JP2019087622A - Imprint apparatus and article manufacturing method - Google Patents

Abstract

To provide an advantageous technique to prevent failures in the event of interruption of a power supply.SOLUTION: An imprint apparatus performs pattern forming processing of forming a pattern on an imprint material on a substrate by using a mold. The imprint apparatus includes a block including a relative drive mechanism that controls the relative position and relative attitude between the substrate and the mold and a control unit that controls power supply to the block, and the control unit controls interruption of power supply to the block according to the state of the pattern forming processing when an event in which the power supply to the block should be interrupted occurs.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  An imprinting apparatus for bringing a mold into contact with an imprinting material on a substrate and curing the imprinting material to form a pattern of a cured product of the imprinting material, and thereafter separating the pattern and the mold; Attention has been paid. Such an imprint apparatus is described, for example, in Patent Document 1.

JP, 2016-149510, A

  In the process of forming a pattern in the imprint apparatus, the substrate and the mold can be arranged in close proximity to each other. In such a state, when the power supply to the relative drive mechanism for controlling the relative position and relative inclination between the substrate and the mold is cut off, the servo control in the relative drive mechanism is stopped, and the substrate or the substrate is The upper membrane and the mold may contact or collide. This can cause problems such as breakage of the substrate or the mold, contamination of the mold by the material constituting the film, generation of particles, and the like.

  The present invention has been made with the above problem recognition as an opportunity, and an object thereof is to provide an advantageous technique for preventing a failure at the time of interruption of power supply.

  One aspect of the present invention relates to an imprint apparatus for performing a pattern forming process for forming a pattern on an imprint material on a substrate using a mold, wherein the imprint apparatus is configured to compare the substrate with the mold. A block including a relative drive mechanism for controlling the relative position and the relative attitude, and a control unit for controlling the power supply to the block, the control unit including an event that should shut off the power supply to the block When it occurs, control is performed to shut off the power supply to the block in accordance with the state of the patterning process.

  According to the present invention, an advantageous technique is provided to prevent a failure in the interruption of the power supply.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows typically the structure of the imprint apparatus of one Embodiment of this invention. FIG. 7 is a diagram showing a flow of pattern formation processing in the imprint apparatus. FIG. 7 is a diagram showing an operation of the first embodiment regarding the interruption of the power supply to the block of the imprint apparatus. FIG. 7 is a view showing an operation of the second embodiment regarding the interruption of the power supply to the block of the imprint apparatus. FIG. 13 is a view showing an operation of the third embodiment regarding the interruption of the power supply to the block of the imprint apparatus. The figure which shows operation | movement of 4th Embodiment regarding interruption | blocking of the electric power supply with respect to the block of an imprint apparatus. The figure which shows operation | movement of 5th Embodiment regarding interruption | blocking of the electric power supply with respect to the block of an imprint apparatus. The figure which illustrates the article manufacturing method.

  The invention will now be described through its exemplary embodiments with reference to the accompanying drawings.

  FIG. 1 is a view schematically showing the configuration of an imprint apparatus 1 according to an embodiment of the present invention. The imprint apparatus 1 is configured to perform a pattern formation process for forming a pattern on the imprint material IM on the substrate S using the mold M. In the pattern formation process, (the pattern area PR of) the mold M is brought into contact with the imprint material IM on the substrate S to cure the imprint material IM, and a pattern made of a cured product of the imprint material IM formed thereby And the type M may be separated. The patterning process may include a process of disposing the imprint material IM on the substrate S.

  As the imprint material, a curable composition (sometimes referred to as an uncured resin) which is cured by receiving energy for curing is used. As energy for curing, electromagnetic waves, heat, etc. may be used. The electromagnetic wave may be, for example, light whose wavelength is selected from the range of 10 nm or more and 1 mm or less, such as infrared light, visible light, and ultraviolet light. The curable composition may be a composition which is cured by irradiation of light or by heating. Among these, the photocurable composition which is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a nonpolymerizable compound or a solvent as required. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component and the like. The imprint material may be disposed on the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets. The viscosity (the viscosity at 25 ° C.) of the imprint material may be, for example, 1 mPa · s or more and 100 mPa · s or less. As a material of the substrate, for example, glass, ceramics, metals, semiconductors, resins and the like can be used. If necessary, a member made of a material different from that of the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

  In the present specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which a direction parallel to the surface of the substrate S is an XY plane. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are taken as the X, Y, and Z directions, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are θX and θY, respectively. , ΘZ. The control or drive on the X axis, Y axis, and Z axis means control or drive on a direction parallel to the X axis, a direction parallel to the Y axis, and a direction parallel to the Z axis, respectively. Also, control or drive with respect to the θX axis, the θY axis, and the θZ axis relates to rotation around an axis parallel to the X axis, rotation around an axis parallel to the Y axis, and rotation around an axis parallel to the Z axis, respectively. Means control or drive. The position is information that can be specified based on the coordinates of the X axis, the Y axis, and the Z axis, and the posture is information that can be specified by the values of the θX axis, the θY axis, and the θZ axis.

  The imprint apparatus 1 can include a block 10 including a relative drive mechanism DM that controls the relative position and the relative attitude of the substrate S and the mold M. The relative drive mechanism DM may include a substrate positioning mechanism SA that holds and positions the substrate S, and a mold positioning mechanism MA that holds and positions the mold M. The relative drive mechanism DM drives at least one of the substrate S and the mold M such that the relative position and the relative attitude of the substrate S and the mold M are controlled. Driving of at least one of the substrate S and the mold M by the relative driving mechanism DM is for contact between the imprint material IM and the mold M on the substrate S and separation of a cured product of the imprint material IM from the mold M. Drive the

  The substrate positioning mechanism SA includes a substrate stage SS for holding the substrate S, a substrate drive mechanism 24 for driving the substrate S by driving the substrate stage SS, and a sensor for detecting the position and posture of the substrate stage SS (substrate S). And 25. The substrate positioning mechanism SA can configure a servo mechanism that feedback-controls the position and attitude of the substrate stage SS (substrate S) based on the output of the sensor 25. The substrate stage SS can include a substrate chuck 21 for holding the substrate S and a table 22 for supporting the substrate chuck 21.

  The mold positioning mechanism MA may include a mold chuck 41 for holding the mold M, and a mold drive mechanism 42 for driving the mold M by driving the mold chuck 41. In addition, the mold positioning mechanism MA may include a sensor (not shown) that detects the position and attitude of the mold M, and may configure a servo mechanism that feedback-controls the position and attitude of the mold M based on the output of the sensor. The mold positioning mechanism MA may be supported by the support 50.

  The substrate positioning mechanism SA (substrate drive mechanism 24) has a substrate S with a plurality of axes (for example, three axes of X axis, Y axis, θZ axis, preferably X axis, Y axis, Z axis, θX axis, θY axis) , ΘZ axes) can be configured to drive. Mold positioning mechanism MA (the mold driving mechanism 42 has a mold M with a plurality of axes (eg, Z axis, θX axis, θY axis three axes, preferably X axis, Y axis, Z axis, θX axis, θY axis, It can be configured to drive about six axes of the θZ axis).

  The imprint apparatus 1 can include a curing unit 90. In the hardening portion 90, the imprint material IM on the shot area of the substrate S is in contact with the pattern area PR of the mold M, and the imprint material is filled in the concave portion constituting the pattern of the pattern area PR. The material is irradiated with energy for curing. The imprint apparatus 1 can include a dispenser 30 (supply unit). The dispenser 30 supplies the mounting material IM onto the substrate S. The dispenser 30 disposes the imprint material IM at a target position on the substrate S, for example, by discharging the imprint material IM in a state where the substrate S is moved by the substrate positioning mechanism SA. The dispenser 30 may be configured as an external device of the imprint apparatus 1. The imprint apparatus 1 can include an alignment scope 80. The alignment scope 80 can detect, for example, the relative position and orientation (θZ axis) of the shot area and the pattern area PR of the mold M based on the mark of the shot area of the substrate S and the mark of the mold M.

  The imprint apparatus 1 can include a gas supply unit (not shown) that supplies a purge gas between the substrate S and the mold M. As the purge gas, a gas having at least one of solubility and diffusivity to the imprint material, for example, at least one of helium gas and nitrogen gas is suitable. Due to the solubility or diffusivity, the purge gas in the recess constituting the pattern of the pattern area PR of the mold M dissolves in the imprint material IM or diffuses in the mold M, and the imprint material IM is quickly filled in the recess. Alternatively, as the purge gas, a condensable gas (for example, pentafluoropropane (PFP)) is suitable. Condensable gas in the concave portion constituting the pattern of the pattern area PR of the mold M is significantly reduced in volume by condensation upon contact with the imprint material IM, whereby the imprint material IM is rapidly filled in the concave portion Be done.

  The imprint apparatus 1 can include a control unit 60 that controls power supply to the block 10. The control unit 60 may control the interruption of the power supply to the block 10 according to the state of the patterning process when an event occurs to shut off the power supply to the block 10. In this example, the control unit 60 is configured to control the pattern formation process in addition to the power supply to the block 10. However, a second control unit may be separately provided to control the pattern formation process. The control unit 60 is, for example, a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), or an ASIC (abbreviation of application specific integrated circuit), or a general purpose program incorporating a program. It may be configured by a computer or a combination of all or part of them. In the example illustrated in FIG. 1, the block 10 that is the control target of the power supply by the control unit 60 includes a relative drive mechanism DM, a dispenser 30, an alignment scope 80, and a curing unit 90. However, the power supply to the dispenser 30, the alignment scope 80 and the curing unit 90 may be controlled by a control unit separate from the control unit 60.

  The control unit 60 receives power from the power supply and supplies power to the block 10. The control unit 60 may include an electromagnetic contactor or a relay disposed in the power supply line. Also, the control unit 60 may have a protection device such as a breaker or a thermal relay disposed in the power supply line. The imprint apparatus 1 can include a power switch 70 that instructs supply and disconnection of power to the block 10. When the power switch 70 receives an on command from the operator, the power switch 70 sends a command to the control unit 60 to request the start of the power supply to the block 10, and requests the interruption of the power supply to the block 10 when the off command is received from the operator Command to the control unit 60. The supply and interruption of the power to the block 10 by the control unit 60 can be performed in response to the input of the off command to the power switch 70. Further, the control unit 60 can be activated by inputting the on command to the power switch 70. The event to shut off the power supply to the block 10 may include, for example, an off command input to the power switch 70 and the occurrence of an abnormality in the imprint apparatus 1. The occurrence of abnormality in the imprint apparatus 1 can be detected by the control unit 60 based on signals from the relative drive mechanism DM, the dispenser 30, the alignment scope 80, the curing unit 90, and the like.

  FIG. 2 shows the flow of the pattern formation process in the imprint apparatus 1. The patterning process illustrated in FIG. 2 can be controlled by the control unit 60. In step S101, the substrate S is carried into the imprint apparatus 1, placed on the substrate chuck 21 of the substrate stage SS, and held by the substrate chuck 21. In step S102, the imprint material IM is disposed on the shot area of the substrate S by the dispenser 30.

  In step S103, the relative drive mechanism DM aligns the shot area where the imprint material IM is disposed with the mold M. In step S104, at least one of the substrate S and the mold M is driven by the relative drive mechanism DM so that the imprint material IM on the shot area and the (pattern area PR of) the mold M come in contact with each other. In step S105, the relative drive mechanism DM detects the relative position and orientation (θZ axis) of the shot area and the pattern area PR of the mold M using the alignment scope 80, and the pattern area PR of the shot area and the mold M is detected. And are aligned.

  Thereafter, the process waits for the imprint material IM to be filled in the concave portion constituting the pattern of the pattern area PR of the mold M, and in step S106, the imprint material IM is cured by the curing unit 90. Thereby, a pattern made of a cured product of the imprint material IM is formed in the shot area. In step S107, at least one of the substrate S and the mold M is separated so that the pattern made of the cured product of the imprint material IM on the shot area and the (pattern area PR of) the mold M are separated by the relative drive mechanism DM. It is driven. Here, steps S104 to S107 will be referred to as imprint processing.

  In step S108, it is determined whether a pattern is formed on all shot areas of the plurality of shot areas of the substrate S. Then, when there is a shot area in which a pattern is not formed, steps S102 to S107 are performed on the shot area. When the patterns are formed on all the shot areas, the substrate S is unloaded from the imprint apparatus 1 in step S109.

  FIG. 3 shows the operation of the first embodiment relating to the interruption of the power supply to the block 10. This operation is controlled by the control unit 60 independently of the above-described pattern formation process. In step S201, the control unit 60 monitors whether or not an off command is input to the power switch 70, and when an off command is input, the process proceeds to step S202. The input of the off command to the power supply switch 70 is an example of the occurrence of an event to shut off the power supply to the block 10. In step S202, the control unit 60 determines whether the imprint process is being performed. If the imprint process is not being performed, the process proceeds to step S203 to cut off the power supply to the block 10. On the other hand, when the imprint process is being performed, the control unit 60 does not receive the off command to the power switch 70. That is, while the imprint process is being performed, the control unit 60 ignores the off command to the power switch 70, and continues the power supply to the block 10.

  This prevents the power supply to the block 10 including the relative drive mechanism DM from being interrupted in a state in which the film (for example, the film of the imprint material IM) on the substrate S or the film S is close to the mold M Ru. Thus, contact or collision of the film on the substrate S or the substrate S with the mold M is prevented. When the power supply to the relative drive mechanism DM is cut off in a state in which the film on the substrate S or the substrate S and the mold M are close to each other, the substrate S and the mold M do not stop immediately at that moment. The substrate S and the mold M can move. By this movement, the film on the substrate S or the substrate S and the mold M can contact or collide.

  FIG. 4 shows the operation of the second embodiment relating to the interruption of the power supply to the block 10. This operation is controlled by the control unit 60 independently of the above-described pattern formation process. In step S301, the control unit 60 monitors in the imprint apparatus 1 whether or not an abnormality that should shut off the power supply to the block 10 has occurred, and proceeds to step S302 when the abnormality has occurred. The abnormality may be, for example, liquid leakage such as refrigerant, power abnormality, pressure abnormality such as pressure line, flow abnormality such as refrigerant, temperature abnormality. The leak can be detected based on the output of the leak sensor. The power supply abnormality can be determined by whether the voltage value is within the normal range, or the current value is within the normal range, or both are within the normal range. The pressure abnormality can be detected based on the output of the pressure sensor. The flow rate abnormality can be detected based on the output of the flow rate sensor. The temperature abnormality can be detected based on the output of the temperature sensor or the state of the thermal switch. The occurrence of an abnormality that should shut off the power supply to the block 10 is an example of the occurrence of an event to shut off the power supply to the block 10 that the off command is input to the power switch 70.

  In step S302, the control unit 60 determines whether the imprint process is being performed. If the imprint process is not being performed, the process proceeds to step S303 to cut off the power supply to the block 10. On the other hand, if the imprint process is being performed, the process returns to step S301 without interrupting the power supply to the block 10. Therefore, if the imprint process is being performed, the control unit 60 continues the power supply to the block 10, and shuts off the power supply to the block 10 in step S303 as soon as the imprint process is completed.

  This prevents the power supply to the block 10 including the relative drive mechanism DM from being interrupted in a state in which the film (for example, the film of the imprint material IM) on the substrate S or the film S is close to the mold M Ru. Thus, contact or collision of the film on the substrate S or the substrate S with the mold M is prevented.

  FIG. 5 shows the operation of the third embodiment relating to the interruption of the power supply to the block 10. This operation is controlled by the control unit 60 independently of the above-described pattern formation process. In step S401, the control unit 60 monitors in the imprint apparatus 1 whether or not an event to shut off the power supply to the block 10 has occurred, and when the event has occurred, the process proceeds to step S402. The event may include, for example, that an off command is input to the power switch 70 and that an abnormality that should shut off the power supply to the block 10 has occurred in the imprint apparatus 1.

  In step S402, when the imprint process is being performed, the control unit 60 waits for the completion of the imprint process, and then proceeds to step S403 to cut off the power supply to the block 10. Here, in step S402, when the imprint process is not performed, the control unit 60 immediately proceeds to step S403, and cuts off the power supply to the block 10.

  As described above, in the third embodiment, when the imprint process is performed, the power supply to the block 10 is cut off after the imprint process is completed. This prevents the power supply to the block 10 including the relative drive mechanism DM from being interrupted in the state where the film on the substrate S or the substrate S and the mold M are close to each other. Thus, contact or collision of the film on the substrate S or the substrate S with the mold M is prevented.

  FIG. 6 shows the operation of the fourth embodiment regarding the interruption of the power supply to the block 10. This operation is controlled by the control unit 60 independently of the above-described pattern formation process. In step S501, the control unit 60 monitors in the imprint apparatus 1 whether or not an event to shut off the power supply to the block 10 has occurred, and when the event has occurred, the process proceeds to step S502. The event may include, for example, that an off command is input to the power switch 70 and that an abnormality that should shut off the power supply to the block 10 has occurred in the imprint apparatus 1.

  In step S502, the control unit 60 determines whether the imprint process is being performed. If the imprint process is being performed, the process proceeds to step S503, and if the imprint process is not being performed. Proceed to step S505. In step S503, the control unit 60 stops the imprint processing, and controls the relative drive mechanism so that the substrate S and the mold M are separated in step S504. For example, when the imprint process is stopped in step S503 during execution of step S104 (contact step) or S105 (alignment step), step S504 (separation step) can be performed without the imprint material IM being cured. . When the imprint process is stopped in step S503 while step S106 (curing step) is performed, step S107 (separation step) may be performed as step S504 (separation step). When the imprint process is stopped in step S503 during execution of step S107 (hard separation step), step S107 (separation step) may be continued as step S504 (separation step). Following step S504, step S5 is performed. In step S505, the control unit 60 shuts off the power supply to the block 10.

  As described above, when the substrate S and the mold M are close to each other when the power supply to the block 10 is to be shut off, the power supply to the block 10 is shut off after the substrate S and the mold M are separated. This prevents contact or collision between the film on the substrate S or the substrate S and the mold M.

  FIG. 7 shows the operation of the fifth embodiment relating to the interruption of the power supply to the block 10. This operation is controlled by the control unit 60 independently of the above-described pattern formation process. In step S601, the control unit 60 monitors in the imprint apparatus 1 whether or not an event to shut off the power supply to the block 10 has occurred, and when the event has occurred, the process proceeds to step S602. The event may include, for example, that an off command is input to the power switch 70 and that an abnormality that should shut off the power supply to the block 10 has occurred in the imprint apparatus 1. In step S602, the control unit 60 specifies the content of the event that should shut off the power supply to the block 10. In the transition process, the control (processing) is performed according to the content.

  In step S602, the control unit 60 determines whether to execute error processing based on the content of the event identified in step S602, and when error processing is to be performed, the process proceeds to step S604. On the other hand, in the case of completing the imprint process without executing the error process, the control unit 60 proceeds to step S612 and completes the imprint process. That is, when an event that should shut off the power supply to the block 10 occurs, the control unit 60 completes the imprint process and then shuts off the power supply to the block 10 according to the content of the event. decide.

  When error processing is performed, a problem may occur if power supply to block 10 is continued until imprint processing is completed. On the other hand, the case where the imprint process is completed without executing the error process is a case where no problem occurs even if the power supply to the block 10 is continued until the imprint process is completed. As a case where the imprint process is completed without executing the error process, for example, there is a case where an off command is input to the power switch 70.

  If error processing is to be performed (YES in step S603), error processing is performed according to the content of the event for which the power supply to the block 10 should be cut off. In this example, error handling may be performed according to a plurality of urgency levels (urgency levels 1, 2, 3) corresponding to the content of the event for which the power supply to the block 10 is to be cut off.

  In steps S604 and S607, the control unit 60 determines the degree of urgency corresponding to the content of the event for which the power supply to the block 10 should be cut off, and proceeds to step S605 if it is degree of urgency 1, and if it is degree of urgency 2 The process proceeds to step S607, and if the degree of urgency is 3, the process proceeds to step S610. The degree of urgency 1 is the highest and the degree of urgency 2 is the next highest. As an event corresponding to the degree of urgency 1, for example, the case where a liquid leakage is detected in the imprint apparatus 1 can be mentioned. If a leak occurs, the power supply to block 10 should be shut off immediately to prevent a leak. As an event corresponding to the degree of urgency 2, for example, the case where a P wave of an earthquake is detected can be mentioned. Since there is a slight time from the arrival of the P wave to the arrival of the S wave (the main shock), it can be treated as having a lower degree of urgency than in the case of the liquid leakage. As an event corresponding to the degree of urgency 3, for example, there may be mentioned a case where a temperature abnormality is detected at a position where precise temperature control is performed in the imprint apparatus 1.

  When the control unit 60 cuts off the power supply to the block 10 without completing the imprint process, the control unit 60 cuts off the power supply to the block 10 according to the content of the event to be cut off to the power supply to the block 10. Determine the error handling to be performed.

  If the degree of urgency is 1, the control unit 60 operates the relative drive mechanism DM so that the substrate S and the mold M are separated in step S605, and then supplies power to the block 10 in step S606. Shut off.

  If the degree of urgency is 2, the control unit 60 operates the relative drive mechanism DM so that the substrate S and the mold M are separated in step S608, and then, in step S609, the control unit 60 turns on the curing unit 90. The print material IM is cured. Thereafter, in step S606, the control unit 60 cuts off the power supply to the block 10. Here, when the power supply to the block 10 is cut off in step S606 without curing the imprint material IM in step S609, the uncured imprint material IM is vaporized and the imprint apparatus 1 is contaminated. there is a possibility. Therefore, in the second degree of urgency which is lower than the first degree of urgency, the imprint material IM is cured by the curing unit 90 after the substrate S and the mold M are separated.

  When the degree of urgency is 3, the control unit 60 sets the substrate S and the mold M to be separated in step S611 after curing the imprint material IM in the curing unit 90 in step S610. The drive mechanism DM is operated. Thereafter, in step S606, the control unit 60 cuts off the power supply to the block 10. In the third degree of urgency, which is lower than the second degree of urgency, it takes time to separate the substrate S and the mold M from each other. Therefore, after the imprint material IM is cured, the substrate S and the mold M are separated. In the case of the urgency level 3, steps S104 and S105 may be skipped.

  According to the fifth embodiment, since the action (processing) is performed according to the contents of the event for which the power supply to the block 10 is to be cut off, the disadvantage when the event to cut the power supply to the block 10 occurs is reduced. can do.

  The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily for manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. The mold may, for example, be a mold for imprinting.

  The pattern of the cured product is used as it is as a component member of at least a part of the article or temporarily used as a resist mask. After etching, ion implantation, or the like is performed in the substrate processing step, the resist mask is removed.

  Next, an article manufacturing method will be described in which a pattern is formed on a substrate by an imprint apparatus, the substrate on which the pattern is formed is processed, and an article is manufactured from the substrate on which the processing is performed. As shown in FIG. 8 (a), a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared, and subsequently, the surface of the workpiece 2z is exposed by an inkjet method or the like. Apply the printing material 3z. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto a substrate is shown.

  As shown in FIG. 8B, the mold 4z for imprint is faced with the side on which the concavo-convex pattern is formed facing the imprint material 3z on the substrate. As shown in FIG. 8C, the substrate 1 provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

  As shown in FIG. 8D, after the imprint material 3z is cured, when the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. In the pattern of the cured product, the concave portions of the mold correspond to the convex portions of the cured product, and the convex portions of the mold correspond to the concave portions of the cured product. It will be done.

  As shown in FIG. 8 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the workpiece 2z which has no cured material or remains thin is removed, and the groove 5z is removed. Become. As shown in FIG. 8F, when the pattern of the cured product is removed, it is possible to obtain an article having grooves 5z formed on the surface of the workpiece 2z. Although the pattern of the cured product is removed here, it may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, as a component of an article without removing it even after processing.

1: Imprint apparatus, 10: Block, DM: Relative drive mechanism, 30: Dispenser, 80: Alignment scope, 90: Hardened part, IM: Imprint material, S: Substrate, M: Model, PR: Pattern area

Claims (12)

What is claimed is: 1. An imprint apparatus for performing a patterning process for forming a pattern on an imprint material on a substrate using a mold,
A block including a relative drive mechanism that controls the relative position and relative attitude between the substrate and the mold;
A control unit that controls power supply to the block;
The control unit controls the interruption of the power supply to the block according to the state of the patterning process when an event to shut off the power supply to the block occurs.
An imprint apparatus characterized in that The pattern formation process includes an imprint process of bringing the imprint material on the substrate into contact with the mold, curing the imprint material, and separating a cured product of the imprint material from the mold.
The control unit does not shut off the power supply to the block during the imprinting process.
The imprint apparatus according to claim 1, When the event occurs in the imprint process, the control unit waits for the completion of the imprint process and then shuts off the power supply to the block.
The imprint apparatus according to claim 2, The pattern formation process includes an imprint process of bringing the imprint material on the substrate into contact with the mold, curing the imprint material, and separating a cured product of the imprint material from the mold.
The control unit shuts off the power supply to the block after operating the relative drive mechanism such that the substrate and the mold are separated when the event occurs in the imprint process.
The imprint apparatus according to claim 1, The pattern formation process includes an imprint process of bringing the imprint material on the substrate into contact with the mold, curing the imprint material, and separating a cured product of the imprint material from the mold.
The control unit determines, when the event occurs, whether to shut off the power supply to the block after completing the imprinting process according to the content of the event.
The imprint apparatus according to claim 1, In the case of interrupting the power supply to the block without completing the imprint process, the control unit performs an error process to be executed before interrupting the power supply to the block according to the content of the event. decide,
The imprint apparatus according to claim 5, The error processing includes operating the relative drive mechanism such that the substrate and the mold are separated, and the control unit performs the relative drive mechanism such that the substrate and the mold are separated. After operation, shut off the power supply to the block without curing the imprint material on the substrate,
The imprint apparatus according to claim 6, The error process includes a process of curing the imprint material on the substrate after operating the relative drive mechanism so that the substrate and the mold are separated.
The imprint apparatus according to claim 6, The error processing includes operating the relative drive mechanism such that the substrate and the mold are separated after curing the imprint material on the substrate.
The imprint apparatus according to claim 6, The occurrence of the event includes the generation of a command to shut off the power supply to the block.
The imprint apparatus according to any one of claims 1 to 9, characterized in that: The occurrence of the event includes the occurrence of an abnormality in the imprint apparatus,
The imprint apparatus according to any one of claims 1 to 9, characterized in that: Forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 11;
Processing the substrate on which the pattern is formed in the step;
A method of manufacturing an article from the substrate on which the treatment has been performed.

Images