JP7265824B2 - Molding apparatus and article manufacturing method - Google Patents

Description

The present invention relates to a molding apparatus and an article manufacturing method.

There are molding apparatuses that shape a curable composition disposed on a substrate by a molding process. The molding process includes a contact step of contacting the curable composition on the substrate with the mold (mold), a curing step of curing the curable composition while the curable composition and the mold are in contact, and after curing and a separating step of separating the curable composition of and the mold. A mold may also be referred to as a template. Patent Document 1 describes disposing a polymerizable compound on a first surface, bringing a template into contact with the polymerizable compound, and then solidifying the polymerizable compound. The template can have a flat patterned surface.

Japanese Patent Publication No. 2011-529626 JP 2015-115370 A

If the bonding strength between the curable composition and the mold is stronger than the expected bonding strength, the mold cannot be separated from the curable composition in the separation step. Such a phenomenon can occur, for example, when not enough release agent is provided to the mold. Patent Document 2 discloses an apparatus having a drive section for driving at least one of a substrate holding section and a mold holding section for mold release (separation process) and a detection section for detecting the completion of mold release by the drive section. is described. In the apparatus, when the completion of mold release is not detected by the detection unit, the force for holding the substrate by the substrate holding unit is increased, and then the driving unit again drives for mold release.

When the bonding strength between the curable composition and the mold is stronger than the predetermined bonding strength, if the mold is separated from the curable composition by a force exceeding the bonding strength, the substrate and/or the mold will be damaged. sell. Damage to the substrate and/or mold can result in particle generation associated with the damage, resulting in significant time spent servicing the apparatus. Also, damage to the substrate and/or mold can increase the cost of manufacturing articles such as semiconductor devices.

The present invention was made in response to the recognition of the above problem, and an object of the present invention is to provide an advantageous technique for preventing breakage of the substrate and/or the mold during the separation process.

One aspect of the present invention includes a contact step of contacting a curable composition on a substrate with a mold, and a curing step of curing the curable composition while the curable composition and the mold are in contact. and a separation step of separating the curable composition after curing from the mold, wherein the substrate holding unit holds the substrate, and the mold holding unit holds the mold. a driving mechanism for changing the relative positions of the substrate holding portion and the mold holding portion so that the contacting step and the separating step are performed; a transfer mechanism; detecting an abnormality that occurs in a state in which the mold is held by the mold holding section; responding to the detection of the abnormality ; controlling the drive mechanism to stop the separating process; controlling the drive mechanism so as to release one of the holding of the substrate and the holding of the mold by the mold holding portion and separate the substrate holding portion and the mold holding portion; and a control unit that controls the transport mechanism so as to transport the structure composed of the mold .

The present invention provides an advantageous technique for preventing damage to the substrate and/or mold during the separation process.

The figure which shows the structure of the shaping|molding apparatus of one Embodiment of this invention. FIG. 4 is a diagram illustrating planarization processing as an example of molding processing; The figure which illustrates the structure of a board|substrate holding|maintenance part. The figure which illustrates the structure of a mold holding|maintenance part. FIG. 4 is a view exemplifying states of a substrate holding part, a mold holding part 1, a substrate, and a mold; FIG. 10 is a view exemplifying a holding abnormality (abnormality related to holding of the substrate 1 by the substrate holding unit 2) as an example of the separation process abnormality; 4 is a flowchart showing the operation of the molding device; FIG. 8 is a diagram showing an example of a detailed procedure of step S605 (separation step) in FIG. 7; The figure which illustrates the structure of a board|substrate storage shelf. FIG. 8 is a diagram showing another example of the detailed procedure of step S605 (separation step) in FIG. 7; The figure which illustrates the structure of a mold storage shelf. FIG. 4 is a view exemplifying a mold transfer hand of the mold transfer section; The figure which illustrates an article manufacturing method.

The invention will now be described through its exemplary embodiments with reference to the accompanying drawings.

FIG. 1 describes the configuration of a molding apparatus 100 according to one embodiment of the present invention. Molding apparatus 100 may be configured to perform a molding process to mold a curable product onto substrate 1 . The molding process includes a contact step of contacting the curable composition on the substrate 1 and the mold 11, a curing step of curing the curable composition while the curable composition and the mold 11 are in contact, and after curing and a separation step of separating the curable composition of and the mold 11 .

In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which a direction parallel to the surface of the substrate 1 is the XY plane. Directions parallel to the X, Y, and Z axes in the XYZ coordinate system are defined as the X, Y, and Z directions, respectively, and rotation about the X axis, Y axis, and Z axis are θX and θY, respectively. , θZ. Controlling or driving with respect to the X-axis, Y-axis, and Z-axis means controlling or driving with respect to directions parallel to the X-axis, directions parallel to the Y-axis, and directions parallel to the Z-axis, respectively. In addition, the control or driving of the θX-axis, θY-axis, and θZ-axis relates to rotation about an axis parallel to the X-axis, rotation about an axis parallel to the Y-axis, and rotation about an axis parallel to the Z-axis, respectively. means to control or drive. The position is information that can be specified based on the coordinates of the X, Y, and Z axes, and the orientation is information that can be specified by the values of the θX, θY, and θZ axes. Alignment means controlling position and/or attitude. Alignment may include controlling the position and/or orientation of at least one of substrate 1 and mold 11 . Alignment may also include controls for correcting or changing the shape of at least one of substrate 1 and mold 11 .

As the curable composition, a curable composition (also referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, and the like are used as curing energy. The electromagnetic wave is, for example, light such as infrared rays, visible rays, and ultraviolet rays whose wavelengths are selected from the range of 10 nm or more and 1 mm or less.

A curable composition is a composition that is cured by irradiation with light or by heating. Among these, the photocurable composition that is cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent if necessary. The non-polymerizable compound is at least one selected from the group consisting of sensitizers, hydrogen donors, internal release agents, surfactants, antioxidants, polymer components and the like. The curable composition is applied to the substrate in the form of a film by a spin coater or a slit coater. Alternatively, the curable composition may be applied onto the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets, using a liquid jet head. The viscosity of the hardening product (viscosity at 25° C.) is, for example, 1 mPa·s or more and 100 mPa·s or less.

The molding apparatus 100 can be configured as a planarization apparatus that uses a mold having a planar surface 11a and forms a planarization film on the substrate 1 with a curable composition. In this case, the curable composition is cured while the flat surface 11a is in contact with the curable composition. In the planarization apparatus, for example, a planarization film can be collectively formed on a plurality of shot regions of the substrate 1 .

Alternatively, the molding apparatus 100 can be configured as an imprinting apparatus that uses a patterned mold 11 and transfers the pattern of the mold 11 to the curable composition on the substrate 1 . In this case, the curable composition is cured while the pattern of the mold 11 is in contact with the curable composition. In the imprint apparatus, for example, patterns may be formed individually for each of a plurality of shot regions on the substrate 1, patterns may be formed collectively for two or more shot regions, Patterns may be collectively formed for a plurality of shot areas.

In the following, an example in which the molding apparatus 100 is configured as a flattening apparatus will be described as a representative example. However, when the molding apparatus 100 is configured as an imprint apparatus, the configuration is the same as when configured as a flattening apparatus. can have

The substrate 1 can be, for example, a silicon wafer, but is not limited to this. The substrate 1 is arbitrarily selected from substrates known as substrates for semiconductor devices, such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, and silicon nitride. can be The substrate 1 may be a bare substrate, or may have one or more layers on a base material substrate such as a wafer. The substrate 1 may be a substrate on which an adhesion layer is formed by surface treatment such as silane coupling treatment, silazane treatment, or deposition of an organic thin film to improve adhesion to the curable composition. The substrate 1 is, for example, circular with a diameter of 300 mm, but is not limited to this.

For example, light can be used as the energy for curing the curable composition. In this case, the mold 11 can be made of a material that transmits the light. The mold 11 is made of, for example, at least one of glass, quartz, PMMA (Polymethyl methacrylate), optically transparent resin such as polycarbonate resin, transparent metal deposition film, flexible film such as polydimethylsiloxane, photocured film, and metal film. can consist of In one example, the mold 11 can be circular with a diameter greater than 300 mm and less than 500 mm, but is not limited thereto. In addition, the mold 11 may be 0.25 mm or more and less than 2 mm in one example, but is not limited to this. The curable composition can be a UV curable liquid when UV light is used as the energy for curing. Curable compositions can be monomers such as, for example, acrylates or methacrylates.

The molding apparatus 100 includes a substrate holding portion 2, a substrate stage 3, a base surface plate 4, a column 5, a top plate 6, a guide bar plate 7, a guide bar 8, a head driving portion 9, and a column 10. , a mold holder 12 , a head 13 , and an alignment shelf 14 . The molding apparatus 100 can also include a dispenser 20 , an off-axis alignment (OA) scope 21 , a substrate transfer processing section 220 , a substrate transfer section 22 and an alignment scope 23 . The molding apparatus 100 can also include a curing section 24 , a stage driving section 31 , a mold transfer processing section 320 , a mold transfer section 32 , a cleaning section 33 , an input section 34 and a control section 200 .

The substrate holding part 2 includes a chuck such as a vacuum chuck or an electrostatic chuck, and can hold the substrate 1 with the chuck. The substrate stage 3 holds the substrate holder 2 . The substrate stage 3 can be mounted with an actuator that drives the substrate holder 2 about the θZ axis. The stage driving section 31 drives the substrate stage 3 and thereby drives the substrate 1 . The stage driving section 31 can include, for example, a linear motor. The substrate holding section 2 , substrate stage 3 and stage driving section 31 can constitute a substrate positioning mechanism SA that drives or positions the substrate 1 . The substrate positioning mechanism SA moves the substrate 1 along a plurality of axes (for example, X, Y, and θZ axes, preferably X, Y, Z, θX, θY, and θZ axes). ).

The mold holding unit 12 includes a chuck such as a vacuum chuck or an electrostatic chuck, and can hold the mold 11 with the chuck. The head 13 can hold the mold holder 12 . The head driving section 9 drives the mold holding section 12 by driving the head 13 , thereby driving the mold 11 . The head drive unit 9 moves the mold 11 along a plurality of axes (for example, Z-axis, θX-axis, and θY-axis, preferably X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). ).

A column 5 for supporting the top plate 6 can be arranged on the base surface plate 4 . A guide bar 8 is arranged to pass through the top plate 6 , one end of the guide bar 8 can be fixed to the guide bar plate 7 and the other end can be fixed to the head 13 . The head driving section 9 drives the head 13 in the Z-axis direction by driving the guide bar 8 . Thereby, the mold 11 held by the mold holding part 12 can be brought into contact with the curable composition on the substrate 1, and the mold 11 can be separated from the curable composition on the substrate 1. The head driving section 9 may include a mechanism for driving the head 13 about an axis other than the Z axis. Alternatively, the head driving section 9 drives the head 13 along a plurality of axes (for example, three axes of θX axis and θY axis, preferably X axis, Y axis, Z axis, θX axis, θY axis and θZ axis). mechanism.

The mold holding section 12 , head 13 , head driving section 9 , guide bar 8 and guide bar plate 7 can constitute a mold positioning mechanism MA that drives or positions the mold 11 . In this example, the mold positioning mechanism MA constitutes a drive mechanism DM that changes or adjusts the relative positions of the substrate holder 2 and the mold holder 12 so that the contacting process and the separating process are performed. However, the drive mechanism DM may be configured by the substrate positioning mechanism SA, or may be configured by the substrate positioning mechanism SA and the mold positioning mechanism MA.

The mold 11 can be carried in from the outside of the molding apparatus 100 by a mold transfer section 32 including a transfer hand and the like, transferred to the mold holding section 12 via the mold transfer processing section 320, and held by the mold holding section 12. . The mold transfer processing section 320 can include a mold storage shelf 321 that can store the mold 11 . A portable mold storage section may be provided instead of the mold storage shelf 321 . The mold 11 can have, for example, a circular or square outer shape. Mold 11 may include a flat surface 11 a that conforms to the surface topography of substrate 1 in contact with the curable composition on substrate 1 . The planar surface 11a can have, for example, the same size as the substrate 1 or a larger size than the substrate 1 . The mold holder 12 is supported by the head 13 and, in one example, can be driven by the head 13 about the θZ axis.

The mold holder 12 and the head 13 may include windows that allow curing energy (eg, light such as UV light) provided from the curing section 24 to pass through. Further, the mold holder 12 or the head 13 may incorporate a sensor LC such as a load cell that measures the force applied by the drive mechanism DM to the substrate 1 and the mold 11 during the contacting process and the separating process. Here, in the contacting process, a Z-axis direction pressing force is applied to the substrate 1 and the mold 11 , and in the separating process, a Z-axis direction tensile force is applied to the substrate 1 and the mold 11 .

The alignment shelf 14 can be suspended by the top plate 6 via the struts 10 . A guide bar 8 penetrates the alignment shelf 14 . Further, on the alignment shelf 14, for example, a height measurement system (not shown) for measuring the height (flatness) of the substrate 1 held by the substrate holder 2 can be arranged. The height measurement system can measure the height (flatness) of the substrate 1 by, for example, an oblique incidence image shift method.

The alignment scope 23 can include an optical system and an imaging system for observing the reference marks provided on the substrate stage 3 , the alignment marks provided on the mold 11 , and the alignment marks provided on the substrate 1 . If the substrate stage 3 and the mold 11 are not aligned, the alignment scope 23 may not be provided.
The alignment scope 23 can be used for alignment that measures the relative position between the reference mark provided on the substrate stage 3 and the alignment mark provided on the mold 11 and corrects the positional deviation.

The dispenser 20 (supply unit) places or supplies an uncured (liquid) curable composition onto the substrate 1 . The dispenser 20 may include, for example, a discharge port (nozzle) for discharging the curable composition. The dispenser 20 can supply a minute volume (eg, 1 picoliter) of the curable composition onto the substrate 1 by, for example, a piezojet method or a micro-solenoid method. The number of ejection openings provided in the dispenser 20 is not limited to a specific number, and may be one or plural. In one example, dispenser 20 can have 100 or more outlets. Such an arrangement of multiple ejection openings can be configured by, for example, one or multiple linear nozzle arrays.

OA scope 21 can be supported by alignment shelf 14 . The OA scope 21 can be used for global alignment processing that detects alignment marks provided in a plurality of shot areas on the substrate 1 and determines the positions of each of the plurality of shot areas. Relative alignment between the mold 11 and the substrate 1 can be performed by determining the positional relationship between the mold 11 and the substrate stage 3 with the alignment scope 23 and determining the positional relationship between the substrate stage 3 and the substrate 1 with the OA scope 21 . can.

The cleaning unit 33 can clean the mold 11 while the mold 11 is held by the mold holding unit 12 . The cleaning station 33 may remove the curable composition remaining on the mold 11 , particularly the planar surface 11 a thereof, for example by separating the mold 11 from the cured curable composition on the substrate 1 . The cleaning unit 33 may, for example, wipe off the curable composition adhering to the mold 11, or may remove the curable composition adhering to the mold 11 using UV irradiation, wet cleaning, plasma cleaning, or the like. .

The control unit 200 is, for example, a PLD (abbreviation for Programmable Logic Device) such as FPGA (abbreviation for Field Programmable Gate Array), or ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose device in which a program is incorporated. or a dedicated computer, or a combination of all or part of these. The control unit 200 can control each of the above constituent elements that constitute the molding apparatus 100 .

The control unit 200 can control execution of a shaping process such as a flattening process. The planarization treatment is an example of molding treatment for molding the curable composition on the substrate 1, and is a treatment for forming a film having a planarized surface by a cured product of the curable composition. More specifically, in the planarization process, the flat surface 11a of the mold 11 is brought into contact with the curable composition on the substrate 1 to conform to the surface shape of the substrate 1, thereby planarizing the curable composition. processing. A planarization process can generally be performed on a lot-by-lot basis, ie, on each of a plurality of substrates included in the same lot.

The control unit 200 can include a detection unit 300 that detects an abnormality that occurs in the separation process when the substrate 1 is held by the substrate holding unit 2 and the mold 11 is held by the mold holding unit 12 (hereinafter referred to as separation process abnormality). . The detection unit 300 may be provided in the molding apparatus 100 as a separate component from the control unit 200 . For example, the detection unit 300 may be incorporated into the control unit 200 as a program module, or may be incorporated into the control unit 200 as a hardware element such as an ASIC that implements the function. The detection unit 300 detects the occurrence of a separation process abnormality when the information detected in the separation process indicates an abnormality, for example, when the information detected in the separation process deviates from a preset reference range. sell. Detection of the separation process abnormality suggests that the substrate 1 and/or the mold 11 may be damaged if the separation process is continued.

For example, in the separation process, the detection section 300 can detect a holding abnormality as a separation process abnormality in a state where the substrate 1 is held by the substrate holding section 2 and the mold 11 is held by the mold holding section 12 . The holding abnormality can be at least one of the holding of the substrate 1 by the substrate holding part 2 and the holding of the mold 11 by the mold holding part 12 . The detection unit 300 acquires information indicating the holding state of the substrate 1 held by the substrate holding unit 2 and/or information indicating the holding state of the mold 11 held by the mold holding unit 12, and based on the information, can detect separation process anomalies (retention anomalies). Here, the occurrence of a holding abnormality means that the structure (hereinafter also simply referred to as "structure") consisting of the substrate 1, the curable composition and the mold 11 is subjected to a normal force (normal separation process This suggests that a larger force (tensile force) is applied than the force at Therefore, if the separation process is continued while the holding abnormality is occurring, a force larger than the normal force is continuously applied to the structure composed of the substrate 1, the curable composition and the mold 11, or even stronger. Substrate 1 and/or mold 11 may be damaged due to the applied force.

A flattening process as an example of the molding process will be exemplified with reference to FIG. First, as shown in FIG. 2(a), the curable composition IM is supplied or placed by the dispenser 20 on the substrate 1 having the underlying pattern 1a. FIG. 2(a) shows a state before the curable composition IM is supplied onto the substrate 1 and (the flat surface 11a of) the mold 11 is brought into contact with the curable composition IM. Next, as shown in FIG. 2(b), the distance between the substrate 1 and the mold 11 is increased by the driving mechanism DM so that the curable composition IM on the substrate 1 and (the flat surface 11a of) the mold 11 are in contact with each other. (contacting step). FIG. 2(b) shows a state in which the flat surface 11a of the mold 11 is in complete contact with the curable composition IM on the substrate 1, and the flat surface 11a of the mold 11 follows the surface shape of the substrate 1. . Then, in the state shown in FIG. 2B, the curable composition IM on the substrate is irradiated with energy for curing from the curing unit 24 through the mold 11, thereby curing the curable composition IM. (curing process). Next, as shown in FIG. 2(c), the distance between the substrate 1 and the mold 11 is adjusted by the driving mechanism DM so that the mold 11 is separated from the cured curable composition IM on the substrate 1. Uru (separation process). As a result, a layer (flattening layer) of the curable composition IM having a uniform thickness can be formed over the entire substrate 1 . FIG. 2(c) shows a state in which a flattening layer made of a cured product of the curable composition IM is formed on the substrate 1. As shown in FIG.

FIG. 3 illustrates the configuration of the substrate holding part 2. As shown in FIG. A vacuum chuck can be incorporated in the substrate holding part 2 as a chuck for holding the substrate 1 . The vacuum chuck may include grooves 2 a - 2 e provided on the surface of substrate holder 2 . Vacuum lines La-Le can be connected to the grooves 2a-2e, respectively. The molding apparatus 100 can include, for example, a pressure sensor 2g that individually detects the pressure of each of the vacuum lines La-Le. The pressure sensor 2g provides information indicating the detected pressure to the control section 200 (or the detection section 300). The information is an example of information indicating the holding state of the substrate 1 held by the substrate holding unit 2 . The molding apparatus 100 can also include a pressure regulator 2h that individually regulates the pressure of each of the vacuum lines La-Le. The detection unit 300 detects an abnormality in the holding of the substrate 1 by the substrate holding unit 2 based on information provided from the pressure sensor 2g, that is, information indicating the holding state of the substrate 1 held by the substrate holding unit 2. sell.

FIG. 4 illustrates the configuration of the mold holding portion 12. As shown in FIG. A vacuum chuck may be incorporated in the mold holding unit 12 as a chuck for holding the mold 11 . The vacuum chuck may include grooves 12a provided in the surface of the mold holder 12. As shown in FIG. A vacuum line Lm can be connected to the groove 12a. The molding apparatus 100 can include, for example, a pressure sensor 12g that detects the pressure of the vacuum line Lm. The pressure sensor 12g provides information indicating the detected pressure to the control section 200 (or the detection section 300). This information is an example of information indicating the holding state of the mold 11 held by the mold holding unit 12 . The molding apparatus 100 can also include a pressure regulator 12h that regulates the pressure of the vacuum line Lm. The detection unit 300 detects an abnormality in the holding of the mold 11 by the mold holding unit 12 based on information provided from the pressure sensor 12g, that is, information indicating the holding state of the mold 11 held by the mold holding unit 12. sell. The vacuum chuck incorporated in the mold holder 12 may have a plurality of grooves, to which individual vacuum lines may be connected and the pressure of each vacuum line may be individually detected and adjusted.

3 and 4, the detection unit 300 detects information indicating the holding state of the substrate 1 held by the substrate holding unit 2 and/or the holding state of the mold 11 held by the mold holding unit 12. Information indicative of the current state may be obtained, and a retention abnormality may be detected based on the information. The control unit 200 adjusts the pressure of the vacuum lines La to Le for the substrate holding unit 2 and the pressure of the vacuum line Lm for the mold holding unit 12 based on the information provided by the pressure sensors 2g and 12g. The pressure regulators 2h and 12h may be controlled so as to

FIG. 5(a) schematically shows the states of the substrate holding part 2, the mold holding part 12, the substrate 1, the mold 11 and the like at the time when the curing process is completed. Note that the curable composition is not shown. A structure ST composed of a substrate 1, a curable composition (not shown), and a mold 11 is held by a substrate holder 2 on its lower surface and by a mold holder 12 on its upper surface. The detection unit 300 detects a separation process abnormality (holding abnormality) based on information indicating the holding state of the substrate 1 held by the substrate holding unit 2 and/or information indicating the holding state of the mold 11 held by the mold holding unit 12. Start discovery. In addition, the control unit 200 can control the pressure regulators 2h and 12h so that the vacuum lines La to Le and Lm reach the target pressure in the separation process.

FIG. 5B schematically shows the states of the substrate holding part 2, the mold holding part 12, the substrate 1, the mold 11, and the like during the separation process. 5(b), only a portion of the flat surface 11a of the mold 11 is separated from the cured curable composition on the substrate 1. In the state shown in FIG. The detection unit 300 detects a separation process abnormality (holding abnormality) based on information indicating the holding state of the substrate 1 held by the substrate holding unit 2 and/or information indicating the holding state of the mold 11 held by the mold holding unit 12. Continue detection.

FIG. 5(c) schematically shows the states of the substrate holding part 2, the mold holding part 12, the substrate 1, the mold 11, etc. after the separation process is completed. In the state shown in FIG. 5( c ), the entire flat surface 11 a of mold 11 is separated from the cured curable composition on substrate 1 . The detection unit 300 detects a separation process abnormality (holding abnormality) based on information indicating the holding state of the substrate 1 held by the substrate holding unit 2 and/or information indicating the holding state of the mold 11 held by the mold holding unit 12. Continue detection.

When the separation process proceeds normally, in the period from the start of the separation process to the end of the separation process, the information (information indicating pressure) provided by the pressure sensors 2g and 12g is within the reference range (target pressure ± tolerance). On the other hand, the force required to separate the mold 11 from the cured curable composition on the substrate 1 (hereinafter referred to as the required separation force) is the holding force of the substrate 1 by the substrate holding portion 2 and/or the mold by the mold holding portion 12. If it is larger than 11 holding portions, a holding abnormality may occur. The holding abnormality is, for example, separation of the structure ST from the holding surface of the substrate holding part 2 , and can occur when the required separating force is greater than the holding force of the substrate 1 by the substrate holding part 2 . Alternatively, the holding anomaly is the separation of the structure ST from the holding surface of the mold holding part 12 and can occur when the required separation force is greater than the holding force of the mold 11 by the mold holding part 12 . As described above, the holding abnormality is detected by the detection section 300 .

FIGS. 6A and 6B illustrate a holding abnormality (an abnormality related to holding of the substrate 1 by the substrate holding unit 2) as an example of the separation process abnormality. In the example of the separation process abnormality (holding abnormality) shown in FIG. 6A, part of the structure ST (lower surface) is separated from the holding surface of the substrate holding part 2 during the separation process. Such a separation process abnormality can also be understood as a phenomenon in which a portion of the substrate 1 (lower surface) is separated from the holding surface of the substrate holding part 2 during the execution of the separation process. Such an abnormality in the separation process can be detected by the detection unit 300 detecting an increase in pressure (decrease in vacuum pressure) in any one of the vacuum lines La to Le based on information from the pressure detector 2g. For example, when the outer peripheral portion of the substrate 1 is separated from the substrate holding portion 2 as illustrated in FIG. 6A, the detection portion 300 detects the vacuum line La A rise in pressure (a drop in vacuum pressure) can be detected, thereby detecting an abnormality in the separation process.

In the example of the separation process abnormality (holding abnormality) shown in FIG. 6B, part of the structure ST (lower surface) is separated from the holding surface of the substrate holding part 2 during the separation process. For example, when all portions of the substrate 1 other than the central portion are separated from the substrate holding portion 2 as illustrated in FIG. , the increase in pressure in the vacuum lines La to Ld can be detected, thereby detecting a holding abnormality.

When the mold holding unit 12 fails to hold the mold 11, the detection unit 300 detects an increase in pressure (a decrease in vacuum pressure) in the vacuum line Lm based on information provided from the pressure detector 12g. , thereby detecting separation process anomalies. When the detection unit 300 detects the occurrence of a separation process abnormality, the control unit 200 can control the driving mechanism DM to stop the separation process in response to the detection. As a result, damage to the substrate 1 and/or the mold 11 can be prevented, and furthermore, scattering of particles due to the damage can be prevented.

FIG. 7 illustrates a flowchart showing the operation of the molding apparatus 100. As shown in FIG. The processing shown in this flowchart is controlled by the control unit 200 . In step S<b>601 , the mold conveying section 32 conveys the mold 11 to the mold holding section 12 , and the mold 11 is held by the mold holding section 12 . In step S<b>602 , the substrate 1 is transported to the substrate holding part 2 by the substrate transporting part 22 , and the substrate 1 is held by the substrate holding part 2 . In step S<b>603 , a curable composition is deposited onto the substrate 1 by the dispenser 20 . Here, when the curable composition is applied onto the substrate 1 by an external device, step S603 may be omitted.

In step S604, the substrate 1 is positioned under the mold 11 by the substrate positioning mechanism SA (stage driving unit 31), and the contact step is performed. In the contact step, the drive mechanism DM adjusts or changes the relative position between the substrate 1 and the mold 11 so that the curable composition on the substrate 1 and (the flat surface 11a of) the mold 11 come into contact with each other. In step S605, a curing step is performed. In the curing step, the curing unit 24 irradiates the curable composition between the substrate 1 and the mold 11 with energy for curing, thereby curing the curable composition.

In step S606, a separation step is performed. In the separation step, the relative positions of the substrate 1 and the mold 11 are adjusted or changed so that the hardened curable composition on the substrate 1 and (the flat surface 11a of) the mold 11 are separated by the drive mechanism DM. . In step S<b>607 , the substrate 1 held by the substrate holding unit 2 is transferred to the substrate storage shelf 221 by the substrate transfer unit 22 and stored in the substrate storage shelf 221 . At step S608, it is determined whether or not there is a substrate 1 to be processed next. On the other hand, when all the substrates 1 have been processed, the mold 11 held by the mold holding section 12 is transferred to the mold storage rack 321 by the mold transfer section 32, thereby completing a series of operations.

FIG. 8 shows an example of a detailed procedure of step S606 (separation step). FIG. 8 also shows an example of the operation when a separation process abnormality is detected in the separation process. In step S701, the control unit 200 provides the detection unit 300 with information indicating the holding state of the substrate 1 held by the substrate holding unit 2 and/or the holding state of the mold 11 held by the mold holding unit 12. Get information. Information indicating the holding state of the substrate 1 held by the substrate holding unit 2 is, for example, information provided from the pressure sensor 2g. Information indicating the holding state of the mold 11 held by the mold holding unit 12 is, for example, information provided from the pressure sensor 12g.

In step S702, the control unit 200 causes the detection unit 300 to execute processing for detecting the occurrence of separation process abnormality based on the information acquired in step S701. For example, the detection unit 300 can detect the occurrence of a separation process abnormality when the information acquired in step S701 deviates from a preset reference range. In step S702, the control unit 200 advances the process to step S703 when the detection unit 300 does not detect the occurrence of separation process abnormality, and proceeds to step S704 when the detection unit 300 detects the occurrence of the separation process abnormality. Proceed with processing. In step S703, the control unit 200 determines whether or not the separation step has ended, and if it has ended, ends the processing shown in FIG. 8 and advances the processing to step S607 in FIG. If not, the process returns to step S701.

Steps S704 to S708, which are executed when an abnormality in the separation process is detected in step S702, will be described below. At step S704, the control unit 200 stops the separation step. Aborting the separation process can include, for example, stopping the drive mechanism DM from changing the relative position between the substrate 1 and the mold 11 . Alternatively, stopping the separation step can include, for example, stopping the driving mechanism DM from applying force (pulling force) to the structure consisting of the substrate 1 , the curable composition and the mold 11 .

Next, in step S705, the control section 200 releases the holding of the mold 11 by (the vacuum chuck provided in) the mold holding section 12 . Next, in step S706, the control unit 200 causes the driving mechanism DM to adjust or change the relative position between the substrate holding unit 2 and the mold holding unit 12 so that the substrate holding unit 2 and the mold holding unit 12 are separated from each other. . For example, the control unit 200 can control the drive mechanism DM so that the relative positions of the substrate holding unit 2 and the mold holding unit 12 are set before the start of the separation process. The reason why the substrate holding part 2 and the mold holding part 12 are separated in step S706 is to move the substrate holding part 2 in step S707.

Next, in step S707, the control section 200 controls the substrate positioning mechanism SA (stage driving section 31) so that the substrate holding section 2 moves to a predetermined position (transfer position). Next, in step S708, the control unit 200 controls the substrate holding unit 2 to transfer the structure composed of the substrate 1, the curable composition, and the mold 11 from the substrate holding unit 2 to the substrate transfer unit 22 (transfer mechanism). 2 and the substrate transfer section 22 are controlled. In step S<b>708 , the control unit 200 controls the substrate transfer unit 22 so that the structure is transferred to the substrate storage shelf 221 and stored in the substrate storage shelf 221 . The object transported by the substrate transport unit 22 in step S708 is a structure composed of the substrate 1, the curable composition, and the mold 11, and is heavier than the substrate 1, which is the object transported in step S607. Therefore, in order to prevent the structure from dropping and being displaced, it is desirable to set the maximum transport speed of the structure in step S708 lower than the maximum transport speed of the substrate 1 in step S607. In step S<b>708 , if preparations for carrying out the structure to the outside of the molding apparatus 100 have been completed, the structure may be transferred to the outside of the molding apparatus 100 without being transferred to the substrate storage rack 221 .

When the size of the mold 11 is larger than the size of the substrate 1, the structure composed of the substrate 1, the curable composition, and the mold 11 does not fit in the FOUP used when transporting the substrate 1 to the outside of the molding apparatus 100. there is a possibility. Therefore, it is desirable that the substrate storage shelf 221 is arranged and configured so that the structure stored in the substrate storage shelf 221 can be transferred from the mold transfer processing unit 320 side using the mold transfer unit 32 .

In the description so far, an example of detecting a holding abnormality as a separation process abnormality has been described. Force anomalies may be detected. Such forces can be detected by a sensor LC, such as the aforementioned load cell, for example. Specifically, the detection unit 300 can detect the occurrence of an abnormality in the separation process when information (information indicating force) detected by the sensor LC in the separation process deviates from a preset reference range. . In step S701, the detection unit 300 obtains information provided from the sensor LC instead of or in addition to the information provided from the pressure sensors 2g and 12g, and performs the separation step based on the obtained information. Anomalies can be detected. The sensor LC is not limited to a load cell, and may be, for example, a strain sensor that measures the strain of the substrate holder 2 and/or the mold holder 12, or an optical sensor that measures the amount of deformation of the substrate 1 and/or the mold 11. good too.

9A and 9B show configuration examples of the substrate storage shelf 221. FIG. 9(a) is a plan view of the substrate storage shelf 221, and FIG. 9(b) is a cross-sectional view taken along line AA of FIG. 9(a). The substrate storage shelf 221 can store a plurality of substrates 1 . Further, the substrate storage shelf 221 can store the structure ST composed of the substrate 1, the curable composition and the mold 11. As shown in FIG. Substrate storage shelf 221 can include, for example, substrate support 222 , support 223 and base 224 . Substrate storage shelf 221 is desirably configured to have a minimum size corresponding to the outer diameter of substrate 1 in consideration of cost reduction and suppression of the size of the molding apparatus. Therefore, the substrate storage shelf 221 can be configured such that only the uppermost substrate support portion 225 among the plurality of substrate support portions can store the structure ST. The uppermost substrate support portion 225 includes a support surface 225a that supports the substrate 1, a guide wall 225b that suppresses displacement of the substrate 1, a guide wall 225c that suppresses displacement of the mold 11, the guide wall 225b and the guide wall 225c. and a connecting surface 225d that connects with the wall 225c. The step formed by the support surface 225 a and the connection surface 225 d is preferably smaller than the thickness of the substrate 1 . The substrate storage shelf 221 described above is merely an example, and the substrate storage shelf 221 may be configured to be able to store a plurality of structures ST. Alternatively, a dedicated shelf for storing the structure ST may be provided separately from the substrate storage shelf 221 .

FIG. 10 shows another example of the detailed procedure of step S606 (separation step). FIG. 10 also shows an example of operation when a separation process abnormality is detected in the separation process. In the example shown in FIG. 10, steps S705, S707 and S708 in the example shown in FIG. 8 are replaced with steps S805, S807 and S808.

Steps S704, S805, S706, S807, and S808, which are executed when the occurrence of the separation process abnormality is detected in step S702, will be described below. At step S704, the control unit 200 stops the separation step. Aborting the separation process can include, for example, stopping the drive mechanism DM from changing the relative position between the substrate 1 and the mold 11 . Alternatively, stopping the separation step can include, for example, stopping the driving mechanism DM from applying force (pulling force) to the structure consisting of the substrate 1 , the curable composition and the mold 11 .

Next, in step S805, the control unit 200 releases the holding of the substrate 1 by (the vacuum chuck provided in) the substrate holding unit 2. FIG. In the example shown in FIGS. 8 and 10, the operations of steps S705 and S805 are performed after the control unit 200 stops the separation step, holding the substrate 1 by the substrate holding unit 2 and releasing the mold 11 by the mold holding unit 12. This is an example of the operation of releasing one of the holdings of .

Next, in step S706, the control unit 200 causes the driving mechanism DM to adjust or change the relative position between the substrate holding unit 2 and the mold holding unit 12 so that the substrate holding unit 2 and the mold holding unit 12 are separated from each other. . For example, the control unit 200 can control the drive mechanism DM so that the relative positions of the substrate holding unit 2 and the mold holding unit 12 are set before the start of the separation process. The reason why the substrate holding part 2 and the mold holding part 12 are separated in step S706 is to move the substrate holding part 2 in step S807.

Next, in step S807, the control section 200 controls the substrate positioning mechanism SA (stage driving section 31) so that the substrate holding section 2 moves to the retracted position. Next, in step S808, the control unit 200 controls the mold holding unit 12 to transfer the structure composed of the substrate 1, the curable composition, and the mold 11 from the mold holding unit 12 to the mold conveying unit 32 (conveying mechanism). It controls the section 12 and the mold transfer section 32 . In step S<b>808 , the control unit 200 controls the mold transfer unit 32 so that the structure is transferred to the mold storage shelf 321 and stored in the mold storage shelf 321 . The object transported by the mold transport unit 32 in step S808 is a structure composed of the substrate 1, the curable composition, and the mold 11, and is heavier than the mold 11, which is the object transported in step S609. Therefore, in order to prevent the structure from dropping and positional displacement, it is desirable to set the maximum transport speed of the structure in step S808 to be lower than the maximum transport speed of the mold 11 in step S609. In step S<b>808 , if preparations for carrying out the structure to the outside of the molding apparatus 100 have been completed, the structure may be transferred to the outside of the molding apparatus 100 without being transferred to the mold storage shelf 321 .

FIG. 11 shows a configuration example of the mold storage shelf 321. As shown in FIG. The mold storage shelf 321 can store a plurality of molds 11 . Further, the substrate storage shelf 221 can store the structure ST composed of the substrate 1, the curable composition and the mold 11. As shown in FIG. The position or space where the mold 11 is accommodated and the position or space where the structure ST is accommodated may be the same. In other words, the mold storage shelf 321 has a plurality of storage positions (storage units), and can store the mold 11 or the structure ST at each storage position. Mold storage shelf 321 may include, for example, mold support 322 , support 323 and base 324 . The mold storage shelf 321 may include a partition plate 325 that partitions spaces in which a plurality of molds are arranged.

In the structure ST housed in the mold housing shelf 321, the substrate 1 may drop out of the mold 11 due to factors such as vibration and the weight of the substrate 1 itself. The partition plate 325 is advantageous for preventing the substrate 1 dropped from the mold 11 from colliding with the mold 11 below. Alternatively, the partition plate 325 is advantageous for preventing particles generated by the structure ST from adhering to other molds 11 . In a configuration in which the partition plate 325 is not provided, the mold transfer section 32 preferably stores the structure ST in the lowest storage section (storage positions) of the mold storage shelf 321 .

12 illustrates the mold transfer hand 326 of the mold transfer section 32. As shown in FIG. 12 is a plan view, and FIG. 12(b) is a cross-sectional view taken along line AA of FIG. 12(a). The mold transfer hand 326 can include a support portion 327 that holds an area other than the area where the mold 11 and the substrate 1 contact during the molding process, that is, the outer peripheral portion of the mold 11 . Such a configuration reduces the flatness of the flat surface 11a of the mold 11 because particles generated from the contact portion between the mold transfer hand 326 and the mold 11 are sandwiched between the substrate 1 and the mold 11 during the molding process. It is advantageous to prevent

In the configuration as described above, the substrate 1 forming part of the structure ST is not supported by the support portion 327 . Therefore, it is desirable that the mold transfer hand 326 includes a drop prevention portion 328 that prevents the substrate 1 from dropping from the mold 11 forming the structure ST. The drop prevention part 328 may have a hole smaller than the size of the substrate 1 for weight reduction, but the hole may be omitted.

Forming apparatus 100 configured as a flattening apparatus can be used in an article manufacturing method for manufacturing an article. The article manufacturing method includes a film forming step of forming a film of a curable composition on a substrate 1 by a molding device 100 configured as a flattening device, and a treatment step of treating the film. Articles may be manufactured from the substrate 1 through the forming and processing steps. In the film forming step, for example, a film of the curable composition can be formed as a planarization film on the substrate 1 having one or more layers. The processing steps include: forming a photoresist film on the planarizing film; forming a latent image pattern on the photoresist film using an exposure device; and forming a pattern. The processing step may also include a step of processing the substrate 1 (for example, patterning a layer of the substrate 1) using the resist pattern.

Molding apparatus 100 may be configured as an imprinting apparatus that uses a mold 11 having a pattern and transfers the pattern to the curable composition on substrate 1 . An article manufacturing method for manufacturing an article using an imprint apparatus will be described below. The article manufacturing method includes a film forming step of forming a film of a curable photocomposition on which a pattern of a mold 11 is transferred by a molding device 100 configured as an imprinting device on a substrate 1, and a process of processing the film. and a step. In the article manufacturing method, an article can be manufactured from the substrate 1 through the film formation process and the treatment process.

A more specific example of an article manufacturing method for manufacturing an article using a molding apparatus 100 configured as an imprint apparatus will be described below with reference to FIG. 13 . As shown in FIG. 13A, a substrate 1z such as a silicon wafer having a surface to be processed 2z such as an insulator is prepared. A printing material 3z is applied. Here, a state is shown in which a plurality of droplet-like imprint materials 3z are applied onto the substrate.

As shown in FIG. 13(b), the imprint mold 4z is opposed to the imprint material 3z on the substrate with the uneven pattern formed side thereof facing. As shown in FIG. 13(c), the substrate 1 provided with the imprint material 3z and the mold 4z are brought into contact with each other and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

As shown in FIG. 13D, after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated to form a pattern of the cured imprint material 3z on the substrate 1z. The pattern of this cured product has a shape in which the concave portions of the mold correspond to the convex portions of the cured product, and the convex portions of the mold correspond to the concave portions of the cured product. It will be done.

As shown in FIG. 13(e), when etching is performed using the pattern of the cured product as an anti-etching mask, the portion of the surface of the workpiece 2z where the cured product is absent or remains thinly is removed, forming the grooves 5z. Become. As shown in FIG. 13(f), by removing the pattern of the cured product, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Although the pattern of the cured product is removed here, it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, as a constituent member of an article, without being removed after processing.

A pattern of a cured product formed using an imprint apparatus is used permanently on at least a part of various articles, or temporarily used when manufacturing various articles. Articles are electric circuit elements, optical elements, MEMS, recording elements, sensors, molds, or the like. Examples of electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of the mold include imprint molds and the like.

The pattern of the cured product is used as it is or temporarily used as a resist mask as at least a part of the article. After etching, ion implantation, or the like in the substrate processing step, the resist mask is removed.

100: molding apparatus, 1: substrate, 2: substrate holding unit, DM: driving mechanism, 200: control unit

Claims (17)

A contact step of contacting the curable composition on the substrate with the mold, a curing step of curing the curable composition while the curable composition and the mold are in contact, and the curable composition after curing A molding apparatus for performing a molding process including a separation step of separating the composition and the mold,
a substrate holder that holds the substrate;
a mold holder that holds the mold;
a driving mechanism for changing the relative positions of the substrate holding part and the mold holding part so that the contacting step and the separating step are performed;
a transport mechanism;
detecting an abnormality that occurs in the separating step while the substrate is held by the substrate holding portion and the mold is held by the mold holding portion; and stopping the separating step in response to the detection of the abnormality. The drive mechanism is controlled to release one of holding of the substrate by the substrate holding section and holding of the mold by the mold holding section, and to separate the substrate holding section from the mold holding section. and a control unit for controlling the transport mechanism to transport a structure composed of the substrate, the curable composition and the mold;
A molding device comprising: Stopping the separation step includes stopping a change in the relative position between the substrate and the mold by the drive mechanism.
The molding apparatus according to claim 1, characterized in that: Aborting the separation step means that the drive mechanism applies a force to a structure composed of the substrate, the curable composition and the mold so as to separate the curable composition and the mold. including stopping
The molding apparatus according to claim 1, characterized in that: After stopping the separating step, the control unit releases holding of the mold by the mold holding unit as release of one of holding of the substrate by the substrate holding unit and holding of the mold by the mold holding unit. let
The control unit controls the substrate holding unit and the transport mechanism so that the structure is transferred from the substrate holding unit to the transport mechanism.
The molding apparatus according to any one of claims 1 to 3, characterized in that: The control unit moves the substrate holding unit to a predetermined position after the mold holding unit releases the mold, and transfers the structure from the substrate holding unit to the transport mechanism at the predetermined position. controlling the substrate holder and the transport mechanism to
The molding apparatus according to claim 4, characterized in that: further comprising a substrate storage shelf capable of storing a plurality of substrates and the structure,
The transport mechanism transports the structure to the substrate storage shelf.
The molding apparatus according to claim 4 or 5, characterized in that: After stopping the separating step, the control unit releases holding of the substrate by the substrate holding unit as release of one of holding of the substrate by the substrate holding unit and holding of the mold by the mold holding unit. let
The control unit controls the mold holding unit and the transport mechanism so that the structure is transferred from the mold holding unit to the transport mechanism.
The molding apparatus according to any one of claims 1 to 3, characterized in that: further comprising a mold storage shelf that is capable of storing a plurality of molds and the structure, and that includes a partition plate that mutually partitions the spaces in which the plurality of molds are arranged;
The transport mechanism transports the structure to the mold storage shelf.
The molding apparatus according to claim 7, characterized in that: The transport mechanism is capable of transporting the mold and transporting the structure.
The molding apparatus according to any one of claims 1 to 8, characterized in that: The control unit detects, as the abnormality, an abnormality in at least one of holding of the substrate by the substrate holding unit and holding of the mold by the mold holding unit.
The molding apparatus according to any one of claims 1 to 9, characterized in that: A contact step of contacting the curable composition on the substrate with the mold, a curing step of curing the curable composition while the curable composition and the mold are in contact, and the curable composition after curing A molding apparatus for performing a molding process including a separation step of separating the composition and the mold,
a substrate holder that holds the substrate;
a mold holder that holds the mold;
a driving mechanism for changing the relative positions of the substrate holding part and the mold holding part so that the contacting step and the separating step are performed;
detecting an abnormality in the holding of the substrate by the substrate holding unit that occurs in a state in which the substrate is held by the substrate holding unit and the mold is held by the mold holding unit in the separating step; a control unit that controls the drive mechanism to stop the separation process in response,
The substrate holding unit includes a vacuum chuck that holds the substrate, and the control unit detects the abnormality based on the pressure of a vacuum line connected to the vacuum chuck.
A molding device characterized by: A contact step of contacting the curable composition on the substrate with the mold, a curing step of curing the curable composition while the curable composition and the mold are in contact, and the curable composition after curing A molding apparatus for performing a molding process including a separation step of separating the composition and the mold,
a substrate holder that holds the substrate;
a mold holder that holds the mold;
a driving mechanism for changing the relative positions of the substrate holding part and the mold holding part so that the contacting step and the separating step are performed;
detecting an abnormality in the holding of the mold by the mold holding section, which occurs in a state in which the substrate is held by the substrate holding section and the mold is held by the mold holding section in the separation step; a control unit that controls the drive mechanism to stop the separation process in response,
The mold holding unit includes a vacuum chuck that holds the mold, and the control unit detects the abnormality based on the pressure of a vacuum line connected to the vacuum chuck.
A molding device characterized by: A contact step of contacting the curable composition on the substrate with the mold, a curing step of curing the curable composition while the curable composition and the mold are in contact, and the curable composition after curing A molding apparatus for performing a molding process including a separation step of separating the composition and the mold,
a substrate holder that holds the substrate;
a mold holder that holds the mold;
a driving mechanism for changing the relative positions of the substrate holding part and the mold holding part so that the contacting step and the separating step are performed;
detecting an abnormality that occurs in the separating step when the substrate is held by the substrate holding portion and the mold is held by the mold holding portion; and stopping the separating step in response to the detection of the abnormality. A control unit that controls the drive mechanism,
The abnormality includes at least one of holding of the substrate by the substrate holding section and holding of the mold by the mold holding section,
The substrate holding section includes a vacuum chuck that holds the substrate, the mold holding section includes a vacuum chuck that holds the mold, and the control section includes a vacuum chuck connected to the vacuum chuck of the substrate holding section. detecting an abnormality of the at least one based on the pressure of the line and the pressure of a vacuum line connected to the vacuum chuck of the mold holder;
A molding device characterized by: The control unit detects, as the abnormality, an abnormality in the force applied by the drive mechanism to the substrate and the mold in the separation step.
The molding apparatus according to any one of claims 1 to 13, characterized in that: The mold is configured as a flattening apparatus that uses a mold having a flat surface as the mold and forms a flattening film on the substrate with the curable composition.
The molding apparatus according to any one of claims 1 to 14, characterized in that: The mold is configured as an imprinting apparatus that uses a mold having a pattern as the mold and transfers the pattern to the film of the curable composition on the substrate.
The molding apparatus according to any one of claims 1 to 14, characterized in that: A film forming step of forming a film of a curable composition on a substrate by the molding apparatus according to any one of claims 1 to 16;
a treatment step of treating the membrane,
An article manufacturing method, comprising: manufacturing an article from the substrate through the film forming step and the treating step.

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