JP2019085131A - Roll package - Google Patents

Abstract

To provide a roll package capable of preventing the occurrence of cracks or breakage in a resin film.SOLUTION: A roll package is provided with a winding core 3, a resin film 2 and a packaging film 4; an axial dimension of the winding core 3 is larger than the width direction dimension of the resin film 2, and the resin film 2 is wound in a roll form on an outer peripheral surface of the winding core in a region other than the outer peripheral surface of an end part of the winding core 3; the packaging film 4 is wound on the outer peripheral surface of a roll body of the resin film 2; the packaging film 4 extends on a side surface of the roll body of the resin film 2 and the resin film 2 contains an inorganic filler at 30% by weight or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a roll package in which a resin film is wound on the outer peripheral surface of a winding core.

  Heretofore, various resin films have been used to obtain electronic components such as semiconductor devices, laminates and printed wiring boards. For example, in a flexible printed wiring board and a multilayer printed wiring board, a resin film is used to form an insulating layer for insulating the inner layers or to form an insulating layer located on the surface layer portion. There is.

  In a flexible printed wiring board or the like, a polyimide film is often used to form a flexible insulating layer. Moreover, before manufacture of a flexible printed wiring board etc., the original film of a resin film may be wound by roll shape. Moreover, the roll film wound raw film may be stored or transported. During the storage and transportation, the roll-formed raw film is exposed to various environments, and an impact is applied to the roll-formed raw film.

  Patent Document 1 below discloses a polyimide film roll in which a polyimide film having a thickness of 1 μm or more and 30 μm or less is wound in a roll, and a roll body of the polyimide film is packaged by a sheet material for packaging. There is. The packaging sheet material is formed of a metal material.

  On the other hand, in a multilayer printed wiring board, a resin film containing an inorganic filler is used to form an insulating layer having a low dielectric loss tangent.

JP 2002-370788 A

  In the resin film containing an inorganic filler, when the resin film is bent or an impact is applied to the resin film, a crack or a crack is easily generated. When the content of the inorganic filler is small, the resin film may be bent or the resin may be bent if the content of the inorganic filler in the resin film is large even if the occurrence of cracks or cracks can be prevented. When an impact is applied to the film, a crack or a crack is likely to occur.

  Furthermore, when the resin film containing the inorganic filler is wound into a roll and made into a roll, cracks or cracks easily occur.

  In a resin film in which a crack or a crack has occurred, a void or the like is likely to occur at the time of lamination on a substrate. Moreover, when the resin film which a crack or a crack produced is used, the insulation reliability in an insulating layer will fall large.

  An object of the present invention is to provide a roll package that can prevent the occurrence of cracks or breakage of a resin film.

  According to a broad aspect of the present invention, a winding core, a resin film, and a packaging film are provided, and an axial dimension of the winding core is larger than a width direction dimension of the resin film, and an end portion of the winding core The resin film is wound in the form of a roll on the outer peripheral surface of the winding core in the area excluding the outer peripheral surface of the above, and the packaging film is wound on the outer peripheral surface of the roll of resin film. The roll packaging body is provided, wherein the packaging film extends on the side surface of the roll body of the resin film, and the resin film includes an inorganic filler at 30% by weight or more.

  In a specific aspect of the roll package according to the present invention, a shock absorbing material is disposed on the outer peripheral surface of the end of the winding core.

  In a particular aspect of the roll package according to the present invention, the winding core has an opening on both sides in the axial direction, and the packaging film is folded in the opening of the winding core.

  In a specific aspect of the roll package according to the present invention, a shock absorbing material is disposed on the outer peripheral surface of the end of the winding core via the packaging film.

  In a specific aspect of the roll package according to the present invention, the roll package includes a holding member for holding the winding core, the resin film, and the packaging film in a suspended manner, and The holding members are attached to both sides in the axial direction.

  In a specific aspect of the roll package according to the present invention, the winding core has an opening on both sides in the axial direction, the holding member has a holding member main body and an insertion portion, and the holding is The insertion portion of the member is inserted into the opening of the winding core.

  In a specific aspect of the roll package according to the present invention, in the axial direction of the winding core, the tip of the insertion portion of the holding member inserted into the opening of the winding core is the end of the resin film It is located inside the part.

  In a specific aspect of the roll package according to the present invention, a buffer film is disposed between the roll body of the resin film and the packaging film.

  In a specific aspect of the roll package according to the present invention, the resin film contains the inorganic filler at 60% by weight or more.

  In a specific aspect of the roll package according to the present invention, the resin film contains a thermosetting compound and a curing agent.

  In a specific aspect of the roll package according to the present invention, the thermosetting compound is an epoxy resin.

  In a specific aspect of the roll package according to the present invention, the resin film is a B-stage film.

  The roll package according to the present invention includes a winding core, a resin film, and a packaging film. In the roll package according to the present invention, the axial dimension of the winding core is larger than the width dimension of the resin film. In the roll package according to the present invention, the resin film is wound in a roll on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core. The packaging film is wound on the outer peripheral surface of the roll body, and the packaging film extends on the side surface of the roll body of the resin film. In the roll packaged body according to the present invention, the resin film contains an inorganic filler at 30% by weight or more. In the roll package concerning the present invention, since the above-mentioned composition is provided, generating of a crack or a crack of a resin film can be prevented.

FIG. 1 is a cross-sectional view schematically showing a roll package according to a first embodiment of the present invention. FIG. 2 is a perspective view schematically showing a roll package according to a second embodiment of the present invention. FIG. 3 is a perspective view schematically showing a roll package according to a third embodiment of the present invention. FIG. 4 is a perspective view schematically showing a shock absorbing material. FIG. 5 is a perspective view schematically showing the holding member.

  Hereinafter, the present invention will be described in detail.

  The roll package according to the present invention includes a winding core, a resin film, and a packaging film. In the roll package according to the present invention, the axial dimension of the winding core is larger than the width dimension of the resin film. In the roll package according to the present invention, the resin film is wound in a roll on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core. The packaging film is wound on the outer peripheral surface of the roll body, and the packaging film extends on the side surface of the roll body of the resin film. In the roll packaged body according to the present invention, the resin film contains an inorganic filler at 30% by weight or more. In the roll package concerning the present invention, since the above-mentioned composition is provided, generating of a crack or a crack of a resin film can be prevented.

  In general, in a resin film containing an inorganic filler, when the resin film is bent or an impact is applied to the resin film, a crack or a crack is easily generated, so it is difficult to obtain a good roll package. is there.

  In the roll package according to the present invention, although the resin film containing a relatively large amount of the inorganic filler is wound in a roll, the generation of the crack or the crack of the resin film can be prevented.

  In addition, in the roll packaged body according to the present invention, the occurrence of cracks or breakage of the resin film can be prevented, so that even when the resin film is laminated on the substrate, voids are not easily generated. Furthermore, when the insulating layer is formed of a resin film, the insulation reliability can be enhanced.

  Moreover, in the roll packaged body which concerns on this invention, generation | occurrence | production of the winding shift of a resin film can also be suppressed.

  The resin film is preferably a resin film used to form an insulating layer in a printed wiring board.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view schematically showing a roll package according to a first embodiment of the present invention. In FIG. 1 and the drawings to be described later, different portions can be replaced with each other.

  The roll package 1 includes a winding core 3, a resin film 2, a packaging film 4, a buffer material 5, a holding member 6, and a buffer film 7.

  The winding core 3 has an opening 3a on both sides in the axial direction. The inside of the winding core 3 is hollow. The winding core 3 is cylindrical.

  The axial dimension of the winding core 3 is larger than the width dimension of the resin film 2.

  The resin film 2 is wound in a roll shape on the outer peripheral surface of the winding core 3 in a region excluding the outer peripheral surface of the end portion of the winding core 3. The resin film 2 is not wound on the outer peripheral surface of the end of the winding core 3. The winding core 3 and the resin film 2 are in contact on the outer peripheral surface of the winding core 3. Another film may be disposed between the winding core and the resin film. The resin film 2 is wound in a roll form from one end to the other end in the length direction. The width direction of the resin film 2 corresponds to the axial direction of the winding core 3.

  Since the resin film 2 is wound in a roll, the resin film 2 is wound on the outer peripheral surface of the winding core 3 one or more times. The resin film 2 is a roll body. The resin film is preferably wound twice or more on the outer peripheral surface of the winding core, and the resin film on the inner periphery and the resin film on the outer periphery are preferably laminated.

  A buffer film 7 is disposed between the roll of the resin film 2 and the packaging film 4. The resin film 2 and the buffer film 7 are in contact on the outer peripheral surface of the resin film 2. The outer peripheral surface of the resin film 2 is protected by the buffer film 7. The buffer film 7 is wound around the outer peripheral surface of the resin film 2 once or more than once. The buffer film may be wound more than once around the outer peripheral surface of the resin film. A buffer film may not be used.

  A packaging film 4 is wound on the outer peripheral surface of the roll body of the resin film 2. In the present embodiment, the packaging film 4 is wound on the outer peripheral surface of the roll body of the resin film 2 via the buffer film 7. The packaging film may be wound directly on the outer peripheral surface of the roll of resin film without the buffer film. The packaging film 4 is on the end of the winding core 3. A packaging film 4 is wound on the outer peripheral surface of the end of the winding core 3. The buffer film 7 and the packaging film 4 are in contact with each other on the outer peripheral surface of the buffer film 7. The winding core 3 and the packaging film 4 are in contact on the end of the winding core 3. The resin film 2 and the packaging film 4 are not in contact with each other on the outer peripheral surface of the resin film 2. The packaging film 4 is on the side of the roll of the resin film 2. The packaging film portion extending on the side surface of the roll of resin film is located on the side of the side of the roll of resin film. The packaging film may or may not be in contact with the side surface of the resin film roll body as long as the packaging film reaches the side surface of the resin film roll body. There may be a space between the packaging film and the side surface of the roll of resin film, and other members may be disposed.

  The packaging film 4 is folded into the opening 3 a of the winding core 3. For this reason, in the roll packaging 1, the packaging film 4 is well held. By folding the packaging film 4 into the opening 3 a of the winding core 3, it is possible to prevent the shape of the packaging form from being broken.

  A shock absorbing material 5 is disposed on the outer peripheral surface of the end portion of the winding core 3 via the packaging film 4. In the present embodiment, the cushioning material 5 shown in FIG. 4 (a) is used. A shock absorbing material 5 is disposed on the outer peripheral surface of the end portion of the winding core 3 via the packaging film 4. The buffer material 5 has a rectangular parallelepiped shape, and has an opening corresponding to the size of the end of the winding core 3 in the rectangular parallelepiped. The buffer material 5 is externally inserted to the winding core 3 so that the end of the winding core 3 is positioned in the opening of the buffer material 5 from the outside in the axial direction of the winding core 3 to the inside. The packaging material is well protected by the buffer material 5 and the side surface of the roll body of the resin film 2 is protected. The buffer material 5 extends to the outside of the packaging film 4 in the radial direction of the annularly wound packaging film 4. No cushioning material may be used.

  In addition, it may change to the shock absorbing material 5, and you may use 5 A of shock absorbing materials shown, for example in FIG.4 (b). The cushioning material 5A includes a first cushioning member 5a and a second cushioning member 5b. The shock absorbing material 5A has a shape obtained by cutting the shock absorbing material 5 at the center. The first buffer member 5a and the second buffer member 5b have semicircular recesses. The cushioning material 5A in which the first cushioning member 5a and the second cushioning member 5b are combined has a rectangular parallelepiped shape, and has an opening corresponding to the size of the end of the winding core in the rectangular parallelepiped. . By fitting the recess of the first buffer member 5a of the buffer 5A and the recess of the second buffer 5b onto the outer peripheral surface of the end of the winding core, the buffer 5A is formed at the end of the winding core It can be easily arranged on the outer peripheral surface. The cushioning material 5 is less likely to cause unintended detachment from the roll package than the cushioning material 5A. In addition, the shock absorbing material 5A is easier to remove than the shock absorbing material 5. In addition, only the 1st buffer member 5a may be used as a buffer material, and only the 2nd buffer member 5b may be used.

  In addition, the shape of the opening of the said shock absorbing material can be changed according to the shape of the edge part of a winding core. The outer shape of the cushioning material may be a polygon such as a square, or may be circular.

  Holding members 6 are attached to both axial sides of the winding core 3. In the present embodiment, the holding member 6 shown in FIG. 5 is used. The holding member 6 is a member for holding the winding core 3, the resin film 2 and the packaging film 4 in a suspended manner. As shown in FIG. 1, the holding member 6 may not hold the cushioning material 5 in a suspended manner. The holding member may hold the cushioning material in a suspended manner.

  The holding member 6 extends to the outside of the packaging film 4 in the radial direction of the annularly wound packaging film 4. The holding member 6 has a holding member main body 6a and an insertion portion 6b. The insertion portion 6 b of the holding member 6 is inserted into the opening 3 a of the winding core 3. The insertion portion 6 b of the holding member 6 is inserted into the winding core 3 so that the insertion portion 6 b of the holding member 6 is positioned in the opening 3 a of the winding core 3 and in the opening of the cushioning material 5. In the axial direction of the winding core 3, the tip end of the insertion portion 6 b of the holding member 6 inserted into the opening 3 a of the winding core 3 is located inside the end of the resin film 2. Therefore, the winding core 3, the resin film 2 and the packaging film 4 can be more favorably held in a suspended manner. In the axial direction of the winding core, the leading end of the insertion portion of the holding member inserted in the opening of the winding core may be located outside the end of the resin film, and is aligned with the end of the resin film May be The holding member may not be used.

  The roll package 1 can be placed on the mounting surface as shown in FIG. The holding member 6 is in contact with the mounting surface. The shock absorbing material 5 is in contact with the mounting surface. The cushioning material may not be in contact with the mounting surface. In a state where the roll package 1 is placed on the mounting surface, the winding core 3, the resin film 2 and the packaging film 4 are held in a suspended manner.

  FIG. 2 is a perspective view schematically showing a roll package according to a second embodiment of the present invention.

  The roll package 11A includes a winding core 3, a resin film 2, and a packaging film 4A. In the roll packaged body 11A and the roll packaged body 1 shown in FIG. 1, the winding core 3 and the resin film 2 are configured in the same manner.

  Unlike the roll wrapping body 1, the roll wrapping body 11A is not provided with a shock absorbing material, a holding member, and a shock absorbing film.

  A packaging film 4A is wound on the outer peripheral surface of the roll body of the resin film 2. The resin film 2 and the packaging film 4A are in contact with each other on the outer peripheral surface of the resin film 2. The packaging film 4A extends on the side surface of the roll body of the resin film 2. The winding core 3 and the packaging film 4A are in contact with each other on the end of the winding core 3. The end of the packaging film 4 is in contact with the outer peripheral surface of the end of the winding core 3.

  In the roll packaged body 11A, the packaging film 4A is not folded into the opening 3a of the winding core 3.

  In addition, a buffer material may be used with respect to 11 A of roll packaging bodies shown in FIG. 2, a holding member may be used, and a buffer film may be used.

  FIG. 3 is a perspective view schematically showing a roll package according to a third embodiment of the present invention.

  The roll packaging body 11B includes the winding core 3, the resin film 2, and the packaging film 4. In the roll packaged body 11B and the roll packaged body 1 shown in FIG. 1, the winding core 3, the resin film 2 and the packaging film 4 are configured in the same manner.

  Unlike the roll wrapping body 1, the roll wrapping body 11 </ b> B does not include a shock absorbing material, a holding member, and a shock absorbing film.

  The packaging film 4 is folded into the opening 3 a of the winding core 3. As described above, the packaging film 4 is configured in the same manner for the roll package 11 B and the roll package 1. However, in the roll packaged body 11B, the end portion of the packaging film 4 is not in contact with the outer peripheral surface of the end portion of the winding core 3 because the cushioning material and the holding member are not used.

  In addition, a shock absorbing material may be used with respect to roll packaging body 11B shown in FIG. 3, and a holding member may be used. The end of the packaging film 4 is in contact with the outer peripheral surface of the end of the winding core 3 by using the cushioning material 5 with respect to the roll packaged body 11B illustrated in FIG. 3. By using the shock absorbing material 5 and the holding member 6 for the roll packaged body 11B shown in FIG. 3, it is possible to obtain a roll packaged body which differs only in the use of the buffer film as compared with the roll packaged body 1 shown in FIG. Can.

  Hereinafter, the details of the roll package according to the present invention will be further described.

(Winding core)
The material of the winding core is not particularly limited. The material of the winding core is preferably a plastic resin because it is excellent in processability, lightness and strength.

  Examples of the plastic resin include polyethylene (PE) resin, polypropylene (PP) resin, polystyrene (PS) resin, acrylonitrile butadiene styrene (ABS) resin, nylon resin, and polyvinyl chloride resin.

  The axial dimension of the winding core is larger than the width dimension of the resin film.

  The axial dimension of the winding core is preferably 20 cm or more, more preferably 25 cm or more, preferably 100 cm or less, more preferably 95 cm or less.

  The axial dimension of the winding core is preferably 1 cm or more larger than the width direction dimension of the resin film, and more preferably 2 cm or larger.

  From the viewpoint of reducing the weight of the roll package, the winding core preferably has an opening on both sides in the axial direction, and the winding core is preferably cylindrical.

  The resin film is rolled on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core. It is preferable that the external shape of the part by which the said resin film of the said winding core is wound is a circle. It is preferable that the part by which the said resin film of the said winding core is wound has a cavity inside.

  When the winding core is cylindrical, the inner diameter and the thickness of the winding core are appropriately set in consideration of the strength and lightness of the winding core and the like. For example, winding cores having an inner diameter of 7.6 cm (3 inches) and a thickness of 4 mm can be used.

(Resin film)
The said resin film is wound by roll shape on the outer peripheral surface of the said winding core in area | region except the outer peripheral surface top of the edge part of the said winding core. Therefore, the resin film is wound on the outer peripheral surface of the winding core for one or more turns. The said resin film is a roll body.

  The length of the resin film is preferably 20 m or more, and preferably 300 m or less. Even when the resin film is wound on the outer peripheral surface of the winding core when the length of the resin film is equal to or less than the upper limit, the misalignment of the resin film can be favorably suppressed.

  The widthwise dimension of the resin film is preferably 20 cm or more, more preferably 25 cm or more, preferably 100 cm or less, more preferably 95 cm or less.

  The said resin film contains the inorganic filler mentioned later. It is preferable that the said resin film contains the thermosetting compound and hardening | curing agent which are mentioned later.

  Hereinafter, the detail of each component used for a resin film is demonstrated.

[Inorganic filler]
The resin film contains an inorganic filler. The use of the inorganic filler reduces the dimensional change of the cured product due to heat. Furthermore, the surface roughness of the surface of the cured product is further reduced, and the adhesion strength between the insulating layer and the metal layer is increased.

  Examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

  The surface roughness of the surface of the cured product is reduced, the adhesion strength between the insulating layer and the metal layer is further enhanced, and finer wiring is formed by the surface of the insulating layer, and the insulating layer has better insulation reliability. From the viewpoint of imparting, the above-mentioned inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica. By the use of silica, the thermal expansion coefficient of the cured product is further lowered, the surface roughness of the surface of the cured product is effectively reduced, and the adhesion strength between the insulating layer and the metal layer is effectively enhanced. The shape of the silica is preferably spherical.

  From the viewpoint of promoting curing of the resin regardless of the curing environment, effectively raising the glass transition temperature of the cured product, and effectively reducing the coefficient of linear thermal expansion of the cured product, the inorganic filler is spherical silica Is preferred.

  The average particle diameter of the above inorganic filler is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 100 nm or more, preferably 5 μm or less, more preferably 3 μm or less, still more preferably 1 μm or less, particularly preferably 0.5 μm It is below. The adhesive strength of an insulating layer and a metal layer becomes it still higher that the average particle diameter of the said inorganic filler is more than the said minimum and below the said upper limit.

  As the average particle diameter of the above-mentioned inorganic filler, a value of median diameter (d50) which is 50% is adopted. The average particle size can be measured using a laser diffraction scattering type particle size distribution measuring apparatus.

  The inorganic fillers are preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesion strength between the insulating layer and the metal layer is effectively enhanced. When each of the inorganic fillers is spherical, the aspect ratio of each of the inorganic fillers is preferably 2 or less, more preferably 1.5 or less.

  The inorganic filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent. As a result, the surface roughness of the surface of the roughened cured product is further reduced, the adhesion strength between the insulating layer and the metal layer is further enhanced, and finer wiring is formed by the surface of the insulating layer, and the like. It is possible to impart better inter-wiring insulation reliability and interlayer insulation reliability to the insulating layer.

  As said coupling agent, a silane coupling agent, a titanium coupling agent, an aluminum coupling agent etc. are mentioned. Examples of the above-mentioned silane coupling agent include methacryl silane, acryl silane, aminosilane, imidazole silane, vinyl silane, and epoxy silane.

  The content of the inorganic filler is 30% by weight or more in 100% by weight of the resin film. The content of the inorganic filler is preferably 50% by weight or more, more preferably 60% by weight or more, still more preferably 70% by weight or more, preferably 90% by weight or less, of 100% by weight of the resin film. It is at most 85 wt%, more preferably at most 83 wt%, particularly preferably at most 80 wt%. When the content of the inorganic filler is the lower limit or more and the upper limit or less, the surface roughness of the surface of the insulating layer is further reduced, and the adhesion strength between the insulating layer and the metal layer is further enhanced, and the insulation is Finer wiring is formed by the surface of the layer. Furthermore, with this amount of inorganic filler, it is also possible to improve the smear removability simultaneously with lowering the coefficient of thermal expansion of the insulating layer. When the content of the inorganic filler is at least the lower limit, the dielectric loss tangent is effectively reduced.

[Thermosetting compound]
It is preferable that the said resin film contains a thermosetting compound. The said thermosetting compound is not specifically limited. As the above-mentioned thermosetting compound, conventionally known thermosetting compounds can be used.

  Examples of the thermosetting compound include styrene compounds, phenoxy compounds, oxetane compounds, epoxy compounds, episulfide compounds, (meth) acrylic compounds, phenol compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds. It can be mentioned. Only one type of the thermosetting compound may be used, or two or more types may be used in combination.

  The thermosetting compound is preferably an epoxy compound. The epoxy compound refers to an organic compound having at least one epoxy group. Only one type of the thermosetting compound and the epoxy compound may be used, or two or more types may be used in combination.

  Examples of the epoxy compounds include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds , Fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthalene ether type The epoxy compound, the epoxy compound which has a triazine nucleus in frame | skeleton, etc. are mentioned.

  From the viewpoint of further increasing the adhesive strength between the insulating layer and the metal layer, the epoxy compound preferably has an aromatic skeleton, preferably has a biphenyl skeleton, and is preferably a biphenyl type epoxy compound.

  From the viewpoint of further increasing the adhesive strength between the insulating layer and the metal layer, the content of the thermosetting compound is preferably 10% by weight or more, more preferably 20% by weight or more in 100% by weight of the resin film. Preferably it is 70 weight% or less, More preferably, it is 65 weight% or less, More preferably, it is 60 weight% or less, Especially preferably, it is 55 weight% or less.

  The molecular weight of the epoxy compound is more preferably 1,000 or less. In this case, when the resin film is laminated on the substrate, the inorganic filler can be uniformly present.

  When the epoxy compound or the curing agent is not a polymer, and when the structural formula of the epoxy compound or the curing agent can be specified, the molecular weight of the epoxy compound and the molecular weight of the curing agent described later mean the molecular weight that can be calculated from the structural formula. Do. Moreover, when an epoxy compound or a hardening | curing agent is a polymer, a weight average molecular weight is meant.

[Hardener]
The resin film preferably contains a curing agent. The curing agent is not particularly limited. A conventionally known curing agent can be used as the above-mentioned curing agent. Only one type of the curing agent may be used, or two or more types may be used in combination.

  As the curing agent, cyanate ester compounds (cyanate ester curing agents), phenol compounds (phenol curing agents), amine compounds (amine curing agents), thiol compounds (thiol curing agents), imidazole compounds, phosphine compounds, acid anhydrides, Active ester compounds and dicyandiamide may, for example, be mentioned. When the thermosetting compound is an epoxy compound, the curing agent preferably has a functional group capable of reacting with the epoxy group of the epoxy compound.

  As said cyanate ester compound, novolak-type cyanate ester resin, bisphenol-type cyanate ester resin, the prepolymer by which these were partially trimerized, etc. are mentioned. Examples of the novolac type cyanate ester resin include phenol novolac type cyanate ester resin and alkylphenol type cyanate ester resin. As said bisphenol type cyanate ester resin, bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, tetramethyl bisphenol F type cyanate ester resin, etc. are mentioned.

  Examples of commercially available products of the above cyanate ester compounds include phenol novolac cyanate ester resins ("PT-30" and "PT-60" manufactured by Lonza Japan Co., Ltd.), and prepolymers in which bisphenol type cyanate ester resins are trimerized (Lonza Japan Company-made "BA-230S", "BA-3000S", "BTP-1000S" and "BTP-6020S" etc. are mentioned.

  Examples of the phenol compound include novolac type phenol, biphenol type phenol, naphthalene type phenol, dicyclopentadiene type phenol, aralkyl type phenol and dicyclopentadiene type phenol.

  As commercial products of the above-mentioned phenol compounds, novolac type phenol (“TD-2091” manufactured by DIC Corporation), biphenyl novolac type phenol (“MEH-7851” manufactured by Meiwa Kasei Co., Ltd.), aralkyl type phenol compound (“MEH manufactured by Meiwa Kasei Corporation” And phenol having an aminotriazine skeleton (“LA1356” and “LA3018-50P” manufactured by DIC Corporation).

  From the viewpoint of further lowering the dielectric loss tangent, the curing agent preferably contains an active ester compound. The active ester compound refers to a compound having at least one ester bond in the structure and having an aromatic ring bonded to both sides of the ester bond. The compound represented by following formula (1) as a preferable example of an active ester compound is mentioned.

  In the above formula (1), X1 and X2 each represent a group containing an aromatic ring. As a preferable example of the group containing the said aromatic ring, the benzene ring which may have a substituent, the naphthalene ring which may have a substituent, etc. are mentioned. A hydrocarbon group is mentioned as said substituent. The carbon number of the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.

  As a combination of X1 and X2, a combination of a benzene ring which may have a substituent, a benzene ring which may have a substituent, a benzene ring which may have a substituent, and a substitution The combination with the naphthalene ring which may have a group is mentioned. Furthermore, the combination of X 1 and X 2 includes a combination of a naphthalene ring which may have a substituent and a naphthalene ring which may have a substituent.

  The said active ester compound is not specifically limited. Examples of commercially available products of the active ester compound include "HPC-8000-65T", "EXB9416-70BK", "EXB8100-65T" and "EXB-8000L-65MT" manufactured by DIC Corporation.

  It is preferable that the molecular weight of the said hardening | curing agent is 1000 or less. In this case, when the resin film is laminated on the substrate, the inorganic filler can be uniformly present.

  The content of the total of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are preferably 100% by weight of the component excluding the inorganic filler in the resin film. Is 75% by weight or more, more preferably 80% by weight or more, preferably 99% by weight or less, and more preferably 97% by weight or less. A still better cured product is obtained when the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are the lower limit or more and the upper limit or less. Since the melt viscosity can be adjusted, the dispersibility of the inorganic filler is improved. Furthermore, in the curing process, the resin film can be prevented from wetting and spreading in an unintended region. Furthermore, the dimensional change of the cured product due to heat can be further suppressed. In addition, when the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are at least the lower limit, the melt viscosity does not become too low, and the curing process Therefore, the insulating film tends to be difficult to spread excessively in the unintended region. In addition, when the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are less than or equal to the upper limit, it is easy to bury the circuit board in holes or asperities. In addition, the inorganic filler tends to be difficult to be present unevenly.

  The content of the curing agent is preferably 30% by weight or more, more preferably 40% by weight or more, and preferably 70% by weight or less in 100% by weight of the components excluding the inorganic filler in the resin film. Preferably it is 60 weight% or less. When the content of the curing agent is at least the lower limit and the upper limit, a more favorable cured product is obtained, and the dielectric loss tangent is effectively reduced.

[Thermoplastic resin]
The resin film preferably contains a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl acetal resin and phenoxy resin. Only one type of the thermoplastic resin may be used, or two or more types may be used in combination.

  The thermoplastic resin is preferably a phenoxy resin from the viewpoint of effectively reducing the dielectric loss tangent and effectively improving the adhesion of the metal wiring regardless of the curing environment. The use of the phenoxy resin suppresses the deterioration of the embeddability of the resin film to the holes or irregularities of the circuit board and the nonuniformity of the inorganic filler. In addition, the use of a phenoxy resin makes it possible to adjust the melt viscosity, so that the dispersibility of the inorganic filler is improved, and the resin film hardly wets and spreads in an unintended region in the curing process. The phenoxy resin is not particularly limited. A conventionally known phenoxy resin can be used as the phenoxy resin. The phenoxy resin may be used alone or in combination of two or more.

  Examples of the phenoxy resin include a bisphenol A type skeleton, a bisphenol F type skeleton, a bisphenol S type skeleton, a biphenyl skeleton, a novolak skeleton, a naphthalene skeleton, and a phenoxy skeleton having a skeleton such as an imide skeleton.

  Examples of commercial products of the phenoxy resin include “YP50”, “YP55” and “YP70” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and “1256B40”, “4250” and “4256H40” manufactured by Mitsubishi Chemical Corporation. 4275 "," YX 6954 BH 30 "," Y X 8 100 BH 30 "and the like.

  From the viewpoint of obtaining a resin film which is more excellent in storage stability, the weight average molecular weight of the thermoplastic resin is preferably 5000 or more, more preferably 10000 or more, preferably 100000 or less, more preferably 50000 or less.

  The said weight average molecular weight of the said thermoplastic resin shows the weight average molecular weight in polystyrene conversion measured by gel permeation chromatography (GPC).

  The content of the thermoplastic resin and the phenoxy resin is not particularly limited. The content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) is preferably 1% by weight or more in 100% by weight of the component excluding the inorganic filler in the resin film. More preferably, it is 5% by weight or more, preferably 30% by weight or less, and more preferably 15% by weight or less. When the content of the thermoplastic resin is not less than the lower limit and not more than the upper limit, the embedding property of the resin film to the holes or the unevenness of the circuit board is improved. When the content of the thermoplastic resin is equal to or more than the above lower limit, the formation of the resin film is further facilitated, and a better insulating layer can be obtained. The thermal expansion coefficient of an insulating layer becomes it still lower that content of the said thermoplastic resin is below the said upper limit. The surface roughness of the surface of the cured product is further reduced, and the adhesion strength between the insulating layer and the metal layer is further enhanced.

[Hardening accelerator]
The resin film preferably contains a curing accelerator. The use of the above curing accelerator makes the curing speed faster. By rapidly curing the resin film, the crosslinked structure in the cured product becomes uniform, and the number of unreacted functional groups is reduced, resulting in an increase in the crosslinking density. The curing accelerator is not particularly limited, and conventionally known curing accelerators can be used. The said hardening accelerator may be used only by 1 type, and 2 or more types may be used together.

  As said hardening accelerator, an imidazole compound, a phosphorus compound, an amine compound, an organic metal compound etc. are mentioned, for example.

  As the above imidazole compound, 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-Methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ene Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ′ -Methyl Midazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-Ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine Isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-dihydroxymethylimidazole, etc. It can be mentioned.

  Examples of the phosphorus compounds include triphenylphosphine and the like.

  Examples of the above amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine and 4,4-dimethylaminopyridine.

  Examples of the organic metal compounds include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bis (acetylacetonato) cobalt (II), and tris (acetylacetonato) cobalt (III).

  The content of the curing accelerator is not particularly limited. The content of the curing accelerator is preferably 0.005% by weight or more, more preferably 0.01% by weight or more, preferably 5% by weight or less, in 100% by weight of the components excluding the inorganic filler in the resin film. More preferably, it is 3% by weight or less. A resin film hardens | cures efficiently that content of the said hardening accelerator is more than the said minimum and below the said upper limit. If the content of the curing accelerator is in a more preferable range, the storage stability of the resin film is further enhanced, and a much better cured product can be obtained.

[solvent]
The resin film does not contain or contains a solvent. Moreover, the said solvent may be used in order to obtain the slurry containing the said inorganic filler. The solvent may be used alone or in combination of two or more.

  As the above solvents, acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, Examples include N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone and naphtha as a mixture.

  Many of the solvents are removed when the resin film is molded using a resin composition. On the other hand, a solvent may remain in the resin film. The residual amount of this solvent is preferably small. Therefore, the boiling point of the solvent is preferably 200 ° C. or less, more preferably 180 ° C. or less. The content of the solvent in the resin film is not particularly limited. The content of the solvent can be appropriately changed to such an extent that the layer shape of the resin film can be maintained.

[Other ingredients]
For the purpose of improving impact resistance, heat resistance, resin compatibility, workability, etc., the above resin film contains a leveling agent, a flame retardant, a coupling agent, a coloring agent, an antioxidant, an anti-oxidant, an anti-UV deterioration agent, and a light-off A foaming agent, a thickener, a thixotropic agent, and other thermosetting resins other than the above-mentioned thermosetting compound may be added.

  As said coupling agent, a silane coupling agent, a titanium coupling agent, an aluminum coupling agent etc. are mentioned. Examples of the above-mentioned silane coupling agent include vinylsilane, aminosilane, imidazolesilane and epoxysilane.

  Examples of the other thermosetting resin include polyphenylene ether resin, divinyl benzyl ether resin, polyarylate resin, diallyl phthalate resin, polyimide resin, benzoxazine resin, benzoxazole resin, bismaleimide resin, acrylate resin and the like.

  As a method of obtaining the above-mentioned resin film, for example, after extruding the resin film material using an extruder, after extruding, an extrusion molding method of forming into a film by T die or circular die etc., resin containing solvent Examples of the method include a casting method in which a film material is cast and formed into a film, and other film forming methods conventionally known. Alternatively, a resin film material may be laminated on a base material and dried by heating to obtain a resin film. The extrusion molding method or the casting molding method is preferable because it can cope with thinning. The film includes a sheet.

  A resin film which is a B-stage film can be obtained by molding the resin film material into a film and heating and drying the film at, for example, 50 to 150 ° C. for 1 to 10 minutes so that curing by heat does not proceed excessively.

  The film-like resin film obtainable by the above-described drying step is referred to as a B-stage film. The B-stage film is in a semi-cured state. The semi-cured product is not completely cured, and curing can be further advanced.

  The resin film is preferably a B-stage film.

  From the viewpoint of further improving the laminateability of the resin film (B stage film when the resin film is a B stage film) and further suppressing the curing unevenness of the resin film, the thickness of the resin film is preferably 5 μm. The thickness is more preferably 10 μm or more, preferably 200 μm or less, and more preferably 100 μm or less.

[Others]
A base material may be laminated on the first surface of the resin film, and a protective film may be laminated on the second surface opposite to the first surface of the resin film. .

  From the viewpoint of improving the operability and protection of the resin film, it is preferable that a base material is laminated on the first surface of the resin film, and the second opposite to the first surface of the resin film. It is preferable that a protective film is laminated on the surface of.

  Examples of the substrate include metal foils, polyester resin films such as polyethylene terephthalate films and polybutylene terephthalate films, olefin resin films such as polyethylene films and polypropylene films, and polyimide films. The surface of the substrate may be subjected to release treatment, if necessary. The substrate may be a metal foil or a resin film. The substrate is preferably a resin film. When using metal foil as said base material, it is preferable that the said metal foil is copper foil.

  The thickness of the substrate is preferably 5 μm or more, more preferably 10 μm or more, preferably 75 μm or less, from the viewpoint of improving the operability of the resin film and the laminating property of the resin film. 60 μm or less.

  Examples of the material of the protective film include polyolefins such as polypropylene and polyethylene, and polyethylene terephthalate. The material of the protective film is preferably a polyolefin, more preferably polypropylene.

  From the viewpoint of further improving the protective properties of the resin film, the thickness of the protective film is preferably 5 μm or more, more preferably 10 μm or more, preferably 75 μm or less, more preferably 60 μm or less.

  In the roll package according to the present invention, when the substrate and the protective film are laminated on the resin film, the substrate or the protective film is in contact with the outer peripheral surface of the winding core, and the substrate or the protection A film is in contact with the packaging film or the buffer film.

(Film for packaging)
The packaging film is wound on the outer peripheral surface of the roll body of the resin film. The packaging film extends on the side surface of the roll body of the resin film. If the packaging film does not reach the side surface of the roll of resin film, the resin film is likely to be cracked or broken at the side surface. In the case where the packaging film does not reach the side surface of the roll of resin film, the cause of the occurrence of cracks or cracks in the resin film is not clear on the side, but the solvent remaining in the resin film is the roll of resin film. By volatilizing from the side, it is considered that the bending resistance and the impact resistance of the resin film are reduced.

  From the viewpoint of suppressing the positional displacement of the packaging film and also from the viewpoint of favorably suppressing the winding displacement of the resin film, in the case where the winding core has an opening on both sides in the axial direction, the inside of the opening of the winding core Preferably, the packaging film is folded.

  From the viewpoint of suppressing positional displacement of the packaging film, the packaging film is preferably wound in one or more turns on the surface of the roll of the resin film, and is wound in two or more turns. More preferable.

  The material of the packaging film is not particularly limited, and examples thereof include polyethylene, polypropylene, and polyvinylidene chloride.

  The thickness of the packaging film is preferably 5 μm or more, more preferably 10 μm or more, preferably 50 μm or less, and more preferably 45 μm or less.

(Buffer material)
It is preferable that the shock absorbing material is arrange | positioned on the outer peripheral surface of the edge part of a roll core which concerns on this invention.

  By disposing the buffer material on the outer peripheral surface of the end portion of the winding core, it is possible to favorably suppress the winding displacement of the resin film. In addition, by arranging the shock absorbing material on the outer peripheral surface of the end of the winding core, the impact resistance of the roll package can be enhanced, and breakage of the winding core (in particular, the end of the winding core) can be prevented. .

  From the viewpoint of enhancing the impact resistance of the roll package by absorbing external impact, as a material of the above-mentioned cushioning material, expanded polystyrene, polyurethane foam, polyethylene foam or polypropylene foam is preferable.

  When the winding core has an opening on both sides in the axial direction, and the packaging film is folded in the opening of the winding core, on the outer peripheral surface of the end of the winding core, It is preferable that a shock absorbing material be disposed via the packaging film. In this case, the winding displacement of the resin film can be suppressed more favorably.

  From the viewpoint of further improving the impact resistance of the roll package and further preventing the breakage of the winding core (in particular, the end of the winding core), the cushioning material is arranged to cover the entire outer peripheral surface of the end of the winding core. Preferably.

(Holding member)
The roll package according to the present invention preferably includes a holding member. The holding member is a member for holding the winding core, the resin film, and the packaging film in a suspended manner. When the roll package according to the present invention includes the shock absorbing material, the winding core, the resin film, the packaging film, and the shock absorbing material may be suspended in a suspended manner, and the winding excluding the shock absorbing material. The core, the resin film and the packaging film may be suspended in a suspended manner.

  In the roll package provided with the holding member, for example, when the roll package is packed in a packing material such as a cardboard box, the winding core, the resin film, and the film for packing do not contact the packing material. It is possible to further prevent the occurrence of cracks or breakage of the resin film.

  It is preferable that the holding member be attached to both sides in the axial direction of the winding core.

  When the winding core has an opening on both sides in the axial direction, the holding member has a holding member main body and an insertion portion, and the insertion portion of the holding member is in the opening of the winding core. Preferably it is inserted.

  From the viewpoint of enhancing the stability of the attached holding member, and also from the viewpoint of preventing breakage of the winding core (in particular, the end of the winding core), in the opening of the winding core in the axial direction of the winding core It is preferable that the tip of the insertion portion of the holding member inserted in the inner side be positioned inside the end of the resin film.

  From the viewpoint of holding the winding core, the resin film, and the packaging film in a suspended manner, the holding member preferably has a certain degree of strength. Examples of the material of the holding member include polypropylene (PP) resin, acrylonitrile butadiene styrene (ABS) resin, and polyethylene (PE) resin.

  The shape of the holding member is not particularly limited, but is preferably a rectangular solid from the viewpoint of holding the winding core, the resin film, and the packaging film in a suspended manner.

  The shape of the insertion portion can be changed according to the shape of the opening of the end of the winding core. The outer shape of the holding member is preferably a polygon such as a square.

(Buffer film)
In the roll package according to the present invention, it is preferable that a buffer film be disposed between the roll of the resin film and the packaging film.

  By providing the buffer film, it is possible to further prevent the occurrence of a crack or a crack of the resin film due to an external impact. Moreover, when a roll package body is stored at low temperature (for example, 5 degrees C or less), generation | occurrence | production of dew condensation on the resin film at the time of use can be prevented.

  As a material of the said buffer film, a polyethylene foam etc. are preferable, for example.

  Hereinafter, the present invention will be specifically described by listing examples and comparative examples. The present invention is not limited to the following examples.

  The following winding core, packaging film, buffer material, holding member, buffer film, base material, and protective film were prepared.

(Winding core)
The winding core A and the winding core B of the shape shown in FIG. 1 were prepared. The details of the winding core A and the winding core B are as follows.

Winding core A:
Material: Acrylonitrile Butadiene Styrene (ABS) Resin Axial dimension of winding core: 56 cm
Winding core thickness: 0.4 cm
Inner diameter of winding core: 7.6 cm

Winding core B:
Material: Acrylonitrile Butadiene Styrene (ABS) resin Core dimension of the winding core: 51 cm
Winding core thickness: 0.4 cm
Inner diameter of winding core: 7.6 cm

(Film for packaging)
Packaging film A ("Stretch film" manufactured by Sanyo Chemical Co., Ltd., 15 μm thick)
Packaging film B ("Saran Wrap (registered trademark)" manufactured by Asahi Kasei Corp., thickness 11 μm)

(Buffer material)
Polyethylene foam having the shape shown in FIG. 1

(Holding member)
Plastic holding member having the shape shown in FIG. 1

(Buffer film)
Buffer film ("Lightlon S" manufactured by Sekisui Plastics Co., Ltd.)

(Base material)
Polyethylene terephthalate (PET) film ("L5" manufactured by LINTEC Corporation, 38 μm thick)

(Protective film)
Protective film ("Alfan MA-411" manufactured by Oji F-Tex, 15 μm thick)

Example 1
Preparation of resin film material: 107 parts by weight of a cyclohexanone slurry (solid content: 70% by weight) of aminophenylsilane-treated silica ("SOC2" manufactured by Admatex Co., Ltd.) was prepared. To this slurry, 11 parts by weight of biphenyl type epoxy resin ("NC 3000H" manufactured by Nippon Kayaku Co., Ltd.), 5 parts by weight of bisphenol A type epoxy resin ("850S" manufactured by DIC), 7.9 parts by weight of cyclohexanone, methyl ethyl ketone 7.7 parts by weight were added. Stirring was performed at 1200 rpm for 60 minutes using a stirrer, and it was confirmed that the undissolved matter disappeared. Thereafter, 11 parts by weight of methyl ethyl ketone mixed solution (solid content: 50% by weight) of aminotriazine-modified phenol novolac curing agent (“LA-1356” manufactured by DIC) and 3 weight of phenol novolac curing agent (“H4” manufactured by Meiwa Kasei Co., Ltd.) Department and added. The mixture was stirred at 1200 rpm for 60 minutes, and it was confirmed that the undissolved matter disappeared. Thereafter, a methyl ethyl ketone and cyclohexanone mixed solution (solid content: 30% by weight) of bisphenol acetophenone skeleton phenoxy resin ("YX6954" manufactured by Mitsubishi Chemical Corporation) was prepared. 2.5 parts by weight of the mixed solution (solid content 30% by weight), 0.1 parts by weight of 2-ethyl-4-methylimidazole ("2E4MZ" manufactured by Shikoku Kasei Kogyo Co., Ltd.), and a leveling agent (manufactured by Kushimoto Kasei Co., Ltd.) LS-480 ′ ′) 0.01 parts by weight was further added. The mixture was stirred at 1200 rpm for 30 minutes to obtain a resin film material (varnish).

Preparation of laminated film of base material, resin film and protective film:
The resulting resin film material was coated on a substrate using a die coater, and then dried at an average temperature of 100 ° C. for 3 minutes to evaporate the solvent. Thus, a resin film (B-stage film) having a thickness of 40 μm and a residual amount of solvent of 1.0% by weight or more and 3.0% by weight or less was formed on the base material.

  Thereafter, a protective film was thermally laminated at a temperature of 50 ° C. on the surface opposite to the substrate side of the resin film to obtain a laminated film in which the resin film is a B-stage film.

Preparation of roll packaging:
The obtained laminated film was slit so that the dimension in the width direction was 51 cm. The laminated film was wound 100 m in a roll on the outer peripheral surface of the winding core A in a region excluding the outer peripheral surface of the end portion of the winding core A to prepare a roll body of a resin film (laminated film). The buffer film is wound one turn on the outer peripheral surface of the roll body of the obtained resin film (laminated film), the packaging film A is wound two turns on the outside, and the packaging film A is folded in the opening of the winding core A It is. Next, a shock absorbing material was disposed on the outer peripheral surface of the end portion of the winding core A so as to completely cover the outer peripheral surface of the end portion of the winding core A via the packaging film A. Then, the insertion portion of the holding member is inserted into the opening of the winding core A so that the tip of the insertion portion of the holding member is located inside the end of the resin film in the axial direction of the winding core A The holding members were attached to both sides in the axial direction of the winding core A to obtain a roll package. When the roll package is placed on the mounting surface in the cardboard box, the winding core A, the resin film, and the packaging film A are suspended in a suspended manner.

(Example 2)
A roll package was obtained in the same manner as in Example 1 except that no cushioning material was placed at the time of preparation of the roll package.

(Example 3)
The holding member is arranged such that the buffer film is not disposed at the time of production of the roll package, and the tip of the insertion portion of the holding member is located outside the end of the resin film in the axial direction of the winding core A roll package was obtained in the same manner as in Example 1 except that the insertion portion of (1) was inserted into the opening of the winding core.

(Comparative example 1)
In the same manner as in Example 1, a laminated film was obtained.

Preparation of roll packaging:
The obtained laminated film was slit so that the dimension in the width direction was 51 cm. The laminated film was wound 100 m in a roll on the outer peripheral surface of the winding core A in a region excluding the outer peripheral surface of the end portion of the winding core A to prepare a roll body of a resin film (laminated film). The wrapping film B was wound twice around the outside of the roll body of the obtained resin film (laminated film) so that the wrapping film B did not reach on the side surface of the roll body. Then, the insertion portion of the holding member is inserted into the opening of the winding core A so that the tip of the insertion portion of the holding member is located outside the end of the resin film in the axial direction of the winding core A The holding members were attached to both sides in the axial direction of the winding core A to obtain a roll package. When the roll package is placed on the mounting surface in the cardboard box, the winding core A, the resin film, and the packaging film B are held in a suspended manner.

(Comparative example 2)
In the same manner as in Example 1, a laminated film was obtained.

Preparation of roll packaging:
The obtained laminated film was slit so that the dimension in the width direction was 51 cm. This laminated film was wound on the outer peripheral surface of the winding core B in the form of a roll of 100 m of the laminated film thus obtained, to form a roll body of a resin film (laminated film). The widthwise dimension of the resin film (laminated film) and the axial dimension of the winding core B have the same length, so in Comparative Example 2, the resin film (laminated film) on the entire outer peripheral surface of the winding core Is wound. The wrapping film B was wound twice around the outside of the roll body of the obtained resin film (laminated film) so that the wrapping film B did not reach on the side surface of the roll body. Then, the insertion portion of the holding member is inserted into the opening of the winding core B so that the tip of the insertion portion of the holding member is positioned inside the end of the resin film in the axial direction of the winding core B The holding members were attached to both sides of the winding core B in the axial direction to obtain a roll package. When the roll package is placed on the mounting surface in the cardboard box, the winding core B, the resin film, and the packaging film B are held in a suspended manner.

(Comparative example 3)
In the same manner as in Example 1, a laminated film was obtained. The obtained laminated film was slit so that the dimension in the width direction was 51 cm. This laminated film was wound on the outer peripheral surface of the winding core B in the form of a roll of 100 m of the laminated film thus obtained, to form a roll body of a resin film (laminated film). The widthwise dimension of the resin film (laminated film) and the axial dimension of the winding core B have the same length, so in Comparative Example 3, the resin film (laminated film) on the entire outer peripheral surface of the winding core Is wound. On the outer peripheral surface of the roll body of the obtained resin film (laminated film), the packaging film A was wound twice, and the packaging film A was folded into the opening of the winding core B. Then, the insertion portion of the holding member is inserted into the opening of the winding core so that the tip of the insertion portion of the holding member is positioned inside the end of the resin film in the axial direction of the winding core B Holding members were attached to both sides of the winding core in the axial direction to obtain a roll package. When the roll package was placed on the mounting surface in the cardboard box, the winding core B, the resin film, and the packaging film A were suspended in a suspended manner.

(Evaluation)
(1) Crack or Crack of Resin Film The roll packaged body obtained in Examples 1 to 3 and Comparative Example 1 was packaged in a cardboard box of inner size 59 cm × 17 cm × 17 cm. The roll package obtained in Comparative Examples 2 and 3 was packed in a cardboard box with an inner size of 54.5 cm × 17 cm × 17 cm. The roll package packed in a cardboard box was transported for 2 days while maintaining the temperature at 5 ° C. or less. After transport, the roll package was allowed to stand at room temperature for 2 hours or more, and the resin film was visually observed to evaluate cracks or cracks in the resin film.

[Criteria for Judgment of Crack or Crack of Resin Film]
○: no cracks or cracks in the resin film ×: cracks or cracks in the resin film

(2) Fabrication of void evaluation substrate:
A 100 mm long × 100 mm wide laminated board was prepared in which a copper foil having a thickness of 25 μm was laminated on a glass epoxy substrate having a thickness of 400 μm. The copper foil was etched, and circular recesses with a diameter of 100 μm and a depth of 25 μm were provided in total of 30 in the longitudinal direction and 30 in the lateral direction in a total area of 30 mm × 30 mm. The distance between the centers of adjacent circles is 900 μm. Thus, the evaluation substrate was obtained.

Preparation of laminate of evaluation substrate and resin film:
The roll package obtained in Examples 1 to 3 and Comparative Example 1 was packaged in a cardboard box of inner dimensions 59 cm × 17 cm × 17 cm. The roll package obtained in Comparative Examples 2 and 3 was packed in a cardboard box with an inner size of 54.5 cm × 17 cm × 17 cm. The roll package packed in a cardboard box was transported for 2 days while maintaining the temperature at 5 ° C. or less. After transportation, after leaving at room temperature for 2 hours or more, the laminated film was cut out from the roll package. The protective film of the laminated film is peeled off, and the exposed surface of the resin film is heated and pressurized at a laminating pressure of 0.4 MP and a laminating temperature of 90 ° C. for 20 seconds using a batch type vacuum laminator MVLP-500IIA (manufactured by Meishin Seisakusho Co., Ltd.) After that, heating pressure was applied at a press pressure of 0.8 MPa and a press temperature of 90 ° C. for 20 seconds. Next, the base material of the laminated film was peeled off to obtain a laminated body of the evaluation substrate and the resin film.

Observation of void:
The resulting laminate was observed for all the recesses of the evaluation substrate using an optical microscope to evaluate voids.

Judgment criteria of void
○: no void was observed in the recess (the percentage of the recess in which the void was observed is 0%)
:: The ratio of recesses in which voids are observed is less than 5%. ×: the ratio of recesses in which voids are detected is 5% or more.

(3) Winding gap The roll package obtained in Examples 1 to 3 and Comparative Example 1 was packaged in a cardboard box of inner size 59 cm × 17 cm × 17 cm. The roll package obtained in Comparative Examples 2 and 3 was packed in a cardboard box with an inner size of 54.5 cm × 17 cm × 17 cm. The roll package packed in a cardboard box was stored in a refrigerator at a temperature of 5 ° C. or less for one week. After storage, the corrugated box packed with the roll package was dropped from a height of 1 m from the ground. After dropping, the roll packaged body was visually observed to evaluate the winding deviation of the resin film.

[Criteria for determining winding deviation]
○: no winding deviation △: winding deviation not causing any problem in practical use ×: winding deviation causing a practical problem

  The composition of the roll package and the results are shown in Table 1 below.

1, 11A, 11B: Roll package 2. Resin film (roll of resin film)
Reference Signs List 3 winding core 3a opening 4 packaging film 5, 5A buffer member 5a first buffer member 5b second buffer member 6 holding member 6a holding member main body 6b insertion portion 7 buffer film

Claims (12)

Equipped with a winding core, a resin film, and a packaging film,
The axial dimension of the winding core is larger than the width dimension of the resin film,
The resin film is wound in a roll shape on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end portion of the winding core,
The packaging film is wound on the outer peripheral surface of the roll body of the resin film,
The packaging film extends on the side surface of the roll body of the resin film,
The roll packaging body in which the said resin film contains an inorganic filler by 30 weight% or more.   The roll package according to claim 1, wherein a shock absorbing material is disposed on the outer peripheral surface of the end of the winding core. The winding core has an opening on both sides in the axial direction,
The roll packaging body according to claim 1, wherein the packaging film is folded in the opening of the winding core.   The roll packaged body according to claim 3, wherein a shock absorbing material is disposed on the outer peripheral surface of the end of the winding core via the packaging film. A holding member for holding the winding core, the resin film, and the packaging film in a suspended manner;
The roll packaging body of any one of Claims 1-4 with which the said holding member is attached to the axial direction both sides of the said winding core. The winding core has an opening on both sides in the axial direction,
The holding member has a holding member main body and an insertion portion,
The roll wrapping body according to claim 5, wherein the insertion portion of the holding member is inserted into the opening of the winding core.   The tip end of the insertion portion of the holding member inserted into the opening of the winding core in the axial direction of the winding core is positioned inside the end of the resin film. Roll packaging.   The roll packaging body of any one of Claims 1-7 in which the buffer film is arrange | positioned between the roll body of the said resin film, and the said film for packaging.   The roll packaging body of any one of Claims 1-8 in which the said resin film contains the said inorganic filler by 60 weight% or more.   The roll packaging body of any one of Claims 1-9 in which the said resin film contains a thermosetting compound and a hardening | curing agent.   The roll package according to claim 10, wherein the thermosetting compound is an epoxy resin. The roll packaging body of any one of Claims 1-11 whose said resin film is a B-stage film.

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