

  As described above, these six peripheral walls 14a to 14f form six pressure chambers (i.e., the central pressure chamber 16a, the intermediate pressure chambers 16b to 16e, and the edge pressure chamber 16f). The contact portion 11 contacts the back surface of the wafer W, that is, the surface opposite to the surface to be polished, and presses the wafer W against the polishing pad 19. The peripheral walls 14a to 14f are annular peripheral walls arranged concentrically.

  The peripheral wall 14 f is the outermost peripheral wall and extends upward from the peripheral end of the contact portion 11. In the following description, the peripheral wall 14f is referred to as an edge peripheral wall (or side wall) 14f. The circumferential wall 14e is disposed radially inward of the edge circumferential wall 14f, the circumferential wall 14d is disposed radially inward of the circumferential wall 14e, the circumferential wall 14c is disposed radially inward of the circumferential wall 14d, and the circumferential wall 14b is disposed radially inward of the circumferential wall 14c. It arrange | positions and the surrounding wall 14a is arrange | positioned inside the radial direction of the surrounding wall 14b.

  In the following description, the peripheral wall 14a is referred to as a first inner peripheral wall 14a, the peripheral wall 14b is referred to as a second internal peripheral wall 14b, the peripheral wall 14c is referred to as a third internal peripheral wall 14c, and the peripheral wall 14d is referred to as a fourth internal peripheral wall 14d. 14e is referred to as a fifth inner peripheral wall 14e. The circumferential walls 14a-14e may be referred to as partitions 14a-14e. The inner peripheral walls 14 a to 14 e extend upward from the contact portion 11.

  The contact portion 11 has a plurality of through holes 17 communicating with a pressure chamber 16c formed between the second inner peripheral wall 14b and the third inner peripheral wall 14c. Only one through hole 17 is shown in FIGS. 3 and 4. When a vacuum is formed in the intermediate pressure chamber 16 c in a state in which the wafer W is in contact with the contact portion 11, the wafer W is held on the lower surface of the contact portion 11, that is, in the polishing head 1 by vacuum suction.

  Furthermore, when a fluid is supplied to the intermediate pressure chamber 16 c while the wafer W is separated from the polishing pad 19, the wafer W is released from the polishing head 1. The through hole 17 may be formed in another pressure chamber instead of the pressure chamber 16c. At this time, vacuum suction and / or release of the wafer W is performed by controlling the pressure of the pressure chamber in which the through hole 17 is formed.

  In the present embodiment, the inner peripheral walls 14a to 14e are configured as inclined peripheral walls inclined inward in the radial direction, and have the same shape. Below, the internal peripheral wall 14b comprised as an inclined peripheral wall is demonstrated.

  The inner peripheral wall 14b, which is an inclined peripheral wall, comprises a peripheral wall main body 55 extending obliquely upward from the contact portion 11, and an annular seal projection 54 formed at the tip of the peripheral wall main body 55. In the present embodiment, the seal projection 54 has a circular cross-sectional shape, and the peripheral wall main body 55 extends in the tangential direction of the seal projection 54. The inner peripheral wall 14b extends upward while being inclined radially inward at a predetermined angle θ throughout the entire area from the lower end to the upper end. The lower end of the inner peripheral wall 14b is connected to the contact portion 11, and the upper end (that is, the seal projection 54) of the inner peripheral wall 14b is connected to a connection ring (holder ring) 23a of the head main body 2 described later. The inclination angle θ of the inner peripheral wall 14b with respect to the contact portion 11 is preferably set in the range of 20 ° to 70 °.

  As shown in FIG. 4, since the inner peripheral walls 14a to 14e configured as the inclined peripheral walls have the same shape as each other, the inner peripheral walls 14a to 14e extend in parallel to each other. More specifically, peripheral wall bodies 55 of the internal peripheral walls 14a to 14e are parallel to one another. As shown in FIG. 3, a pressure chamber 16b is formed between the first inner circumferential wall 14a and the second inner circumferential wall 14b, and a pressure chamber 16c is formed between the second inner circumferential wall 14b and the third inner circumferential wall 14c. A pressure chamber 16d is formed between the third inner peripheral wall 14c and the fourth inner peripheral wall 14d, a pressure chamber 16e is formed between the fourth inner peripheral wall 14d and the fifth inner peripheral wall 14e, and a fifth inner peripheral wall 14e is formed. A pressure chamber 16f is formed between the and the peripheral wall 14f.

  Furthermore, in the elastic film 10 shown in FIGS. 3 and 4, the inner peripheral walls 14 a to 14 e configured as the inclined peripheral walls extend in parallel to one another. That is, the inclination angles θ of the peripheral wall bodies 55 of the internal peripheral walls 14a to 14e are the same. In this case, since the adjacent inner peripheral walls 14 can be arranged at extremely narrow intervals, the radial width of the pressure chamber 16 can be extremely narrowed.

  In the present embodiment, the edge peripheral wall 14 f is composed of a vertical portion 22 extending perpendicularly to the contact portion 11 and an inclined portion 28 connected to the vertical portion 22. The inclined portion 28 extends radially inward from the vertical portion 22. The inclination angle of the inclined portion 28 with respect to the contact portion 11 is the same as the inclination angle θ of the inner peripheral walls 14 a to 14 e. Although not shown, the edge peripheral wall 14 f may extend vertically from the contact portion 11 to the head body 2.

  As described above, fluid is supplied to the pressure chambers 16a to 16f through fluid lines 73 (see FIGS. 1 and 2) extending from the pressure adjusting device 65 through the rotary joint 82, respectively. Only a portion of the fluid line 73 for supplying fluid from the pressure regulator 65 to the pressure chamber 16c is shown in FIG.

  A part of the fluid line 73 shown in FIG. 3 is formed in the through hole 73a formed in the spacer 42, the through hole 73b formed in the carrier 43 and communicating with the through hole 73a, and the coupling ring 23 described later It is comprised by the through-hole 73c connected to the hole 73b. These through holes 73a, 73b, 73c have the same diameter.

  An annular recess is formed at the upper end of the through hole 73c formed in the connection ring 23, and a seal member (eg, an O-ring for sealing a gap between the connection ring 23 and the carrier 43) is formed in this recess. ) 74 is arranged. The seal member 74 prevents the fluid flowing through the through holes 73 b and 73 c from leaking from the gap between the connection ring 23 and the carrier 43. Similarly, an annular recess is formed at the upper end of the through hole 73b formed in the carrier 43, and a sealing member (for example, O--) that seals the gap between the carrier 43 and the spacer 42 is formed in this recess. Rings 44 are arranged. The seal member 44 prevents the fluid flowing through the through holes 73 a and 73 b from leaking from the gap between the spacer 42 and the carrier 43.

  The head body 2 further includes a plurality of connection rings 23a to 23e to which the inner peripheral walls 14a to 14e and the edge peripheral wall 14f are connected. The connection ring 23a is disposed between the first inner peripheral wall 14a and the second inner peripheral wall 14b, and will be referred to as a first connection ring 23a in the following description. The connection ring 23b is disposed between the second inner peripheral wall 14b and the third inner peripheral wall 14c, and will be referred to as a second connection ring 23b in the following description. The connection ring 23c is disposed between the third inner peripheral wall 14c and the fourth inner peripheral wall 14d, and will be referred to as a third connection ring 23c in the following description. The connection ring 23d is disposed between the fourth inner peripheral wall 14d and the fifth inner peripheral wall 14e, and will be referred to as a fourth connection ring 23d in the following description. The connection ring 23e is disposed between the fifth inner peripheral wall 14e and the edge peripheral wall 14f, and is referred to as a fifth connection ring 23e in the following description.

  Thus, each connection ring 23a-23e is arrange | positioned between the adjacent internal peripheral walls 14. As shown in FIG. In the present embodiment, since the first inner peripheral wall 14a is also configured as the inclined peripheral wall, the head body 2 has the connection ring 23f to which the inner peripheral wall 14a is connected. In the following description, the connection ring 23 f is referred to as an additional connection ring 23 f.

  The first connection ring 23a, the third connection ring 23c, and the fifth connection ring 23e have the same configuration as each other except for an engagement groove, a step portion, and a protrusion described later. The second connection ring 23b and the fourth connection ring 23d have the same configuration. Furthermore, the second connection ring 23b and the fourth connection ring 23d are engaged with each other in that the ring vertical portion described later is shorter than the ring vertical portion of the first connection ring 23a, the third connection ring 23c and the fifth connection ring 23e It differs from the first connection ring 23a, the third connection ring 23c and the fifth connection ring 23e in that the groove is not formed in the ring vertical portion. Hereinafter, the configuration of the third connection ring 23c will be described.

  Fig.5 (a) is sectional drawing of the 3rd connection ring 23c, FIG.5 (b) is an A arrow line view of FIG. 5 (a). In FIG. 5A, the seal member 74 is drawn by a phantom line (dotted line). The third connection ring 23 c has a ring vertical portion 50 extending perpendicularly to the carrier 43 of the head body 2, and a ring slope 51 extending downward from the ring vertical portion 50 and inclined radially outward.

  An outer peripheral surface 51 b of the ring inclined portion 51 is connected to an inner peripheral surface 51 a of the ring inclined portion 51 at a tip end 51 c of the ring inclined portion 51. Therefore, the ring inclined portion 51 has a cross-sectional shape that gradually narrows toward the tip 51 c of the ring inclined portion 51. The tip end 51c of the ring inclined portion 51 to which the inner peripheral surface 51a and the outer peripheral surface 51b are connected has a sectional shape (for example, a semicircular sectional shape) formed of a curved surface. The radius of this curved surface is preferably equal to the thickness of the inner circumferential wall in the radial direction. Further, the third connecting member 23c has a through hole 51d extending from the inner peripheral surface 51a of the ring inclined portion 51 of the third connecting member 23c to the outer peripheral surface 51b. Further, on the outer peripheral surface 51b of the ring inclined portion 51, an annular seal groove 51e extending over the entire periphery of the outer peripheral surface 51b is formed.

  As shown in FIG. 5B, on the inner peripheral surface 51a of the ring inclined portion 51 of the third connection ring 23c, a plurality of lateral grooves 63 extending in the circumferential direction of the inner peripheral surface 51a and the adjacent lateral grooves 63 are mutually A plurality of longitudinal grooves 64 to be communicated are formed. In the present embodiment, the through hole 73 c of the fluid line 73 is open to the lateral groove 63 formed in the inner circumferential surface 51 a of the ring inclined portion 51, and the through hole 51 d is different from the lateral groove 63 where the fluid line 73 is open It opens in different lateral grooves 63.

  The through holes 73 c and the through holes 51 d of the fluid line 73 may be respectively opened in the vertical grooves 64 formed in the inner peripheral surface 51 a of the ring inclined portion 51. Although not shown, the outer peripheral surface 51b of the ring inclined portion 51 of the third connection ring 23c is formed with a plurality of lateral grooves extending in the circumferential direction of the outer peripheral surface 51b and a plurality of longitudinal grooves communicating adjacent lateral grooves with each other. It is done. It is preferable that the through hole 51 d be opened in a horizontal groove or a vertical groove formed in the outer peripheral surface 51 b of the ring inclined portion 51.

  The seal projection 54 of the inner peripheral wall 14 shown in FIG. 4 is fitted in the seal groove 51 e formed on the outer peripheral surface 51 b of the ring inclined portion 51. When the elastic film 10 is connected to the head main body 2, the seal projection 54 is pressed against the bottom surface of the seal groove 51 e by the inner peripheral surface 51 a of the ring inclined portion 51 of the connection ring 23 located radially outside the seal projection 54. Be done. For example, the seal projection 54 formed at the tip of the second inner peripheral wall 14b is fitted in the seal groove 51e formed in the outer peripheral surface 51b of the ring inclined portion 51 of the first connection ring 23a, and the ring of the second connection ring 23b The inner peripheral surface 51 a of the inclined portion 51 presses the bottom surface of the seal groove 51 e of the first connection ring 23 a. Thereby, the gap between the second inner peripheral wall 14b and the outer peripheral surface 51b of the ring inclined portion 51 of the first connection ring 23a, the second inner peripheral wall 14b, and the inside of the ring inclined portion 51 of the second connection ring 23b. A gap between the peripheral surface 51a and the peripheral surface 51a is sealed. Such a configuration prevents the fluid supplied to the pressure chambers 16a to 16e from leaking from the pressure chambers 16a to 16e.

  FIG. 6 is an enlarged cross-sectional view showing an example in which the pressing projection 51 f is formed on the inner circumferential surface 51 a of the ring inclined portion 51 of the connection ring 23. As shown in FIG. 6, an annular pressing projection 51 f may be formed on the inner circumferential surface 51 a of the ring inclined portion 51 of the connection ring 23 so as to face the sealing projection 54 fitted in the sealing groove 51 e. The pressing projection 51 f extends over the entire circumference of the inner circumferential surface 51 a of the ring inclined portion 51. The pressing projection 51 f can press the sealing projection 54 against the bottom surface of the sealing groove 51 e with a strong pressing force. As a result, the fluid supplied to the pressure chambers 16a to 16e can be more effectively prevented from leaking from the pressure chambers 16a to 16e.

  As shown in FIG. 3, the inner peripheral walls 14 a to 14 e are in contact with the connection rings 23 a to 23 e only at the seal protrusions 54 respectively. That is, a gap is formed between the ring inclined portion 51 having a cross-sectional shape that gradually narrows toward the tip 51 c and the inner peripheral wall 14 other than the seal projection 54. By this gap, when the pressurized fluid is supplied to each of the pressure chambers 16a to 16f, the inner peripheral walls 14a to 14e are allowed to move in the radial direction (that is, to rotate around the seal projection 54). Ru. As a result, the elastic film 10 can be smoothly inflated according to the pressure of the fluid supplied to each of the pressure chambers 16a to 16f, so that the polishing profile can be precisely adjusted.

  As described above, when the pressurized fluid is supplied to each of the pressure chambers 16a to 16f, the elastic film 10 expands, and the connection portion between the inner peripheral walls 14a to 14f and the contact portion 11 also moves in the radial direction. However, in the portion other than the seal projection 54 of the inner peripheral walls 14a-14e, the above-mentioned gap is formed between the inner peripheral walls 14a-14e and the connection rings 23a-23e, so the radial direction of the inner peripheral walls 14a-14e Some movement is not impeded by the coupling rings 23a-23e. Therefore, the elastic membrane 10 can be expanded according to the pressure of the fluid supplied to each pressure chamber 16a-16f.

  When there is a pressure difference between the fluids supplied to the adjacent pressure chambers 16, the inner peripheral wall 14 which divides the pressure chambers 16 tends to be deformed in the radial direction. However, since the radial deformation of the inner peripheral wall 14 is limited by the inner peripheral surface 51a or the outer peripheral surface 51b of the ring inclined portion 51 of the connection ring 23, it is effective that the inner peripheral wall contacts the contact portion 11 At the same time, adjacent inner circumferential walls are effectively prevented from contacting each other. In the present embodiment, the tip end 51c of the ring inclined portion 51 of the connection ring 23 has a cross-sectional shape formed of a curved surface. Therefore, when the inner peripheral wall 14 contacts the tip end 51 c of the ring inclined portion 51, damage to the inner peripheral wall 14 can be prevented.

  As described above, the connection ring 23 extends from the inner peripheral surface 51a to the outer peripheral surface 51b, the horizontal groove 63 and the vertical groove 64 formed in the inner peripheral surface 51a and the outer peripheral surface 51b of the ring inclined portion 51. Alternatively, it has a through hole 51d opened in the longitudinal groove 64). Furthermore, through holes 73 c (see FIG. 4) of the fluid line 73 through which the fluid supplied to the pressure chambers 16 a to 16 f flows (see FIG. 4) are opened in the lateral grooves 63. Therefore, even if the inner circumferential wall 14 contacts the inner circumferential surface 51 a and / or the outer circumferential surface 51 b of the ring inclined portion 51 of the connection ring 23 due to the pressure difference of the fluid supplied to the adjacent pressure chambers 16, the fluid line 73 Fluid can be supplied to the pressure chamber 16 quickly and smoothly via the lateral groove 63 and the longitudinal groove 64 formed in the ring inclined portion 51 and the through hole 51 d. As a result, even when the inner peripheral wall 14 is in contact with the inner peripheral surface 51 a and / or the outer peripheral surface 51 b of the ring inclined portion 51 of the connection ring 23, the pressure of the fluid supplied from the fluid line 73 It can be made to act promptly.

  In the present embodiment, the polishing head 1 has a fixture 70 for simultaneously fixing the two adjacent inner peripheral walls 14 formed as the inclined peripheral walls to the head body 2 via the three connection rings 23. Hereinafter, a method of fixing the connecting ring 23 to which the elastic film 10 is connected to the head main body 2 by using the fixing tool 70 and the fixing tool 70 will be described.

  Fig.7 (a) is a top view of the fixing tool 70, FIG.7 (b) is the BB sectional drawing of FIG. 7 (a). As shown in FIGS. 7 (a) and 7 (b), the fixture 70 has a cylindrical fixture main body 71, and a collar 72 projecting outward from the outer peripheral surface of the fixture main body 71 and having an elliptical shape. Prepare. The collar 72 has two inclined surfaces 72a and 72b, and the inclined surfaces 72a and 72b extend to the outer peripheral surface of the collar 72, respectively.

  The thickness in the vertical direction of the collar 72 excluding the inclined surfaces 72a and 72b is the same as an engagement groove (described later) formed in the ring vertical portion 50 of the connection ring 23. The upper surface 71 a of the fixing tool main body 71 is formed with a groove 71 b which can be engaged with the tip of a jig (for example, a minus driver) not shown. The fixture 70 can be rotated by engaging the tip of the jig with the groove 71 b and further rotating the jig.

  Next, a method of simultaneously fixing the three connection rings 23 to the carrier 43 of the head main body 2 using the fixing tool 70 shown in FIGS. 7A and 7B will be described. When the three connection rings 23 are fixed to the carrier 43, the two adjacent inner peripheral walls 14 are simultaneously connected to the head body 2.

  In the following description, the connection ring 23 positioned radially inward of the three connection rings 23 may be referred to as the inner connection ring 23, and the connection ring 23 positioned radially outward of the three connection rings 23. May be referred to as an outer connecting ring 23, and the connecting ring 23 located between the inner connecting ring 23 and the outer connecting ring 23 may be referred to as an intermediate connecting ring. In addition, the inner peripheral wall 14 located radially inward of the two adjacent inner peripheral walls 14 configured as the inclined peripheral walls may be referred to as an inner inclined peripheral wall 14, and the two adjacent internal peripheral walls configured as the inclined peripheral walls The inner peripheral wall 14 located radially outside of the fourteen may be referred to as an outer inclined peripheral wall 14.

  FIGS. 8 to 11 show three coupling rings 23 as carriers by using the fixture 70 shown in FIGS. 7A and 7B in order to couple the elastic film 10 shown in FIG. 4 to the head main body 2. It is the schematic diagram which showed each process fixed to 43 simultaneously.

  In the elastic film 10 shown in FIG. 4, the second inner peripheral wall 14 b is the inner inclined peripheral wall 14, and the third inner peripheral wall 14 c is the outer inclined peripheral wall 14. The first connection ring 23 a is an inner connection ring 23, the second connection ring 23 b is an intermediate connection ring 23, and the third connection ring 23 c is an outer connection ring with respect to the second inner peripheral wall 14 b and the third inner peripheral wall 14 c. 23

  By fixing the connection rings 23 a to 23 c to the carrier 43 by the fixing tool 70, the second inner peripheral wall 14 b and the third inner peripheral wall 14 c are connected to the head main body 2. Similarly, the fourth inner peripheral wall 14 d is an inner inclined peripheral wall 14, and the fifth inner peripheral wall 14 e is an outer inclined peripheral wall 14. The third connection ring 23c is an inner connection ring 23, the fourth connection ring 23d is an intermediate connection ring 23, and the fifth connection ring 23e is an outer connection ring with respect to the fourth inner peripheral wall 14d and the fifth inner peripheral wall 14e. 23

  By fixing the connection rings 23 c to 23 e to the carrier 43 by the fixing tool 70, the fourth inner peripheral wall 14 d and the fifth inner peripheral wall 14 e are connected to the head main body 2. Thus, the third connection ring 23c is the outer connection ring 23 for the second inner peripheral wall 14b and the third inner peripheral wall 14c, and the inner connection for the fourth inner peripheral wall 14d and the fifth inner peripheral wall 14e. It is a ring 23.

  As shown in FIG. 8, on the upper surface 43 c of the carrier 43 of the head main body 2, a plurality of first concave portions 45 into which a plurality of fixing tools 70 are respectively inserted are formed. Each first recess 45 extends from the upper surface 43 c of the carrier 43 toward the lower surface 43 d of the carrier 43. The first recess 45 has an elliptical cross section so that the collar 72 of the fixture 70 inserted into the first recess 45 does not contact.

  Furthermore, an annular second recess 46 into which the ring vertical portion 50 of the inner connection ring 23 is inserted and an annular third recess 47 into which the ring vertical portion 50 of the intermediate connection ring 23 is inserted And a fourth recess 48 into which the ring vertical portion 50 of the outer connecting ring 23 is inserted. The second recess 46, the third recess 47, and the fourth recess 48 extend around the entire circumference of the carrier 43 and extend from the lower surface 43d of the carrier 43 to the upper surface 43c.

  An inner opening 96 is formed on the radially inner surface of the first recess 45, and an outer opening 97 is formed on the radially outer surface of the first recess 45. The first recess 45 is in communication with the second recess 46 through the inner opening 96 and in communication with the fourth recess 48 through the outer opening 97. When the fixture 70 inserted into the first recess 45 is rotated, the collar 72 of the fixture 70 protrudes through the inner opening 96 and the outer opening 97 into the interior of the second recess 46 and the fourth recess 48.

  The middle connection ring 23 is held by the inner connection ring 23 and the outer connection ring 23 so as to be held by the inner connection ring 23 and the outer connection ring 23. For example, the second connection ring 23b, which is the intermediate connection ring 23, is held by the first connection ring 23a, which is the inner connection ring 23, and the third connection ring 23c, which is the outer connection ring 23. Similarly, the fourth connection ring 23 d which is the intermediate connection ring 23 is held by the third connection ring 23 c which is the inner connection ring 23 and the fifth connection ring 23 e which is the outer connection ring 23.

  In the present embodiment, the intermediate connection ring 23 has an annular protrusion 30 projecting outward from the outer peripheral surface thereof, and the inner connection ring 23 has an annular step 31 on which the protrusion 30 is mounted. Furthermore, the outer connection ring 23 has an annular protrusion 33 projecting outward from the outer peripheral surface thereof, and the middle connection ring 23 has an annular step 34 on which the protrusion 33 is mounted. The third connection ring 23c functions as an outer connection ring 23 for the second inner peripheral wall 14b and the third inner peripheral wall 14c, and as an inner connection ring 23 for the fourth inner peripheral wall 14d and the fifth inner peripheral wall 14e. Since it functions, the third connection ring 23c has an annular protrusion 33 and an annular step 31.

  Further, the ring vertical portion 50 of the inner connection ring 23 is formed with an inner engagement groove 36 engageable with the collar 72 of the fixture 70, and the ring vertical portion 50 of the outer connection ring 23 is fixed An outer engagement groove 37 is formed, with which the collar 72 of 70 can be engaged. The third connection ring 23c functions as an outer connection ring 23 for the second inner peripheral wall 14b and the third inner peripheral wall 14c, and as an inner connection ring 23 for the fourth inner peripheral wall 14d and the fifth inner peripheral wall 14e. As it works, the third coupling ring 23c has an inner engagement groove 36 and an outer engagement groove 37.

  A seal projection formed on the tip of the inner inclined peripheral wall 14 (for example, the second inner peripheral wall 14b) in the seal groove 51e formed on the outer peripheral surface of the ring inclined portion 51 of the inner connection ring 23 (for example, the first connection ring 23a) 54 is fitted. A seal projection formed on the tip of the outer inclined peripheral wall 14 (for example, the third inner peripheral wall 14c) in the seal groove 51e formed on the outer peripheral surface of the ring inclined portion 51 of the intermediate connection ring 23 (for example, the second connection ring 23b) 54 is fitted. Further, the protrusion 30 of the intermediate connection ring 23 is placed on the step 31 of the inner connection ring 23, and the protrusion 33 of the outer connection ring 23 is placed on the step 34 of the intermediate connection ring 23. This state is shown in FIG.

  As shown in FIG. 8, the first inner peripheral wall 14 a of the elastic film 10 is also configured as an inclined peripheral wall. The first inner peripheral wall 14 a is connected to the additional connection ring 23 f and is connected to the head main body 2 by fixing the additional connection ring 23 f to the carrier 43. More specifically, the additional connection ring 23f has an inclined surface 53, and the inclined surface 53 is formed with a seal groove 53a into which the seal projection 54 formed at the tip of the first inner peripheral wall 14a is fitted. .

  The first inner peripheral wall 14a is sandwiched between the first connection ring 23a and the additional connection ring 23f in a state in which the seal projection 54 of the first inner peripheral wall 14a is fitted into the seal groove 53a of the additional connection ring 23f. The first inner peripheral wall 14a is held by the first connection ring 23a and the additional connection ring 23f.

  Furthermore, the edge peripheral wall 14 f of the elastic film 10 has an inclined portion 28. A seal projection 54 is formed at the tip of the inclined portion 28, and a seal groove 51e in which the seal projection 54 is fitted is formed on the outer peripheral surface 51b of the ring inclined portion 51 of the fifth connection ring 23e. . When connecting the elastic film 10 to the carrier 43 of the head body 2, the inner peripheral walls 14b to 14e and the edge peripheral wall 14f of the elastic film 10 are held in advance by the connecting rings 23a to 23e, and the inner peripheral wall 14a is added to the additional connecting ring 23f. Hold in advance.

  Next, as shown in FIG. 9, the elastic film 10, the connection rings 23a to 23e, and the additional connection ring 23f are moved toward the carrier 43, and the recesses formed on the lower surface 43b of the carrier 43 Insert into 46, 47, 48 (see FIG. 8). As shown in FIG. 8, the recess into which the third connection ring 23c is inserted is the fourth recess 48 with respect to the second inner peripheral wall 14b and the third inner peripheral wall 14c, while the fourth inner peripheral wall 14d and the fourth inner For the 5 inner peripheral wall 14 e, it is the second recess 46.

  Next, as shown in FIG. 10, the fixture 70 is inserted into the first recess 45 formed in the upper surface 43 c of the carrier 43, and the fixture 70 is rotated by a jig (not shown). As fixture 70 rotates, as shown in FIG. 11, collar 72 of fixture 70 passes through inner opening 96 and outer opening 97 and forms an inner engagement groove 36 formed in ring vertical portion 50 of inner connection ring 23 and They engage with the outer engagement grooves 37 formed in the ring vertical portion 50 of the outer connection ring 23 respectively.

  As shown in FIGS. 7A and 7B, the flange 72 of the fixture 70 is formed with two inclined surfaces 72a and 72b. The inclined surfaces 72a and 72b extend to the outer peripheral surface of the collar 72, respectively. The inclined surfaces 72a and 72b allow the collar 72 to smoothly enter the engagement grooves 36 and 37.

  Since the thickness of the collar 72 excluding the inclined surfaces 72a and 72b is the same as the thickness of the engagement grooves 36 and 37, the collar 72 which smoothly enters the engagement grooves 36 and 37 is strong with the engagement grooves 36 and 37 Engage in As a result, the inner connection ring (for example, the first connection ring 23a) and the outer connection ring (for example, the third connection ring 23c) are firmly fixed to the carrier 43. At this time, the intermediate connection ring 23 (for example, the second connection ring 23 b) held by the inner connection ring 23 and the outer connection ring 23 is also firmly connected to the inner connection ring 23 and the outer connection ring 23.

  Simultaneously, in the seal groove 51e in which the seal projection 54 of the inner inclined peripheral wall (for example, the second inner peripheral wall 14b) is formed in the outer peripheral surface 51b of the ring inclined portion 51 of the inner connection ring 23, the ring inclined portion 51 of the intermediate connection ring 23 is The outer connecting ring 23 is pressed by the inner peripheral surface 51a of the outer groove 51e in which the seal projection 54 of the outer inclined peripheral wall (for example, the inner peripheral wall 14c) is formed in the outer peripheral surface 51b The inner circumferential surface 51 a of the ring inclined portion 51 of the first embodiment is pressed.

  Thereby, the gap between the inner inclined circumferential wall 14 and the inner connection ring 23 a and the gap between the inner inclined circumferential wall 14 and the intermediate connection ring 23 are sealed, and the gap between the outer inclined circumferential wall 14 and the intermediate connection ring 23 is The gap and the gap between the outer sloping peripheral wall 14 and the outer connecting ring 23 are sealed. As described with reference to FIG. 6, a pressing protrusion 51 f may be formed on the inner circumferential surface 51 a of the ring inclined portion 51 of the connection ring 23 to press the sealing protrusion 54 to the sealing groove 51 e.

  The seal projection 54 of the edge peripheral wall 14f is pressed against the seal groove 51e formed on the outer peripheral surface 51b of the ring inclined portion 51 of the fifth connection ring 23e by the inclined portion 43e (see FIG. 8) formed on the lower surface of the carrier 43. Thereby, the gap between the edge peripheral wall 14f and the fifth connection ring 23e and the gap between the edge peripheral wall 14f and the carrier 43 are sealed.

  In the present embodiment, the additional connection ring 23 f is fixed to the carrier 43 by a plurality of screws 94. In the carrier 43, a through hole 43f (see FIG. 8) into which the screw 94 is inserted is formed, and a screw hole 56 extending from the upper surface to the lower surface of the additional connection ring 23f is formed. By inserting the screw 94 into the through hole 43 f and screwing the screw 94 into the screw hole 56, the additional connection ring 23 f is firmly fixed to the carrier 43.

  In the embodiment described below, the plurality of peripheral walls 14a to 14f may be simply referred to as the plurality of peripheral walls 14 without distinction, and the plurality of connection rings 23a to 23f are simply referred to as the plurality of connection rings 23 without distinction. In some cases, the plurality of pressure chambers 16 a to 16 f may be simply referred to as a plurality of pressure chambers 16 without distinction.

  Next, details of the assembly of the elastic film 10 to the head body 2 will be described with reference to the drawings. In the present embodiment, the step of attaching the elastic film 10 to the head body 2 means a step of connecting the elastic film 10 to the plurality of connection rings 23 and bringing the connection ring 23 into close contact with the carrier 43 in this state.

  In order to assemble the elastic film 10 to the head main body 2, the seal projection 54 formed on the peripheral wall 14 of the elastic film 10 is fitted into the seal groove 51 e formed on the connection ring 23, and the connection ring 23 is closely attached to the carrier 43. By assembling the elastic film 10 to the head main body 2, the peripheral walls 14 of the elastic film 10 including the inner peripheral walls (partitions) 14a to 14e and the edge peripheral walls (side walls) 14f form independent pressure chambers 16. The fluid line 73 formed in the carrier 43 and the pressure chamber 16 are connected via the through holes 73 b and 73 c by the close contact of the connection rings 23 a to 23 f to the carrier 43.

  A fixing tool 70 is used to fix the connection ring 23 to the carrier 43. The plurality of connection rings 23 are fitted to the carrier 43 such that a gap is formed between each connection ring 23 and the carrier 43. The plurality of connection rings 23 are drawn toward the carrier 43 by the rotation of the fixture 70. In this manner, the fixing tool 70 closely fixes the connection ring 23 to the carrier 43 while pulling up the plurality of connection rings 23 by its rotation.

  However, when the connection ring 23 is closely fixed to the carrier 43 by pulling up the connection ring 23, a local pulling force by the fixing tool 70 acts on the connection ring 23. Therefore, the connection ring 23 can not withstand the local pulling force by the fixture 70 and may be broken. Moreover, not only the connection ring 23 but also the fixing tool 70 may be damaged.

  FIGS. 12 (a) to 12 (c) are cross-sectional views showing the elastic film 10 assembled to the head body 2 in the atmospheric pressure state. 12 (a) shows an arbitrary cross section A of the elastic film 10, FIG. 12 (b) shows an arbitrary cross section B of the elastic film 10, and FIG. 12 (c) shows an arbitrary cross section C of the elastic film 10. It shows. These arbitrary cross sections A to C represent different cross sections of the elastic film 10.

  As described above, since the elastic film 10 is formed of a flexible material, the degree of deformation of the elastic film 10 may vary when the elastic film 10 is assembled to the head body 2. In FIG. 12A, the inclined portion 28 of the peripheral wall 14f is deformed in the direction approaching the connection ring 23e, and the inclined portion (peripheral wall main body 55) of the peripheral wall 14e is deformed in the direction approaching the connection ring 23e The inclined portion (peripheral wall main body 55) of the peripheral wall 14d is deformed in the direction approaching the connection ring 23c. In FIG. 12 (b), the inclined portion 28 of the peripheral wall 14 f is deformed in the direction approaching the carrier 43. In FIG. 12C, the inclined portion 28 of the peripheral wall 14f is deformed in the direction approaching the connection ring 23e, and the inclined portion (peripheral wall main body 55) of the peripheral wall 14d is deformed in the direction approaching the connection ring 23c. .

  The variation in the degree of deformation of the elastic film 10, that is, the nonuniformity of the deformation of the elastic film 10 may affect the uniformity of the polishing rate. Therefore, when assembling the elastic film 10 into the head main body 2, it is required to make the deformation of the peripheral wall 14 of the elastic film 10 uniform in the circumferential direction.

  Therefore, in the following embodiment, an assembly system 200 will be described. The assembly system 200 can eliminate variations in the degree of deformation of the elastic film 10, and can assemble the elastic film 10 to the head main body 2 without damaging the connection ring 23 (and / or the fixture 70). .

  FIG. 13 is a schematic perspective view showing an assembly system 200 for assembling the elastic film 10 to the head body 2. The assembly system 200 includes a fluid transfer device 250 that pressurizes or decompresses each pressure chamber 16 of the elastic film 10, and an assembly jig 201 that brings the connection ring 23 into close contact with the carrier 43.

  The assembly jig 201 can attach the carrier 43 and the jig base 202 having the accommodation recess 202a having a size capable of accommodating the elastic film 10 and the head main body 2, and can close the accommodation recess 202a. The disk-shaped jig plate 203, the fastener 204 capable of fastening the carrier 43 and the jig plate 203, and the plurality of connection rings 23 and the carrier 43 are housed in the housing recess 202a in a state where a gap is formed. The clamper 205 is provided to bring the jig plate 203 close to the jig base 202 until the plurality of connection rings 23 and the carrier 43 come into close contact with each other.

  Although a single fastener 204 is depicted in FIG. 13, the jig plate 203 and the carrier 43 can be secured by multiple (two in this embodiment) fasteners 204. The jig plate 203 is set to the jig base 202 in a state where the carrier 43 is fixed to the jig plate 203 by the plurality of fasteners 204. The plurality of fasteners 204 are arranged at equal intervals along the circumferential direction of the jig plate 203.

  The clamper 205 can connect the jig plate 203 to the jig base 202 and can prevent the carrier 43 from rising due to the pressure applied to the pressure chambers 16. Although a single clamper 205 is depicted in FIG. 13, the jig plate 203 and the jig base 202 are connected by a plurality of (four in the present embodiment) clampers 205. The plurality of clampers 205 are arranged at equal intervals along the circumferential direction of the jig plate 203.

  FIG. 14 is a partial cross-sectional view of the assembly system 200. As shown in FIG. In FIG. 14, the head body 2 and the assembling jig 201 are illustrated in cross section, and the seal members 44 and 74 are not shown. A plurality of disk-shaped jig plates 203 can be communicated with the through holes 73 (more specifically, the through holes 73 b and 73 c) formed in the head main body 2 and communicating with the plurality of pressure chambers 16. A communication hole 203a is formed. The number of communication holes 203 a corresponds to the number of pressure chambers 16.

  The fluid transfer device 250 includes a fluid transfer pipe 251 connectable to each communication hole 203 a and a fluid device 252 connected to the fluid transfer pipe 251. The fluid device 252 is a compression device that pressurizes each pressure chamber 16 by supplying pressurized fluid to each pressure chamber 16 or a vacuum device that decompresses each pressure chamber 16 by suction of fluid in each pressure chamber 16.

  The fluid transfer pipe 251 further includes a pressure gauge 253 that measures the pressure of the fluid passing through the fluid transfer pipe 251, a flow meter 254 that measures the flow rate of the fluid passing through the fluid transfer pipe 251, and the fluid transfer pipe 251. An on-off valve 255 for opening and closing the flow path and a pressure regulator 256 are connected. The fluid transfer device 250 includes the pressure gauge 253, the flow meter 254, the on-off valve 255, and the pressure regulator 256.

  The pressure regulator 256 is disposed adjacent to the fluid device 252 and the on-off valve 255 is disposed adjacent to the pressure regulator 256. The flow meter 254 is disposed adjacent to the on-off valve 255, and the pressure gauge 253 is disposed adjacent to the flow meter 254.

  The fluid transfer pipe 251 branches in the middle and is connected to each communication hole 203 a through a joint 210. When the fluid device 252 is a compression device, when the fluid device 252 is operated, pressurized fluid is supplied to each pressure chamber 16 through the fluid transfer pipe 251, and each pressure chamber 16 is pressurized. When the fluid device 252 is a vacuum device, when the fluid device 252 is operated, the fluid in each pressure chamber 16 is aspirated, and each pressure chamber 16 is depressurized.

  As shown in FIG. 14, the plurality of connection rings 23 are fitted to the carrier 43 such that a gap is formed between each connection ring 23 and the carrier 43, and the plurality of connection rings 23 are elastic. The membrane 10 is connected. When the jig plate 203 is set to the jig base 202, the elastic film 10 and the head body 2 (more specifically, the plurality of connection rings 23 and the carrier 43) are accommodated in the housing recess 202a of the jig base 202. The jig plate 203 accommodated therein closes the accommodation recess 202 a of the jig base 202.

  The jig base 202 includes a peripheral wall (inner peripheral wall) 202 b for suppressing the radial outward swelling of the edge peripheral wall 14 f. The jig plate 203 is fixed so that the elastic film 10 and the jig base 202 are arranged concentrically, that is, the circle of the edge peripheral wall 14 f and the circle of the peripheral wall 202 b of the jig base 202 are aligned. The tool base 202 is set.

  The elastic film 10 is expanded by the pressure of each pressure chamber 16, and the outer surface of the edge peripheral wall 14 f contacts the peripheral wall 202 b of the jig base 202. Since the swelling of the elastic film 10 affects the polishing characteristics of the wafer W, the inner diameter of the jig base 202 is determined so that the optimum polishing characteristics of the wafer W can be obtained. In other words, the gap between the peripheral wall 202b of the jig base 202 and the outer surface of the edge peripheral wall 14f adjacent to the peripheral wall 202b is determined such that the amount of deformation (the amount of expansion) of the elastic film 10 becomes a predetermined amount. .

  When the pressurized fluid is supplied to the edge pressure chamber 16f, the edge peripheral wall 14f of the elastic film 10 expands outward. In particular, when the edge peripheral wall 14f is excessively expanded, the seal projection 54 of the edge peripheral wall 14f may come out of the seal groove 51e and may protrude outward. The peripheral wall 202 b of the jig base 202 effectively functions as a measure against the protrusion of the seal projection 54.

  In one embodiment, the assembly jig 201 may include an annular spacer (expansion adjustment member) 220 disposed between the peripheral wall 202 b and the edge peripheral wall 14 f. FIG. 15 is a cross-sectional view showing the spacer 220. As shown in FIG. By arranging the spacers 220 as shown in FIG. 15, the amount of deformation of the elastic film 10 can be determined without changing the inner diameter of the jig base 202. The assembly jig 201 may include a plurality of spacers 220 having different thicknesses. In this case, the operator can select the spacer 220 having any thickness according to the polishing conditions of the wafer W among the plurality of spacers 220.

  FIG. 16 is a view showing a process of assembling the elastic film 10 to the head body 2. First, as shown in step 1 of FIG. 16, the elastic film 10 is connected to a plurality of connection rings 23. The elastic film 10 is formed of an elastically deformable elastic body such as silicone rubber. Therefore, when attaching the elastic film 10 to the plurality of connection rings 23, the operator manually deforms the peripheral wall 14 of the elastic film 10 corresponding to each connection ring 23 to make the elastic film 10 the plurality of connection rings 23. Connect to

  At each of the end portions of the plurality of peripheral walls 14 of the elastic film 10, seal protrusions 54 are provided over the entire circumference. The operator fits the seal projection 54 of each peripheral wall 14 into the seal groove 51 e provided in each connection ring 23. The seal groove 51 e has a size larger than that of the seal projection 54 in order to improve the assemblability of the seal projection 54 into the seal groove 51 e. Therefore, in the state where the seal projection 54 is fitted in the seal groove 51e, the seal projection 54 can freely rotate with respect to the seal groove 51e.

  After all the seal protrusions 54 are fitted in the seal grooves 51e and the elastic film 10 is connected to the plurality of connection rings 23, the operator fits the connection ring 23 to the carrier 43 (step 2 in FIG. 16). reference). At this time, a gap is formed between the plurality of connection rings 23 and the carrier 43.

  Thereafter, the carrier 43 to which the plurality of connection rings 23 are attached is fixed to the jig plate 203 by the fastener 204 (see step 3 in FIG. 16). Holes (screw holes or through holes) into which the fasteners 204 can be inserted are respectively formed in the carrier 43 and the jig plate 203, and the carrier 43 is fixed by tightening the fasteners 204 inserted into the holes. It is fixed to the tool plate 203. By fixing the carrier 43 to the jig plate 203, the communication hole 203a formed in the jig plate 203 and the through holes 73b and 73c formed in the head main body 2 communicate with each other. At this time, each pressure chamber 16 is at atmospheric pressure. In the present embodiment, the fastener 204 is a fastener composed of a screw or a bolt.

  The jig plate 203 is set to the jig base 202 such that the elastic film 10 and the head body 2 are disposed in the housing recess 202 a of the jig base 202 (see step 4 in FIG. 16). Thereafter, the worker connects the jig plate 203 to the jig base 202 by the clamper 205. In the present embodiment, the clamper 205 is a clamp comprised of a screw or a bolt.

  FIG. 17 is a view showing another embodiment of the clamper 205. As shown in FIG. The clamper 205 may include a plurality of air cylinders 235 and a holding member 236 for holding the plurality of air cylinders 235. The fluid transfer device 250 is not shown in FIG. Since the plurality of air cylinders 235 have the same structure, a single air cylinder 235 will be described below.

  As shown in FIG. 17, the air cylinder 235 includes a piston rod 235 a connected to the jig plate 203 and a cylinder body 235 b. The tip of the piston rod 235 a is fixed to the jig plate 203. The internal space of the cylinder body 235b is divided into two pressure chambers by a piston rod 235a, and a gas transfer line (not shown) is connected to the cylinder body 235b. The gas transfer line is connected to a gas source (not shown). The piston rod 235a can bias the jig plate 203 downward (in the direction close to the jig base 202) by the supply of the compressed gas to the piston main body 235b.

  The piston main body 235 b is held by the holding member 236, and both ends of the holding member 236 are fixed to the jig base 202. With such a structure, the piston rod 235a can bias the jig plate 203 downward by the supply of compressed gas, and the jig plate 203 can be brought close to the jig base 202. In FIG. 17, the clamper 205 includes a plurality of (three in the present embodiment) air cylinders 235, but the number of air cylinders 235 is not limited to this embodiment.

  An on-off valve (not shown) may be connected to the gas transfer line. The on-off valve can control the biasing force of the piston rod 235a by opening and closing thereof, and can easily adjust the clamping force of the clamper 205 (force to make the jig plate 203 approach the jig base 202). By connecting the common gas transfer line and the common on-off valve to the plurality of cylinder bodies 235b, the clamping force of the plurality of clampers 205 can be made common, and the clamping force can be easily managed.

  Although not shown, the clamper 205 may be a one-touch clamp structure in consideration of maintainability. For example, the clamper 205 includes a hooking member attached to the jig plate 203, and a hook member attached to the jig base 202 and connectable to the hooking member. The operator can bring the jig plate 203 close to the jig base 202 by hooking the hooking member onto the hook member and operating the hooking member in this state.

  Referring back to FIG. 14, the jig plate 203 and the jig base 202 are formed with holes into which the clampers 205 can be inserted, and the clampers 205 are inserted into the holes and further temporarily tightened if necessary. The tool plate 203 is connected to the jig base 202.

  After step 4 of FIG. 16, the fluid transfer pipe 251 of the fluid transfer device 250 is connected to the jig plate 203 through the joint 210 (see step 5 of FIG. 16). The fluid device 252 as a compression device supplies pressurized fluid to the pressure chambers 16 through the fluid transfer pipe 251, the communication hole 203a, and the through holes 73b and 73c by its operation. As a result, each pressure chamber 16 is pressurized (see step 6 in FIG. 16). The pressure of the pressurized fluid supplied to each pressure chamber 16 is regulated by the pressure regulator 256 within the range of 0.2 to 7 PSI (1.379 to 48.265 kPa).

  At this time, the plurality of connection rings 23 are fitted to the carrier 43 such that gaps are formed between the respective connection rings 23 and the carrier 43. In other words, the plurality of connection rings 23 are not in close contact with the carrier 43. Since the seal projection 54 of the elastic membrane 10 is in contact with at least one of the connection ring 23 and the carrier 43, the amount of leakage of the pressurized fluid is very small even if the pressurized fluid is supplied to each pressure chamber 16 .

  The elastic film 10 expands outward (more specifically, in a direction away from the carrier 43) by the supply of the pressurized fluid to the pressure chambers 16. If a gap is formed between the jig base 202 and the lower surface of the elastic film 10, the elastic film 10 also bulges downward. The inner peripheral wall 14 of the elastic membrane 10 is compressed by the pressure of the pressurized fluid supplied to the adjacent pressure chamber 16.

  In a state where the plurality of pressure chambers 16 are pressurized, the clamper 205 is rotated to bring the jig plate 203 close to the jig base 202. The clamper 205 moves the carrier 43 and the connection ring 23 in the direction approaching the lower surface of the jig base 202 (that is, the surface of the accommodation recess 202a) through the jig plate 203 by the rotation. As a result, the clamper 205 presses the lower end of the connection ring 23 against the lower surface of the jig base 202 via the elastic film 10. When the connection ring 23 is pressed against the lower surface of the jig base 202, the gap between the connection ring 23 and the carrier 43 disappears. As a result, the connection ring 23 is in close contact with the carrier 43 (see step 7 in FIG. 16).

  In the embodiment shown in FIG. 14, the lower ends of the connection rings 23c and 23d, that is, the tip 51c (see FIG. 6) of the ring inclined portion 51 are located below the lower end of the connection ring 23e. , 23d are pressed against the lower surface of the jig base 202 by the clamper 205 via the elastic film 10. The annular projection 33 (see FIG. 8) of the coupling ring 23e is mounted on the annular step 34 (see FIG. 8) of the coupling ring 23d, and the coupling ring 23e is connected to the coupling rings 23c and 23d. There is. Therefore, the connection ring 23e is also in close contact with the carrier 43 together with the other connection rings 23c and 23d.

  As shown in FIG. 14, when the jig plate 203 is set on the jig base 202, the distance between the jig plate 203 and the jig base 202 is formed between the connection ring 23 and the carrier 43. Larger than the gap distance. The distance between the jig plate 203 and the jig base 202 is further larger than the distance between the lower ends of the connection rings 23 c and 23 d and the lower surface of the jig base 202. The distance between the lower surface of the jig base 202 (more specifically, the lower surface of the accommodation recess 202a) and the upper end of the jig base 202 is the lower end of the connection ring 23 in a state in which the connection ring 23 is in close contact with the carrier 43. Or the same as the distance between the top of the carrier 43 and the top end of the carrier 43. Therefore, the plurality of connection rings 23 can be pressed against the lower surface of the jig base 202 by the proximity of the jig plate 203 to the jig base 202 and can be in close contact with the carrier 43.

  The carrier 43, the plurality of connection rings 23, and the elastic film 10 are sandwiched between the jig plate 203 and the jig base 202, and the plurality of connection rings 23 are formed on the lower surface of the jig base 202 via the elastic film 10. It is pressed. Therefore, in order to reliably prevent damage to the elastic film 10, the assembling jig 201 may further include a buffer member (cushion) 230 which is disposed in the housing recess 202a and can contact the lower surface of the elastic film 10 (see FIG. See Figure 18). The buffer member 230 is made of an elastic member such as rubber, and the hardness of the buffer member 230 is the same as the hardness of the elastic film 10 or lower than the hardness of the elastic film 10.

  In the present embodiment, the lower end of the connection ring 23e is located above the lower ends of the other connection rings 23a to 23d and 23f. FIG. 19 is a view showing a cushioning member 230 provided with a cushioning step 230a. As shown in FIG. 19, the cushioning member 230 may further include an annular cushioning step 230a formed on the upper surface thereof. As described above, since the cushioning member 230 includes the cushioning stepped portion 230a, the distance between the lower end of each connection ring 23 and the cushioning member 230 is the same. Therefore, the clamper 205 can uniformly transmit the clamping force to all the coupling rings 23.

  FIG. 20 is a view showing a deformed state of the elastic film 10 due to the pressurization of the pressure chamber 16. As shown in FIG. 20, the pressure of the pressurized fluid (see the arrow in FIG. 20) supplied to each pressure chamber 16 reduces the shape non-uniformity of the elastic film 10. More specifically, since the inner peripheral wall 14 of the elastic film 10 is compressed by the pressure of the pressurized fluid supplied to the adjacent pressure chamber 16, the posture of the inner peripheral wall 14 is corrected, and the deformation of the inner peripheral wall 14 Variation is eliminated. Furthermore, the edge peripheral wall 14 f of the elastic film 10 is uniformly deformed outward, and the variation in the degree of deformation of the edge peripheral wall 14 f is eliminated. Thus, the variation in the degree of deformation in the circumferential direction of the entire peripheral wall 14 of the elastic film 10 is eliminated.

  The plurality of connection rings 23 are in close contact with the carrier 43 in a state in which the pressurized fluid is supplied to each pressure chamber 16, that is, in a state in which variation in deformation of the entire peripheral wall 14 of the elastic film 10 is eliminated. Therefore, elastic film 10 can be assembled to head body 2 so that elastic film 10 has an optimum shape in a state of polishing wafer W, that is, in a state in which variation in deformation of elastic film 10 is eliminated.

  FIG. 21 is a view showing the elastic film 10 assembled to the head main body 2 in a state in which the variation in the degree of deformation of the elastic film 10 is eliminated. According to the present embodiment, as shown in FIG. 21, the variation in the degree of deformation of the elastic film 10 can be eliminated, so that the pressing force on the wafer W can be made uniform, and as a result, the polishing rate becomes uniform. It is possible to improve the quality.

  The fluid device 252 may be a vacuum device that decompresses each pressure chamber 16. Even if the elastic film 10 is assembled to the head main body 2 in a state in which the pressure chambers 16 are decompressed by operating the fluid device 252 as a vacuum device, it is possible to eliminate the variation in the degree of deformation of the elastic film 10.

  The pressure of the pressurized fluid supplied to each pressure chamber 16 may be changed for each pressure chamber 16. In particular, when the pressure of the pressurized fluid supplied to each pressure chamber 16 is the same, the inner circumferential wall 14 receives the same pressure of the pressurized fluid supplied to the adjacent pressure chamber 16, so the shape of the inner circumferential wall 14 It may be difficult to correct the degree of deformation of. Therefore, pressurized fluid of different pressure is supplied to each pressure chamber 16.

  FIG. 22 illustrates another embodiment of a fluid transfer device 250. As shown in FIG. As shown in FIG. 22, the fluid transfer device 250 includes a plurality of fluid transfer pipes 251, and each of the plurality of fluid transfer pipes 251 includes a fluid device 252, a pressure gauge 253, a flow meter 254, an on-off valve 255. , And a pressure regulator 256 are connected. With such a configuration, the pressure of the pressurized fluid supplied to each pressure chamber 16 can be changed for each pressure chamber 16.

  When the pressure of the pressurized fluid is changed for each pressure chamber 16, a pressure difference is generated in the pressure of the pressurized fluid supplied to the plurality of pressure chambers 16. FIG. 23 is a view showing a deformed state of the elastic film 10 when the pressure of the pressurized fluid is changed for each pressure chamber 16. In FIG. 23, the pressure of the pressurized fluid supplied to the pressure chamber 16e is larger than the pressure of the pressurized fluid supplied to the pressure chamber 16f (see the arrow in FIG. 23).

  As shown in FIG. 23, the inner peripheral wall 14e of the elastic film 10 that divides the pressure chamber 16e and the pressure chamber 16f is deformed toward the pressure chamber 16f in the low pressure state, and hence the inherent characteristic of the elastic film 10 in the atmospheric pressure state. It is possible to eliminate bending.

  FIG. 24 is a view showing the elastic film 10 assembled to the head main body 2 in a state where the pressure of the pressurized fluid is changed for each pressure chamber 16. As shown in FIG. 24, by bringing the connection ring 23 into close contact with the carrier 43 in a state where a pressure difference is generated in the pressure of the pressurized fluid supplied to the plurality of pressure chambers 16, the elasticity assembled to the head main body 2 Changes can be made in the shape of the inner peripheral walls 14d, 14e of the membrane 10.

  As shown in FIG. 22, when the fluid transfer device 250 includes a plurality of fluid devices 252, any one of the plurality of fluid devices 252 may be a vacuum device. With such a configuration, for example, in two adjacent pressure chambers 16, one pressure chamber 16 can be pressurized and the other pressure chamber 16 can be depressurized. In this manner, since the pressure difference between the adjacent pressure chambers 16 can be increased, the shape of the inner peripheral wall 14 of the elastic film 10 that divides the adjacent pressure chambers 16 can be largely deformed.

  In one embodiment, a branch pipe connected to a fluid device separate from the fluid device 252 may be connected to the fluid transfer pipe 251 via a switching valve. In this case, two fluid devices 252, that is, a compression device and a vacuum device are connected to one fluid transfer pipe 251.

  FIG. 25 is a view showing how the plurality of connection rings 23 are fixed to the carrier 43 by the fixing tool 70. As shown in FIG. After the elastic film 10 is assembled to the head main body 2, that is, after step 7 of FIG. 16, the fixing tool 70 is formed in the jig plate 203 and is communicated with the first recess 45 through the insertion hole 203 b. Insert into The insertion hole 203 b formed in the jig plate 203 has the same shape as the first recess 45. The plurality of connection rings 23 are firmly fixed to the carrier 43 by the rotation of the fixture 70 (see step 8 in FIG. 16).

  As shown in step 9 of FIG. 16, in order to confirm the sealability of the seal projection 54 of the elastic film 10, the pressurized fluid is supplied to each pressure chamber 16, and each flow meter 254 provided in each fluid transfer pipe 251. The leak flow rate may be confirmed by The soundness of the assemblability of the elastic film 10 to the head main body 2 can be confirmed by confirming the leak flow rate as described above. When carrying out this leak test, the operator supplies pressurized fluid to each pressure chamber 16 and confirms that the flow rate of the pressurized fluid is equal to or less than a specified value.

  The plurality of connection rings 23 are in close contact with the carrier 43 due to the proximity of the jig plate 203 to the jig base 202. Therefore, the plurality of seal protrusions 54 are pressed by the plurality of seal grooves 51 e in a state where the plurality of connection rings 23 and the carrier 43 are not fixed by the fixture 70. That is, the seal projection 54 is pressed against the seal groove 51 e by the clamping force of the clamper 205 when the jig plate 203 is brought close to the jig base 202.

  The assembling jig 201 is provided with a clamper 205 capable of bringing the plurality of connection rings 23 into close contact with the carrier 43, and the clamper 205 carries the connection ring 23 as the carrier 43 by the proximity of the jig plate 203 to the jig base 202. It can be attached to According to the present embodiment, the plurality of connection rings 23 can be closely attached to the carrier 43 without using the fixing tool 70. Therefore, it is not necessary to draw the plurality of connection rings 23 toward the carrier 43 by the rotation of the fixture 70, and the fixture 70 can easily fix the plurality of connection rings 23 to the carrier 43.

  According to the present embodiment, by combining the assembly jig 201 and the fluid transfer device 250, optimization of fixing of the elastic film 10 to the head body 2 and breakage of the connection ring 23 and / or the fixture 70 are prevented. You can get the effect.

  After the elastic film 10 is assembled to the head body 2 and the plurality of connection rings 23 are fixed to the carrier 43 by the fixture 70, the polishing head 1 including the head body 2, the flange 41, the spacer 42 and the retainer ring 3 By assembling the components, the entire polishing head 1 is assembled.

  The embodiments described above are described for the purpose of enabling one skilled in the art to which the present invention belongs to to practice the present invention. Various modifications of the above-described embodiment can naturally be made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Accordingly, the present invention is not limited to the described embodiments, but is to be construed in the broadest scope in accordance with the technical concept defined by the claims.

1 Substrate holding device (polishing head)
2 Head body 3 Retaining ring 10 Elastic membrane (membrane)
DESCRIPTION OF SYMBOLS 11 contact part 14a, 14b, 14c, 14e, 14f Peripheral wall 16a, 16b, 16c, 16d, 16e, 16f Pressure chamber 17 passage 18 Polishing table 19 Polishing pad 23a, 23b, 23c, 23d, 23e connection Ring 25 Polishing liquid supply nozzle 27 Head shaft 33 Protrusion part 34 Step part 36, 37 Engaging groove 40 Control device 45 1st recess 46 2nd recess 47 3rd recess 48 4th recess 50 Ring vertical part 51 Ring inclined part 51d Seal Groove 54 Seal projection 55 Peripheral wall body (inclined part)
Reference Signs List 60 retainer ring pressing mechanism 70 fixture 71 fixture body 72 flange 81 vertical movement mechanism 82 rotary joint 85 spherical bearing 94 screw 200 assembly system 201 assembly jig 202 jig base 202a accommodation recess 202b peripheral wall 203 jig plate 203a communication hole 203b Insertion hole 204 Fastener 205 Clamper 210 Joint 220 Spacer 230 Buffer member 230a Buffer step 235 Air cylinder 235a Piston rod 235b Piston body 236 Holding member 250 Fluid transfer device 251 Fluid transfer tube 252 Fluid device 253 Pressure gauge 254 Flow meter 255 Open / close valve 256 pressure regulator

Claims (11)

A method of assembling an elastically deformable elastic film in which a plurality of pressure chambers for pressing a substrate are formed on a head body,
A method of assembling the elastic film to the head body in a state where the plurality of pressure chambers are pressurized or depressurized. Preparing the elastic membrane including a plurality of peripheral walls forming the plurality of pressure chambers, and a plurality of sealing protrusions formed on end portions of the plurality of peripheral walls;
The method according to claim 1, further comprising: fitting the plurality of sealing protrusions into a plurality of sealing grooves formed in the head body. Preparing the head body including a plurality of connection rings in which the plurality of seal grooves are respectively formed, and a carrier to which the plurality of connection rings can be closely attached;
Fitting the plurality of seal protrusions into the plurality of seal grooves to connect the elastic film to the plurality of connection rings;
3. The method according to claim 2, further comprising: bringing the plurality of connection rings and the carrier into close contact with each other and pressing the plurality of seal protrusions into the plurality of seal grooves. Connecting a fluid transfer pipe to a through hole formed in the head body and communicating with each of the plurality of pressure chambers;
The step of assembling the elastic membrane to the head body is performed in a state where the plurality of pressure chambers are pressurized or depressurized by the operation of a compression device or a vacuum device connected to the fluid transfer pipe. The method according to any one of Items 1 to 3. A method of assembling an elastically deformable elastic film in which a plurality of pressure chambers for pressing a substrate are formed on a head body,
Preparing the head body including a plurality of connection rings to which the elastic film can be connected, and a carrier to which the plurality of connection rings can be closely attached;
Providing a jig base having a receiving recess having a size capable of receiving the elastic film and the head main body, and a jig plate capable of closing the receiving recess.
Connecting the elastic membrane to the plurality of connection rings;
Fitting the plurality of connection rings to the carrier while forming a gap between the plurality of connection rings and the carrier;
Attaching the carrier to which the plurality of coupling rings are fitted to the jig plate;
Closing the receiving recess with the jig plate in a state where the elastic film, the plurality of connection rings, and the carrier are received in the receiving recess;
And D. bringing the jig plate into proximity with the jig base until the plurality of connection rings and the carrier are in close contact with each other. Preparing the elastic membrane including a plurality of peripheral walls forming the plurality of pressure chambers, and a plurality of sealing protrusions formed on end portions of the plurality of peripheral walls;
Fitting the plurality of seal projections into a plurality of seal grooves formed in the plurality of connection rings,
The method according to claim 5, wherein the step of bringing the jig plate close to the jig base is performed until the plurality of seal protrusions are respectively pressed by the plurality of seal grooves. A fluid transfer pipe is connected to the communication hole in a state in which the communication hole formed in the jig plate and the through hole formed in the head main body and communicating with each of the plurality of pressure chambers are communicated with each other The process to
The method according to claim 5 or 6, further comprising the step of operating a compressor or a vacuum device connected to the fluid transfer pipe to pressurize or depressurize the plurality of pressure chambers. The elastic film is assembled to a head main body provided with a plurality of connection rings to which an elastically deformable elastic film having a plurality of pressure chambers for pressing a substrate can be connected and a carrier to which the plurality of connection rings can be closely attached. Assembly jig for
The assembly jig is
A jig base having an accommodation recess having a size capable of accommodating the elastic film and the head body;
A jig plate to which the carrier can be attached and which can close the receiving recess;
A fastener capable of fastening the carrier and the jig plate;
The jig plate is used as the jig base until the plurality of connection rings accommodated in the accommodation recess and the carrier are in close contact with each other in a state where a gap is formed between the plurality of connection rings and the carrier. An assembling jig characterized by comprising:   The assembly jig according to claim 8, wherein the assembly jig further includes a buffer member disposed in the accommodation recess and capable of contacting the lower surface of the elastic film. An assembling jig according to claim 8 or 9;
A fluid transfer device connected to the assembly jig;
The jig plate is formed with communication holes which are formed in the head main body and can be communicated with through holes communicating with the plurality of pressure chambers, respectively.
The fluid transfer device
A fluid transfer pipe connectable to the communication hole;
A compression device for pressurizing the plurality of pressure chambers or a vacuum device for reducing the pressure of the plurality of pressure chambers;
The assembly system, wherein the compression device or the vacuum device is connected to the fluid transfer pipe.   The assembly system of claim 10, wherein the fluid transfer device further comprises a pressure regulator connected to the fluid transfer tube.

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